KR100969531B1 - Head part of led die bonder - Google Patents

Abstract

PURPOSE: A head part device of an LED die bonder is provided to maintain a stable process flow by using a one body shaped casting base in order to have the durability against vibrations and deformation. CONSTITUTION: A head part comprises an epoxy device for dotting the epoxy in the pad of a lead frame which is transferred with a feeding device. The head part comprises a chip bonding device which attaches a chip to the pad of a lead frame where an epoxy dotting work is completed from the epoxy device by separating a chip from a wafer sheet. A base(500) supports the epoxy device, a chip bonding device, and a camera part. The camera part is composed of an epoxy camera(410) which detects a lead frame before the epoxy dotting and the chip attachment, a mount camera(420), and a wafer camera(430) which recognizes the chip of the wafer sheet.

Description

HEAD PART OF LED DIE BONDER}

The present invention, in the LED die bonder, the gantry head combined with two axes (Y (front, rear), Z (up, down)) to ensure durability against vibration or deformation of the components forming the head unit device A head unit of a LED die bonder of a drive system.

A die bonder is a facility for bonding a chip (or die) onto a pad of a lead frame, which is a skeleton of a semiconductor chip package. An adhesive (epoxy) is applied to each separated chip after a sawing process. After bonding to the lead frame pad, it is a facility to enable the thermal bonding by wire bonding.

First, when looking at the mechanical combination form of the epoxy head and the bonding head used in the conventional die bonder, assembling the Y (front, rear), Z (up, down) axis in one base, and X ( The most common form of the left and right) shaft is assembled, and the driving of each shaft converts the rotational motion of the servo motor into the linear motion of the ball screw. The two components are connected by coupling, and linear motion (LM) guides are assembled parallel to the left and right around the driving source. When using the driving method by such a mechanical combination there are the following problems.

① Add a transfer device in the X direction to reduce the bonding position error in the X direction of the lead frame supplied. This causes vibrations during Y and Z axis head device transfer.

② In addition, the number of machined products is increased as well as driving devices such as servo motors, ball screws, supports, couplings, and LM guides.

③ If the X-axis driving device is included at the bottom of the Y- and Z-axis bases, the Z-axis position is increased and the required stroke is longer, resulting in longer cycle time and lower productivity.

④ The fixing of the head unit is somewhat stable using the casting base, but the loading device for supplying the lead frame, the feeding device for feeding the lead frame, etc. are not integrated, but the brackets are mounted from the base to prevent vibration or deformation. Insufficient durability is secured, resulting in poor workability or poor bonding.

⑤ Friction resistance is increased by installing two rows of LM guides around the drive shaft, which increases the load on the motor, ball screw, and LM guide end plate, which shortens the service life.

(6) Since there is no stroke adjusting device in the width direction, not only the width of the lead frame can be varied, but also the MCP type lead frame cannot be supported.

Various problems as described above are a factor in reducing productivity in performing the LED die bonding or inferior chip bonding. In addition, it is disadvantageous in terms of economics such as manufacturing cost and maintenance cost according to the increase in the number of parts constituting the head unit.

The main object of the present invention is not only to construct epoxy devices, camera devices, and bonding head devices suitable for LED die bonders that can be applied to leadframes having various widths, but also to MCP type leadframes, as well as vibrations generated from external factors. By providing a casting base having a durability against deformation and a gantry head structure head unit combined in two axes (Y, Z),

In performing LED die bonding, it has stable workability and reliability without vibration or deformation, and can be used for lead frames having various widths and lead frames of MCP type.

An object of the present invention as described above is possible to adjust the width corresponding to the size of the lead frame supplied in the LED die bonder including a feeding device for transferring the lead frame, the epoxy of the pad of the lead frame and chip In the head unit to be attached,

A head comprising an epoxy device for doping epoxy to a pad of a lead frame transferred by the feeding device, and a chip bonding device for separating chips from a wafer sheet and attaching chips to the pads of a lead frame where epoxy doping is completed from the epoxy device. Wealth;

A camera unit including an epoxy camera and a mount camera for sensing a lead frame before the epoxy doping and before the chip is attached, and a wafer camera for recognizing the chip of the wafer sheet; And

And a base for supporting the epoxy device, the chip bonding device, and the camera unit.

