JP2006019710A - Bump inspecting apparatus and method for ic component, bump formation method for ic component, and ic component mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To perform bump inspection with high accuracy and efficiency, by using each of obtained images of bumps formed on an electrode of an IC component. <P>SOLUTION: A light in a single direction is applied to the bump forming surface of an IC component, and a first whole image of the IC component is obtained; next, light in each inclined direction is applied to the bump-forming surface; and a second whole image is obtained. Each first bump inspecting image is obtained from the first whole image, while each second bump inspection image is obtained from the second whole image; and bump formation positions are inspected on the basis of each second bump inspection image, while the degree of crush of each bump head is inspected on the basis of each first bump inspection image. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention obtains an image of each bump formed on the electrode pad of the semiconductor bare chip, and performs image processing on the obtained image, thereby inspecting the formation state of each bump. The present invention relates to an inspection apparatus and an inspection method. The present invention also relates to a bump forming method and an IC component mounting method using such a bump inspection method.

  Conventionally, there are various known methods for inspecting bumps in this type of semiconductor bare chip, that is, IC components. For example, after forming each bump on each bump forming surface for a plurality of IC components, the image of each bump formation state is taken as it is, and the respective image processing is performed. There is an inspection method of inspecting the formation state of each bump (see, for example, Patent Document 1).

  The conventional inspection method will be specifically described. One IC component is taken out from a plurality of IC components stored in a component tray and moved to a bump forming position. A plurality of bumps are formed on the bump forming surface of the IC component arranged at the bump forming position.

  Thereafter, the IC component on which each bump is formed is moved to an image capturing position where an image is captured for the inspection of the bump. At this image capturing position, the image capturing camera and one bump in the IC component are aligned, and the image of the one bump is captured by the image capturing camera. Thereafter, in the IC component, the next bump and the imaging camera are aligned, the next bump image is taken, and the image of each bump is taken in the same procedure. .

  Thereafter, by performing recognition processing of each captured image, the formation position of each bump is inspected, and pass / fail judgment of the formation state of each bump is performed based on the inspection result.

Japanese Patent Laid-Open No. 10-242219

  In recent years, by mounting such IC components on a board, it is desired to reduce the manufacturing cost of an electronic device having a built-in board on which IC components are to be formed. It is desired to plan. Therefore, it is desired that each bump for mounting each IC component on the substrate is formed more reliably and with high accuracy, and such inspection of each bump can be performed efficiently with high accuracy. It is desired.

  However, in the conventional inspection method as described above, the individual bumps in the IC component are individually aligned with the imaging camera, and images for each individual bump are acquired, and each image is recognized. Thus, since each bump is inspected, the time required for the alignment and the time required for imaging the image hinder the reduction of the time required for the inspection. In recent years, the number of bumps to be formed tends to increase as IC components become more sophisticated. In such a case, the time required for the inspection of each bump increases, which is efficient. There is a problem that inspection is increasingly obstructed.

  Further, in such a bump inspection, an image of each bump is acquired in a state where the IC component is securely held. However, in this holding, the IC component is directly touched. There is a problem that the top of the bump may be damaged or a crack may be generated in the IC component itself.

  In addition, since the positioning of the individual bumps and the imaging camera is performed by relative movement as described above, a positional shift caused by the movement is included in the bump position recognition accuracy by the image processing. In other words, there is a problem that it may become a factor that hinders high-precision inspection.

  Further, in the case where such an efficient and reliable bump inspection cannot be performed, the efficiency of mounting the IC component on the substrate is also hindered.

  Accordingly, an object of the present invention is to solve the above-described problem, by acquiring an image of each bump formed on the electrode of the IC component, and performing image processing on the acquired image. In the bump inspection for inspecting each of the above bumps, an IC component bump inspection apparatus and inspection method capable of realizing highly accurate and efficient inspection, and an IC component bump forming method using such inspection results And providing an IC component mounting method.

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, a housing member holding device that holds a component housing member that houses a plurality of IC components in which a plurality of bumps are formed in an aligned arrangement with the respective bump forming surfaces as upper surfaces;
An imaging device that captures images of the respective IC components housed in the component housing member held by the housing member holding device;
A control device that controls the inspection operation of each of the bumps by using the imaging operation by the imaging device, the holding operation by the container holding device, and the captured image;
The imaging apparatus is
An imaging camera unit that individually captures an entire image on the bump forming surface of the IC component along an optical axis arranged in a direction substantially orthogonal to a direction along the surface of the bump forming surface.
An imaging optical axis positioning unit that aligns the optical axis of the imaging camera unit with a substantially center position on the bump forming surface of the IC component to be imaged;
The control device
A component position recognizing unit for recognizing the position of the IC component based on the whole image captured by the imaging camera unit with respect to the IC component subjected to the alignment by the imaging optical axis positioning unit; ,
Based on the formation position of each bump in the IC component, the inspection area of each bump whose arrangement is set in advance is positioned on the entire image based on the recognition result by the component position recognition unit. A bump inspection area setting unit for obtaining a bump inspection image for each of the bumps from the entire image,
An inspection processing unit that performs an inspection process of the formation position of each of the bumps based on each of the bump inspection images and an inspection process of a crushing degree of the top of each of the bumps. A bump inspection apparatus for IC parts is provided.

According to a second aspect of the present invention, the imaging device includes a unidirectional light irradiation unit that irradiates light in a substantially unidirectional direction along the optical axis with respect to the bump forming surface of the IC component. A plurality of directions that are directed from the periphery of the optical axis arranged on the bump forming surface toward the optical axis, and inclined to irradiate light from each direction inclined with respect to the bump forming surface A lighting device having a directional light irradiation unit;
The control device is configured so that the unidirectional light irradiating unit causes the unidirectional light irradiation unit to perform the unidirectional light irradiation with respect to the bump formation surface of the IC component in a state in which the imaging optical axis positioning unit is aligned with the optical axis. The first entire image of the IC component imaged by the imaging camera unit while irradiating light and the imaging camera unit while irradiating light in the tilt direction by the tilt direction light irradiation unit. The second whole image of the IC component is further provided with an image storage unit that is input and stored so that it can be taken out.
The component position recognition unit extracts the first whole image or the second whole image stored in the image storage unit, and recognizes the position of the IC component based on the extracted image. And
The bump inspection area setting unit takes out the first whole image and the second whole image from the image storage unit, and performs the first bump inspection for each bump from the first whole image. Obtaining an image, and obtaining a second bump inspection image for each of the bumps from the second overall image,
The inspection processing unit performs an inspection process of the formation positions of the bumps based on the images of the first bump inspection image or the second bump inspection image, and the first bump inspection image. The bump inspection apparatus for an IC component according to the first aspect, which performs an inspection process of the degree of crushing of the top of each bump based on the bump inspection image.

  According to the third aspect of the present invention, in the control device, the inspection processing section performs a second inspection process for the formation position of the bumps based on the second bump inspection images. An IC component bump inspection apparatus according to an aspect is provided.

According to the fourth aspect of the present invention, the housing member holding device comprises:
A pair of support members for supporting lower portions of opposite end portions of the component housing member;
While pressing the respective end portions of the component housing members in a state supported by the respective support members from above, correcting the warp or deflection of the component housing members and maintaining a substantially horizontal posture, the above A pair of pressing and holding members for holding the supporting posture;
From a first aspect comprising a press holding member moving device for integrally moving the respective press holding members forward and backward between a holding position for holding the supporting posture and a holding releasing position for releasing the holding. A bump inspection apparatus for an IC component according to any one of three aspects is provided.

  According to a fifth aspect of the present invention, the imaging camera unit provides the bump inspection apparatus for an IC component according to any one of the first to fourth aspects, which includes a telecentric lens as an optical lens.

  According to a sixth aspect of the present invention, in the component storage member according to any one of the first to fifth aspects, the component storage member is a component storage tray capable of storing the plurality of IC components individually arranged. A bump inspection apparatus for IC parts is provided.

According to the seventh aspect of the present invention, the inspection processing unit may use the first bump inspection image or the second bump inspection image in the bump formation position inspection process, in the bump formation position inspection process. The center position can be detected as the bump formation position by obtaining the center position of the contour,
A substantially circular matching line part for matching with the contour of the bump, and a position that divides the matching line part into at least approximately four equal parts in the normal direction of the matching line part, and in the arrangement position and its vicinity A step function edge detection template comprising a plurality of line part movement change bars that individually change partial curvatures in the matching line part by individually moving and changing the matching line part in the normal direction. Prepared,
In each of the images of the bumps, at least one or more of the line portions is disposed while fixing a portion of the matching line portion to match a portion of the bump outline and fixing the matched position. Using the movement change bar, the matching line part is partially moved and changed in the normal direction so that the matching line part substantially matches the arc part other than the part in the contour, and the bump The bump inspection apparatus for an IC component according to the second aspect or the third aspect, wherein the template is matched with the outline of the template and the center position of the matched template is calculated.

  According to the eighth aspect of the present invention, in the inspection processing of the crushing degree of the top portion of each bump, the inspection processing unit includes the bump in the first bump inspection image within the outline of the bump. By calculating the area of the image region formed by the reflected light of the light emitted from the unidirectional light irradiation unit, the calculated area is recognized as the area of the crushing plane in the top of the head, and the area is The IC component bump inspection apparatus according to the second aspect or the third aspect, in which the crushing degree of the top of the head is inspected by determining whether or not it is within a reference area value.

  According to the ninth aspect of the present invention, the inspection processing unit has a substantially annular inspection area disposed adjacent to the outer periphery of the outline of each bump, and one of the bumps is included in the inspection area. An IC component bump inspection apparatus according to any one of the first to eighth aspects, wherein the presence / absence of an image of a portion is inspected to inspect for the presence or absence of an abnormal shape of the bump.

According to the tenth aspect of the present invention, each of the bumps has a generally conical shape, or a generally conical shape in which a crushing plane is formed on the top of the head,
The light in the unidirectional direction irradiated from the unidirectional light irradiating unit is light for irradiating the top of the head of each of the bumps,
The IC component according to the second aspect or the third aspect, wherein the light in the tilt direction irradiated from the tilt direction light irradiation unit is light for peripheral surface irradiation irradiated to the peripheral surface of each of the bumps. A bump inspection apparatus is provided.

According to the eleventh aspect of the present invention, an entire image of a bump formation surface of an IC component on which a plurality of bumps are formed is obtained,
Based on the acquired entire image, the position of the IC component is recognized,
Based on the recognition result, the inspection area of each bump is positioned and set on the entire image, and an image for bump inspection is obtained for each bump from the entire image.
A bump inspection method for an IC component characterized in that, based on each of the images for bump inspection, the formation position of each bump is inspected, and the crushing degree of the top of each bump is inspected. provide.

According to the twelfth aspect of the present invention, the acquisition of the entire image of the IC component is performed by emitting light in a single direction along a direction substantially orthogonal to the bump formation surface of the IC component. To obtain a first whole image of the IC component, and a plurality of directions from the periphery to the substantially center of the bump forming surface with respect to the bump forming surface, and It is performed by irradiating light from each direction inclined with respect to the bump forming surface and acquiring the second whole image of the IC component,
Recognition of the position of the IC component is performed based on the acquired first whole image or second whole image,
The acquisition of the respective bump inspection images is obtained by acquiring the first bump inspection image from the first overall image and obtaining the second bump inspection from the second overall image for each of the bumps. Is done by acquiring images for
Based on the first bump inspection image or the second bump inspection image, the formation position of each bump is inspected, and on the basis of the first bump inspection image, An IC component bump inspection method according to an eleventh aspect, wherein the crushing degree of the top of each bump is inspected.

  According to the thirteenth aspect of the present invention, there is provided the IC component bump inspection method according to the twelfth aspect, wherein the inspection of the formation positions of the respective bumps is performed based on the respective second bump inspection images. provide.

According to a fourteenth aspect of the present invention, the IC component is one selected from a plurality of the IC components housed in an aligned arrangement in a component housing tray with each bump forming surface as an upper surface. Parts,
The bump inspection method for an IC component according to any one of the eleventh aspect to the thirteenth aspect, in which the entire image is acquired for each of the IC components accommodated and arranged in the component accommodation tray. provide.

