CN109841706B

CN109841706B - Solar silicon wafer disassembling and laminating method and laminated tile assembly line

Info

Publication number: CN109841706B
Application number: CN201910224581.XA
Authority: CN
Inventors: 苏金财; 陈春芙
Original assignee: Guangdong Kelongwei Intelligent Equipment Co ltd
Current assignee: Guangdong Kelongwei Intelligent Equipment Co ltd
Priority date: 2019-03-23
Filing date: 2019-03-23
Publication date: 2024-03-29
Anticipated expiration: 2039-03-23
Also published as: CN109841706A

Abstract

The invention discloses a solar silicon wafer splitting and stacking method and a tile stacking assembly line, which comprise a frame, and a feeding conveying mechanism, a feeding manipulator, a splitting mechanism, a sorting manipulator, a stacking adsorption manipulator, a vacuum adsorption conveying belt, a first vacuum adsorption progressive conveying mechanism, a second vacuum adsorption progressive conveying mechanism, a transferring manipulator, a silicon wafer drying box and a blanking conveying mechanism which are respectively arranged on the frame.

Description

Solar silicon wafer disassembling and laminating method and laminated tile assembly line

Technical Field

The invention relates to the technical field of solar silicon wafer production, in particular to a solar silicon wafer disassembling and laminating method and a tile stacking assembly line for implementing the method.

Background

The photovoltaic solar silicon wafer is a core part in a solar power generation system and is also the most valuable part in the solar power generation system. The photovoltaic solar silicon wafer has the function of converting solar energy into electric energy, and the electric energy is sent to a storage battery for storage or is directly used for pushing a load to work. The quality and cost of the photovoltaic solar silicon wafer directly determine the quality and cost of the whole solar power generation system, so that in the production process of the photovoltaic solar silicon wafer, whether the electrical properties such as conductivity and the like meet the standards and whether defects exist or not needs to be detected through a photovoltaic detection board dividing machine, such as velvet, black cores, junction friction, slurry leakage, broken grids, reverse breakdown, poor sintering and the like, and then the defective products are classified or rated according to the size of the defect degree. However, various defects are often only present in a part of the photovoltaic solar wafer, but not in the whole, and if the electrical performance such as the overall conductivity is reduced due to the local defects, the defects are evaluated as defective products or defective products, which results in great waste.

Disclosure of Invention

In view of the above-mentioned shortcomings, it is an object of the present invention to provide a method for splitting and stacking solar silicon wafers, which can split the photovoltaic solar silicon wafers in sections to facilitate selection of defective portions and then perform stacking connection of other portions.

The invention also aims to provide a laminated tile assembly line which has ingenious and reasonable structural design and can be used for sectionally disassembling the photovoltaic solar silicon wafers so as to conveniently select a defective part and then carry out lamination connection on other parts.

In order to achieve the above purpose, the technical scheme provided by the invention is as follows:

a solar silicon wafer disassembling and laminating method comprises the following steps:

(1) The feeding conveying mechanism conveys the solar silicon wafer to a preset position;

(2) The solar silicon wafer conveyed by the feeding conveying mechanism is horizontally placed on the wafer disassembling mechanism by the feeding mechanical arm;

(3) The wafer disassembling mechanism divides the solar silicon wafer horizontally placed on the wafer disassembling mechanism into a plurality of sub silicon wafers;

(4) The slicing mechanism separates the multiple sub-silicon wafers which are split by the slicing mechanism in sections by a certain distance and moves the sub-silicon wafers to the vacuum adsorption conveyor belt;

(5) Sorting the plurality of sub-silicon chips on the vacuum adsorption conveyor belt by a sorting manipulator, and separating and placing the sub-silicon chips with chamfer angles from the sub-silicon chips without chamfer angles;

(6) The lamination adsorption mechanical arm places the sub-silicon wafers with or without chamfers on the first vacuum adsorption progressive conveying mechanism according to a preset stacking rule, so that the corresponding number of sub-silicon wafers are connected in series to form a silicon wafer module, and the stacking serial number of the sub-silicon wafers is determined according to the power wattage of the required silicon wafer module;

(7) The transfer manipulator transfers the silicon wafer module on the first vacuum adsorption progressive conveying mechanism to the second vacuum adsorption progressive conveying mechanism;

(8) The second vacuum adsorption progressive conveying mechanism sends the silicon wafer module into a silicon wafer drying box;

(9) The silicon wafer drying box dries the silicon wafer module on the second vacuum adsorption progressive conveying mechanism;

(10) After the drying is finished, the second vacuum adsorption progressive conveying mechanism exits the silicon wafer drying box to a preset position;

(11) The transfer manipulator moves the silicon wafer module which has completed the drying process on the second vacuum adsorption progressive conveying mechanism to the blanking conveying mechanism;

(12) And the blanking conveying mechanism conveys the silicon wafer module positioned on the blanking conveying mechanism to a preset position.

A stacking tile assembly line comprises a feeding conveying mechanism, a feeding manipulator, a piece disassembling mechanism, a piece separating mechanism, a sorting manipulator, a lamination adsorption manipulator, a first vacuum adsorption progressive conveying mechanism, a second vacuum adsorption progressive conveying mechanism, a transferring manipulator, a silicon wafer drying box and a blanking conveying mechanism; the feeding conveying mechanism is used for conveying the solar silicon wafer to a preset position; the solar silicon wafer conveyed by the feeding conveying mechanism is horizontally placed on the wafer disassembling mechanism by the feeding mechanical arm; the wafer disassembling mechanism is used for sectionally disassembling the solar silicon wafer horizontally placed on the wafer disassembling mechanism into a plurality of sub-silicon wafers; the slicing mechanism is used for separating the multiple sub-silicon wafers which are split by the slicing mechanism in sections by a certain distance and moving the sub-silicon wafers to the vacuum adsorption conveyor belt; the sorting manipulator is used for sorting a plurality of sub-silicon wafers on the vacuum adsorption conveyor belt, and separating and placing the sub-silicon wafers with chamfer angles from the sub-silicon wafers without chamfer angles; the lamination adsorption manipulator is used for stacking the sub-silicon wafers with or without the chamfer on the first vacuum adsorption progressive conveying mechanism according to a preset stacking rule, so that the sub-silicon wafers with corresponding numbers are stacked and connected in series to form a silicon wafer module; the first vacuum adsorption progressive conveying mechanism is used for conveying and placing the silicon wafer modules; the transfer manipulator is used for transferring the silicon wafer module on the first vacuum adsorption progressive conveying mechanism to the second vacuum adsorption progressive conveying mechanism, or transferring the silicon wafer module on the second vacuum adsorption progressive conveying mechanism after the drying process is completed to the blanking conveying mechanism; the second vacuum adsorption progressive conveying mechanism is used for conveying the silicon wafer module into or out of the silicon wafer drying box;

The silicon wafer drying box is used for drying the silicon wafer module; the blanking conveying mechanism is used for conveying the silicon wafer module located on the blanking conveying mechanism to a preset position.

As an improvement of the invention, the sheet disassembling mechanism comprises a sheet folding frame, a fixed adsorption plate, a movable adsorption plate, a linear driving device and a sheet folding driving seat, wherein the fixed adsorption plate is longitudinally fixed at the top of the sheet folding frame, the movable adsorption plate is symmetrically positioned at two sides of the fixed adsorption plate and is at the same horizontal height with the fixed adsorption plate, one side position of the end part of the movable adsorption plate is arranged on the sheet folding frame through a rotating shaft, the linear driving device is arranged on the sheet folding frame corresponding to the lower position of the movable adsorption plate, the sheet folding driving seat is arranged on a driving part of the linear driving device, and a sheet folding rod capable of pushing the movable adsorption plate to turn over by taking the rotating shaft as an axis is arranged on the sheet folding driving seat when the sheet folding driving seat performs lifting action.

