CN109979870B - Automatic burst feed mechanism of silicon wafer - Google Patents
Automatic burst feed mechanism of silicon wafer Download PDFInfo
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- CN109979870B CN109979870B CN201910327227.XA CN201910327227A CN109979870B CN 109979870 B CN109979870 B CN 109979870B CN 201910327227 A CN201910327227 A CN 201910327227A CN 109979870 B CN109979870 B CN 109979870B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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Abstract
The invention provides an automatic slicing and feeding mechanism for silicon wafers, which comprises a worktable arranged at the top of an installation rack, a feeding mechanism vertically penetrating through the worktable, a supporting component, a lifting component, a limiting mechanism arranged around the supporting component, and a layering mechanism arranged at the top of a material area formed by the limiting mechanism, the silicon wafer stacking material which is arranged up and down is driven by the hairbrush matching with the lifting component, the silicon wafer at the top of the silicon wafer stacking material is separated from the stacking material by the hairbrush, meanwhile, the air nozzle is used to separate the uppermost silicon wafer from the next lower silicon wafer to form a buffer area, when the vacuum chuck moves downwards to adsorb the silicon wafers, the buffer interval of pushing down exists, avoids the extrusion breakage between the silicon wafers, solves the technical problem that the silicon wafers are easy to break when being pressed when being grabbed, and realizes the automatic and one-by-one orderly material distribution and output of the silicon wafers.
Description
Technical Field
The invention relates to the technical field of silicon wafer automatic feeding machinery, in particular to an automatic slicing and feeding mechanism for silicon wafers.
Background
The silicon wafer is used as a good conductive material and can be widely applied to the technical fields of semiconductors, solar cells and the like. The later stage of the processing technology of the silicon wafer generally needs to carry out the steps of chamfering, grinding, corroding, polishing, cleaning and the like, wherein the cleaning refers to carrying out liquid cleaning on the processed silicon wafer to remove impurities on the surface of the silicon wafer and avoid the conditions of scratching, cracking and the like on the surface of the silicon wafer, so the cleaning is a very important process step.
However, the silicon wafer cleaning machine in the prior art is complex to operate, the silicon wafer needs to be manually placed in the cleaning tank for cleaning, the silicon wafer is fragile, in the manual transferring process, the silicon wafer is easy to break due to the fact that the silicon wafer is easy to break due to the holding force, the manual transferring speed is low, the working efficiency is low, mechanical grabbing is adopted, if vacuum suction cups are adopted for adsorption, the silicon wafer can be squeezed in the adsorption process, and the silicon wafer is broken.
The Chinese patent with the Chinese patent application number of CN201811292666.3 discloses a silicon wafer self-slicing, conveying and positioning system, which comprises a mounting frame, a feeding lifting mechanism, a slicing mechanism, a conveying mechanism and a self-centering mechanism, wherein the feeding lifting mechanism is arranged on the mounting frame and is used for driving a wafer box in which a plurality of silicon wafers are stacked to move upwards; the slicing mechanism of the slicing mechanism is arranged at the rear side of the feeding lifting mechanism; the transmission mechanism is arranged behind the slicing mechanism; the self-centering mechanism is arranged above one end of the transmission mechanism; through setting up material loading hoist mechanism and forming silicon chip stack area on the silicon chip plummer, a plurality of silicon chips are piled up naturally and are piled up in silicon chip stack area and move to the burst mechanism below from bottom to top, and burst mechanism and silicon chip carry out the automatic burst of contact realization silicon chip, are transmitted to realizing from the centering department by transmission mechanism one by one continuous type simultaneously and realize from the centering.
However, in the above patent, the silicon wafer is separated and delivered directly by the friction between the rubber tube and the silicon wafer, and the silicon wafer is easily broken by the rotation of the rubber tube.