According to the fifteenth aspect of the present invention, the inspection of each bump formation position is performed by detecting the outline of the bump and obtaining the center position of the outline, thereby setting the center position as the bump formation position. Done by detecting,
The detection of the contour of the bump is arranged in a normal direction of the matching line portion at a position that divides the matching line portion into at least approximately four equal parts and a substantially circular matching line portion for matching with the bump contour. A plurality of line part movement change bars for individually changing partial curvatures in the matching line part by individually moving and changing the matching line part in the arrangement position and the vicinity thereof in the normal direction. Using the template for step function edge detection provided,
In the first bump inspection image or the second bump inspection image, a part of the matching line portion is arranged so as to match a part of the contour of the bump,
While fixing the matched position, using at least one or more of the line part movement change bars, the matching line part is partially moved and changed in the normal direction,
As a result, the matching line portion is substantially matched with the arc portion other than the part in the contour, and the template of the IC component according to the twelfth aspect or the thirteenth aspect is used to match the template to the contour of the bump. A bump inspection method is provided.

According to the sixteenth aspect of the present invention, the inspection of the degree of crushing of the top of each of the bumps is as follows:
In the first image for bump inspection, the area of the image area formed by the reflected light of the light in the single direction is calculated within the outline of the bump,
Determine the calculated area as the area of the crush plane of the top of the head, whether the area is within the reference area value,
The bump inspection method for an IC component according to the twelfth aspect, which is performed by detecting an abnormality in the crushing degree when the reference area value is exceeded.

According to the seventeenth aspect of the present invention, in the first bump inspection image or the second bump inspection image for each of the bumps,
A substantially annular inspection area is arranged adjacent to the outer periphery of the bump outline,
In the inspection area, determine whether there is a partial image of the bump,
An IC component bump inspection method according to a twelfth aspect or a thirteenth aspect, wherein the bump is determined to have an abnormal shape when it is determined that the image exists.

According to an eighteenth aspect of the present invention, an inspection result of each of the bumps in the IC component according to the bump inspection method for the IC component according to any one of the eleventh to seventeenth aspects is expressed as the respective IC component. Feedback to each bump formation process above,
In the bump forming step, there is provided a bump forming method for an IC component, wherein each bump is formed on each IC component while reflecting the inspection result.

According to a nineteenth aspect of the present invention, an inspection result of each of the bumps in the IC component by the bump inspection method for an IC component according to any one of the eleventh to seventeenth aspects is obtained as a substrate of the IC component. Feed forward to the component mounting process for mounting
In the component mounting step, an IC component mounting method is provided, wherein each IC component subjected to the inspection is mounted on the substrate while reflecting the inspection result.

  According to the present invention, in the bump inspection apparatus, each of the bumps included in the IC component and the imaging device are held in a state in which each IC component is held as in the conventional image acquisition method for the inspection of the bump. Alignment is performed individually, and images of individual bumps are not individually captured, but an entire image of the bump forming surface is captured for an IC component housed in a component housing member. Since the bump inspection image for each of the bumps is taken out from the entire captured image and the respective bumps are inspected, in each of the bump inspection images, relative to the imaging object with respect to the imaging system. It is possible to reduce the influence of the positional deviation accompanying the alignment on the inspection accuracy.

  In particular, as in the case of the conventional inspection method, in the case where the alignment between each bump and the imaging camera is performed individually, it is considered that the alignment accuracy varies for each bump. As in this embodiment, the image of each of the bumps formed on one IC component is collectively taken as the entire image of the bump forming surface to prevent such a problem from occurring. can do.

  Further, by capturing an entire image of the IC component and positioning and setting the inspection area of each bump on the entire image, a bump inspection image of each bump is determined from the entire image. Since acquisition can be performed, it is possible to eliminate the operation of individually positioning the imaging camera and individual bumps as in the prior art, and the time required for acquiring the image of each bump is shortened. be able to. Therefore, a more efficient inspection can be performed.

  In addition, since the whole image of the IC component can be captured in a state where the IC component is housed in the component housing member, the IC component itself or bumps can be obtained by gripping the IC component. Can be prevented in advance.

  In the relative alignment between the imaging system and the imaging object, the imaging optical axis positioning unit causes the optical axis of the imaging camera unit and the substantially central position on the bump forming surface of the IC component to be imaged. For example, in the case where the positioning is performed by moving the imaging camera unit in a direction substantially along the surface of the bump formation surface, the component housing member is always kept stationary. Can keep. Therefore, it is possible to prevent the respective IC components accommodated in the component accommodating member from popping out due to the alignment. In a case where the IC component does not jump out of the component housing member, the relative positioning is performed by moving the IC component while the imaging camera unit is stationary. Can also be done.

  In addition, the illumination device includes a unidirectional light irradiating unit that irradiates light in a single direction and an inclined direction light irradiating unit that irradiates light in an inclined direction. A more accurate and efficient inspection can be realized by inspecting the bump by properly using one bump inspection image and the second bump inspection image captured by the light in the tilt direction. it can.

  Specifically, in the first bump inspection image, the first bump is used by utilizing the characteristic that the image area of the flat surface at the top of the bump is displayed with a higher contrast than the surrounding area. By inspecting the crushing degree of the top of the bump using the inspection image, high-accuracy and efficient inspection can be realized.

  Since such a configuration and each operation can be realized in the bump inspection apparatus, highly accurate and efficient inspection can be realized.

  The housing member holding device for holding the housing member corrects the deflection or warpage of the housing member, and can hold the housing member while maintaining the substantially horizontal state, whereby the imaging camera unit and the imaging object The distance dimension with the IC component can be kept substantially constant. Since the distance can be kept substantially constant in this way, highly accurate inspection can be realized.

  Furthermore, by adopting a telecentric lens as the optical lens provided in the imaging camera unit, it is possible to further reduce the influence of variations in the distance between the imaging object and the captured image on the captured image. And high-precision inspection can be realized.

  In addition, in the inspection of each bump forming position, a step function edge detection template including a matching line portion and a plurality of line portion movement change bars is used, so that not only the bump having a substantially circular contour is used. Even if the bump has an elliptical or flat circular contour, the matching line portion is changed to the contour by changing the matching line portion using the respective line portion movement change bars. It is possible to reliably match, and the center position can be detected as the bump formation position. Therefore, the conventional method can reliably detect the formation position of a bump having a contour such as a flat circular shape that is considered to have an inspection error or shape abnormality. Accurate inspection can be realized.

  Further, in the first bump inspection image, by calculating the area of the image region formed by the reflected light of the unidirectional light within the outline of the bump, the calculated area is calculated as the top of the head. It can be recognized as the area of the collapse plane. Further, by determining whether or not this area is within the reference area value, it is possible to specifically realize the crushing degree inspection of the top of the head.

  Whether the bump inspection unit has a substantially annular inspection area disposed adjacent to the outer periphery of the outline of each of the bumps, and whether or not an image of a part of the bump exists in the inspection area. By determining the above, it is possible to determine the abnormal shape of the bump.

  In addition, the inspection results of the bumps according to each of the above-described aspects are fed back to the bump formation process for the IC component, and the inspection results are reflected in the bump formation process, while each bump of the new IC component is reflected. By performing the formation, it is possible to efficiently form the bumps by effectively utilizing the inspection result. In particular, considering that such an IC component is a relatively expensive component, it is more effective that generation of defective components can be suppressed in advance.

  Conversely, the inspection results are fed forward to the bumps according to each of the above aspects, and the IC components that have been inspected while reflecting the inspection results in the mounting step. Is mounted on the substrate, it is possible to realize mounting of IC components with higher accuracy. For example, more accurate mounting can be realized by mounting the IC component so as to correct the positional deviation amount based on the information such as the positional deviation amount of each bump formation position.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

(First embodiment)
FIG. 1 is a schematic configuration diagram showing a schematic configuration of a bump inspection apparatus 101 which is an example of a bump inspection apparatus for an IC component according to the first embodiment of the present invention, and a schematic plane showing a planar configuration. The figure is shown in FIG. 1 is a schematic cross-sectional view taken along the line AA in the schematic plan view of FIG.

  As shown in FIG. 1, the bump inspection apparatus 101 acquires images of a plurality of bumps formed on a plurality of electrode pads included in an IC component that is a semiconductor bare chip, and recognizes the acquired image. It is an inspection apparatus that inspects the formation state of each bump by performing processing.

  Here, a schematic external perspective view of such an IC component 1 is shown in FIG. As shown in FIG. 3, the IC component 1 is arranged with the bump forming surface S, which is the surface on which the respective bumps 3 are formed, facing upward. Further, the IC component 1 has, for example, a substantially square shape, and a large number of bumps 3 are arranged in the vicinity of the peripheral portion on the bump forming surface S so as to be arranged at a predetermined interval pitch. . Each of the bumps 3 has a substantially conical shape, and includes a top portion 3a that is a tip portion formed in a protruding shape. For example, the top portion 3a is directly connected to the substrate electrode of the substrate. Alternatively, the IC component 1 can be mounted on the substrate by being indirectly joined. In the IC component 1 of FIG. 3, the display of each electrode pad formed on the bump forming surface S is omitted. In the first embodiment, the case where the IC component 1 has a substantially square shape will be described. However, the IC component 1 is limited to the case where the IC component 1 is formed in a substantially square shape. It may be a case of having various shapes such as a rectangular shape.

  Each of the bumps 3 is formed by, for example, a stud bump method. Specifically, for example, an Au ball formed by discharging and melting the tip of an Au wire is metal-bonded to the Al pad surface on the IC component 1 by heat and ultrasonic waves, and finally the tip is cut, and then necessary Each bump 3 can be formed by performing a leveling process according to the above. In this stud bump method, an Au ball is formed, pressed against an Al pad, and further cut, so that the shape of each bump 3 is not a beautiful spherical shape. is doing.

  Further, as shown in FIGS. 1 and 2, such an IC component 1 has a plurality of component receiving portions 5a which are concave portions capable of individually accommodating the IC components 1 arranged on the upper surface thereof. It is handled in the state accommodated in the component tray 5 which is an example of the component accommodating member provided. Considering the ease of the operation of accommodating the IC component 1 in the component accommodating portion 5a and the operation of taking out the IC component 1 from the component accommodating portion 5a, the inner dimensions of each of the component accommodating portions 5a are as follows. It is formed to be larger than the outer dimension of 1. Therefore, although the movement range of the IC component 1 is limited to a predetermined range in the state of being accommodated in the component accommodating portion 5a, the arrangement is not completely fixed. In each component housing portion 5a, each IC component 1 is housed with the bump forming surface S as the upper surface side.

  As shown in FIGS. 1 and 2, the bump forming device 101 includes a tray holding device 10 that is an example of a storage member holding device that holds a component tray 5 in a state where a plurality of IC components 1 are stored, and the tray holding device. And an imaging device 20 that captures an image of each IC component 1 housed in the component tray 5 held by the device 10. In addition, the imaging device 20 includes a camera unit 22 that is an example of an imaging camera unit that acquires an image by capturing the image, and a bump formation surface of the IC component 1 that is an imaging target for capturing the image. With respect to S, the alignment of the illumination device 24 for irradiating light, the imaging optical axis T of the camera unit 22 and the approximate center of the IC component 1 that is the imaging target is adjusted for the imaging. And an imaging moving device 28 that is an example of an imaging optical axis positioning unit that is performed by moving the camera unit 22 in a direction substantially along the surface of the bump forming surface S. Further, in the bump inspection apparatus 101, as shown in FIG. 2, the component tray 5 supplied from the tray supply position P1 disposed in the vicinity of the right end portion of the illustrated apparatus is supported at both ends thereof by the two rails 16a. On the other hand, the tray which is conveyed to the inspection position P2, the defective part discharge position P3, and the tray discharge position P4 disposed in the vicinity of the left end of the apparatus so as to be sequentially positionable to the respective positions. A transport device 16 is provided.

  As shown in FIGS. 1 and 2, the tray holding device 10 is configured to hold the component tray 5 in a state in which ends facing each other are held by the rails 16 a of the tray transport device 16 at the inspection position P <b> 2. It has the function to fix securely. Specifically, the tray holding device 10 includes a lower side support member 11 that can support the mutually opposing end portions of the component tray 5 on the lower surface side so as to maintain a substantially horizontal state, and the respective lower side support members. By pushing down the mutually opposing end portions of the component tray 5 in a state of being supported by 11 from the upper surface side, the respective end portions are urged toward the respective lower side support members 11 and the respective lower side support members are supported. And an upper side support member 12 that holds the support position by the member 11. Further, the tray holding device 10 includes a support member lifting / lowering device 13 that integrally drives the upper support members 12 to move up and down.

