CN209021793U - A kind of full-automatic silicon wafer chamfer machining equipment - Google Patents

Abstract

The utility model provides a kind of full-automatic silicon wafer chamfer machining equipment, the full-automatic silicon wafer chamfer machining equipment is by fragment feeding device and transmits Self-centering device and realizes the monolithic fragment of silicon wafer stacked and self-centering, the silicon wafer of self-centering completion is grabbed and realized under the movement of silicon dice transfer device from grabbing device later and carries out film releasing on facing attachment, and realized on facing attachment take piece from automatic fetching device after the chamfering of silicon wafer after the collection of silicon wafer is carried out into silicon wafer collection box, realize that a transfer device cooperates the processing method of more chamfering devices, human resources are saved, it solves to be not implemented in chamfering device and be fully automated, the low technical problem of working efficiency；The full-automatic silicon wafer chamfer machining technique is realized by using silicon wafer fragment process and silicon wafer positioning process, realizing the quick monolithic fragment of silicon wafer and self-centering, and using silicon wafer transport and silicon wafer film releasing and carries out chamfer machining at silicon wafer transport at most platform chamfering device.

Description

A kind of full-automatic silicon wafer chamfer machining equipment

Technical field

The utility model relates to monocrystalline silicon piece production technical field, specially a kind of full-automatic silicon wafer chamfer machining equipment.

Background technique

Monocrystalline silicon piece can be widely used in the skills such as semiconductor, solar battery as a kind of good conductive material Art field.The processing technology later period of monocrystalline silicon piece generally require carry out chamfering, grinding, burn into polishing and cleaning and etc., wherein Chamfering refers to that the sharp keen side finishing of the chip that will be cut into is in the arc-shaped, prevents Waffer edge rupture and lattice defect from generating, therefore be A very important processing step.

However monocrystalline silicon piece beveler in the prior art, it operates more complicated, once can only generally process one Workpiece, needs continually clamping workpiece, and processing efficiency is very low；In addition, cannot achieve the sight of a processing effect in process It surveys, the effect for processing preceding cutter positioning can not be satisfactory, and the chamfered of monocrystalline silicon piece is caused to tend not to reach expectation Precision.

In the Chinese patent of Patent No. CN201610892031.1, a kind of automation monocrystalline silicon piece chamfering dress is disclosed It sets, including workbench, rotating base, rotary drive motor and grinding wheel chamfering component, is provided with several stations on workbench, Each station is provided with a clamping component, and workbench is set to above rotating base, and rotary drive motor is connected with rotating base Connect, each clamping component include two clamping bars and with one-to-one two springs of clamping bar, spring one end be connected to pair The clamping bar answered, the other end of spring is connected on the workbench in the outside of corresponding clamping bar, and the other end of spring is set It is equipped with tension sensor, tension sensor is connected with rotary drive motor, and grinding wheel chamfering component can front and back relative to workbench Mobile, using this kind of device, by setting rotating base, workbench and multiple stations above, a piece uploading be can be set Multiple monocrystalline silicon pieces reduce the operating procedure of staff to realize that multiple workpiece are processed in a piece installing.

But above-mentioned patent does not fully achieve the full-automation of monocrystalline silicon piece chamfering, it is desirable for carrying out the chamfering of silicon wafer Manually silicon wafer is placed in machine table, it is still necessary to manually operated, it is time-consuming and laborious, and its only one chamfering work Position, working efficiency are low.

Utility model content

In view of the above problems, the utility model provides a kind of full-automatic silicon wafer chamfer machining equipment, by fragment It is self-centering in the monolithic fragment and transmission process of the silicon wafer that material device and transmission Self-centering device realization stack, later by grabbing The silicon wafer of self-centering completion grab and realize under the movement of silicon dice transfer device putting on facing attachment by device Piece, and carried out carrying out silicon into silicon wafer collection box after taking piece from silicon wafer output device after the chamfering of realization silicon wafer on facing attachment The collection of piece realizes that a transfer device cooperates the processing method of more chamfering devices, has saved human resources, solves existing The technical issues of being fully automated is not implemented in technology in chamfering device.

To achieve the above object, the utility model provides the following technical solutions:

Rack；

Feeding makes bit location I by oneself, and the feeding makes one end that bit location I is installed on machine frame inside by oneself comprising:

Fragment feeding device, the fragment feeding device include the film magazine for driving internal stacking to be placed with several silicon wafers The charging hoister structure moved up and the separating mechanism being arranged on rear side of charging hoister structure；And

Transmit Self-centering device, it is described transmission Self-centering device be set to the fragment feeding device rear side and with it is described Fragment feeding device is vertically arranged, which includes transmission mechanism and make concentric mechanism by oneself, is located at film magazine the top Silicon wafer through separating mechanism by contact fricting transmissioning mode be automatically transmitted on transmission mechanism and by transmission mechanism to roll Dynamic transmission mode, which transfers them to, makes self-centering adjustment, positioning that the silicon wafer is realized at concentric mechanism by oneself；

Silicon wafer buanch unit II, the silicon wafer buanch unit II are installed on the top of rack comprising:

Silicon dice transfer device, the silicon dice transfer device are set to the top of the transmission Self-centering device；And

Grabbing device, the grabbing device are slidably mounted on the silicon dice transfer device, the initial bit of the grabbing device Setting in the surface for making concentric mechanism by oneself, the silicon wafer after making concentric mechanism positioning by oneself transfers them to next work by the grabbing device Sequence is processed；And

The rear side that the feeding makes bit location I by oneself is arranged in multistation chamfering unit III, the multistation chamfering unit III And it is located at the lower section of the silicon wafer buanch unit II comprising:

Several facing attachments, several facing attachments are linearly uniformly arranged in the rear side for making concentric mechanism by oneself, grabbing device When silicon wafer is transferred to the surface of the facing attachment at corresponding station, in the center of the silicon wafer and the mill of the facing attachment The heart is located in the same vertical plane；And

Several silicon wafer output devices, the side of the facing attachment are equipped with a silicon wafer output device, the silicon wafer The silicon wafer that chamfer machining is completed is removed from corresponding facing attachment and is put into silicon wafer collection box by output device；

The separating mechanism is equipped with close to switch, is made concentric mechanism by oneself and is equipped with transmission proximity sensor, when transmission is close When sensor has detected silicon wafer, control makes concentric mechanism work by oneself and realizes that the clamping of the silicon wafer is fixed after control system postpones 2~3 seconds Position is controlled simultaneously after transmission mechanism stops operating, and grabbing device work carries out the downward crawl of silicon wafer after clamping position, works as crawl Sensor on device detects controlled system delay 2~3 seconds when silicon wafer after control make concentric mechanism by oneself and unclamp clamping to silicon wafer, Grabbing device carries out being lifted up and transporting to respective chamfered corners station for silicon wafer, while detecting lower section without silicon wafer close to switch When, control system control fragment feeding device is lifted upwards.

As an improvement, the charging hoister structure includes the silicon chip up-down mould group and sliding being fixedly installed on equipment rack The feeding bracket being set in the silicon chip up-down mould group, the film magazine are installed on the feeding bracket, below the film magazine It is provided with photosensitive sensor, silicon wafer stack region is provided with above the photosensitive sensor.