Disclosure of Invention
Aiming at the problems, the invention provides an automatic silicon wafer slicing and feeding mechanism which drives a silicon wafer stacking material arranged in an up-and-down lifting mode through a hairbrush matched with a lifting assembly, the hairbrush is used for separating a silicon wafer at the top of the silicon wafer stacking material from the stacking material, meanwhile, an air nozzle is used for separating the topmost silicon wafer from the silicon wafer adjacent below to form a buffer area, when a vacuum chuck moves downwards to adsorb the silicon wafer, a downward pressing buffer area exists, the silicon wafers are prevented from being crushed by extrusion, the technical problem that the silicon wafers are easily crushed by pressure during grabbing is solved, and the silicon wafers are automatically and orderly divided and output one by one.
In order to achieve the purpose, the invention provides the following technical scheme:
an automatic burst feed mechanism of silicon wafer includes:
the mounting device comprises a mounting rack, wherein a workbench is arranged at the top of the mounting rack;
the feeding mechanism vertically penetrates through the workbench, is installed on the installation rack and comprises a supporting component and a lifting component, silicon wafers are stacked on the top of the supporting component, and the lifting component drives the silicon wafers to lift;
the limiting mechanism is arranged on the workbench, is arranged around the supporting component and comprises a plurality of limiting rods arranged in a parallel sliding manner, and a material area for stacking the silicon wafers is formed between the limiting rods; and
the layering mechanism is arranged at the top of the material area and distributes the silicon wafers positioned at the top of the material area, so that the silicon wafers at the top of the material area and the silicon wafers adjacent below the silicon wafers form a buffer area.
As an improvement, the workbench is arranged on the mounting rack in a sliding mode and is driven to slide by a sliding driving piece positioned below the workbench.
As an improvement, the support assembly comprises:
the mounting plate is horizontally arranged, is connected with the lifting assembly and is driven by the lifting assembly to lift along the vertical direction; and
the bracing piece, a plurality of the bracing piece all vertically install in on the mounting panel, this bracing piece is followed the direction of rise and fall circumference equidistance setting of mounting panel, and the top cooperation of this bracing piece forms places the place the platform of silicon wafer.
As an improvement, the lift assembly comprises:
the electric sliding table unit is vertically arranged on the mounting rack, a sliding table is arranged on the electric sliding table unit, and the sliding table is arranged in a sliding manner along the vertical direction;
the sliding table bottom plate is connected with the sliding table, moves synchronously with the sliding table and is connected with the supporting assembly.
As an improvement, the limiting mechanism further comprises:
the limiting guide disc is rotatably arranged on the workbench and is connected with a handle, waist grooves which are arranged at equal intervals on the circumference are formed in the limiting guide disc, the waist grooves are arranged in one-to-one correspondence with the limiting rods, and the tops of the limiting rods penetrate through the waist grooves; and
the sliding assemblies are arranged in one-to-one correspondence with the limiting rods, are arranged on the workbench and are connected with the bottoms of the limiting rods.
As an improvement, an adjusting pointer is arranged on the limiting guide disc, and an adjusting scale is arranged on the workbench opposite to the adjusting pointer.
As an improvement, the slide assembly comprises:
the sliding rail is arranged on the workbench and points to the circle center of the limiting guide disc; and
and the sliding block is slidably arranged on the sliding rail and is connected with the bottom of the limiting rod.
As an improvement, a locking assembly is arranged at any slide block, and comprises:
the locking block is integrally connected with the adjacent sliding block and is provided with a vertically sliding contact pin; and
the locking block is arranged right below the locking block, and a plurality of jacks correspondingly matched with the contact pins are arranged on the locking block.
As an improvement, the layering mechanism comprises:
the hairbrushes are symmetrically arranged on two sides of the material area and are abutted against the silicon wafer on the top of the material area; and
the air nozzle is arranged on one side of the material area and is positioned between the hairbrushes in a symmetrical mode.
As the improvement, one side of stop gear is provided with buffer memory mechanism, this buffer memory mechanism set up in on the workstation, it includes:
the blanking device comprises a blanking container, a buffer liquid and a control device, wherein the blanking container is filled with the buffer liquid;
the discharging handle is placed in the discharging container and is detachably arranged; and
and the overflow container is arranged right below the blanking container, and the blanking container transfers the overflow liquid of the blanking container into the overflow container through an overflow pipe communicated with the top of the overflow container.
