CN117672948A - Silicon wafer separating and combining device and silicon wafer diffusion inserting and taking method - Google Patents
Silicon wafer separating and combining device and silicon wafer diffusion inserting and taking method Download PDFInfo
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- CN117672948A CN117672948A CN202410121591.1A CN202410121591A CN117672948A CN 117672948 A CN117672948 A CN 117672948A CN 202410121591 A CN202410121591 A CN 202410121591A CN 117672948 A CN117672948 A CN 117672948A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 223
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 223
- 239000010703 silicon Substances 0.000 title claims abstract description 223
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000009792 diffusion process Methods 0.000 title claims abstract description 13
- 238000001179 sorption measurement Methods 0.000 claims abstract description 277
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- 235000012431 wafers Nutrition 0.000 claims description 215
- 238000000605 extraction Methods 0.000 claims description 20
- 238000010521 absorption reaction Methods 0.000 claims description 12
- 230000000712 assembly Effects 0.000 claims description 8
- 238000000429 assembly Methods 0.000 claims description 8
- 230000000295 complement effect Effects 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 238000009423 ventilation Methods 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 description 10
- 241000252254 Catostomidae Species 0.000 description 9
- 210000004027 cell Anatomy 0.000 description 8
- 238000009434 installation Methods 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 210000002381 plasma Anatomy 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Abstract
The invention provides a silicon wafer separating and combining device and a silicon wafer diffusion inserting and taking method, which comprise a mounting base, wherein a guide rail and an ion air knife assembly are arranged on the mounting base, a first adsorption module and a second adsorption module are arranged at two ends of the guide rail, and an offset mechanism is arranged on at least one of the first adsorption module and the second adsorption module; the offset mechanism is used for driving the silicon wafer adsorbed by at least one of the first adsorption module and the second adsorption module to offset; the ion air knife assembly is provided with an air outlet channel, and the air outlet channel is provided with an ion generating device; the mounting base is also provided with a driving device for driving the first adsorption module and the second adsorption module to do relative opening and closing movement. The invention has ingenious design, high silicon wafer clamping stability and high wafer dividing and combining efficiency, and can realize nondestructive transportation of the silicon wafer.
Description
Technical Field
The invention relates to the technical field of silicon wafer transportation, in particular to a silicon wafer separating and combining device and a silicon wafer diffusion inserting and taking method.
Background
Solar cells are developed very rapidly at home and abroad, and in China, the yield of solar cell modules is increased year by year at an annual growth rate which is over 100% on average. Solar cells are now very versatile, and silicon-based solar cells are used in many applications in terms of their technical aspects, whereas in such cells the silicon wafer is very high, the cost of which affects the cost of the whole cell production. The silicon wafer basket has important significance in reducing the rejection rate of silicon wafers. The silicon wafer basket is a bearing device used for firmly, orderly and intermittently placing silicon wafers in the process treatment of the solar cell silicon wafers so as to facilitate the repeated transfer of the silicon wafers in the process treatment.
In the process of solar cell silicon wafers, in boron diffusion or ALD automation equipment, in order to avoid diffusion or deposition on the back surface of the silicon wafer, two adjacent silicon wafers are generally stacked (bonded) and then vertically placed in a silicon wafer basket, and then transferred to reaction equipment, and this process is generally called silicon wafer bonded diffusion. After the silicon wafer lamination diffusion is completed, the two silicon wafers stacked in the silicon wafer basket are subjected to slicing treatment, and then are placed in the two silicon wafer baskets to carry out the next working procedure.
In the prior art, when loading or unloading the silicon wafer, a contact type grabbing mode is mostly adopted, and the silicon wafer is thinner, crisp in texture and extremely fragile, so that fragments can be caused by slight impact during grabbing, and a high fragment rate is caused. At present, some sucking disc mechanisms appear in the market, a vacuum adsorption mode is adopted to grasp a silicon wafer, but the sucking disc of the sucking disc mechanism is poor in adsorption stability to the silicon wafer, and a phenomenon that the silicon wafer falls off frequently occurs.
The invention discloses a silicon wafer clamping device, which is disclosed in Chinese patent literature and has the publication number of CN 114180339A, an external air source is connected with an air source connecting port, a silicon wafer is sucked through a first sucker and a second sucker, a motor drives a sliding block to move on a track, so that the first sucker and the second sucker perform relative movement, the silicon wafer is overlapped, and finally the silicon wafer is placed in a quartz boat, so that the damage of clamping jaws to the silicon wafer is avoided. However, the contact area between the first sucker and the second sucker and the silicon wafer is small, the suction force is uneven, the adsorption stability is poor, and the silicon wafer is easy to fall off in the transportation process; the clamping pieces are connected in series, if one clamping piece is damaged, the whole clamping piece needs to be replaced completely, so that maintenance is not facilitated, and the replacement cost is high; and the problem that the overall transfer efficiency of the silicon wafer is extremely low due to the fact that the difficulty of the silicon wafer in slicing is high due to the fact that the electrostatic adsorption effect is generated after the stacked silicon wafers react at high temperature is solved.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, the present invention is directed to a silicon wafer separating and combining device and a silicon wafer diffusion inserting and taking method, which are used for solving the problems of poor adsorption stability, high difficulty in separating silicon wafers and low transportation efficiency of the existing vacuum adsorption type silicon wafer clamping and taking device.