As an improvement of the invention, the rotating shaft is provided with a bearing, and the inner side wall of the folding plate frame is provided with a bearing mounting cavity matched with the bearing; the inner side wall of the folding plate frame is provided with a lower supporting strip which supports the movable adsorption plate so that the upper surface of the movable adsorption plate and the upper surface of the fixed adsorption plate are on the same horizontal plane; an upper limit strip for preventing the movable adsorption plate from overturned is arranged on the inner side wall of the folding plate frame corresponding to the upper position of the lower support strip; the lower end of the folding plate rod is fixed on the folding plate driving seat, and the upper end of the folding plate rod extends to a position of one side, far away from the rotating shaft, of the bottom surface of the movable adsorption plate; and an elastic part is arranged on the upper limit strip at a position facing the movable adsorption plate.

The invention relates to an improvement, which is characterized in that the slicing mechanism comprises a slicing frame, a fixed lower plate, a movable upper plate, a telescopic driving device, a linear sliding rail, a fixed seat, a sliding column, a sliding seat and a suction nozzle, wherein the telescopic driving device is arranged on the upper surface of the fixed lower plate, the slicing frame is arranged on the fixed lower plate, the upper surface of the fixed lower plate is movably arranged at the front position of the movable upper plate corresponding to the telescopic driving device and is driven by the telescopic driving device to do telescopic action relative to the fixed lower plate, a plurality of inclined long holes forming a certain included angle with the telescopic path line of the movable upper plate are arranged on the movable upper plate, the linear sliding rail is arranged on the lower surface of the fixed lower plate, the fixed seat is fixed on the lower surface of the fixed lower plate corresponding to the middle one side of the linear sliding rail, the sliding seat is movably arranged on the linear sliding rail corresponding to the position of the inclined long holes, the lower end of the sliding column is fixed on the sliding seat, the upper end of the sliding column penetrates through the fixed lower plate and stretches into the inclined long holes, and the sliding seat is arranged on the sliding seat and the fixed seat.

As an improvement of the invention, the telescopic driving device is an air cylinder, an oil cylinder or a linear motor; the included angle is 14-25 degrees; the slicing frame and the fixed lower plate form a cavity, and the telescopic driving device is positioned in the cavity; the bottom of the sliding seat is provided with a mounting rod parallel to the telescopic track line of the movable upper plate, and the suction nozzles are arranged on the bottom surfaces of the two ends of the mounting rod; the fixed lower plate is provided with a guide slot hole perpendicular to the telescopic track line of the movable upper plate, and the sliding column penetrates through the fixed lower plate through the guide slot hole; a sliding sleeve is sleeved at the position of the sliding column corresponding to the guide slot hole; the sliding column is sleeved with a pulley at a position corresponding to the inclined long hole.

As an improvement of the invention, the lamination adsorption manipulator comprises a four-axis manipulator body and an adsorption mechanism arranged on the four-axis manipulator body, the adsorption mechanism comprises a transverse plate, an upper driving device, a lower driving device and a vacuum adsorption component, the rear side of the middle position of the transverse plate is convex to form a mounting part, a mounting hole is arranged on the mounting part, a limit flange is arranged on the upper edge of the mounting hole, a mounting connecting seat is arranged on an output shaft of the four-axis manipulator body, a limit cavity matched with the outline of the limit flange is arranged at the middle position of the bottom surface of the lower end of the mounting connecting seat, a screw hole is arranged at the periphery of the lower end of the mounting connecting seat, assembly holes corresponding to the screw hole are arranged on the mounting part, a plurality of upper driving devices and lower driving devices are symmetrically arranged on two sides of the transverse plate, and the vacuum adsorption component is arranged on the driving component of the upper driving device and the lower driving device.

As an improvement of the invention, the vacuum adsorption component comprises a connecting plate, an air suction seat, an air suction plate and an air pipe joint, wherein the upper surface and the lower surface of the connecting plate are respectively provided with an upper countersink and a lower countersink, the connecting plate is fixed on the transverse plate by screwing a screw into the transverse plate through the lower countersink, the air suction seat is fixed on the connecting plate by screwing a screw into the air suction seat through the upper countersink, a main air hole extending along the long side direction of the air suction seat is arranged in the air suction seat, one end of the main air hole extends to the side wall of the air suction seat to form a mounting opening, and the air pipe joint is screwed into the mounting opening; the bottom surface of the air suction seat is vertically provided with an air distribution hole communicated with the main air hole, the suction plate is fixed on the bottom surface of the air suction seat through a screw, and an adsorption hole corresponding to the air distribution hole is formed;

As an improvement of the invention, the aperture of the adsorption hole is larger than that of the air-dividing hole; the aperture of the adsorption hole is 3-4 times of the aperture of the air distribution hole; the other end of the main air hole extends to the other side wall of the air suction seat to form an assembly opening, and a sealing screw is screwed on the assembly opening to seal the assembly opening; the upper and lower driving device is an air cylinder, an oil cylinder or a linear motor; the number of the upper and lower driving devices is six, and the upper and lower driving devices are divided into two groups and symmetrically arranged on the lower surfaces of the two ends of the transverse plate.

As an improvement of the invention, the first vacuum adsorption progressive conveying mechanism comprises a ground rail, a linear rack, a lower support plate, an extension frame, an upper support plate, a vertical frame, an adsorption seat, an adsorption bedplate, a pneumatic joint, a driving motor and a gear; the two sides of the ground rail are provided with sliding rails extending along the long sides of the ground rail, and the linear racks are arranged on the ground rail and are parallel to the sliding rails; the lower support plate is movably arranged on the sliding rail through the sliding block, the upper support plate is arranged on the lower support plate through the extension frame, a plurality of vertical frames are arranged on the upper support plate at intervals side by side, the adsorption seat is horizontally arranged on the vertical frames, the upper surface of the adsorption seat is inwards concave to form a ventilation cavity, the lower surface of the adsorption seat is provided with a communication hole connected with the ventilation cavity, the pneumatic connector is arranged on the communication hole, the adsorption platen covers the opening of the ventilation cavity, a plurality of air holes connected with the ventilation cavity are distributed on the adsorption platen, the position of the driving motor corresponding to the linear rack is arranged on the lower support plate, the extension frame or the upper support plate, and the gear is arranged on the driving shaft of the driving motor and meshed with the linear rack.

As an improvement of the invention, the length of the extension frame is longer than that of the lower support plate, and the length of the lower support plate is longer than that of the extension frame; the extension frame comprises a long plate, a short plate and square plates, wherein the two long plates are vertically arranged at two sides of the lower support plate, the two short plates are respectively connected to two ends of the two long plates to form a square frame, a plurality of square plates are arranged on the square frame at intervals, and the upper support plate is arranged on the square plate; the number of the ventilation cavities is multiple, and the ventilation cavities are sequentially arranged on the adsorption seat; the outline of the ventilation cavity is rectangular, and the communication hole is positioned at the geometric center point of the ventilation cavity.

