CN219873411U - Full-automatic die bonding device suitable for chips with multiple sizes - Google Patents

Abstract

The utility model discloses a full-automatic die bonding device suitable for chips with multiple sizes, which comprises a beam frame, wherein the beam frame is arranged above a workbench, a first chute is arranged on the beam frame, a movable seat is arranged on one side of the beam frame, a first mounting frame and a second mounting frame are arranged on one side of the movable seat, and a third electric telescopic rod is arranged between the first mounting frame and the second mounting frame; the object placing table is arranged above the workbench, a sliding seat is arranged on one side of the object placing table, a first fixing frame is arranged above the sliding seat, and a second fixing frame is arranged on one side of the first fixing frame; the glue dripping nozzle is arranged below the first mounting frame, sucking discs are arranged below the first mounting frame and the second mounting frame, the space between the sucking discs arranged by the crystal fixing device taking and placing mechanism can be adjusted, the center distance of the sucking discs can be correspondingly adjusted according to the size of a chip, the chip is accurately placed on a chip board for crystal fixing, and crystal fixing of the chips with multiple sizes is achieved.

Description

Full-automatic die bonding device suitable for chips with multiple sizes

Technical Field

The utility model relates to the technical field of chip die bonding, in particular to a full-automatic die bonding device suitable for chips with multiple sizes.

Background

Chips, which are the general term for semiconductor device products, are carriers for integrated circuits, and are formed by dividing wafers into wafers, and are referred to as silicon chips containing integrated circuits, and are small, often part of computers or other devices. And (3) die bonding, namely bonding the wafer to a designated area of the bracket through colloid to form a thermal path or an electric path, and providing conditions for subsequent wire bonding connection.

The Chinese patent publication No. CN216437892U, the authorized bulletin day is 2022, 05 and 03, a die bonding device comprises a machine body, wherein a die bonding station is arranged on the machine body; the conveying mechanism is used for conveying the PCB; the die bonding station is positioned on a conveying track of the conveying mechanism; the wafer taking and placing mechanism comprises a taking and placing frame, a taking and placing suction nozzle, a dispensing part and a taking and placing frame driving part, wherein the taking and placing frame driving part is used for driving the taking and placing frame to move along the X-axis direction, and the taking and placing frame driving part is used for driving the taking and placing frame to move along the Y-axis direction; the pick-and-place suction nozzle is arranged on the pick-and-place rack and is used for clamping the wafer; the dispensing piece is arranged on the picking and placing frame and used for dispensing on the PCB; the die bonding station is positioned on the motion track of the picking and placing frame. The die bonding device can realize automatic dispensing and die fixing of the PCB and improve the production efficiency of the PCB.

The existing wafer taking and placing mechanism adopts a sucking disc sucking mode to achieve taking and placing, the distance between the sucking discs is fixed, the size of the chip board clamping mechanism is fixed, when chips with different sizes are subjected to die bonding processing, the chips which are taken and placed cannot be accurately placed on the chip board, die bonding efficiency of the chips is greatly reduced, and the use requirements cannot be met.

Disclosure of Invention

The utility model aims to provide a full-automatic die bonding device suitable for chips with multiple sizes, which aims to solve the problems that in the prior art, the existing wafer taking and placing mechanism adopts a sucking disc to absorb so as to realize taking and placing, the space between sucking discs is fixed, the size of a chip board clamping mechanism is fixed, and when the chips with different sizes are subjected to die bonding processing, the chips which are taken and placed cannot be accurately placed on a chip board, so that the die bonding efficiency of the chips is greatly reduced, and the use requirement cannot be met.