As an improvement, one end of the separating mechanism is located at the top in the film magazine, which includes:

Fragment driving assembly, the fragment driving assembly are set to the top of the silicon wafer stack region；

Sliced transmission component, the sliced transmission component are set to the top of the silicon wafer stack region, and the sliced transmission One end of component is located in the film magazine, and the silicone tube of several rotation settings, several silica gel are provided on the sliced transmission component Pipe tangent contacts setting with the silicon wafer positioned at film magazine top；

It is described to be installed on the sliced transmission component close to switch close to switch, and this is located at the silicon close to switch The top of piece stack region, the close rotation and stopping switched for controlling fragment driving assembly.

As an improvement, the transmission mechanism includes:

The transmission mechanism is set to the rear side of the separating mechanism, and one end of the transmission mechanism is located at the wafer separator The lower section of structure side, the transmission mechanism include:

Transmit driving assembly；

Several transmission silicone tubes, several transmission silicone tubes are rotated under being driven by transmission driving assembly, will be passed by fragment The silicon wafer of defeated component monolithic fragment is continued to transmit backward, and it is logical that chip transmission is formed between the transmission silicone tube and silicone tube Road；

Proximity sensor is transmitted, the transmission proximity sensor is located on one end of several transmission silicone tube transmission directions, The rotation and stopping of transmission proximity sensor control transmission driving assembly, and concentric mechanism is made in transmission proximity sensor control by oneself Carry out the centering of silicon wafer；

The transmission mechanism is further fixedly arranged on baffle on one end of the charging hoister structure, the baffle with it is described The setting of film magazine end thereof contacts, the silicon wafer and baffle of the stacking setting in film magazine contradict and are arranged.

As an improvement, the top made concentric mechanism by oneself and be set to transmission mechanism transmission direction one end, this is self-centering Centering area is formed between mechanism and transmission mechanism, this is made concentric mechanism by oneself and includes:

Twin-screw positioning component, the twin-screw positioning component are symmetrically disposed on the both ends in the centering sector width direction On, it is self-centering which is moved towards the single silicon chip realization being located in centering area；

Size adjusts component, and the size adjusts the rear end along chip transmission direction that component is set to the centering area, The size adjusts component between the twin-screw positioning component, which, which adjusts component, to carry out work according to the size of silicon wafer Size before work is adjusted.

As an improvement, the silicon dice transfer device includes:

Silicon wafer catching block, the silicon wafer catching block are located at the surface of the transmission Self-centering device；

Silicon wafer film releasing area, silicon wafer film releasing area are located at the rear of the silicon wafer catching block；

Rectilinear orbit, the rectilinear orbit are fixedly installed on the top of the transmission Self-centering device, which passes through It is through at the silicon wafer catching block and the setting of silicon wafer film releasing area；

Moving member, the moving member are slideably positioned on the rectilinear orbit, linear motor are provided on the moving member, directly Line motor control moving member acts in silicon wafer catching block and silicon wafer film releasing area in moving back and forth on rectilinear orbit.

As an improvement, the grabbing device includes:

Rotary drive assembly, the rotary drive assembly are fixedly installed on the lower end surface of the moving member；

Driving assembly is gone up and down, the lifting driving assembly is fixedly installed on the rotation driving end of the rotary drive assembly On；

Absorbent module, the absorbent module are fixedly installed on the lifting driving assembly, which carries out

The absorption of silicon wafer, the absorbent module is when the silicon wafer catching block carries out crawl silicon wafer in the centering area On heart line extended line.

As an improvement, the facing attachment includes:

Grinding wheel component, the grinding wheel component are fixedly installed in the rack, and rotation is provided with progress on the grinding wheel component The chamfering abrasive wheel of wafer chamfering；

Silicon slice rotating absorbent module, the silicon slice rotating absorbent module are slideably positioned in the facing attachment, the silicon wafer Rotary adsorption component initial position is located at the underface that the grabbing device carries out film releasing, which adsorbs Silicon wafer simultaneously drives silicon wafer to carry out mobile and realizes chamfering at chamfering abrasive wheel.

As an improvement, the silicon wafer output device includes:

Rotary components are exported, the output rotary components are fixedly installed in the rack, and the output rotary components position In the top of the facing attachment；

Lifting assembly is exported, the output lifting assembly is fixedly installed on the output rotary components rotation driving end；

Absorbent module is exported, the output absorbent module is fixedly installed on the driving end of the output lifting assembly, should Piece is taken after the completion of output absorbent module progress wafer chamfering.

The utility model has the beneficial effects that:

(1) the monolithic fragment that the utility model passes through fragment feeding device and the silicon wafer for transmitting Self-centering device realization stacking With it is self-centering in transmission process, later by grabbing device by the silicon wafer of self-centering completion carry out crawl and in silicon dice transfer device Movement under realize and carry out film releasing on facing attachment, and realize on facing attachment after the chamfering of silicon wafer by silicon wafer output device Take the collection for carrying out silicon wafer in the backward silicon wafer collection box of piece, realizes that a transfer device cooperates the processing of more chamfering devices Mode has saved human resources, improves work efficiency；

(2) the utility model is forming silicon wafer stack region by setting charging hoister structure and on silicon wafer bearing table, if Dry silicon wafer is stacked in silicon wafer stack region naturally and carries out being moved to from bottom to top below separating mechanism, separating mechanism and silicon wafer into Row contact realize silicon wafer auto plate separation, while by transmission mechanism one by one continous way be transmitted to it is self-centering, by making concentric mechanism by oneself It realizes self-centering, realizes that multiple devices orderly carry out corresponding processing and prepare for silicon wafer subsequent production, save subsequent chamfer machining Preceding Self-aligning step improves the degree of automation and production efficiency of silicon wafer processing；

(3) the utility model, by contact friction transmission, realizes silicon in silicon box in such a way that several silicone tubes are driven Silicon wafer in piece stack region, by sequence from top to bottom, orderly exports one by one outward in whole lifting process, improves silicon wafer Fragment efficiency；

(4) the utility model by several transmission silica gel sheaths on transmission mechanism by chip transmission to making by oneself in heart district, by Proximity sensor controls twin-screw precision ball screw after obtaining electric signal and precision ball screw accurate positioning in left and right is corresponding Diametrical position, so that silicon wafer realizes 3 points of self-centering adjustment in transmission process, it is ensured that the center of silicon wafer and subsequent transfer are adsorbed Mechanism precise match, the Self-aligning step before saving subsequent chamfer machining；

(5) the utility model is by being provided with photosensitive sensor on film magazine spacing zone, when photosensitive sensor detects piece When in box without silicon wafer, charging hoister structure declines automatically, and film magazine can be removed to carry out load at this time, so that the automation journey of device Degree further increases；

(6) the utility model cooperates the processing method of more chamfering devices by using a transfer device, cooperates simultaneously Setting Buffer Unit is realized to the buffering in silicon wafer adsorption process during silicon wafer absorption, prevents silicon wafer from damaging；

(7) the utility model by the way that silicon wafer to be adsorbed in silicon slice rotating mechanism, adsorb silicon wafer and carry out by silicon slice rotating mechanism The chamfer machining for carrying out silicon wafer is rotated and be moved at silicon slice rotating absorbent module, is carried out using silicon slice rotating mechanism absorption silicon wafer The mobile mode adjusted of three coordinates, improves the precision of wafer chamfering.

