CN220272465U

CN220272465U - Frame conveying clamp for semiconductor packaging

Info

Publication number: CN220272465U
Application number: CN202321813349.8U
Authority: CN
Inventors: 施锦源; 张大强; 黄明敏
Original assignee: Shenzhen Xinzhantong Electronics Co ltd
Current assignee: Shenzhen Xinzhantong Electronics Co ltd
Priority date: 2023-07-11
Filing date: 2023-07-11
Publication date: 2023-12-29
Anticipated expiration: 2033-07-11

Abstract

The utility model relates to the technical field of semiconductor packaging, and discloses a frame conveying clamp for semiconductor packaging, which comprises two conveying rails, wherein the surfaces of the conveying rails are connected with a frame body in a bonding way, and clamping assemblies are arranged at the upper end and the lower end of the frame body; the clamping assembly comprises two movable frames, threaded rods are connected to the middle ends of the movable frames in a threaded mode, two double-shaft motors are fixedly connected to the middle portions of the threaded rods, sliding plates are arranged between the double-shaft motors and the transmission rails, connecting plates are fixedly connected to the surfaces of the upper end and the lower end of each movable frame, electric telescopic rods are fixedly installed on the opposite sides of the connecting plates, and movable plates are fixedly connected to the telescopic ends of the electric telescopic rods. The frame conveying clamp for semiconductor packaging drives the movable plate to move to the upper side and the lower side of the frame body through the telescopic end of the electric telescopic rod, and a plurality of positioning blocks arranged through the fixed blocks are attached to the surface of the frame body to play a role in positioning and clamping.

Description

Frame conveying clamp for semiconductor packaging

Technical Field

The utility model relates to the technical field of semiconductor packaging, in particular to a frame conveying clamp for semiconductor packaging.

Background

Semiconductor packaging refers to the process of processing a wafer that passes testing to obtain individual chips according to product model and functional requirements. The packaging process is as follows: the wafer from the wafer front process is cut into small chips through the dicing process, then the cut chips are attached to the small islands of the corresponding substrate (lead frame) frame by using glue, and then the bonding pads of the chips are connected to the corresponding pins of the substrate by using superfine metal (gold, tin, copper or aluminum, etc.) wires or conductive resin to form a required circuit; and then packaging and protecting the independent wafers by using a plastic shell, performing a series of operations after plastic packaging, performing finished product testing after packaging, generally performing procedures such as inspection, testing and packaging, and finally warehousing and delivering.

Chinese patent CN216145598U discloses a frame conveying fixture for semiconductor encapsulation, including the transmission track with establish at the inside welding frame of transmission track, welding frame is last, the equal symmetry of below is equipped with a plurality of new clamping jaw, new clamping jaw lateral wall all is connected with the drive block through the connecting plate, and be located through threaded rod fixed connection between the adjacent drive block of homonymy, all be equipped with first mounting hole on the new clamping jaw, new clamping jaw lower part equal interval that is located welding frame top is equipped with a plurality of spout, the inside equal sliding connection of spout has the reference column, the reference column upper end is all connected with the spout interior top surface through first compression spring, realize carrying out buffer protection to it when pressing from both sides getting the frame, avoid the frame to take place to warp, and fix a position the frame, avoid the frame to take place the off normal.

In the process of realizing the application, the inventor finds that at least the following problems exist in the technology, the frame conveying clamp for semiconductor packaging is fixed on one side of a conveying track through a connecting rod, but the frame types adopted facing different packages are different, so that the new clamping jaw position can not be changed and adjusted, and the frames of different types can not be positioned and clamped effectively, and therefore the frame conveying clamp for semiconductor packaging is provided to solve the problems.

Disclosure of Invention

The utility model provides a frame conveying clamp for semiconductor packaging, which has the advantages of clamping and fixing according to different frame types, and solves the problems that the frame types adopted by different packaging can not be changed and adjusted to new clamping jaw positions so as not to effectively position and clamp frames of different sizes due to the fact that the frame types are fixed on one side of a conveying track through connecting rods.

In summary, the present utility model provides the following technical solutions: the utility model provides a frame conveying fixture for semiconductor encapsulation, includes two transmission rails, transmission rail surface laminating is connected with the frame body, both ends all are provided with clamping assembly about the frame body.