As an improvement of the invention, the silicon wafer drying box comprises a bottom frame, a lower box shell, an upper box shell, heating bodies, temperature controllers and filter plates, wherein the lower box shell is arranged on the bottom frame, the upper box shell is arranged on the lower box shell through a hinge and can be turned over to cover the lower box shell to form a box body, a drying tunnel through which a second vacuum adsorption progressive conveying mechanism passes is arranged on the lower box shell, a plurality of heating bodies are arranged in the upper box shell side by side along the running direction interval of the drying tunnel, the top surface of the upper box shell is provided with an exhaust port communicated with the inner cavity of the upper box shell, the lower part of the filter plates corresponding to the exhaust port is arranged in the upper box shell, and a plurality of temperature controllers are arranged on the upper box shell along the running direction interval of the drying tunnel;

As an improvement of the invention, the front side wall and the rear side wall of the lower case are respectively provided with a T-shaped opening corresponding to the drying tunnel, and the bottom surface of the lower case is provided with a slot extending along the trend of the drying tunnel; the two drying tunnels are arranged in the lower case side by side; a handle is arranged on the upper case shell; the upper case shell is provided with a through hole for the heating element to penetrate, a clamping plate for installing the heating element is arranged at the opening of the through hole, a clamping hole corresponding to the through hole is arranged on the clamping plate, the clamping hole is provided with a high-temperature-resistant clamping sleeve, an inner hole of the high-temperature-resistant clamping sleeve is in interference fit with a connector of the heating element, and the inner wall of the through hole is not contacted with the heating element; the probe of the temperature controller stretches into the upper case, and a protective frame capable of protecting the probe is arranged in the upper case.

The beneficial effects of the invention are as follows: the method provided by the invention has simple steps and is easy to realize, the solar silicon wafer is split into a plurality of sub silicon wafers in a sectioning way through the sectioning mechanism, then the sectioning mechanism separates the split sub silicon wafers with the sectioning way by a certain distance and moves the split sub silicon wafers onto a vacuum adsorption conveying belt, the sub silicon wafers with the chamfers and the sub silicon wafers without the chamfers are separately placed by using a sorting manipulator, and then the sub silicon wafers with the chamfers or the sub silicon wafers without the chamfers are stacked on a first vacuum adsorption progressive conveying mechanism according to a preset stacking rule through a lamination adsorption manipulator, so that the silicon wafer modules with required power are formed by stacking and cascading the corresponding number of sub silicon wafers; then the silicon wafer module is sent into a silicon wafer drying box for drying through a second vacuum adsorption progressive conveying mechanism, each sub silicon wafer in the silicon wafer module is conducted and firmly bonded, and finally the silicon wafer module is taken down by a transfer manipulator and placed on a blanking conveying mechanism, and the silicon wafer module is sent to the next working procedure through the blanking conveying mechanism; the structural design of the laminated tile assembly line is ingenious and reasonable, the photovoltaic solar silicon wafers can be disassembled in sections so as to conveniently select defective parts, and then other parts are laminated in series to form silicon wafer modules with required power, so that different use requirements are met, the product quality is effectively ensured, unnecessary waste is avoided, and the cost is saved.

The invention will be further described with reference to the drawings and examples.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a schematic view of the structure of the hidden frame of the present invention.

Fig. 3 is a schematic perspective view of a sheet removing mechanism in the present invention.

Fig. 4 is an exploded view of the sheet removing mechanism of the present invention.

Fig. 5 is a schematic view of the structure of the slicing mechanism in the present invention when in use.

Fig. 6 is a schematic perspective view 1 of a slicing mechanism in the present invention.

Fig. 7 is a schematic perspective view of a slicing mechanism 2 in the present invention.

Fig. 8 is an exploded view of the slicing mechanism of the present invention.

Fig. 9 is a schematic view of the structure of the movable upper plate in the present invention.

Fig. 10 is a schematic view of the structure of the sorting robot of the present invention.

Fig. 11 is a schematic structural view of a lamination adsorbing robot according to the present invention.

Fig. 12 is a schematic perspective view of an adsorption mechanism in the present invention.

FIG. 13 is a schematic exploded view of the adsorption mechanism in the present invention.

FIG. 14 is a schematic view of an exploded view of a vacuum chuck assembly according to the present invention 1.

Fig. 15 is a schematic view of an exploded view of the vacuum adsorption module of the present invention, shown in fig. 2.

FIG. 16 is a schematic cross-sectional view of a vacuum adsorption module in accordance with the present invention.

Fig. 17 is a schematic perspective view of a first vacuum suction progressive conveying mechanism in the present invention.

Fig. 18 is a schematic partial structure of a first vacuum suction progressive conveying mechanism in the present invention.

Fig. 19 is a schematic view of the structure of the extension frame of the present invention.

Fig. 20 is a schematic view of the structure of the suction base and suction platen in the present invention.

Fig. 21 is a schematic view showing a closed structure of a silicon wafer drying oven according to the present invention.

Fig. 22 is a schematic view showing an opened structure of a silicon wafer drying oven according to the present invention.

Fig. 23 is an enlarged schematic view of the partial a structure in fig. 22.

FIG. 24 is a schematic cross-sectional view of a silicon wafer drying oven according to the present invention.

FIG. 25 is a schematic view of the structure of the clamping plate in the invention.

Detailed Description

Referring to fig. 1 to 25, the present embodiment provides a tile stacking assembly line, which includes a frame 1, and a feeding conveying mechanism 2, a feeding manipulator 3, a splitting mechanism 4, a splitting mechanism 5, a sorting manipulator 6, a lamination adsorption manipulator 7, a vacuum adsorption conveyor belt 8, a first vacuum adsorption progressive conveying mechanism 9, a second vacuum adsorption progressive conveying mechanism 10, a transfer manipulator 11, a silicon wafer drying box 12 and a discharging conveying mechanism 13, which are respectively disposed on the frame 1. The feeding conveying mechanism 2, the feeding mechanical arm 3, the sheet disassembling mechanism 4, the sheet separating mechanism 5, the sorting mechanical arm 6, the lamination adsorption mechanical arm 7, the vacuum adsorption conveying belt 8, the first vacuum adsorption progressive conveying mechanism 9, the second vacuum adsorption progressive conveying mechanism 10, the transferring mechanical arm 11, the silicon wafer drying box 12 and the discharging conveying mechanism 13 are all connected with and controlled by a PLC.

In order to improve the working efficiency, in this embodiment, the number of the sheet disassembling mechanisms 4 is two; the number of the slicing mechanisms 5 is two; the number of the vacuum adsorption conveyor belts 8 is two; the number of the sorting manipulators 6 is two, and the number of the lamination adsorbing manipulators 7 is two. The feeding conveying mechanism 2, the feeding mechanical arm 3, the two vacuum adsorption conveying belts 8, the two lamination adsorption mechanical arms 7 and the two discharging conveying mechanisms 13 are arranged on the frame 1 in sequence; the two sheet disassembling mechanisms 4 are symmetrically arranged at two sides of the feeding manipulator 3; the two slicing mechanisms 5 and the two sorting manipulators 6 are arranged on the frame 1 at the upper positions corresponding to the two vacuum adsorption conveying belts 8, the first vacuum adsorption progressive conveying mechanism 9 and the second vacuum adsorption progressive conveying mechanism 10 are arranged at the two side positions of the two blanking conveying mechanisms 13, and the silicon wafer drying box 12 is arranged on the frame 1 at the positions corresponding to the second vacuum adsorption progressive conveying mechanism 10.