In conclusion the utility model has the advantages that high degree of automation, saving is artificial, high production efficiency, it is especially suitable For monocrystalline silicon piece production technical field.

Detailed description of the invention

Fig. 1 is the utility model schematic perspective view；

Fig. 2 is the front view of the utility model；

Fig. 3 is the structural schematic diagram that the utility model feeding makes bit location by oneself；

Fig. 4 is the front view that the utility model feeding makes bit location by oneself；

Fig. 5 is the utility model fragment feeding device schematic perspective view；

Fig. 6 is the partial structural diagram of the utility model fragment feeding device；

Fig. 7 is the partial elevation view of the utility model fragment feeding device；

Fig. 8 is the utility model separating mechanism structural schematic diagram；

Fig. 9 is another structural schematic diagram of the utility model separating mechanism；

Figure 10 is the utility model separating mechanism schematic cross-sectional view；

Figure 11 is the schematic perspective view of the utility model transmission mechanism；

Figure 12 is the utility model transmission mechanism positive structure diagram；

Figure 13 is the broken section structural schematic diagram of the utility model transmission mechanism；

Figure 14 is the schematic perspective view that the utility model makes concentric mechanism by oneself；

Figure 15 is the schematic perspective view of the utility model twin-screw positioning area；

Figure 16 is the utility model or so positioning area schematic perspective view；

Figure 17 is the working state schematic representation of the utility model fragment feeding device；

Figure 18 is the partial enlargement diagram in Figure 17 at A；

Figure 19 is that the utility model picks and places blade unit schematic perspective view；

Figure 20 is the partial enlargement diagram in Figure 19 at B；

Figure 21 is the utility model grabbing device schematic perspective view one；

Figure 22 is the utility model grabbing device schematic perspective view two；

Figure 23 is the utility model facing attachment schematic perspective view；

Figure 24 is the utility model grinding wheel component schematic perspective view；

Figure 25 is the utility model silicon slice rotating absorbent module schematic perspective view；

Figure 26 is the utility model silicon slice rotating mechanism schematic perspective view；

Figure 27 is the utility model silicon wafer output device schematic perspective view；

Figure 28 is to stack the status diagram for placing silicon wafer in the utility model in film magazine；

Figure 29 is located at status diagram when initial position for grabbing device in the utility model；

Figure 30 is located at status diagram when facing attachment side for grabbing device in the utility model；

Figure 31 carries out status diagram when rotation film releasing for grabbing device in the utility model；

Figure 32 carries out another status diagram when rotation film releasing for grabbing device in the utility model；

Two production technological process of Figure 33 the utility model embodiment.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

In the description of the present invention, it should be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width Degree ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", The orientation or positional relationship of the instructions such as " clockwise ", " counterclockwise " be based on the orientation or positional relationship shown in the drawings, be only for Convenient for description the utility model and simplify description, rather than the equipment of indication or suggestion meaning or element must have specifically Orientation is constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.

In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include one or more of the features.The meaning of " plurality " is two or two in the description of the present invention, More than, unless otherwise specifically defined.

Embodiment one:

As shown in Figure 1, Figure 2, shown in Fig. 3 and Fig. 4, a kind of full-automatic silicon wafer chamfer machining equipment, comprising:

Rack；

Feeding makes bit location I by oneself, and the feeding makes one end that bit location I is installed on machine frame inside by oneself comprising:

Fragment feeding device 1, the fragment feeding device 1 include for driving internal stack to be placed with several silicon wafers 10 The charging hoister structure 11 that film magazine 118 moves up and the separating mechanism 12 being arranged on rear side of charging hoister structure 11；And

Transmit Self-centering device 2, it is described transmission Self-centering device 2 be set to the fragment feeding device 1 rear side and with The fragment feeding device 1 is vertically arranged, which includes transmission mechanism 21 and make concentric mechanism 22 by oneself, is located at The silicon wafer 10 of 118 the top of film magazine is automatically transmitted to transmission mechanism 21 by contacting fricting transmissioning mode through separating mechanism 12 It is transferred them to above and in a manner of roller transfer by transmission mechanism 21 and makes the self-centering tune that concentric mechanism 22 realizes the silicon wafer 10 by oneself Whole, positioning；

Silicon wafer buanch unit II, the silicon wafer buanch unit II are installed on the top of rack comprising:

Silicon dice transfer device 3, the silicon dice transfer device 3 are set to the top of the transmission Self-centering device 2；And

Grabbing device 4, the grabbing device 4 are slidably mounted on the silicon dice transfer device 3, at the beginning of the grabbing device 4 Beginning position, which is located at, makes the surface of concentric mechanism 22 by oneself, the silicon wafer 10 after making concentric mechanism 22 by oneself and positioning by the grabbing device 4 by its Subsequent processing is transferred to be processed；And

The rear side that the feeding makes bit location I by oneself is arranged in multistation chamfering unit III, the multistation chamfering unit III And it is located at the lower section of the silicon wafer buanch unit II comprising:

Several facing attachments 5, several facing attachments 5 are linearly uniformly arranged in the rear side for making concentric mechanism 22 by oneself, crawl When silicon wafer 10 is transferred to the surface of the facing attachment 5 at corresponding station by device 4, the center of the silicon wafer 10 and the facing attachment The center of 5 mill is located in the same vertical plane；And

Several silicon wafer output devices 6, the side of the facing attachment 5 are equipped with a silicon wafer output device 6, the silicon The silicon wafer 10 that chamfer machining is completed is removed from corresponding facing attachment 5 and is put into silicon wafer collection box by piece output device 6；

The separating mechanism 12 is equipped with close to switch 129, is made concentric mechanism 22 by oneself and is equipped with transmission proximity sensor 218, When transmitting proximity sensor 218 and having detected silicon wafer, control makes concentric mechanism 22 by oneself and works reality after control system postpones 2~3 seconds After now the clamping position of the silicon wafer controls after transmission mechanism 21 stops operating simultaneously, after the work of grabbing device 4 carries out clamping position The downward crawl of silicon wafer is controlled after controlling system delay 2~3 seconds when the sensor on grabbing device 4 detects silicon wafer and is made by oneself Concentric mechanism 22 unclamps clamping to silicon wafer, and grabbing device 4 carries out being lifted up and transporting to respective chamfered corners station for silicon wafer, simultaneously When detecting lower section without silicon wafer close to switch 129, control system control fragment feeding device 1 is lifted upwards.

It should be noted that feeding makes the quick monolithic fragment for the silicon wafer that bit location I is stacked by oneself, while being transmitted across The self-centering of silicon wafer is realized in journey, silicon wafer buanch unit II is then to fall after being grabbed the silicon wafer of self-centering completion to multistation The conveying of silicon wafer is carried out on each chamfering station on angle unit III, multistation chamfering unit III is carried out at chamfering to silicon wafer It manages and is collected into silicon wafer collection box.