The head portion may be achieved by the head portion device of the LED die bonder, characterized in that the stroke corresponding to the variable width of the feeding device to secure a stroke corresponding to the variable width of the feeding device.

According to the head unit of the LED die bonder according to the present invention, as the position of the Z-axis is lowered while the X-axis driving device is removed, the cycle time is shortened due to the shortening of the required stroke, thereby improving productivity.

In addition, since the casting base having an integral structure capable of accommodating the head unit having the greatest influence on the degree of chip bonding is used, it is possible to secure durability against vibration or deformation caused by external factors and thus maintain a more stable process flow.

The basic configuration of each axis (Y, Z) is a structure that connects a wide LM rail and a row of guides in which a block is assembled to a drive source assembled with a servo motor, coupling, ball screw, support, etc. Minimizing the resistance extends the life of the components.

Epoxy device and chip bonding device can secure as many strokes as necessary in Y direction, and ball screw drive device is also applied to epoxy and mount cameras to secure as many strokes as necessary to cope with various LED lead frame width changes. have.

In order to configure the head unit of the LED die bonder which has the greatest effect among the processes of bonding the chip on the pad of the lead frame, the present invention provides a casting base and a two-axis ( The present invention includes the provision of an epoxy device and a chip bonding device having a gantry structure combined in Y (forward and backward directions) and Z (up and down directions).

More specifically, the head unit of the LED die bonder is adjustable in width corresponding to the size of the lead frame supplied, and in the LED die bonder including a feeding device for feeding the lead frame, the epoxy of the pad of the lead frame In the head unit for dotting and attaching chips,

A head comprising an epoxy device for doping epoxy to a pad of a lead frame transferred by the feeding device, and a chip bonding device for separating chips from a wafer sheet and attaching chips to the pads of a lead frame where epoxy doping is completed from the epoxy device. Wealth;

A camera unit including an epoxy camera and a mount camera for sensing a lead frame before the epoxy doping and before the chip is attached, and a wafer camera for recognizing the chip of the wafer sheet; And

And a base for supporting the epoxy device, the chip bonding device, and the camera unit.

The head part may secure a stroke corresponding to a variable width of the feeding device so as to correspond to the variable width of the feeding device.

The chip bonding apparatus may include a first guard mounted on an upper portion of the base such that one side thereof protrudes toward the front of the base;

A first servomotor mounted to the rear of the first guard, a first ball screw rotated by the first servomotor, and a horizontally moved forward and backward by the first servomotor and the first ball screw A moving member, a horizontal moving bracket coupled to and interlocked with the horizontal moving member, a first horizontal LM guide mounted inside the first guard in parallel with the first ball screw, and a guiding direction of the first horizontal LM guide A Y-axis feeder configured to be transported along the first horizontal movable block coupled with the horizontal movable bracket to prevent shaking of the horizontal movable bracket;

A second servo motor mounted on an upper part of the first guard, a second ball screw rotated by the second servo motor, and a vertical conveyance in the vertical direction by the second servo motor and the second ball screw. A moving member, a vertical moving bracket coupled to and interlocked with the vertical moving member, a first vertical LM guide mounted inside the first guard in parallel with the second ball screw, and a guiding direction of the first vertical LM guide A Z-axis feeder configured to be transported along the first vertical movable block coupled with the vertical movable bracket to prevent shaking of the vertical movable bracket;

A second vertical LM guide mounted on a side of the horizontal movable bracket, a second vertical movable block vertically moved along the guide direction of the second vertical LM guide, and the second vertical LM guide mounted on the movable block and interlocked with each other; A first connecting portion comprising one connecting link;

A second horizontal LM guide mounted on a side of the vertical movement bracket, a second horizontal movable block horizontally moved along a guide direction of the second horizontal LM guide, and mounted on the second horizontal movable block and interlocked with each other; A second connecting portion configured of a second connecting link coupled to the first connecting link; And

And a chip tool bundle mounted to interlock with the second connection link and picking chips from the wafer sheet and attaching the chips to the pads of the lead frame.