The invention has the beneficial effects that:
(1) according to the silicon wafer stacking device, the brush is matched with the lifting assembly to drive the silicon wafer stacking material to lift up and down, the brush is used for separating the silicon wafer at the top of the silicon wafer stacking material from the stacking material, meanwhile, the air nozzle is used for separating the topmost silicon wafer from the silicon wafer adjacent to the lower part to form a buffer area, when the vacuum chuck moves downwards to adsorb the silicon wafer, a downward-pressing buffer area exists, so that the silicon wafers are prevented from being crushed by extrusion, and the silicon wafers are automatically and orderly separated and output one by one;
(2) according to the invention, the silicon wafer stacking material placed on the supporting component is limited and protected by the limiting mechanism, so that the silicon wafer keeps better verticality, when the silicon wafer is output, the output positions of the silicon wafer are the same, the sizes of the contact parts of the silicon wafer and the brushes on the two sides are the same, and the obtained friction force is also the same;
(3) the limiting rod in the limiting mechanism designed by the invention can synchronously move outwards or inwards to adapt to silicon wafers with different sizes, the movement can be realized by driving the limiting guide disc to rotate through the handle, the structure is ingenious, and the rotation of the limiting guide disc can also realize visual adjustment through the pointer and the scales;
(4) according to the invention, after the limiting rods in the designed limiting mechanism are adjusted in place, synchronous fixing and limiting of the four limiting rods can be realized directly through a group of locking assemblies, so that the structure of the limiting mechanism is greatly simplified;
(5) the invention can realize the sliding of the workbench through the sliding driving piece, so that when the silicon wafer is transferred to the supporting component, the workbench can be moved to one side to supplement the silicon wafer, the operation space is large, the silicon wafer is more easily supplemented, and the condition of breaking the silicon wafer is avoided.
In conclusion, the automatic feeding device has the advantages of ingenious structure, good silicon wafer feeding integrity, high automation degree and the like, and is particularly suitable for the technical field of automatic feeding before silicon wafer cleaning.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic side view of the present invention;
FIG. 3 is a partial schematic view of the present invention;
FIG. 4 is a schematic view of an electric slide unit according to the present invention;
FIG. 5 is a schematic perspective view of a spacing mechanism according to the present invention;
FIG. 6 is a schematic perspective view of the dispensing mechanism of the present invention;
FIG. 7 is a schematic top view of the spacing mechanism of the present invention;
FIG. 8 is a perspective view of the sliding assembly of the present invention;
FIG. 9 is a perspective view of the locking assembly of the present invention;
FIG. 10 is a schematic structural diagram of a second embodiment of the present invention;
fig. 11 is a schematic perspective view of the discharge handle of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
The first embodiment is as follows:
as shown in fig. 1 to 6, an automatic slicing and feeding mechanism for silicon wafers comprises:
the device comprises an installation rack 1, wherein a workbench 11 is arranged at the top of the installation rack 1;
the feeding mechanism 2 vertically penetrates through the workbench 11, is mounted on the mounting rack 1, and comprises a supporting component 21 and a lifting component 22, wherein silicon wafers 20 are stacked on the top of the supporting component 21, and the lifting component 22 drives the silicon wafers 20 to lift;
the limiting mechanism 3 is arranged on the workbench 11, is arranged around the supporting component 21 and comprises a plurality of limiting rods 31 arranged in a parallel sliding manner, and a material area 30 for stacking the silicon wafers 20 is formed between the limiting rods 31; and
and the layering mechanism 4 is installed at the top of the material area 30, and distributes the silicon wafers 20 positioned at the top of the material area 30, so that the silicon wafers 20 at the top of the material area 30 and the silicon wafers 20 adjacent below the silicon wafers 20 form a buffer area 40.
As shown in fig. 5, a work table 11 is slidably disposed on the mounting frame 1, and is driven to slide by a slide driving member 10 located therebelow.
