CN218039109U - Cooling transposition device for silicon wafers - Google Patents
Cooling transposition device for silicon wafers Download PDFInfo
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- CN218039109U CN218039109U CN202221865395.8U CN202221865395U CN218039109U CN 218039109 U CN218039109 U CN 218039109U CN 202221865395 U CN202221865395 U CN 202221865395U CN 218039109 U CN218039109 U CN 218039109U
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Abstract
The utility model discloses a cooling transposition device of silicon chip, comprises a workbench, install the transposition board on the workstation, the transfer line is installed to the lower extreme of transposition board, the transfer line runs through and is connected with lift rotary power device, lift rotary power device drives the lift and the rotation of transposition board through the transfer line, first place logical groove and second place logical groove have been seted up respectively to the upper plate face of transposition board, first place logical groove and second place logical groove are in last unloading station and cooling station respectively, cooling station below is equipped with the cooling seat, the cooling seat is fixed mounting on the workstation, first place logical groove and second place logical groove are reciprocal to be switched between station and cooling station, still be equipped with the manipulator on the workstation, the execution end of manipulator is equipped with adsorption equipment, be provided with on the transposition board and be used for first dodge breach and second dodge the breach; the device can switch the position of the silicon chip, and can cool the silicon chip while loading and unloading, thereby saving the cooling time and improving the production efficiency of the silicon chip.
Description
Technical Field
The utility model relates to a cooling transposition device of silicon chip is applicable to the semiconductor material field of making.
Background
In the field of semiconductor manufacturing, surface deposition is often used in a surface treatment process of a silicon wafer, and the chemical vapor deposition method is utilized to enable the silicon wafer to chemically react with gas, so that an oxide layer is deposited on the surface of the silicon wafer, reflected light on the surface of the silicon wafer is reduced or eliminated, the light transmittance is increased, and the photoelectric conversion efficiency of the silicon wafer is further improved; at present, a large amount of heat can be generated after the chemical vapor deposition of a silicon wafer in a reaction chamber is finished, the silicon wafer is directly taken out by a manipulator and placed in a wafer rack, the wafer rack can be overheated to cause that workers cannot move, a containing groove for containing the silicon wafer is arranged in the wafer rack and can only support the edge position of the silicon wafer, the temperature of the silicon wafer is too high at the moment, the silicon wafer cannot be integrally supported to generate thermal deformation, and the yield is possibly low.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the utility model provides a cooling transposition device of silicon chip, the device can carry out the switching of position with the silicon chip, can also carry out the cooling of silicon chip in the unloading, has saved the cooling time, has improved the production efficiency of silicon chip.
In order to solve the technical problem, the technical scheme of the utility model is that: the utility model provides a cooling transposition device of silicon chip, includes the workstation, install the transposition board on the workstation, the transfer line is installed to the lower extreme of transposition board, the transfer line runs through the workstation and is connected with lifting and drop rotating power device, lifting and drop rotating power device passes through the lift and the rotation of transfer line drive transposition board, the first logical groove of placing and the second logical groove of placing that is used for placing the silicon chip is offered respectively to the last face of transposition board, first logical groove of placing and the second of placing are placed logical groove and are in respectively goes up unloading station and cooling station, cooling station below is equipped with the cooling seat that is used for placing and cool off the silicon chip, cooling seat fixed mounting is on the workstation, first logical groove of placing and the second of placing on the lifting and drop rotating power device drive transposition board place the reciprocal switching between last unloading station and cooling station, still be equipped with the manipulator on the workstation, the execution end of manipulator is equipped with the adsorption apparatus that conveniently adsorbs the silicon chip bottom surface, the motion orbit of manipulator covers the station, it dodges the breach and dodges the breach with the first logical groove and the second to be provided with the adsorption apparatus on the transposition board, first breach and dodge the intercommunication with the second respectively.
As an optimal scheme, the first placing through groove and the second placing through groove have the same structure and are step-shaped, the first placing through groove comprises a supporting surface for supporting the edge of the bottom of the silicon wafer and a positioning surface for preventing the silicon wafer from moving, and the first placing through groove and the second placing through groove are larger than the cooling seat in size.
As a preferred scheme, a housing for accommodating a lifting rotary power device is fixed at the bottom of the workbench, a lifting seat is installed in the housing in a lifting sliding manner, the lower section of the transmission rod is rotatably installed on the lifting seat, the lifting rotary power device comprises a rotary power device for controlling the rotation of the transmission rod and a lifting power device for driving the transmission rod to lift, the rotary power device is fixed on the lifting seat, the rotary power device and the transmission rod are in transmission through a synchronous belt, the lifting power device is fixed in the housing, and the power end of the lifting power device is connected with the lifting seat to control the lifting of the lifting seat.