It further illustrates, fragment feeding device 1 is realizing the monolithic of silicon wafer 10 into moving process from bottom to top Fragment, fragment are realized that silicon wafer 10 is self-centering in centering area 221 by transmission Self-centering device 2 in transmission process after the completion.

It further explains, charging hoister structure 11 carries out silicon wafer stack region 111 upward to be promoted to wafer separator At structure 12, wherein compact reactor is laminated with several silicon wafers 10 in silicon wafer stack region 111, and silicon wafer 10 is located at silicon wafer heap in the process of ascension The silicon wafer 10 of folded 111 top of area is contacted with separating mechanism 12, and separating mechanism 12 is then will by contact friction transmission mode The orderly output outward one by one of silicon wafer 10, transmission mechanism 21 is then linking separating mechanism 12 and makes concentric mechanism 22 by oneself, and fragment is completed Single silicon chip be sent to and make by oneself in concentric mechanism 22 by way of friction transmission, make concentric mechanism 22 by oneself then and be and be transmitted across to being located at The silicon wafer 10 come carries out 3 points of self-centering adjustment.

And grabbing device 4 is grabbed to the silicon wafer 10 being located in centering area 221, so that silicon wafer 10 is adsorbed on crawl On device 4 and be transferred on multiple facing attachments 5 by silicon dice transfer device 3 and carry out chamfered, wherein grabbing device 4 in Crawl is carried out at the silicon wafer catching block 31 of silicon dice transfer device 3 and carries out film releasing in silicon wafer film releasing area 32.

Herein it is noted that when grabbing device 4 is located at the initial position for carrying out self-centering rear silicon wafer crawl, the crawl The elongated central line that 44 elongated central line of lifting cylinder on device 4 completes self-centering silicon wafer with the centering area 221 is located at In same plane, while grabbing device 4 is moved on corresponding station the position after carrying out rotation 180 degree and is located at the silicon slice rotating The surface of absorbent module 52, and the 52 elongated central line of silicon slice rotating absorbent module with grabbing device 4 rotate 180 degree after rise The elongated central line of sending down abnormally ascending cylinder 44 is in the same plane.

As shown in Fig. 5, Fig. 6 and Fig. 7, as a preferred embodiment, charging hoister structure described in the present embodiment 11 further include:

Feeding mounting plate 112, the feeding mounting plate 112 are fixedly installed on the side of equipment rack；

Silicon chip up-down mould group 113, the silicon chip up-down mould group 113 are fixedly installed on the feeding mounting plate 112；

Lifting moving block, the lifting moving block are slideably positioned in the silicon chip up-down mould group 113；

Feeding bracket 115, the feeding bracket 115 are fixedly installed on the lifting moving block；

Film magazine limited block 117,117 quantity of film magazine limited block is two groups, and is symmetrically disposed on the feeding bracket 115 The center line both ends of width direction form film magazine spacing zone 110, the film magazine spacing zone between film magazine limited block 117 described in two groups Photosensitive sensor 1101 is provided on 110；

Film magazine 118, the film magazine 118 are placed in the film magazine spacing zone 110, the film magazine 118 and the baffle 116 it Between formed silicon wafer stack region 111.

It should be noted that charging hoister structure 11 carries out the slow of lifting moving block 114 by silicon chip up-down mould group 113 It drives up, the mode that wherein feeding is promoted uses precision ball screw mechanism in the present embodiment, is of course not solely limited to essence Close ball screw framework, other embodiments for being able to achieve feeding promotion are also fallen into scope of protection of the utility model.

At this it is noted that the silicon wafer in film magazine 118 10 will be stacked on using sequence from bottom to top, orderly outward It exports, when the silicon wafer 10 in the silicone tube 127 and film magazine 118 of several rotations on separating mechanism 12 is contacted, leads to one by one The fragment that friction transmission mode realizes upper side silicon wafer 10 and lower side silicon wafer 10 is crossed, the silicon wafer 10 of top is real under the action of frictional force It is now exported to side, the silicon wafer 10 of lower section realizes the separation with the silicon wafer 10 in transmission process under the effect of gravity, really Protecting the silicon wafer 10 exported every time is exported outward in the form of monolithic.

It further illustrates, film magazine 118 is rectangular-shape setting, and the four sides of film magazine 118 is closing setting, in the film magazine 118 top forms the fragment area contacted with separating mechanism 12, and one end of separating mechanism 12 is in film magazine 118 in the process of ascension Interior progress fragment work, when the silicon wafer 10 in film magazine 118 after the completion of whole fragment outward, is located at film magazine and limits through separating mechanism 12 Photosensitive sensor 1101 in area 110 obtains electric signal and moves charging hoister structure 2 downwards, resets to initial Position can carry out the charging of silicon wafer 10 in film magazine 118 at this time.

As shown in Fig. 8, Fig. 9 and 10, as a preferred embodiment, one end of the separating mechanism 12 is positioned at described In film magazine 118, and it is located at end thereof contacts of the silicon wafer 10 of 111 upper end of silicon wafer stack region always with the separating mechanism 12 and sets It sets, which includes:

Fragment driving assembly 121, the fragment driving assembly 121 are set to the top of the silicon wafer stack region 111；

Sliced transmission component 122, the sliced transmission component 122 are set to the top of the silicon wafer stack region 111, and should One end of sliced transmission component 122 is located in the film magazine 118, and several rotation settings are provided on the sliced transmission component 122 Silicone tube 127, several silicone tubes 127 tangent contact setting with the silicon wafer 10 for being located at 118 top of film magazine；

Fragment driving motor 123, the fragment driving motor 123 are fixedly installed on the fragment driving assembly 121, and The fragment driving motor 123 is located on the output end of the separating mechanism 12, is arranged in the turning end of the fragment driving motor 123 There is driving gear 124, which is located at the top of the guide rod installing zone；

Transmission gear 125, the transmission gear 125 rotational installation is in the guide rod installing zone, and the transmission gear 125 It is engaged positioned at the lower section for driving gear 124 and with the driving gear 124；

Rolling bearing 126,126 quantity of rolling bearing are several and are uniformly spaced and set along the guide rod installing zone It sets, silicone tube 127 is provided on one end of the rolling bearing 126, the silicone tube 127 is contacted with the silicon wafer 10 in Slicing procedure Setting, wherein one group of rolling bearing 126 is engaged with the transmission gear 125；

It is driven rolling bearing 128,128 quantity of transmission rolling bearing is for several and along the guide rod installing zone 122 Uniformly distributed interval setting, and the transmission rolling bearing 128 intersects with the rolling bearing 126 and is engaged, the transmission gear 125 Engagement drives several silicone tubes 127 to synchronize rotation；

Close to switch 129, the close switch 129 is installed on the fragment driving assembly 121 and is located at silicon wafer stack region 111 On one end of top, this controls the rotation and stopping of the fragment driving motor 123 close to switch 129.