In order to achieve the above purpose, the present utility model provides the following technical solutions: a full-automatic die bonder suitable for chips with multiple sizes comprises a workbench,

the beam frame is arranged above the workbench, a first sliding groove is formed in the beam frame, a movable seat is arranged on one side of the beam frame, one end of the movable seat extends to the inside of the first sliding groove, the movable seat is in sliding connection with the beam frame, a first mounting frame and a second mounting frame are arranged on one side of the movable seat, the first mounting frame is fixedly connected with the movable seat, a third electric telescopic rod is arranged between the first mounting frame and the second mounting frame, the third electric telescopic rod is fixedly connected with the first mounting frame and the second mounting frame, a third sliding groove is formed in the movable seat, one end of the second mounting frame extends to the inside of the third sliding groove, and the second mounting frame is in sliding connection with the movable seat;

the object placing table is arranged above the workbench, one side of the object placing table is provided with a sliding seat, the object placing table and the sliding seat are fixedly connected with the workbench, a first fixing frame is arranged above the sliding seat, one side of the first fixing frame is provided with a second fixing frame, guide rods are arranged below the second fixing frame, at least four guide rods are arranged, the guide rods are fixedly connected with the second fixing frame, and the guide rods are in sliding connection with the first fixing frame;

the glue dripping nozzle is arranged below the first installation frame, sucking discs are arranged below the first installation frame and the second installation frame, a glue storage box and a peristaltic pump are arranged above the beam frame, the glue storage box and the peristaltic pump are fixedly connected with the beam frame, a glue conveying pipe is arranged between the peristaltic pump and the glue storage box and between the peristaltic pump and the glue dripping nozzle, an electric control cabinet is arranged on one side of the workbench, and the electric control cabinet is connected with the workbench through screws.

Preferably, one end of the guide rod is provided with a limiting block, the limiting block is fixedly connected with the guide rod, a spring is arranged outside the guide rod and is in sliding connection with the guide rod, and two ends of the spring are respectively attached to the first fixing frame and the limiting block.

Preferably, the inside of first mounting bracket and second mounting bracket all is provided with flexible chamber, the top of glue dripping mouth and sucking disc all is provided with the connecting rod, and the one end and the glue dripping mouth and the sucking disc fixed connection of connecting rod, the other end of connecting rod extends to the inside in flexible chamber, and connecting rod and first mounting bracket and second mounting bracket sliding connection, the top of first mounting bracket and second mounting bracket is provided with first electric telescopic handle and second electric telescopic handle, and the second electric telescopic handle is provided with two, and second electric telescopic handle corresponds the setting with the sucking disc.

Preferably, one side of the beam frame is provided with a first motor, the first motor is connected with the beam frame through a screw, a first screw rod is arranged in the first sliding groove, one end of the first screw rod is connected with the output end of the first motor into an integrated structure, the first screw rod is in threaded connection with the movable seat, and the first screw rod is rotationally connected with the beam frame.

Preferably, the upper end of workstation is provided with the second spout, and the second spout is provided with two, and the both ends of roof beam frame all extend to the inside of second spout, roof beam frame and workstation sliding connection, one side of workstation is provided with the second motor, and the second motor passes through screw connection with the workstation, two the inside of second spout all is provided with the second lead screw, and the one end and the output of second motor of second lead screw are connected as an organic whole structure, second lead screw and roof beam frame threaded connection, and second lead screw and workstation rotate to be connected.

Preferably, the sliding seat is provided with a fourth sliding groove, one end of the first fixing frame extends to the inside of the fourth sliding groove, the first fixing frame is in sliding connection with the sliding seat, one side of the sliding seat is provided with a third motor, the third motor is connected with the sliding seat through a screw, the inside of the fourth sliding groove is provided with a third screw rod, one end of the third screw rod is connected with the output end of the third motor into an integrated structure, the third screw rod is in threaded connection with the first fixing frame, and the third screw rod is in rotary connection with the sliding seat.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the device, through the arrangement of the glue dropping nozzle, the peristaltic pump, the suckers, the first electric telescopic rod, the second electric telescopic rod and the third electric telescopic rod, glue is dropped onto the chip board through the glue dropping nozzle under the action of the peristaltic pump, the first electric telescopic rod drives the glue dropping nozzle to lift, glue can be precisely dropped onto the chip board, the second electric telescopic rod drives the suckers to lift, under the combined action of the second electric telescopic rod and the suckers, the chip can be sucked and then placed onto the chip board after glue dropping, chip die bonding is realized, the second mounting frame is driven to move under the action of the third electric telescopic rod, the distance between the two suckers is adjusted, and multi-size chip die bonding processing can be realized;