  With the tray holding device 10 having such a configuration, the component tray 5 transported to the inspection position P2 by the tray transport device 16 is supported by the respective lower support members 11 while being in its raised position. Each upper support member 12 in a positioned state is integrally lowered by a support member lifting device 13 so as to press the respective end portions of the component tray 5 against the respective lower support members 11. The supporting position can be held. Such component trays 5 are often formed of resin or the like, and some warpage (for example, warpage of about 0.3 mm) may occur. Even in such a case, the warpage can be corrected by holding the component tray 5 by holding the respective lower side support members 11 substantially horizontally, and in the holding state. The component tray 5 can be kept substantially horizontal.

  Further, as shown in FIG. 1, the optical axis T for imaging in the camera unit 22 is arranged so as to be substantially orthogonal to the bump forming surface S of the IC component 1, and the camera unit 22 is arranged on this optical axis T. As an image pickup optical lens, a telecentric lens 22a is provided. In an optical system configured using such a telecentric lens 22a, the aperture stop can be positioned at the focal position of the lens, so that the main optical axis is parallel to the lens optical axis on the object side or both sides. It becomes possible. In particular, in the case where the optical system adopts a configuration in which a telecentric lens is disposed on the object side, this angle of view (telecentricity) can be as close to 0 degrees as possible, That is, even if the subject moves up and down, the dimensional variation and the positional variation can be reduced, and the measurement error can be reduced. Therefore, in the bump inspection apparatus 101, even if there is a variation in the distance dimension from the camera unit 22 to the bump forming surface S of the IC component 1 that is the imaging target due to warpage of the component tray 5 or the like, In each captured image, it is possible to prevent a variation in the size of each IC component 1 caused by the variation in the distance dimension.

  In addition, as shown in FIG. 1, the illuminating device 24 simply irradiates the bump forming surface S of the IC component 1 to be imaged with light in a substantially single direction along the direction along the optical axis T. The coaxial illumination unit 25, which is an example of a unidirectional light irradiating unit, and the bump forming surface S are inclined from the bump forming surface S in a plurality of directions from the periphery toward the approximate center of the bump forming surface S. And a dome illumination unit 26 which is an example of a tilt direction light irradiation unit that irradiates light from each direction.

  The coaxial illumination unit 25 is provided in the vicinity of the camera unit 22 and, for example, reflects light emitted from a direction orthogonal to the optical axis T in a direction along the optical axis T by using the reflecting mirror. Such a configuration is adopted. Further, by adopting such a coaxial illumination unit 25 together with the telecentric lens, the reflected light on the surface of the bump 3 of the illumination light irradiated along the principal ray is captured, and an image of each bump 3 is obtained. Since imaging can be performed, a change in reflectance on the surface of the bump 5 can be captured as contrast. That is, it is possible to achieve high-accuracy image acquisition that can identify irregularities and curved surface changes on the surface of the bump 3.

  Further, the dome illumination unit 26 irradiates light on the surface of the bump 3 not only in the direction along the optical axis T but also in the direction inclined at various inclination angles from the optical axis T. In the image picked up by the above, it is possible to obtain an image such that there is no shadow on the surface of the bump 3 due to unevenness or curved surface change. That is, it has a function as shadowless illumination. In order to realize such functions and effects, the dome illumination unit 26 is at least substantially uniform around the substantially center as the plurality of directions from the periphery toward the approximate center of the bump forming surface S. It is desirable that the light in the tilt direction can be irradiated from at least three directions arranged at an angle.

  Further, the camera unit 22 can capture images of the bump forming surfaces S of the respective IC components 1 accommodated in the respective component accommodating portions 5a of the component tray 5 collectively for each IC component 1. In addition, an image pickup device having a relatively large number of pixels, for example, a CCD (not shown) is provided.

  Further, as shown in FIG. 1, the camera unit 22, the coaxial illumination unit 25, and the dome illumination unit 26 are integrated with a common frame 27, and the imaging movement is further performed through the frame 27. The device 28 is supported so as to be integrally movable. The imaging moving device 28 supports a Y-axis direction moving device 29 that moves the frame 27 along a direction (Y-axis direction) substantially orthogonal to the conveying direction of the component tray 5 and the Y-axis direction moving device 29. In addition, an X-axis direction moving device 30 that moves the Y-axis direction moving device 29 along the conveying direction (X-axis direction) of the component tray 5 is provided. Each of such moving devices can be configured using, for example, an LM guide, an LM block engaged with the LM guide, and a ball screw shaft mechanism.

  Here, the characteristics of the two types of illumination units included in the illumination device 24 of the bump inspection apparatus 101, that is, the coaxial illumination unit 25 and the dome illumination unit 26 will be specifically described. In the description, FIGS. 4A and 4B, and FIGS. 5A and 5B are schematic explanatory views showing light irradiation and reflection states on the bumps from the respective illumination units.

  First, FIG. 4A is a schematic explanatory view showing a state in which light is irradiated from the coaxial illumination unit 25 to the bump 3. The coaxial illumination unit 25 includes a reflecting mirror 25a. The emitted light is reflected by the reflecting mirror 25a, and is applied to the bump 3 disposed below as coaxial light W1 that is light along the optical axis T. Irradiation is possible. Since the bump 3 shown in FIG. 4A has a substantially conical shape, the coaxial light W1 irradiated on the surface of the bump 3 is reflected so as to be diffused on the surface of the cone. The coaxial light W <b> 1 thus made is reflected along the optical axis T and does not enter the camera unit 22. Therefore, in the image captured by such a camera unit 22, the surface of the bump 3 appears black.

  Next, FIG. 4B is a schematic explanatory view showing a state in which light is applied to the bump 3 from the dome illumination unit 26. The dome illumination unit 26 can irradiate the bumps 3 arranged below with diffused light W2 (an example of the light in the tilt direction) that is light inclined at various angles from the optical axis T. It has become. As shown in FIG. 4B, the diffused light W2 applied to the surface of the bump 3 from the dome illumination unit 26 is applied to the entire periphery of the bump 3, and a part of the irradiated diffused light W2 has a substantially conical surface. Is reflected along the optical axis T. By receiving the reflected light W3, which is the reflected light, by the camera unit 22, an image of the bump 3 is taken. Therefore, in the image captured by such a camera unit 22, the entire surface of the bump 3 appears white.

  FIG. 5A is a schematic explanatory view showing a state where the coaxial light W1 is irradiated from the coaxial illumination unit 25 to the bump 3, but the shape of the bump 3 is different from the case shown in FIG. 4A. In this example, a crushing plane 3b (flat surface) is formed on the top 3a of the bump 3. As shown in FIG. 5A, the coaxial light W <b> 1 irradiated on the surface of the bump 3 is reflected so as to be diffused on the peripheral surface portion of the bump 3, but is a flat surface substantially orthogonal to the optical axis T. On the plane 3b, the coaxial light W1 is reflected along the optical axis T. When the reflected light W4 that is the reflected light is received by the camera unit 22, an image of the bump 3 is captured. In the image picked up in this way, the peripheral surface of the bump 3 appears black and the crushing plane 3b appears white.

  Further, FIG. 5B is a schematic explanatory view showing a state in which the dome illumination unit 26 irradiates the diffused light W2 to the bump 3 having such a flat surface 3b. As shown in FIG. 5B, a part of the diffused light W <b> 2 irradiated to the bump 3 from the dome illumination unit 26 is reflected along the optical axis T on the entire surface of the bump 3. However, since the dome illumination unit 26 is arranged on the optical axis T for imaging of the camera unit 22, the dome illumination unit 26 has a hollow portion on the optical axis T and in the vicinity thereof for causing the camera unit 22 to acquire reflected light. is doing. The diffused light W2 irradiated from the dome illumination unit 26 having such a structure does not have a coaxial light component along the optical axis T (or even if it has such a component, the amount is small). ) For this reason, in the captured image, the peripheral surface portion of the bump 3 appears white, and the crushing plane 3b portion appears blacker than the peripheral surface portion.

  In addition, with respect to the bump 3 having a generally conical shape in this manner, the coaxial light W1 is applied to the top 3a (or the crushing plane 3b formed on the top 3a), so that the top 3a is irradiated. It can be said that it is an example of light, and the diffused light W2 is an example of light for peripheral surface irradiation because the peripheral surface is mainly irradiated.

  The bump inspection apparatus 101 having such a configuration performs overall control while associating operations of the respective components with each other, and performs control processing for performing an inspection processing operation of the formation state of the bump 3 based on the captured image. A device 50 is provided. A control block diagram showing the configuration of the control device 50 is shown in FIG. 6, and the configuration of the control device 50 will be described with reference to FIG.

  As shown in FIG. 6, the control device 50 includes an axis control unit 51 that controls the movement operation of the imaging device 20 by the imaging movement device 28, and an illumination control unit 52 that controls the light irradiation operation by the illumination device 24. The holding control unit 53 for controlling the operation of holding / holding the component tray 5 by the tray holding device 10 and the image acquisition operation by the imaging device 20 and the image processing of the acquired image are performed. And an inspection control unit 54 for inspecting the formation state.

  The axis control unit 51 controls the movement operation of the imaging device 20 by the X-axis movement device 30 and the Y-axis movement device 29, that is, the movement operation of the optical axis T with respect to the component tray 5 held by the tray holding device 10. The imaging device 20 can be moved so that the optical axis T is positioned approximately at the center of each IC component 1 housed in the component tray 5.

  The illumination control unit 52 can control the irradiation operation of the coaxial light W1 by the coaxial illumination unit 25 included in the illumination device 24 and the irradiation operation of the diffused light W2 by the dome illumination unit 26, and obtain an image. The coaxial illumination unit 25 and the dome illumination unit 26 can be selectively used in accordance with the type of image desired. In addition, the timing of light irradiation by the respective illumination units and the timing of imaging by the camera unit 22 are controlled so as to be synchronized with each other.

  The holding control unit 53 can control the holding / holding release operation of the component tray 5 by the lifting / lowering operation of the upper support member 12 by the support member lifting / lowering device 13. The tray holding device 10 can control the component tray 5. If the holding of the component tray 5 is stopped, the transfer of the component tray 5 by the tray transfer device 16 is stopped, and the transfer operation of the tray transfer device 16 is performed so that the transfer is performed when the holding is released. The control operation associated with is performed.

As shown in FIG. 6, the inspection control unit 54 takes out an image stored in the image storage unit 61 and an image storage unit 61 that stores the image acquired by the imaging device 20 so that the image can be taken out. A component position recognition unit 62 for recognizing the position of the IC component 1 based on the image, and an inspection of each bump whose arrangement is set in advance based on the position where each bump 3 in the IC component 1 is to be formed. By setting a region (which will be described in detail later) on the image of the IC component 1 based on the recognition result by the component position recognition unit 62, the bump inspection for each bump 3 from the image of the IC component 1 is performed. 8 is an example of a bump inspection area setting unit 63 that acquires an image for use, and an inspection processing unit that performs an inspection process such as a formation position of each bump 3 based on each bump inspection image. A bump inspection unit 64, a pass / fail determination unit 65 for determining pass / fail based on the inspection result, and an inspection condition setting unit 66 for setting an inspection condition as a reference for the determination in the pass / fail determination unit 65 It has. Furthermore, the control device 50 is provided with a display unit 67 that displays the determination result in the pass / fail determination unit 65 in a recognizable manner, so that the operator of the bump inspection apparatus 101 can recognize the inspection result through the display unit 67. It is possible.

  In the control device 50, information for identifying the IC component 1 to be inspected, for example, the lot number and the component number of the IC component 1, and the individual bumps 3 formed in the IC component 1 are identified. For example, information such as a bump number is input and held, and bump inspection result information, which will be described later, can be associated with these component information.

  A procedure for inspecting each bump 3 of the IC component 1 in the bump inspection apparatus 101 having the above-described configuration will be described below. In the description, a flowchart of the procedure of the inspection process is shown in FIG. Each procedure in this inspection process is comprehensively controlled by the control device 50 so that the components of the bump inspection apparatus 101 perform operations associated with each other.

  First, in starting the inspection process, a state in which a plurality of IC components 1 are accommodated in the component tray 5 is shown as a schematic plan view in FIG. 8A, and a sectional view taken along line BB of the component tray 5 in FIG. 8A is shown. Shown in FIG. 8B.

