CN210073894U - Laminated tile assembly line - Google Patents

Abstract

The utility model discloses a stack tile assembly line, it includes the frame and sets up the material loading conveyor in this frame respectively constructs, the material loading manipulator, tear the piece mechanism, the burst mechanism, the letter sorting manipulator, the lamination adsorbs the manipulator, the vacuum adsorption conveyer belt, first vacuum adsorption transport mechanism that advances progressively, second vacuum adsorption transport mechanism that advances progressively, the transfer manipulator, silicon chip stoving case and unloading conveying mechanism, solar energy silicon chip segmentation split becomes multi-disc sub silicon chip through tear the piece mechanism, in order to conveniently select out the defective sub silicon chip, carry out the silicon chip module that the required power size was established ties out to other sub silicon chips through the lamination adsorption manipulator after that, in order to satisfy different user demands, then send into and send into silicon chip stoving case and dry, whole operation flow easily realizes, effectively ensure product quality, avoid unnecessary extravagant, save the cost.

Description

Laminated tile assembly line

Technical Field

The utility model relates to a solar energy silicon chip production technical field, concretely relates to can carry out the general assembly line of imbricating of stripping lamination to solar energy silicon chip.

Background

The photovoltaic solar silicon wafer is a core part in a solar power generation system and is also the part with the highest value in the solar power generation system. The photovoltaic solar silicon wafer is used for converting solar energy into electric energy, and the electric energy is sent to a storage battery for storage or is directly used for pushing a load to work. Therefore, in the production process of the photovoltaic solar silicon wafer, whether the electric conductivity and other electric properties meet the standards and whether defects exist, such as fluff, black cores, junction area friction, slurry leakage, grid breakage, reverse breakdown, poor sintering and the like, need to be detected by a photovoltaic detection plate separator, and then the defects are classified or evaluated as defective products according to the degree of the defects. However, various defects are often only present in a part of the photovoltaic solar silicon wafer, but not in the whole, and if the electric properties such as the whole electric conductivity are reduced due to the local defects, the defects are evaluated as defective products or defective products, which causes great waste.

SUMMERY OF THE UTILITY MODEL

To the above, the utility model aims to provide a structural design is ingenious, reasonable, can unpack photovoltaic solar energy silicon chip segmentation apart to conveniently select out the defective part, then other parts carry out the general assembly line of shingles that the lamination is connected.

In order to achieve the above purpose, the utility model provides a technical scheme is:

a tile stacking assembly line comprises a feeding conveying mechanism, a feeding mechanical arm, a tile detaching mechanism, a splitting mechanism, a sorting mechanical arm, a stacking adsorption mechanical arm, a first vacuum adsorption progressive conveying mechanism, a second vacuum adsorption progressive conveying mechanism, a transfer mechanical arm, a silicon wafer drying box and a blanking conveying mechanism; the feeding conveying mechanism is used for conveying the solar silicon wafer to a preset position; the feeding manipulator horizontally places the solar silicon wafers conveyed by the feeding conveying mechanism on the wafer detaching mechanism; the solar silicon wafer splitting mechanism is used for splitting a solar silicon wafer horizontally placed on the solar silicon wafer into a plurality of sub-silicon wafers in a segmented manner; the slicing mechanism is used for separating a plurality of sub silicon wafers which are segmented and split by the slicing mechanism by a certain distance and moving the sub silicon wafers to a vacuum adsorption conveyor belt; the sorting manipulator is used for sorting a plurality of sub silicon wafers on the vacuum adsorption conveying belt and separately placing the sub silicon wafers with chamfers and the sub silicon wafers without chamfers; the lamination adsorption manipulator is used for stacking the sub-silicon wafers with chamfers or the sub-silicon wafers without chamfers on the first vacuum adsorption progressive conveying mechanism according to a preset stacking rule, so that the sub-silicon wafers with corresponding number are stacked and connected in series to form a silicon wafer module; the first vacuum adsorption progressive conveying mechanism is used for conveying and placing the silicon wafer modules; the transfer manipulator is used for transferring the silicon wafer module on the first vacuum adsorption progressive conveying mechanism to the second vacuum adsorption progressive conveying mechanism, or transferring the silicon wafer module which is subjected to the drying process on the second vacuum adsorption progressive conveying mechanism to the blanking conveying mechanism; the second vacuum adsorption progressive conveying mechanism is used for conveying the silicon wafer module into or out of the silicon wafer drying box;

the silicon wafer drying box is used for drying the silicon wafer module; and the blanking conveying mechanism is used for conveying the silicon wafer modules positioned on the blanking conveying mechanism to a preset position.

As an improvement of the utility model, the mechanism of breaking out includes the folded sheet frame, fixed adsorption plate, activity adsorption plate, linear drive device and folded sheet drive seat, fixed adsorption plate longitudinal fixation is in the top of folded sheet frame, activity adsorption plate symmetric position is in the both sides position of fixed adsorption plate, and with fixed adsorption plate is on same level, and tip one side position of this activity adsorption plate sets up on the folded sheet frame through the pivot, the below position that linear drive device corresponds activity adsorption plate sets up on the folded sheet frame, folded sheet drive seat sets up on linear drive device's drive assembly, and is equipped with on this folded sheet drive seat and can promote when it does the lift action the activity adsorption plate with the pivot is the folded sheet pole of axis upset.

As an improvement of the utility model, a bearing is arranged on the rotating shaft, and a bearing installation cavity matched with the bearing is arranged on the inner side wall of the folding rack; the inner side wall of the sheet folding frame is provided with a lower supporting strip which supports the movable adsorption plate so that the upper surface of the movable adsorption plate and the upper surface of the fixed adsorption plate are on the same horizontal plane; an upper limit strip for preventing the movable adsorption plate from turning excessively is arranged on the inner side wall of the folding piece frame corresponding to the upper part of the lower support strip; the lower end of the folding sheet rod is fixed on the folding sheet driving seat, and the upper end of the folding sheet rod extends to the position of one side of the bottom surface of the movable adsorption plate far away from the rotating shaft; and an elastic component is arranged on the upper limit strip at a position facing the movable adsorption plate.

As an improvement of the utility model, the wafer separating mechanism comprises a wafer separating frame, a fixed lower plate, a movable upper plate, a telescopic driving device, a linear slide rail, a fixed seat, a slide column, a slide seat and a suction nozzle, wherein the telescopic driving device is arranged on the upper surface of the fixed lower plate, the wafer separating frame is arranged on the fixed lower plate, the movable upper plate is movably arranged on the upper surface of the fixed lower plate corresponding to the front position of the telescopic driving device and is driven by the telescopic driving device to do telescopic action relative to the fixed lower plate, the movable upper plate is provided with a plurality of inclined long holes which form a certain included angle with the telescopic track line of the movable upper plate, the linear slide rail is arranged on the lower surface of the fixed lower plate, the fixed seat is fixed on the lower surface of the fixed lower plate corresponding to the position of one side of the linear slide rail, the plurality of slide seats and the inclined long holes corresponding to the slide seats are movably arranged on the, the upper end of the sliding column penetrates through the fixed lower plate and extends into the inclined long hole, and the suction nozzle is arranged on the sliding seat and the fixed seat.