The epoxy device has a configuration that is symmetrical with the first guard, Y-axis feeder, Z-axis feeder, the first connecting portion, the second connecting portion, the configuration is symmetrical with the second connecting link epoxy lead frame Epoxy tool bundles dotting to the pad is characterized in that the mounting.

On the other hand, the wafer camera of the camera unit is fixed to the camera base mounted on the upper portion of the base between the chip bonding device and the epoxy device and a fixed block supported on the third and fourth fixing brackets installed in front of the first guard,

The epoxy camera and the mount camera is preferably configured to be moved to correspond to the variable width of the feeding device.

Hereinafter, with reference to the accompanying drawings showing a preferred embodiment of the present invention will be described in detail.

The head unit according to the present invention is part of the configuration of the LED die bonder. Here, among the configuration of the LED die bonder is a feeding device for transferring the lead frame with three clamps, one clamp transfers the lead frame supplied by the pickup device to the epoxy device, the other clamp is the epoxy device lead frame Each clamp is transferred in the unit of pitch in the epoxy area so that the epoxy can be doped. Another clamp is configured to transfer the unit in the unit of pitch in the chip bonding area to bond the chip to each pad of the lead frame. .

On the other hand, such a feeding device is possible to adjust the width in accordance with the size of the lead frame to be supplied, it is required to adjust the stroke of the epoxy device and the chip bonding device according to the present invention, and at the same time requires the position adjustment of the epoxy camera and the mount camera .

The head part, the camera part, and the base 500 according to the present invention satisfy the above requirements.

The head portion is an epoxy device for doping epoxy to the pad of the lead frame conveyed by the feeding device, and a chip bonding device for separating the chip from the wafer sheet and attaching the chip to the pad of the lead frame completed epoxy doping operation from the epoxy device And the epoxy device is symmetrical with the chip bonding device except for the configuration of the epoxy tool bundle 310 which dots the epoxy to the pad of the leadframe, and thus will be described in detail only with respect to the chip bonding device.

The chip bonding apparatus includes a first guard 190, a Y-axis feeder, a Z-axis feeder, a first connection part, a second connection part, and a chip tool bundle 320.

As illustrated in FIG. 2, the chip bonding apparatus may perform a reciprocating motion in the Y direction (front and rear directions) and a reciprocating motion in the Z direction (up and down directions). In addition, various types of exercises can be set by connecting these exercises. To this end, the first guard 190 is mounted on the upper portion of the base 500 such that one side thereof protrudes toward the front of the base 500 as shown in FIG. 1.

The Y-axis feeder includes a first servomotor 101 mounted to the rear of the first guard 190, a first ball screw 104 rotated by the first servomotor 101, and the first servo motor 101. A horizontal moving member 105 which is transported in the front and rear directions by the servo motor 101 and the first ball screw 104, a horizontal moving bracket 131 which is coupled to and interlocked with the horizontal moving member 105, A first horizontal LM guide 121 mounted inside the first guard 190 in parallel with the first ball screw 104, and moved along a guide direction of the first horizontal LM guide 121 and being horizontal It is composed of a first horizontal movable block 132 coupled with the horizontal movable bracket 131 to prevent the shaking of the movable bracket 131.

Here, the length of the first ball screw 104 is configured to correspond to or longer than the variable width range of the feeding device so as to correspond to the variable width of the feeding device.

The Z-axis feeder includes a second servomotor 151 mounted on the first guard 190, a second ball screw 154 rotated by the second servomotor 151, and the second servomotor 151. A vertical moving member 155 which is transported in the up and down directions by the servo motor 151 and the second ball screw 154, a vertical moving bracket 137 which is coupled to and interlocked with the vertical moving member 155, The first vertical LM guide 124 mounted inside the first guard 190 in parallel with the second ball screw 154, and is transferred along the guide direction of the first vertical LM guide 124 and the number The first vertical movement block 138 is coupled to the vertical movement bracket 137 to prevent the movement of the linear movement bracket 137.

The first connection part includes a second vertical LM guide 122 mounted on a side of the horizontal moving bracket 131 and a second vertical moving block 134 vertically moving along the guide direction of the second vertical LM guide 122. ) And a first connection link 133 mounted and interlocked with the second vertical movable block 134.