2. the device is characterized in that the first fixing frame, the second fixing frame, the guide rod and the spring are arranged, the first fixing frame and the second fixing frame are connected into a whole through the guide rod, the spring can apply a pulling force to the second fixing frame towards the first fixing frame, the first fixing frame and the second fixing frame can be respectively and tightly attached to two ends of the chip board under the action of the pulling force, the chip boards with different sizes can be rapidly clamped and fixed, and the chip fixing processing of multiple sizes can be realized.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a cross-sectional view of the present utility model;

FIG. 3 is an enlarged view of a portion of area A of FIG. 1 in accordance with the present utility model;

FIG. 4 is a diagram showing the connection relationship between a first mounting frame and a second mounting frame according to the present utility model;

FIG. 5 is a diagram showing the connection relationship between the first fixing frame and the second fixing frame according to the present utility model;

FIG. 6 is a diagram showing the connection relationship between the first fixing frame and the sliding seat;

fig. 7 is a diagram showing a connection relationship between a second screw and a table according to the present utility model.

In the figure: 1. a work table; 2. an electric control cabinet; 3. a beam frame; 4. a glue storage box; 5. a peristaltic pump; 6. a movable seat; 7. a first mounting frame; 8. a second mounting frame; 9. a first chute; 10. a storage table; 11. a second chute; 12. a first motor; 13. a second motor; 14. a slide; 15. a first fixing frame; 16. the second fixing frame; 17. a first screw rod; 18. a second screw rod; 19. a rubber conveying pipe; 20. a third chute; 21. a telescopic chamber; 22. a glue dripping nozzle; 23. a suction cup; 24. a connecting rod; 25. a first electric telescopic rod; 26. a second electric telescopic rod; 27. a third electric telescopic rod; 28. a guide rod; 29. a spring; 30. a fourth chute; 31. a third screw rod; 32. a limiting block; 33. and a third motor.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Referring to fig. 1-7, an embodiment of the present utility model is provided: a full-automatic die bonding device suitable for chips with multiple sizes comprises a workbench 1,

the beam frame 3 is arranged above the workbench 1, a first sliding groove 9 is formed in the beam frame 3, a movable seat 6 is arranged on one side of the beam frame 3, one end of the movable seat 6 extends into the first sliding groove 9, the movable seat 6 is in sliding connection with the beam frame 3, a first mounting frame 7 and a second mounting frame 8 are arranged on one side of the movable seat 6, the first mounting frame 7 is fixedly connected with the movable seat 6, a third electric telescopic rod 27 is arranged between the first mounting frame 7 and the second mounting frame 8, the third electric telescopic rod 27 is fixedly connected with the first mounting frame 7 and the second mounting frame 8, a third sliding groove 20 is formed in the movable seat 6, one end of the second mounting frame 8 extends into the third sliding groove 20, and the second mounting frame 8 is in sliding connection with the movable seat 6;

the object placing table 10 is arranged above the workbench 1, one side of the object placing table 10 is provided with a sliding seat 14, the object placing table 10 and the sliding seat 14 are fixedly connected with the workbench 1, a first fixing frame 15 is arranged above the sliding seat 14, one side of the first fixing frame 15 is provided with a second fixing frame 16, guide rods 28 are arranged below the second fixing frame 16, at least four guide rods 28 are arranged, the guide rods 28 are fixedly connected with the second fixing frame 16, and the guide rods 28 are in sliding connection with the first fixing frame 15;

the glue dripping nozzle 22 is arranged below the first installation frame 7, sucking discs 23 are arranged below the first installation frame 7 and the second installation frame 8, the glue storage tank 4 and the peristaltic pump 5 are arranged above the beam frame 3, the glue storage tank 4 and the peristaltic pump 5 are fixedly connected with the beam frame 3, the glue conveying pipe 19 is arranged between the peristaltic pump 5 and the glue storage tank 4 and the glue dripping nozzle 22, one side of the workbench 1 is provided with the electric control cabinet 2, and the electric control cabinet 2 is connected with the workbench 1 through screws.