As a preferred scheme, the rotary power device comprises a servo motor, a driving wheel is fixed on an output shaft of the servo motor, a driven wheel is connected on the transmission rod, the driving wheel and the driven wheel are in meshing transmission through a synchronous belt, and the servo motor is fixedly installed on the lifting seat.
As a preferred scheme, the lifting power device comprises a linear cylinder, the linear cylinder is fixedly installed at the bottom of the housing, the lifting seat comprises an upper plate, a middle plate and a lower plate, the upper plate, the middle plate and the lower plate form a rectangular frame structure, a guide rod of the linear cylinder is connected with the lower plate, the servo motor is fixedly installed on the middle plate, a bearing is fixed on the upper plate, and the transmission rod is rotatably installed on the upper plate through the bearing.
As a preferred scheme, the adsorption device comprises a wafer support for supporting the silicon wafer, wherein the wafer support is fixed at the execution end of the manipulator, a plurality of adsorption holes are formed in the wafer support, and the adsorption holes are communicated with the vacuum power device to adsorb the silicon wafer.
As a preferred scheme, the cooling seat comprises a seat body, a cooling platform for placing the silicon wafer is arranged on the seat body, a cooling coil pipe for circulating a cooling medium is arranged in the seat body, and the cooling coil pipe is communicated with a cooling medium circulation pipeline system.
After the technical scheme is adopted, the utility model discloses an effect is: the cooling transposition device for the silicon wafers comprises a workbench, wherein a transposition plate is arranged on the workbench, a transmission rod is arranged at the lower end of the transposition plate, the transmission rod penetrates through the workbench and is connected with a lifting rotary power device, the lifting rotary power device drives the transposition plate to lift and rotate through the transmission rod, a first placing through groove and a second placing through groove for placing the silicon wafers are formed in the upper surface of the transposition plate respectively, the first placing through groove and the second placing through groove are formed in a feeding and discharging station and a cooling station respectively, a cooling seat for placing and cooling the silicon wafers is arranged below the cooling station, the cooling seat is fixedly arranged on the workbench, the lifting rotary power device drives the first placing through groove and the second placing through groove in the transposition plate to be switched between the feeding and discharging station and the cooling station in a reciprocating mode, a manipulator is further arranged on the workbench, an adsorption device convenient for adsorbing the bottom surfaces of the silicon wafers is arranged at the execution end of the feeding and discharging station, the motion track of the manipulator covers the station, and a first avoiding notch and a second avoiding notch which are communicated with the first placing through groove and the second avoiding notch are formed in a avoiding notch;
firstly, a silicon wafer which is subjected to chemical vapor deposition is placed on a first placing through groove in a feeding and discharging station through an adsorption device of a manipulator, a lifting and rotating power device drives a transposition plate to rotate, at the moment, the first placing through groove moves to a cooling station, a second placing through groove moves to the feeding and discharging station, the lifting and rotating power device drives the transposition plate to descend until the transposition plate is lower than a cooling seat, the silicon wafer is positioned on the cooling seat to be cooled, meanwhile, the manipulator adsorption device sucks the silicon wafer which is subjected to processing to the second placing through groove, after the silicon wafer on the cooling seat is cooled, the lifting and rotating power device drives the transposition plate to ascend, then drives the transposition plate to rotate, so that the first placing through groove moves to the cooling station, the second placing through groove moves to the cooling station, the adsorption device of the manipulator adsorbs the processed silicon wafer to the first placing through groove again after the cooled silicon wafer is placed on the first placing through groove, and the processed silicon wafer is cooled by repeating the actions; the device can switch the position of the silicon chip, and can cool the silicon chip while loading and unloading, thereby saving the cooling time and improving the production efficiency of the silicon chip.
The first placing through groove and the second placing through groove are identical in structure and are step-shaped, the first placing through groove comprises a supporting surface for supporting the edge of the bottom of the silicon wafer and a positioning surface for preventing the silicon wafer from moving, and the sizes of the first placing through groove and the second placing through groove are larger than that of the cooling seat; like this the silicon chip is in first place lead to groove or the second is placed and is led to the groove and can be effectively supported and prevent that the silicon chip from taking place to rock, improves the accuracy to the transposition board can not bump with the cooling seat when going up and down, makes the silicon chip can accurately fall on the cooling seat.