  As shown in FIGS. 8A and 8B, the component tray 5 includes, for example, nine component housing portions 5a arranged in an aligned manner, and the IC component 1 is individually bump-formed on each component housing portion 5a. S is accommodated with the top surface. Moreover, since each component accommodating part 5a is formed larger than the external shape of the IC component 1, the arrangement | positioning of the IC component 1 accommodated in each component accommodating part 5a is in the state which is not being fixed. . The following description will be given on the assumption that the IC component 1 accommodated in the component accommodating portion 5a disposed in the upper right corner of the component tray 5 is the first IC component 1 to be imaged.

  First, in FIG. 2, the component tray 5 is supplied to the tray supply position P <b> 1 in the tray conveyance device 16. The component tray 5 is conveyed from the tray supply position P1 to the inspection position P2 by the tray conveying device 16, and the component tray 5 is held by the tray holding device 10 at the inspection position P2.

  Thereafter, in step S1 of FIG. 7, the IC component 1 that is first inspected from among the IC components 1 accommodated in the component tray 5 (the IC component 1 accommodated in the upper right corner of FIG. 8A). ) Is selected. When the selection is performed, in step S2, the imaging moving device 28 moves the imaging device 20, and the optical axis T is positioned substantially at the center of the selected IC component 1. In addition, an image of the IC component 1 is picked up by the camera unit 22 in such a positioned state, and the imaging field R by the camera unit 22 accommodates the IC component 1 as shown in FIG. 8A. It will arrange | position so that the whole component accommodating part 5a to be included may be included. By setting the imaging field of view R in such a range, the image of the IC component 1 can be reliably acquired even when the arrangement in the component housing portion 5a is not fixed.

  Next, in step S3, the coaxial illumination unit 25 irradiates the coaxial light W1 onto the bump forming surface S of the IC component 1, and the entire image of the IC component 1 formed by the reflected light W4 (the first entire image and the first image). Image). The first whole image acquired by imaging is stored in the image storage unit 61 of the inspection control unit 54. In addition, when the image acquisition by this imaging is performed, the light irradiation by the coaxial illumination unit 25 is stopped.

  Thereafter, in Step S4, the dome illumination unit 26 irradiates the bump forming surface S of the IC component 1 with the diffused light W2, and the entire image of the IC component 1 formed by the reflected light W3 (referred to as a second entire image). ). The second whole image acquired by imaging is stored in the image storage unit 61 of the inspection control unit 54. In addition, when the image acquisition by this imaging is performed, the light irradiation by the dome illumination unit 26 is stopped.

  When each image is acquired, the position of the IC component 1 is recognized based on the captured image in step S5. Specifically, for example, a first overall image that is an image captured using the coaxial light W <b> 1 is extracted from the image storage unit 61, and the position recognition unit 62 recognizes the position. The first image G1 of the IC component 1 is, for example, as shown in the schematic plan view of FIG. 9, with the IC component 1 housed in the component housing portion 5a, the respective bumps 3, the IC component 1, and The image of the component accommodating part 5a is acquired collectively. Further, as shown in FIG. 9, reference marks 1a for position recognition are formed in the upper right corner and lower left corner of the bump forming surface S of the IC component 1 in the drawing. Note that the arrangement of the reference marks 1a on the bump formation surface S of the IC component 1 is not limited to such a case, and various other arrangements can be adopted. As shown in FIG. 10, the component position recognizing unit 62 recognizes each of the reference marks 1a, so that in this first overall image, the housing posture of the IC component 1 in the component housing unit 5a, That is, the planar position and angle are obtained.

  Thereafter, in step S6, each bump 3 set in advance on the first overall image G1 based on the position information of the IC component 1 in the first overall image G1 recognized by the component position recognition unit 62. A bump inspection window Q is set as a bump inspection area. Here, the bump inspection window Q is an area (window) for cutting out the image of each bump 3 formed on the IC component 1 from the first overall image G1 of the IC component 1 as shown in FIG. In this case, each reference mark 1a and each bump 3 are designed in advance with reference to the design formation positions. Further, such an inspection window Q is set to a size such that the image of each bump 3 is within the region range. Further, as described above, since the arrangement position of the IC component 1 is not fixed in the component accommodating portion 5a, the bump is determined based on the position recognition result of the IC component 1 in the captured first whole image G1. The inspection window Q is positioned and set. With this setting of the bump inspection window Q, the first bump inspection image G3 for each bump 3 is acquired from the first entire image G1.

  Further, such a setting operation of the bump inspection window Q is performed on the second whole image G2 that is an image of the IC component 1 captured by the diffused light W2, for example, the position of the IC component 1 By using the recognition result and arranging and setting the bump inspection window Q on the second whole image G2, the second bump inspection image G4 for each bump 3 can be obtained from the second whole image G2. Will be acquired. The first bump inspection image G3 and the second bump inspection image G4 acquired in this way are stored in the image storage unit 61, for example.

  Next, in step S7, a bump 3 to be inspected first is selected from each first bump inspection image G2 stored in the image storage unit 61, and the selected bump 3 is selected. A first bump inspection image G3 is taken out. In step S8, the bump inspection unit 64 detects the bump formation position. This bump formation position is detected by recognizing the outline of the bump 3 (for example, a substantially circular outline) from the first bump inspection image G3 by pattern matching and then calculating the center position of the outline. . This recognition result is output to the pass / fail judgment unit 65.

  The bump forming position detection process in step S8 is not limited to the case where the first bump inspection image G3 is used, but the case where the second bump inspection image G4 is used. It may be. It is possible to identify the contour of the bump 3 in both the first bump inspection image G3 imaged by the coaxial light W1 and the second bump inspection image G4 imaged by the diffused light W2. However, as will be described later, it is more preferable to perform the inspection process of the bump formation position using the second bump inspection image G4 by the diffused light W2 that can image only the bump 3 with high contrast.

  Next, in step S9, the bump inspection unit 64 inspects the crushing degree of the top 3a of the bump 3 using the acquired first bump inspection image G3. This crushing degree inspection is performed when the crushing plane 3b exists on the top 3a of the bump 3 in the image G3 using the first bump inspection image G3 imaged using the coaxial light W1. Is performed by calculating the size of the crushing plane 3b by calculating the area of the white portion by using the white portion of the portion. Even when the second bump inspection image G4 imaged using the diffused light W2 is used, the crushing plane 3b portion of the top 3a is blacker than its surroundings (portion white). Since the image is captured, the second bump inspection image G4 may be used for the collapse degree inspection. However, the first bump inspection image G3 has a clearer contrast between the crushing plane 3b and the surrounding portion than the second bump inspection image G4. It is desirable to use the bump inspection image G3. This inspection result is output to the pass / fail judgment unit 65.

  Next, in step S10, the first bump inspection image G3 or the second bump inspection image G4 is used to inspect whether there is any abnormality in the substantially convex (or substantially conical) shape of the bump 3. Is done. Specifically, although details will be described later, the top 3a of the bump 3 is formed so as to be greatly deviated from the vicinity of the plane substantially center of the bump 3, or a part of the peripheral surface of the bump 3 is flat. An inspection is performed for the presence or absence of an abnormal shape, such as when it is formed to protrude outside the target contour. This inspection result is output to the pass / fail judgment unit 65.

  When each of the above-described inspections is performed on the first selected bump 3, in step S11, it is determined whether or not there is a bump 3 to be inspected next in the IC component 1, and it is determined that it exists. In step S12, the next bump 3 is selected, and the first bump inspection image G3 and the second bump inspection for the selected bump 3 are sent from the image storage unit 61 to the bump inspection unit 64. The work image G4 is taken out. Thereafter, the bump inspection unit 64 performs each of the above-described steps S8 to S10.

  On the other hand, if it is determined in step S11 that the bump 3 to be inspected next does not exist in the IC component 1, the pass / fail determination unit 65 sets the inspection condition set in advance in the inspection condition setting unit 66. On the basis of this, the pass / fail judgment of each bump 3 is performed. In addition, instead of the case where the pass / fail determination is performed by the pass / fail determination unit 65 as described above, the bump inspection unit 64 may perform the determination. In addition, the pass / fail determination result, that is, the inspection result is output from the pass / fail determination unit 65 to the display unit 67 (step S13).

  Thereafter, in step S14, it is determined whether or not the inspection has been completed for all the IC components 1 accommodated in the component tray 5, and if not completed, in step S15, the next The IC component 1 is selected, and the processes from step S2 to S13 are performed on the selected IC component 1. On the other hand, if it is determined in step S14 that the inspection for all the IC components 1 has been completed, the inspection processing is completed. Note that, instead of the case where the image acquisition for the next IC component 1 is performed after the inspection processing for the one IC component 1 is completed in this way, the imaging of the image for the one IC component 1 is performed. Then, the next IC component 1 is continuously picked up with an image, and in parallel with the image pick-up operation, a bump inspection process using the image of the first IC component 1 is performed. Such a case may be used.

  When the inspection process is completed, the holding of the component tray 5 by the tray holding device 10 is released, and then the component tray 5 is conveyed from the inspection position P2 to the defective component discharge position P3 by the tray conveying device 16. At the defective component discharge position P3, the IC component 1 determined to be defective in the formation state of the bump 3 based on the result of the inspection process is taken out from the component tray 5 and discharged. Thereafter, the component tray 5 is discharged to the tray discharge position P4 by the tray conveying device 16, and the component tray 5 is discharged from the bump inspection device 101.

  In the description of each step described above, the case where the second whole image is captured in step S4 after the first whole image is captured in step S3 has been described. Instead of this, the first whole image may be taken in step S3 after the second whole image is taken in step S4.

  Further, in the above-described inspection processing, the case where the camera unit 22 individually acquires the entire image of the IC component 1 accommodated in the component tray 5 has been described. However, the present embodiment is only applied to such a case. It is not limited. Instead of such a case, for example, it may be a case where images of a plurality of IC components 1 housed in the component tray 5 are acquired in a lump. This is because the processing similar to the above-described inspection processing can be performed by dividing the image for each IC component 1 after the batch acquisition in this way.

  Next, each inspection processing method performed in the bump inspection unit 64 will be described in detail. Prior to the description of the respective inspection processing methods, the types of shapes of the bumps 3 formed on the IC component 1 and their images will be described with reference to the drawings.

  First, FIG. 13A shows a schematic diagram of the bump 3 in a state in which the top 3a is not crushed (when a bump having such a shape characteristic is specified and used as a bump 3X), FIG. FIG. 13 is a diagram showing an example of the first bump inspection image G3 imaged using the coaxial light W1 with respect to the bump 3X. FIG. 13C shows a second image imaged using the diffused light W2. The figure showing an example of image G4 for bump inspection is shown.

  As shown in FIGS. 13B and 13C, the entire surface of the bump 3X in a substantially conical shape is black in the first bump inspection image G3, and in the second bump inspection image G4. The whole is white.

  Next, FIG. 14A is a schematic diagram of the bump 3 in a state in which a crushing plane 3b is formed on the top 3a (when a bump having such a shape characteristic is specifically used, it is referred to as a bump 3Y). FIG. 14B shows a diagram illustrating an example of the first bump inspection image G3 imaged using the coaxial light W1 with respect to the bump 3Y. FIG. 14C illustrates imaging using the diffused light W2. The figure showing an example of the 2nd image for inspection of bumps G4 shown is shown.

  As shown in FIG. 14B, in the first bump inspection image G3, the peripheral surface of the bump 3Y appears black, and the crushing plane 3b appears white. On the other hand, as shown in FIG. 14C, in the second bump inspection image G4, the peripheral surface of the bump 3Y appears white and the crushing plane 3b appears black.

  Next, in FIG. 15A, a bump 3 in a state in which a curved corner portion 3c that is curved so that the head top portion 3a is largely deviated from the center position is formed (a bump having such a shape characteristic is specified and used. FIG. 15B and FIG. 15C show an example of the first bump inspection image G3 imaged using the coaxial light W1 with respect to the bump 3Z. Each figure is shown, and each figure showing an example of the second bump inspection image G4 imaged using the diffused light W2 is shown in FIGS. 15D and 15E.