As an improvement of the utility model, the telescopic driving device is a cylinder, an oil cylinder or a linear motor; the included angle is 14-25 degrees; the wafer dividing frame and the fixed lower plate form a cavity, and the telescopic driving device is positioned in the cavity; the bottom of the sliding seat is provided with an installation rod parallel to the telescopic track line of the movable upper plate, and the suction nozzles are arranged on the bottom surfaces of two ends of the installation rod; the fixed lower plate is provided with a guide long hole which is vertical to the telescopic track line of the movable upper plate, and the sliding column penetrates through the fixed lower plate through the guide long hole; a sliding sleeve is sleeved at the position of the sliding column corresponding to the guide long hole; and pulleys are sleeved at the positions of the sliding columns corresponding to the inclined long holes.

As an improvement of the utility model, the laminated adsorption manipulator comprises a four-shaft manipulator body and an adsorption mechanism arranged on the four-shaft manipulator body, the adsorption mechanism comprises a transverse plate, an up-and-down driving device and a vacuum adsorption component, wherein the rear side of the middle position of the transverse plate is convex to form an installation part, the mounting part is provided with a mounting hole, the upper edge of the mounting hole is provided with a limit flange, the output shaft of the four-shaft manipulator body is provided with a mounting connecting seat, the middle position of the bottom surface of the lower end of the mounting and connecting seat is provided with a limit cavity matched with the outline of the limit flange, the lower extreme peripheral position of this erection joint seat is equipped with the screw hole, and be equipped with on the installation department with the corresponding pilot hole of this screw hole, a plurality of upper and lower drive arrangement symmetries are in the both sides of diaphragm side by side, the vacuum adsorption subassembly sets up on drive arrangement's drive part about this.

As an improvement of the present invention, the vacuum adsorption assembly includes a connecting plate, an air suction seat, an air suction plate and an air pipe joint, the upper and lower surfaces of the connecting plate are correspondingly provided with an upper countersunk hole and a lower countersunk hole, the connecting plate is fixed on the diaphragm by screwing the screw into the lower countersunk hole and the air suction seat is fixed on the connecting plate by screwing the screw into the upper countersunk hole and the air suction seat, the air suction seat is provided with a main air hole extending along the long edge direction, one end of the main air hole extends to the side wall of the air suction seat to form an installation opening, and the air pipe joint is screwed into the installation opening; the bottom surface of the air suction seat is vertically provided with an air distribution hole communicated with the main air hole, the suction plate is fixed on the bottom surface of the air suction seat through screws, and the suction plate is provided with an adsorption hole corresponding to the air distribution hole;

as an improvement of the utility model, the aperture of the adsorption hole is larger than that of the gas distribution hole; the aperture of the adsorption hole is 3-4 times of that of the gas distribution hole; the other end of the main air hole extends to the other side wall of the air suction seat to form an assembly opening, and a sealing screw is screwed in the assembly opening for sealing; the up-down driving device is a cylinder, an oil cylinder or a linear motor; the number of the upper and lower driving devices is six, and the upper and lower driving devices are divided into two groups which are symmetrical and arranged on the lower surfaces of the two ends of the transverse plate in parallel.

As an improvement of the utility model, the first vacuum adsorption progressive conveying mechanism comprises a ground rail, a linear rack, a lower support plate, an extension frame, an upper support plate, a vertical frame, an adsorption seat, an adsorption bedplate, a pneumatic joint, a driving motor and a gear; the two sides of the ground rail are provided with slide rails extending along the long edge direction of the ground rail, and the linear rack is arranged on the ground rail and is parallel to the slide rails; the lower support plate is movably arranged on the slide rail through a slide block, the upper support plate is arranged on the lower support plate through an extension frame, a plurality of vertical frames are arranged on the upper support plate side by side at intervals, the adsorption seat is horizontally arranged on the vertical frames, the upper surface of the adsorption seat is inwards recessed to form a ventilation cavity, a communication hole connected with the ventilation cavity is formed in the lower surface of the adsorption seat, a pneumatic connector is arranged on the communication hole, the adsorption bedplate covers an opening of the ventilation cavity, a plurality of air holes connected with the ventilation cavity are distributed in the adsorption bedplate, the driving motor is arranged on the lower support plate, the extension frame or the upper support plate corresponding to the linear rack, and the gear is arranged on the driving shaft of the driving motor and meshed with the linear rack.

As an improvement of the utility model, the length of the extension frame is longer than that of the lower support plate, and the length of the lower support plate is longer than that of the extension frame; the extension frame comprises long plates, short plates and square plates, the two long plates are vertically arranged at two sides of the lower support plate, the two short plates are respectively connected to two ends of the two long plates to form a square frame, the square plates are arranged on the square frame at intervals, and the upper support plate is arranged on the square plates; the number of the ventilation cavities is multiple, and the ventilation cavities are sequentially arranged on the adsorption seat; the outline of the ventilation cavity is rectangular, and the communication hole is positioned at the geometric center point of the ventilation cavity.

As an improvement of the utility model, the silicon wafer drying box comprises a bottom frame, a lower box shell, an upper box shell, heating elements, temperature controllers and a filter plate, wherein the lower box shell is arranged on the bottom frame, the upper box shell is arranged on the lower box shell through a hinge and can be turned over to cover the lower box shell to form a box body, a drying tunnel for passing a second vacuum adsorption progressive conveying mechanism is arranged on the lower box shell, a plurality of heating elements are arranged in the upper box shell side by side along the moving direction of the drying tunnel, the top surface of the upper box shell is provided with an air suction opening communicated with an inner cavity of the upper box shell, the filter plate is arranged in the upper box shell corresponding to the lower position of the air suction opening, and a plurality of temperature controllers are arranged on the upper box shell along the moving direction of the drying tunnel;

as an improvement of the utility model, the front and rear side walls of the lower box shell are respectively provided with a T-shaped opening corresponding to the drying tunnel, and the bottom surface of the lower box shell is provided with a slot extending along the direction of the drying tunnel; the two drying tunnels are arranged in the lower box shell side by side; a handle is arranged on the upper box shell; the upper box shell is provided with a through hole for the heating body to penetrate through, the opening of the through hole is provided with a clamping plate for mounting the heating body, the clamping plate is provided with a clamping hole corresponding to the through hole, the clamping hole is provided with a high-temperature-resistant clamping sleeve, the inner hole of the high-temperature-resistant clamping sleeve is in interference fit with the connector of the heating body, and the inner wall of the through hole is not contacted with the heating body; the probe of the temperature controller extends into the upper box shell, and a protection frame capable of protecting the probe is arranged in the upper box shell.