In order to achieve the above and other related objects, the present invention provides a silicon wafer separating and combining device, which comprises a mounting base, a guide rail and an ion air knife assembly, wherein the guide rail and the ion air knife assembly are arranged on the mounting base, a first adsorption module and a second adsorption module for adsorbing a silicon wafer are respectively arranged at two ends of the guide rail in a sliding manner, and the ion air knife assembly is arranged between the first adsorption module and the second adsorption module; at least one of the first adsorption module and the second adsorption module is also provided with an offset mechanism; when the first adsorption module and the second adsorption module adsorb silicon wafers, an accommodating space capable of accommodating at least a single silicon wafer exists between two adjacent silicon wafers; the offset mechanism is used for driving at least one of the first adsorption module and the second adsorption module to offset; the ion air knife assembly is provided with an air outlet channel, and the air outlet channel is provided with an ion generating device; the air outlet channel comprises a plurality of air outlet units which are uniformly arranged at intervals along the length direction of the first adsorption module and the second adsorption module; the mounting base is also provided with a driving device for driving the first adsorption module and the second adsorption module to relatively open and close along the guide rail; the first sucking disc that adsorbs the module is equipped with a plurality of first sucking disc, the second adsorbs the module and is equipped with a plurality of second sucking disc, the absorption face of first sucking disc and second sucking disc sets up relatively, first sucking disc and second sucking disc are equipped with the complementary absorption arm subassembly of structure, first sucking disc and second sucking disc all are equipped with the vacuum absorption circuit module that covers the absorption face, vacuum absorption circuit module external connection has vacuum generating device.
In the above-mentioned technical scheme of this application, adopt first adsorption module and second adsorption module to adsorb the silicon chip based on negative pressure adsorption principle and realize the harmless transportation of silicon chip, through the adsorption area of the complementary adsorption arm subassembly increase to the silicon chip of design structure on first sucking disc and second sucking disc, improve adsorption stability, complementary structure is favorable to realizing accurate counterpoint still, is convenient for realize high-efficient piece that closes. The first adsorption module and the second adsorption module are relatively opened and closed along the guide rail through the guide rail and the driving device, so that the silicon wafer is split and combined; the offset mechanism can drive the silicon wafers absorbed in the first absorption module and the second absorption module to offset relatively, which is beneficial to high-efficiency inserting sheets in the process of combining sheets; in the prior art, the air knife with the air outlet of a linear structure is mostly adopted for slicing, but the problem of uneven air flow at the air outlet of the air knife with the linear structure is found in practical application, and the electrostatic adsorption force generated after the stacked silicon wafers react at high temperature is large, so that the traditional air knife can not realize the separation of the silicon wafers rapidly. In order to solve the problems, the ion air knife assembly creatively adopts high-energy ion air generated by utilizing plasmas, the plasmas are in a state formed by interaction of ionized gas and electromagnetic fields, the ion air knife assembly has the characteristics of high speed and high temperature, static electricity between silicon wafers can be eliminated rapidly, but the linear ion air is directly adopted to be uneven, so that larger impact force is easily caused to the silicon wafers, and the silicon wafers are inclined. In order to overcome the defect, the air outlet channel of the ion air knife assembly is designed to be a plurality of structures which are formed by a plurality of air outlet units uniformly arranged along the length direction interval of the first adsorption module and the second adsorption module, linear ion air is uniformly dispersed and then acts on the silicon wafer, static electricity is effectively removed, and efficient slicing is achieved. The silicon wafer separating and combining device has ingenious design, high silicon wafer clamping, separating and combining efficiency, can realize nondestructive transportation of silicon wafers, can efficiently remove static electricity, and has high separating efficiency.
Preferably, the first adsorption module further comprises a first sliding block with an upper end in sliding connection with the guide rail and a first mounting plate fixedly connected with the lower end of the first sliding block and horizontally arranged, the first sucking disc is vertically arranged on the lower end face of the first mounting plate at intervals, the second adsorption module further comprises a second sliding block with an upper end in sliding connection with the guide rail and a second mounting plate fixedly connected with the lower end of the second sliding block and horizontally arranged, the second sucking disc is vertically arranged on the lower end face of the second mounting plate at intervals, a first air extraction connector communicated with the first sucking disc is arranged on the first mounting plate, a second air extraction connector communicated with the second sucking disc is arranged on the second mounting plate, and the first air extraction connector and the second air extraction connector are connected with the vacuum generating device.
Preferably, the first adsorption module, the air knife assembly and the second adsorption module are arranged in parallel, and when the first adsorption module and the second adsorption module are combined, the air outlet channel is arranged right above the combined center line of the first adsorption module and the second adsorption module.
Preferably, each first suction cup is independently and detachably connected with the first mounting plate; each second adsorption unit is independently and detachably connected with the second mounting plate. The single sucking disc is independently and detachably connected with the mounting plate, the mounting and the replacement are convenient, and the maintenance cost is reduced relative to the whole series fixed connection design.
Preferably, the ion air knife component comprises an installation vertical plate which is relatively arranged on two sides of the installation base and a ventilation opening enclosure component which is fixedly connected with the end parts of the installation vertical plate at two ends, a gas containing cavity is formed in the ventilation opening enclosure component, the ventilation opening enclosure component is provided with a gas source access port which is communicated with the gas containing cavity, the ventilation opening enclosure component is horizontally suspended between the first adsorption module and the second adsorption module, and the air outlet channel is formed by an air outlet groove which is formed in the lower end of the ventilation opening enclosure component.
