CN115892658B - Automatic silicon wafer film tearing machine and silicon wafer blanking system - Google Patents

Automatic silicon wafer film tearing machine and silicon wafer blanking system Download PDF

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Publication number
CN115892658B
CN115892658B CN202310154330.5A CN202310154330A CN115892658B CN 115892658 B CN115892658 B CN 115892658B CN 202310154330 A CN202310154330 A CN 202310154330A CN 115892658 B CN115892658 B CN 115892658B
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film
silicon wafer
lifting
reel
attached
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CN115892658A (en
Inventor
董晓清
安迪
金磊
唐炼蓉
朱烽
王献飞
周煜杰
郑琦
熊波
高刘
王加龙
顾庆龙
申俊宇
王小彬
陆文轩
杨义
沈强强
詹尔豪
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Wuxi Jiangsong Technology Co ltd
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Wuxi Jiangsong Technology Co ltd
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention discloses an automatic film tearing machine and a blanking system for a silicon wafer, which can realize the rapid automatic film tearing of the silicon wafer, improve the processing efficiency, ensure the separation of a diaphragm from the silicon wafer and improve the film tearing effect, and the automatic film tearing machine for the silicon wafer comprises: the film winding mechanism comprises a winding shaft and a winding shaft driving device for driving the winding shaft to rotate, the winding shaft comprises two half shafts, and the transfer mechanism is matched with the film attaching mechanism to wind the protective film onto the winding shaft; the silicon wafer blanking system comprises a carrier plate lifting table, a film-attached silicon wafer blanking position, a film rolling mechanism in the silicon wafer automatic film tearing machine, a silicon wafer blanking transmission table and a flower basket lifting mechanism which are distributed in sequence, wherein the film-attached silicon wafer on the carrier plate is transferred to the film rolling mechanism through a transfer mechanism, and after the film is torn off through the film rolling mechanism, the silicon wafer is transmitted to an empty flower basket in the flower basket lifting mechanism through the silicon wafer blanking transmission table, so that the silicon wafer automatic blanking is realized.

Description

Automatic silicon wafer film tearing machine and silicon wafer blanking system
Technical Field
The invention relates to the technical field of silicon wafer processing, in particular to an automatic silicon wafer film tearing machine and a silicon wafer blanking system.
Background
With the development of large-scale integrated circuits, silicon wafers are widely used as main substrate materials for electronic products such as semiconductors. The thickness, the surface roughness and the like of the silicon wafer are main indexes for influencing the performance of the electronic product, in order to ensure the quality of the silicon wafer and prevent the problems of silicon wafer fragments, surface abrasion and the like in the processing process of the silicon wafer, a layer of protective film is required to be attached to the front surface and/or the back surface of the silicon wafer, but in the subsequent processing processes of silicon wafer cutting, separating, coating and the like, the protective film is required to be removed, the traditional film removing mode is cleaning liquid cleaning or manual film tearing, and one cleaning liquid cleaning mode is as follows: firstly, cleaning PECVD (plasma enhanced chemical vapor deposition) by adopting hydrofluoric acid, then preparing cleaning solution with proper concentration by using HF and pure water, soaking and cleaning a coated silicon wafer to remove films, wherein the mode has higher technological requirements on components, concentration ratio, temperature and the like in the cleaning solution, is extremely easy to generate certain corrosion on circuits and the like on the surface of the silicon wafer, is commonly used for cleaning the coating film on the surface of an unqualified silicon wafer, and is not suitable for removing a protective film attached to the surface of the silicon wafer; the mode of manual film tearing is time-consuming and labor-consuming, and is low in efficiency, and secondary damages such as silicon wafer surface abrasion and collision are extremely easy to occur due to the influence of human factors.
In the existing silicon wafer automatic processing equipment, a solar cell film tearing equipment is provided, and the patent number is: 201620201922.3 this equipment is including the conveyer that is used for carrying the silicon chip, protection film separation pretreatment mechanism, dyestripping mechanism comprises last dyestripping mechanism, lower dyestripping mechanism, including the adhesion roller, the sticky tape, the gyro wheel, protection film separation pretreatment mechanism is blowing mechanism or brush mechanism, when the dyestripping, sweep the protection film of silicon chip front end upper and lower surface or rotate the protection film of friction silicon chip upper and lower surface through the brush mechanism through blowing mechanism, make the protection film of silicon chip upper and lower surface separate with corresponding photosensitive film in advance, thereby improve the dyestripping yield and the dyestripping efficiency of last dyestripping mechanism and lower dyestripping mechanism, but the adherence compactness of silicon film and eutectic silicon is different, and blowing mechanism has limited or the brush friction dynamics is limited, can get rid of fast to the silicon film that is not inseparable with the eutectic silicon film, when the adhesion is inseparable with the silicon film, then probably because of the dyestripping dynamics is not enough appear silicon film and the unable scheduling problem of separation of eutectic silicon, the dyestripping effect is worse, follow-up processing procedure has seriously influenced smoothly.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides the automatic film tearing machine for the silicon wafers, which can realize automatic film tearing of the silicon wafers, can realize rapid automatic film tearing of the silicon wafers, is simple and quick in film tearing operation, saves time and labor, can improve the processing efficiency, can ensure the separation of the film and the silicon wafers, and can improve the film tearing effect.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the automatic film tearing machine for the silicon wafer comprises a workbench and a transfer mechanism arranged on the workbench, wherein the transfer mechanism is used for adsorbing and transferring a film-attached silicon wafer, a protective film is attached to the back surface of the film-attached silicon wafer, a plurality of convex blocks which are distributed at intervals are arranged on the edges of two sides of the protective film, and the convex blocks protrude out of the edges of the film-attached silicon wafer.
The spool includes two at least groups, each the spool parallel interval install in the top curb plate of first mount pad to drive through corresponding spool drive arrangement respectively, spool drive arrangement all includes: the first pneumatic clamping jaw cylinder and the first rotating motor are distributed on one side of the scroll, the third mounting seat is used for mounting the first rotating motor, the second pneumatic clamping jaw cylinder and the slip ring are distributed on the other side of the scroll, the shell of the first rotating motor is fixed on the outer side end of the top end side plate on one side of the first mounting seat through the third mounting seat, the rotating shaft of the first rotating motor sequentially penetrates through the bearing seat in the middle of the third mounting seat and the bearing seat in the middle of the top end side plate and then is fixedly connected with the cylinder body of the first pneumatic clamping jaw cylinder on one side end of the corresponding scroll, one end of the two half shafts in the same scroll is fixedly connected with the two clamping jaws of the corresponding first pneumatic clamping jaw cylinder respectively, the other side ends of the two half shafts are fixedly connected with the two clamping jaws of the corresponding second pneumatic clamping jaw cylinder respectively, and the second pneumatic clamping jaw cylinder is mounted on the inner side end of the top end side plate on the other side of the first mounting seat through the slip ring;
the transfer mechanism comprises a first transverse moving module, a second mounting seat arranged on a sliding block of the first transverse moving module, a first mounting plate rotatably arranged on the second mounting seat, and a plurality of groups of sucker assemblies arranged at the bottom end of the first mounting plate, wherein each group of sucker assemblies comprises at least three suckers which are not in the same straight line, and the adsorption ends of the suckers correspond to the front surface of the film-attached silicon wafer and are used for adsorbing the film-attached silicon wafer;
The step of tearing the film comprises the following steps: a1, adsorbing the film-attached silicon wafer through a sucker assembly in the transfer mechanism, and transferring the film-attached silicon wafer to the upper part of the film rolling mechanism;
a2, the first mounting plate and the sucker component rotate, so that the convex blocks on the protective film correspond to gaps before relative movement of two half shafts of the corresponding reel in the film winding mechanism;
a3, the two half shafts in the scroll move relatively to clamp the lug on the diaphragm;
a4, the reel driving device drives the reel to rotate, and the membrane is wound on the reel.