The utility model has the advantages that: the utility model discloses a structural design is ingenious, and is reasonable, can unpack photovoltaic solar energy silicon chip segmentation apart to conveniently select out defective part, then carry out the silicon chip module that the lamination established ties out required power size to other parts, with satisfy different user demands, effectively ensure product quality moreover, avoid unnecessary extravagant, save the cost.

The present invention will be further explained with reference to the drawings and the embodiments.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a schematic structural diagram of the present invention when the rack is hidden.

Fig. 3 is a schematic perspective view of the middle detaching mechanism of the present invention.

Fig. 4 is an exploded schematic view of the middle detaching mechanism of the present invention.

Fig. 5 is a schematic structural diagram of the wafer separating mechanism in use.

Fig. 6 is a schematic perspective view of the middle separating mechanism of the present invention 1.

Fig. 7 is a schematic perspective view of the middle separating mechanism of the present invention 2.

Fig. 8 is an exploded schematic view of the middle separating mechanism of the present invention.

Fig. 9 is a schematic structural view of the middle movable upper plate of the present invention.

Fig. 10 is a schematic structural view of the middle sorting manipulator of the present invention.

Fig. 11 is a schematic structural view of the middle lamination adsorption manipulator of the present invention.

Fig. 12 is a schematic perspective view of the adsorption mechanism of the present invention.

Fig. 13 is an exploded schematic view of the adsorption mechanism of the present invention.

Fig. 14 is an exploded view of the vacuum suction module of the present invention, schematically illustrated in fig. 1.

Fig. 15 is an exploded schematic view of the vacuum adsorption module of the present invention 2.

Fig. 16 is a schematic cross-sectional structure diagram of the vacuum adsorption assembly of the present invention.

Fig. 17 is a schematic perspective view of the first vacuum adsorption progressive transfer mechanism of the present invention.

Fig. 18 is a partial structural schematic view of the first vacuum suction progressive transfer mechanism of the present invention.

Fig. 19 is a schematic structural view of the extension frame of the present invention.

Fig. 20 is a schematic structural view of the middle suction seat and the suction platen of the present invention.

Fig. 21 is a schematic view of the closed structure of the middle silicon wafer drying box of the present invention.

Fig. 22 is a schematic view of the opening structure of the middle silicon wafer drying box of the present invention.

Fig. 23 is an enlarged view of a part a of the structure in fig. 22.

Fig. 24 is a schematic view of the cross-sectional structure of the middle silicon wafer drying box of the present invention.

Fig. 25 is a schematic structural view of the middle plate of the present invention.

Detailed Description

Referring to fig. 1 to 25, the assembly line for stack tiles provided in this embodiment includes a frame 1, and a feeding conveying mechanism 2, a feeding manipulator 3, a detaching mechanism 4, a slicing mechanism 5, a sorting manipulator 6, a lamination adsorption manipulator 7, a vacuum adsorption conveyor belt 8, a first vacuum adsorption progressive conveying mechanism 9, a second vacuum adsorption progressive conveying mechanism 10, a transfer manipulator 11, a silicon wafer drying box 12, and a discharging conveying mechanism 13, which are respectively disposed on the frame 1. The feeding conveying mechanism 2, the feeding mechanical arm 3, the detaching mechanism 4, the separating mechanism 5, the sorting mechanical arm 6, the lamination adsorption mechanical arm 7, the vacuum adsorption conveying belt 8, the first vacuum adsorption progressive conveying mechanism 9, the second vacuum adsorption progressive conveying mechanism 10, the transfer mechanical arm 11, the silicon wafer drying box 12 and the discharging conveying mechanism 13 are all connected with and controlled by a PLC (programmable logic controller).

In order to improve the working efficiency, in this embodiment, the number of the detaching mechanisms 4 is two; the number of the slicing mechanisms 5 is two; the number of the vacuum adsorption conveying belts 8 is two; the number of the sorting mechanical arms 6 is two, and the number of the lamination adsorption mechanical arms 7 is two. The feeding conveying mechanism 2, the feeding mechanical arm 3, the two vacuum adsorption conveying belts 8, the two laminated adsorption mechanical arms 7 and the two discharging conveying mechanisms 13 are arranged on the rack 1 in sequence; the two piece detaching mechanisms 4 are symmetrically arranged at the two sides of the feeding manipulator 3; the two wafer separating mechanisms 5 and the two sorting manipulators 6 are arranged on the frame 1 at positions above the two vacuum adsorption conveying belts 8, the first vacuum adsorption progressive conveying mechanism 9 and the second vacuum adsorption progressive conveying mechanism 10 are arranged at positions on two sides of the two blanking conveying mechanisms 13, and the silicon wafer drying box 12 is arranged on the frame 1 at a position corresponding to the second vacuum adsorption progressive conveying mechanism 10.

The feeding conveying mechanism 2 is used for conveying the solar silicon wafer to a preset position, and the feeding conveying mechanism 2 can be a conveying belt or a manipulator and the like. The feeding manipulator 3 flatly places the solar silicon wafers conveyed by the feeding conveying mechanism 2 on the detaching mechanism 4; the splitting mechanism 4 is used for splitting the solar silicon wafer flatly placed on the splitting mechanism into a plurality of sub silicon wafers in a segmented manner.

Specifically, referring to fig. 3 and 4, the tab detaching mechanism 4 includes a tab frame 41, a fixed suction plate 42, a movable suction plate 43, a linear driving device 44 and a tab driving seat 45,

the linear driving device 44 is preferably an air cylinder, and in other embodiments, the linear driving device 44 may also be an oil cylinder or a linear motor. And the fixed adsorption plate 42 and the movable adsorption plate 43 are both provided with vacuum adsorption nozzles.

The fixed adsorption plate 42 is longitudinally fixed on the top of the folding sheet frame 41, the movable adsorption plates 43 are symmetrically positioned at two sides of the fixed adsorption plate 42 and are at the same horizontal height with the fixed adsorption plate 42, one side of the end part of the movable adsorption plate 43 is arranged on the folding sheet frame 41 through a rotating shaft 47, the linear driving device 44 is arranged on the folding sheet frame 41 corresponding to the lower position of the movable adsorption plate 43, the folding sheet driving seat 45 is arranged on a driving part of the linear driving device 44, and the folding sheet driving seat 45 is provided with a folding sheet rod 46 which can push the movable adsorption plate 43 to turn over by taking the rotating shaft 47 as an axis when the folding sheet driving seat does lifting action.

In order to improve the smoothness of rotation and prolong the service life, a bearing 48 is arranged on the rotating shaft 47, and a bearing installation cavity matched with the bearing 48 is arranged on the inner side wall of the folding sheet frame 41.

In this embodiment, a lower support strip 49 for supporting the movable suction plate 43 so that the upper surface of the movable suction plate 43 and the upper surface of the fixed suction plate 42 are on the same horizontal plane is provided on the inner sidewall of the sheet folding frame 41.