It should be noted that when the silicon wafer being located in silicon wafer stack region 111 is promoted to wafer separator by charging hoister structure 11 When 12 lower section of structure, the control that electric signal carries out fragment driving motor 123, fragment are obtained close to switch 129 on separating mechanism 12 Driving motor 123 carries out rotate driving silicone tube 127 and is rotated, and passes through contact friction during silicone tube 127 rotates Power realizes that silicon wafer 10 carries out fragment conveying outward.

It further explains, several silicone tubes 127 realize the rotation of the same direction, fragment driving during rotation Motor 123 is driven, and band nutating gear 125 is rotated, and wherein one group of rolling is driven in 125 rotation process of transmission gear Gear 126 is rotated, and one group of rolling bearing 126 of the rotation drives the one group of rolling bearing 126 engaged to be rotated, It is engaged simultaneously between several transmission gears 125 and several rolling bearings 126 to intersect, transmission gear 125 and rolling bearing Engagement force is transmitted mutually between 126, realizes the consistent rotation in the direction of several silicone tubes 127.

Further, such as Figure 11,12 and 13, the transmission mechanism 21 includes:

Driving assembly 211 is transmitted, the transmission driving assembly 211 is fixedly installed in rack, the transmission driving assembly 211 On be provided with transmission guide rod installing zone 210；

Driving motor 212 is transmitted, the transmission driving motor 212 is fixedly installed on the transmission driving assembly 211, and The transmission driving motor 212 is located at the transmission driving assembly 211 along 10 transmission direction output end of silicon wafer, transmission driving electricity Transmission driving gear 213 is fixedly installed in the turning end of machine 212, transmission driving gear 213 is located at transmission guide rod peace Fill the lower section of 210 one end of area；

Transferring drive gear 214, the transferring drive gear 214 are rotatably dispose on the transmission driving assembly 211, and In the transmission guide rod installing zone 210, the transferring drive gear 214 be located at it is described transmission driving gear 213 top and It is engaged with transmission driving gear 213；

Rolling bearing 215 is transmitted, 215 quantity of transmission rolling bearing is for several and along the transmission guide rod installing zone 210 uniformly distributed intervals are arranged, and transmission silicone tube 216 is provided on one end of the transmission rolling bearing 215, and the silicon wafer 10 is located at institute It states on transmission silicone tube 216, wherein transmission rolling bearing 215 described in one group is engaged with the transferring drive gear 214；

Several transmission silicone tubes 216, several transmission silicone tubes 216 are rotated under being driven by transmission driving assembly 211, will Continued to transmit backward by the silicon wafer 10 of 122 monolithic fragment of sliced transmission component, the transmission silicone tube 216 and silicone tube 127 Between formed chip transmission channel 2160；

It should be noted that the relationship between the height H in chip transmission channel 2160 and the height h of single silicon chip 10 is full Foot, H >=h, so that single silicon chip can realize outside transmission out of chip transmission channel 2160.

Transferring drive rolling bearing 217,217 quantity of transferring drive rolling bearing are several and lead along the transmission The uniformly interval setting of bar installing zone 210, and the transferring drive rolling bearing 217 intersects with the transmission rolling bearing 215 and engages Setting, the engagement of transmission rolling bearing 215 drive several transmission silicone tubes 216 to be rotated；

Herein it is noted that the transmission silicone tube 216 is divided into chip transmission area along 10 transmission direction of silicon wafer 2161, silicon wafer adjustment area 2162 and silicon chip clamping area 2163, chip transmission area 2161, silicon wafer adjustment area 2162 and silicon chip clamping area Rotated on 2163 the silicone tube 216 of setting respectively with make concentric mechanism 22 by oneself and be adapted.

Proximity sensor 218 is transmitted, the transmission proximity sensor 218 is set to the transmission guide rod installing zone 210 and passes On the output end in defeated direction and it is located in the centering area 221.

The transmission mechanism 21 is further fixedly arranged on baffle 219 on one end of the charging hoister structure 11, the gear Plate 219 and 118 end thereof contacts of film magazine are arranged, and silicon wafer 10 and the conflict of baffle 219 of the stacking setting in film magazine 118 are set It sets.

It should be noted that when feel relieved area 221 on there is no silicon wafer 10 when, transmission proximity sensor 218 obtain electric signal into The driving of several transmission silicone tubes 216 of row, several transmission silicone tubes 216 carry out the consistent rotation in direction, and pass through contact friction Transmission mode transmits the silicon wafer 10 being located on transmission silicone tube 216 to making by oneself in concentric mechanism 22, when silicon wafer 10 is transmitted to When at centering area 221, silicon wafer 10 is blocked proximity sensor 218 is transmitted, and transmission proximity sensor 218 obtains electric signal again, So that transmission silicone tube 216 stops operating, feel relieved at silicon wafer 10 and centering area 221.

It further illustrates, transmission driving motor 212 carries out rotation drive and drives end positioned at the transmission driving motor 212 On transmission driving gear 213 rotated, transmission driving gear 213, which drives, engages the transferring drive gear 214 of setting It is rotated, transferring drive gear 214 drives the one group of transmission rolling bearing 215 engaged to be rotated, and transmits silicone tube 216 are rotated by the drive of transmission rolling bearing 215, and transmission rolling bearing 215 drives transferring drive to roll during rotation Gear 217 synchronizes rotation, since transmission rolling bearing 215 is to intersect to be engaged with transferring drive rolling bearing 217, two Transmission rolling bearing 215 and transferring drive rolling bearing 217 between two are engaged, drive several transmission silicone tubes 216 into The consistent rotation of line direction.

As shown in Figure 14,15 and 16, as a preferred embodiment, the concentric mechanism 22 of making by oneself includes:

Self-centering mounting plate 222, the self-centering mounting plate 222 are fixedly mounted on equipment rack, the self-centering mounting plate Twin-screw positioning area 223 and left and right positioning area 224, the twin-screw positioning area 223 and left and right positioning area 224 are provided on 222 It is vertically arranged；

Twin-screw positioning motor 225, the twin-screw positioning motor 225 are fixedly installed on the twin-screw positioning area 223 Side, the driving end of the twin-screw positioning motor 225 acts in the twin-screw positioning area 223；

Double threaded screw 226, the rotational installation of double threaded screw 226 is in the twin-screw positioning area 223；

Positioning sliding block 227, the positioning slide 227 quantity and are two groups and are slideably positioned in the double threaded screw 226 relatively On, Double-ended nut is fixedly installed on the positioning sliding block 227, Double-ended nut is equipped with the double threaded screw 226, double end spiral shell Two groups of positioning sliding blocks 227 are driven to be moved towards in 226 rotation process of bar；

Positioning plate 228,228 quantity of positioning plate are two groups and are correspondingly arranged with the positioning sliding block 227, the positioning plate 228 are fixedly installed on the positioning sliding block 227, positioning plate 228 described in two groups be located at it is described centering area 221 both ends, two groups The front end of the positioning plate 228 mutually forms v-shaped openings, and silicon wafer 10 enters in centering area 221 through v-shaped openings；

Size adjusts component 229, and the size adjusts component 229 and is set to transmitting along silicon wafer 10 for the centering area 221 The rear end in direction, the size adjust component 229 between the twin-screw positioning component 222, which adjusts component 229 can Size before being worked according to the size of silicon wafer 10 is adjusted.