It is further characterized in that,
further, the transfer mechanism further comprises an air path assembly, wherein the air path assembly is used for introducing positive pressure or negative pressure into the sucker;
still further, the gas circuit subassembly includes the gas collecting exhaust plate of installing in first mounting panel top, set up in the gas collecting channel of gas collecting exhaust plate bottom, run through first mounting panel and with the first through-hole of gas collecting channel intercommunication, run through the gas collecting exhaust plate and with first negative pressure pipeline and positive pressure pipeline, first negative pressure generator, first solenoid valve, second solenoid valve of gas collecting channel intercommunication, be located first mounting panel top and with the second mounting panel of second mount pad rigid coupling, the non-adsorption end intercommunication of sucking disc first through-hole, positive pressure pipeline passes through positive pressure pipeline intercommunication vacuum machine, first solenoid valve install in positive pressure pipeline, the vacuum machine passes through negative pressure pipeline and connects gradually first negative pressure generator, first negative pressure pipeline, the second solenoid valve install in negative pressure pipeline, the casing rigid coupling of first negative pressure generator in the top of second mounting panel;
Further, the adsorption component is rotatably mounted on the second mounting seat through the rotation component, the rotation component is used for driving the first mounting plate to rotate, the rotation component comprises a first linear air cylinder, a first connecting rod, two second connecting rods, a limit bolt and a third connecting rod, the cylinder body of the first linear air cylinder is fixed at the top end of the second mounting plate, a first waist-shaped hole is formed in the middle of the second mounting plate, one end of the first connecting rod penetrates through the first waist-shaped hole and then is hinged to the end part of a piston rod of the first linear air cylinder, the limit bolt is fixed at the top end of the second mounting plate and corresponds to the side end of the first connecting rod, the first mounting plate is respectively and rotatably connected with the second mounting plate through the third connecting rod, one end of the third connecting rod is respectively and vertically fixed at the top end of the corresponding first mounting plate, the other end of the third connecting rod is hinged to the bottom end of the second mounting plate, and the two second connecting rods are respectively and vertically hinged to the middle parts of two side ends of the third connecting rod;
further, the transfer mechanism further comprises an air knife, the air knife is obliquely arranged at one side end of the second mounting plate through a first mounting frame, an air blowing opening of the air knife corresponds to the front face of the film-attached silicon wafer to be transplanted, and the front face of the film-attached silicon wafer is purged through the air knife before the transfer mechanism adsorbs the film-attached silicon wafer;
Further, two rows of magnets are respectively arranged at the inner side ends of two half shafts in the same reel, the magnets in each row are arranged at intervals, wherein the magnets at the inner side end of one half shaft are N-pole magnets, the magnets at the inner side end of the other half shaft are S-pole magnets, and the N-pole magnets and the S-pole magnets are arranged in a one-to-one correspondence manner;
further, the film winding mechanism further comprises a first base and a first lifting unit, wherein the first lifting unit is used for driving the first mounting seat and the scroll to lift, the first lifting unit comprises a first lifting motor, a screw nut assembly, a belt, a driving wheel and a driven wheel, the screw nut assembly comprises a first screw nut assembly and a second screw nut assembly, the first screw nut assembly and the second screw nut assembly respectively comprise nuts and screw rods matched with the nuts, the first screw nut assembly and the second screw nut assembly are mounted between the first base and the first mounting seat, one end of the screw rod is connected with the bottom end of the first mounting seat, the other end of the screw rod penetrates through the corresponding nuts and the first base and is in sliding connection with the first base, a driving shaft of the first lifting motor penetrates through a bearing seat in the first base and is fixedly connected with the driving wheel, and the belt is wound around the nuts of the driving wheel, the driven wheel, the first screw nut assembly and the second screw nut assembly;
Further, the automatic film tearing machine for the silicon wafer further comprises a film rolling cutting mechanism, wherein the film rolling cutting mechanism is positioned above the film rolling mechanism and used for cutting films wound on the reels, the film rolling cutting mechanism comprises a first longitudinal moving module and an air knife assembly arranged on a sliding block of the first longitudinal moving module, the first longitudinal moving module is arranged on the frame and comprises a fourth mounting seat vertically fixed on the sliding block, a circular blade, a second rotating motor for driving the circular blade to rotate and an air pipe arranged adjacent to the circular blade, a shell of the second rotating motor is fixed on the fourth mounting seat, the circular blade is arranged on a power shaft of the second rotating motor, and a cutting edge of the circular blade and an air outlet of the air pipe are corresponding to the corresponding reels;
further, the top end side plates of the first mounting seat comprise four rectangular grooves with open tops, the rectangular grooves are located below the scroll, and after the film rolling cutting mechanism cuts the film rolling on the scroll, the cut film rolling falls into the rectangular grooves;
further, the surface of the scroll is provided with a groove;
Further, the inner side ends of the two half shafts are respectively provided with an inner mounting plate, the two inner mounting plates in the same reel are correspondingly arranged, the rear ends of the inner mounting plates are respectively embedded in the corresponding half shafts, the front ends of the inner mounting plates respectively protrude out of the inner side ends of the corresponding half shafts, the diameter of an outer circle formed after the two half shafts are closed is larger than the diameter of an inner circle formed after the two inner mounting plates are closed, and the outer circle and the inner circle are coaxially arranged;
further, the N pole magnet and the S pole magnet are respectively embedded at the front side end of the inner mounting plate of the same reel.
The system comprises a silicon wafer blanking transmission platform and a flower basket lifting mechanism, wherein the silicon wafer blanking transmission platform is used for blanking and transmitting a silicon wafer after film tearing, the flower basket lifting mechanism is used for lifting a flower basket, and the flower basket is used for bearing the silicon wafer after film tearing;
the film-attached silicon wafer discharging position is used for placing a carrier plate, and film-attached silicon wafers are placed in a carrying groove of the carrier plate;
The transfer mechanism in the automatic film tearing machine is used for transferring the film-attached silicon wafers on the carrier plate of the film-attached silicon wafer blanking position to the film rolling mechanism and transferring the film-torn silicon wafers to the silicon wafer blanking transmission platform;
the film rolling mechanism is matched with the transfer mechanism and is used for tearing off the protective film on the film-attached silicon wafer;
the silicon wafer blanking step comprises the following steps: b1, transferring the film-attached silicon wafer on the carrier plate of the film-attached silicon wafer discharging position to the upper part of the film rolling mechanism through a transfer mechanism;
b2, tearing off the membrane on the membrane-attached silicon wafer through the membrane rolling mechanism;
b3, transferring the silicon wafer subjected to film tearing to the silicon wafer blanking transmission table through the transfer mechanism;
and B4, transmitting the silicon wafer to an empty basket in the basket lifting mechanism through the silicon wafer blanking transmission table.
