CN109979870A - A kind of silicon wafer auto plate separation feed mechanism - Google Patents
A kind of silicon wafer auto plate separation feed mechanism Download PDFInfo
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- CN109979870A CN109979870A CN201910327227.XA CN201910327227A CN109979870A CN 109979870 A CN109979870 A CN 109979870A CN 201910327227 A CN201910327227 A CN 201910327227A CN 109979870 A CN109979870 A CN 109979870A
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- workbench
- feed mechanism
- sliding
- separation feed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention provides a kind of silicon wafer auto plate separation feed mechanisms, it includes the top setting workbench of installation frame, the feeding mechanism of workbench is penetrated vertically, feeding mechanism includes support component and lifting assembly, around the position-limit mechanism of support component setting, with the lamination mechanism being installed at the top of the material area that position-limit mechanism is formed, its silicon wafer stacking material for cooperating lifting assembly that oscilaltion is driven to be arranged by hairbrush, the silicon wafer at the top of silicon wafer stacking material is separated with stacking material using hairbrush, air nozzle is utilized simultaneously, make to separate to form buffer area between the silicon wafer of the top and the adjacent silicon wafer in lower section, when vacuum chuck being made to move down absorption silicon wafer, the buffering section pushed there are one, avoid the attrition crushing between silicon wafer, solves the frangible technical problem that is pressurized when silicon wafer crawl, it is automatic to realize silicon wafer, one by one Orderly sub-material and output.
Description
Technical field
The present invention relates to silicon wafer automatic charging machinery technical field, specially a kind of silicon wafer auto plate separation feeder
Structure.
Background technique
Silicon wafer can be widely used in the technologies such as semiconductor, solar battery as a kind of good conductive material
Field.The processing technology later period of silicon wafer generally require carry out chamfering, grinding, burn into polishing and cleaning and etc., wherein cleaning
Refer to the impurity for carrying out liquid rinse removal silicon wafer surface to the silicon wafer for completing processing, silicon wafer surface is avoided to draw
Situations such as trace, rupture, therefore it is very important a processing step.
However silicon wafer cleaning machine in the prior art, it operates more complicated, needs manually to be placed in silicon wafer
It is cleaned in rinse bath, and silicon wafer is frangible, during artificial transfer, is easily crushed because of the reason of being affectedly bashful dynamics appearance
It happens, and artificial transfer velocity is slow, working efficiency is low, but uses mechanical crawl, is such as adsorbed, is being inhaled using vacuum chuck
In attached process, silicon wafer can be squeezed, silicon wafer is caused to rupture.
To disclose a kind of silicon wafer fixed from fragment transmission application No. is the Chinese patent of CN201811292666.3 for Chinese invention
Position system, including mounting rack, charging hoister structure, separating mechanism, transmission mechanism and make concentric mechanism by oneself, the setting of charging hoister structure
In on mounting rack, the film magazine that charging hoister structure is used to that internal stacking to be driven to be placed with several silicon wafers is moved up；Separating mechanism
Separating mechanism is set to the rear side of the charging hoister structure；Transmission mechanism is set to the rear of the separating mechanism；It is self-centering
Mechanism is set to the top of transmission mechanism one end；Silicon wafer is formed by setting charging hoister structure and on silicon wafer bearing table to stack
Area, several silicon wafers are stacked in silicon wafer stack region naturally and carry out being moved to from bottom to top below separating mechanism, separating mechanism with
Silicon wafer carry out contact realize silicon wafer auto plate separation, while by transmission mechanism one by one continous way be transmitted to it is self-centering realization make by oneself
The heart.
But above-mentioned patent directly passes through sebific duct and the friction of silicon wafer and exports silicon wafer fragment, the easily rotation of sebific duct
Transduction causes silicon wafer broken.
Summary of the invention
In view of the above problems, being cooperated by hairbrush and being risen the present invention provides a kind of silicon wafer auto plate separation feed mechanism
Part of coming down to a lower group drives the silicon wafer stacking material of oscilaltion setting, makes the silicon wafer and stacking at the top of silicon wafer stacking material using hairbrush
Material separation, while air nozzle is utilized, make to separate to form buffer area between the silicon wafer of the top and the adjacent silicon wafer in lower section, make
When vacuum chuck moves down absorption silicon wafer, the buffering section pushed there are one avoids the attrition crushing between silicon wafer, solves
Be pressurized frangible technical problem when silicon wafer crawl, realizes automatic silicon wafer, orderly sub-material one by one and output.