The feeding and conveying mechanism 2 is used for conveying the solar silicon wafers to a preset position, and the feeding and conveying mechanism 2 can be a conveying belt or a manipulator and the like. The solar silicon wafer conveyed by the feeding conveying mechanism 2 is horizontally placed on the wafer disassembling mechanism 4 by the feeding mechanical arm 3; the splitting mechanism 4 is used for splitting the solar silicon wafer horizontally placed on the splitting mechanism into a plurality of sub-silicon wafers in a segmented mode.

Specifically, referring to fig. 3 and 4, the tab removing mechanism 4 includes a tab frame 41, a fixed suction plate 42, a movable suction plate 43, a linear driving device 44 and a tab driving seat 45,

the linear drive device 44 is preferably a cylinder, and in other embodiments, the linear drive device 44 may be an oil cylinder or a linear motor. The fixed adsorption plate 42 and the movable adsorption plate 43 are provided with vacuum adsorption nozzles.

The fixed adsorption plate 42 is longitudinally fixed at the top of the folding frame 41, the movable adsorption plate 43 is symmetrically located at two sides of the fixed adsorption plate 42 and is at the same horizontal height with the fixed adsorption plate 42, one side of the end of the movable adsorption plate 43 is arranged on the folding frame 41 through a rotating shaft 47, the lower position of the linear driving device 44 corresponding to the movable adsorption plate 43 is arranged on the folding frame 41, the folding driving seat 45 is arranged on a driving part of the linear driving device 44, and a folding rod 46 capable of pushing the movable adsorption plate 43 to turn over by taking the rotating shaft 47 as an axis is arranged on the folding driving seat 45 when the folding driving seat performs lifting motion.

In order to improve the smoothness of rotation and prolong the service life, the rotating shaft 47 is provided with a bearing 48, and the inner side wall of the flap frame 41 is provided with a bearing mounting cavity matched with the bearing 48.

In this embodiment, a lower supporting strip 49 is provided on the inner side wall of the flap frame 41 to support the movable adsorption plate 43 such that the upper surface of the movable adsorption plate 43 is on the same horizontal plane as the upper surface of the fixed adsorption plate 42.

An upper limit strip 410 for preventing the movable adsorption plate 43 from turning over is arranged on the inner side wall of the folding frame 41 corresponding to the upper position of the lower support strip 49. An elastic member 411 is provided on the upper limit strip 410 at a position facing the movable adsorption plate 43. The elastic member 411 may be a spring or an elastic rubber column. The movable adsorption plate 43 is pushed to reset by the elastic force of the elastic member 411, so that the upper surface of the movable adsorption plate 43 and the upper surface of the fixed adsorption plate 42 are on the same horizontal plane. The lower end of the flap rod 46 is fixed on the flap driving seat 45, and the upper end of the flap rod 46 extends to a position of one side of the bottom surface of the movable adsorption plate 43 away from the rotating shaft 47. When the solar silicon wafer breaking device works, the movable adsorption plate 43 is pushed by the folding plate rod 46 to compress the elastic component 411 to turn over, so that the purpose of breaking the solar silicon wafer is achieved.

In other embodiments, the lower carrier strip 49, the upper limiting strip 410 and the elastic member 411 may not be provided to simplify the overall structure. The overturning angle of the movable adsorption plate 43 is controlled directly through the telescopic action of the linear driving device 44, so that the upper surface of the movable adsorption plate 43 and the upper surface of the fixed adsorption plate 42 are on the same horizontal plane or are not on the same horizontal plane. Specifically, the lower end of the flap rod 46 is fixed on the flap driving seat 45, and the upper end of the flap rod 46 is hinged to a side of the bottom surface of the movable adsorption plate 43 away from the rotating shaft 47. Since the flap lever 46 is hinged to the suction plate, the flap lever 46 can drive the movable suction plate 43 to return to the original position when it is lowered.

During operation of the feeding conveying mechanism 2, the solar silicon wafers are stably fixed on the fixed adsorption plate 42 and the movable adsorption plate 43 through adsorption of the vacuum adsorption nozzle, the linear driving device 44 drives the flap rod 46 to push the movable adsorption plate 43 to turn over, so that the upper surfaces of the movable adsorption plates 43 and the upper surfaces of the fixed adsorption plate 42 are not on the same horizontal plane, and the solar silicon wafers are divided into sections, so that the defective sub silicon wafers can be conveniently selected, other sub silicon wafers are reserved, unnecessary waste is avoided, cost is saved, and meanwhile, the quality of a silicon wafer module can be guaranteed.

The slicing mechanism 5 is used for separating a plurality of sub-silicon wafers which are split by the slicing mechanism 4 in a sectioning way by a certain distance and moving the sub-silicon wafers to the vacuum adsorption conveyor belt 8; specifically, referring to fig. 5 to 9, the dicing mechanism 5 is mounted on a three-axis robot. The slicing mechanism 5 comprises a slicing frame 51, a fixed lower plate 52, a movable upper plate 53, a telescopic driving device 54, a linear sliding rail 55, a fixed seat 56, a sliding column 57, a sliding seat 58 and a suction nozzle 59.

The telescopic driving device 54 is disposed on the upper surface of the fixed lower plate 52, the split frame 51 is disposed on the fixed lower plate 52, specifically, the split frame 51 and the fixed lower plate 52 form a cavity, and the telescopic driving device 54 is located in the cavity.

The movable upper plate 53 is movably arranged on the upper surface of the fixed lower plate 52 corresponding to the front position of the telescopic driving device 54, and is driven by the telescopic driving device 54 to perform telescopic motion relative to the fixed lower plate 52, the movable upper plate 53 is provided with a plurality of inclined long holes 531 forming a certain included angle with the telescopic track line of the movable upper plate, and the included angle is preferably 14-25 degrees; wherein the angle a near the midline of the movable upper plate 53 is smaller and the angle b far away is larger. In this embodiment, the included angle a is preferably 13 degrees, and the included angle b is preferably 23 degrees.

The linear sliding rail 55 is arranged on the lower surface of the fixed lower plate 52, the fixed seat 56 is fixed on the lower surface of the fixed lower plate 52 corresponding to the middle side position of the linear sliding rail 55, a plurality of sliding seats 58 and the corresponding inclined long holes 531 are movably arranged on the linear sliding rail 55, the lower end of the sliding column 57 is fixed on the sliding seat 58, the upper end of the sliding column 57 penetrates through the fixed lower plate 52 and stretches into the inclined long holes 531, and the suction nozzles 59 are arranged on the sliding seat 58 and the fixed seat 56.

In this embodiment, the telescopic driving device 54 is an air cylinder, and in other embodiments, the telescopic driving device 54 may be an oil cylinder or a linear motor.

The bottom of the sliding seat 58 is provided with a mounting rod 581 parallel to the telescopic track line of the movable upper plate 53, and the suction nozzles 59 are arranged on the bottom surfaces of the two ends of the mounting rod 581; the fixed lower plate 52 is provided with a long guide hole 521 perpendicular to the telescopic trajectory of the movable upper plate 53, and the slide post 57 penetrates the fixed lower plate 52 through the long guide hole 521.

Preferably, a sliding sleeve 571 is sleeved at a position of the sliding column 57 corresponding to the guiding long hole 521, and a pulley 572 is sleeved at a position of the sliding column 57 corresponding to the inclined long hole 531, so that sliding friction is changed into rolling friction, action matching is more flexible and smooth, abrasion is reduced, and service life is long.