  As shown in FIGS. 15B and 15C, in each of the first bump inspection images G3, the entire peripheral surface of the bump 3Z is shown in black, and the black image including the curved corner portion 3c is integrally formed as a black image. Yes. Further, the curved corner 3c forms an image region that protrudes outward from the substantially circular outline of the bump 3Z. Further, as shown in FIGS. 15D and 15E, in each second bump inspection image G4, the entire peripheral surface of the bump 3Z is shown in white, and the white image including the curved corner portion 3c is integrated with the white image. Has been. Further, the curved corner 3c forms an image region that protrudes outward from the substantially circular outline of the bump 3Z.

(Bump formation position detection method)
Next, a method for detecting the bump formation position using such an image will be described. 12A, 12B, and 12C are schematic explanatory diagrams for explaining this detection method. As shown in FIG. 12A, although the bump 3 has a substantially circular planar outline (indicated by a two-dot chain line in the figure), depending on the formation state, the bump 3 has a flattened outline. There are cases like this. On the other hand, in order to accurately detect the formation position of the bump 3, the center position of the recognized contour is surely recognized even when the contour is elliptical or the like. Therefore, it is necessary to detect the center position as the bump 3 formation position. Therefore, in the present embodiment, even for such a flattened circular outline, a bump search template 70 which is an example of a step function edge detection template capable of pattern matching according to the outline shape. Is used.

  Specifically, as shown in FIG. 12A, the bump search template 70 is equally arranged on the matching line portion 72 and the substantially circular matching line portion 72 for matching with the contour 71 of the bump 3. For example, the partial curvature is individually changed in the matching line portion 72 by changing the matching line portion 72 in the normal direction in each of the arrangement positions and the vicinity thereof, which are arranged in eight equal parts. In the matching line portion 72, a plurality of (that is, eight) line portion movement change bars 73 that individually change the partial curvature are provided.

  For example, the matching line portion 72 is formed so as to have a diameter of, for example, 70 μm in the initial state (the state in which the movement is not changed), and each line portion movement change bar 73 is formed of the matching line portion 72. In the normal direction, the outer side is 13.6 μm and the inner side is 13.6 μm. The matching line portions 72 formed in this way have a maximum of 13.6 μm outward in the normal direction and a maximum of 13 inward in the normal direction at the positions where the respective line portion movement change bars 73 are arranged. .6 μm can be individually moved and changed, and by performing such a movement change, the partial curvature in the matching line portion 72 can be individually changed.

  Further, each line portion movement change bar 73 recognizes a boundary portion between a white portion (that is, a bright portion) and a black portion (dark portion) on the arranged image. The matching line part 72 can be partially moved and changed so that the intersection part with the matching line part 72 is positioned at the boundary part recognized in this way. .

  A method of detecting the formation position of the bump 3 using such a bump search template 70 will be specifically described. First, as shown in FIG. 12A, using the first bump inspection image G3 or the second bump inspection image G4, a part of the contour 71 of the bump 3 and the matching line portion 72 of the bump search template 70 are used. Match with a part of. Specifically, the matching line part 72 at each intersection position with the four line part movement change bars 73 arranged on the left side of the bump search template 70 in the drawing is displayed on the left side of the contour 71 of the bump 3. A bump search template 70 is arranged on the image so as to substantially match the portion. In this state, the matching line portion 72 at each intersection position with the four line portion movement change bars 73 on the right side of the matching line portion 72 and the right side portion of the contour 71 coincide with each other. There is no state. However, in these unmatched portions, a part of the contour 71 of the bump 3 is arranged on the four line portion movement change bars 73.

  Thereafter, as shown in FIG. 12B, in the four line portion movement change bars 73 in the portions that do not match each other, the intersection position with the contour 71 of the bump 3 is determined using the light / dark portion boundary recognition function. The matching line portion 72 is partially and individually moved and changed (fitting change) so that the matching line portion 72 is positioned at each recognized intersection position. Specifically, the matching line portion 72 in the portion where the four line portion movement change bars 73 are arranged is moved and changed outward in the normal direction. Even in such a case where the movement is changed, the matching line portion 72 is maintained in a curved shape, and a corner portion or the like is not formed.

  By performing such movement change, as shown in FIG. 12C, the matching line portion 72 is substantially matched with the contour 71 of the bump 3, and the matching of the bump search template 70 with the contour 71 is performed. It will be. Thereafter, the center coordinates of the matched bump search template 70 are calculated, and the calculated center coordinates are detected as the bump 3 formation position. It should be noted that in such a matching, it is often difficult to match 100% in practice, and it is considered that the purpose is to finally calculate the center coordinates from the matched state. In this case, it is possible to match with a match of about 80% or more.

  In the above description, the case where the bump search template 70 is provided with the eight line portion movement changing bars 73 has been described. It is not limited to cases only. When highly accurate detection is performed or when the shape of the bump is large, the number of the line portion movement change bars 73 may be increased, for example, the number of about 16 to 24 bars. It can be. In consideration of such a template matching function, it is desirable that the number of line section movement change bars 73 is at least four.

  In addition, such a bump formation position detection method uses, for example, a second bump inspection image acquired by irradiating the bump 3Y having the crushing plane 3b as shown in FIG. 14C with the diffused light W2. A case where G4 is used will be described with reference to the drawings.

  As shown in FIG. 16A, first, the second bump inspection image G4 for the bump 3Y is taken out from the image storage unit 61. A bump search template 70 shown in FIG. 16B is arranged on the extracted second bump inspection image G4, and matching with a part of the contour 71 in the image of the bump having a white substantially annular region is performed. Do. After this matching, the matching line portion 72 is deformed and moved to substantially match the matching line portion 72 with the contour 71 of the bump 3 (fitting). In the substantially matched state, the center coordinates of the matching line portion 72 are calculated to detect the formation position of the bump 3Y.

  In addition, in this bump formation position detection processing, a case where the second bump inspection image G4 for the bump 3Y having the crushing plane 3b is used has been described. It is not limited only to such a case. In place of such a case, the same procedure is used regardless of the case of using any of the various bump 3 shapes shown in FIGS. 13A to 13C, 14A to 14C, and 15A to 15E. Can be done.

  However, in such a bump formation position detection process, the second bump inspection image G4 using the diffused light W2 is used rather than the case where the first bump inspection image G3 using the coaxial light W1 is used. preferable. Since the coaxial light W1 is in principle a method of “lighting portions other than the bumps 3”, an image of the bumps 3 themselves cannot be actively acquired. That is, in the coaxial light W1, the pad portion around the bump 3 is lit white so that the black portion inside the bump is indirectly acquired as an image of the bump 3. However, the bump forming surface S of the IC component 1 has other black portions, so that, for example, when the bump 3 is formed out of the pad portion, the bump 3 It is also conceivable that the boundary of the contour is not clear and it is difficult to recognize the bump 3. Furthermore, when the coaxial light W1 is used, images of various patterns other than the bump 3 such as the IC pattern on the bump forming surface S of the IC component 1 are also acquired, resulting in erroneous recognition of the bump and a decrease in accuracy. It is also possible. On the other hand, since the diffused light W2 does not contain many coaxial components in nature, the IC pattern as described above is hardly visible. For this reason, in the bump formation position detection process, it is preferable to use the second bump inspection image G4 by the diffused light W2 that can image only the bump 3 with high contrast.

(Inspection method of crushing degree at the top of the bump)
Next, a method for inspecting the crushing degree at the top 3a of the bump 3 will be described. For example, such a crushing degree inspection is performed on a bump 3Y having a crushing plane 3b as shown in FIG. 14A using a first bump inspection image G3 imaged by the coaxial light W2 shown in FIG. 14B. A case will be described.

  First, as shown in FIG. 17A, a predetermined range D is set from the center position C in the first bump inspection image G3 in a state where the bump formation position is inspected, and is within the predetermined range D. Calculate the area of the white image area. Specifically, such calculation is performed by a binarized particle analysis processing method.

  Thereafter, as shown in FIG. 17B, a white image region E within a predetermined range D is detected and its area is calculated. The detected white image region E substantially matches the collapse plane 3b in the bump 3Y, and the area of the collapse plane 3b can be calculated by calculating the area. In addition, the quality determination unit 65 determines whether the calculated area of the collapse plane 3b is within a predetermined area value range or the like.

  In such a case where the degree of collapse is inspected, instead of using the first bump inspection image G3 by the coaxial light W1 as described above, the second by the diffused light W2 is used. The bump inspection image G4 may be used. However, when high-precision inspection is required, the first bump inspection image G3 by the coaxial light W1 in which the boundary between the white area and the black area in the image is expressed with a clearer contrast is obtained. It is preferable to use it.

  As shown in FIG. 5B, in the case where the diffused light W2 is irradiated at a very wide angle from the dome illumination unit 26, the light irradiated on the crush plane 3b in the bump 3Y returns to the camera unit 22. Therefore, in the captured second bump inspection image G4, the portion of the flat surface 3b appears black, and it is possible to inspect the above-described degree of flatness in such a state. However, in the case where the diffused light W2 is used in this way, the collapse plane 3b in the bump 3Y is not explicitly lit, and the collapse plane 3b is only indirectly determined depending on the irradiation angle and the irradiation position of the diffused light W2. It is inspecting without shining. Therefore, depending on the irradiation angle and irradiation position, a component close to the same axis may be included. In such a case, the contrast of the flat surface 3b in the picked-up image is also reduced, and the inspection accuracy of the degree of flatness is also improved. Will be reduced. For this reason, it can be said that the above-described crushing degree inspection is preferably performed using the first bump inspection image G3 using the coaxial light W1.

  Further, the crushing of the top portion 3a in the bump 3 may be actively formed by leveling processing for each bump 3 included in the IC component 1.

(Detection method of bump shape abnormality)
Next, a method for inspecting whether or not the shape of the bump 3 itself is abnormal will be described. In such an inspection, for example, as shown in FIG. 15A, even when no abnormality is detected in the inspection of the formation position of the bump 3 or the inspection of the crushing degree, the top 3a is larger than the center position. This is performed in order to reliably detect the bump 3Z in which the curved corner 3c is formed so as to be shifted.

  Specifically, as shown in FIG. 18A, after the contour 71 in the image of the bump 3Z and the bump search template 70 are fitted, the formation position of the bump 3Z is detected. As shown in FIG. 18B, a substantially annular inspection region F is disposed adjacent to the periphery of the substantially circular outline 71 of the bump 3Z. After this arrangement, in the inspection area F, it is inspected whether a part of the image of the bump 3Z is detected.

  For example, as shown in FIG. 18B, when a part 75 of the image of the bump 3Z is detected in the substantially annular inspection region F, the area of the detected image region H is set in advance. By determining whether or not the allowable range is exceeded, if it exceeds the allowable range, it is determined that it has an abnormal shape.

  In such an inspection, any of the images shown in FIGS. 15B to 15E can be used.

  Next, an explanation will be given of an example of the necessity of performing the inspection of the crushing degree of the top 3a and the criterion for the determination in the inspection of the bump formation state. First, FIG. 19 shows a schematic diagram of a bump 3X having a substantially conical shape in which the crest 3a is not crushed, and FIG. 20 shows a schematic diagram of a bump 3Y in which a crushing plane 3b is formed. .

  There are roughly two types of mounting methods for mounting the IC component 1 on which the respective bumps 3 are formed on the substrate. One is a crushing plane 3b formed as shown in FIG. The IC component 1 including the bump 3Y (that is, so-called leveling processing) is bonded to the substrate electrode on the substrate via a conductive bonding material, so that the IC component 1 is mounted on the substrate. SBB mounting (Stud Bump Bonding). The other is, as shown in FIG. 19, an insulating sheet member disposed on a substrate with an IC component 1 including a bump 3 </ b> X in a sharp state without causing a crushing portion on the top 3 a. In this mounting method, the IC component 1 is mounted on the substrate by breaking through the top 3a of each bump 3X and making contact with each substrate electrode.

  First, in the SBB mounting method, the crushing plane 3b is formed in advance in each bump 3Y, and each bump 3Y is not further crushed during mounting. From the viewpoint of uniforming, it is necessary to form the crushing plane 3b so that the crushing plane 3b has an area within a predetermined range when the crushing plane 3b is formed. In addition, since the area of the crushing plane 3b is within a predetermined range in each bump 3Y, the formation height of each bump 3Y can be made uniform. For example, as shown in FIG. 20, in the bump 3Y, the condition that the diameter dimension L of the crushing plane 3b is 35 μm ± 15 μm can be within the predetermined range.