To achieve the above object, the invention provides the following technical scheme:
A kind of silicon wafer auto plate separation feed mechanism, comprising:
Installation frame is provided with workbench at the top of the installation frame；
Feeding mechanism, the feeding mechanism penetrate the workbench vertically, are installed on the installation frame comprising branch
Support component and lifting assembly, the stacked on top of the support component place silicon wafer, and the lifting assembly drives the silicon wafer
Lifting；
Position-limit mechanism, the position-limit mechanism are set on the workbench, are arranged around the support component, and it is wrapped
The gag lever post of several parallel sliding settings is included, forms the material area for stacking the silicon wafer between the gag lever post；And
Lamination mechanism, the lamination mechanism are installed on the top in the material area, allocate at the top of the material area
Silicon wafer, so that silicon wafer at the top of the material area is formed buffer area with the adjacent silicon wafer below.
As an improvement, workbench is slideably positioned on the installation frame, driven by the sliding actuator being disposed below
Dynamic sliding.
As an improvement, the support component includes:
Mounting plate, the mounting plate is horizontally disposed, connect with the lifting assembly, and it is driven by the lifting assembly
Lifting setting along the vertical direction；And
Support rod, several support rods are vertically arranged on the mounting plate, and the support rod is along the mounting plate
Lifting direction circumference be placed equidistant with, and the placement platform for placing the silicon wafer is cooperatively formed at the top of the support rod.
As an improvement, the lifting assembly includes:
Electronic slide unit unit, the electronic slide unit unit is vertically arranged on the installation frame, and is provided with cunning
Dynamic slide unit, the slide unit slide setting along the vertical direction；
Slide unit bottom plate, the slide unit bottom plate are connect with the slide unit, with the slide unit synchronizing moving, and described in its connection
Support component.
As an improvement, the position-limit mechanism further include:
Limition orientation disk, the limition orientation disk rotational installation are connected with handle, and thereon on the workbench thereon
It is provided with the gain of circumference equidistant arrangement, which is arranged in a one-to-one correspondence with the gag lever post, and wears at the top of the gag lever post
Cross the gain；And
Slide assemblies, the slide assemblies are arranged in a one-to-one correspondence with the gag lever post, are installed on the workbench up,
And it connect with the bottom of the gag lever post.
As an improvement, being provided with adjusting pointer on the limition orientation disk, the workbench of pointer is adjusted described in face
On be provided with adjusting scale.
As an improvement, the slide assemblies include:
Sliding rail, the sliding rail are installed on the workbench, are directed toward the limition orientation disk center of circle；And
Sliding block, the sliding block are slidably mounted on the sliding rail, are connect with the bottom of the gag lever post.
As an improvement, being provided with locked component at any sliding block, which includes:
Closing piece, its immediate sliding block integrally connected setting of the closing piece, is provided with the contact pin of vertical sliding；
And
Clamping block, the clamping block are set to the underface of the closing piece, are provided with and the contact pin corresponding matching
Several jacks.
As an improvement, the lamination mechanism includes:
Hairbrush, the hairbrush are symmetrically disposed on the two sides in the material area, with the silicon wafer at the top of the material area
Piece contradicts setting；And
Air nozzle, the air nozzle are set to the side in the material area, between the symmetrically arranged hairbrush.
As an improvement, the side of the position-limit mechanism is provided with cache mechanism, which is set to the workbench
On comprising:
Lower material container is contained with buffering liquid in the lower material container；
Discharge handle, and the discharging handle is placed in the lower material container, detachable to be arranged；And
Spilling water container, the spilling water container are set to the underface of the lower material container, the lower material container by with its
The lower material container is overflowed wind liquid and is transferred in the spilling water container by the overflow pipe of top connection.
