CN212967642U - High-efficient device of getting of silicon chip - Google Patents
High-efficient device of getting of silicon chip Download PDFInfo
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- CN212967642U CN212967642U CN202021622369.3U CN202021622369U CN212967642U CN 212967642 U CN212967642 U CN 212967642U CN 202021622369 U CN202021622369 U CN 202021622369U CN 212967642 U CN212967642 U CN 212967642U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model discloses a silicon chip high efficiency moves and carries device, include the support, move and carry subassembly, translation subassembly, the subassembly of rectifying and sucking disc subassembly, it is in to move the subassembly be provided with at least a set ofly on the support to move, it includes first Z axle drive module and first X axle drive module to move the subassembly, the translation subassembly connect in first X axle drive module, the translation subassembly sets up along X axle direction, the subassembly of rectifying is in the translation subassembly below is provided with a pair ofly, the subassembly of rectifying sets up along Y axle direction, just the subassembly of rectifying is in relative movement on the translation subassembly, the subassembly of rectifying connects through absorbing the mounting panel sucking the sucking disc subassembly, the sucking disc subassembly includes the piece of a plurality of equidistant settings. The utility model discloses a to move and carry mechanism and close piece mechanism and separately set up, simplified and moved the structure of carrying the subassembly, improved work efficiency simultaneously greatly.
Description
Technical Field
The utility model relates to an automation equipment technical field, concretely relates to device is put to high-efficient getting of silicon chip.
Background
In the process treatment of the solar cell silicon wafer, the silicon wafer needs to be stably, orderly and intermittently placed by using a bearing device, so that the silicon wafer is transferred for many times in the process treatment, the bearing device is called as a silicon wafer basket, the structure and the type of the silicon wafer basket are different in different process treatment steps, two silicon wafers can be simultaneously accommodated in some baskets at the same interval, only one silicon wafer can be accommodated in some baskets, and at the moment, the silicon wafers need to be combined and separated when being placed between different baskets.
In the traditional process, the silicon wafer taking and placing from the quartz boat to the flower basket are completed by adopting a Z-axis with two longer translation X-axes, the structure is complex and low in efficiency, and the requirement of the existing production cannot be met.
Disclosure of Invention
The to-be-solved technical problem of the utility model is to provide a silicon chip high efficiency moves and carries device, through will moving the mechanism and close piece mechanism separately sets up, simplified and moved the structure that carries the subassembly, improved work efficiency simultaneously greatly.
In order to solve the technical problem, the utility model provides a silicon chip high efficiency moves and carries device, include the support, move and carry subassembly, translation subassembly, the subassembly of rectifying and sucking disc subassembly, it is in to move the subassembly be provided with at least a set of on the support, it includes first Z axle drive module and first X axle drive module to move the subassembly, the translation subassembly connect in first X axle drive module, the translation subassembly sets up along X axle direction, the subassembly of rectifying is in translation subassembly below is provided with a pair ofly, the subassembly of rectifying sets up along Y axle direction, just the subassembly of rectifying is in relative movement on the translation subassembly, the subassembly of rectifying is connected through absorbing the mounting panel sucking disc subassembly, the sucking disc subassembly includes the piece of inhaling of a plurality of equidistant settings.
Further, the translation subassembly includes translation mounting panel, two-way lead screw and translation motor, the translation mounting panel with a X axle drive module links to each other, two-way lead screw both ends pass through the bearing frame with the translation mounting panel links to each other, translation motor with translation mounting panel fixed connection, the translation motor drive two-way lead screw rotates, the nut of two-way lead screw respectively with the subassembly of rectifying links to each other.
Further, the deviation correcting assembly comprises a deviation correcting mounting plate, a deviation correcting moving plate, a deviation correcting screw rod and a deviation correcting motor, the deviation correcting mounting plate is connected with the translation assembly, the deviation correcting screw rod is connected with the deviation correcting mounting plate through a bearing seat, the deviation correcting motor is fixedly mounted on the deviation correcting mounting plate, the deviation correcting motor drives the deviation correcting screw rod to rotate, and a nut of the deviation correcting screw rod is connected with the deviation correcting moving plate.