  Next, in the latter mounting method, the sheet member is required to be surely pierced by the top 3a of the bump 3X. For this reason, it is preferable that the crushing plane 3b does not exist in the top 3a, but in reality, a crushing plane 3b having a slight size may exist. Therefore, even when the crushing plane 3b is formed, it is desirable that the area is formed so as not to exceed a predetermined range so that the sheet member can be broken through. For example, as shown in FIG. 20, in the bump 3Y, the condition that the diameter dimension L of the crushing plane 3b is less than 20 μm can be set to the predetermined range.

  In the inspection of the bump 3 formation state in the bump inspection apparatus 101 described above, for example, the inspection can be performed under the following conditions. For example, the inspection resolution is 3.4 μm / pixel, the inspection accuracy (3σ) is 2 μm, the inspection item is that the bump 3 is formed, the positional deviation of the formation position of the bump 3 is not more than 10 μm, the collapse plane It can be set that the diameter dimension of 3b is not 20 μm or more and that the diameter dimension of the crushing plane 3b is within a predetermined range. Further, the visual field size of the camera unit 22 is set to 6.8 mm × 6.8 mm, and the time required for the inspection processing (that is, inspection tact) is 1.8 seconds / IC component (however, it is formed in one IC component 1). When the number of the bumps 3 is 200 or less), the imaging time can be 160 msec / image, and the bump inspection time can be 4 msec / bump. By inspecting the formation state of the bump 3 under such conditions, an efficient inspection can be performed.

  According to the first embodiment, the following various effects can be obtained.

  First, in the bump inspection apparatus 101, with each IC component 1 held, each bump 3 provided in the IC component 1 is individually aligned with the imaging camera, and an image of each bump 3 is obtained. Rather than picking up an image, the entire image of the bump forming surface S is picked up on the IC component 1 in a state of being housed in the component tray 5, and a bump inspection is performed on each bump 3 from the picked up whole image. Since the image for cutting is cut out and the respective bumps 3 are inspected, in each of the bump inspection images, the influence of the positional deviation accompanying the relative alignment with the imaging system such as the camera unit 22 on the inspection accuracy is reduced. can do.

  In particular, as in the conventional inspection method, in the case where each bump 3 and the imaging camera are individually aligned, it is considered that the alignment accuracy varies for each bump 3. However, it is possible to prevent such a problem from occurring by collectively capturing images of the respective bumps 3 formed on one IC component 1 as in the above embodiment.

  Further, by capturing such an entire image of the IC component 1 and obtaining an image by extracting a bump inspection image for each bump 3 from the entire image, an imaging camera and individual bumps as in the past are obtained. It is possible to eliminate a mechanical movement operation such as the alignment of the positions of the two, and it is possible to shorten the time required to acquire the image of each bump 3. Therefore, a more efficient inspection can be performed.

  Further, since the whole image of the IC component 1 can be taken in a state where the IC component 1 is accommodated in the component tray 5, the IC component 1 itself or bumps can be obtained by holding the IC component 1 or the like. 3 can be prevented from being damaged.

  Further, in the bump inspection apparatus 101, the tray holding apparatus 10 that holds the component tray 5 that accommodates each IC component 1 that is an imaging object at the inspection position P2 has opposite end portions of the component tray 5 from below. By having a lower side support member 11 to be supported and an upper side support member 12 for supporting the respective end portions supported by the respective lower side support members 11 so as to be pushed down from above. Even when the component tray 5 is warped or warped, it can be held while the warp or warp is corrected to a substantially horizontal state. In particular, in the inspection of the formation state by acquiring the image of the bump 3 as described above, the variation in the distance between the imaging system and the imaging object causes the variation in the size of each captured image. The existence of such variations also affects the inspection accuracy of each bump 3. However, the component tray 5 that accommodates each IC component 1 that is an object to be imaged is supported in a substantially horizontal state by correcting its warp and the like, so that each IC component 1 and the camera unit 22 are supported. The distance between the two can be kept substantially constant. Therefore, even when the image of the IC component 1 is acquired in the state of being accommodated in the component tray 5, a highly accurate inspection can be realized.

  In the relative positioning of the imaging system and the imaging object, the component tray 5 is fixed and the camera unit 22 is moved by the imaging moving device 28 so that the component tray 5 is accommodated. Each IC component 1 that is present can be prevented from jumping out of the component tray 5 by the alignment 3.

  Further, by adopting the telecentric lens 22a as an optical lens provided in the camera unit 22 in the imaging apparatus 20, the influence of the variation in the distance dimension between the imaging object in imaging is given to the captured image. Can be further reduced, and a highly accurate inspection can be realized.

  In addition, the illumination device 24 includes the coaxial illumination unit 25 and the dome illumination unit 26 that irradiate two types of light having different characteristics of the light to be irradiated. In the case of performing an inspection, the contrast of the collapse plane 3b can be made clearer by using the image by the coaxial light W1 emitted from the coaxial illumination unit 25, and an accurate inspection of the collapse level can be performed. On the other hand, in the case where the entire shape of the bump 3 is inspected, the image of the diffused light W2 emitted from the dome illumination unit 26 is used to clarify the outline of the bump 3 more clearly. And an accurate inspection of the entire shape can be performed. Therefore, according to various inspection contents required for the inspection of the bump 3, a more reliable inspection can be realized by using different images captured by the two types of illumination units.

  In addition, the inspection method (inspection logic) corresponding to each of the above-described inspections is used in the inspection of the formation position of the bump 3, the inspection of the degree of crushing, and the inspection of the presence or absence of an abnormal shape using the respective images for bump inspection. Thus, each inspection can be specifically and reliably realized, and a highly accurate bump inspection method can be provided.

  Further, since the bump inspection apparatus 101 is not configured integrally with the bump forming apparatus as in the prior art, but is configured independently, the time required for forming the bump in the bump forming apparatus. The bump inspection apparatus 101 can independently implement inspection without being affected by the above. Therefore, it is possible to realize various usage modes such as using the bump forming apparatus 101 alone or using it in connection with various apparatuses, and the degree of freedom of the usage mode of the inspection apparatus can be improved.

(Second Embodiment)
In addition, this invention is not limited to the said embodiment, It can implement with another various aspect. For example, the bump inspection apparatus 201 according to the second embodiment of the present invention relates to a configuration that associates such a bump inspection apparatus 201 with other apparatuses in a controllable manner. The specific configuration is shown in the schematic configuration diagram of FIG. Note that in the bump inspection apparatus 201 of the second embodiment, the same reference numerals are given to the components having the same configuration as the bump inspection apparatus 101 of the first embodiment, and the description thereof will be omitted. .

  As shown in FIG. 21, the bump inspection apparatus 201 has substantially the same configuration as the bump inspection apparatus 101 of the first embodiment. Further, the bump inspection apparatus 201 can inspect the bumps for each IC component 1 supplied from the bump forming apparatus 291 capable of performing a bump forming process for forming each bump 3 on the IC component 1. It has become. In addition, each IC component 1 subjected to the bump inspection by the bump inspection apparatus 201 is supplied to a component mounting apparatus 292 capable of performing a component mounting process for mounting each IC component 1 on a substrate. It is possible.

  That is, in the bump forming apparatus 291, the IC component 1 on which each bump 3 is formed is supplied to the bump inspection apparatus 201, and the bump inspection apparatus 201 indicates the state of formation of each bump 3 on the IC component 1. After the inspection, the IC component 1 is supplied to the component mounting apparatus 292, and the IC component 1 is mounted on the substrate via the bumps 3 by the component mounting apparatus 292. A mounting board production apparatus 290 is configured.

  In such an IC component mounting board production apparatus 290, the control device 250 included in the bump inspection device 201 and the control devices included in the bump forming device 291 and the component mounting device 292 are connected in a controlled manner. Therefore, it is possible to exchange control-related information between the respective devices.

  Since the IC component mounting board production apparatus 290 is configured as described above, information on the inspection result of the bump 3 for each IC component 1 obtained by the bump inspection apparatus 201 is controlled by the bump inspection apparatus 201. The device 250 can transmit to the bump forming device 291 and the component mounting device 292 as necessary. In the bump forming apparatus 291 to which such inspection result information is fed back, the next bump forming step can be performed based on the information, and the information on the inspection result is fed forward. In the component mounting apparatus 292, an IC component mounting process corresponding to the inspection result can be performed based on the information.

  Specifically, for example, when the bump inspection apparatus 201 detects an IC component 1 having a defect in the top 3 a of the bump 3, the bump forming apparatus 291 that has formed the bump 3 on the IC component 1. (If there are a plurality of bump forming apparatuses 291, a specific apparatus is specified from among them), the abnormal amount of the top 3 a and information on defective parts are fed back. If the crushing amount is always abnormal with respect to the bump 3 at a specific position, there may be a cause such as the presence of foreign matter in the leveling mechanism section for each bump 3 provided in the bump forming device 291. It is possible to take means such as issuing an abnormality alarm to the forming apparatus 291 or outputting a cleaning operation execution signal.

  In addition, the component mounting apparatus 292 is fed forward with the information specifying the IC component 1 by feeding forward the information on the positional deviation amount of the formation position, even if no abnormality such as the formation position of the bump 3 occurs. In the component mounting apparatus 292, the mounting process of the IC component 1 can be performed while correcting the positional deviation amount.

  The various information output from the bump inspection apparatus 201 includes, for example, the deviation amount of the bump formation position, the bump size, the bump collapse amount, the position information of the defective bump in the IC component 1, the production lot number, and the like. .

  Here, specific contents of feedback control between the bump inspection apparatus 201 and the bump forming apparatus 291 and feedforward control between the bump inspection apparatus 201 and the component mounting apparatus 292 will be described as an example with reference to the drawings. . In the description, a control block diagram showing a control configuration relating to feedback control is shown in FIG. 22, and a flowchart showing a main procedure of control operation in the feedback control is shown in FIG. FIG. 24 is a control block diagram showing a control configuration relating to feedforward control, and FIG. 25 is a flowchart showing a main procedure of control operation in the feedforward control.

(Feedback control)
First, specific contents of feedback control using information on the result of bump inspection processing from the bump inspection apparatus 201 to the bump forming apparatus 291 will be described. As shown in FIG. 22, the inspection control unit 254 in the control device 250 of the bump inspection device 201 includes the lot number of the IC component 1 and the component of the IC component 1 in addition to the components described in the first embodiment. A component information input unit 268 for inputting information on the component such as the (identification) number and the device (identification) number of the bump forming apparatus in which the bump 3 is formed on the IC component 1 to the pass / fail judgment unit 65; A feedback control unit 269 that receives the result of the bump inspection processing performed in the apparatus 250 from the pass / fail determination unit 65 and outputs information on the processing result to the bump forming device 291 is further provided.

  In the bump inspection apparatus 201 having such a configuration, first, in step S21 in the flowchart of FIG. 23, a lot number, a part number, an apparatus number of the bump forming apparatus, etc. Component information is input and preparation for bump inspection processing is performed. Thereafter, the component information is input from the component information input unit 268 to the pass / fail determination unit 65, and the inspection control unit 254 performs a bump inspection process on one IC component 1 (step S22).

  Next, the result of the bump inspection process is determined by the pass / fail determination unit 65 (step S23). As a result of the pass / fail determination by the pass / fail determination unit 65, when it is determined that there is a defective bump 3 in the one IC component 1 to be inspected, the number of defective bumps 3 in the IC component 1 in step S24. Are counted (stored). Further, in step S25, it is determined whether or not the number of defective bumps 3 in the IC component 1 is less than a preset number set in advance, and if it is determined that the number exceeds the preset number. In step S29, the bump forming device number information in the component information input from the component information input unit 268 is referred to, and the bump forming device that has formed the defective bump 3 is specified. Thereafter, these pieces of information are input from the pass / fail determination unit 65 to the feedback control unit 269, and are specified by the lot number and the part number from the feedback control unit 269 to the bump forming device 291 specified by the bump forming device number. Warning information that a defective bump 3 has been formed in the IC component 1 is notified, and information on the inspection processing result is fed back. The warning information is displayed, for example, so as to be recognized by the operator in the bump forming apparatus 291.