It should be noted that the automatic slicing and feeding mechanism for silicon wafers of the present invention is applied to an automatic feeding mechanism before cleaning after silicon wafers are processed, and a robot arm equipped with a vacuum chuck needs to clean the silicon wafers in a cleaning tank after the silicon wafers are adsorbed and transferred one by one, and directly adsorb the silicon wafers through the vacuum chuck, during the adsorption process, the pressure generated by the vacuum chuck at the moment of adsorption is easy to cause the silicon wafer to be broken, therefore, in order to ensure the integrity of the silicon wafer in the process of being absorbed by the vacuum chuck, the invention separates the silicon wafer lifted by the feeding mechanism 2 by using the layering mechanism 4, so that a buffer zone 40 is formed between the silicon wafer 20 output from the topmost layer and the next adjacent silicon wafer 20, when the vacuum chuck adsorbs the silicon wafer 20, the pressing down of the vacuum chuck can be buffered by the buffer area 20, and the silicon wafer 20 being discharged and the silicon wafer 20 being fed therebelow are prevented from being broken.
In addition, the worktable 11 of the invention can be pushed by the sliding driving component 10, so that after the silicon wafer on the supporting component 21 is completely output, the worktable can be moved to a space with a relatively wide space to supplement the silicon wafer, and the collision damage of the narrow space to the silicon wafer is avoided, wherein the sliding driving component 10 can be an air cylinder or a hydraulic cylinder, and is not limited to the air cylinder and the hydraulic cylinder.
As shown in fig. 2, as a preferred embodiment, the support assembly 21 includes:
the mounting plate 211 is horizontally arranged, is connected with the lifting assembly 22 and is driven by the lifting assembly 22 to vertically lift; and
and a plurality of support rods 212 are vertically arranged on the mounting plate 211, the support rods 212 are circumferentially arranged at equal intervals along the lifting direction of the mounting plate 211, and the top of each support rod 212 is matched to form a placing platform 213 for placing the silicon wafer 20.
It should be noted that, in the present invention, the number of the supporting rods 212 is preferably 4, the tops of the supporting rods 212 are arranged flatly, and cooperate to form the placing platform 213, and the silicon wafers 20 are stacked on the placing platform 213.
As shown in fig. 3 and 4, as a preferred embodiment, the lifting assembly 22 includes:
an electric sliding table unit 221, wherein the electric sliding table unit 221 is vertically arranged on the installation rack 1, a sliding table 222 is arranged on the electric sliding table unit 221, and the sliding table 222 is arranged in a sliding manner along the vertical direction;
and the sliding table bottom plate 223 is connected with the sliding table 222, moves synchronously with the sliding table 222 and is connected with the supporting assembly 21.
It should be noted that the lifting assembly 22 drives the sliding table bottom plate 223 to move up and down along the vertical direction through the electric sliding table unit 221, so that the silicon wafers 20 stacked on the placing platform 213 can be transported upward, and when the top silicon wafer 20 contacts the brush in the layering mechanism 4, the lifting assembly 22 drives the silicon wafer 20 to move up and down for 2-5 times, so that the silicon wafer 20 is fully contacted with the brush.
It should be noted that, during the process of outputting the silicon wafer 20, the sensor 214 is installed on the worktable 21, the sensor 214 senses whether the silicon wafer 20 is conveyed to the output position according to the principle of light penetration, and the sensor 214 controls the lifting assembly 22 to drive the silicon wafer 20 to move up and down in a reciprocating manner for 2-5 times in a small amplitude, so that a gap is formed between the topmost silicon wafer 20 and the lower silicon wafer 20, and then the air is sprayed by the air nozzle 42.
As shown in fig. 5, 6 and 7, as a preferred embodiment, the limiting mechanism 3 further includes:
the limiting guide disc 32 is rotatably mounted on the workbench 11, a handle 33 is connected to the limiting guide disc 32, waist grooves 34 which are arranged at equal intervals on the circumference are formed in the limiting guide disc 32, the waist grooves 34 are arranged in one-to-one correspondence with the limiting rods 31, and the tops of the limiting rods 31 penetrate through the waist grooves 34; and
and the sliding assembly 35 is arranged on the workbench 11, and the sliding assembly 35 and the limiting rods 31 are arranged in a one-to-one correspondence manner and connected with the bottoms of the limiting rods 31.