It is further characterized in that,
the carrier plate lifting platform is used for lifting the carrier plate and transmitting the carrier plate to a blanking position of the film-attached silicon wafer, and comprises a first lifting moving module, a first roller bracket fixed on a sliding block of the first lifting moving module and a first roller rotatably installed on the first roller bracket through a first roller shaft;
The blanking position of the film-attached silicon wafer comprises a second roller bracket, second rollers rotatably arranged at the head end and the tail end of the second roller bracket through a second roller shaft, and third rollers rotatably arranged at two sides of the second roller bracket; the discharge port of the carrier plate lifting table corresponds to the feed port of the blanking level of the film-attached silicon wafer, and the transmission directions of the second roller wheel, the third roller wheel and the first roller wheel are consistent;
the silicon wafer blanking system further comprises a silicon wafer jacking mechanism, wherein the silicon wafer jacking mechanism is positioned below the blanking level of the film-attached silicon wafer and is used for jacking the film-attached silicon wafer in the carrier plate, the silicon wafer jacking mechanism comprises a lifting cylinder, a guide assembly, a third mounting plate, a plurality of jacking plates arranged at the top end of the third mounting plate and at least three jacking suckers which are not in the same straight line and are arranged at the top end of the jacking plates, a cylinder body of the lifting cylinder is fixed on a base, a piston rod of the lifting cylinder is fixedly connected with the middle part of the bottom end of the third mounting plate and is connected with the third mounting plate through the guide assembly, a second through hole is formed in the bottom end of the middle part of the bearing groove, the jacking plates correspond to the second through hole, and the adsorption end of the jacking suckers corresponds to the bottom end of the film-attached silicon wafer;
Further, the guide assembly comprises four guide rods, connecting plates and rectangular supporting frames, wherein the guide rods are distributed in a rectangular shape, the rectangular supporting frames are fixed at one ends of the guide rods, the other ends of the guide rods penetrate through corresponding shaft sleeves fixed on the connecting plates and are fixedly connected with the bottom ends of the third mounting plates, and four side end faces of the connecting plates are fixedly connected with the machine frame respectively;
further, the film-attached silicon wafers are arranged in the bearing grooves of the carrier plate in an array structure, the jacking plates are arranged at the top ends of the third mounting plates in an array structure, and the jacking plates are in one-to-one correspondence with the bottom ends of the bearing grooves;
still further, the guiding component further comprises a spring guide rod, a second negative pressure pipeline is arranged in the middle of the spring guide rod, one end of the spring guide rod vertically penetrates through the jacking plate and then is connected with the non-adsorption end of the jacking sucker, one end of the second negative pressure pipeline is communicated with an air hole in the middle of the jacking sucker, and the other end of the second negative pressure pipeline is communicated with a second negative pressure generator through the second negative pressure pipeline;
further, the silicon wafer blanking transmission platform comprises a second base and at least two groups of first belt wheel assemblies arranged on the second base, the two groups of first belt wheel assemblies respectively correspond to the first mounting plates on the two sides of the transfer mechanism one by one, and each group of first belt wheel assemblies comprises a first roller rotatably arranged on the second base and two rows of first conveyor belts respectively wound on the corresponding first rollers and distributed in parallel;
Further, two sides of the silicon wafer blanking transmission table are provided with a deviation rectifying mechanism and a buffering mechanism;
further, telescopic transmission mechanisms are respectively arranged between the silicon wafer discharging transmission platforms and the corresponding flower basket lifting mechanisms, and silicon wafers conveyed by the first conveyor belt are respectively transferred to empty flower baskets in the flower basket lifting mechanisms through the telescopic transmission mechanisms.
The structure of the invention has the advantages that the film rolling mechanism is arranged in the automatic film tearing machine for the silicon wafers, the film rolling mechanism is positioned below the transfer mechanism, the clamping of the convex blocks on the films is realized through the relative movement of the two half shafts in the film rolling mechanism, the reel driving device drives the reel to rotate, the films on the film-attached silicon wafers are separated from the silicon wafers, the films on the film-attached silicon wafers adsorbed by the transfer mechanism are wound on the reel, the automatic film tearing of the film-attached silicon wafers is realized, the manual film tearing is not needed, the film tearing operation is simple and quick, time and labor are saved, and the processing efficiency is improved. Compared with a film tearing mode of air blowing or air discharging of the air pump, the film tearing force of the reel driving device for driving the reel to rotate is larger, and even if the silicon wafer is tightly attached to the protective film, the film can be torn off from the film-attached silicon wafer, so that the silicon wafer and the protective film are effectively separated, the film tearing effect is improved, and the smooth proceeding of the subsequent processing procedure is facilitated.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a three-dimensional structure of an automatic film tearing machine for silicon wafers;
FIG. 2 is a schematic diagram of a three-dimensional structure of a silicon wafer with a film according to the present invention;
FIG. 3 is a schematic perspective view of a film winding mechanism according to the present invention;
FIG. 4 is an enlarged view of a portion of the film winding mechanism of the present invention;
FIG. 5 is a front view of the film winding mechanism of the present invention;
FIG. 6 is a schematic perspective view of a transfer mechanism according to the present invention;
FIG. 7 is a schematic perspective view of the transfer mechanism according to the present invention, wherein the rotating assembly drives the first mounting plate to rotate;
FIG. 8 is a schematic perspective view of a film rolling and cutting mechanism according to the present invention;
FIG. 9 is a schematic diagram of a cross-sectional structure of a film winding cutting mechanism and a film winding mechanism of the present invention in front view;
FIG. 10 is a schematic diagram of a three-dimensional structure of a silicon wafer blanking system according to the present invention;
FIG. 11 is a schematic perspective view of a carrier lifting platform according to the present invention;
FIG. 12 is a schematic diagram of a three-dimensional structure of a silicon wafer lift mechanism according to the present invention;
FIG. 13 is a schematic view of another angle of the silicon wafer lift mechanism of the present invention;
FIG. 14 is a schematic perspective view of a silicon wafer blanking transfer table and a transfer mechanism according to the present invention;
FIG. 15 is a schematic perspective view of a carrier plate according to the present invention;
fig. 16 is a schematic perspective view of a gas collecting exhaust plate according to the present invention.
Reference numerals: the device comprises a transfer mechanism 1, a film-attached silicon wafer 10, a convex block 101, a first transverse moving module 11, a second mounting seat 12, a sucker assembly 13, a rotating assembly 14, a first mounting plate 131, a gas collecting and discharging plate 133, a gas collecting tank 134, a first negative pressure pipeline 135, a positive pressure pipeline 136, a first negative pressure generator 137, a second mounting plate 138, an air knife 151, a first mounting frame 152, a first linear cylinder 141, a first connecting rod 142, a second connecting rod 143, a limit bolt 144, a third connecting rod 145 and a first waist-shaped hole 146;
film winding mechanism 2, first mount 21, reel 22, reel driving device 23, first pneumatic clamping jaw cylinder 231, first rotary motor 232, third mount 233, second pneumatic clamping jaw cylinder 234, slip ring 235, top end side plate 236, magnet 220, half shaft 221, inner mounting plate 2210, groove 2211, first lifting unit 25, first lifting motor 251, driving wheel 252, first lead screw nut assembly 253, second lead screw nut assembly 254, driven wheel 255, belt 256, first base 24;
The film rolling cutting mechanism 3, the first longitudinal moving module 31, the air knife assembly 32, the fourth mounting seat 33, the circular blade 34, the second rotating motor 36 and the air pipe 35;
the silicon wafer blanking transmission platform 4, the second base 41, the first roller 42, the first conveyor belt 43, the basket lifting mechanism 5, the carrier lifting platform 6, the carrier 60, the second through hole 601, the carrier groove 602, the first lifting moving module 61, the first roller bracket 62, the first roller shaft 63 and the first roller 64;
a blanking position 7 of the film-attached silicon wafer, a second roller bracket 71, a second roller shaft 72, a second roller 73 and a third roller 74;
silicon wafer lifting mechanism 8, lifting cylinder 81, guide assembly 82, third mounting plate 83, lifting plate 84, lifting sucker 85, connecting plate 822, rectangular support 823, base 810, guide rod 821 and spring guide rod 851.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It is noted that the terms "comprises" and "comprising," and any variations thereof, in the description and claims of the present invention and in the foregoing figures, are intended to cover a non-exclusive inclusion, such that a process, method, apparatus, article, or device that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed or inherent to such process, method, article, or device.
At present, the silicon wafer processing technology mainly comprises squaring, slicing, chamfering, grinding, corrosion, cleaning and the like, and because the silicon wafer has the characteristics of high hardness, high brittleness and the like, before slicing and grinding, a protective film is required to be attached to the surface of the silicon wafer (in the embodiment, a blue film is attached to the back surface of the silicon wafer) so as to prevent the problems of abrasion of the surface of the silicon wafer, even fragments and the like, but before the silicon wafer is fed, the film on the surface of the silicon wafer is required to be removed so as to facilitate subsequent corrosion and cleaning operations, and the existing silicon wafer film tearing machine has the problems of difficult separation of the silicon wafer and the film, poor film tearing effect and the like. In order to solve the problem, the following provides a specific embodiment of a silicon wafer automatic film tearing machine.
See fig. 1, fig. 2, an automatic film tearing machine for silicon wafers, it includes and moves and carries mechanism 1, rolls up membrane mechanism 2, move and carry mechanism 1 and be used for adsorbing and move and attach membrane silicon wafer 10, attach membrane silicon wafer 10 includes the silicon wafer, paste the protection film (i.e. the diaphragm) of dress in the silicon wafer back, the both sides border of protection film is provided with a plurality of interval distribution's lug 101, see fig. 2, when the protection film paste dress in the silicon wafer, lug 101 protrusion is in the border of attaching membrane silicon wafer 10, the setting of lug 101, the follow-up membrane mechanism 2 that rolls up is convenient for press from both sides and get this lug 101 and realize the protection film winding.