Preferably, the vent enclosure assembly comprises a first enclosing plate and a second enclosing plate, the air outlet groove and the gas accommodating cavity are formed after the first enclosing plate and the second enclosing plate are relatively and alternately buckled and fixed, and the size of the air outlet groove along the air outlet direction is gradually reduced to form a necking structure. The necking structure can increase the impact force of the ion airflow and improve the efficiency of the silicon wafer splitting and combining device in the process of splitting and desorbing the silicon wafers.
Preferably, a plurality of guide plates are arranged in the air outlet groove at intervals, and the air outlet unit is formed by a space between two adjacent guide plates.
Preferably, a sealing plate is arranged at the opening of the air outlet groove, the air outlet unit is a nozzle, and the nozzle is arranged on the sealing plate at intervals.
Preferably, the first sucking disc includes first installation department and first adsorption site, first installation department is pegged graft fixedly with first mounting panel, the second sucking disc includes second installation department and second adsorption site, second installation department is pegged graft fixedly with the second mounting panel, the adsorption arm subassembly includes that at least three intervals locate the first adsorption arm of first adsorption site and at least three locate the second adsorption arm of second adsorption site, be formed with the spacing groove with second adsorption arm shape looks adaptation between two adjacent first adsorption arms.
Preferably, one surface of the first sucker is a first adsorption surface, the other surface of the first sucker is a first air inlet surface, and the first air inlet surface is provided with a first air suction hole communicated with a first vacuum adsorption loop; one surface of the second sucker is a second adsorption surface, the other surface of the second sucker is a second air inlet surface, and the second air inlet surface is provided with a second air suction hole communicated with a second vacuum adsorption loop; the vacuum adsorption loop module comprises a first vacuum adsorption loop arranged on the first adsorption surface and a second vacuum adsorption loop arranged on the second adsorption surface, and the first vacuum adsorption loop covers the first adsorption part and the first adsorption arm; the second vacuum adsorption loop covers the second adsorption part and the second adsorption arm; the first adsorption surface and the second adsorption surface are oppositely arranged, so that the first adsorption surface and the second adsorption surface can adsorb two surfaces of the stacked silicon wafers respectively during slicing, and slicing is facilitated.
The application has increased the adsorption area of first sucking disc and second sucking disc through the coverage area that enlarges first, two vacuum adsorption circuit, and annular vacuum adsorption circuit is longer, and the suction is more stable, avoids taking place the drop of silicon chip in the transportation process.
Preferably, the guide rails are at least two, the driving device comprises guide wheels which are arranged between the two guide rails and correspond to two ends of the guide rails, and a first driving source which is used for driving at least one guide wheel to rotate, a conveyor belt is wound between the two guide wheels, the first sliding block and the second sliding block are respectively and fixedly connected with the conveyor belt, the moving directions of the first sliding block and the second sliding block are opposite, and the offset mechanism is arranged on the first sliding block or the second sliding block. The first adsorption module and the second adsorption module can be driven to relatively open and close along the guide rail in a high-efficiency manner by adopting a belt transmission mode.
Preferably, the offset mechanism comprises a sliding rail, an offset sliding block in sliding connection with the sliding rail and a driving mechanism for driving the offset sliding block to move along the sliding rail in an offset mode, the sliding rail is horizontally arranged on the first sliding block or the second sliding block along the direction perpendicular to the silicon wafer, one end of the offset sliding block is in sliding connection with the sliding rail, and the other end of the offset sliding block is fixedly connected with the first adsorption module or the second adsorption module.
More preferably, the driving mechanism comprises a screw rod, a nut and a second driving source for driving the screw rod to rotate, wherein the nut is sleeved on the screw rod and is fixedly connected with the first adsorption module or the second adsorption module. The screw rod is used for driving the nut to linearly move, and the nut drives the first adsorption module or the second adsorption module to linearly move along the sliding rail in a shifting mode. The mode of adopting the screw transmission can efficiently realize that the silicon wafers adsorbed in the first adsorption module and the second adsorption module are relatively deviated, thereby being beneficial to efficient inserting sheets in the lamination process.
The invention also provides a system for inserting, taking and placing the silicon wafers by the ALD automatic manipulator, which comprises the silicon wafer splitting and combining device and a mechanical arm for controlling the silicon wafer splitting and combining device to work.