When in use, the utility model is characterized in that: the chip is placed on the object placing table 10, the chip board is clamped and fixed by using the first fixing frame 15 and the second fixing frame 16, the peristaltic pump 5 is started to pump glue in the glue storage box 4 to drop into a chip groove on the chip board through the glue conveying pipe 19 and the glue dropping nozzle 22, the chip on the object placing table 10 is firstly sucked by means of the sucking disc 23, then the sucked chip is placed into the chip groove after glue dropping, chip die bonding is realized, when die bonding is carried out on chips with different sizes, the third electric telescopic rod 27 is driven to drive the second fixing frame 8 to move, the distance between the two sucking discs 23 is adjusted, the die bonding processing of the chips with multiple sizes can be realized, and the moving mechanism of the die bonding device is operated by numerical control, and full-automatic die bonding can be realized.

Referring to fig. 1 and 5, a limiting block 32 is disposed at one end of the guide rod 28, the limiting block 32 is fixedly connected with the guide rod 28, a spring 29 is disposed outside the guide rod 28, the spring 29 is slidably connected with the guide rod 28, two ends of the spring 29 are respectively attached to the first fixing frame 15 and the limiting block 32, tension can be applied to the second fixing frame 16 through the spring 29, the first fixing frame 15 and the second fixing frame 16 are respectively and tightly attached to two ends of a chip board under the action of the tension, and the chip boards with different sizes can be rapidly clamped and fixed, so that the stability of the die bonding process is ensured.

Please refer to fig. 1 and 4, the inside of first mounting bracket 7 and second mounting bracket 8 all is provided with flexible chamber 21, glue dispensing nozzle 22 and sucking disc 23's top all is provided with connecting rod 24, and connecting rod 24's one end and glue dispensing nozzle 22 and sucking disc 23 fixed connection, connecting rod 24's the other end extends to the inside of flexible chamber 21, and connecting rod 24 and first mounting bracket 7 and second mounting bracket 8 sliding connection, first mounting bracket 7 and second mounting bracket 8's top is provided with first electric telescopic handle 25 and second electric telescopic handle 26, second electric telescopic handle 26 is provided with two, and second electric telescopic handle 26 corresponds the setting with sucking disc 23, can drive glue dispensing nozzle 22 through first electric telescopic handle 25 and go up and down, can drive sucking disc 23 to go up and down under the effect of second electric telescopic handle 26, can be better absorb or release the chip with glue dripping into the chip groove.

Referring to fig. 1 and 2, a first motor 12 is disposed on one side of the beam frame 3, the first motor 12 is connected with the beam frame 3 through a screw, a first screw rod 17 is disposed in the first chute 9, one end of the first screw rod 17 is connected with an output end of the first motor 12 into an integral structure, the first screw rod 17 is in threaded connection with the movable seat 6, the first screw rod 17 is rotationally connected with the beam frame 3, the first motor 12 drives the first screw rod 17 to rotate, the movable seat 6 is driven to move along the first chute 9 along with the rotation of the first screw rod 17, and then the glue dropping nozzle 22 and the suction cup 23 are driven to transversely move.

Referring to fig. 1, 2 and 7, a second chute 11 is provided at the upper end of the working table 1, two second chutes 11 are provided, two ends of the beam frame 3 extend to the inside of the second chute 11, the beam frame 3 is slidably connected with the working table 1, a second motor 13 is provided at one side of the working table 1, the second motor 13 is connected with the working table 1 through screws, two second screw rods 18 are provided in the inside of the two second chutes 11, one end of each second screw rod 18 is connected with the output end of the second motor 13 into an integral structure, the second screw rods 18 are in threaded connection with the beam frame 3, the second screw rods 18 are rotationally connected with the working table 1, the second screw rods 18 are driven to rotate by the second motor 13, the beam frame 3 is driven to move along the second chute 11 along with the rotation of the second screw rods 18, then the glue dropping nozzle 22 and the suction disc 23 are driven to longitudinally move, and the die-bonding processing is realized under the combined action of the first motor 12 and the second motor 13.