In this embodiment, the number of the mounting rods 581 is five. Two suction nozzles 59 are provided on each mounting bar 581. When the slicing mechanism 5 is in operation, in an initial state, the telescopic driving device 54 is in a retracted state. The sliding column 57 is located at the front end of the inclined long hole 531, so that each mounting rod 581 is in a disturbing and attaching shape, after the sub silicon wafer is adsorbed by the suction nozzle 59, the telescopic driving device 54 makes an extending motion to push out the movable upper plate 53, the sliding column 57 can only make a motion perpendicular to the telescopic track line of the movable upper plate 53 under the limitation of the guiding and guiding long holes 521 of the inclined long hole 531, and further drives the sliding seat 58 to move outwards, so that each mounting rod 581 makes a separating motion, and the sub silicon wafer with defects is separated, so that the sub silicon wafer with defects is more conveniently selected, other sub silicon wafers are reserved, unnecessary waste is avoided, cost is saved, and meanwhile, the quality of a silicon wafer module can be ensured.

The sorting manipulator 6 is used for sorting a plurality of sub-silicon wafers on the vacuum adsorption conveyor belt 8, and separating and placing the sub-silicon wafers with chamfer angles from the sub-silicon wafers without chamfer angles; specifically, referring to fig. 10, the sorting robot 6 includes a three-axis robot 61, a mounting plate 62, two-bar cylinders 63, a nozzle holder 64, and a nozzle 65 provided on the nozzle holder 64, the mounting plate 62 is provided on the three-axis robot 61, five two-bar cylinders 63 are arranged side by side on the mounting plate 62 at intervals, and the nozzle holder 64 is provided on a piston rod of the two-bar cylinders 63. During sorting, the double-rod air cylinders 63 corresponding to the positions of the sub-silicon wafers to be adsorbed make an extending action, the sub-silicon wafers to be moved are adsorbed through the suction nozzles 65, and the other double-rod air cylinders 63 do not work, so that the sub-silicon wafers with the chamfers and the sub-silicon wafers without the chamfers are separately placed.

The lamination adsorption manipulator 7 is used for stacking the sub-silicon wafers with or without chamfer angles on the first vacuum adsorption progressive conveying mechanism 9 according to a preset stacking rule, so that the sub-silicon wafers with corresponding numbers are stacked and connected in series to form a silicon wafer module; specifically, referring to fig. 11 to 16, the lamination adsorbing robot 7 includes a four-axis robot body 71 and an adsorbing mechanism 72 provided on the four-axis robot body 71.

Referring to fig. 12 and 13, the suction mechanism 72 includes a cross plate 721, an up-down driving device 722, and a vacuum suction unit 723.

Referring to fig. 13, a mounting portion 7211 is formed by protruding the rear side of the middle portion of the transverse plate 721, a mounting hole 7212 is formed in the mounting portion 7211, a limit flange 7213 is disposed at the upper edge of the mounting hole 7212, a mounting connection seat 711 is disposed on the output shaft of the four-axis manipulator body 71, a limit cavity adapted to the outline of the limit flange 7213 is disposed at the middle portion of the bottom surface of the lower end of the mounting connection seat 711, a screw hole is disposed at the peripheral edge of the lower end of the mounting connection seat 711, and an assembly hole 7214 corresponding to the screw hole is disposed in the mounting portion 7211, and a plurality of upper and lower driving devices 722 are symmetrically arranged on two sides of the transverse plate 721 in parallel.

The vacuum suction unit 723 is provided on a driving part of the up-down driving device 722. In particular, in fig. 14, 15 and 16, the vacuum adsorption assembly 723 comprises a connecting plate 7231, a suction seat 7232, a suction plate 7233 and an air pipe joint 7234, wherein an upper countersunk hole 72311 and a lower countersunk hole 72312 are respectively arranged on the upper surface and the lower surface of the connecting plate 7231, the connecting plate 7231 is fixed on the cross plate 721 by screwing a screw into the cross plate 721 through the lower countersunk hole 72312, the suction seat 7232 is fixed on the connecting plate 7231 by screwing a screw into the suction seat 7232 through the upper countersunk hole 72311, a main air hole 72321 extending along the long edge direction of the main air hole 72321 is arranged in the suction seat 7232, one end of the main air hole 72321 extends to the side wall of the suction seat 7232 to form a mounting opening, and the air pipe joint 7234 is screwed into the mounting opening; for convenience of processing, the main air hole 72321 is formed by integrally penetrating the suction seat 7232. That is, the other end of the main air hole 72321 extends to the other side wall of the suction seat 7232 to form an assembly opening, and a sealing screw 7235 is screwed on the assembly opening to seal the assembly opening; when cleaning maintenance is required, the main air hole 72321 can be cleaned by unscrewing the sealing screw 7235. Meanwhile, the positions of the air pipe joint 7234 and the sealing screw 7235 can be mutually exchanged so as to meet different pipeline wiring requirements.

The bottom surface of the suction seat 7232 is vertically provided with an air-distributing hole 72322 communicated with the main air hole 72321, the suction plate 7233 is fixed on the bottom surface of the suction seat 7232 by a screw, and an adsorption hole 72331 corresponding to the air-distributing hole 72322 is provided; preferably, the aperture of the adsorption hole 72331 is larger than that of the air-distributing hole 72322, preferably, the aperture of the adsorption hole 72331 is 3-4 times that of the air-distributing hole 72322, so as to improve adsorption stability;

in this embodiment, the number of the up-down driving devices 722 is six, and the up-down driving devices are divided into two groups and symmetrically arranged on the lower surfaces of the two ends of the transverse plate 721. The up-down driving device 722 is preferably an air cylinder, and in other embodiments, the up-down driving device 722 may be an oil cylinder or a linear motor. The cross plate 721 has a control valve seat 724 on an upper surface of one end for controlling the up-down driving means 722, and a solenoid valve 725 on an upper surface of the other end for controlling the on-off of a pipe connected to the air pipe joint 7234.

When the lamination adsorption manipulator 7 works, the four-axis manipulator body 71 drives the adsorption mechanism 72 to move to the upper position of the vacuum adsorption conveying belt 8, the four-axis manipulator body 71 drives the adsorption mechanism 72 to move downwards to adsorb the sub silicon wafers with chamfers and/or the sub silicon wafers without chamfers, then the four-axis manipulator body 71 drives the adsorption mechanism 72 to move upwards and move to the upper position of the first vacuum adsorption progressive conveying mechanism 9, then the four-axis manipulator body 71 drives the adsorption mechanism 72 to move downwards to place the sub silicon wafers with chamfers and/or the sub silicon wafers without chamfers to the first vacuum adsorption progressive conveying mechanism 9, each time the sub silicon wafers are placed, the first vacuum adsorption progressive conveying mechanism 9 moves forwards for a certain position, so that the sub silicon wafers placed later can be partially overlapped with the sub silicon wafers placed earlier, contact points on the overlapped sub silicon wafers can be overlapped and communicated, and when the required sub silicon wafers are stacked, the first vacuum adsorption progressive conveying mechanism 9 moves forwards for a larger position, so that a previous module and a next module have enough interval. The lamination adsorption manipulator 7 does not adsorb the defective sub-silicon wafer, and the defective sub-silicon wafer automatically falls into a waste box prepared in advance under the continuous conveying of the vacuum adsorption conveying belt 8 to separate the defective sub-silicon wafer.