It should be noted that when silicon wafer 10 is transmitted in centering area 221 by transmission mechanism 21, in centering area 221 Transmission proximity sensor 218 obtains electric signal, adjusts component 229 by positioning plate 228 and size and carries out three points centering processing, so that Silicon wafer 10 is realized self-centering in transmission process.

It further illustrates, positive/negative thread is provided on the double threaded screw 226 in twin-screw positioning area 223, and two groups fixed Position sliding block 227 is respectively cooperating on the positive/negative thread of double threaded screw 226, and two groups of positioning are sliding in 226 rotation process of double threaded screw Block 227 moves towards, wherein being provided with positioning plate 228 in positioning sliding 227, two groups of positioning plates 228 are located at centering area 221 Both ends on, realized during moving towards the fit dimension in centering area 221 of silicon wafer 10 adjust component 229 realize 3 points it is fixed The heart.

It is noted that the distance between the positioning sliding block 227 on double threaded screw 226 can be according to the diameter of silicon wafer It is adjusted, self-centering processing is carried out to be adapted to the silicon wafer of different size, by adopting the hoisting way of charging hoister structure 11 It is steady and easily controllable in lifting process with precision ball screw mechanism, so that the fragment efficiency of silicon wafer greatly improves.

As shown in Figure 19 and Figure 20, as a preferred embodiment, the silicon dice transfer device 3 further include:

Rectilinear orbit 33, the rectilinear orbit 33 are fixedly installed on the top of the transmission Self-centering device 2, the straight line rail Road passes through 33 and is through at the silicon wafer catching block 31 and the setting of silicon wafer film releasing area 32；

Moving member 34, the moving member 34 are slideably positioned on the rectilinear orbit 33, are provided on the moving member 34 straight Line motor, linear motor control moving member 34 and act on silicon wafer catching block 31 and silicon wafer in moving back and forth on rectilinear orbit 33 In film releasing area 32, the grabbing device 4 is fixedly installed on the moving member 34.

It should be noted that moving member 34 on rectilinear orbit 33 silicon wafer catching block 31 and silicon wafer film releasing area 32 carry out it is past It is multiple mobile, it is controlled in reciprocating movement by linear motor, grabbing device 4 is fixedly installed on moving member 34 and follows movement Part 34 synchronizes mobile and carries out film releasing at each silicon wafer film releasing area 32.

Further, as shown in Figure 21 and 22, the grabbing device 4 includes:

Rotary drive assembly 41, the rotary drive assembly 41 are fixedly installed on the lower end surface of the moving member 34；

Driving assembly 42 is gone up and down, the rotation that the lifting driving assembly 42 is fixedly installed on the rotary drive assembly 41 is driven On moved end, lifting driving assembly 42 includes picking and placing piece cylinder mount frame 43 and lifting cylinder 44.

Absorbent module 40, the absorbent module 40 are fixedly installed on the lifting driving assembly 42, the absorbent module 40 The absorption of silicon wafer 10 is carried out, which is located at the centering area when silicon wafer catching block 31 carries out crawl silicon wafer 10 On 221 center line extended line.

It should be noted that the lifting cylinder 44 picked and placed on piece cylinder mount frame 43 passes through driving vacuum chuck 45 and silicon wafer 10 are contacted, and are adsorbed silicon wafer 10 and by the suction of vacuum chuck 45 on each facing attachment 5 in contact process The conveying for carrying out silicon wafer 10, at this it is noted that being provided on output end of the vacuum chuck 45 with lifting cylinder 44 slow Component is rushed, when vacuum chuck 45, which is moved down, to be contacted with silicon wafer 10, Buffer Unit, which moves back, carries out vacuum chuck 45 Buffering when silicon wafer 10 is adsorbed, prevents silicon wafer from damaging.

As shown in Figure 23,24,25 and 26, further, the facing attachment 5 includes:

Grinding wheel component 51, the grinding wheel component 51 are fixedly installed in the rack, and setting is rotated on the grinding wheel component 51 There is the chamfering abrasive wheel 523 for carrying out 10 chamfering of silicon wafer, the grinding wheel component 51 is fixedly installed on equipment rack, the grinding wheel component 51 Including lifting driving motor 511, it is set to the fluctuating orbit 512 of described lifting 511 one end of driving motor and is slideably positioned in institute The lifting sliding table 513 on fluctuating orbit 512 is stated, described 513 one end of lifting sliding table connect setting with the driving motor 511；

Silicon slice rotating absorbent module 52, the silicon slice rotating absorbent module 52 are fixedly installed in the lifting sliding table 513, The silicon slice rotating absorbent module 52 includes the motor shaft base 521 being fixedly installed in the lifting sliding table 513, is installed on the electricity Rotary drive motor 522 on arbor seat 521 and the chamfering sand being removably mounted on 521 rotary output of motor shaft base Wheel 523；

Transverse moving mechanism 53, the transverse moving mechanism 53 are fixedly installed on equipment rack, and the transverse shifting machine Structure 53 is located at the lower section of the grinding wheel component 51, which is vertically arranged with the grinding wheel component 51, the transverse direction Mobile mechanism 53 includes horizontal drive motor 531, the transverse shifting track 532 for being set to 531 side of horizontal drive motor And it is slideably positioned in the transverse shifting sliding block 533 on the transverse shifting track 532, one end of the transverse shifting sliding block 533 Setting is connect with the horizontal drive motor 531 driving end；

Longitudinal moving mechanism 54, the longitudinal moving mechanism 54 is set to the top of the transverse moving mechanism 53 and this is vertical It is vertically arranged to mobile mechanism 54 and the transverse moving mechanism 53, which includes being fixedly installed on the cross To the longitudinal movement track 541 moved on sliding block 533, the zigzag tread patterns electricity being fixedly installed on the longitudinal movement track 541 Machine 542 and the longitudinal movement sliding block 543 being slideably positioned on the longitudinal movement track 541, the longitudinal movement sliding block 543 One end connect setting with the vertical drive motor 542 driving end；

Silicon slice rotating mechanism 55, the silicon slice rotating mechanism 55 are fixedly installed on the longitudinal movement sliding block 543, the silicon Piece rotating mechanism 55 includes microscope carrier rotating electric machine 551, the microscope carrier axis being set on 551 rotary output of microscope carrier rotating electric machine 552, the vacuum envelope 553 being sheathed on described 552 one end of microscope carrier axis and the microscope carrier axle bed being sheathed in the middle part of the microscope carrier axis 552 554, the outer cover of the microscope carrier rotating electric machine 551 is equipped with motor shield, is provided with load on one end of the microscope carrier axle bed 554 Platform waterproof cover, forms silicon wafer adsorbing plane 555 between described 552 one end of microscope carrier axis and the vacuum envelope 553, the silicon wafer 10 is inhaled It invests on the silicon wafer adsorbing plane 555, the vacuum envelope 553 is connected to setting with external vacuum equipment.