The beneficial effects of the present invention are:
(1) present invention cooperates lifting assembly to drive the silicon wafer stacking material of oscilaltion setting by hairbrush, utilizes hairbrush
It separates the silicon wafer at the top of silicon wafer stacking material with stacking material, while utilizing air nozzle, make silicon wafer and the lower section of the top
Separation forms buffer area between adjacent silicon wafer, and when vacuum chuck being made to move down absorption silicon wafer, there are the bufferings of a pushing
Section avoids the attrition crushing between silicon wafer, realizes automatic silicon wafer, orderly sub-material one by one and output；
(2) present invention is by carrying out limit guarantor to the silicon wafer stacking material being placed in support component using position-limit mechanism
Shield makes silicon wafer keep preferable verticality, and when export silicon wafer, the output position of silicon wafer is all the same, make silicon wafer and
The size of the contact site of two sides hairbrush is consistent, and the frictional force size of acquisition is also identical；
(3) gag lever post in the position-limit mechanism that the present invention designs can synchronize outer shifting or interior shifting, to adapt to various differences
Size silicon wafer, and movement drives limition orientation disc spins to achieve that by handle, clever structure, and limition orientation disk
Rotation can also realize visual adjust by pointer and scale；
(4) present invention directly passes through one group of locked component using the gag lever post in the position-limit mechanism of design after adjusting in place
Can realize four gag lever posts synchronizes fixed limit, greatly simplified the structure of position-limit mechanism；
(5) sliding of workbench may be implemented by sliding actuator in the present invention, is transferred to silicon wafer in support component
When, movable workbench to side can be carried out to the supplement of silicon wafer, operating space is big, it is easier to supplement silicon wafer, avoid
Break up silicon wafer situation.
In conclusion the present invention has many advantages, such as that clever structure, silicon wafer feeding integrality be good, high degree of automation, especially
Automatic charging technical field before being cleaned it is suitable for silicon wafer.
Detailed description of the invention
Fig. 1 is schematic diagram of the three-dimensional structure；
Fig. 2 is side structure schematic view of the present invention；
Fig. 3 is partial structural diagram of the present invention；
Fig. 4 is the electronic slide unit cellular construction schematic diagram of the present invention；
Fig. 5 is position-limit mechanism schematic perspective view of the present invention；
Fig. 6 is that the present invention allocates mechanism schematic perspective view；
Fig. 7 is position-limit mechanism overlooking structure diagram of the present invention；
Fig. 8 is slide assemblies schematic perspective view of the present invention；
Fig. 9 is locked component schematic perspective view of the present invention；
Figure 10 is two structural schematic diagram of the embodiment of the present invention；
Figure 11 is present invention discharging handle schematic perspective view.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, rather than the equipment of indication or suggestion meaning or element must have a particular orientation, with spy
Fixed orientation construction and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
Embodiment one:
As shown in Figure 1 to Figure 3, a kind of silicon wafer auto plate separation feed mechanism, comprising:
The top of installation frame 1, the installation frame 1 is provided with workbench 11；
Feeding mechanism 2, the feeding mechanism 2 penetrate the workbench 11 vertically, are installed on the installation frame 1,
Including support component 21 and lifting assembly 22, the stacked on top of the support component 21 places silicon wafer 20, the lifting assembly
The 22 driving silicon wafers 20 are lifted；
Position-limit mechanism 3, the position-limit mechanism 3 are set on the workbench 11, are arranged around the support component 21,
And it includes the gag lever post 31 of several parallel sliding settings, forms the material for stacking the silicon wafer 20 between the gag lever post 31
Area 30；And
Lamination mechanism 4, the lamination mechanism 4 are installed on the top in the material area 30, allocate positioned at the material area
The silicon wafer 20 at 30 tops forms the silicon wafer 20 at 30 top of material area and the silicon wafer 20 adjacent below slow
Rush area 40.
As shown in Figure 5, wherein workbench 11 is slideably positioned on the installation frame 1, by the sliding being disposed below
The driving sliding of actuator 10.
It should be noted that silicon wafer auto plate separation feed mechanism of the invention be apply to silicon wafer complete processing it is laggard
The mechanism of automatic charging before row cleaning, be equipped with vacuum chuck manipulator need one by one by silicon wafer absorption migration
It is cleaned in rinse bath afterwards, and silicon wafer is directly adsorbed by vacuum chuck, in adsorption process, vacuum chuck is in absorption wink
Between the pressure that generates easily cause silicon wafer broken, therefore, in order to guarantee silicon wafer by complete in vacuum chuck adsorption process
Whole property, the present invention is by being separated the silicon wafer that feeding mechanism 2 jacks using lamination mechanism 4, the silicon for exporting top
One section of buffer area 40 is formed between chip 20 and next adjacent silicon wafer 20, it, can be with when vacuum chuck adsorbs silicon wafer 20
The pushing of vacuum chuck is buffered by buffer area 20, the silicon wafer 20 of the silicon wafer 20 and lower section charging that avoid output is broken
It is broken.