Furthermore, an adjusting pointer 36 is arranged on the limiting guide disc 32, and an adjusting scale 111 is arranged on the workbench 11 opposite to the adjusting pointer 36.
As shown in fig. 8, further, the sliding assembly 35 includes:
the sliding rail 351 is mounted on the workbench 11 and points to the center of the limiting guide disc 32; and
and the sliding block 352 is slidably mounted on the sliding rail 351 and is connected with the bottom of the limiting rod 31.
As shown in fig. 9, a locking assembly 37 is disposed at any of the sliders 352, and the locking assembly 37 includes:
the locking block 371 is integrally connected with the sliding block 352 adjacent to the locking block 371, and a contact pin 372 which vertically slides is arranged on the locking block 371; and
and the locking block 373 is arranged right below the locking block 371, and is provided with a plurality of insertion holes 374 correspondingly matched with the pins 372.
In order to limit the silicon wafers 20 placed on the placing platform 213, the silicon wafers 20 are limited by the limiting rods 31 by arranging 4 parallel limiting rods 31 around the silicon wafers 20, so as to form the material area 30 of the stacked silicon wafers 20.
Further, in order to better place the silicon wafers 20 in the material area 30, the limiting rods 31 are arranged to be adjustable in a sliding mode, all the limiting rods 31 are synchronously driven to move and adjust through the waist grooves 34 on the limiting guide discs 32, the space of the material area 30 is adjusted, when the material area 30 is enlarged, the silicon wafers 20 can be easily placed, and when the material area 30 is reduced, the whole stack of the silicon wafers 20 is limited.
It is further noted that the material region 30 can be adjustably configured and can also be adapted to various sizes of silicon wafers 20.
When the size of the material area 30 is adjusted by rotating the limiting guide disc 32, the pointer 36 on the limiting guide disc 32 and the adjusting scale 111 on the workbench 11 can be used for accurately adjusting the size of the material area 30, and after the material area is adjusted in place, the inserting pin 372 is directly inserted into the inserting hole 374 and locked.
As shown in fig. 6, as a preferred embodiment, the layering mechanism 4 includes:
the brushes 41 are symmetrically arranged at two sides of the material area 30 and are abutted against the silicon wafer 20 at the top of the material area 30; and
and the air nozzles 42 are arranged on one side of the material area 30, and are positioned between the symmetrically arranged hairbrushes 41.
It should be noted that, the silicon wafer 20 at the topmost part of the silicon wafer stacking material is driven by the lifting assembly 22 to contact with the brush 41 during the lifting and lowering processes, because the silicon wafer 20 has light weight, under the friction action of the brush 41, the topmost silicon wafer 20 is separated from the adjacent silicon wafer 20 to form a gap, and the air nozzle 42 is communicated with an external air supply source, and just introduces air into the gap to expand the gap and form the buffer area 40, so that the silicon wafer 20 is separated from the adjacent silicon wafer 20 below the gap.
It is further noted that when the topmost silicon wafer 20 is sucked by the vacuum chuck, the pressure applied to the silicon wafer 20 by the vacuum chuck is released by the buffer area 40, and the gas in the buffer area 40 is exhausted to the periphery without any influence on the silicon wafer 20 below.
Example two:
FIG. 10 is a schematic structural view of a second embodiment of an automatic slicing and feeding mechanism for silicon wafers according to the present invention; as shown in fig. 10, in which the same or corresponding components as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, only the points different from the first embodiment will be described below for the sake of convenience. The second embodiment is different from the first embodiment shown in fig. 1 in that:
as shown in fig. 10 and fig. 11, an automatic slicing and feeding mechanism for silicon wafers, wherein a buffer mechanism 5 is disposed on one side of the limiting mechanism 3, and the buffer mechanism 5 is disposed on the working table 11, and comprises:
a blanking container 51, wherein the blanking container 51 contains buffer liquid;
the discharging handle 52 is placed in the blanking container 51, and the discharging handle 52 is detachably arranged; and
and an overflow container 53, wherein the overflow container 53 is disposed directly below the lower container 51, and the overflow of the lower container 51 is transferred into the overflow container 53 by an overflow pipe 54 connected to the top of the overflow container 53 in the lower container 51.