  On the other hand, in the pass / fail judgment unit 65, when the occurrence of the defective bump 3 is continuously generated in each IC component 1 to be sequentially inspected, the continuous number of the defective components is counted ( (Step S26). For example, in the case where the defective bump 3 is detected in the IC component 1 that has been inspected first, and the defective bump 3 is also detected in the IC component 1 that has been inspected next, The number of consecutive defective parts is counted as two. If it is determined in step S25 that the number of defective bumps 3 counted in one IC component 1 is less than the set number, the processes in steps S29 and S30 are not performed. The process of S26 is performed.

  Thereafter, the pass / fail determination unit 65 determines whether or not the counted number of consecutive defective parts is less than a preset number (step S27). If it is determined that the number of consecutive defective parts has reached the set number, the component information input to the component information input unit 268 is referred to in step S31 to bump the IC component 1 3 is specified. When the bump forming device 291 is specified, the feedback control unit 269 notifies the specified bump forming device 291 of warning information that defective parts are continuously generated, and the inspection processing result. Is fed back (step S32). In the bump forming apparatus 291, for example, this warning information is displayed so that the operator can recognize it.

  Thereafter, in step S28, it is determined whether or not the bump inspection process has been completed for all the IC components 1 to be inspected, specifically, for all the IC components 1 accommodated in the component tray 5. . If it is determined in step S23 that there is no defective bump 3 as a result of the bump inspection process, the processes of steps S24, S25, S29, S30, S26, S27, S31, and S32 are performed. Instead, the process of step S28 is performed.

  If it is determined in step S28 that there is an IC component 1 that has not yet been inspected, bump inspection processing is performed on the IC component 1 in step S22, and processing in each of the above steps is performed. Are implemented sequentially. On the other hand, if it is determined in step S28 that the bump inspection process for all the IC components 1 has been completed, the bump inspection process is completed.

  In addition, although the case where each process of step S25, S29, S27, S31 in the flowchart of FIG. 23 is performed in the quality determination part 65 was demonstrated, each said process is performed in the feedback control part 269. It may be the case.

  As a specific operation of the set number with respect to the number of defective bumps 3 in step S25 of FIG. 23, for example, two settings, a first set number and a second set number larger than the first set number. If the number of defective bumps 3 is greater than or equal to the first set number and less than the second set number, defective parts are generated in the corresponding bump forming apparatus 291. When the warning information is notified, and the number of the second set number is exceeded, an apparatus stop signal is output to the corresponding bump forming apparatus 291, and the bump forming operation by the bump forming apparatus 291 is performed. It is also possible to suppress the generation of a large amount of defective parts.

  Similarly, as a specific operation of the set number with respect to the continuous number of defective parts in step S27 of FIG. 23, for example, two of a first set number and a second set number larger than the first set number are used. When a set number is provided and the number of consecutive defective parts is equal to or more than the first set number and less than the second set number, the defective parts are continuously provided to the corresponding bump forming device 291. Warning information indicating that it has occurred is notified. On the other hand, if the number is equal to or more than the second set number, a device stop signal is output to the corresponding bump forming device 291 and the bump forming device 291 is output. It is also possible to stop the bump forming operation due to the occurrence of a large amount of defective parts.

(Feed forward control)
Next, the specific content of the feedforward control using the information of the bump inspection processing result from the bump inspection apparatus 201 to the component mounting apparatus 292 will be described. As shown in FIG. 24, the inspection control unit 254 in the control device 250 of the bump inspection apparatus 201 includes the inspection result information in the pass / fail determination unit 65 in addition to the components described in the above embodiment. A feedforward control unit 270 that outputs the feedforward control is further provided. Further, the control device in the component mounting apparatus 292 includes, as the component information, inspection result information associated with the component (identification) number of the IC component 1, that is, information on the positional deviation amount of the bump 3 formation position and the IC component 1 concerned. The number information of the bumps 3 formed on the component is input from the feedforward control unit 270, and the component information input unit 271 for holding (storing) the information, and the component stored in the component information input unit 271 A component information reference unit 272 that references necessary information from the information is provided. Further, the control device of the component mounting apparatus 292 uses the component information referred to and acquired by the component information reference unit 272 to calculate the correction amount based on the deviation amount of the bump 3 when the IC component 1 is mounted. A correction amount calculation unit 274 that performs processing, and a mounting correction amount setting unit 273 that sets the correction amount calculated by the correction amount calculation unit 274 as a mounting offset value when mounting the IC component 1 are further provided. ing.

  In the bump inspection apparatus 201 having such a configuration, first, bump inspection processing for each IC component 1 is performed in step S41 in the flowchart of FIG. The result information of these bump inspection processes is input from the pass / fail determination unit 65 to the feedforward control unit 270, output from the feedforward control unit 270, and input to the component information input unit 271 in the component mounting apparatus 292, and the component information (Step S42). Here, the component information is the amount of positional deviation at each bump 3 formation position associated with the component number of the IC component 1, that is, the amount of bump displacement (X, Y) and the number of bumps 3 formed (number of bumps). It is data of. Next, in the control device of the component mounting apparatus 292, one IC component 1 is selected from the component information for each IC component 1 held by the component information input unit 271 by the component information reference unit 272. With reference to the component information about the above, data on the amount of bump deviation and data on the number of bumps 3 formed are acquired (step S43).

  Next, in step S44, a correction method for correcting the displacement amount of the mounting position of the IC component 1 due to the displacement amount of the bump formation position is selected from the following two methods. The first correction method is a method of calculating a correction amount by averaging the individual bump deviation amounts in the respective bumps 3 of the IC component 1, and the second correction method is a method of calculating each bump of the IC component 1. 3 is a method based on an absolute deviation amount in which an intermediate value between the maximum deviation amount and the minimum deviation amount is calculated as a correction amount among the individual bump deviation amounts in 3. The selection of such a correction method is selected by an operator.

First, when the first correction method is selected in step S45, the component information acquired by the component information reference unit 272 is input to the correction amount calculation unit 274. The correction amount calculation unit 274 uses the data (X, Y) of the deviation amount of the formation position for each bump 3 in the component information and the number of bumps 3 formed in the IC component 1 to determine the bump deviation amount. An average value (X _ave , Y _ave ) is calculated (step S46), and the average value of the bump deviation amount is set as a correction amount (step S47).

On the other hand, when the second correction method (correction method based on the absolute deviation amount) is selected in step S48, the component information acquired by the component information reference unit 272 is input to the correction amount calculation unit 274. Then, the maximum value (X _max , Y _max ) of the amount of bump deviation is extracted from the input component information (step S49), and the minimum value (X _min , Y _min ) of the amount of bump deviation is extracted. (Step S50). Thereafter, in step S51, the correction amount calculation unit 274 calculates the bump intermediate shift amount (X _mid , Y _mid ) using the extracted maximum and minimum values of the bump shift amount (step S51). ) The bump intermediate deviation amount calculated in this way is set as a correction amount (step S52).

  In step S47 or S52, when the correction amount is set by the first correction method or the second correction method, the correction amount is input from the correction amount calculation unit 274 to the mounting correction amount setting unit 273. Thus, the mounting correction amount setting unit 273 sets the correction amount as a mounting offset value that is a correction amount of positional deviation in component mounting (S53).

  In the component mounting apparatus 292, the mounting operation of mounting the IC component 1 on the substrate is performed while the mounting position of the IC component 1 on the substrate is corrected using the mounting offset value set by the feedforward control. Is called. Therefore, it is possible to realize component mounting that reflects the amount of displacement of the bump 3 formation position in the IC component 1.

  In the first correction method, the bump displacement amount of each bump 3 formed on the IC component 1 is relatively small, or only a few bumps 3 are misaligned. This is a relatively effective correction method. On the other hand, the second correction method is an effective correction method when the width of the shift amount in each bump 3 is relatively large.

  As described above, various information regarding the formation state of the bump 3 obtained by the bump inspection apparatus 201 is fed back to the bump forming apparatus 291 located on the upstream side thereof, so that the bump information can be obtained based on the inspection result. Abnormalities in formation can be detected early. In particular, such IC parts 1 are often relatively expensive, and early detection of defective parts is effective in suppressing an increase in production costs.

  Further, when the inspection result is within the allowable range, but the value is determined to be close to the boundary of the allowable range, the bump forming apparatus 291 is provided with early feedback of the information, and the apparatus It is also effective to advise workers and the like in advance that the maintenance time is approaching.

  In addition, by feeding forward the above information to the component mounting apparatus 292, the IC component 1 can be mounted based on the information, and more accurate mounting can be performed.

  In each of the above embodiments, the case where the inspection of the formation state of each bump 3 is performed in the form in which the IC component 1 is housed in the component tray 5 has been described. It is not limited only. Instead of such a case, for example, when each IC component is supplied in a wafer state without using a component tray, and the bump formation state is inspected in such a state, the present invention is also used. The invention can be applied.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

It is a schematic block diagram which shows the structure of the bump inspection apparatus concerning the 1st Embodiment of this invention, and is the sectional view on the AA line in FIG. It is a schematic plan view of the bump inspection apparatus of the first embodiment. It is a model perspective view of the IC component handled in the said 1st Embodiment. It is a schematic explanatory drawing explaining the image imaging method using two types of illumination parts in the said 1st Embodiment, Comprising: The state which has acquired the image of the bump in the state where the top of the head was sharp using the coaxial illumination part FIG. It is a schematic explanatory drawing explaining the image imaging method using two types of illumination parts in the said 1st Embodiment, Comprising: It is a figure which shows the state which has acquired the image of the bump of the said state using a dome illumination part. . It is a schematic explanatory drawing explaining the image imaging method using two types of illumination parts in the said 1st Embodiment, Comprising: The image of the bump of the state which has a crushing plane in a top part using the coaxial illumination part is acquired. It is a figure which shows a state. It is a schematic explanatory drawing explaining the image imaging method using two types of illumination parts in the said 1st Embodiment, Comprising: It is a figure which shows the state which has acquired the image of the bump of the said state using a dome illumination part. . It is a control block diagram which shows the control structure in the bump test | inspection apparatus of the said 1st Embodiment. It is a flowchart which shows the procedure of the bump test | inspection method of the said 1st Embodiment. It is a schematic plan view which shows the accommodation state of each IC component to a component tray. FIG. 8B is a sectional view taken along line BB in the component tray of FIG. 8A. It is a schematic diagram which shows the whole image of the accommodation state of the IC component in a component accommodating part. FIG. 10 is a schematic diagram illustrating a state in which position recognition is performed on the entire image of the IC component in FIG. 9. FIG. 10 is a schematic diagram illustrating a state in which a bump inspection window is set for the entire image of the IC component of FIG. 9. In the bump inspection method of the first embodiment, it is a schematic explanatory view showing a bump formation position inspection method, and shows a state in which a template matches a part of the bump outline. In the bump inspection method of the first embodiment, it is a schematic explanatory view showing a bump formation position inspection method, and shows a state where a template is partially moved and changed. In the bump inspection method of the first embodiment, it is a schematic explanatory view showing a bump formation position inspection method, and shows a state in which a template is substantially matched with a bump outline. It is a model perspective view of the bump in the state where the top of the head was pointed. It is a figure which shows the 1st image for bump inspection which imaged the said bump using coaxial light. It is a figure which shows the 2nd image for bump inspection which imaged the said bump using the diffused light. It is a model perspective view of a bump in the state where a crush plane was formed in the top of a head. It is a figure which shows the 1st image for bump inspection which imaged the said bump using coaxial light. It is a figure which shows the 2nd image for bump inspection which imaged the said bump using the diffused light. It is a model perspective view of the bump in the state where the curved corner was formed in the top of the head. It is a figure which shows the 1st image for bump inspection which imaged the said bump using coaxial light. It is a figure which shows the 1st image for bump inspection which imaged the said bump using coaxial light. It is a figure which shows the 2nd image for bump inspection which imaged the said bump using the diffused light. It is a figure which shows the 2nd image for bump inspection which imaged the said bump using the diffused light. It is a figure which shows the inspection method of the bump formation position of the said 1st Embodiment, Comprising: It is a figure which shows the image for 2nd bump inspection. It is a figure which shows the test method of the bump formation position of the said 1st Embodiment, Comprising: It is a schematic diagram which shows the template used for the said test | inspection. It is a figure which shows the test method of the bump formation position of the said 1st Embodiment, Comprising: It is a figure which shows the state with which the part of the outline of the bump on the image and the template were matched. It is a figure which shows the test | inspection method of the formation position of the bump of the said 1st Embodiment, Comprising: It is a figure which shows the state by which the template was deform | transformed and was substantially matched with the outline. It is a figure which shows the inspection method of the crushing degree of the bump of the said 1st Embodiment, Comprising: It is a figure which shows the state in which the formation position of the bump was detected in the 1st image for bump inspection. It is a figure which shows the inspection method of the crushing degree of the bump of the said 1st Embodiment, Comprising: It is a figure which shows the state by which the area of the crushing plane is calculated in the said image. It is a figure which shows the inspection method of the presence or absence of the abnormal shape of the bump of the said 1st Embodiment, Comprising: It is a figure which shows the state by which the outline of the bump was detected. It is a figure which shows the inspection method of the presence or absence of the abnormal shape of the bump of the said 1st Embodiment, Comprising: It is a figure which shows the state by which the cyclic | annular test | inspection area | region was set around the said outline and the abnormal shape was detected. It is a schematic diagram of bumps showing inspection conditions in the bump inspection method of the first embodiment. It is a schematic diagram of bumps showing inspection conditions in the bump inspection method of the first embodiment. It is a schematic block diagram which shows the structure of the IC component mounting board manufacturing apparatus which has a bump test | inspection apparatus concerning the 2nd Embodiment of this invention. It is a control block diagram which shows the structure for performing feedback control in the bump test | inspection apparatus of the said 2nd Embodiment. It is a flowchart which shows the procedure of the said feedback control. It is a control block diagram which shows the structure for performing feedforward control in the bump test | inspection apparatus of the said 2nd Embodiment. It is a flowchart which shows the procedure of the said feedforward control.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC component 3 Bump 3a Head top part 3b Crush plane 3c Curved corner part 5 Component tray 5a Component accommodating part 10 Tray holding | maintenance apparatus 11 Lower side support member 12 Upper side support member 13 Support member raising / lowering apparatus 16 Tray conveyance apparatus 20 Imaging apparatus 22 Camera Unit 24 Illumination device 25 Coaxial illumination unit 26 Dome illumination unit 28 Imaging movement device 50, 250 Control device 54 Inspection control unit 61 Image storage unit 62 Component position recognition unit 63 Bump inspection region setting unit 64 Bump inspection unit 65 Pass / fail judgment unit 70 Bump Search template 71 Contour 72 Matching line portion 73 Line portion movement change bar 101, 201 Bump inspection device 290 IC component mounting board manufacturing device 291 Bump forming device 292 Component mounting device G1 First overall image G2 Second overall image G3 First bump inspection image G4 Second bump inspection image Image S Bump formation surface T Optical axis W1 Coaxial light W2 Diffused light