The first vacuum adsorption progressive conveying mechanism 9 is used for conveying and placing silicon wafer modules; specifically, referring to fig. 17 to 20, the first vacuum suction progressive conveying mechanism 9 includes a ground rail 91, a linear rack 92, a lower support plate 93, an extension frame 94, an upper support plate 95, a vertical frame 96, a suction seat 97, a suction platen 98, a pneumatic connector 99, a driving motor 910, and a gear 911. The driving motor 910 may be a stepping motor or a servo motor.

The two sides of the ground rail 91 are provided with sliding rails 912 extending along the long sides of the ground rail 91, and the linear racks 92 are arranged on the ground rail 91 and are parallel to the sliding rails 912; the lower support plate 93 is movably arranged on the slide rail 912 through the sliding block 913, the upper support plate 95 is arranged on the lower support plate 93 through the extension frame 94, specifically, the extension frame 94 comprises a long plate 941, a short plate 942 and square plates 943, the two long plates 941 are vertically arranged at two side positions of the lower support plate 93, the two short plates 942 are respectively connected at two ends of the two long plates 941 to form square frames, a plurality of square plates 943 are arranged on the square frames at intervals, and the upper support plate 95 is arranged on the square plates 943.

A plurality of vertical frames 96 are spaced apart side by side on the upper support plate 95. The adsorption seat 97 is horizontally arranged on the vertical frame 96, the upper surface of the adsorption seat 97 is inwards recessed to form a ventilation cavity 971, and the lower surface of the adsorption seat 97 is provided with a communication hole 972 connected with the ventilation cavity 971. In this embodiment, the number of the ventilation chambers 971 is plural, and the ventilation chambers are sequentially arranged on the adsorption seat 97; the ventilation cavity 971 has a rectangular outline, and the communication hole 972 is preferably located at a geometric center point of the ventilation cavity 971.

The pneumatic connector 99 is disposed on the communication hole 972, the adsorption platen 98 is covered on the opening of the ventilation cavity 971, a plurality of air holes connected with the ventilation cavity 971 are distributed on the adsorption platen 98, the position of the driving motor 910 corresponding to the linear rack 92 is disposed on the extension frame 94 through the motor base, the structural stability is good, in other embodiments, the driving motor 910 may be disposed on the lower support plate 93 or the upper support plate 95, and the gear 911 is disposed on the driving shaft of the driving motor 910 and meshed with the linear rack 92.

Preferably, the length of the extension frame 94 is longer than the lower support plate 93, and is about twice as long as the lower support plate 93. The length of the lower support plate 93 is slightly longer than the extension frame 94.

The second vacuum suction progressive conveying mechanism 10 and the first vacuum suction progressive conveying mechanism 9 have the same structure. The second vacuum adsorption progressive conveying mechanism 10 is used for conveying the silicon wafer module into or out of the silicon wafer drying box 12.

The first vacuum adsorption progressive conveying mechanism 9 is different from the traditional vacuum adsorption conveying belt structure, the traditional vacuum adsorption conveying belt has poor high temperature resistance, deformation phenomenon is easy to occur after the silicon wafer enters the silicon wafer drying box 12, the adsorption stability is affected, and the service life is short.

The first vacuum adsorption progressive conveying mechanism 9 adopts a flat plate type structure for conveying, the adsorption bedplate 98 and the adsorption seat 97 are all made of metal, the high temperature resistance performance is good, the deformation can not be caused under the high temperature baking of the silicon wafer drying box 12, the flatness and the whole straightness of a conveying surface are ensured, the adsorption stability is improved, and the product quality is further ensured.

The silicon wafer drying box 12 is used for drying the silicon wafer module; in particular, see fig. 21 to 25. The silicon wafer drying box 12 comprises a bottom frame 121, a lower box shell 122, an upper box shell 123, a heating body 124, a temperature controller 125 and a filter plate 126. The lower case 122 is disposed on the bottom frame 121, the upper case 123 is disposed on the lower case 122 through a hinge 127, and can be turned over and covered on the lower case 122 by taking the hinge 127 as an axis line to form a case, and a drying tunnel through which the second vacuum adsorption progressive conveying mechanism 10 passes is disposed on the lower case 122. Preferably, the inner walls of the lower case 122 and the upper case 123 are provided with heat insulation cotton, so that the hot air in the compartment and the air outside the compartment can be more effectively insulated, the better heat insulation and heat insulation effects are achieved, the electric power cost is saved, and the external elements can be protected.

The heating elements 124 are arranged in the upper case 123 side by side along the running direction interval of the drying tunnel, specifically, a perforation for the heating elements 124 to penetrate is arranged on the upper case 123, a clamping plate 129 for installing the heating elements 124 is arranged at the opening of the perforation, a clamping hole 1291 corresponding to the perforation is arranged on the clamping plate 129, a high-temperature resistant clamping sleeve 1292 is arranged on the clamping hole 1291, the inner hole of the high-temperature resistant clamping sleeve 1292 is in interference fit with the connector of the heating elements 124, and the inner wall of the perforation is not in contact with the heating elements 124. The high temperature resistant clamping sleeve 1292 comprises a front buckling rubber sleeve and a rear buckling rubber sleeve, one end of the front buckling rubber sleeve is radially reduced to form an insertion part capable of being inserted into the rear buckling rubber sleeve, and the insertion part penetrates through the clamping hole 1291 to be inserted into the rear buckling rubber sleeve so as to achieve the purpose of being fixed on the clamping hole 1291. And the connector of the heating body 124 extends out from the inner hole of the front buckle rubber sleeve and is in interference fit.

The top surface of the upper case 123 is provided with an exhaust port 128 communicated with the inner cavity of the upper case 123, the filter plate 126 is arranged in the upper case 123 corresponding to the lower position of the exhaust port 128, and a plurality of temperature controllers 125 are arranged on the upper case 123 along the running direction interval of the drying tunnel;

preferably, the front and rear side walls of the lower casing 122 are respectively provided with a T-shaped opening 1221 corresponding to the drying tunnel, and the bottom surface of the lower casing 122 is provided with a slot 1222 extending along the trend of the drying tunnel, so as to better adapt to the outline of the combined body formed by combining the adsorption bedplate 98, the adsorption seat 97 and the vertical frame 96.

To improve the drying efficiency, two drying tunnels are arranged side by side in the lower case 122.

A handle 120 is provided on the upper case 123 to facilitate operation.

The probe of the temperature controller 125 extends into the upper case 123, and a protecting frame 130 capable of protecting the probe 1251 is arranged in the upper case 123, so that the probe 1251 is prevented from being damaged by foreign matters during ventilation and air pumping, and the service life is prolonged. Specifically, the protection frame 130 includes an upper baffle, a lower baffle, adjusting screws and connecting rods, wherein the two adjusting screws are symmetrically arranged on the upper surfaces of the two ends of the upper baffle, the upper ends of the two connecting rods are connected with the lower surfaces of the two ends of the upper baffle, the lower ends of the two connecting rods are connected with the lower baffle, and the two adjusting screws penetrate through the upper box shell 123 and are screwed with adjusting nuts. And an opening is formed in the middle of the upper baffle plate. After the protection frame 130 is installed, the probe 1251 of the temperature controller 125 sequentially penetrates through the upper case 123 and the opening, and extends into the protection space formed by the upper baffle and the lower baffle.