Referring to fig. 5 and 6, a fourth sliding groove 30 is provided on the sliding seat 14, one end of the first fixing frame 15 extends into the fourth sliding groove 30, the first fixing frame 15 is slidably connected with the sliding seat 14, a third motor 33 is provided on one side of the sliding seat 14, the third motor 33 is connected with the sliding seat 14 through a screw, a third screw rod 31 is provided in the fourth sliding groove 30, one end of the third screw rod 31 is connected with an output end of the third motor 33 into an integral structure, the third screw rod 31 is in threaded connection with the first fixing frame 15, the third screw rod 31 is rotationally connected with the sliding seat 14, the third screw rod 31 is driven to rotate through the third motor 33, the first fixing frame 15 is driven to move along the fourth sliding groove 30 along with the rotation of the third screw rod 31, and the clamping mechanism longitudinally moves along with the movement of the first fixing frame 15, so that the chip board is conveniently fed and discharged.

Working principle: placing the chip on the object placing table 10, clamping and fixing the chip board by using the first fixing frame 15 and the second fixing frame 16, starting the third motor 33 to drive the third screw rod 31 to rotate clockwise, and feeding the clamping mechanism into the inner side of the device; the peristaltic pump 5 is started to pump the glue in the glue storage tank 4 and drop the glue into a chip groove on the chip board through the glue delivery pipe 19 and the glue dropping nozzle 22, and when the glue is dropped, the first electric telescopic rod 25 is driven to drive the glue dropping nozzle 22 to lift, and the glue dropping nozzle 22 is inserted into the chip groove to ensure the glue dropping precision; driving the second electric telescopic rod 26 to drive the sucker 23 to lift, adjusting the height of the sucker 23, sucking the chip on the object placing table 10 by means of the sucker 23, and then placing the sucked chip into a chip groove after glue dripping to realize chip die bonding; the first motor 12 drives the first screw rod 17 to rotate, the movable seat 6 is driven to move along the first sliding groove 9 along with the rotation of the first screw rod 17, then the glue dripping nozzle 22 and the sucking disc 23 are driven to transversely move, the second motor 13 drives the second screw rod 18 to rotate, the beam frame 3 is driven to move along the second sliding groove 11 along with the rotation of the second screw rod 18, then the glue dripping nozzle 22 and the sucking disc 23 are driven to longitudinally move, the die bonding processing is realized under the combined action of the first motor 12 and the second motor 13, the moving mechanism of the die bonding device is operated by numerical control, full-automatic die bonding can be realized, the third motor 33 is started to drive the third screw rod 31 to anticlockwise rotate after die bonding is finished, and the clamping mechanism is moved out from the inner side of the device. The third electric telescopic rod 27 is driven to drive the second mounting frame 8 to move, the distance between the two suckers 23 is adjusted, and die bonding processing of chips with multiple sizes can be achieved.

What is not described in detail in this specification is prior art known to those skilled in the art.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a be suitable for full-automatic solid brilliant device of multisize chip, includes workstation (1), its characterized in that:

the beam frame (3) is arranged above the workbench (1), a first sliding groove (9) is formed in the beam frame (3), a movable seat (6) is arranged on one side of the beam frame (3), one end of the movable seat (6) extends to the inside of the first sliding groove (9), the movable seat (6) is slidably connected with the beam frame (3), a first mounting frame (7) and a second mounting frame (8) are arranged on one side of the movable seat (6), the first mounting frame (7) is fixedly connected with the movable seat (6), a third electric telescopic rod (27) is arranged between the first mounting frame (7) and the second mounting frame (8), the third electric telescopic rod (27) is fixedly connected with the first mounting frame (7) and the second mounting frame (8), a third sliding groove (20) is formed in the movable seat (6), one end of the second mounting frame (8) extends to the inside of the third sliding groove (20), and the second mounting frame (8) is slidably connected with the movable seat (6).