Referring to fig. 6 and 7, in the present embodiment, the transfer mechanism 1 has a specific structure as follows: the transfer mechanism 1 comprises a first transverse moving module 11, a second mounting seat 12 arranged on a sliding block of the first transverse moving module 11, and a first mounting plate rotatably arranged on the second mounting seat 12, wherein a plurality of groups of sucking disc assemblies 13 are arranged at the bottom end of the first mounting plate, each group of sucking disc assemblies comprises at least three sucking discs which are not in the same straight line, the sucking discs are used for adsorbing film-attached silicon wafers 10, the number of the sucking disc assemblies 13 in the embodiment is consistent with the number of bearing grooves in a carrier plate, the sucking disc assemblies are twelve groups, each group of sucking disc assemblies comprises four sucking discs which are in rectangular distribution, and each group of sucking disc assemblies 13 correspondingly adsorbs one silicon wafer. In this embodiment, the number of the first mounting plates 131 is three, the three first mounting plates 131 are installed at the bottom end of the second mounting seat at intervals in parallel, and four groups of sucking disc assemblies 13 are installed at intervals at the bottom end of each first mounting plate 131.
The transfer mechanism 1 further comprises an air path assembly, the air path assembly is used for introducing positive pressure air or negative pressure air into the suction cup, the specific structure of the air path assembly comprises an air collecting and discharging plate 133 arranged at the top end of the first mounting plate 131, an air collecting tank 134 arranged at the bottom end of the air collecting and discharging plate 133 (see fig. 16), a first through hole penetrating through the first mounting plate 131 and communicated with the air collecting tank 134, a first negative pressure pipeline 135 and a positive pressure pipeline 136 penetrating through the air collecting and discharging plate 133 and communicated with the air collecting tank 134, a first negative pressure generator 137, a first electromagnetic valve (not shown in the drawings), a second mounting plate 138 positioned above the first mounting plate 131 and fixedly connected with the second mounting plate 12, the non-adsorption end of the suction cup is communicated with the first through hole, the positive pressure pipeline 136 is communicated with a vacuum machine (not shown in the drawings) through the positive pressure pipeline, the vacuum machine is sequentially connected with the first negative pressure generator 137 and the first negative pressure pipeline 135 through the negative pressure pipeline, the second electromagnetic valve is arranged on the negative pressure pipeline, and the top end 138 of the first negative pressure generator 137 is fixedly connected with the second mounting plate.
When the film-attached silicon wafer is adsorbed by the suction cup, the adsorption end of the suction cup is contacted with the front surface of the film-attached silicon wafer, the controller controls the second electromagnetic valve to be opened, the first electromagnetic valve to be closed, vacuum of the vacuum machine enters the first negative pressure generator 137 through the second electromagnetic valve and the negative pressure pipeline to generate negative pressure, the negative pressure enters the gas collecting tank of the gas collecting exhaust plate 133 through the first negative pressure pipeline 135, and negative pressure gas in the gas collecting tank 134 enters the suction cup through the first through hole on the first mounting plate 131 to realize the adsorption of the film-attached silicon wafer; when unloading the silicon wafer after film removal to a silicon wafer blanking transmission platform, the controller controls the first electromagnetic valve to be opened, the second electromagnetic valve to be closed, positive pressure gas of the vacuum machine enters a gas collecting groove of the gas collecting exhaust plate 133 through the first electromagnetic valve, the positive pressure pipeline and the positive pressure pipeline 136, the positive pressure gas in the gas collecting groove enters the sucker through a first through hole on the first mounting plate 131, and the front surface of the silicon wafer after film removal is blown, so that the silicon wafer after film removal is placed on the silicon wafer blanking transmission platform. In the gas circuit assembly, the gas collecting exhaust plate 133 and the gas collecting tank 134 are arranged, so that positive pressure gas or negative pressure gas can be concentrated in the gas collecting tank 134 and uniformly enter the sucker through the first through hole, thereby improving the uniformity of the adsorption force when adsorbing the film-attached silicon wafer or the uniformity of the blowing force when unloading the film-removed silicon wafer, and avoiding the occurrence of adsorption failure caused by uneven stress of the film-attached silicon wafer.
Referring to fig. 7 and 8, the transfer mechanism 1 further includes an air knife 151, the air knife 151 is obliquely mounted at one side end of the second mounting plate through a first mounting frame 152, an air blowing port of the air knife 151 corresponds to the front surface of the silicon wafer on the carrier plate transmission platform at one side, the angle range between the air knife and the plane where the surface of the silicon wafer is located is 45-80 degrees, in this embodiment, the angle is 45 degrees, before the transfer mechanism 1 adsorbs the silicon wafer, the front surface of the film-attached silicon wafer on the carrier plate is purged through the air knife 151, so that the problem that the adsorption effect of the sucker is affected due to chips or other impurities existing on the front surface of the film-attached silicon wafer is prevented.
Referring to fig. 3, 4 and 5, the film winding mechanism 2 includes a first mounting seat 21, a reel 22 rotatably mounted on the first mounting seat 21, and a reel driving device 23 for driving the reel 22 to rotate, wherein the reel 22 is used for clamping the protective film and winding the protective film onto the reel 22, and when the film is torn, the transfer mechanism 1 moves to the upper side of the film winding mechanism 2, so that the bump on the film corresponds to a gap between two half shafts 221 of the corresponding reel 22, and the clamping of the bump 101 on the film is realized by the relative movement of the two half shafts 221. The number of the reels 22 is equal to the number of the first mounting plates 131 in this embodiment, and three reels 22 are installed on the top side plate of the first mounting base 21 at parallel intervals, and rotate under the driving action of the corresponding reel driving device 23.
To improve the stability of the rotation of the spool, the spool driving device 23 includes the following structure: the first pneumatic clamping jaw cylinder 231 and the first rotating motor 232 which are distributed on one side of the reel 22, the third installation seat 233 for installing the first rotating motor 232, the second pneumatic clamping jaw cylinder 234 and the slip ring 235 which are distributed on the other side of the reel 22, the shell of the first rotating motor 232 is fixed on the outer side end of the top end side plate 236 on one side of the first installation seat 21 through the third installation seat 233, the rotating shaft of the first rotating motor 232 sequentially penetrates through the bearing seat in the middle of the third installation seat 233 and the bearing seat in the middle of the top end side plate 236 and then is fixedly connected with the cylinder body of the first pneumatic clamping jaw cylinder 231 on one side of the corresponding reel, one end of the two half shafts 221 in the same reel 22 is fixedly connected with the two clamping jaws of the corresponding first pneumatic clamping jaw cylinder 231 respectively, the other side ends of the two half shafts 221 are fixedly connected with the two clamping jaws of the corresponding second pneumatic clamping jaw cylinder 234 respectively, the second pneumatic clamping jaw cylinder 234 is installed on the inner side end of the top end of the corresponding second installation seat 21 through the slip ring 235, the cylinder body of the second pneumatic clamping jaw cylinder 234 is fixed on the sliding part of the top end of the slip ring 235, the fixed part of the slip ring 235 is fixed on the inner side end of the top end side plate 236, and the rotating shaft of the rotating motor 235 is fixed on the inner side end of the sliding part of the slip ring side plate 236, and the rotating shaft of the rotating shaft is coaxially arranged.
Two rows of parallel magnets 220 are respectively arranged at intervals at the inner ends of two half shafts 221 in the same reel 22, the magnets 220 in each row are arranged at intervals, wherein the magnets at the inner end of one half shaft 221 are N-pole magnets, the magnets at the inner end of the other half shaft are S-pole magnets, and the N-pole magnets and the S-pole magnets are arranged in a one-to-one correspondence. When the two half shafts 221 in the same reel 22 are closed by relative movement under the driving action of the first pneumatic clamping jaw cylinder 231 and the second pneumatic clamping jaw cylinder 234, the corresponding N-pole magnet and S-pole magnet are adsorbed, so that the corresponding clamping tightness of the two half shafts 221 is further improved, and the two half shafts 221 can be further ensured to firmly clamp the lug 101 on one side of the diaphragm 10.