The invention also provides a silicon wafer diffusion inserting and taking method based on the silicon wafer separating and combining device, which comprises the following steps:
when the device is applied to combining silicon wafers in two groups of silicon wafer flower baskets, a silicon wafer separating and combining device is moved to the upper part of the silicon wafers in the two groups of silicon wafer flower baskets, a driving device is adopted to drive a first adsorption module and a second adsorption module to reversely move and separate to the corresponding positions of the silicon wafers in the two groups of silicon wafer flower baskets along a guide rail, a vacuum generating device is started to start vacuum, a vacuum environment is provided for a vacuum adsorption loop module, and the first adsorption module and the second adsorption module are respectively adopted to simultaneously realize the absorption of the silicon wafers in the silicon wafer flower baskets; when the first adsorption module and the second adsorption module which adsorb the silicon wafers are driven by the driving device to move along the guide rail in opposite directions to be contacted, the first adsorption module and the second adsorption module are driven by the shifting mechanism to shift relatively, the driving device drives the first adsorption module and the second adsorption module to drive the silicon wafers to carry out inserting sheet combination, then the silicon wafers are moved to the position above a third silicon wafer basket for accommodating the combined silicon wafers, the vacuum generating device is closed, and the combined silicon wafers are placed in the third silicon wafer basket to finish the combined silicon wafers;
when the device is applied to slicing of silicon wafers in a group of silicon wafer flower baskets in a slice-combining state, the silicon wafer slicing-combining device is moved to the upper part of the silicon wafers in the group of silicon wafer flower baskets, a driving device is adopted to drive a first adsorption module and a second adsorption module to move to a combined state after combination along the guide rail in opposite directions, a vacuum generating device is started to start vacuum, a vacuum environment is provided for a vacuum adsorption loop module, and the silicon wafers in the silicon wafer flower baskets are simultaneously absorbed by the first adsorption module and the second adsorption module; opening an ion air knife assembly, driving a first adsorption module and a second adsorption module to generate relative offset by adopting an offset mechanism, driving the first adsorption module and the second adsorption module which adsorb silicon wafers by adopting a driving device to reversely move and separate along a guide rail, driving the silicon wafers to be combined, then moving to the positions above two silicon wafer flower baskets for accommodating the silicon wafers after the silicon wafers are separated, closing a vacuum generating device, and respectively placing the silicon wafers after the silicon wafers are separated in the two silicon wafer flower baskets to finish the silicon wafer separation.
As described above, the present invention has the following advantageous effects:
(1) The first adsorption module and the second adsorption module are used for adsorbing the silicon wafer based on a negative pressure adsorption principle to realize nondestructive transportation of the silicon wafer, and the first adsorption module and the second adsorption module are used for realizing relative opening and closing movement to realize slicing and slice combination of the silicon wafer through the guide rail and the driving device;
(2) The adsorption area of the silicon wafer is increased by designing the adsorption arm assemblies with complementary structures on the first sucker and the second sucker, so that the adsorption stability is improved, the complementary structures are also beneficial to realizing accurate alignment, and the efficient wafer combination is convenient to realize;
(3) The offset mechanism can drive the silicon wafers absorbed in the first absorption module and the second absorption module to offset relatively, which is beneficial to high-efficiency inserting sheets in the process of combining sheets;
(4) An ion air knife assembly with an air outlet channel formed by a plurality of air outlet units uniformly arranged along the length direction of the first adsorption module and the second adsorption module is adopted, linear ion air is uniformly dispersed and then acts on a silicon wafer, static electricity is effectively removed, and efficient slicing is realized;
(5) The silicon wafer separating and combining device for carrying out the silicon wafer diffusion inserting and taking method has high silicon wafer clamping, separating and combining efficiency, and can realize the nondestructive transfer of the silicon wafer.
Drawings
FIG. 1 is a schematic diagram of an ALD robot system for handling and transporting silicon wafers according to example 1.
Fig. 2 is a schematic structural view of a silicon wafer separating and combining device in a state of separating the silicon wafer.
Fig. 3 is a schematic structural diagram of the silicon wafer separating and combining device in fig. 1.
Fig. 4 shows an enlarged view at a in fig. 3.
Fig. 5 shows a left side view of fig. 3.
Fig. 6 shows a rear view of fig. 3.
Fig. 7 shows a schematic structural view of the first suction surface of the first suction cup.
Fig. 8 shows a schematic structural view of the first air inlet surface of the first suction cup.
Fig. 9 shows a schematic structural view of the second suction surface of the second suction cup.
Fig. 10 shows a schematic structural view of the second air inlet surface of the second suction cup.
Fig. 11 is a schematic view showing a mounting structure of the driving device.
Fig. 12 is a schematic structural view showing the adsorption of the silicon wafer by the first adsorption module in the wafer splitting state of the silicon wafer splitting and combining device.
Fig. 13 is a schematic view showing the structure of the silicon wafer separating and combining device in a state of being combined.
Fig. 14 is a schematic structural view showing an ionic wind knife assembly according to example 2.
Reference numerals illustrate: 1. a mounting base; 2. a guide rail; 3. an ion air knife assembly; 31. installing a vertical plate; 33. a vent enclosure assembly; 331. a first coaming; 332 a second shroud; 34. an air source access port; 35. an air outlet groove; 36. a deflector; 37. a sealing plate; 38. a nozzle; 4. a silicon wafer; 5. a first adsorption module; 51. a first mounting plate; 52. a first suction cup; 521. a first mounting portion; 522. a first adsorption unit; 523. a first adsorption arm; 524. a limit groove; 525. a first adsorption surface; 526. a first air inlet surface; 527. a first vacuum adsorption loop; 528. a first suction hole; 53. a first air extraction joint; 54. a first slider; 541. the first sliding block adapter plate; 6. a second adsorption module; 61. a second mounting plate; 62. a second suction cup; 621. a second mounting portion; 622. a second adsorption unit; 623. a second adsorption arm; 624. a second adsorption surface 625 and a second air inlet surface; 626. a second vacuum adsorption loop; 627. a second suction hole; 63. a second air extraction joint; 64. a second slider; 641. the second sliding block adapter plate; 7. an offset mechanism; 71. a slide rail; 72. an offset slider; 73. a screw rod; 74. a nut; 75. a second driving source; 8. a driving device; 81. a guide wheel; 82. a first driving source; 83. a conveyor belt; 9. and a mechanical arm.
Detailed Description
In order to make the objects, features and advantages of the present invention more comprehensible, the technical solutions in the embodiments of the present invention are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present application, it should be noted that the azimuth or positional relationship indicated by the terms "upper", "lower", "inner", "outer", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of description of the present application and simplification of the description, and do not indicate or imply that the apparatus or element in question must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present application.