Further, the suction piece comprises an integrally formed suction portion and a root portion, the thickness of the suction portion is smaller than that of the root portion, the root portion is provided with an air hole penetrating through the suction piece, the surface of the suction portion is provided with a suction nozzle, and an air path communicated with the air hole and the suction nozzle is formed inside the suction portion.
Further, the sucking disc assembly further comprises a sucking disc mounting plate which is of an inverted U-shaped structure, limiting strips protrude inwards from two sides inside the sucking disc mounting plate, limiting grooves matched with the limiting strips are formed in two sides of the sucking disc mounting plate, the sucking disc is connected in series through connecting shafts, limiting blocks are arranged at two ends of each connecting shaft, air inlets are formed in the limiting blocks, and the air inlets are communicated with the air holes.
Furthermore, the suction parts are arranged in an offset mode relative to the root parts, and the distance between every two adjacent suction parts is larger than the thickness of the two silicon wafers in a stacked mode.
Furthermore, a rotating motor is arranged between the absorbing mounting plate and the deviation rectifying assembly, the rotating motor is arranged in the deviation rectifying assembly, and an output shaft of the rotating motor extends out of the deviation rectifying assembly and is connected with the absorbing mounting plate.
Further, absorb the mounting panel with be provided with the upset subassembly between the sucking disc subassembly, the upset subassembly includes upset seat, upset motor and upset connecting plate, the upset seat set up in absorb mounting panel below both ends, the upset connecting plate with the upset seat rotates to be connected, the upset motor is fixed absorb on the mounting panel, the output shaft of upset motor with upset connecting plate fixed connection.
Furthermore, first Z axle drive module is sharp module, including Z axle lead screw and Z axle motor, Z axle motor drive the Z axle lead screw is rotatory, first X axle drive module includes triangle cast aluminium frame and X axle linear electric motor, X axle linear electric motor passes through triangle cast aluminium frame with the nut of Z axle lead screw links to each other.
Furthermore, the moving and loading assemblies are provided with two groups, the support comprises a portal frame and a back plate, the back plate is arranged on a central shaft of the portal frame, the two first Z-axis driving modules are respectively embedded into the two sides of the middle of the back plate, and guide slide rails are further arranged on the two sides of the first Z-axis driving modules.
The utility model discloses a silicon chip high efficiency moves and carries device compares with prior art's beneficial effect is, through will moving the mechanism and close piece mechanism separately setting, simplified and moved the structure of carrying the subassembly, improved work efficiency simultaneously greatly.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic structural view of the bracket back plate of the present invention;
FIG. 3 is the transfer assembly structure of the present invention
Fig. 4 is a schematic structural view of the translation assembly of the present invention;
FIG. 5 is a schematic structural view of the deviation rectifying assembly of the present invention;
FIG. 6 is a schematic structural view of the suction cup assembly of the present invention;
FIG. 7 is a schematic view of the suction sheet of the present invention;
fig. 8 is a schematic structural diagram of the second embodiment of the present invention.
The reference numbers in the figures illustrate:
100. a support; 110. a gantry; 120. a back plate;
200. a transfer component; 210. a first Z-axis driving module; 211. a Z-axis lead screw; 212. a Z-axis motor; 220. a first X-axis driving module; 221. triangular cast aluminum frames; 222. an X-axis linear motor;
300. a translation assembly; 310. a translational mounting plate; 320. a bidirectional screw rod; 330. a translation motor;
400. a deviation rectifying component; 410. a deviation-rectifying mounting plate; 420. a deviation rectifying moving plate; 430. a deviation correcting screw rod; 440. a deviation rectifying motor; 450. mounting a plate;
500. a sucker component; 510. sucking the sheet; 511. a suction part; 512. a root portion; 513. air holes; 514. a suction nozzle; 515. a gas circuit; 520. a suction sheet mounting plate; 521. a limiting strip; 522. a limiting groove; 523. a connecting shaft; 530. a limiting block; 531 air ports;
600. a rotating electric machine;
700. a turnover assembly; 710. a turning seat; 720. turning over a motor; 730. and turning over the connecting plate.