The clamping assembly comprises a sliding plate and two movable frames, wherein threaded rods are connected to the middle ends of the movable frames in a threaded mode, the threaded rods are rotationally connected to the sliding plate, two double-shaft motors are fixedly connected to the middle portions of the threaded rods, the double-shaft motors are fixedly connected with the sliding plate, the movable frames are slidably connected to the sliding plate, connecting plates are fixedly connected to the surfaces of the upper ends and the lower ends of the movable frames, two electric telescopic rods are fixedly installed on the opposite sides of the connecting plates, the telescopic ends of the electric telescopic rods are fixedly connected with the movable plates, fixed blocks are fixedly connected to the surfaces of the movable plates, which are far away from the telescopic ends of the electric telescopic rods, five positioning blocks are arranged on the surfaces of the fixed blocks, and two sliding rods are connected to the movable plates, which are close to one side of the movable frames, inside of the movable plates.

Further, the left end and the right end of the threaded rod are fixedly connected with the surface of one side of the movable frame, which is opposite to the movable frame, respectively.

The beneficial effects of adopting the further scheme are as follows: the output ends of the two driving motors are connected relatively to drive the movable frame to move left and right outside the transmission rail.

Further, a through hole is formed in one side, close to the movable plate, of the movable frame, and the movable plate penetrates through the through hole and extends into the movable frame.

The beneficial effects of adopting the further scheme are as follows: the movable plate penetrates through the through hole to realize that the sliding connection at the outer side of the sliding rod plays a supporting and stabilizing role.

Further, the upper end and the lower end of the sliding rod are fixedly connected to the inner wall surface of the movable frame.

The beneficial effects of adopting the further scheme are as follows: the stability of the movable plate during movement is realized through the sliding rod.

Further, the two sliding rods are arranged transversely at equal intervals.

The beneficial effects of adopting the further scheme are as follows: the stability of the movement of the movable plate can be improved through the two sliding rods.

Further, the five positioning blocks are transversely arranged at equal intervals, and an anti-slip cushion block is arranged on one end surface of each positioning block, which is far away from the corresponding fixed block.

The beneficial effects of adopting the further scheme are as follows: the frame body can be better clamped and fixed through the five positioning blocks.

Further, the anti-skid cushion block is a rubber pad.

The beneficial effects of adopting the further scheme are as follows: the clamping stability of the frame body can be improved through the anti-slip cushion block, and the situation of deviation during processing is avoided.

Compared with the prior art, the utility model provides the frame conveying clamp for semiconductor packaging, which has the following beneficial effects:

the frame conveying clamp for semiconductor packaging drives the two movable frames to move relatively or linearly back to back through the double-shaft motor driving threaded rod, and adjusts clamping positions of frame bodies of different sizes. The telescopic end of the electric telescopic rod drives the movable plate to move towards the upper side and the lower side of the frame body, and a plurality of positioning blocks arranged through the fixed blocks are attached to the surface of the frame body to play a clamping role.

Drawings

FIG. 1 is a front view of the present utility model;

FIG. 2 is a side view of a portion of the structure of the movable frame of the present utility model;

FIG. 3 is a partial cross-sectional view of the movable frame of the present utility model;

fig. 4 is a side view of the present utility model.

Reference numerals illustrate:

1. a movable frame; 2. a connecting plate; 3. an electric telescopic rod; 4. a movable plate; 5. a fixed block; 6. a positioning block; 7. a threaded rod; 8. a transmission rail; 9. a slide bar; 10. a through hole; 11. a frame body; 12. a biaxial motor; 13. and a sliding plate.

Detailed Description

Referring to fig. 1 and 4, a frame conveying fixture for semiconductor package includes two transmission rails 8, wherein the surface of the transmission rail 8 is connected with a frame body 11 in a bonding manner, and the upper and lower ends of the frame body 11 are respectively provided with a clamping assembly.

Referring to fig. 2-4, the clamping assembly includes a sliding plate 13 and two movable frames 1, a driving member for driving the sliding plate 13 to slide is disposed on the transmission rail 8, and the driving member is disclosed in the prior art and is disclosed in the patent CN216145598U, which is not repeated herein. The end threaded connection has threaded rod 7 in movable frame 1, thereby two threaded rod 7 middle part fixedly connected with biax motor 12, threaded rod 7's tip rotates to be connected on sliding plate 13, biax motor 12 and sliding plate 13 fixed connection, movable frame 1 sliding connection is on sliding plate 13, specific movable frame 1 is close to sliding plate 13 and is provided with the slider, the spout has been seted up on sliding plate 13 surface, the slider of movable frame 1 and the spout that sliding plate 13 offered form sliding connection, biax motor 12 passes through mounting bracket fixed mounting on transmission rail 8, thereby threaded rod 7 passes through biax motor 12 output threaded connection and drives two movable frames 1 and realize relative or the regulation of back of the body rectilinear movement and realizing the angle, threaded rod 7 left and right sides both ends respectively with movable frame 1 one side fixed surface connection that is back to the body, the equal fixedly connected with connecting plate 2 in movable frame 1 upper and lower both ends surface, two connecting plates 2 are equal fixed connection and are fixed with electric telescopic handle 3, electric telescopic handle 3 is fixed connection is 4, the movable frame 1 is close to one side of movable frame 4 is seted up through hole 10, inside through hole 10 and extends to its movable frame 1, electric handle 4 is fixed connection is equipped with 5, two fixed surface 5 side of sliding handle 6 are fixed connection is fixed to be the side of sliding handle 9, five fixed surface 5, the fixed surface is fixed connection is fixed surface 9 is fixed to be fixed side of sliding handle 9, and is fixed surface 9 is fixed to be arranged at two sliding handle 5.