The second connection part includes a second horizontal LM guide 123 mounted on the side of the vertical movement bracket 137 and a second horizontal movement block 136 horizontally moving along the guide direction of the second horizontal LM guide 123. ) And a second connection link 135 mounted on the second horizontal movable block 136 and interlocked with the first connection link 133.

The chip tool bundle 320 is mounted to interlock with the second connection link 135 to pick up chips from the wafer sheet and attach the chips to the pads of the lead frame.

On the other hand, the base 500 is configured to support the epoxy device, the chip bonding device, and the camera unit, so as to secure durability against vibration or deformation caused by external factors, reinforcing ribs are provided at the portion to which the force is applied. In addition, a round is formed in the corner portion to prevent deformation such as cracks due to stress concentration.

The camera unit includes an epoxy camera 410 and a mount camera 420 for sensing a lead frame before epoxy doping and before chip attachment, and a wafer camera 430 for recognizing a chip of the wafer sheet.

The wafer camera 430 is mounted on the camera base 427 mounted on the base 500 between the chip bonding device and the epoxy device, and on the third and fourth fixing brackets 471 and 472 provided in front of the first guard 190. The fixed block 470 is supported and fixed.

That is, the wafer camera 430 is always configured to keep the same position (position on the same axis perpendicular to the ejector pin as one of the components of the LED die bonder) without shaking, thereby fixing the third and fourth fixing brackets 471 and 472. Block 470 is used.

The epoxy camera 410 and the mount camera 420 are configured to be moved to correspond to the variable width of the feeding device.

Specifically, the position shifting configuration of the epoxy camera 410 and the mount camera 420, the camera base 427 provided between the epoxy device and the chip bonding device mounted on both sides of the base 500, and the camera base ( Camera movement LM guides (412 and 422) installed on both sides of the 427, and the connecting support is installed on the upper portion of the camera base (427) and forward and backward in the front and rear guide direction of the camera movement LM guides (412,422) ( 450, a driving unit for driving the connection supporter 450 to reciprocate forward and backward, first and second manual stages 413 and 423 mounted on both sides of the upper part of the connection supporter 450, and the first 2, an epoxy camera support 411 and a mount camera support 421 installed on the manual stages 413 and 423 and transferred in the X direction (left and right directions) by the first and second manual stages 413 and 423. It is configured by.

Therefore, when the epoxy camera 410 and the mount camera 420 are installed on the epoxy camera support 411 and the mount camera support 421, the manual stage moves in the X direction and the drive unit moves in the Y direction. The camera base 427 and the camera guide LM guides 412 and 422 are in charge.

Meanwhile, the chip bonding apparatus may include a first sensor 181, a second sensor 182, and a Z-axis movement detector as illustrated in FIGS. 2 to 5 to improve response in reciprocating motion in the Z-axis direction. 183 may be provided.

The Z-axis movement detecting unit 183 is mounted on the upper portion of the vertical movement bracket 137 and interlocked, and the first sensor 181 and the second sensor 182 are moved paths of the Z-axis movement detecting unit 183. After spaced at a predetermined interval on the phase, the response state of the second servomotor 151 may be improved by sensing the movement state of the Z-axis movement detecting unit 183.

The same method can be applied to a Y-axis feeder, and the configuration corresponding to the Z-axis movement detector 183 is a Y-axis movement detector 184 mounted and interlocked with the horizontal movement bracket 131.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications, and variations will readily occur to those skilled in the art without departing from the spirit and scope of the invention. Therefore, the disclosed embodiments should be considered in descriptive sense only and not for purposes of limitation, and the true scope of the present invention is shown in the claims rather than the foregoing description, and all differences within the equivalent scope are included in the present invention. Should be interpreted as.

1 is a view showing the overall appearance of the head unit of the LED die bonder according to the present invention,

2 to 8 are views showing in detail the operation relations and the main parts of the main parts of FIG.