In addition, the workbench 11 in the present invention can be pushed by sliding actuator 10, make in support component 21
After silicon wafer exports completely, it can be moved to progress silicon wafer supplement in the more spacious space in side, avoid narrow space to silicon
The impact wreckage of chip, wherein sliding actuator 10 can be cylinder either hydraulic cylinder, certainly, be also not only limited to cylinder with
Hydraulic cylinder.
As shown in Fig. 2, as a preferred embodiment, the support component 21 includes:
Mounting plate 211, the mounting plate 211 are horizontally disposed, connect with the lifting assembly 22, and it is by the lifting
The driving of component 22 lifting setting along the vertical direction；And
Support rod 212, several support rods 212 are vertically arranged on the mounting plate 211, the support rod 212
Lifting direction circumference along the mounting plate 211 is placed equidistant with, and the top of the support rod 212 cooperatively forms and places the silicon wafer
The placement platform 213 of piece 20.
It should be noted that the quantity of support rod 212 is preferably 4 in the present invention, the upper flat of support rod 212 is set
It sets, cooperatively forms placement platform 213, silicon wafer 20 is stacked on placement platform 213.
As shown in Figure 3 and Figure 4, as a preferred embodiment, the lifting assembly 22 includes:
Electronic slide unit unit 221, the electronic slide unit unit 221 is vertically arranged on the installation frame 1, and is set thereon
It is equipped with the slide unit 222 of sliding, which slides setting along the vertical direction；
Slide unit bottom plate 223, the slide unit bottom plate 223 are connect with the slide unit 222, with 222 synchronizing moving of slide unit,
And it connects the support component 21.
It should be noted that lifting assembly 22 drives slide unit bottom plate 223 to rise along the vertical direction by electronic slide unit unit 221
The mobile setting of drop, is delivered up stacking in the silicon wafer 20 on placement platform 213, and touches in the silicon wafer of top 20
When encountering the hairbrush in lamination mechanism 4, lifting assembly 22 will drive silicon wafer 20 and move back and forth up and down 2-5 times, make silicon wafer 20
It is adequately contacted with hairbrush.
Wherein, it is notable that during silicon wafer 20 exports, inductor 214 is installed on workbench 21,
Whether the principle induction silicon wafer 20 that inductor 214 is penetrated by light is transported on the position of output, and inductor 214 controls
Lifting assembly 22 drives the moving back and forth up and down 2-5 times by a small margin of silicon wafer 20, makes the silicon wafer 20 of top and the silicon of lower section
Chip 20 forms gap, later the jet of air nozzle 42.
As shown in Fig. 5, Fig. 6 and Fig. 7, as a preferred embodiment, the position-limit mechanism 3 further include:
Limition orientation disk 32, the rotational installation of limition orientation disk 32 are connected with handle on the workbench 11 thereon
33, and it is provided with the gain 34 of circumference equidistant arrangement, which is arranged in a one-to-one correspondence with the gag lever post 31, and described
The top of gag lever post 31 passes through the gain 34；And
Slide assemblies 35, the slide assemblies 35 are arranged in a one-to-one correspondence with the gag lever post 31, are installed on the work
Platform 11 gets on, and it connect with the bottom of the gag lever post 31.
Further, it is provided on the limition orientation disk 32 and adjusts pointer 36, adjusting pointer 36 is described described in face
It is provided on workbench 11 and adjusts scale 111.
As shown in figure 8, further, the slide assemblies 35 include:
Sliding rail 351, the sliding rail 351 are installed on the workbench 11, are directed toward 32 center of circle of limition orientation disk；With
And
Sliding block 352, the sliding block 352 are slidably mounted on the sliding rail 351, are connected with the bottom of the gag lever post 31
It connects.
As shown in Figure 9, wherein be provided with locked component 37 at any sliding block 352, which includes:
Closing piece 371, its immediate 352 integrally connected of the sliding block setting of the closing piece 371, is provided with vertical cunning
Dynamic contact pin 372；And
Clamping block 373, the clamping block 373 are set to the underface of the closing piece 371, are provided with and the contact pin
Several jacks 374 of 372 corresponding matchings.