Detailed Description
The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.
Referring to fig. 1, fig. 2 and fig. 3, schematic diagrams of an embodiment of a high-efficiency transferring device for silicon wafers according to the present invention are shown. The utility model discloses a transfer device, which comprises a bracket 100, a transfer component 200 and a translation component Z-axis linear motor; 300. a deviation correcting component 400 and a suction cup component 500. In the embodiment, the support 100 is designed into a portal frame 110, so that the support is more stable, the sucker assembly 500 sucks a plurality of silicon wafers to ensure that the silicon wafers are uniformly arranged, the transfer assembly 200 is used for driving the sucker assembly 500 to move between two stations, the long-distance position adjustment of the silicon wafers is realized, the transfer efficiency is improved, and the translation assembly is provided with a Z-axis linear motor; 300 and the subassembly 400 of rectifying are used for driving sucking disc subassembly 500 and carry out the position fine setting, have improved and have moved the precision of carrying, guarantee that the silicon chip can insert basket of flowers or quartz boat. Specifically, the transfer assembly 200 is provided with at least one group on the support 100, and the plurality of chuck assemblies 500 can pick up and transfer silicon wafers at the same time through the arrangement of the plurality of groups of transfer assemblies 200. In this embodiment, the two sets of the transferring assemblies 200 are arranged, in order to install the two sets of transferring assemblies 200, the bracket 100 includes a gantry 110 and a back plate 120, the back plate 120 is arranged in a central axis of the gantry 110, and the gantry 110 forms a lower support upper auxiliary fixing structure for the back plate 120, so as to ensure stable operation. The transfer assembly 200 includes a first Z-axis driving module 210 and a first X-axis driving module 220; in order to save space, the two first Z-axis driving modules 210 are respectively embedded into two sides of the middle of the back plate 120, so that the distance between the two Z-axis driving modules in the Y-axis direction is small, and the two transfer modules are arranged back to back, thereby saving space. During operation, the first Z-axis driving module 210 drives the sucker assembly 500 to move up and down to pick up or put down a silicon wafer, and the first X-axis driving module 220 drives the sucker assembly 500 to move rapidly between two stations, so that the moving efficiency is improved. In order to realize powerful driving of the first Z-axis driving module 210, in this embodiment, the first Z-axis driving module 210 is a linear module and includes a Z-axis screw 211 and a Z-axis motor 212, the Z-axis screw 211 is a large-diameter screw, two ends of the Z-axis screw 211 are connected to the back plate 120 through a heavy-duty roller bearing, the Z-axis motor 212 drives the Z-axis screw 211 to rotate, the first X-axis driving module 220 includes a triangular cast aluminum frame 221 and an X-axis linear motor 222, the X-axis linear motor 222 is connected to a nut of the Z-axis screw 211 through the triangular cast aluminum frame 221, the triangular cast aluminum frame 221 has a stable and reliable structure and a light weight, pressure on the first Z-axis driving module 210 is reduced, and meanwhile, the linear motor has a faster speed, a more stable and an easy control, and work efficiency is ensured. Meanwhile, because the length of the first X-axis driving module 220 is long, guide slide rails are further arranged on two sides of the first Z-axis driving module 210, and the triangular cast aluminum frame 221 is connected with the guide slide rails in a sliding manner, so that the lifting stability is ensured. The translation assembly is a Z-axis linear motor; 300 is connected to the first X-axis driving module 220, the translation assembly Z-axis linear motor; 300 are arranged along the X-axis direction; the first X-axis driving module 220 is used for long-distance adjustment, and has high speed, low precision and a translation assembly Z-axis linear motor; 300 are used for the short distance fine setting, and the precision is high, and both cooperate the efficiency that improves the silicon chip and get and put. The deviation rectifying assembly 400 is a linear motor on the Z axis of the translation assembly; 300, the deviation rectifying assemblies 400 are arranged along the Y-axis direction, and the deviation rectifying assemblies 400 are arranged on the translation assembly Z-axis linear motors; 300, relative movement; the deviation rectifying assemblies 400 are used for finely adjusting the positions of the sucker assemblies 500 in the Y-axis direction, so that on one hand, the silicon wafers can be taken and placed in cooperation with a flower basket or a quartz