The bottom of the workbench is fixedly provided with a housing for accommodating a lifting rotary power device, a lifting seat is arranged in the housing in a lifting sliding manner, the lower section of the transmission rod is rotatably arranged on the lifting seat, the lifting rotary power device comprises a rotary power device for controlling the transmission rod to rotate and a lifting power device for driving the transmission rod to lift, the rotary power device is fixed on the lifting seat, the rotary power device and the transmission rod are driven by a synchronous belt, the lifting power device is fixed in the housing, and the power end of the lifting power device is connected with the lifting seat to control the lifting of the lifting seat; the lifting and rotating power device in the housing can be effectively protected through the housing, and the safety of the device is improved.
The rotary power device comprises a servo motor, a driving wheel is fixed on an output shaft of the servo motor, a driven wheel is connected on the transmission rod, the driving wheel and the driven wheel are in meshing transmission through a synchronous belt, and the servo motor is fixedly arranged on the lifting seat; the servo motor can accurately control the speed, the position precision is very accurate, and the driving wheel and the driven wheel are meshed through the synchronous belt, so that the slipping can be effectively reduced, the transmission efficiency is ensured, and the device accuracy is improved.
The lifting power device comprises a linear cylinder, the linear cylinder is fixedly arranged at the bottom of the housing, the lifting seat comprises an upper plate, a middle plate and a lower plate, the upper plate, the middle plate and the lower plate form a rectangular frame structure, a guide rod of the linear cylinder is connected with the lower plate, a servo motor is fixedly arranged on the middle plate, a bearing is fixed on the upper plate, and a transmission rod is rotatably arranged on the upper plate through the bearing; on one hand, the bearing can support the transmission rod to lift and can keep the transmission rod to smoothly rotate, so that the operation of lifting and rotating is completed, and the device is compact in structure.
The adsorption device comprises a wafer support for supporting the silicon wafer and fixed at the execution end of the manipulator, the wafer support is provided with a plurality of adsorption holes, and the adsorption holes are communicated with the vacuum power device to adsorb the silicon wafer; the adsorption device is simple and reliable, and can effectively absorb the silicon wafer to ensure the firmness of adsorption.
The cooling seat comprises a seat body, a cooling platform for placing the silicon chip is arranged on the seat body, a cooling coil pipe for circulating a cooling medium is arranged in the seat body, and the cooling coil pipe is communicated with a cooling medium circulating pipeline system; therefore, the heat of the silicon wafer on the cooling platform can be taken away by the flowing of the cooling medium in the cooling coil, good heat dissipation performance is guaranteed, and production quality is improved.
Drawings
The present invention will be further described with reference to the accompanying drawings and examples.
Fig. 1 is a perspective view of an embodiment of the present invention;
fig. 2 is a top view of an embodiment of the invention;
fig. 3 is a schematic structural diagram of a lifting and rotating power device according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a shifting board according to an embodiment of the present invention;
in the drawings: 1. a work table; 2. a manipulator; 3. a sheet support; 31. an adsorption hole; 4. a cooling seat; 41. a cooling platform; 5. a housing; 6. a linear cylinder; 7. an upper plate; 8. a middle plate; 9. a lower plate; 10. a servo motor; 11. a driving wheel; 12. a driven wheel; 13. a synchronous belt; 14. a transmission rod; 15. a transposition board; 16. a first placing through groove; 17. a second placing through groove; 18. a loading and unloading station; 19. a cooling station; 20. a positioning surface; 21. a support surface; 22. a first avoidance gap; 23. a second avoidance gap; 24. and a bearing.
Detailed Description
The present invention will be described in further detail with reference to the following examples.
As shown in fig. 1 to 4, a silicon wafer cooling transposition device includes a workbench 1, a transposition plate 15 is mounted on the workbench 1, a transmission rod 14 is mounted at a lower end of the transposition plate 15, the transmission rod 14 penetrates through the workbench 1 and is connected with a lifting and rotating power device, the lifting and rotating power device drives the transposition plate 15 to lift and rotate through the transmission rod 14, a first placing through groove 16 and a second placing through groove 17 for placing a silicon wafer are respectively formed in an upper plate surface of the transposition plate 15, the first placing through groove 16 and the second placing through groove 17 are respectively located in a loading and unloading station 18 and a cooling station 19, a cooling seat 4 for placing and cooling the silicon wafer is arranged below the cooling station 19, the cooling seat 4 is fixedly mounted on the workbench 1, the lifting and rotating power device drives the first placing through groove 16 and the second placing through groove 17 on the transposition plate 15 to switch between the loading and unloading station 18 and the cooling station 19 in a reciprocating manner, a manipulator 2 is further arranged on the workbench 1, an executing end of the bottom surface of the manipulator 2 is provided with an adsorption device for conveniently adsorbing the silicon wafers, a movement track of the manipulator 2 covers the loading and unloading groove 18, the transposition plate, the avoidance plate 18 is provided with a second placing through groove 23 for placing notch, and the avoidance notch, and the second placing notch 23 for placing notch, and the avoidance notch are respectively communicated with the second placing notch 23, and the avoidance notch 23.