An upper limit strip 410 for preventing the movable adsorption plate 43 from being overturned excessively is arranged on the inner side wall of the folding sheet frame 41 corresponding to the upper position of the lower supporting strip 49. An elastic member 411 is disposed on the upper limit strip 410 at a position facing the movable suction plate 43. The elastic member 411 may be a spring or an elastic rubber column. The elastic force of the elastic component 411 pushes the movable adsorption plate 43 to reset, so that the upper surface of the movable adsorption plate 43 is on the same horizontal plane with the upper surface of the fixed adsorption plate 42. The lower end of the flap rod 46 is fixed on the flap driving seat 45, and the upper end of the flap rod 46 extends to a side position of the bottom surface of the movable adsorption plate 43 far away from the rotating shaft 47. During operation, the folding rod 46 pushes the movable adsorption plate 43 to compress the elastic component 411 for turning, so that the purpose of breaking the solar silicon wafer is achieved.

In other embodiments, the lower supporting strip 49, the upper limiting strip 410 and the elastic member 411 may not be provided to simplify the overall structure. The tilting angle of the movable suction plate 43 is controlled directly by the extension and contraction of the linear driving device 44, so that the upper surface of the movable suction plate 43 is at the same level or not at the same level as the upper surface of the fixed suction plate 42. Specifically, the lower end of the flap lever 46 is fixed on the flap driving seat 45, and the upper end of the flap lever 46 is hinged to a side of the bottom surface of the movable suction plate 43 away from the rotating shaft 47. Since the folding piece rod 46 is hinged with the adsorption plate, the folding piece rod 46 can drive the movable adsorption plate 43 to return to the initial position when moving downwards.

The feeding conveying mechanism 2 is characterized in that when the feeding conveying mechanism 2 works, solar silicon wafers are stably fixed on the fixed adsorption plate 42 and the movable adsorption plate 43 through adsorption of the vacuum adsorption nozzle, the linear driving device 44 drives the folding rod 46 to move upwards to push the movable adsorption plate 43 to turn over, so that the upper surface of each movable adsorption plate 43 and the upper surface of the fixed adsorption plate 42 are not on the same horizontal plane, the solar silicon wafers are disassembled in a segmented mode, at the moment, defective sub-silicon wafers can be conveniently selected, other sub-silicon wafers are reserved, unnecessary waste is avoided, cost is saved, and meanwhile the quality of a silicon wafer module can be guaranteed.

The slicing mechanism 5 is used for separating a plurality of sliced sub-silicon wafers which are segmented and split by the slicing mechanism 4 by a certain distance and moving the sliced sub-silicon wafers onto a vacuum adsorption conveying belt 8; specifically, referring to fig. 5 to 9, the slicing mechanism 5 is mounted on a three-axis manipulator. The slicing mechanism 5 comprises a slicing frame 51, a fixed lower plate 52, a movable upper plate 53, a telescopic driving device 54, a linear slide rail 55, a fixed seat 56, a slide column 57, a slide seat 58 and a suction nozzle 59.

The telescopic driving device 54 is arranged on the upper surface of the fixed lower plate 52, the wafer dividing frame 51 is arranged on the fixed lower plate 52, and specifically, the wafer dividing frame 51 and the fixed lower plate 52 form a cavity, and the telescopic driving device 54 is located in the cavity.

The movable upper plate 53 is movably provided with the upper surface of the fixed lower plate 52 corresponding to the front position of the telescopic driving device 54, and is driven by the telescopic driving device 54 to perform telescopic action relative to the fixed lower plate 52, the movable upper plate 53 is provided with a plurality of inclined long holes 531 forming a certain included angle with the telescopic track line thereof, and the included angle is preferably 14-25 degrees; wherein the included angle a is smaller near the center line of the movable upper plate 53 and the included angle b is larger away from the center line. In the present embodiment, the included angle a is preferably 13 degrees, and the included angle b is preferably 23 degrees.

The linear slide rail 55 is arranged on the lower surface of the fixed lower plate 52, the fixed seat 56 is fixed on the lower surface of the fixed lower plate 52 corresponding to one side of the middle of the linear slide rail 55, the plurality of slide seats 58 and the corresponding inclined long holes 531 are movably arranged on the linear slide rail 55, the lower end of the sliding column 57 is fixed on the slide seat 58, the upper end of the sliding column 57 penetrates through the fixed lower plate 52 and extends into the inclined long holes 531, and the suction nozzle 59 is arranged on the slide seat 58 and the fixed seat 56.

In this embodiment, the telescopic driving device 54 is an air cylinder, and in other embodiments, the telescopic driving device 54 may be an oil cylinder or a linear motor.

The bottom of the sliding base 58 is provided with a mounting rod 581 parallel to the telescopic track line of the movable upper plate 53, and the suction nozzles 59 are arranged on the bottom surfaces of two ends of the mounting rod 581; the fixed lower plate 52 is provided with a guide long hole 521 perpendicular to the telescopic path line of the movable upper plate 53, and the sliding column 57 penetrates the fixed lower plate 52 through the guide long hole 521.

Preferably, a sliding sleeve 571 is sleeved at a position of the sliding column 57 corresponding to the guiding long hole 521, and a pulley 572 is sleeved at a position of the sliding column 57 corresponding to the inclined long hole 531, so that sliding friction is changed into rolling friction, and therefore, the action fit is more flexible and smoother, the abrasion is reduced, and the service life is long.

In this embodiment, the number of the mounting rods 581 is five. Two suction nozzles 59 are provided on each mounting bar 581. When the slicing mechanism 5 works, the telescopic driving device 54 is in a retraction state in an initial state. The sliding columns 57 are located at the front end of the inclined long holes 531, so that the mounting rods 581 are in a close fit state, after the sub-silicon wafers are adsorbed by the suction nozzles 59, the telescopic driving device 54 extends out to push out the movable upper plate 53, the sliding columns 57 can only do actions perpendicular to telescopic tracks of the movable upper plate 53 under the limitation of the guide of the inclined long holes 531 and the guide long holes 521, the sliding seat 58 is further driven to move outwards, and the mounting rods 581 can further do separating actions to separate the sub-silicon wafers, so that the defective sub-silicon wafers can be conveniently selected and retained, unnecessary waste is avoided, the cost is saved, and the quality of the silicon wafer module can be ensured.

The sorting manipulator 6 is used for sorting the plurality of sub silicon wafers on the vacuum adsorption conveyor belt 8 and separately placing the sub silicon wafers with chamfers and the sub silicon wafers without chamfers; specifically, referring to fig. 10, the sorting robot 6 includes a three-axis robot 61, a mounting plate 62, a two-rod cylinder 63, a nozzle holder 64, and a nozzle 65 disposed on the nozzle holder 64, the mounting plate 62 is disposed on the three-axis robot 61, five two-rod cylinders 63 are spaced side by side on the mounting plate 62, and the nozzle holder 64 is disposed on a piston rod of the two-rod cylinder 63. During sorting, the double-rod cylinder 63 corresponding to the position of the sub-silicon wafer to be adsorbed stretches out, the sub-silicon wafer to be moved is adsorbed by the suction nozzle 65, and other double-rod cylinders 63 do not work, so that the sub-silicon wafer with the chamfer and the sub-silicon wafer without the chamfer are separately placed.