In order to facilitate accurate correspondence of the scroll 22 in the film rolling mechanism 2 and the membrane protruding block on the film attaching silicon wafer adsorbed by the sucker in the transfer mechanism 1, a first lifting unit 25 is arranged in the film rolling mechanism 2, and the first mounting plate is rotatably mounted on the second mounting seat 12 through the rotating assembly 14, the first lifting unit 25 is used for driving the first mounting seat 21 and the scroll 22 to lift, the rotating assembly 14 is used for driving the first mounting plate, the sucker and the film attaching silicon wafer to rotate, in order to ensure that the scroll can clamp the protruding block protruding from the edge of the film attaching silicon wafer, the inclination angle of the first mounting plate is 45-90 degrees, and in the embodiment, the angle after the first mounting plate rotates is 45 degrees.
The first lifting unit 25 includes a first lifting motor 251, a screw-nut assembly, and a belt, the screw-nut assembly includes a first screw-nut assembly 253, a second screw-nut assembly 254 parallel to the first screw-nut assembly 253, the first screw-nut assembly 253 and the second screw-nut assembly 254 include nuts, and screws matched with the nuts, respectively, the first screw-nut assembly 253 and the second screw-nut assembly 254 are mounted between the first base 24 and the first mounting seat 21, one end of the screws is connected with the bottom end of the first mounting seat 21, the other end of the screws penetrates the first base 24 and is slidably connected with the first base 24, the driving shaft of the first lifting motor 251 penetrates through a bearing seat in the first base 24 and is connected with the driving wheel 252, and the belt 256 is wound around the driven wheel 255, the driving wheel 252 and the nuts.
Referring to fig. 7, the rotating assembly 14 includes a first linear cylinder 141, a first connecting rod 142, two second connecting rods 143, a limit bolt 144, and a third connecting rod 145, wherein the cylinder body of the first linear cylinder 141 is fixed at the top end of the second mounting plate 138, a first waist-shaped hole 146 is formed in the middle of the second mounting plate 138, one end of the first connecting rod 142 penetrates through the first waist-shaped hole 146 and then is hinged to the end of a piston rod of the first linear cylinder 141, the limit bolt 144 is fixed at the top end of the second mounting plate 138 and corresponds to the side end of the first connecting rod 142, the first mounting plate 131 is respectively and rotatably connected with the second mounting plate 138 through the third connecting rod 145, one end of the third connecting rod 145 is respectively and vertically fixed at the top end of the corresponding first mounting plate 131, the other end of the third connecting rod 145 is hinged to the bottom end of the second mounting plate 138, and the two second connecting rods 143 are parallel and respectively and vertically hinged to the middle parts of two side ends of the third connecting rod 145.
Referring to fig. 9 and 10, after the film is wound on the reel 22, the film wound on the reel 22 needs to be removed, therefore, in the silicon wafer automatic film tearing machine, a film winding cutting mechanism 3 is further provided, the film winding cutting mechanism 3 is located above the film winding mechanism 2 and is used for cutting the film wound on the reel 22, the film winding cutting mechanism 3 comprises a first longitudinal moving module 31, an air knife assembly 32 mounted on a sliding block of the first longitudinal moving module 31, the first longitudinal moving module 31 is mounted on a frame (not shown in the drawings), the air knife assembly 32 comprises a fourth mounting seat 33 perpendicular to the sliding block of the first longitudinal moving module 31, a circular knife 34, a second rotary motor 36 for driving the circular knife 34 to rotate, an air duct 35 arranged adjacent to the circular knife 34, a shell of the second rotary motor 36 is fixed on the fourth mounting seat 33, the circular knife 34 is mounted on a power shaft of the second rotary motor 36, and an air outlet of the blade edge of the circular knife 34 and an air duct 35 respectively correspond to a gap between two half shafts 221 in the corresponding reel 22.
In order to facilitate the circular blade 34 to cut the membrane wound on the reel 22 and simultaneously facilitate the two half shafts 221 to clamp the lug 101 on the membrane, in this embodiment, the inner side ends of the two half shafts 221 are respectively provided with an inner mounting plate 2210, the two inner mounting plates in the same reel 22 are correspondingly arranged, the rear ends of the inner mounting plates are respectively embedded in the corresponding half shafts 221, the front ends of the inner mounting plates respectively protrude from the inner side ends of the corresponding half shafts 221, and the N-pole magnet and the S-pole magnet are respectively embedded in the front side ends of the inner mounting plates of the same reel 22; the diameter of the outer circle formed after the two half shafts 221 are closed is larger than the diameter of the inner circle formed after the two inner mounting plates 2210 are closed, the outer circle and the inner circle are coaxially arranged, the inner mounting plates are ensured to be capable of corresponding to the clamping convex blocks, meanwhile, grooves 2211 are formed on the surface of the scroll 22, when the membrane wound on the scroll 22 is cut, the circular blades 34 are corresponding to the grooves, a servo motor in the first longitudinal moving module drives a tank chain in the module to drive a fourth mounting seat 33 and the circular blades 34 to move along the grooves 2211 in the scroll 22, membrane cutting is achieved, the circular blades can be ensured to completely cut the membrane wound on the scroll through the grooves 2211, and meanwhile, the damage to the scroll or the damage to the cutting edge of the circular blades caused by the scroll due to scratching of the scroll when the circular blades are prevented.
After the diaphragm is cut, in order to facilitate the collection of diaphragm waste materials, a collecting box is arranged at the top end of the first mounting seat 21, four top end side plates 236 at the top end of the first mounting seat 21 enclose to form a rectangular groove with an open top end, the rectangular groove is the collecting box, the rectangular groove is positioned below the scroll 22, and after the diaphragm cutting mechanism cuts the diaphragm on the scroll, the cut diaphragm falls into the rectangular groove.
When the silicon wafer automatic film tearing machine is used for film tearing operation, the specific film tearing steps comprise: a1, a transfer mechanism adsorbs a film-attached silicon wafer, and transfers the film-attached silicon wafer to the upper part of a film rolling mechanism, when adsorbing the film-attached silicon wafer, a controller controls a second electromagnetic valve in an air circuit assembly to be opened and a first electromagnetic valve to be closed, and negative pressure is introduced into a sucker through a vacuum machine, the second electromagnetic valve, a negative pressure pipeline, a negative pressure generator, a first negative pressure pipeline and a gas collecting groove in a gas collecting and discharging plate, so that after the sucker adsorbs the front surface of the film-attached silicon wafer, a servo motor in a first transverse moving module in the transfer mechanism drives a tank chain driving slide block, a second mounting seat, a first mounting plate and the film-attached silicon wafer to move to the upper part of the film rolling mechanism;
a2, starting a first linear cylinder in a rotating assembly in the film rolling mechanism, extending a piston rod of the first linear cylinder, driving a first connecting rod to drive a second connecting rod and a third connecting rod to link, and driving a second mounting plate and an adsorbed film-attached silicon wafer to rotate, so that a lug on a protective film corresponds to a gap between two half shafts of a corresponding reel in a reel driving device;
A3, a first lifting motor in a first lifting unit in the film rolling mechanism drives a driving wheel to rotate, and the driving wheel drives nuts in a driven wheel, a first screw rod assembly and a second screw rod assembly to synchronously rotate through a belt, so that corresponding screw rods are driven to synchronously move upwards, and the screw rods drive a first mounting seat and a scroll to lift, so that a lug on a film-attached silicon wafer corresponds to a gap between two half shafts in the corresponding scroll; then, the first pneumatic clamping jaw cylinder and the second pneumatic clamping jaw cylinder on two sides of the scroll are started to drive the two half shafts to move relatively so as to clamp the lug on the diaphragm;
a4, the first rotating motor drives the corresponding scroll to rotate, so that the membrane is wound on the scroll.
A5, the reel stops rotating, a servo motor in the first longitudinal movement module drives a tank chain in the module to drive a sliding block, a fourth installation seat and a rotary round blade to move along a groove in the reel, membrane cutting is achieved, and cut membrane waste falls into a collecting box, so that follow-up collecting and processing are facilitated.