When the silicon wafer drying box 12 works, the upper box shell 123 is covered on the lower box shell 122 to form a box body with a quite sealed space, so that heat loss can be effectively prevented, the temperature in the box body can be quickly increased through the simultaneous heating of the plurality of heating bodies 124, and the drying efficiency is high; meanwhile, the temperature of each position in the box body is monitored through the plurality of temperature controllers 125, so that the uniformity of the temperature of each position is ensured, the drying effect is improved, and the product quality is ensured; and the upper case 123 can be directly turned over, so that the lower case 122 can be cleaned and tidied conveniently, and daily maintenance and maintenance are facilitated. In addition, the water vapor in the box body can be pumped away through the air suction opening 128, so that the drying efficiency and the drying quality are further improved.

The transfer manipulator 11 is used for transferring the silicon wafer module on the first vacuum adsorption progressive conveying mechanism 9 to the second vacuum adsorption progressive conveying mechanism 10, or transferring the silicon wafer module on the second vacuum adsorption progressive conveying mechanism 10 after the drying process is completed to the blanking conveying mechanism 13. The transfer manipulator 11 comprises a traversing mechanism, a lifting mechanism arranged on the traversing mechanism and a negative pressure adsorption component arranged on the lifting mechanism.

The blanking conveying mechanism 13 is used for conveying the silicon wafer module located on the blanking conveying mechanism to a preset position. The blanking conveying mechanism 13 may be a conveying belt or a manipulator.

The invention provides a solar silicon wafer disassembling and laminating method, which comprises the following steps:

(1) Detecting the solar silicon wafer through a detection system in advance to obtain whether the solar silicon wafer has a defect or not and the coordinate position of the defect, and recording and transmitting the defect to a PLC (programmable logic controller); the feeding conveying mechanism 2 conveys the detected solar silicon wafer to a preset position;

(2) The solar silicon wafer conveyed by the feeding conveying mechanism 2 is horizontally placed on the wafer disassembling mechanism 4 by the feeding mechanical arm 3;

(3) The splitting mechanism 4 splits the solar silicon wafer horizontally placed on the splitting mechanism into five sub-silicon wafers in sections, wherein two sub-silicon wafers at two sides are provided with chamfers, and three sub-silicon wafers at the middle are not provided with chamfers;

(4) The slicing mechanism 5 separates the five sub-silicon wafers which are split by the slicing mechanism 4 in sections by a certain distance and moves the five sub-silicon wafers to the vacuum adsorption conveyor belt 8;

(5) The sorting manipulator 6 sorts five sub-silicon wafers on the vacuum adsorption conveyor belt 8, and separates the sub-silicon wafers with chamfer angles from the sub-silicon wafers without chamfer angles;

(6) The lamination adsorption mechanical arm 7 places the sub-silicon wafers with or without chamfers on the first vacuum adsorption progressive conveying mechanism 9 according to a preset stacking rule, so that the sub-silicon wafers with corresponding numbers are connected in series to form silicon wafer modules, and the stacking serial number of the sub-silicon wafers is determined according to the power wattage of the required silicon wafer modules; each time a sub silicon wafer is placed, the first vacuum adsorption progressive conveying mechanism 9 moves forwards to a certain position, so that the sub silicon wafer placed later can be partially overlapped with the sub silicon wafer placed earlier, contact points on the overlapped sub silicon wafers can be overlapped and communicated, and when the number of the sub silicon wafers required by overlapping is reached, the first vacuum adsorption progressive conveying mechanism 9 moves forwards to a larger position, so that the previous silicon wafer module and the next silicon wafer module have enough intervals. The PLC automatically analyzes the coordinate position of the defect fed back by the detection system to obtain that the defect is positioned on the sub-silicon wafer, and further controls the lamination adsorption manipulator 7 not to adsorb the sub-silicon wafer with the defect, and the sub-silicon wafer with the defect automatically falls into a waste box prepared in advance under the continuous conveying of the vacuum adsorption conveyor belt 8 to separate the sub-silicon wafer with the defect;

(7) The transfer manipulator 11 transfers the silicon wafer module on the first vacuum adsorption progressive conveying mechanism 9 to the second vacuum adsorption progressive conveying mechanism 10;

(8) The second vacuum adsorption progressive conveying mechanism 10 sends the silicon wafer module into a silicon wafer drying box 12;

(9) The silicon wafer drying box 12 dries the silicon wafer module on the second vacuum adsorption progressive conveying mechanism 10;

(10) After the drying is finished, the second vacuum adsorption progressive conveying mechanism 10 exits the silicon wafer drying box 12 to a preset position;

(11) The transfer manipulator 11 moves the silicon wafer module which has completed the drying process on the second vacuum adsorption progressive conveying mechanism 10 to the blanking conveying mechanism 13;

(12) The blanking conveying mechanism 13 conveys the silicon wafer module located on the blanking conveying mechanism to a preset position. The method provided by the invention has simple steps and is easy to realize, the photovoltaic solar silicon wafer can be disassembled in sections so as to conveniently select the part with the defect, and then the other parts are laminated in series to form the silicon wafer module with the required power, so that different use requirements are met, the product quality is effectively ensured, unnecessary waste is avoided, and the cost is saved.

Variations and modifications to the above would be obvious to persons skilled in the art to which the invention pertains from the foregoing description and teachings. Therefore, the invention is not limited to the specific embodiments disclosed and described above, but some modifications and changes of the invention should be also included in the scope of the claims of the invention. In addition, although specific terms are used in the present specification, these terms are used for convenience of description and are not intended to limit the present invention in any way, and other methods and apparatuses using the same or similar structures as those described in the above embodiments of the present invention are included in the scope of the present invention.

Claims

1. The solar silicon wafer disassembling and laminating method is characterized by comprising the following steps of:

2. A shingle assembly line, characterized in that: the device comprises a frame, a feeding conveying mechanism, a feeding manipulator, a piece disassembling mechanism, a piece separating mechanism, a sorting manipulator, a lamination adsorption manipulator, a vacuum adsorption conveyor belt, a first vacuum adsorption progressive conveying mechanism, a second vacuum adsorption progressive conveying mechanism, a transferring manipulator, a silicon wafer drying box and a blanking conveying mechanism which are respectively arranged on the frame;

the feeding conveying mechanism is used for conveying the solar silicon wafer to a preset position;

the feeding mechanical arm horizontally places the solar silicon wafer conveyed by the feeding conveying mechanism on the wafer disassembling mechanism;

the wafer disassembling mechanism is used for sectionally disassembling the solar silicon wafer horizontally placed on the wafer disassembling mechanism into a plurality of sub-silicon wafers;

The slicing mechanism is used for separating the multiple sub-silicon wafers which are split by the slicing mechanism in sections by a certain distance and moving the sub-silicon wafers to the vacuum adsorption conveyor belt;

the sorting manipulator is used for sorting a plurality of sub-silicon wafers on the vacuum adsorption conveyor belt and separating and placing the sub-silicon wafers with chamfer angles from the sub-silicon wafers without chamfer angles;

the lamination adsorption manipulator is used for stacking the sub-silicon wafers with or without the chamfer on the first vacuum adsorption progressive conveying mechanism according to a preset stacking rule, so that the sub-silicon wafers with corresponding numbers are stacked in series to form a silicon wafer module;

the first vacuum adsorption progressive conveying mechanism is used for conveying and placing the silicon wafer modules;

the transfer manipulator is used for transferring the silicon wafer module on the first vacuum adsorption progressive conveying mechanism to the second vacuum adsorption progressive conveying mechanism, or transferring the silicon wafer module on the second vacuum adsorption progressive conveying mechanism after the drying process is finished to the blanking conveying mechanism;

the second vacuum adsorption progressive conveying mechanism is used for conveying the silicon wafer module into or out of the silicon wafer drying box;

the silicon wafer drying box is used for drying the silicon wafer module;

and the blanking conveying mechanism is used for conveying the silicon wafer module positioned on the blanking conveying mechanism to a preset position.