The lamination adsorption manipulator 7 is used for stacking the sub-silicon wafers with chamfers or the sub-silicon wafers without chamfers on the first vacuum adsorption progressive conveying mechanism 9 according to a preset stacking rule, so that the corresponding number of sub-silicon wafers are stacked and connected in series to form a silicon wafer module; specifically, referring to fig. 11 to 16, the lamination suction robot 7 includes a four-axis robot body 71 and a suction mechanism 72 disposed on the four-axis robot body 71.

Referring to fig. 12 and 13, the suction mechanism 72 includes a cross plate 721, an up-down driving device 722, and a vacuum suction assembly 723.

Referring to fig. 13, a mounting portion 7211 is formed by protruding the rear side of the middle portion of the transverse plate 721, a mounting hole 7212 is formed in the mounting portion 7211, a limit flange 7213 is formed on the upper edge of the mounting hole 7212, an installation and connection seat 711 is formed on an output shaft of the four-axis robot body 71, a limit cavity matched with the outline of the limit flange 7213 is formed in the middle portion of the bottom surface of the lower end of the installation and connection seat 711, a screw hole is formed in the peripheral position of the lower end of the installation and connection seat 711, an assembly hole 7214 corresponding to the screw hole is formed in the mounting portion 7211, and a plurality of vertical driving devices 722 are symmetrically arranged on two sides of the transverse.

The vacuum suction unit 723 is provided to a driving member of the up-down driving device 722. Specifically, in fig. 14, 15 and 16, the vacuum suction assembly 723 includes a coupling plate 7231, a suction seat 7232, a suction plate 7233 and an air pipe joint 7234, the upper and lower surfaces of the coupling plate 7231 are respectively provided with an upper countersunk hole 72311 and a lower countersunk hole 72312, the coupling plate 7231 is fixed on the transverse plate 721 by screwing through the lower countersunk hole 72312 into the transverse plate 721, the suction seat 7232 is fixed on the coupling plate 7231 by screwing through the upper countersunk hole 72311 into the suction seat 7232, a main hole 72321 extending along the long side of the suction seat 7232 is provided in the suction seat 7232, one end of the main hole 72321 extends to the side wall of the suction seat 7232 to form a mounting opening, and the air pipe joint 7234 is screwed into the mounting opening; for convenience of processing, the main air hole 72321 is formed to integrally penetrate the suction seat 7232. That is, the other end of the main air hole 72321 extends to the other side wall of the air suction seat 7232 to form an assembly opening, and the assembly opening is closed by screwing a sealing screw 7235; when cleaning and maintenance are needed, the main air hole 72321 can be cleaned by unscrewing the sealing screw 7235. Meanwhile, the positions of the air pipe joint 7234 and the sealing screw 7235 can be interchanged to meet the wiring requirements of different pipelines.

The bottom surface of the air suction seat 7232 is vertically provided with an air distribution hole 72322 communicated with the main air hole 72321, the suction plate 7233 is fixed on the bottom surface of the air suction seat 7232 through screws, and is provided with an adsorption hole 72331 corresponding to the air distribution hole 72322; preferably, the pore diameter of the adsorption pore 72331 is larger than that of the gas separation pore 72322, and preferably, the pore diameter of the adsorption pore 72331 is preferably 3-4 times that of the gas separation pore 72322, so that the adsorption stability can be further improved;

in this embodiment, the number of the up-down driving devices 722 is six, and the up-down driving devices are divided into two groups and symmetrically arranged on the lower surfaces of the two ends of the horizontal plate 721. The up-down driving device 722 is preferably an air cylinder, and in other embodiments, the up-down driving device 722 may also be an oil cylinder or a linear motor. A control valve seat 724 for controlling the up-down driving device 722 is provided on an upper surface of one end of the cross plate 721, and an electromagnetic valve 725 for controlling the connection or disconnection of a pipe connected to the air pipe connector 7234 is provided on an upper surface of the other end.

When the laminated adsorption manipulator 7 works, the four-axis manipulator body 71 drives the adsorption mechanism 72 to move to the position above the vacuum adsorption conveyor belt 8, the four-axis manipulator body 71 drives the adsorption mechanism 72 to move downwards to adsorb the sub-silicon wafer with the chamfer and/or the sub-silicon wafer without the chamfer, then the four-axis manipulator body 71 drives the adsorption mechanism 72 to move upwards and move to the position above the first vacuum adsorption progressive conveyor mechanism 9, then the four-axis manipulator body 71 drives the adsorption mechanism 72 to move downwards to place the sub-silicon wafer with the chamfer and/or the sub-silicon wafer without the chamfer to the first vacuum adsorption progressive conveyor mechanism 9, each time the sub-silicon wafer is placed, the first vacuum adsorption progressive conveyor mechanism 9 moves forwards for a certain position, so that the sub-silicon wafer placed later can be partially overlapped with the sub-silicon wafer placed earlier, and contact points on the overlapped sub-silicon wafers can be overlapped and connected in series, until the number of sub-silicon wafers required for stacking is reached, the first vacuum adsorption progressive transfer mechanism 9 moves forward to a large position, so that the previous silicon wafer module and the next silicon wafer module have a sufficient interval. The lamination adsorption manipulator 7 does not adsorb the sub-silicon wafers with defects, and the sub-silicon wafers with defects automatically fall into a waste material box prepared in advance under the continuous conveying of the vacuum adsorption conveying belt 8, so that the sub-silicon wafers with defects are separated.

The first vacuum adsorption progressive conveying mechanism 9 is used for conveying and placing the silicon wafer modules; specifically, referring to fig. 17 to 20, the first vacuum suction progressive transfer mechanism 9 includes a ground rail 91, a linear rack 92, a lower support plate 93, an extension frame 94, an upper support plate 95, a vertical frame 96, a suction seat 97, a suction platen 98, a pneumatic joint 99, a driving motor 910, and a gear 911. The driving motor 910 may be a stepping motor or a servo motor.

Two sides of the ground rail 91 are provided with slide rails 912 extending along the long edge direction of the ground rail, and the linear rack 92 is arranged on the ground rail 91 and is parallel to the slide rails 912; support board 93 passes through slider 913 activity setting on slide rail 912, go up extension board 95 and set up on support board 93 down through extension frame 94, and is specific, extension frame 94 includes rectangular plate 941, short plate 942 and square plate 943, and two vertical settings in the both sides position of support board 93 down of rectangular plate 941, and two short plates 942 are connected respectively and are formed the square frame at the both ends of two rectangular plates 941, and polylith square plate 943 interval sets up on the square frame, it sets up on square plate 943 to go up extension board 95.