In this embodiment, first dodge breach 22 corresponds the first logical groove 16 of placing, and the second dodges breach 23 and corresponds the second and places logical groove 17, and when manipulator 2 placed the silicon chip, manipulator 2 from top to bottom placed just can pass in first dodging breach 22 or the second dodges breach 23, makes manipulator 2 and first place logical groove 16, the second is placed and is led to the groove 17 and can not bump, guarantees production safety.
As shown in fig. 2 and 4, the first placing through groove 16 and the second placing through groove 17 have the same structure and are step-shaped, the first placing through groove 16 comprises a supporting surface 21 for supporting the edge of the bottom of the silicon wafer and a positioning surface 20 for preventing the silicon wafer from moving, the sizes of the first placing through groove 16 and the second placing through groove 17 are both larger than the size of the cooling seat 4, when the silicon wafer is placed, the supporting surface 21 supports the edge position of the silicon wafer, the positioning surface 20 limits the silicon wafer, the silicon wafer is prevented from shaking, the silicon wafer can be accurately sucked when the silicon wafer is moved next time, the bottom of the silicon wafer is accurately attached to the cooling seat 4 in the descending process of the first placing through groove 16 or the second placing through groove 17, the thermal deformation of the silicon wafer is avoided, and the positioning accuracy is effectively improved.
As shown in fig. 1 and 3, a housing 5 for accommodating a lifting rotary power device is fixed at the bottom of the workbench 1, a lifting seat is installed in the housing 5 in a lifting sliding manner, a lower section of the transmission rod 14 is rotatably installed on the lifting seat, the lifting rotary power device comprises a rotary power device for controlling the rotation of the transmission rod 14 and a lifting power device for driving the transmission rod 14 to lift, the rotary power device is fixed on the lifting seat, the rotary power device and the transmission rod 14 are driven by a synchronous belt 13, the lifting power device is fixed in the housing 5, and a power end of the lifting power device is connected with the lifting seat to control the lifting of the lifting seat; the lifting and rotating power device can be effectively protected from being stably operated under the influence of the outside through the housing 5, and the operation safety of the device is ensured.
In this embodiment, the rotary power device includes a servo motor 10, a driving wheel 11 is fixed on an output shaft of the servo motor 10, a driven wheel 12 is connected on the transmission rod 14, the driving wheel 11 and the driven wheel 12 are in meshing transmission through a synchronous belt 13, and the servo motor 10 is fixedly mounted on a lifting seat; servo motor 10 fixed mounting is on the seat that goes up and down, servo motor 10 can accurate control speed, and the position precision is very accurate, and because action wheel 11 and from the driving wheel 12 between through hold-in range 13 meshing transmission, be equipped with the tooth that the equidistance distributes on the drive belt, the main road with from being equipped with the tooth's socket of meshing with it on the driving wheel 12, efficiency when having guaranteed the transmission can effectively reduce like this to skid improves the device accuracy nature.
Further, the lifting power device comprises a linear cylinder 6, the linear cylinder 6 is fixedly installed at the bottom of the housing 5, the lifting seat comprises an upper plate 7, a middle plate 8 and a lower plate 9, the upper plate 7, the middle plate 8 and the lower plate 9 form a rectangular frame structure, a guide rod of the linear cylinder 6 is connected with the lower plate 9, a servo motor 10 is fixedly installed on the middle plate 8, a bearing 24 is fixed on the upper plate 7, and the transmission rod 14 is rotatably installed on the upper plate 7 through the bearing 24; the bearing 24 on the upper plate 7 is connected with the transmission rod 14, so that the transmission rod 14 does not influence the lifting of the transmission rod 14 while rotating, the lower plate 9 is driven to ascend through the linear air cylinder 6, the middle plate 8 and the upper plate 7 are driven to ascend, the servo motor 10 and the transmission shaft can ascend synchronously, the operation of lifting and rotating is completed, and the device is compact in structure.