As shown in figure 27, as a preferred embodiment, the silicon wafer output device 6 includes:

Rotary components 61 are exported, the output rotary components 61 are fixedly installed in the rack, and the output rotation group Part 61 is located at the top of the facing attachment 5；

Lifting assembly 62 is exported, the output lifting assembly 62 is fixedly installed on the rotation of output rotary components 61 driving On end；

Absorbent module 63 is exported, the output absorbent module 63 is fixedly installed on the driving end of the output lifting assembly 62 On, piece is taken after the completion of the output absorbent module 63 progress 10 chamfering of silicon wafer.

Embodiment two:

Reference implementation example one, embodiment two and embodiment three describe a kind of full-automatic silicon wafer of the utility model embodiment four Chamfer machining technique.

As shown in figure 33, a kind of full-automatic silicon wafer chamfer machining technique, comprising:

The silicon wafer 10 for needing to carry out chamfered is packed into film magazine 118 by step 1, film magazine feeding in a stacked fashion；

Step 2 promotes fragment, and feeding bracket 115 is lifted by silicon chip up-down mould group 113, so that silicon wafer stack region The silicon wafer 10 of 111 upper ends is contacted with the silicone tube 127 on separating mechanism 12, and the silicone tube in lifting process by rotating 127 realize monolithic fragment；

Silicon wafer 10 is delivered in centering area 221 by step 3, silicon wafer conveying, transmission silicone tube 216 in the course of rotation, It stops operating when silicon wafer 10 transmits silicone tube 216 close to centering area 221；

Step 4, silicon wafer positioning, when silicon wafer 10 carries out self-centering, realization silicon by making concentric mechanism 22 by oneself close to centering area 221 The three-point fix of piece 10；

Step 5, silicon wafer absorption are adsorbed after the completion of silicon wafer 10 is felt relieved in the area 221 that feels relieved by absorbent module 43 Crawl；

Step 6, silicon wafer transfer, the silicon wafer 10 adsorbed by grabbing device 4 is under the driving of moving member 34 along straight line rail In the transport to each silicon wafer film releasing area 32 of road 33；

Step 7, silicon wafer film releasing, after the transport to each silicon wafer film releasing area 32 of silicon wafer 10 adsorbed by grabbing device 4, by Silicon wafer is placed in silicon slice rotating absorbent module 52 by grabbing device 4；

Step 8, wafer chamfering, silicon slice rotating absorbent module 52, which drives, carries out silicon wafer 10 between silicon wafer and chamfering abrasive wheel 523 Chamfer machining；

Step 9, silicon wafer are collected, and the silicon wafer 10 that chamfer machining is completed is adsorbed by silicon wafer output device (6), will be processed Good silicon wafer 10 is removed from processing stations and is put into silicon wafer collection box.

The course of work:

As shown in Figure 1, silicon wafer 10 is packed into film magazine 118, while film magazine 118 being placed on feeding mounting plate 112 It is limited on film magazine limited block 117, while silicon chip up-down mould group 113 carries out the silicon wafer 10 being located in silicon wafer stack region 111 Promotion at separating mechanism 12, close to switch 129 detect silicon wafer 10 close to when give 123 turns of fragment driving motor Dynamic, so that several silicone tubes 127 are rotated, silicon wafer 10 is realized monolithic by way of contact friction transmission by silicone tube 127 Fragment conveying, the silicon wafer 10 that fragment is completed enter at transmission mechanism 21, while being passed by transmission silicone tube 216 by contact friction Defeated mode carries out the conveying to centering area 221, and when silicon wafer 10 is located at centering area 221, transmission proximity sensor 218 obtains electricity Signal makes transmission silicone tube 216 stop operating, while making concentric mechanism 22 by oneself again and carrying out the making by oneself in centering area 221 of silicon wafer 10 The heart, grabbing device 4 are located in silicon wafer catching block 31, and are driven from lifting cylinder 44 so that vacuum chuck 45 is to centering area It is moved in 221 and is adsorbed the silicon wafer 10 being located in centering area 221, lifting cylinder 44 is lifted silicon wafer after absorption 10 are lifted, at the same silicon wafer 10 be lifted after transmission proximity sensor 218 obtain signal again and make positioning plate 228 and size It adjusts component 229 to reset, the transmission driving transmission silicone tube 216 of driving motor 212 is rotated, and is adsorbed by grabbing device 4 Silicon wafer 10 is transported along rectilinear orbit 33 to each silicon wafer film releasing area 32 under the driving of moving member 34, is inhaled by grabbing device 4 After the attached transport to each silicon wafer film releasing area 32 of silicon wafer 10 firmly, rotary drive assembly 41 carries out 180 degree rotation and rotates silicon wafer 10 To the surface of silicon wafer adsorbing plane 555, silicon wafer 10 is put on microscope carrier axis 552 and by vacuum envelope 553 and is carried out by lifting cylinder 44 Absorption, while microscope carrier axis 552 drives silicon wafer 10 to be rotated, and is adsorbed on the silicon wafer 10 on microscope carrier axis 552 in transverse moving mechanism 53 and longitudinal moving mechanism 54 driving under drive silicon wafer 10 carry out horizontal and vertical movement, and in moving process with rotation Chamfering abrasive wheel 523 contacted, chamfering abrasive wheel 523 carry out silicon wafer 10 chamfer machining, chamfer machining complete silicon wafer 10 by Silicon wafer output device 6 is adsorbed, and the silicon wafer 10 processed is removed from processing stations and is put into silicon wafer collection box.

Claims (9)

1. a kind of full-automatic silicon wafer chamfer machining equipment characterized by comprising

Rack；

Feeding makes bit location I by oneself, and the feeding makes one end that bit location I is installed on machine frame inside by oneself comprising:

Fragment feeding device (1), the fragment feeding device (1) include for driving internal stack to be placed with several silicon wafers (10) The charging hoister structure (11) that moves up of film magazine (118) and the separating mechanism that is arranged on rear side of charging hoister structure (11) (12)；And

Transmit Self-centering device (2), it is described transmission Self-centering device (2) be set to the fragment feeding device (1) rear side and It is vertically arranged with the fragment feeding device (1), which includes transmission mechanism (21) and make concentric mechanism by oneself (22), the silicon wafer (10) positioned at film magazine (118) the top is automatic by it by contact fricting transmissioning mode through separating mechanism (12) It is sent on transmission mechanism (21) and is transferred them in a manner of roller transfer by transmission mechanism (21) and make concentric mechanism (22) by oneself Realize self-centering adjustment, the positioning of the silicon wafer (10)；

Silicon wafer buanch unit II, the silicon wafer buanch unit II are installed on the top of rack comprising:

Silicon dice transfer device (3), the silicon dice transfer device (3) are set to the top of transmission Self-centering device (2)；And

Grabbing device (4), the grabbing device (4) are slidably mounted on the silicon dice transfer device (3), the grabbing device (4) Initial position be located at and make the surfaces of concentric mechanism (22) by oneself, the silicon wafer (10) after being made by oneself concentric mechanism (22) positioning is by the crawl Device (4) transfers them to subsequent processing and is processed；And

Rear side and position that the feeding makes bit location I by oneself is arranged in multistation chamfering unit III, the multistation chamfering unit III In the lower section of the silicon wafer buanch unit II comprising:

Several facing attachments (5), several facing attachments (5) are linearly uniformly arranged in the rear side for making concentric mechanism (22) by oneself, grab When the surface for the facing attachment (5) for taking device (4) to be transferred to silicon wafer (10) at corresponding station, the center of the silicon wafer (10) with The center of the mill of the facing attachment (5) is located in the same vertical plane；And

Several silicon wafer output devices (6), the side of the facing attachment (5) are equipped with a silicon wafer output device (6), should The silicon wafer (10) that chamfer machining is completed is removed from corresponding facing attachment (5) and is put into silicon wafer receipts by silicon wafer output device (6) Collect in box.