A plurality of vertical shelves 96 are spaced apart and arranged on the upper support plate 95. The adsorption base 97 is horizontally arranged on the vertical frame 96, the upper surface of the adsorption base 97 is inwards recessed to form a ventilation cavity 971, and the lower surface of the adsorption base 97 is provided with a communication hole 972 connected with the ventilation cavity 971. In this embodiment, the number of the vent cavities 971 is multiple, and the vent cavities are sequentially arranged on the adsorption base 97; the vent chamber 971 has a rectangular outline, and the communication hole 972 is preferably located at a geometric center of the vent chamber 971.

The pneumatic connector 99 is disposed on the communication hole 972, the suction platen 98 covers the opening of the ventilation cavity 971, a plurality of air holes connected with the ventilation cavity 971 are distributed on the suction platen 98, the driving motor 910 is disposed on the extension frame 94 through a motor base at a position corresponding to the linear rack 92, and the driving motor 910 may be disposed on the lower support plate 93 or the upper support plate 95, and the gear 911 is disposed on a driving shaft of the driving motor 910 and engaged with the linear rack 92.

Preferably, the length of the extension bracket 94 is longer than the lower support plate 93, and is about twice the length of the lower support plate 93. The lower support plate 93 is slightly longer than the extension bracket 94.

The second vacuum suction progressive transfer mechanism 10 and the first vacuum suction progressive transfer mechanism 9 have the same structure. The second vacuum adsorption progressive conveying mechanism 10 is used for conveying the silicon wafer module into or out of the silicon wafer drying box 12.

First vacuum adsorption conveying mechanism 9 that advances is different from traditional vacuum adsorption conveyer belt structure, and traditional vacuum adsorption conveyer belt's high temperature resistance can not be good, gets into silicon chip stoving case 12 after, appears the deformation phenomenon easily, influences absorbent stability, and life is short moreover.

The first vacuum adsorption progressive conveying mechanism 9 is conveyed by adopting a flat plate type structure, the adsorption bedplate 98 and the adsorption seat 97 are all made of metal, the high-temperature resistance is good, the deformation cannot occur under the high-temperature baking of the silicon wafer drying box 12, the flatness and the integral straightness of a conveying surface are ensured, the adsorption stability is improved, and the product quality is further ensured.

The silicon wafer drying box 12 is used for drying the silicon wafer module; specifically, see fig. 21-25. The silicon wafer drying box 12 comprises a bottom frame 121, a lower box casing 122, an upper box casing 123, a heating element 124, a temperature controller 125 and a filter plate 126. The lower case 122 is disposed on the bottom frame 121, the upper case 123 is disposed on the lower case 122 through a hinge 127, and can be turned over and covered on the lower case 122 by using the hinge 127 as an axis to form a box, and the lower case 122 is provided with a drying tunnel for passing the second vacuum adsorption progressive transfer mechanism 10. Preferably, the heat insulation cotton is arranged on the inner walls of the lower box shell 122 and the upper box shell 123, so that hot air in the box and air outside the box are effectively separated, better heat insulation and heat insulation effects are achieved, the electric power cost is saved, and external elements can be protected.

The plurality of heating bodies 124 are arranged in the upper box shell 123 at intervals along the moving direction of the drying tunnel, specifically, a through hole through which the heating body 124 penetrates is formed in the upper box shell 123, a clamping plate 129 used for installing the heating body 124 is arranged at the opening of the through hole, a clamping hole 1291 corresponding to the through hole is formed in the clamping plate 129, a high-temperature-resistant clamping sleeve 1292 is arranged in the clamping hole 1291, the inner hole of the high-temperature-resistant clamping sleeve 1292 is in interference fit with the connector of the heating body 124, and the inner wall of the through hole is not in contact with the heating body 124. The high-temperature-resistant cutting sleeve 1292 comprises a front rubber sleeve and a rear rubber sleeve, wherein one end of the front rubber sleeve is radially reduced to form an insertion part which can be inserted into the rear rubber sleeve, and the insertion part penetrates through the clamping hole 1291 and is inserted into the rear rubber sleeve to realize the purpose of being fixed on the clamping hole 1291. And the connector of the heating element 124 extends out of the inner hole of the front buckle rubber sleeve and is in interference fit.

An air suction opening 128 communicated with the inner cavity of the upper box shell 123 is formed in the top surface of the upper box shell 123, the filter plate 126 is arranged in the upper box shell 123 corresponding to the lower position of the air suction opening 128, and the plurality of temperature controllers 125 are arranged on the upper box shell 123 at intervals along the moving direction of the drying tunnel;

preferably, T-shaped openings 1221 corresponding to the drying tunnel are respectively formed on the front and rear side walls of the lower casing 122, and a slot 1222 extending along the drying tunnel is formed on the bottom surface of the lower casing 122, so as to be better adapted to the contour of the assembly formed by the combination of the suction platen 98, the suction seat 97 and the vertical frame 96.

For promoting drying efficiency, the drying tunnel is two, side by side in lower case shell 122.

The upper box shell 123 is provided with a handle 120, which brings convenience to operation and use.

The probe of the temperature controller 125 extends into the upper box casing 123, and a protection frame 130 capable of protecting the probe 1251 is arranged in the upper box casing 123, so that the probe 1251 is prevented from being damaged by foreign matters during ventilation and air draft, and the service life of the probe 1251 is prolonged. Specifically, this protection frame 130 includes top flap, lower separation blade, adjusting screw and connecting rod, and two adjusting screw symmetries set up the both ends upper surface at top flap, and the both ends lower surface at top flap is connected to the upper end of two connecting rods, and the lower extreme is connected with lower separation blade, and two adjusting screw run through upper box shell 123 and have screwed adjusting nut. The middle part of the upper baffle plate is provided with an opening. After the protection frame 130 is installed, the probe 1251 of the temperature controller 125 sequentially penetrates through the upper box shell 123 and the opening, and extends into a protection space formed by the upper baffle and the lower baffle.

When the silicon wafer drying box 12 works, the upper box shell 123 is covered on the lower box shell 122 to form a box body with a rather sealed space, so that heat loss can be effectively prevented, the plurality of heating bodies 124 can simultaneously heat, the temperature in the box body can be quickly raised, and the drying efficiency is high; meanwhile, the temperature of each position in the box body is monitored through a plurality of temperature controllers 125, so that the uniformity of the temperature of each position is ensured, the drying effect is improved, and the product quality is ensured; and can directly turn over upper box shell 123, be convenient for carry out clean arrangement to lower box shell 122, make things convenient for daily maintenance and maintenance. In addition, water vapor in the box body can be pumped away through the air suction opening 128, and the drying efficiency and quality are further improved.