boat, and on the other hand, the relative distance of the two deviation rectifying assemblies 400 in the Y-axis direction can be adjusted, and therefore the two deviation rectifying assemblies 400 are arranged on the translation assembly Z-axis linear motor; 300, the silicon wafers on the two sucker assemblies 500 can be combined or separated. The correcting component 400 is connected with the sucker component 500 through a suction mounting plate 450, and the sucker component 500 comprises a plurality of suction pieces 510 arranged at equal intervals; each suction piece 510 adsorbs one silicon wafer, so that a gap is ensured to exist between each silicon wafer, and the distance between two adjacent silicon wafers is the same, so that the silicon wafers are ensured to be tidy on one hand, and on the other hand, the silicon wafers on the two suction cup assemblies 500 can be mutually inserted into the gap between the silicon wafers of the other side, and the silicon wafers are combined or separated.
During operation, the first X-axis driving module 220 drives the Z-axis linear motor of the translation assembly; 300 moving to the upper part of the flower basket or the quartz boat, and translating the component by a Z-axis linear motor; 300 and the deviation rectifying assembly 400 finely adjust the position of the sucker assembly 500 to enable the sucker assembly 500 to be matched with a flower basket or a quartz boat, the first Z-axis driving module 210 drives the sucker assembly 500 to descend, and at least one of the two sucker assemblies 500 picks up a silicon wafer according to the working requirement; when the silicon wafer is not needed to be combined or split, only one sucker assembly 500 can work, and the sucker assembly 500 picking up the silicon wafer completes the transfer of the silicon wafer under the driving of the first X-axis driving module 220 and the first Z-axis driving module 210; when the silicon wafers are required to be combined or split, the two sucker assemblies 500 pick up the silicon wafers, the first X-axis driving module 220 and the first Z-axis driving module 210 drive the two sucker assemblies 500 to move to the upper part of a flower basket or a quartz boat, and the two sucker assemblies 500 are staggered by a certain distance in the Y-axis direction under the adjustment of the deviation rectifying assembly 400, so that the silicon wafers can be inserted into the gaps of the silicon wafers of the other side, and then the Z-axis linear motor of the assembly is translated; 300 driving the two sucker assemblies 500 to approach each other to realize the sheet combination, and if the sheet separation is needed, the reverse operation is carried out, thereby completing the sheet combination or sheet separation of the silicon wafer. The utility model discloses in, the piece or burst of combining of silicon chip can go on simultaneously with moving of carrying of silicon chip, has also improved work efficiency greatly when having improved work precision.
Referring to fig. 4, the Z-axis linear motor of the translation assembly of the present invention is shown; 300 is a schematic structural view. Specifically, the translation assembly is a Z-axis linear motor; 300 includes translation mounting panel 310, two-way lead screw 320 and translation motor 330, translation mounting panel 310 with a X axle drive module 220 links to each other, two-way lead screw 320 both ends through the bearing frame with translation mounting panel 310 links to each other, translation motor 330 with translation mounting panel 310 fixed connection, translation motor 330 drives two-way lead screw 320 rotates, two-way lead screw 320 the nut respectively with subassembly 400 links to each other rectifies. When the translation assembly works, the translation assembly is a Z-axis linear motor; 300 driving the translation mounting plate 310 to move, thereby being connected with the translation assembly Z-axis linear motor; 300 connected with the correcting component 400 and the sucker component 500 are driven, and when the sheets are combined or separated, the correcting component and the sucker component are connected with the translation component through the Z-axis linear motor; 300, the two deviation rectifying assemblies 400 are required to be close to or far away from each other, so the two-way screw 320 is provided in this embodiment, the two-way screw 320 and the translation motor 330 are both connected to the translation mounting plate 310, that is, the positions of the two deviation rectifying assemblies 400 relative to the translation mounting plate 310 are determined, the two deviation rectifying assemblies 400 are respectively connected to two nuts of the two-way screw 320, when the translation motor 330 drives the two-way screw 320 to rotate, the two deviation rectifying assemblies 400 are driven by the nuts to be close to or far away from each other, and sheet combination or sheet separation.