After the silicon wafer 20 is cleaned, the vacuum chuck sucks the silicon wafer 20 again, the silicon wafer 20 is transferred into the unloading container 51 and buffered, and the buffer liquid in the unloading container 51 buffers the silicon wafer 20 placed therein, so that the falling impact force is removed, and the silicon wafer 20 is prevented from being broken by rigid contact.
Further, the silicon wafers 20 are loaded on the discharge handles 52 arranged in the blanking container 51, the silicon wafers 20 all fall on the discharge handles 52 when falling into the blanking container 51, and after the discharge handles 52 are fully stacked with the silicon wafers 20, the silicon wafers 20 can be completely lifted out of the blanking container 51 by directly lifting the discharge handles 52.
Further, when the silicon wafer 20 falls into the lower tank 51, the buffer liquid overflows, and the overflowing buffer liquid enters the overflow tank 53 through the overflow pipe 54 and is retained.
The working process is as follows:
according to the invention, the silicon wafer 20 positioned at the topmost part of the silicon wafer stacking material is driven by the lifting assembly 22 to contact the brush 41 in the lifting and descending processes, because the silicon wafer 20 is light in weight, the topmost silicon wafer 20 is separated from the adjacent silicon wafer 20 under the friction action of the brush 41 to form a gap, the sensor 214 senses whether the silicon wafer 20 is conveyed to an output position or not according to the light penetration principle, and the sensor 214 controls the air injection of the air injection nozzle 42 in the layering mechanism 4 to inject air into the gap to expand the gap, and simultaneously, the buffer area 40 is formed to separate the silicon wafer 20 from the adjacent silicon wafer 20 below the gap.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. An automatic burst feed mechanism of silicon wafer, its characterized in that includes:
the device comprises an installation rack (1), wherein a workbench (11) is arranged at the top of the installation rack (1);
the feeding mechanism (2) vertically penetrates through the workbench (11), is installed on the installation rack (1) and comprises a supporting component (21) and a lifting component (22), silicon wafers (20) are stacked on the top of the supporting component (21), and the lifting component (22) drives the silicon wafers (20) to lift;
the limiting mechanism (3) is arranged on the workbench (11), is arranged around the supporting component (21) and comprises a plurality of limiting rods (31) arranged in a parallel sliding manner, and a material area (30) for stacking the silicon wafers (20) is formed between the limiting rods (31); and
layering mechanism (4), layering mechanism (4) install in the top of material district (30), it is allocated and is located silicon wafer (20) at material district (30) top makes silicon wafer (20) at material district (30) top are adjacent rather than below silicon wafer (20) form buffer area (40), layering mechanism (4) include brush (41) and air nozzle (42), brush (41) symmetry set up in the both sides of material district (30), its with material district (30) top silicon wafer (20) conflict the setting, air nozzle (42) set up in one side of material district (30), it is located the symmetry and sets up between brush (41).
2. An automatic slicing and feeding mechanism for silicon wafers as claimed in claim 1, wherein a work table (11) is slidably mounted on said mounting frame (1) and is driven to slide by a slide driving member (10) located therebelow.
3. An automatic slicing and feeding mechanism for silicon wafers as claimed in claim 1, wherein said supporting member (21) comprises:
the mounting plate (211) is horizontally arranged, is connected with the lifting assembly (22) and is driven by the lifting assembly (22) to lift and fall along the vertical direction; and
the supporting rods (212) are vertically arranged on the mounting plate (211), the supporting rods (212) are arranged at equal intervals along the circumference of the lifting direction of the mounting plate (211), and the top of each supporting rod (212) is matched to form a placing platform (213) for placing the silicon wafer (20).