The object placing table (10) is arranged above the workbench (1), one side of the object placing table (10) is provided with a sliding seat (14), the object placing table (10) and the sliding seat (14) are fixedly connected with the workbench (1), a first fixing frame (15) is arranged above the sliding seat (14), one side of the first fixing frame (15) is provided with a second fixing frame (16), guide rods (28) are arranged below the second fixing frame (16), the guide rods (28) are at least four, the guide rods (28) are fixedly connected with the second fixing frames (16), and the guide rods (28) are in sliding connection with the first fixing frames (15);

glue dripping mouth (22), it sets up the below of first mounting bracket (7), the below of first mounting bracket (7) and second mounting bracket (8) all is provided with sucking disc (23), the top of roof beam structure (3) is provided with glue storage case (4) and peristaltic pump (5), and glue storage case (4) and peristaltic pump (5) and roof beam structure (3) fixed connection, be provided with between peristaltic pump (5) and glue storage case (4) and glue dripping mouth (22) and carry rubber tube (19), one side of workstation (1) is provided with automatically controlled cabinet (2), and automatically controlled cabinet (2) and workstation (1) pass through screw connection.

2. The fully automatic die attach apparatus for multi-size chips of claim 1, wherein: one end of guide bar (28) is provided with stopper (32), and stopper (32) and guide bar (28) fixed connection, the outside of guide bar (28) is provided with spring (29), and spring (29) and guide bar (28) sliding connection, the both ends of spring (29) laminate with first mount (15) and stopper (32) respectively.

3. The fully automatic die attach apparatus for multi-size chips of claim 1, wherein: the inside of first mounting bracket (7) and second mounting bracket (8) all is provided with flexible chamber (21), the top of glue dripping mouth (22) and sucking disc (23) all is provided with connecting rod (24), and the one end and the glue dripping mouth (22) of connecting rod (24) and sucking disc (23) fixed connection, the other end of connecting rod (24) extends to the inside of flexible chamber (21), and connecting rod (24) and first mounting bracket (7) and second mounting bracket (8) sliding connection, the top of first mounting bracket (7) and second mounting bracket (8) is provided with first electric telescopic handle (25) and second electric telescopic handle (26), and second electric telescopic handle (26) are provided with two, and second electric telescopic handle (26) correspond with sucking disc (23) and set up.

4. The fully automatic die attach apparatus for multi-size chips of claim 1, wherein: one side of roof beam frame (3) is provided with first motor (12), and first motor (12) pass through screw connection with roof beam frame (3), the inside of first spout (9) is provided with first lead screw (17), and the one end of first lead screw (17) is connected as an organic whole structure with the output of first motor (12), first lead screw (17) and remove seat (6) threaded connection, and first lead screw (17) are connected with roof beam frame (3) rotation.

5. The fully automatic die attach apparatus for multi-size chips of claim 1, wherein: the upper end of workstation (1) is provided with second spout (11), and second spout (11) are provided with two, and the both ends of roof beam structure (3) all extend to the inside of second spout (11), roof beam structure (3) and workstation (1) sliding connection, one side of workstation (1) is provided with second motor (13), and second motor (13) and workstation (1) pass through screw connection, two the inside of second spout (11) all is provided with second lead screw (18), and the one end of second lead screw (18) is connected as an organic whole structure with the output of second motor (13), second lead screw (18) and roof beam structure (3) threaded connection, and second lead screw (18) and workstation (1) swivelling joint.

6. The fully automatic die attach apparatus for multi-size chips of claim 1, wherein: be provided with fourth spout (30) on slide (14), and the one end of first mount (15) extends to the inside of fourth spout (30), first mount (15) and slide (14) sliding connection, one side of slide (14) is provided with third motor (33), and third motor (33) and slide (14) pass through screw connection, the inside of fourth spout (30) is provided with third lead screw (31), and the one end of third lead screw (31) is connected as an organic whole structure with the output of third motor (33), third lead screw (31) and first mount (15) threaded connection, and third lead screw (31) are connected with slide (14) rotation.