Unless specifically stated or limited otherwise, the terms "connected," "affixed," "disposed" and "configured" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; the two components can be connected mechanically, directly or indirectly through an intermediate medium, or internally. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.
The ion generating device is based on the prior art, can directly adopt the ion generating device sold in the market, and does not relate to the improvement of the structure and the principle, and is not repeated here.
The ion generating device described in the examples below is purchased from Shenzhen Kai precision technology Co., ltd.
Example 1
As shown in fig. 1, an embodiment of the present application provides an ALD automated manipulator inserting, taking and placing silicon wafer system, which includes a silicon wafer separating and combining device 10 and a mechanical arm 9 for controlling the silicon wafer separating and combining device to work.
As shown in fig. 2, the embodiment of the application provides a silicon wafer separating and combining device, which comprises a mounting base 1, wherein two guide rails 2 and an ion air knife assembly 3 are arranged on the mounting base at parallel intervals, a first adsorption module 5 and a second adsorption module 6 for adsorbing a silicon wafer 4 are respectively arranged at two ends of the guide rails in a sliding manner, and the ion air knife assembly is arranged between the first adsorption module and the second adsorption module; the first adsorption module, the ion air knife assembly and the second adsorption module are arranged in parallel, and when the first adsorption module and the second adsorption module are combined, the air outlet channel is arranged right above the combined center line of the first adsorption module and the second adsorption module; the second adsorption module is also provided with an offset mechanism 7; when the first adsorption module and the second adsorption module adsorb silicon wafers, an accommodating space capable of accommodating at least a single silicon wafer exists between two adjacent silicon wafers; the offset mechanism is used for driving the silicon wafer adsorbed by the second adsorption module to offset; the ion air knife assembly is provided with an air outlet channel, and the air outlet channel is provided with an ion generating device (not shown in the figure); the air outlet channel comprises a plurality of air outlet units which are uniformly arranged at intervals along the length direction of the first adsorption module and the second adsorption module; the mounting base is also provided with a driving device 8 for driving the first adsorption module and the second adsorption module to relatively open and close along the guide rail. The first suckers and the second suckers are provided, and each first sucker is independently and detachably connected with the first mounting plate; each second adsorption unit is independently and detachably connected with the second mounting plate.
As shown in fig. 2, the first adsorption module comprises a first sliding block 54, a horizontally arranged first mounting plate 51 and a plurality of first suckers 52, the upper end of the first sliding block is in sliding connection with the guide rail, the lower end of the first sliding block is fixedly connected with the lower end of the second sliding block, the first sucking plate 52 is vertically arranged at intervals on the lower end surface of the first mounting plate, the second adsorption module comprises a second sliding block 64, a horizontally arranged second mounting plate 61 and a plurality of second suckers 62, the upper end of the second sliding block is in sliding connection with the guide rail, the lower end of the second sliding block is fixedly connected with the second mounting plate, the second suckers are vertically arranged at intervals on the lower end surface of the second mounting plate, the first suckers and the second suckers are provided with adsorption arm assemblies with complementary structures, the first suckers and the second suckers are respectively provided with a vacuum adsorption loop module for covering an adsorption surface, and the vacuum adsorption loop module is externally connected with a vacuum generating device, and each first sucker is independently and detachably connected with the first mounting plate; each second adsorption unit is independently and detachably connected with a second mounting plate, a first air extraction connector 53 communicated with a first sucker is arranged on the first mounting plate, a second air extraction connector 63 communicated with a second sucker is arranged on the second mounting plate, and the first air extraction connector and the second air extraction connector are connected with the vacuum generating device.
As shown in fig. 3 and 4, the ionic air knife assembly comprises mounting vertical plates 31 arranged on two sides of the mounting base oppositely and an air vent enclosing and blocking assembly 33 with two ends fixedly connected with the ends of the mounting vertical plates, an air accommodating cavity is formed in the air vent enclosing and blocking assembly, the air vent enclosing and blocking assembly is provided with an air source access port 34 communicated with the air accommodating cavity, the air vent enclosing and blocking assembly is horizontally suspended between the first adsorption module and the second adsorption module, and the air outlet channel is formed by an air outlet groove 35 formed in the lower end of the air vent enclosing and blocking assembly; the vent encloses fender subassembly and includes outside bellied first bounding wall 331 and second bounding wall 332, air-out groove and gas hold the chamber and form after fixed by first bounding wall and the relative crisscross lock of second bounding wall, the size of air-out groove along the direction of giving vent to anger reduces gradually and is formed with the throat structure. As shown in fig. 4, a plurality of guide plates 36 are arranged in the air outlet groove at intervals, and the air outlet unit is formed by a space between two adjacent guide plates.
As shown in fig. 11, the driving device includes a guide wheel 81 disposed between two guide rails and corresponding to two ends of the guide rail, and a first driving source 82 for driving the guide wheel to rotate, where the first driving source adopts a servo motor, a conveyor belt 83 is wound between the two guide wheels, the first slider is fixedly connected with the conveyor belt through a first slider adapter plate 541, the second slider is fixedly connected with the conveyor belt through a second slider adapter plate 641, and movement directions of the first slider and the second slider are opposite; the offset mechanism is arranged on the second sliding block.