In this embodiment, still provide a silicon chip unloading system, this system includes silicon chip unloading transmission platform 4, basket of flowers elevating system 5, carrier plate elevating system 6, attach membrane silicon chip unloading position 7 and above-mentioned silicon chip automatic dyestripping machine, silicon chip unloading transmission platform 4 is used for the unloading transmission of the silicon chip after the dyestripping, basket of flowers elevating system 5 is used for basket of flowers to go up and down, the basket of flowers is used for bearing the silicon chip after the dyestripping, carrier plate elevating system 6, attach membrane silicon chip unloading position 7, the book membrane mechanism 2 in the silicon chip automatic dyestripping machine, silicon chip unloading transmission platform 4, basket of flowers elevating system 5 distributes in proper order.
Referring to fig. 12, in this embodiment, a carrier lifting table 6 is provided for facilitating the transfer of a carrier or the blanking of a carrier on a carrier transferring trolley in the previous process, the carrier lifting table 6 is used for lifting a carrier 60 and transferring the carrier 60 to a blanking level 7 of a film-attached silicon wafer, and twelve film-attached silicon wafers 10 arranged in an array structure are carried on the carrier 60; the carrier lifting table 6 includes a first lifting movement module 61, a first roller bracket 62 fixed to a slider of the first lifting movement module 61, and a first roller 64 rotatably mounted to the first roller bracket 62 by a first roller shaft 63.
Referring to fig. 11, the unloading position 7 of the silicon wafer with film includes a second roller support 71, a second roller 73 rotatably mounted at the head end (i.e. the feeding port end of the unloading position of the silicon wafer with film) and the tail end of the second roller support 71 through a second roller shaft 72, the discharging port of the carrier plate lifting table 6 corresponds to the feeding port of the unloading position 7 of the silicon wafer with film, and the second roller 73, the third roller 74 are consistent with the transmission direction of the first roller 64.
Referring to fig. 13 and 14, the silicon wafer blanking system further includes a silicon wafer lifting mechanism 8, the silicon wafer lifting mechanism 8 is located below the silicon wafer blanking level 7 and is used for lifting the silicon wafer 10 with film in the carrier plate 60, the silicon wafer lifting mechanism 8 includes a lifting cylinder 81, a guide component 82, a third mounting plate 83, a plurality of lifting plates 84 mounted on the top end of the third mounting plate 83, and at least three lifting suckers 85 which are not in the same straight line and mounted on the top end of the lifting plate 84, in this embodiment, the number of lifting suckers 85 on the same lifting plate 84 is four, the cylinder body of the lifting cylinder 81 is fixed on a base 810, the piston rod of the lifting cylinder 81 is fixedly connected with the middle of the bottom end of the third mounting plate 83 and is connected with the bottom end of the third mounting plate 83 in a guide way through the guide component 82, the middle of the bottom end of the carrier groove 602 is provided with a second through hole 601, and the lifting plates 84 are in one-to-one correspondence with the second through holes 601; when the silicon wafer jacking mechanism jacks up the silicon wafer, the lifting cylinder 81 drives the third mounting plate 83 to drive the jacking plate 84 and the jacking sucker 85 at the top end of the jacking plate to lift up, so that the adsorption end of the jacking sucker 85 passes through the second through hole 601 and then contacts and adsorbs the membrane on the back surface of the film-attached silicon wafer, and the film-attached silicon wafer 10 is jacked up, so that the front surface of the film-attached silicon wafer 10 contacts with the adsorption end of the sucker in the transfer mechanism 1, and the transfer mechanism can adsorb the film-attached silicon wafer 10 quickly and stably.
In order to facilitate the unloading of the silicon wafer with film, the jacking plate 84 can jack up the silicon wafer with film 10 in the carrier plate 60 through the unloading position 7 of the silicon wafer with film, so that the maximum length a of the gap between two adjacent second rollers 72 is greater than the maximum length a1 of the top end of the jacking plate 84 and less than the maximum length a2 of the carrier plate 60, and the maximum width b of the gap between the third rollers 74 at two sides is greater than the maximum width b1 of the top end of the jacking plate 84 and less than the maximum width b2 of the carrier plate. When the carrier plate is conveyed to the blanking position of the film-attached silicon wafer, the two sides of the length direction of the carrier plate are supported on the second roller shaft, and the two sides of the width direction of the carrier plate are supported on the third roller 74.
In the silicon wafer jacking assembly 8, the guiding assembly 82 includes four guiding rods 821, a connecting plate 822, and a rectangular supporting frame 823 fixed at one end of the guiding rods 821, the other end of the guiding rods 821 is fixedly connected with the bottom end of the third mounting plate 83 after penetrating through a corresponding shaft sleeve fixed at the connecting plate 822, and four side end surfaces of the connecting plate 822 are respectively fixedly connected with a frame (not shown in the figure); when jacking attaches membrane silicon chip, the piston rod of lift cylinder 81 stretches out, promotes the third mounting panel 83 and rises, and guide bar 821 slides along the axle sleeve simultaneously to drive jacking plate 84, jacking sucking disc 85, the steady lift of absorptive attaching membrane silicon chip, the setting of guide component 82 has improved the stability that jacking plate and jacking sucking disc go up and down, the setting of the rectangular support frame 823 of guide bar 821 bottom has further improved the stability that jacking plate and jacking sucking disc go up and down, and the setting of guide component 82 has ensured that the absorption end place plane of jacking sucking disc is parallel with the plane place of attaching membrane silicon chip back, has ensured that jacking sucking disc can firmly adsorb the tectorial membrane silicon chip.
The film-attached silicon wafers 10 are arranged in the bearing grooves 602 of the carrier plate 60 in an array structure, the jacking plates 84 are arranged at the top ends of the third mounting plates 83 in an array structure, and the jacking plates 84 are in one-to-one correspondence with the bearing grooves 602.
The guiding component 82 further comprises a spring guide rod 851, a second negative pressure pipeline is arranged in the middle of the spring guide rod 851, one end of the spring guide rod 851 vertically penetrates through the jacking plate 84 and then is connected with the non-adsorption end of the jacking sucker 85, one end of the second negative pressure pipeline is communicated with an air hole in the middle of the jacking sucker 85, and the other end of the second negative pressure pipeline is communicated with a second negative pressure generator (not shown in the figure) through the second negative pressure pipeline.
Referring to fig. 15, the silicon wafer blanking transmission table 4 includes a second base 41, two groups of first belt wheel assemblies mounted on the second base 41, the two groups of first belt wheel assemblies respectively correspond to the first mounting plates 131 on two sides in the transfer mechanism 1 one by one, and each group of first belt wheel assemblies includes a first roller 42 rotatably mounted on the second base 41, and two rows of first conveyor belts 43 respectively wound on the corresponding first roller 42 and distributed in parallel.
The two sides of the silicon slice blanking transmission platform 4 are provided with a deviation rectifying mechanism and a buffering mechanism, the deviation rectifying mechanism is used for rectifying deviation, the deviation is prevented from happening when the first conveyor belt 43 drives the silicon slice to move, and the buffering mechanism is used for buffering the silicon slice.
A telescopic transmission mechanism is arranged between the first belt pulley assembly of the silicon wafer blanking transmission table 4 and the corresponding flower basket lifting mechanism, and silicon wafers transmitted by the first belt pulley assembly and the second belt pulley assembly are respectively transferred to empty flower baskets in the flower basket lifting mechanism through the telescopic transmission mechanism. The correction mechanism, the buffer mechanism and the telescopic transmission mechanism can all adopt the prior art.