Referring to fig. 5, it is a schematic structural diagram of the deviation rectifying assembly 400 of the present invention. Specifically, the deviation correcting assembly 400 comprises a deviation correcting mounting plate 410, a deviation correcting moving plate 420, a deviation correcting screw rod 430 and a deviation correcting motor 440, wherein the deviation correcting mounting plate 410 and the translation assembly Z-axis linear motor; 300, the deviation correcting screw 430 is connected with the deviation correcting mounting plate 410 through a bearing seat, the deviation correcting motor 440 is fixedly mounted on the deviation correcting mounting plate 410, the deviation correcting motor 440 drives the deviation correcting screw 430 to rotate, and a nut of the deviation correcting screw 430 is connected with the deviation correcting moving plate 420. When the device works, the deviation rectifying mounting plate 410 and the translation assembly Z-axis linear motor are used; 300 are connected, and the translation component is a Z-axis linear motor; 300 drives the deviation rectifying component 400 to move integrally, because the deviation rectifying screw 430 and the deviation rectifying motor 440 are both connected with the deviation rectifying mounting plate 410, the position of the deviation rectifying screw 430 relative to the deviation rectifying mounting plate 410 is determined, when deviation rectification is needed, the deviation rectifying motor 440 drives the deviation rectifying screw 430 to rotate, the nut of the deviation rectifying screw 430 drives the deviation rectifying moving plate 420 to move along the axial direction of the deviation rectifying screw 430, and the sucker component 500 connected with the deviation rectifying moving plate 420 is driven to adjust the position.
Referring to fig. 6 and 7, a schematic view of a suction cup assembly 500 according to the present invention is shown. The suction piece 510 comprises a suction part 511 and a root part 512 which are integrally formed, wherein the thickness of the suction part 511 is smaller than that of the root part 512; the processing is convenient, and a gap for placing the silicon wafer can be ensured between the adjacent suction parts 511. In order to enable the suction part 511 to suck the silicon wafer, the root part 512 is provided with an air hole 513 penetrating through the suction piece 510, the surface of the suction part 511 is provided with a suction nozzle 514, and the inside of the suction part 511 is provided with an air passage 515 communicating the air hole 513 and the suction nozzle 514; air is sucked through the air holes 513, air is sucked through the suction nozzle 514 and the air passage 515, and negative pressure is formed outside the air nozzles, so that the silicon wafer is adsorbed. For realizing picking up of a plurality of silicon chips, sucking disc subassembly 500 still includes inhales piece mounting panel 520, it is the type of falling U structure to inhale piece mounting panel 520, it has spacing 521 to inhale the inside both sides of piece mounting panel 520 inwards outstanding, inhale piece 510 both sides be provided with spacing 521 complex spacing groove 522, it is a plurality of inhale piece 510 closely establishes ties through connecting axle 523, inhale piece 510 after the series connection insert inhale piece mounting panel 520 in, because spacing groove 522 and spacing 521's cooperation, inhale piece 510 and can not drop from inhaling piece mounting panel 520, simultaneously because inhaling piece 510 closely links to each other, consequently each air vent 513 on inhaling piece 510 communicates each other, can unified bleed. In order to ensure the connection tightness of the suction pieces 510 and prevent the suction pieces 510 from moving axially along the connecting shaft 523, the two ends of the connecting shaft 523 are provided with limiting blocks 530, and the limiting blocks 530 are provided with air ports communicated with the air holes 513. Thereby achieving the same evacuation of air to each suction patch 510. Further, for convenience of processing, the suction parts 511 are arranged in an offset manner relative to the root part 512, and the distance between the adjacent suction parts 511 is greater than the thickness of the two superposed silicon wafers, so that after the suction piece 510 sucks the silicon wafers, a gap enough for accommodating another silicon wafer is still formed between the silicon wafer and the connected suction piece 510 to realize the silicon wafer combination.