4. An automatic slicing and feeding mechanism for silicon wafers as claimed in claim 1, wherein said lifting assembly (22) comprises:
the electric sliding table unit (221), the electric sliding table unit (221) is vertically arranged on the installation rack (1), a sliding table (222) is arranged on the electric sliding table unit, and the sliding table (222) is arranged in a sliding mode along the vertical direction;
the sliding table bottom plate (223) is connected with the sliding table (222), moves synchronously with the sliding table (222), and is connected with the supporting assembly (21).
5. An automatic slicing and feeding mechanism for silicon wafers as claimed in claim 1, wherein said limiting mechanism (3) further comprises:
the limiting guide disc (32) is rotatably mounted on the workbench (11), a handle (33) is connected onto the limiting guide disc (32), waist grooves (34) which are arranged in an equidistant mode in the circumference are formed in the limiting guide disc (32), the waist grooves (34) are arranged in one-to-one correspondence with the limiting rods (31), and the tops of the limiting rods (31) penetrate through the waist grooves (34); and
the sliding assembly (35) is in one-to-one correspondence with the limiting rods (31), installed on the workbench (11), and connected with the bottoms of the limiting rods (31).
6. The automatic slicing and feeding mechanism of silicon wafers as claimed in claim 5, wherein said spacing guiding disc (32) is provided with an adjusting pointer (36), and said worktable (11) facing said adjusting pointer (36) is provided with an adjusting scale (111).
7. An automatic slicing and feeding mechanism for silicon wafers as claimed in claim 5, wherein said slide assembly (35) comprises:
the sliding rail (351) is mounted on the workbench (11) and points to the circle center of the limiting guide disc (32); and
the sliding block (352) is mounted on the sliding rail (351) in a sliding mode, and the sliding block (352) is connected with the bottom of the limiting rod (31).
8. An automatic slicing and feeding mechanism for silicon wafers as claimed in claim 7, wherein a locking assembly (37) is provided at any of said sliders (352), the locking assembly (37) comprising:
the locking block (371) is integrally connected with the sliding block (352) adjacent to the locking block (371), and a vertically sliding contact pin (372) is arranged on the locking block (371); and
the locking block (373), the locking block (373) is set up under the locking block (371), there are several jacks (374) that correspond to the said contact pin (372) on it.
9. An automatic slicing and feeding mechanism for silicon wafers as claimed in claim 1, wherein a buffer mechanism (5) is provided at one side of the limiting mechanism (3), the buffer mechanism (5) is provided on the working table (11), which comprises:
the blanking device comprises a blanking container (51), wherein buffer liquid is contained in the blanking container (51);
the discharging handle (52), the discharging handle (52) is placed in the blanking container (51), and the discharging handle is detachably arranged; and
and the overflow container (53), the overflow container (53) is arranged right below the blanking container (51), and the blanking container (51) transfers the overflow liquid of the blanking container (51) into the overflow container (53) through an overflow pipe (54) communicated with the top of the overflow container (53).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910327227.XA CN109979870B (en) | 2019-04-23 | 2019-04-23 | Automatic burst feed mechanism of silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910327227.XA CN109979870B (en) | 2019-04-23 | 2019-04-23 | Automatic burst feed mechanism of silicon wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109979870A CN109979870A (en) | 2019-07-05 |
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| CN117533798A (en) * | 2023-11-27 | 2024-02-09 | 江苏富乐华功率半导体研究院有限公司 | Automatic ceramic chip frame stacking machine with rotary micro-motion separation function |
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| JP5505384B2 (en) * | 2011-08-04 | 2014-05-28 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and storage medium |
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Denomination of invention: Automatic silicon wafer separating and feeding mechanism Effective date of registration: 20200430 Granted publication date: 20200407 Pledgee: Changxin Zhejiang rural commercial bank Limited by Share Ltd Pledgor: ZHEJIANG GMECHANICAL AUTOMATION SYSTEM Co.,Ltd. Registration number: Y2020330000205 |