The silicon wafer blanking step comprises the following steps: b1, transferring the film-attached silicon wafer on the carrier plate of the film-attached silicon wafer discharging position to the upper part of the film rolling mechanism through the transfer mechanism; specifically, the carrier plate lifting platform lifts or lowers a carrier plate on a carrier plate transfer trolley in the previous processing procedure or the previous processing procedure, and transmits the carrier plate to a film-attached silicon wafer discharging position;
and B12, a piston rod of a jacking cylinder in the silicon wafer jacking mechanism stretches out to drive the third mounting plate, the jacking plate and the jacking sucker to lift, so that the adsorption end of the jacking sucker is correspondingly contacted with the protective film on the back of the film-attached silicon wafer to be transferred in the carrier plate, the film-attached silicon wafer is adsorbed by the jacking sucker, and when the jacking cylinder drives the third mounting plate to lift, the guide rod in the guide assembly synchronously moves upwards. When the film-attached silicon wafer is jacked up by the jacking mechanism, the jacking sucking disc is used for sucking the film-attached silicon wafer, so that the problem that the film tearing is influenced due to inaccurate correspondence between a lug on the film-attached silicon wafer and a reel when the film-attached silicon wafer is torn off by a follow-up film rolling mechanism due to the fact that the film-attached silicon wafer is displaced in the jacking process to influence the adsorption effect of a follow-up transfer mechanism and the adsorption position of the film-attached silicon wafer is prevented, and further improvement of the machining precision is facilitated due to the fact that the jacking sucking disc is arranged in the jacking mechanism;
B13, adsorbing the film-attached silicon wafer by a sucker in the transplanting mechanism, wherein the step is the same as the step A1.
And B2, tearing off the membrane on the membrane-attached silicon wafer through a membrane rolling mechanism, wherein the method specifically comprises the steps A2-A6.
After the film tearing is completed, the silicon wafer after the film tearing is transferred to a silicon wafer blanking transmission table through a transfer mechanism; in the blanking process, firstly, a silicon wafer below a first mounting plate on two sides of a transfer mechanism is respectively corresponding to a first conveyor belt in two groups of first belt pulley assemblies of a silicon wafer blanking transmission platform, a first electromagnetic valve is opened, a second electromagnetic valve is closed, positive pressure vacuum of a vacuum machine enters a sucker through a first electromagnetic valve, a positive pressure pipeline, a gas collecting tank of a gas collecting exhaust plate and a first through hole, positive pressure vacuum blows the front surface of the silicon wafer after film removal, so that the silicon wafer after film removal is quickly placed on the silicon wafer blanking transmission platform, and the silicon wafer blanking transmission platform transmits the silicon wafer to a cache platform;
then, the transverse moving module in the transfer mechanism drives the second mounting seat to move forwards or backwards, the moving distance is equal to 1/2 of the distance between the two groups of first belt wheel assemblies, so that the suction disc adsorbed below the middle first mounting plate corresponds to the first conveyor belt in one group of first belt wheel assemblies, and similarly, the silicon wafer below the middle first mounting plate is placed on the first conveyor belt in a vacuum blowing mode and is conveyed to the cache mechanism for cache through the first conveyor belt.
And B4, in the process of conveying the silicon wafer along a first conveying belt in the silicon wafer blanking conveying table, correcting the deviation by a deviation correcting mechanism, buffering the silicon wafer by a buffering mechanism, and conveying the silicon wafer to an empty basket in a basket lifting mechanism by a telescopic conveying mechanism, so that film removing and automatic blanking of the film-attached silicon wafer are realized.
By adopting the technical scheme provided by the invention, the method has the following advantages:
(1) In the silicon wafer film tearing machine, through moving mechanism and the cooperation of film winding mechanism, realized attaching the automatic tearing of diaphragm on the membrane silicon wafer, the film tearing easy operation is swift, even diaphragm and silicon wafer paste closely, also can tear the diaphragm fast, has promoted the film tearing effect greatly.
(2) In the silicon wafer film tearing machine, twelve film-attached silicon wafers are borne on the carrier plate, and a plurality of groups of sucker assemblies are arranged in the transfer mechanism, so that a plurality of film-attached silicon wafers can be adsorbed simultaneously (in the embodiment, the sucker assemblies in the transfer mechanism can adsorb twelve film-attached silicon wafers simultaneously), three reels are arranged in the film rolling mechanism, and correspond to the film-attached silicon wafers adsorbed by the adsorption assemblies on the first mounting plate, so that the films on the twelve film-attached silicon wafers are torn off simultaneously, and the processing efficiency is greatly improved.
(3) In the automatic silicon wafer blanking system, the silicon wafer jacking mechanism is arranged, and when the adsorption unit in the transfer mechanism adsorbs the film-attached silicon wafer, the film-attached silicon wafer in the carrier plate is jacked up through the silicon wafer jacking mechanism, so that the adsorption operation of the adsorption unit is facilitated, the displacement of the film-attached silicon wafer in the jacking process is prevented, and the processing precision is improved.
The above are only preferred embodiments of the present application, and the present invention is not limited to the above examples. It is to be understood that other modifications and variations which may be directly derived or contemplated by those skilled in the art without departing from the spirit and concepts of the present invention are deemed to be included within the scope of the present invention.

Claims (7)

1. The automatic film tearing machine for the silicon wafers comprises a workbench and a transfer mechanism (1) arranged on the workbench, wherein the transfer mechanism (1) is used for adsorbing and transferring film-attached silicon wafers (10), a protective film is attached to the back of the film-attached silicon wafers (10), a plurality of convex blocks (101) are arranged on the edges of two sides of the protective film at intervals, the convex blocks (101) protrude out of the edges of the film-attached silicon wafers (10), and the automatic film tearing machine is characterized in that a film rolling mechanism (2) is further arranged on the workbench, the film rolling mechanism (2) comprises a first mounting seat (21), a reel (22) rotatably arranged on the top end side plate of the first mounting seat (21) and a reel driving device (23) for driving the reel (22) to rotate, and the reel (22) is used for clamping the protective film and winding the protective film onto the reel (22), and each reel (22) is correspondingly formed by two half shafts, and clamping of the convex blocks on the film is realized through relative movement of the two half shafts;
Two rows of magnets (220) are respectively arranged at the inner side ends of two half shafts in the same reel (22), the magnets (220) in each row are arranged at intervals, wherein the magnets at the inner side end of one half shaft are N-pole magnets, the magnets at the inner side end of the other half shaft are S-pole magnets, and the N-pole magnets and the S-pole magnets are arranged in a one-to-one correspondence manner;
the reels (22) comprise at least two groups, each reel (22) is installed at the top end side plate of the first installation seat (21) at intervals in parallel and is driven by a corresponding reel driving device (23), and the reel driving devices (23) comprise: the device comprises a first pneumatic clamping jaw cylinder (231) and a first rotating motor (232) which are distributed on one side of a scroll, a third mounting seat (233) for mounting the first rotating motor (232), a second pneumatic clamping jaw cylinder (234) and a slip ring which are distributed on the other side of the scroll, wherein a shell of the first rotating motor (232) is fixed on the outer side end of a top end side plate on one side of the first mounting seat (21) through the third mounting seat (233), a rotating shaft of the first rotating motor (232) sequentially penetrates through a bearing seat in the middle of the third mounting seat (233) and a bearing seat in the middle of the top end side plate and is fixedly connected with a cylinder body of the first pneumatic clamping jaw cylinder on one side end of the corresponding scroll, one end of two half shafts in the same scroll (22) is fixedly connected with two clamping jaws of the corresponding first pneumatic clamping jaw cylinder (231), the other side ends of the two half shafts are fixedly connected with two clamping jaws of the corresponding second pneumatic clamping jaw cylinder (234) respectively, and the second pneumatic clamping jaw cylinder (234) is mounted on the inner side end of the top end side plate on the other side of the first pneumatic clamping jaw cylinder (21);
The transfer mechanism (1) comprises a first transverse moving module (11), a second mounting seat (12) arranged on a sliding block of the first transverse moving module (11), and a first mounting plate (131) rotatably arranged on the second mounting seat (12), wherein a plurality of groups of sucker assemblies are arranged at the bottom end of the first mounting plate (131), each group of sucker assemblies comprises at least three suckers which are not in the same straight line, and the absorption ends of the suckers correspond to the front face of a film-attached silicon wafer and are used for absorbing the film-attached silicon wafer;
the automatic film tearing machine for the silicon wafer further comprises a film rolling cutting mechanism (3), wherein the film rolling cutting mechanism (3) is positioned above the film rolling mechanism (2) and is used for cutting films wound on the scroll (22), the film rolling cutting mechanism (3) comprises a first longitudinal moving module (31) and an air knife assembly (32) arranged on a sliding block of the first longitudinal moving module (31), the first longitudinal moving module (31) is arranged on a frame, the air knife assembly (32) comprises a fourth mounting seat (33) vertically fixed on the sliding block, a circular blade (34), a second rotating motor (36) for driving the circular blade to rotate and an air pipe arranged adjacent to the circular blade (34), a shell of the second rotating motor (36) is fixed on the fourth mounting seat (33), the circular blade (34) is arranged on a shaft of the second rotating motor (36), and a blade edge of the circular blade (34) and an air outlet of the air pipe are corresponding to a gap between two half shafts in the corresponding scroll;
The step of tearing the film comprises the following steps: a1, adsorbing a film-attached silicon wafer through a sucker assembly in the transfer mechanism (1), and transferring the film-attached silicon wafer (10) to the upper part of the film winding mechanism (2);
a2, the adsorption unit (13) rotates to enable the convex blocks on the protective film to correspond to gaps before relative movement of two half shafts of the corresponding scroll (22) in the film rolling mechanism (2);
a3, two half shafts in the scroll (22) move relatively to clamp the lug on the diaphragm;
a4, a reel driving device (23) drives the reel (22) to rotate, and the membrane is wound on the reel (22);
a5, the reel (22) stops rotating, the first longitudinal moving module (31) drives the fourth mounting seat (33) and the rotary circular blade (34) to move along a gap between two half shafts in the corresponding reel, and membrane cutting is achieved.