2. a kind of full-automatic silicon wafer chamfer machining equipment according to claim 1, which is characterized in that the charging hoister Structure (11) includes the silicon chip up-down mould group (113) being fixedly installed on equipment rack and is slideably positioned in the silicon chip up-down mould group (113) the feeding bracket (115) on, the film magazine (118) are installed on the feeding bracket (115), under the film magazine (118) Side is provided with photosensitive sensor (1101), is provided with silicon wafer stack region (111) above the photosensitive sensor (1101).

3. a kind of full-automatic silicon wafer chamfer machining equipment according to claim 2, which is characterized in that the separating mechanism (12) one end is located at the top in the film magazine (118), which includes:

Fragment driving assembly (121), the fragment driving assembly (121) are set to the top of the silicon wafer stack region (111)；

Sliced transmission component (122), the sliced transmission component (122) are set to the top of the silicon wafer stack region (111), and One end of the sliced transmission component (122) is located in the film magazine (118), is provided on the sliced transmission component (122) several The silicone tube (127) of setting is rotated, several silicone tubes (127) set with silicon wafer (10) tangent contact for being located at film magazine (118) top It sets；

It is described to be installed on the sliced transmission component (122) close to switch (129) close to switch (129), and the close switch (129) it is located at the top of the silicon wafer stack region (111), this is close to switch (129) for controlling fragment driving assembly (121) Rotation and stopping.

4. according to a kind of full-automatic silicon wafer chamfer machining equipment described in claim 1, which is characterized in that the transmission mechanism (21) It is set to the rear side of the separating mechanism (12), and one end of the transmission mechanism (21) is located at the separating mechanism (12) side Lower section, the transmission mechanism (21) include:

It transmits driving assembly (211)；

Several transmission silicone tubes (216), several transmission silicone tubes (216) are rotated under being driven by transmission driving assembly (211), It will be continued to transmit backward by the silicon wafer (10) of sliced transmission component (122) monolithic fragment, the transmission silicone tube (216) and silicon Chip transmission channel (2160) are formed between sebific duct (127)；

It transmits proximity sensor (218), the transmission proximity sensor (218) is located at several transmission silicone tube (216) transmission sides To one end on, the rotation and stopping of the transmission proximity sensor (218) control transmission driving assembly (211), and the transmission connects The centering that concentric mechanism (22) carry out silicon wafer (10) is made in nearly sensor (218) control by oneself；

The transmission mechanism (21) is further fixedly arranged on baffle (219) on one end of the charging hoister structure (11), should Baffle (219) and the film magazine (118) end thereof contacts are arranged, and are located at the silicon wafer (10) and gear of the stacking setting in film magazine (118) Plate (219) contradicts setting.

5. a kind of full-automatic silicon wafer chamfer machining equipment according to claim 1, which is characterized in that described to make concentric mechanism by oneself (22) be set to the top of the transmission mechanism (21) transmission direction one end, this make by oneself concentric mechanism (22) and transmission mechanism (21) it Between form centering area (221), this is made concentric mechanism (22) by oneself and includes:

Twin-screw positioning component (222), the twin-screw positioning component (222) are symmetrically disposed on centering area (221) width On the both ends in direction, which, which is moved towards, will be located at the single silicon chip in centering area (221) (10) it realizes self-centering；

Size adjusts component (229), the size adjust component (229) be set to centering area (221) along silicon wafer (10) The rear end of transmission direction, the size adjust component (229) between the twin-screw positioning component (222), which is adjusted Size before component (229) can be worked according to the size of silicon wafer (10) is adjusted.

6. a kind of full-automatic silicon wafer chamfer machining equipment according to claim 5, which is characterized in that the silicon wafer transfer dress Setting (3) includes:

Silicon wafer catching block (31), the silicon wafer catching block (31) are located at the surface of transmission Self-centering device (2)；

Silicon wafer film releasing area (32), silicon wafer film releasing area are located at the rear of the silicon wafer catching block (31)；

Rectilinear orbit (33), the rectilinear orbit (33) are fixedly installed on the top of transmission Self-centering device (2), the straight line Track is arranged through the silicon wafer catching block (31) and silicon wafer film releasing area (32)；

Moving member (34), the moving member (34) are slideably positioned on the rectilinear orbit (33), are arranged on the moving member (34) There is a linear motor, linear motor controls moving member (34) and acts on silicon wafer catching block in moving back and forth on rectilinear orbit (33) (31) and in silicon wafer film releasing area (32).

7. a kind of full-automatic silicon wafer chamfer machining equipment according to claim 6, which is characterized in that the grabbing device (4) include:

Rotary drive assembly (41), the rotary drive assembly (41) are fixedly installed on the lower end surface of the moving member (34)；

It goes up and down driving assembly (42), lifting driving assembly (42) is fixedly installed on the rotation of the rotary drive assembly (41) It drives on end；

Absorbent module (40), the absorbent module (40) are fixedly installed on the lifting driving assembly (42), the absorbent module (40) absorption of silicon wafer (10) is carried out, which carries out position when crawl silicon wafer (10) In on the center line extended line of centering area (221).

8. a kind of full-automatic silicon wafer chamfer machining equipment according to claim 6, which is characterized in that the facing attachment (5) include:

Grinding wheel component (51), the grinding wheel component (51) are fixedly installed in the rack, rotate and set on the grinding wheel component (51) It is equipped with the chamfering abrasive wheel (523) for carrying out silicon wafer (10) chamfering；

Silicon slice rotating absorbent module (52), the silicon slice rotating absorbent module (52) are slideably positioned in the facing attachment (5), Silicon slice rotating absorbent module (52) initial position is located at the underface that the grabbing device (4) carries out film releasing, the silicon slice rotating Absorbent module (52) adsorbs silicon wafer and drives silicon wafer (10) to carry out mobile and realize chamfering at chamfering abrasive wheel (523).

9. a kind of full-automatic silicon wafer chamfer machining equipment according to claim 6, which is characterized in that the silicon wafer output dress Setting (6) includes:

It exports rotary components (61), the output rotary components (61) are fixedly installed in the rack, and the output rotation group Part (61) is located at the top of the facing attachment (5)；

It exports lifting assembly (62), the output lifting assembly (62) is fixedly installed on output rotary components (61) rotation and drives On moved end；

It exports absorbent module (63), output absorbent module (63) is fixedly installed on the driving of output lifting assembly (62) On end, piece is taken after the completion of the output absorbent module (63) progress silicon wafer (10) chamfering.