It should be noted that, the displacement of the movable frame 1 is not affected by the installation of the double-shaft motor 12, the flexible end of the electric telescopic rod 3 drives the movable plate 4 to move, meanwhile, one end of the movable plate 4 is inside the movable frame 1, the surface sliding connection of the arranged sliding rod 13 can improve the stability during moving and has a supporting effect, and the positioning block 6 can effectively improve the stability of clamping and reduce the situation of deflection during processing through the arranged anti-slip cushion block during surface adhesion of the frame body 11.

The working principle of the embodiment is as follows:

the frame body 11 is placed on the upper side of the surface of two transmission rails 8, when two movable frames 1 are passed through, electric telescopic rods 3 at the upper end and the lower end of the movable frames 1 are started according to the size of the frame body 11 body type, the movable plate 4 is driven to move towards the upper side and the lower side of the frame body 11 through telescopic ends, a plurality of positioning blocks 6 which are arranged through fixed blocks 5 are attached to the surface of the frame body 11 to play a positioning clamping role, the inner side, which is close to one end of the movable frame 1, of the movable plate 4 is in sliding connection with the outer side of a sliding rod 9 when the movable plate 4 moves, stability in moving is improved, the clamping firmness can be improved through a sliding cushion block which is arranged at one end of the fixed block 5 and is far away from the positioning blocks 6 when the frame body 11 is welded, the sliding block 8 is driven to drive the frame body 11 to move through the transmission rails 8, and the double-shaft motor 12 drives the threaded rods 7 to drive the two movable frames 1 to move relatively or linearly back to each other and adjust the clamping positions of the frame body 11 with different body types.

Claims

1. Frame conveying clamp for semiconductor packaging, comprising two conveying rails (8), and being characterized in that: the surface of the transmission rail (8) is connected with a frame body (11) in a bonding mode, and clamping assemblies are arranged at the upper end and the lower end of the frame body (11);

clamping assembly includes sliding plate (13) and two movable frames (1), the equal fixedly connected with threaded rod (7) of movable frame (1) middle-end screw thread, threaded rod (7) rotate and connect on sliding plate (13), two threaded rod (7) middle part fixedly connected with biax motor (12), biax motor (12) and sliding plate (13) fixed connection, movable frame (1) sliding connection is on sliding plate (13), equal fixedly connected with connecting plate (2) in both ends surface about movable frame (1), two connecting plate (2) are all fixed mounting in opposite sides has electric telescopic handle (3), electric telescopic handle (3) telescopic end fixedly connected with fly leaf (4), electric telescopic handle (3) telescopic end's fixed surface is connected with fixed block (5) are kept away from to fly leaf (4), fixed block (5) surface is provided with five (6), inside sliding connection who is close to movable frame (1) one side has two slide bars (9).

2. The frame transfer jig for semiconductor packages according to claim 1, wherein: the left end and the right end of the threaded rod (7) are fixedly connected with the surface of one side of the movable frame (1) opposite to each other respectively.

3. The frame transfer jig for semiconductor packages according to claim 2, wherein: a through hole (10) is formed in one side, close to the movable plate (4), of the movable frame (1), and the movable plate (4) penetrates through the through hole (10) and extends into the movable frame (1).

4. A frame transfer jig for semiconductor packaging according to claim 3, wherein: the upper end and the lower end of the sliding rod (9) are fixedly connected to the inner wall surface of the movable frame (1).

5. The frame transfer jig for semiconductor packaging according to claim 4, wherein: the two sliding rods (9) are transversely and equidistantly arranged.

6. The frame transfer jig for semiconductor packages according to claim 1, wherein: the five positioning blocks (6) are transversely arranged at equal intervals, and an anti-skid cushion block is arranged on the surface of one end, far away from the fixed block (5), of the positioning block (6).

7. The frame transfer jig for semiconductor packages according to claim 6, wherein: the anti-skid cushion block is a rubber pad.