As shown in fig. 5 and 6, the offset mechanism includes a sliding rail 71, an offset sliding block 72 slidably connected with the sliding rail, and a driving mechanism for driving the offset sliding block to move along the sliding rail, where the sliding rail is horizontally disposed on the first sliding block or the second sliding block along a direction perpendicular to the silicon wafer, one end of the offset sliding block is slidably connected with the sliding rail, and the other end is fixedly connected with the first adsorption module or the second adsorption module. The driving mechanism comprises a screw rod 73, a nut 74 and a second driving source 75 for driving the screw rod to rotate, the second driving source adopts a servo motor, the nut is sleeved on the screw rod, and the nut is fixedly connected with the second adsorption module 6.
Referring to fig. 7, 8, 9 and 10, the first suction cup includes a first mounting portion 521 and a first adsorption portion 522, the first mounting portion is fixedly inserted into the first mounting plate, the second suction cup includes a second mounting portion 621 and a second adsorption portion 622, the second mounting portion is fixedly inserted into the second mounting plate, the adsorption arm assembly includes three first adsorption arms 523 and three second adsorption arms 623 spaced apart from each other and disposed on the first adsorption portion, and a limiting groove 524 adapted to the shape of the second adsorption arms is formed between two adjacent first adsorption arms;
as shown in fig. 7, one surface of the first sucker is a first adsorption surface 525, and the other surface is a first air inlet surface 526, and the first air inlet surface is provided with a first air suction hole 528 communicated with a first vacuum adsorption loop; as shown in fig. 9, one surface of the second sucker is a second adsorption surface 624, and the other surface is a second air inlet surface 625, and the second air inlet surface is provided with a second air suction hole 627 communicated with a second vacuum adsorption loop; referring to fig. 7 and 9, the vacuum suction loop module includes a first vacuum suction loop 527 provided on the first suction surface and a second vacuum suction loop 626 provided on the second suction surface, the first vacuum suction loop covering the first suction portion and the first suction arm; the second vacuum adsorption loop covers the second adsorption part and the second adsorption arm; the first adsorption surface and the second adsorption surface are oppositely arranged.
The embodiment of the application also provides a silicon wafer diffusion inserting and taking method based on the silicon wafer separating and combining device in the ALD automatic manipulator inserting and taking and placing silicon wafer system, which comprises the following steps:
when the device is applied to the combination of the silicon wafers in the two groups of silicon wafer flower baskets, the mechanical arm 9 is controlled to move the silicon wafer separating and combining device 10 to the upper part of the silicon wafers in the two groups of silicon wafer flower baskets, the driving device 8 is adopted to drive the first adsorption module 5 and the second adsorption module 6 to reversely move and separate to the corresponding positions of the silicon wafers in the two groups of silicon wafer flower baskets along the guide rail 2, the vacuum generating device is started to start vacuum, the first air extraction connector 53 and the second air extraction connector 63 are connected to carry out air extraction to provide a vacuum environment for the vacuum adsorption loop module, and the first adsorption module and the second adsorption module are respectively adopted to simultaneously realize the absorption of the silicon wafers in the silicon wafer flower baskets; when the first adsorption module and the second adsorption module which adsorb the silicon wafers are driven by the driving device to move along the guide rail in opposite directions to be contacted, the first adsorption module and the second adsorption module are driven by the shifting mechanism to shift relatively, the driving device drives the first adsorption module and the second adsorption module to drive the silicon wafers to carry out inserting sheet combination, then the silicon wafers are moved to the position above a third silicon wafer basket for accommodating the combined silicon wafers, the vacuum generating device is closed, and the combined silicon wafers are placed in the third silicon wafer basket to finish the combined silicon wafers;
when the device is applied to slicing of silicon wafers in a group of silicon wafer flower baskets in a slice combining state, the mechanical arm 9 is controlled to move the silicon wafer slicing and combining device 10 to the upper part of the silicon wafers in the group of silicon wafer flower baskets, the driving device is adopted to drive the first adsorption module and the second adsorption module to move to the combined state after combination along the guide rail in the opposite direction, the vacuum generating device is started to start vacuum, the first air extraction connector 53 and the second air extraction connector 63 are connected to carry out air extraction to provide a vacuum environment for the vacuum adsorption loop module, and the silicon wafers in the silicon wafer flower baskets are simultaneously absorbed by the first adsorption module and the second adsorption module; opening an ion air knife assembly, uniformly dispersing linear ion air through an air outlet unit, and then acting on the silicon wafers to efficiently remove static electricity among the silicon wafers; meanwhile, the first adsorption module and the second adsorption module are driven to generate relative offset by adopting the offset mechanism, the first adsorption module and the second adsorption module which adsorb the silicon wafers are driven by adopting the driving device to reversely move and separate along the guide rail, the silicon wafers are driven to be sliced, then the silicon wafers are moved to the positions above two silicon wafer baskets for accommodating the sliced silicon wafers, the vacuum generating device is closed, the sliced silicon wafers are respectively placed in the two silicon wafer baskets, and slicing of the silicon wafers is completed.