<Description of Symbols for Main Parts of Drawings>

101: first servomotor 104: first ball screw

105: horizontal moving member 121: first horizontal LM guide

122: second vertical LM guide 123: second horizontal LM guide

124: first vertical LM guide 131: horizontal movement bracket

132: first horizontal movable block 133: first connection link

134: second vertical movement block 135: second connection link

136: second horizontal movement block 137: vertical movement bracket

138: first vertical movement block 151: second servomotor

154: second ball screw 155: vertical moving member

310: Epoxy tool bundle 320: Chip tool bundle

410: epoxy camera 420: mount camera

427: camera base 430: wafer camera

470: fixed block 471: third fixing bracket

472: fourth fixing bracket 500: base

Claims (3)

In the LED die bonder which can be adjusted in width corresponding to the size of the lead frame supplied and includes a feeding device for transporting the lead frame, the head unit for doping epoxy and attaching chips to the pad of the lead frame, A head comprising an epoxy device for doping epoxy to a pad of a lead frame transferred by the feeding device, and a chip bonding device for separating chips from a wafer sheet and attaching chips to the pads of a lead frame where epoxy doping is completed from the epoxy device. Wealth; A camera unit including an epoxy camera 410 and a mount camera 420 for sensing the lead frame before the epoxy doping and the chip attachment, and a wafer camera 430 for recognizing the chip of the wafer sheet; And And a base 500 supporting the epoxy device, the chip bonding device, and the camera unit. And the head portion secures a stroke corresponding to the variable width of the feeding device so as to correspond to the variable width of the feeding device. The method of claim 1, The chip bonding apparatus includes a first guard 190 mounted on an upper portion of the base 500 so that one side thereof protrudes toward the front of the base 500; The first servo motor 101 mounted behind the first guard 190, the first ball screw 104 rotated by the first servo motor 101, and the first servo motor 101. And a horizontal moving member 105 which is transferred in the front and rear directions by the first ball screw 104, a horizontal moving bracket 131 which is coupled to and interlocked with the horizontal moving member 105, and the first ball screw. The first horizontal LM guide 121 and the first horizontal LM guide 121 mounted in parallel with the (104), and is moved along the guide direction of the first horizontal LM guide 121 and the horizontal movement bracket 131 A Y-axis feeder composed of a first horizontal movement block 132 coupled with a horizontal movement bracket 131 to prevent shaking of the vehicle; The second servo motor 151 mounted on the first guard 190, the second ball screw 154 rotated by the second servo motor 151, and the second servo motor 151. And a vertical moving member 155 which is transferred in an up and down direction by the second ball screw 154, a vertical moving bracket 137 coupled to and interlocked with the vertical moving member 155, and the second ball screw. The first vertical LM guide 124 mounted inside the first guard 190 and parallel to the 154, and is transferred along the guide direction of the first vertical LM guide 124 and the vertical movement bracket 137 A Z-axis feeder composed of a first vertical movement block 138 coupled with a vertical movement bracket 137 to prevent shaking of the vehicle; A second vertical LM guide 122 mounted on a side of the horizontal moving bracket 131, a second vertical moving block 134 vertically moving along a guide direction of the second vertical LM guide 122, and A first connection part including a first connection link 133 mounted and interlocked with the second vertical movement block 134; A second horizontal LM guide 123 mounted on a side of the vertical movement bracket 137, a second horizontal movement block 136 horizontally moving along a guide direction of the second horizontal LM guide 123, and A second connection part mounted on the second horizontal moving block 136 and interlocked with the second connection link 135 coupled to the first connection link 133; And And a chip tool bundle 320 mounted to interlock with the second connection link 135 to pick up chips from the wafer sheet and attach them to the pads of the lead frame. The epoxy device is configured to be symmetrical with the first guard 190, the Y-axis feeder, the Z-axis feeder, the first connection part, the second connection part, and is symmetrical with the second connection link 135. The configuration of the head unit of the LED die bonder, characterized in that the epoxy tool bundle 310 for doping epoxy to the pad of the lead frame. 3. The method of claim 2, The wafer camera 430 of the camera unit includes a camera base 427 mounted on an upper portion of the base 500 between the chip bonding device and the epoxy device, and third and fourth fixing brackets installed in front of the first guard 190. Mounted on and fixed to the fixed block 470 supported by 471 and 472, The epoxy camera (410) and the mount camera (420) is the head unit of the LED die bonder, characterized in that configured to be moved to correspond to the variable width of the feeding device.

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