Fig. 8 is a schematic view of a second embodiment of the present invention. The difference between this embodiment and the first embodiment is that a rotating motor 531 air port is arranged between the suction mounting plate 450 and the deviation rectifying assembly 400; 600, the rotating electrical machine 531 air port; 600 is arranged in the deviation rectifying assembly 400, and the rotating motor 531 is provided with an air port; 600 extends out of the deviation rectifying assembly 400 to be connected with the suction mounting plate 450. Thereby sucking disc subassembly 500 can carry out angular adjustment, guarantees that two sucking disc subassemblies 500 are parallel to when two sucking disc subassemblies 500 close the piece, can not produce the scraping between the silicon chip, and then guaranteed the quality of silicon chip. Further, some baskets or boats are inclined to insert silicon wafers, so that the chuck assembly 500 needs to be turned over. In this embodiment, absorb mounting panel 450 with be provided with upset subassembly 700 between sucking disc subassembly 500, upset subassembly 700 includes upset seat 710, upset motor 720 and upset connecting plate 730, upset seat 710 set up in absorb mounting panel 450 below both ends, upset connecting plate 730 with upset seat 710 rotates and is connected, upset motor 720 is fixed absorb on the mounting panel 450, the output shaft of upset motor 720 with upset connecting plate 730 fixed connection. The turning seat 710 and the turning motor 720 are fixed in position relative to the suction mounting plate 450, when the turning motor 720 is started, the turning connecting plate 730 is driven to rotate, and the sucker assembly 500 connected with the turning connecting plate 730 is turned.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.
Claims (10)
1. The utility model provides a silicon chip high efficiency moves and carries device, its characterized in that includes the support, moves and carries subassembly, translation subassembly, the subassembly of rectifying and sucking disc subassembly, it is in to move the subassembly be provided with at least a set ofly on the support to move, it includes first Z axle drive module and first X axle drive module to move the subassembly, the translation subassembly connect in first X axle drive module, the translation subassembly sets up along X axle direction, the subassembly of rectifying is in the translation subassembly below is provided with a pair ofly, the subassembly of rectifying sets up along Y axle direction, just the subassembly of rectifying is in relative movement on the translation subassembly, the subassembly of rectifying connects through absorbing the mounting panel sucking the sucking disc subassembly, the sucking disc subassembly includes the piece of inhaling of a plurality of equidistant settings.
2. The efficient silicon wafer transferring device according to claim 1, wherein the translation assembly comprises a translation mounting plate, a bidirectional screw rod and a translation motor, the translation mounting plate is connected with the first X-axis driving module, two ends of the bidirectional screw rod are connected with the translation mounting plate through bearing seats, the translation motor is fixedly connected with the translation mounting plate, the translation motor drives the bidirectional screw rod to rotate, and nuts of the bidirectional screw rod are respectively connected with the deviation correcting assembly.
3. The efficient silicon wafer transfer device according to claim 1, wherein the deviation correcting assembly comprises a deviation correcting mounting plate, a deviation correcting moving plate, a deviation correcting screw rod and a deviation correcting motor, the deviation correcting mounting plate is connected with the translation assembly, the deviation correcting screw rod is connected with the deviation correcting mounting plate through a bearing seat, the deviation correcting motor is fixedly mounted on the deviation correcting mounting plate, the deviation correcting motor drives the deviation correcting screw rod to rotate, and a nut of the deviation correcting screw rod is connected with the deviation correcting moving plate.
4. A high efficiency transfer device for silicon wafers as claimed in claim 1, wherein the suction piece comprises a suction portion and a root portion which are integrally formed, the thickness of the suction portion is smaller than that of the root portion, the root portion is provided with an air hole penetrating through the suction piece, the surface of the suction portion is provided with a suction nozzle, and the inside of the suction portion is provided with an air passage communicating the air hole and the suction nozzle.