Claims (19)

A housing member holding device that holds a component housing member that houses a plurality of IC components in which a plurality of bumps are formed, with the respective bump forming surfaces being aligned and disposed;
An imaging device that captures images of the respective IC components housed in the component housing member held by the housing member holding device;
A control device that controls the inspection operation of each of the bumps by using the imaging operation by the imaging device, the holding operation by the container holding device, and the captured image;
The imaging apparatus is
An imaging camera unit that individually captures an entire image on the bump forming surface of the IC component along an optical axis arranged in a direction substantially orthogonal to a direction along the surface of the bump forming surface.
An imaging optical axis positioning unit that aligns the optical axis of the imaging camera unit with a substantially center position on the bump forming surface of the IC component to be imaged;
The control device
A component position recognizing unit for recognizing the position of the IC component based on the whole image captured by the imaging camera unit with respect to the IC component subjected to the alignment by the imaging optical axis positioning unit; ,
Based on the formation position of each bump in the IC component, the inspection area of each bump whose arrangement is set in advance is positioned on the entire image based on the recognition result by the component position recognition unit. A bump inspection area setting unit for obtaining a bump inspection image for each of the bumps from the entire image,
An inspection processing unit that performs an inspection process of the formation position of each of the bumps based on each of the bump inspection images and an inspection process of a crushing degree of the top of each of the bumps. IC component bump inspection equipment. The imaging device includes a unidirectional light irradiating unit that irradiates light in a substantially unidirectional direction along the optical axis with respect to the bump forming surface of the IC component, and the bump disposed on the bump forming surface. A lighting device having a plurality of directions from the periphery of the optical axis toward the optical axis and an inclined direction light irradiating unit that irradiates light from each direction inclined with respect to the bump forming surface. In addition,
The control device is configured so that the unidirectional light irradiating unit causes the unidirectional light irradiation unit to perform the unidirectional light irradiation with respect to the bump formation surface of the IC component in a state in which the imaging optical axis positioning unit is aligned with the optical axis. The first entire image of the IC component imaged by the imaging camera unit while irradiating light and the imaging camera unit while irradiating light in the tilt direction by the tilt direction light irradiation unit. The second whole image of the IC component is further provided with an image storage unit that is input and stored so that it can be taken out.
The component position recognition unit extracts the first whole image or the second whole image stored in the image storage unit, and recognizes the position of the IC component based on the extracted image. And
The bump inspection area setting unit takes out the first whole image and the second whole image from the image storage unit, and performs the first bump inspection for each bump from the first whole image. Obtaining an image, and obtaining a second bump inspection image for each of the bumps from the second overall image,
The inspection processing unit performs an inspection process of the formation positions of the bumps based on the images of the first bump inspection image or the second bump inspection image, and the first bump inspection image. The IC component bump inspection apparatus according to claim 1, wherein an inspection process of the crushing degree of the top of each of the bumps is performed based on the bump inspection image.   The IC component bump inspection apparatus according to claim 2, wherein the inspection processing unit performs an inspection process of the formation position of each of the bumps based on each of the second bump inspection images. . The housing member holding device is
A pair of support members for supporting lower portions of opposite end portions of the component housing member;
While pressing the respective end portions of the component housing members in a state supported by the respective support members from above, correcting the warp or deflection of the component housing members and maintaining a substantially horizontal posture, the above A pair of pressing and holding members for holding the supporting posture;
4. A press holding member moving device that integrally moves the respective press holding members forward and backward between a holding position for holding the supporting posture and a holding release position for releasing the holding. A bump inspection apparatus for an IC component according to any one of the above.   The said imaging camera part is a bump test | inspection apparatus of IC components as described in any one of Claim 1 to 4 provided with a telecentric lens as an optical lens.   The IC component bump inspection apparatus according to any one of claims 1 to 5, wherein the component housing member is a component housing tray in which the plurality of IC components can be individually disposed and housed. The inspection processing unit detects the outline of the bump in the first bump inspection image or the second bump inspection image in the inspection process of each bump formation position, and By obtaining the center position, the center position can be detected as the formation position of the bump,
A substantially circular matching line part for matching with the contour of the bump, and a position that divides the matching line part into at least approximately four equal parts in the normal direction of the matching line part, and in the arrangement position and its vicinity A step function edge detection template comprising a plurality of line part movement change bars that individually change partial curvatures in the matching line part by individually moving and changing the matching line part in the normal direction. Prepared,
In each of the images of the bumps, at least one or more of the line portions is disposed while fixing a portion of the matching line portion to match a portion of the bump outline and fixing the matched position. Using the movement change bar, the matching line part is partially moved and changed in the normal direction so that the matching line part substantially matches the arc part other than the part in the contour, and the bump 4. The bump inspection apparatus for an IC component according to claim 2, wherein the template is matched with a contour of the template, and the center position of the matched template is calculated.   The inspection processing unit is irradiated from the unidirectional light irradiation unit within the bump outline in the first bump inspection image in the crushing degree inspection process of the top of each bump. By calculating the area of the image region formed by the reflected light of the light, the calculated area is recognized as the area of the crushing plane at the top of the head, and it is determined whether the area is within the reference area value. The bump inspection apparatus for an IC component according to claim 2 or 3, wherein the crushing degree of the top of the head is inspected.   The inspection processing unit has a substantially annular inspection area disposed adjacent to the outer periphery of the outline of each bump, and determines whether or not an image of a part of the bump exists in the inspection area. The bump inspection apparatus for an IC component according to any one of claims 1 to 8, wherein the bump is inspected for an abnormal shape. Each of the bumps has a generally conical shape, or a generally conical shape in which a crushing plane is formed on the top of the head,
The light in the unidirectional direction irradiated from the unidirectional light irradiating unit is light for irradiating the top of the head of each of the bumps,
4. The bump for an IC component according to claim 2, wherein the light in the tilt direction irradiated from the light irradiation section in the tilt direction is light for peripheral surface irradiation irradiated to the peripheral surface of each bump. Inspection device. Obtain the entire image of the bump formation surface of the IC component on which multiple bumps are formed,
Based on the acquired entire image, the position of the IC component is recognized,
Based on the recognition result, the inspection area of each bump is positioned and set on the entire image, and an image for bump inspection is obtained for each bump from the entire image.
A bump inspection method for an IC component, characterized in that, based on each of the bump inspection images, the formation position of each bump is inspected and the crushing degree of the top of each bump is inspected. The whole image of the IC component is acquired by irradiating the bump forming surface with light in a single direction along a direction substantially orthogonal to the bump forming surface of the IC component. In addition to acquiring the entire image of 1, the plurality of directions from the periphery toward the substantially center of the bump forming surface with respect to the bump forming surface and inclined with respect to the bump forming surface It is performed by irradiating light from each direction and acquiring the second whole image of the IC component,
Recognition of the position of the IC component is performed based on the acquired first whole image or second whole image,
The acquisition of the respective bump inspection images is obtained by acquiring the first bump inspection image from the first overall image and obtaining the second bump inspection from the second overall image for each of the bumps. Is done by acquiring images for
Based on the first bump inspection image or the second bump inspection image, the formation position of each bump is inspected, and on the basis of the first bump inspection image, The method for inspecting a bump of an IC component according to claim 11, wherein the degree of collapse of the top of each bump is inspected.   The IC component bump inspection method according to claim 12, wherein the inspection of the formation positions of the respective bumps is performed based on the respective second bump inspection images. The IC component is one component selected from a plurality of the IC components accommodated in the component accommodation tray with each bump forming surface as an upper surface,
14. The IC component bump inspection method according to claim 11, wherein the entire image is acquired for each of the IC components accommodated and arranged in the component accommodation tray. The inspection of each bump formation position is performed by detecting the outline of the bump and determining the center position of the outline, thereby detecting the center position as the formation position of the bump.
The detection of the contour of the bump is arranged in a normal direction of the matching line portion at a position that divides the matching line portion into at least approximately four equal parts and a substantially circular matching line portion for matching with the bump contour. A plurality of line part movement change bars for individually changing partial curvatures in the matching line part by individually moving and changing the matching line part in the arrangement position and the vicinity thereof in the normal direction. Using the template for step function edge detection provided,
In the first bump inspection image or the second bump inspection image, a part of the matching line portion is arranged so as to match a part of the contour of the bump,
While fixing the matched position, using at least one or more of the line part movement change bars, the matching line part is partially moved and changed in the normal direction,
14. The IC component bump inspection according to claim 12, wherein, as a result, the matching line portion is substantially matched with an arc portion other than the part of the contour, and the template is matched with the bump contour. Method. The inspection of the crushing degree of the top of each bump is as follows.
In the first image for bump inspection, the area of the image area formed by the reflected light of the light in the single direction is calculated within the outline of the bump,
Determine the calculated area as the area of the crush plane of the top of the head, whether the area is within the reference area value,
The IC component bump inspection method according to claim 12, which is performed by detecting an abnormality in the degree of crushing when the reference area value is exceeded. In the first bump inspection image or the second bump inspection image for each of the bumps,
A substantially annular inspection area is arranged adjacent to the outer periphery of the bump outline,
In the inspection area, determine whether there is a partial image of the bump,
14. The bump inspection method for an IC component according to claim 12, wherein when it is determined that the image exists, the bump is determined to have an abnormal shape. A test result of each of the bumps in the IC component according to the bump test method for an IC component according to any one of claims 11 to 17 is fed back to a step of forming each of the bumps on each of the IC components,
A bump forming method for an IC component, wherein, in the bump forming step, each of the bumps is formed on each of the IC components while reflecting the inspection result. An inspection result of each of the bumps in the IC component by the IC component bump inspection method according to any one of claims 11 to 17 is fed forward to a component mounting step for mounting the IC component on a substrate. ,
In the component mounting step, each IC component subjected to the inspection is mounted on the substrate while reflecting the inspection result.