It should be noted that the present invention passes through in silicon wafer in order to limit the silicon wafer 20 being placed on placement platform 213
4 gag lever posts 31 disposed in parallel are arranged in 20 surrounding, are limited using gag lever post 31 to silicon wafer 20, form stacking silicon wafer
The material area 30 of piece 20.
It further illustrates, in order to which preferably silicon wafer 20 is placed in material area 30, the present invention will be by that will limit
Position bar 31 is set as sliding and is adjusted, and is moved by all gag lever posts 31 of 34 synchronous drive of gain on limition orientation disk 32
It is dynamic to adjust, the space in material area 30 is adjusted, when material area 30 expands, can easily be put into silicon wafer 20, and in material area
When 30 diminution, the entirety of 20 stacking of silicon wafer is limited.
It further explains, the adjustable setting in material area 30, can be applicable to the silicon wafer of various different dimensions
Piece 20.
Wherein, when adjusting the size in material area 30 by rotary stopper positioning disk 32, limition orientation disk 32 can be passed through
On pointer 36 and workbench 11 on adjusting scale 111, accurately adjust material area 30 size, adjust in place after, directly
It connects for be inserted into jack 374 contact pin 372 and lock.
As shown in fig. 6, as a preferred embodiment, the lamination mechanism 4 includes:
Hairbrush 41, the hairbrush 41 are symmetrically disposed on the two sides in the material area 30, with 30 top of material area
The silicon wafer 20 contradicts setting；And
Air nozzle 42, the air nozzle 42 are set to the side in the material area 30, are located at the symmetrically arranged hair
Between brush 41.
It should be noted that being driven in the silicon wafer 20 for being located at silicon wafer stacking material top by lifting assembly 22
It rises and is contacted during declining with hairbrush 41, due to the light weight of silicon wafer 20, under the action of hairbrush 41 rubs, top silicon wafer
Piece 20 is separated with adjacent silicon wafer 20, forms gap, and air nozzle 42 is connected to external air supply source, just in this gap
It is passed through gas, expands gap, is formed simultaneously buffer area 40, separates silicon wafer 20 with adjacent silicon wafer 20 below.
It further illustrates, for the silicon wafer 20 of top when being adsorbed by vacuum chuck, vacuum chuck acts on silicon wafer
Pressure on piece 20 can be shed by buffer area 40, and the gas in simultaneous buffering area 40 is discharged around, will not be to the silicon wafer of lower section
Piece 20 generates any influence.
Embodiment two:
Figure 10 is a kind of a kind of structural schematic diagram of the embodiment two of silicon wafer auto plate separation feed mechanism of the present invention；Such as figure
Shown in 10, wherein using appended drawing reference corresponding with embodiment one with a kind of identical or corresponding component of embodiment, risen to be easy
See, hereafter only describes the distinctive points with embodiment one.The embodiment two and embodiment one shown in FIG. 1 the difference is that:
As shown in Figure 10 and Figure 11, the side of a kind of silicon wafer auto plate separation feed mechanism, the position-limit mechanism 3 is provided with
Cache mechanism 5, the cache mechanism 5 are set on the workbench 11 comprising:
Lower material container 51 is contained with buffering liquid in the lower material container 51；
Discharge handle 52, and the discharging handle 52 is placed in the lower material container 51, detachable to be arranged；And
Spilling water container 53, the spilling water container 53 are set to the underface of the lower material container 51, the lower material container 51
By the overflow pipe 54 being connected to its top, which is overflowed into wind liquid and is transferred in the spilling water container 53.
It should be noted that vacuum chuck draws silicon wafer 20 once again, by silicon wafer 20 after silicon wafer 20 completes cleaning
It is transferred in lower material container 51, is cached, the buffering liquid in lower material container 51 buffers the silicon wafer 20 being put into, and unloads
The impact force that it falls is removed, rigid contact is avoided to keep it broken.
It further illustrates, the discharging handle 52 being arranged in lower material container 51 carries silicon wafer 20, and silicon wafer 20 is fallen
It is to fall on discharging handle 52 when in lower material container 51, after discharging handle 52 piles with silicon wafer 20, directly lifts out
Expect handle 52, so that it may all propose silicon wafer 20 out of lower material container 51.
In addition, buffering liquid can be made to overflow after falling into silicon wafer 20 in lower material container 51, by overflow pipe 54, spilling
Buffering liquid, which can enter in spilling water container 53, to be retained.