3. The shingle assembly line according to claim 2, wherein the tab removing mechanism comprises a tab frame, a fixed adsorption plate, a movable adsorption plate, a linear driving device and a tab driving seat, the fixed adsorption plate is longitudinally fixed at the top of the tab frame, the movable adsorption plate is symmetrically positioned at two sides of the fixed adsorption plate and is at the same level with the fixed adsorption plate, one side position of the end of the movable adsorption plate is arranged on the tab frame through a rotating shaft, the linear driving device is arranged on the tab frame corresponding to the lower position of the movable adsorption plate, the tab driving seat is arranged on a driving part of the linear driving device, and a tab rod capable of pushing the movable adsorption plate to turn over by taking the rotating shaft as an axis is arranged on the tab driving seat when the movable adsorption plate is lifted.

4. A shingle assembly line according to claim 3 wherein the shaft has bearings and a bearing mounting cavity on the inside wall of the bellows frame that fits the bearings; the inner side wall of the folding plate frame is provided with a lower supporting strip which supports the movable adsorption plate so that the upper surface of the movable adsorption plate and the upper surface of the fixed adsorption plate are on the same horizontal plane; an upper limit strip for preventing the movable adsorption plate from overturned is arranged on the inner side wall of the folding plate frame corresponding to the upper position of the lower support strip.

5. The assembly line for stacking tiles according to claim 2, wherein the tile dividing mechanism comprises a tile dividing frame, a fixed lower plate, a movable upper plate, a telescopic driving device, a linear sliding rail, a fixed seat, a sliding column, a sliding seat and a suction nozzle, wherein the telescopic driving device is arranged on the upper surface of the fixed lower plate, the tile dividing frame is arranged on the fixed lower plate, the movable upper plate is movably arranged on the upper surface of the fixed lower plate corresponding to the front position of the telescopic driving device and is driven by the telescopic driving device to perform telescopic action relative to the fixed lower plate, a plurality of inclined long holes forming a certain included angle with the telescopic rail line of the movable upper plate are formed in the movable upper plate, the linear sliding rail is arranged on the lower surface of the fixed lower plate, the fixed seat is fixed on the lower surface of the fixed lower plate corresponding to the middle side position of the linear sliding rail, a plurality of sliding seats and the corresponding inclined positions of the sliding seats are movably arranged on the linear sliding rail, the lower end of the sliding column is fixed on the sliding seat, the upper end of the sliding seat penetrates through the fixed lower plate and stretches into the inclined long holes, and the suction nozzle is arranged on the sliding seat and the fixed seat.

6. The shingle assembly line according to claim 5 wherein the bottom of the slide is provided with a mounting bar parallel to the telescopic track line of the movable upper plate, and the suction nozzles are provided on bottom surfaces of both ends of the mounting bar; the fixed lower plate is provided with a guide slot hole perpendicular to the telescopic track line of the movable upper plate, and the sliding column penetrates through the fixed lower plate through the guide slot hole; a sliding sleeve is sleeved at the position of the sliding column corresponding to the guide slot hole; the sliding column is sleeved with a pulley at a position corresponding to the inclined long hole.

7. The shingle assembly line according to claim 2, wherein the lamination adsorption manipulator comprises a four-axis manipulator body and an adsorption mechanism arranged on the four-axis manipulator body, the adsorption mechanism comprises a transverse plate, an up-down driving device and a vacuum adsorption assembly, the rear side of the middle part of the transverse plate is convex to form a mounting part, a mounting hole is arranged on the mounting part, a limit flange is arranged on the upper edge of the mounting hole, a mounting connecting seat is arranged on an output shaft of the four-axis manipulator body, a limit cavity matched with the outline of the limit flange is arranged at the middle position of the bottom surface of the lower end of the mounting connecting seat, a screw hole is arranged at the periphery of the lower end of the mounting connecting seat, an assembly hole corresponding to the screw hole is arranged on the mounting part, a plurality of up-down driving devices are symmetrically arranged on two sides of the transverse plate, and the vacuum adsorption assembly is arranged on the driving part of the up-down driving device.

8. The shingle assembly line according to claim 7 wherein the vacuum suction assembly comprises a coupling plate, a suction seat, a suction plate and an air pipe joint, wherein the upper and lower surfaces of the coupling plate are respectively provided with an upper countersink and a lower countersink, the coupling plate is fixed on the cross plate by screwing the cross plate through the lower countersink, the suction seat is fixed on the coupling plate by screwing the screw through the upper countersink, the suction seat is internally provided with a main air hole extending along the long side direction thereof, one end of the main air hole extends to the side wall of the suction seat to form a mounting opening, and the air pipe joint is screwed into the mounting opening; the bottom surface of the suction seat is vertically provided with an air distribution hole communicated with the main air hole, the suction plate is fixed on the bottom surface of the suction seat through screws, and an adsorption hole corresponding to the air distribution hole is formed.

9. The shingle assembly line of claim 2, wherein the first vacuum suction progressive transport mechanism comprises a ground rail, a linear rack, a lower support plate, an extension frame, an upper support plate, a vertical frame, a suction mount, a suction platen, a pneumatic fitting, a drive motor, and a gear; the two sides of the ground rail are provided with sliding rails extending along the long sides of the ground rail, and the linear racks are arranged on the ground rail and are parallel to the sliding rails; the lower support plate is movably arranged on the sliding rail through the sliding block, the upper support plate is arranged on the lower support plate through the extension frame, a plurality of vertical frames are arranged on the upper support plate at intervals side by side, the adsorption seat is horizontally arranged on the vertical frames, the upper surface of the adsorption seat is inwards concave to form a ventilation cavity, the lower surface of the adsorption seat is provided with a communication hole connected with the ventilation cavity, the pneumatic connector is arranged on the communication hole, the adsorption platen covers the opening of the ventilation cavity, a plurality of air holes connected with the ventilation cavity are distributed on the adsorption platen, the position of the driving motor corresponding to the linear rack is arranged on the lower support plate, the extension frame or the upper support plate, and the gear is arranged on the driving shaft of the driving motor and meshed with the linear rack.

10. The assembly line of claim 2, wherein the silicon wafer drying box comprises a bottom frame, a lower box shell, an upper box shell, heating bodies, temperature controllers and filter plates, the lower box shell is arranged on the bottom frame, the upper box shell is arranged on the lower box shell through a hinge and can be turned over to cover the lower box shell to form a box body, a drying tunnel for the second vacuum adsorption progressive conveying mechanism to pass through is arranged on the lower box shell, the heating bodies are arranged in the upper box shell side by side along the running interval of the drying tunnel, the top surface of the upper box shell is provided with an exhaust port communicated with the inner cavity of the upper box shell, the filter plates are arranged in the upper box shell below the corresponding exhaust ports, and the temperature controllers are arranged on the upper box shell along the running interval of the drying tunnel.