The transfer manipulator 11 is used for transferring the silicon wafer modules on the first vacuum adsorption progressive conveying mechanism 9 to the second vacuum adsorption progressive conveying mechanism 10, or transferring the silicon wafer modules on the second vacuum adsorption progressive conveying mechanism 10, which have finished the drying process, to the blanking conveying mechanism 13. The transferring manipulator 11 comprises a transverse moving mechanism, a lifting mechanism arranged on the transverse moving mechanism and a negative pressure adsorption assembly arranged on the lifting mechanism.

The blanking conveying mechanism 13 is used for conveying the silicon wafer modules positioned on the blanking conveying mechanism to a preset position. The blanking conveying mechanism 13 may be a conveyor belt or a robot.

During operation, the utility model discloses a working procedure as follows:

(1) detecting a solar silicon wafer by a detection system in advance to obtain whether the solar silicon wafer has a defect and a coordinate position of the defect, recording and transmitting the defect and the coordinate position to a PLC (programmable logic controller); the feeding conveying mechanism 2 conveys the detected solar silicon wafer to a preset position;

(2) the feeding manipulator 3 flatly places the solar silicon wafers conveyed by the feeding conveying mechanism 2 on the detaching mechanism 4;

(3) the splitting mechanism 4 splits the solar silicon wafer horizontally placed on the splitting mechanism into five sub-silicon wafers in a segmented manner, wherein the two sub-silicon wafers at the two sides have chamfers, and the three sub-silicon wafers at the middle part do not have chamfers;

(4) the slicing mechanism 5 separates five sliced sub-silicon wafers which are segmented and split by the slicing mechanism 4 by a certain distance and moves the five sliced sub-silicon wafers to the vacuum adsorption conveying belt 8;

(5) the sorting mechanical arm 6 sorts the five sub-silicon wafers on the vacuum adsorption conveying belt 8, and the sub-silicon wafers with chamfers and the sub-silicon wafers without chamfers are separately placed;

(6) the lamination adsorption manipulator 7 places the sub-silicon wafers with chamfers or the sub-silicon wafers without chamfers on the first vacuum adsorption progressive conveying mechanism 9 according to a preset stacking rule, so that the corresponding number of the sub-silicon wafers are connected in series to form a silicon wafer module, and the stacking series number of the sub-silicon wafers is determined according to the power wattage of the required silicon wafer module; when the sub silicon wafers are placed once, the first vacuum adsorption progressive conveying mechanism 9 moves forwards for a certain position, so that the sub silicon wafers placed later can be partially overlapped with the sub silicon wafers placed earlier, contact points on the overlapped sub silicon wafers can be overlapped and communicated, and when the required number of the sub silicon wafers are overlapped, the first vacuum adsorption progressive conveying mechanism 9 moves forwards for a larger position, so that a previous silicon wafer module and a next silicon wafer module have enough intervals. The PLC automatically analyzes the coordinate position of the defect fed back by the detection system to obtain that the defect is specifically positioned on the sub-silicon wafer, and then controls the lamination adsorption manipulator 7 not to adsorb the sub-silicon wafer with the defect, and the sub-silicon wafer with the defect automatically falls into a waste material box prepared in advance under the continuous conveying of the vacuum adsorption conveying belt 8 to separate the sub-silicon wafer with the defect;

(7) the transfer manipulator 11 transfers the silicon wafer module on the first vacuum adsorption progressive conveying mechanism 9 to the second vacuum adsorption progressive conveying mechanism 10;

(8) the second vacuum adsorption progressive conveying mechanism 10 sends the silicon wafer module into a silicon wafer drying box 12;

(9) the silicon wafer drying box 12 is used for drying the silicon wafer module on the second vacuum adsorption progressive conveying mechanism 10;

(10) after drying, the second vacuum adsorption progressive conveying mechanism 10 exits the silicon wafer drying box 12 to a preset position;

(11) the transfer manipulator 11 transfers the silicon wafer module which is finished with the drying process on the second vacuum adsorption progressive conveying mechanism 10 to the blanking conveying mechanism 13;

(12) the blanking conveying mechanism 13 conveys the silicon wafer modules positioned on the blanking conveying mechanism to a preset position. The utility model provides a method step is simple, easily realizes, can unpack photovoltaic solar energy silicon chip segmentation apart to conveniently select out defective part, then carry out the silicon chip module that the lamination established ties out required power size to other parts, with satisfy different user demands, effectively ensure product quality moreover, avoid unnecessary extravagant, save the cost.

Variations and modifications to the above-described embodiments may occur to those skilled in the art, in light of the above teachings and teachings. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should fall within the protection scope of the claims of the present invention. In addition, although specific terms are used in the specification, the terms are used for convenience of description and do not limit the present invention, and other devices obtained by using the same or similar structures as those of the above-described embodiments of the present invention are within the protection scope of the present invention.

Claims (10)

1. The utility model provides a stack tile assembly line which characterized in that: which comprises

The feeding conveying mechanism is used for conveying the solar silicon wafer to a preset position;

the feeding manipulator is used for flatly placing the solar silicon wafers conveyed by the feeding conveying mechanism on the detaching mechanism;

the splitting mechanism is used for splitting the solar silicon wafer flatly placed on the splitting mechanism into a plurality of sub silicon wafers in a segmented manner;

the slicing mechanism is used for separating a plurality of sub silicon wafers which are segmented and split by the slicing mechanism by a certain distance and moving the sub silicon wafers to a vacuum adsorption conveyor belt;

the sorting mechanical arm is used for sorting the plurality of sub silicon wafers on the vacuum adsorption conveying belt and separately placing the sub silicon wafers with chamfers and the sub silicon wafers without chamfers;

the lamination adsorption manipulator is used for stacking the sub-silicon wafers with chamfers or the sub-silicon wafers without chamfers on the first vacuum adsorption progressive conveying mechanism according to a preset stacking rule, so that the corresponding number of sub-silicon wafers are stacked and connected in series to form a silicon wafer module;

the first vacuum adsorption progressive conveying mechanism is used for conveying and placing the silicon wafer modules;

the transfer manipulator is used for transferring the silicon wafer module on the first vacuum adsorption progressive conveying mechanism to the second vacuum adsorption progressive conveying mechanism or transferring the silicon wafer module which is subjected to the drying process on the second vacuum adsorption progressive conveying mechanism to the blanking conveying mechanism;

the second vacuum adsorption progressive conveying mechanism is used for conveying the silicon wafer module into or out of the silicon wafer drying box;

the silicon wafer drying box is used for drying the silicon wafer module;

and the blanking conveying mechanism is used for conveying the silicon wafer modules positioned on the blanking conveying mechanism to a preset position.