2. The automatic silicon wafer film tearing machine according to claim 1, wherein the first mounting plate (131) is rotatably mounted on the second mounting plate (138) at the bottom of the second mounting seat (12) through a rotating assembly (14), the rotating assembly (14) comprises a first linear air cylinder (141), a first connecting rod (142), two second connecting rods (143), a limit bolt (144) and a third connecting rod (145), a cylinder body of the first linear air cylinder (141) is fixed on the top end of the second mounting plate (138), a first waist-shaped hole (146) is formed in the middle of the second mounting plate (138), one end of the first connecting rod (142) penetrates through the first waist-shaped hole (146) and then is hinged with the end portion of a piston rod of the first linear air cylinder (141), the limit bolt (144) is fixed on the top end of the second mounting plate (138) and corresponds to the side end of the first connecting rod (142), the first mounting plate (131) is respectively connected with the top end of the second mounting plate (138) through the third connecting rod (145) in a rotating mode, and the other end of the first connecting rod (145) is respectively perpendicular to the two ends of the second mounting plate (145) and is respectively hinged with the two ends of the corresponding second connecting rod (145).
3. The automatic film tearing machine for silicon wafers according to claim 2, wherein the film winding mechanism further comprises a first base (24) and a first lifting unit, the first lifting unit is used for driving the first mounting seat and the reel to lift, the first lifting unit (25) comprises a first lifting motor (251), a screw nut assembly, a belt (256), a driving wheel (252) and a driven wheel (255), the screw nut assembly comprises a first screw nut assembly (253) and a second screw nut assembly (254), the first screw nut assembly (253) and the second screw nut assembly (254) respectively comprise nuts and screw rods matched with the nuts, the first screw nut assembly (253) and the second screw nut assembly (254) are mounted between the first base (24) and the first mounting seat (21), one end of the screw rod is connected with the bottom end of the first mounting seat (21), the other end of the screw rod penetrates through the corresponding nuts, the first base and is in sliding connection with the first base, the driving wheel (255) penetrates through the first base (24) of the first lifting motor (251), and the driven wheel (252) is connected with the first base (252) in a winding manner.
4. The system comprises a silicon wafer blanking transmission table (4) and a flower basket lifting mechanism (5), wherein the silicon wafer blanking transmission table (4) is used for blanking transmission of a silicon wafer after film tearing, the flower basket lifting mechanism (5) is used for lifting a flower basket, and the flower basket is used for bearing the silicon wafer after film tearing, and is characterized by further comprising a film-attached silicon wafer blanking position (7) and the silicon wafer automatic film tearing machine according to claim 1, and the film-attached silicon wafer blanking position (7), a film winding mechanism (2) of the silicon wafer automatic film tearing machine, the silicon wafer blanking transmission table (4) and the flower basket lifting mechanism (5) are distributed in sequence;
the film-attached silicon wafer discharging position (7) is used for placing a carrier plate, and film-attached silicon wafers are placed in a carrier groove of the carrier plate;
the transfer mechanism (1) in the automatic film tearing machine is also used for transferring the film-attached silicon wafer on the carrier plate of the film-attached silicon wafer blanking position (7) to the film rolling mechanism (2) and transferring the film-torn silicon wafer to the silicon wafer blanking transmission platform;
the film rolling mechanism (2) is matched with the transfer mechanism (1) and is used for tearing off the protective film on the film-attached silicon wafer;
the silicon wafer blanking step comprises the following steps: b1, transferring the film-attached silicon wafer on the carrier plate of the film-attached silicon wafer discharging position (7) to the upper part of the film rolling mechanism (2) through a transfer mechanism (1);
B2, tearing off the membrane on the membrane-attached silicon wafer (10) through the membrane rolling mechanism (2);
b3, transferring the silicon wafer subjected to film tearing to the silicon wafer blanking conveying table (4) through the transferring mechanism (1);
and B4, transmitting the silicon wafer to an empty flower basket in the flower basket lifting mechanism (5) through the silicon wafer blanking transmission table (4).
5. The silicon wafer blanking system according to claim 4, wherein the film-attached silicon wafer blanking level (7) comprises a second roller bracket (71), a second roller (73) rotatably installed at the head end and the tail end of the second roller bracket (71) through a second roller shaft (72), and third rollers (74) rotatably installed at two sides of the second roller bracket; the silicon wafer blanking transmission platform comprises a second base (41), at least two groups of first belt wheel assemblies arranged on the second base (41), the two groups of first belt wheel assemblies respectively correspond to first mounting plates on two sides of the transfer mechanism one by one, each group of first belt wheel assemblies comprises a first roller (42) rotatably arranged on the second base (41), and two rows of parallel first conveyor belts (43) respectively wound on the corresponding first roller (42).
6. The silicon wafer blanking system of claim 4 or 5, further comprising a silicon wafer jacking mechanism (8), wherein the silicon wafer jacking mechanism (8) is located below the silicon wafer blanking position (7) with a film, and is used for jacking the silicon wafer with the film in the carrier plate, the silicon wafer jacking mechanism (8) comprises a lifting cylinder (81), a guide assembly (82), a third mounting plate, a plurality of lifting plates (84) mounted at the top end of the third mounting plate, and at least three lifting chucks (85) mounted at the top end of the lifting plates (84) which are not in the same straight line, a cylinder body of the lifting cylinder (81) is fixed on the base (810), a piston rod of the lifting cylinder (81) is fixedly connected with the middle part of the bottom end of the third mounting plate, and is connected with the third mounting plate in a guide manner through the guide assembly, a second through hole is formed in the bottom end of the middle part of the carrier groove, the lifting plates (84) correspond to the second through holes, and before the lifting mechanism (8) lifts, a cylinder body of the lifting cylinder (81) is fixed on the base (810) and is fixedly connected with the middle part of the bottom end of the third mounting plate with the bottom end of the third mounting plate.
7. The silicon wafer blanking system of claim 6, wherein the guiding assembly (82) includes four guiding rods (821) in rectangular distribution, a connecting plate (822), and a rectangular supporting frame (823) fixed at one end of the guiding rods (821), the other end of the guiding rods (821) is fixedly connected with the bottom end of the third mounting plate after penetrating through a corresponding shaft sleeve fixed at the connecting plate (822), and four side end faces of the connecting plate (822) are fixedly connected with the frame respectively.
CN202310154330.5A 2023-02-23 2023-02-23 Automatic silicon wafer film tearing machine and silicon wafer blanking system Active CN115892658B (en)

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CN117594497B (en) * 2024-01-17 2024-03-29 无锡江松科技股份有限公司 Multi-station efficient film tearing machine and film tearing method

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