5. The efficient silicon wafer transferring device as claimed in claim 4, wherein the suction cup assembly further comprises a suction plate mounting plate, the suction plate mounting plate is of an inverted U-shaped structure, limiting strips protrude inwards from two sides inside the suction plate mounting plate, limiting grooves matched with the limiting strips are arranged on two sides of the suction plate, a plurality of suction plates are tightly connected in series through a connecting shaft, limiting blocks are arranged at two ends of the connecting shaft, air inlets are arranged on the limiting blocks, and the air inlets are communicated with the air holes.
6. The efficient silicon wafer transfer device as claimed in claim 4, wherein the suction portions are offset from the root portions, and the distance between adjacent suction portions is greater than the thickness of the stacked two silicon wafers.
7. The efficient silicon wafer transferring device as claimed in claim 1, wherein a rotating motor is disposed between the absorbing mounting plate and the deviation rectifying component, the rotating motor is disposed in the deviation rectifying component, and an output shaft of the rotating motor extends out of the deviation rectifying component and is connected to the absorbing mounting plate.
8. The efficient silicon wafer transferring device as claimed in claim 1, wherein a turning assembly is disposed between the suction mounting plate and the suction cup assembly, the turning assembly includes a turning seat, a turning motor and a turning connecting plate, the turning seat is disposed at two ends below the suction mounting plate, the turning connecting plate is rotatably connected to the turning seat, the turning motor is fixed to the suction mounting plate, and an output shaft of the turning motor is fixedly connected to the turning connecting plate.
9. The efficient transferring device for silicon wafers as claimed in claim 1, wherein the first Z-axis driving module is a linear module comprising a Z-axis lead screw and a Z-axis motor, the Z-axis motor drives the Z-axis lead screw to rotate, the first X-axis driving module comprises a triangular cast aluminum frame and an X-axis linear motor, and the X-axis linear motor is connected with a nut of the Z-axis lead screw through the triangular cast aluminum frame.
10. The efficient silicon wafer transferring device as claimed in claim 1, wherein the transferring assemblies are provided in two sets, the support comprises a gantry and a back plate, the back plate is disposed on a central axis of the gantry, two first Z-axis driving modules are respectively embedded in two sides of the middle of the back plate, and guide rails are further disposed on two sides of the first Z-axis driving modules.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021622369.3U CN212967642U (en) | 2020-08-06 | 2020-08-06 | High-efficient device of getting of silicon chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021622369.3U CN212967642U (en) | 2020-08-06 | 2020-08-06 | High-efficient device of getting of silicon chip |
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| CN212967642U true CN212967642U (en) | 2021-04-13 |
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| CN202021622369.3U Active CN212967642U (en) | 2020-08-06 | 2020-08-06 | High-efficient device of getting of silicon chip |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113915225A (en) * | 2021-09-16 | 2022-01-11 | 苏州诚拓智能装备有限公司 | Sucking disc inserts mechanism and sucking disc device soon |
| CN113977564A (en) * | 2021-09-16 | 2022-01-28 | 苏州诚拓智能装备有限公司 | Silicon chip pickup device |
| CN117672948A (en) * | 2024-01-30 | 2024-03-08 | 无锡松煜科技有限公司 | Silicon wafer separating and combining device and silicon wafer diffusion inserting and taking method |
-
2020
- 2020-08-06 CN CN202021622369.3U patent/CN212967642U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113915225A (en) * | 2021-09-16 | 2022-01-11 | 苏州诚拓智能装备有限公司 | Sucking disc inserts mechanism and sucking disc device soon |
| CN113977564A (en) * | 2021-09-16 | 2022-01-28 | 苏州诚拓智能装备有限公司 | Silicon chip pickup device |
| CN117672948A (en) * | 2024-01-30 | 2024-03-08 | 无锡松煜科技有限公司 | Silicon wafer separating and combining device and silicon wafer diffusion inserting and taking method |
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