2. The shingle assembly line according to claim 1, wherein the shingle removing mechanism comprises a shingle holder, a fixed adsorption plate, a movable adsorption plate, a linear driving device and a shingle driving seat, the fixed adsorption plate is longitudinally fixed on the top of the shingle holder, the movable adsorption plate is symmetrically arranged on two sides of the fixed adsorption plate and is at the same horizontal height with the fixed adsorption plate, one side of the end of the movable adsorption plate is arranged on the shingle holder through a rotating shaft, the linear driving device is arranged on the shingle holder corresponding to the lower position of the movable adsorption plate, the shingle driving seat is arranged on a driving part of the linear driving device, and the shingle driving seat is provided with a shingle rod capable of pushing the movable adsorption plate to turn over by taking the rotating shaft as an axis when the shingle driving seat performs lifting action.

3. The shingle assembly line according to claim 2, wherein a bearing is provided on the rotating shaft, and a bearing installation cavity adapted to the bearing is provided on an inner side wall of the fold rack; the inner side wall of the sheet folding frame is provided with a lower supporting strip which supports the movable adsorption plate so that the upper surface of the movable adsorption plate and the upper surface of the fixed adsorption plate are on the same horizontal plane; the upper position corresponding to the lower supporting strip is arranged on the inner side wall of the folding rack, and an upper limit strip for preventing the movable adsorption plate from turning excessively is arranged on the inner side wall of the folding rack.

4. The shingle assembly line according to claim 3, wherein the shingle-dividing mechanism comprises a shingle-dividing frame, a fixed lower plate, a movable upper plate, a telescopic driving device, a linear slide rail, a fixed seat, a slide post, a slide seat and a suction nozzle, wherein the telescopic driving device is arranged on the upper surface of the fixed lower plate, the shingle-dividing frame is arranged on the fixed lower plate, the movable upper plate is movably arranged on the upper surface of the fixed lower plate corresponding to the front position of the telescopic driving device and is driven by the telescopic driving device to perform telescopic action relative to the fixed lower plate, the movable upper plate is provided with a plurality of inclined long holes forming a certain included angle with the telescopic track line of the movable upper plate, the linear slide rail is arranged on the lower surface of the fixed lower plate, the fixed seat is fixed on the lower surface of the fixed lower plate corresponding to the middle position of the linear slide rail, and the plurality of slide seats and the inclined long holes, the lower end of the sliding column is fixed on the sliding seat, the upper end of the sliding column penetrates through the fixed lower plate and extends into the inclined long hole, and the suction nozzle is arranged on the sliding seat and the fixed seat.

5. The shingle assembly line according to claim 4, wherein a sliding sleeve is sleeved on the sliding column at a position corresponding to the long guide hole; and pulleys are sleeved at the positions of the sliding columns corresponding to the inclined long holes.

6. The shingle assembly line according to claim 1, wherein the lamination suction robot comprises a four-axis robot body and a suction mechanism provided on the four-axis robot body, the adsorption mechanism comprises a transverse plate, an up-and-down driving device and a vacuum adsorption component, wherein the rear side of the middle position of the transverse plate is convex to form an installation part, the mounting part is provided with a mounting hole, the upper edge of the mounting hole is provided with a limit flange, the output shaft of the four-shaft manipulator body is provided with a mounting connecting seat, the middle position of the bottom surface of the lower end of the mounting and connecting seat is provided with a limit cavity matched with the outline of the limit flange, the lower extreme peripheral position of this erection joint seat is equipped with the screw hole, and be equipped with on the installation department with the corresponding pilot hole of this screw hole, a plurality of upper and lower drive arrangement symmetries are in the both sides of diaphragm side by side, the vacuum adsorption subassembly sets up on drive arrangement's drive part about this.

7. The shingle assembly line according to claim 6, wherein the vacuum suction assembly comprises a connecting plate, a suction seat, a suction plate and a gas pipe joint, the upper surface and the lower surface of the connecting plate are respectively provided with an upper countersunk hole and a lower countersunk hole, the connecting plate is fixed on the transverse plate by screwing a screw into the transverse plate through the lower countersunk hole, the suction seat is fixed on the connecting plate by screwing the screw into the suction seat through the upper countersunk hole, a main gas hole extending along the long edge of the suction seat is arranged in the suction seat, one end of the main gas hole extends to the side wall of the suction seat to form a mounting opening, and the gas pipe joint is screwed into the mounting opening; the bottom surface of the air suction seat is vertically provided with an air distribution hole communicated with the main air hole, and the suction plate is fixed on the bottom surface of the air suction seat through screws and is provided with an adsorption hole corresponding to the air distribution hole.

8. The shingle assembly line according to claim 1, wherein the first vacuum suction feed mechanism comprises a ground rail, a linear rack, a lower support plate, an extension frame, an upper support plate, a vertical frame, a suction seat, a suction platen, a pneumatic joint, a drive motor, and a gear; the two sides of the ground rail are provided with slide rails extending along the long edge direction of the ground rail, and the linear rack is arranged on the ground rail and is parallel to the slide rails; the lower support plate is movably arranged on the slide rail through a slide block, the upper support plate is arranged on the lower support plate through an extension frame, a plurality of vertical frames are arranged on the upper support plate side by side at intervals, the adsorption seat is horizontally arranged on the vertical frames, the upper surface of the adsorption seat is inwards recessed to form a ventilation cavity, the lower surface of the adsorption seat is provided with a communication hole connected with the ventilation cavity, the pneumatic connector is arranged on the communication hole, the adsorption bedplate covers the opening of the ventilation cavity, a plurality of air holes connected with the ventilation cavity are distributed on the adsorption bedplate, the driving motor is arranged on the lower support plate, the extension frame or the upper support plate at a position corresponding to the linear rack, and the gear is arranged on the driving shaft of the driving motor and meshed with the linear rack; the extension frame comprises long plates, short plates and square plates, the two long plates are vertically arranged at the two sides of the lower support plate, the two short plates are respectively connected to the two ends of the two long plates to form a square frame, the plurality of square plates are arranged on the square frame at intervals, and the upper support plate is arranged on the square plates.

9. The laminated tile assembly line according to claim 1, wherein the silicon wafer drying box comprises a bottom frame, a lower box shell, an upper box shell, heating bodies, temperature controllers and filter plates, the lower box shell is arranged on the bottom frame, the upper box shell is arranged on the lower box shell through hinges, a box body is formed by covering the lower box shell in a turnover mode, a drying tunnel allowing the second vacuum adsorption progressive conveying mechanism to pass through is arranged on the lower box shell, the heating bodies are arranged in the upper box shell side by side along the moving direction of the drying tunnel, an air suction opening communicated with an inner cavity of the upper box shell is formed in the top surface of the upper box shell, the filter plates are arranged in the upper box shell in a mode corresponding to the lower position of the air suction opening, and the temperature controllers are arranged on the upper box shell along the moving direction of the drying tunnel at intervals.

10. The shingle assembly line according to claim 9, wherein the lower casing has T-shaped openings formed in front and rear side walls thereof, respectively, corresponding to the drying tunnel, and a slot extending along the direction of the drying tunnel is formed in a bottom surface of the lower casing.

Images