The course of work:
The present invention drives rise and fall in the silicon wafer 20 for being located at silicon wafer stacking material top, by lifting assembly 22
Cheng Zhongyu hairbrush 41 contacts, due to the light weight of silicon wafer 20, under the action of hairbrush 41 rubs, top silicon wafer 20 and phase
Adjacent silicon wafer 20 separates, and forms gap, and it is defeated whether the principle induction silicon wafer 20 that inductor 214 is penetrated by light is transported to
On position out, and the jet of air nozzle 42 makes to stitch to gas is passed through in this gap in 214 control hierarchy mechanism 4 of inductor
Gap expands, and is formed simultaneously buffer area 40, separates silicon wafer 20 with adjacent silicon wafer 20 below.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of silicon wafer auto plate separation feed mechanism characterized by comprising
Installation frame (1) is provided with workbench (11) at the top of the installation frame (1)；
Feeding mechanism (2), the feeding mechanism (2) penetrate the workbench (11) vertically, are installed on the installation frame (1)
On comprising the stacked on top of support component (21) and lifting assembly (22), the support component (21) places silicon wafer (20),
The lifting assembly (22) drives silicon wafer (20) lifting；
Position-limit mechanism (3), the position-limit mechanism (3) are set on the workbench (11), around the support component (21)
Setting, and it includes the gag lever post (31) of several parallel sliding settings, is formed between the gag lever post (31) and stacks the silicon wafer
The material area (30) of piece (20)；And
Lamination mechanism (4), the lamination mechanism (4) are installed on the top of the material area (30), allocate positioned at the material
Silicon wafer (20) at the top of area (30) makes silicon wafer (20) and the silicon wafer adjacent below at the top of the material area (30)
Piece (20) forms buffer area (40).
2. a kind of silicon wafer auto plate separation feed mechanism according to claim 1, which is characterized in that workbench (11) sliding
It is set on the installation frame (1), by sliding actuator (10) the driving sliding being disposed below.
3. a kind of silicon wafer auto plate separation feed mechanism according to claim 1, which is characterized in that the support component
(21) include:
Mounting plate (211), the mounting plate (211) are horizontally disposed, connect with the lifting assembly (22), and it is by the liter
Coming down to a lower group, lifting is arranged along the vertical direction for part (22) driving；And
Support rod (212), several support rods (212) are vertically arranged on the mounting plate (211), the support rod
(212) it is placed equidistant with along the lifting direction circumference of the mounting plate (211), and cooperatively forms and put at the top of the support rod (212)
Set the placement platform (213) of the silicon wafer (20).
4. a kind of silicon wafer auto plate separation feed mechanism according to claim 1, which is characterized in that the lifting assembly
(22) include:
Electronic slide unit unit (221), the electronic slide unit unit (221) are vertically arranged on the installation frame (1), and thereon
It is provided with the slide unit (222) of sliding, which slides setting along the vertical direction；
Slide unit bottom plate (223), the slide unit bottom plate (223) connect with the slide unit (222), synchronous with the slide unit (222)
It is mobile, and it connects the support component (21).
5. a kind of silicon wafer auto plate separation feed mechanism according to claim 1, which is characterized in that the position-limit mechanism
(3) further include:
Limition orientation disk (32), limition orientation disk (32) rotational installation are connected with hand on the workbench (11) thereon
Handle (33), and it is provided with the gain (34) of circumference equidistant arrangement, the gain (34) and the gag lever post (31) correspond
Setting, and the top of the gag lever post (31) passes through the gain (34)；And
Slide assemblies (35), the slide assemblies (35) are arranged in a one-to-one correspondence with the gag lever post (31), are installed on the work
Make platform (11) up, and it connect with the bottom of the gag lever post (31).
6. a kind of silicon wafer auto plate separation feed mechanism according to claim 5, which is characterized in that the limition orientation disk
(32) it is provided on and adjusts pointer (36), be provided with adjusting scale on the workbench (11) of adjusting pointer (36) described in face
(111)。
7. a kind of silicon wafer auto plate separation feed mechanism according to claim 5, which is characterized in that the slide assemblies
(35) include:
Sliding rail (351), the sliding rail (351) are installed on the workbench (11), are directed toward limition orientation disk (32) circle
The heart；And
Sliding block (352), the sliding block (352) are slidably mounted on the sliding rail (351), the bottom with the gag lever post (31)
Connection.