Example 2
Embodiment 2 differs from embodiment 1 in that the offset mechanism is disposed at a different position, specifically on the first adsorption module, and the ionic air knife assembly has a different structure, specifically as shown in fig. 5, a sealing plate 37 is disposed at the opening of the air outlet slot, the air outlet unit is a nozzle 38, the nozzles are disposed on the sealing plate at intervals, and the other structures and principles are identical.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (10)
1. The silicon wafer separating and combining device is characterized by comprising a mounting base (1), a guide rail (2) and an ion air knife assembly (3), wherein the guide rail is arranged on the mounting base, a first adsorption module (5) and a second adsorption module (6) for adsorbing a silicon wafer (4) are respectively arranged at two ends of the guide rail in a sliding manner, and the ion air knife assembly is arranged between the first adsorption module and the second adsorption module; at least one of the first adsorption module and the second adsorption module is also provided with an offset mechanism (7); when the first adsorption module and the second adsorption module adsorb silicon wafers, an accommodating space capable of accommodating at least a single silicon wafer exists between two adjacent silicon wafers; the offset mechanism is used for driving at least one of the first adsorption module and the second adsorption module to offset; the ion air knife assembly is provided with an air outlet channel, and the air outlet channel is provided with an ion generating device; the air outlet channel comprises a plurality of air outlet units which are uniformly arranged at intervals along the length direction of the first adsorption module and the second adsorption module; the mounting base is also provided with a driving device (8) for driving the first adsorption module and the second adsorption module to relatively open and close along the guide rail; the first sucking module is provided with a plurality of first sucking discs (52), the second sucking module is provided with a plurality of second sucking discs (62), the sucking surfaces of the first sucking discs and the second sucking discs are arranged oppositely, the first sucking discs and the second sucking discs are provided with sucking arm assemblies with complementary structures, the first sucking discs and the second sucking discs are respectively provided with a vacuum sucking ring channel module for covering the sucking surfaces, and the vacuum sucking ring channel modules are externally connected with a vacuum generating device.
2. The silicon wafer separating and combining device according to claim 1, wherein: the first adsorption module further comprises a first sliding block (54) with the upper end being in sliding connection with the guide rail and a first mounting plate (51) which is horizontally arranged and fixedly connected with the lower end of the first sliding block, the first sucking discs are vertically arranged on the lower end face of the first mounting plate at intervals, the second adsorption module further comprises a second sliding block (64) with the upper end being in sliding connection with the guide rail and a second mounting plate (61) which is horizontally arranged and fixedly connected with the lower end of the second sliding block, the second sucking discs are vertically arranged on the lower end face of the second mounting plate at intervals, a first air extraction connector (53) which is communicated with the first sucking discs is arranged on the first mounting plate, and a second air extraction connector (63) which is communicated with the second sucking discs is arranged on the second mounting plate, and the first air extraction connector and the second air extraction connector are connected with the vacuum generating device.
3. The silicon wafer separating and combining device according to claim 2, wherein: the first adsorption module, the ion air knife assembly and the second adsorption module are arranged in parallel, and when the first adsorption module and the second adsorption module are combined, the air outlet channel is arranged right above the combined center line of the first adsorption module and the second adsorption module; each first sucker is independently and detachably connected with the first mounting plate; each second adsorption unit is independently and detachably connected with the second mounting plate.
4. A silicon wafer separating and combining device according to claim 3, wherein: the ion air knife assembly comprises mounting vertical plates (31) which are oppositely arranged on two sides of the mounting base, and vent hole enclosure assemblies (33) with two ends fixedly connected with the ends of the mounting vertical plates, wherein a gas containing cavity is formed in the vent hole enclosure assemblies, the vent hole enclosure assemblies are provided with gas source access ports (34) communicated with the gas containing cavity, the vent hole enclosure assemblies are horizontally suspended between the first adsorption module and the second adsorption module, and the air outlet channel is formed by an air outlet groove (35) formed in the lower end of the vent hole enclosure assemblies; the ventilation opening enclosure assembly comprises a first enclosing plate (331) and a second enclosing plate (332), the air outlet groove and the gas accommodating cavity are formed after the first enclosing plate and the second enclosing plate are fastened and fixed in a staggered mode, and the size of the air outlet groove along the air outlet direction is gradually reduced to form a necking structure.
5. The wafer dividing and combining device according to claim 4, wherein: a plurality of guide plates (36) are arranged in the air outlet groove at intervals, and the air outlet unit is formed by a space between two adjacent guide plates.
6. The wafer dividing and combining device according to claim 4, wherein: the opening part of the air outlet groove is provided with a sealing plate (37), the air outlet unit is provided with nozzles (38), and the nozzles are arranged on the sealing plate at intervals.
7. A silicon wafer separating and combining device according to claim 3, wherein: the first sucking disc comprises a first mounting part (521) and a first adsorption part (522), the first mounting part is fixedly connected with a first mounting plate in an inserting mode, the second sucking disc comprises a second mounting part (621) and a second adsorption part (622), the second mounting part is fixedly connected with a second mounting plate in an inserting mode, the adsorption arm assembly comprises at least three first adsorption arms (523) arranged on the first adsorption part at intervals and at least three second adsorption arms (623) arranged on the second adsorption part at intervals, and a limiting groove (524) matched with the shape of each second adsorption arm is formed between every two adjacent first adsorption arms;
one surface of the first sucker is a first adsorption surface (525), the other surface of the first sucker is a first air inlet surface (526), and a first air suction hole (528) communicated with a first vacuum adsorption loop is formed in the first air inlet surface; one surface of the second sucker is a second adsorption surface (624), the other surface of the second sucker is a second air inlet surface (625), and the second air inlet surface is provided with a second air suction hole (627) communicated with a second vacuum adsorption loop; the vacuum adsorption loop module comprises a first vacuum adsorption loop (527) arranged on the first adsorption surface and a second vacuum adsorption loop (626) arranged on the second adsorption surface, and the first vacuum adsorption loop covers a first adsorption part and a first adsorption arm; the second vacuum adsorption loop covers the second adsorption part and the second adsorption arm; the first adsorption surface and the second adsorption surface are oppositely arranged.