8. a kind of silicon wafer auto plate separation feed mechanism according to claim 7, which is characterized in that any sliding block
(352) locked component (37) are provided at, which includes:
Closing piece (371), its immediate sliding block (352) the integrally connected setting of the closing piece (371), it is vertical to be provided with
The contact pin (372) of sliding；And
Clamping block (373), the clamping block (373) are set to the underface of the closing piece (371), are provided with and insert with described
Several jacks (374) of needle (372) corresponding matching.
9. a kind of silicon wafer auto plate separation feed mechanism according to claim 1, which is characterized in that the lamination mechanism
(4) include:
Hairbrush (41), the hairbrush (41) are symmetrically disposed on the two sides of the material area (30), push up with the material area (30)
The silicon wafer (20) in portion contradicts setting；And
Air nozzle (42), the air nozzle (42) are set to the side of the material area (30), are located at symmetrically arranged described
Between hairbrush (41).
10. a kind of silicon wafer auto plate separation feed mechanism according to claim 1, which is characterized in that the position-limit mechanism
(3) side is provided with cache mechanism (5), which is set on the workbench (11) comprising:
Lower material container (51), the lower material container (51) is interior to be contained with buffering liquid；
It discharges handle (52), the discharging handle (52) is placed in the lower material container (51), detachable to be arranged；And
Spilling water container (53), the spilling water container (53) are set to the underface of the lower material container (51), the lower material container
(51) by the overflow pipe (54) being connected to its top, which is overflowed into wind liquid and is transferred to the spilling water container
(53) in.
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| CN201910327227.XA CN109979870B (en) | 2019-04-23 | 2019-04-23 | Automatic burst feed mechanism of silicon wafer |
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| CN201910327227.XA CN109979870B (en) | 2019-04-23 | 2019-04-23 | Automatic burst feed mechanism of silicon wafer |
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| CN109979870B CN109979870B (en) | 2020-04-07 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111633853A (en) * | 2020-06-15 | 2020-09-08 | 李海波 | Optical crystal material manufacturing process |
| CN117533798A (en) * | 2023-11-27 | 2024-02-09 | 江苏富乐华功率半导体研究院有限公司 | Automatic ceramic chip frame stacking machine with rotary micro-motion separation function |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201663151U (en) * | 2009-03-06 | 2010-12-01 | 东莞市启天自动化设备有限公司 | Full automatic silicon chip loading and unloading machine |
| US20130032179A1 (en) * | 2011-08-04 | 2013-02-07 | Tomohiro Kaneko | Substrate processing apparatus, substrate processing method and storage medium |
| US20160379855A1 (en) * | 2015-06-24 | 2016-12-29 | Tokyo Electron Limited | Storage unit, transfer apparatus, and substrate processing system |
-
2019
- 2019-04-23 CN CN201910327227.XA patent/CN109979870B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201663151U (en) * | 2009-03-06 | 2010-12-01 | 东莞市启天自动化设备有限公司 | Full automatic silicon chip loading and unloading machine |
| US20130032179A1 (en) * | 2011-08-04 | 2013-02-07 | Tomohiro Kaneko | Substrate processing apparatus, substrate processing method and storage medium |
| US20160379855A1 (en) * | 2015-06-24 | 2016-12-29 | Tokyo Electron Limited | Storage unit, transfer apparatus, and substrate processing system |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111633853A (en) * | 2020-06-15 | 2020-09-08 | 李海波 | Optical crystal material manufacturing process |
| CN117533798A (en) * | 2023-11-27 | 2024-02-09 | 江苏富乐华功率半导体研究院有限公司 | Automatic ceramic chip frame stacking machine with rotary micro-motion separation function |
| CN117533798B (en) * | 2023-11-27 | 2024-06-28 | 江苏富乐华功率半导体研究院有限公司 | Automatic ceramic chip frame stacking machine with rotary micro-motion separation function |
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| CN109979870B (en) | 2020-04-07 |
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Denomination of invention: Automatic silicon wafer separating and feeding mechanism Effective date of registration: 20200430 Granted publication date: 20200407 Pledgee: Changxin Zhejiang rural commercial bank Limited by Share Ltd Pledgor: ZHEJIANG GMECHANICAL AUTOMATION SYSTEM Co.,Ltd. Registration number: Y2020330000205 |