8. The silicon wafer separating and combining device according to claim 2, wherein: the guide rail is provided with at least two guide wheels, the driving device comprises guide wheels (81) which are arranged between the two guide rails and correspond to the two ends of the guide rail, and a first driving source (82) which is used for driving at least one guide wheel to rotate, a conveyor belt (83) is wound between the two guide wheels, the first sliding block and the second sliding block are respectively fixedly connected with the conveyor belt, and the moving directions of the first sliding block and the second sliding block are opposite; the offset mechanism is arranged on the first sliding block or the second sliding block.
9. The silicon wafer separating and combining device according to claim 8, wherein: the offset mechanism comprises a sliding rail (71), an offset sliding block (72) which is in sliding connection with the sliding rail, and a driving mechanism for driving the offset sliding block to move along the sliding rail, wherein the sliding rail is horizontally arranged on the first sliding block or the second sliding block along the direction perpendicular to the silicon wafer, one end of the offset sliding block is in sliding connection with the sliding rail, and the other end of the offset sliding block is fixedly connected with the first adsorption module or the second adsorption module; the driving mechanism comprises a screw rod (73), a nut (74) and a second driving source (75) for driving the screw rod to rotate, the screw rod is sleeved with the nut, and the nut is fixedly connected with the first adsorption module or the second adsorption module.
10. A silicon wafer diffusion inserting and taking method based on the silicon wafer separating and combining device as claimed in any one of claims 1 to 9, which is characterized in that: the method comprises the following steps:
when the device is applied to combining silicon wafers in two groups of silicon wafer flower baskets, a silicon wafer separating and combining device is moved to the upper part of the silicon wafers in the two groups of silicon wafer flower baskets, a driving device is adopted to drive a first adsorption module and a second adsorption module to reversely move and separate to the corresponding positions of the silicon wafers in the two groups of silicon wafer flower baskets along a guide rail, a vacuum generating device is started to start vacuum, a vacuum environment is provided for a vacuum adsorption loop module, and the first adsorption module and the second adsorption module are respectively adopted to simultaneously realize the absorption of the silicon wafers in the silicon wafer flower baskets; when the first adsorption module and the second adsorption module which adsorb the silicon wafers are driven by the driving device to move along the guide rail in opposite directions to be contacted, the first adsorption module and the second adsorption module are driven by the shifting mechanism to shift relatively, the driving device drives the first adsorption module and the second adsorption module to drive the silicon wafers to carry out inserting sheet combination, then the silicon wafers are moved to the position above a third silicon wafer basket for accommodating the combined silicon wafers, the vacuum generating device is closed, and the combined silicon wafers are placed in the third silicon wafer basket to finish the combined silicon wafers;
when the device is applied to slicing of silicon wafers in a group of silicon wafer flower baskets in a slice-combining state, the silicon wafer slicing-combining device is moved to the upper part of the silicon wafers in the group of silicon wafer flower baskets, a driving device is adopted to drive a first adsorption module and a second adsorption module to move to a combined state after combination along the guide rail in opposite directions, a vacuum generating device is started to start vacuum, a vacuum environment is provided for a vacuum adsorption loop module, and the silicon wafers in the silicon wafer flower baskets are simultaneously absorbed by the first adsorption module and the second adsorption module; opening an ion air knife assembly, driving a first adsorption module and a second adsorption module to generate relative offset by adopting an offset mechanism, driving the first adsorption module and the second adsorption module which adsorb silicon wafers by adopting a driving device to reversely move and separate along a guide rail, driving the silicon wafers to be combined, then moving to the positions above two silicon wafer flower baskets for accommodating the silicon wafers after the silicon wafers are separated, closing a vacuum generating device, and respectively placing the silicon wafers after the silicon wafers are separated in the two silicon wafer flower baskets to finish the silicon wafer separation.
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| CN210640204U (en) * | 2019-09-16 | 2020-05-29 | 罗博特科智能科技股份有限公司 | Silicon wafer combining and splitting device |
| CN212967642U (en) * | 2020-08-06 | 2021-04-13 | 罗博特科智能科技股份有限公司 | High-efficient device of getting of silicon chip |
| CN114335253A (en) * | 2021-12-31 | 2022-04-12 | 湖南红太阳光电科技有限公司 | Silicon wafer taking and placing device and method |
| CN219329248U (en) * | 2022-12-27 | 2023-07-11 | 上饶捷泰新能源科技有限公司 | Sucking disc subassembly, go up unloading mechanism and battery production facility |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210640204U (en) * | 2019-09-16 | 2020-05-29 | 罗博特科智能科技股份有限公司 | Silicon wafer combining and splitting device |
| CN212967642U (en) * | 2020-08-06 | 2021-04-13 | 罗博特科智能科技股份有限公司 | High-efficient device of getting of silicon chip |
| CN114335253A (en) * | 2021-12-31 | 2022-04-12 | 湖南红太阳光电科技有限公司 | Silicon wafer taking and placing device and method |
| CN219329248U (en) * | 2022-12-27 | 2023-07-11 | 上饶捷泰新能源科技有限公司 | Sucking disc subassembly, go up unloading mechanism and battery production facility |
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