As shown in fig. 2, the adsorption device includes a wafer support 3 fixed at an execution end of the manipulator 2 for supporting a silicon wafer, a plurality of adsorption holes 31 are formed in the wafer support 3, and the adsorption holes 31 are communicated with a vacuum power device for adsorbing the silicon wafer; the vacuum adsorption can also ensure that the silicon wafer is firmer and more convenient to clamp, the abrasion of the silicon wafer caused by clamping can be avoided, and the production quality and the production efficiency are improved; the manipulator 2 has multiple sections of connecting rods, and the connecting rods can deflect by 360 degrees, so that silicon wafers can be clamped from any position and can be placed at any position, and the device is more flexible; since the robot 2 and the vacuum power apparatus are conventional apparatuses, they will not be described in detail herein.
In this embodiment, the cooling seat 4 includes the pedestal, be equipped with the cooling platform 41 that is used for placing the silicon chip on the pedestal, be provided with the cooling coil who is used for circulating coolant in the pedestal, cooling coil and coolant circulation pipe-line system intercommunication make coolant constantly circulate in cooling coil through circulation pipe-line system and can take away the heat that is in silicon chip on cooling platform 41, reach the cooling effect of silicon chip for the thermal deformation can not take place for the silicon chip, guarantees production quality.
The utility model discloses a theory of operation: the method comprises the steps that firstly, the bottom of a chemical vapor deposition silicon wafer which is adsorbed and adsorbed by an adsorption hole 31 on a wafer support 3 of a manipulator 2 is lifted, the silicon wafer is placed on a first placing through groove 16, then a linear air cylinder 6 drives a shifting plate 15 to rise, then a driving wheel 11 is driven by a servo motor 10 to drive a driven wheel 12 to rotate 180 degrees through a conveyor belt, at the moment, a transmission rod 14 drives the shifting plate 15 to rotate, the first placing through groove 16 reaches a cooling station 19, a second placing through groove 17 reaches a loading and unloading station 18, then the linear air cylinder 6 drives the shifting plate 15 to descend until the first placing through groove 16 on the cooling station 19 is lower than a cooling seat 4, the silicon wafer falls on the cooling platform 41, then heat of the silicon wafer is taken away through a cooling coil for cooling, meanwhile, the manipulator 2 sucks the processed silicon wafer to place on the second placing through groove 17 located on the loading and unloading station 18, after cooling is finished, the linear air cylinder 6 drives the shifting plate 15 to ascend to be higher than the cooling seat 4, then the shifting plate 15 drives the shifting plate 15 to deflect 180 degrees again, the first placing through groove 16 reaches the second placing through groove 17, the second placing through groove 17 reaches the loading and cooling station, the silicon wafer is cooled, and the silicon wafer is placed on the cooling platform, and the silicon wafer is cooled again, and the silicon wafer is taken away.
The above-mentioned embodiments are merely descriptions of the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and alterations made to the technical solution of the present invention without departing from the spirit of the present invention are intended to fall within the scope of the present invention defined by the claims.
Claims (7)
1. The cooling transposition device of the silicon chip comprises a workbench and is characterized in that: install the transposition board on the workstation, the transfer line is installed to the lower extreme of transposition board, the transfer line runs through the workstation and is connected with lifting and drop rotating power device, lifting and drop rotating power device passes through the lift and the rotation of transfer line drive transposition board, the first logical groove of placing and the second logical groove of placing that is used for placing the silicon chip is seted up respectively to the last face of transposition board, first logical groove of placing and the second logical groove of placing are in respectively goes up unloading station and cooling station, cooling station below is equipped with the cooling seat that is used for placing and cooling the silicon chip, cooling seat fixed mounting is on the workstation, the first logical groove of placing and the second logical groove of placing on the lifting and drop rotating power device drive transposition board are placed reciprocal switching between last unloading station and cooling station, still be equipped with the manipulator on the workstation, the execution end of manipulator is equipped with the adsorption equipment who conveniently adsorbs the silicon chip bottom surface, the motion trail of manipulator covers the unloading station, it dodges the breach and the breach to be provided with the first breach that dodges and is used for dodging adsorption equipment and dodges the breach and dodges the logical groove with the first logical groove of placing and the second respectively to dodge breach, first breach and dodge the logical groove and place logical groove intercommunication with the second respectively.
2. The cooling transposition device for silicon wafers as claimed in claim 1, wherein: first place lead to the groove and the second is placed and is led to the groove structure the same and for the step, first place lead to the groove including the holding surface that supports silicon chip bottom edge and the locating surface that prevents the silicon chip and remove, first place lead to the groove and the second is placed and is led to the groove size and all be greater than the cooling seat size.
3. The cooling transposition device for silicon wafers as set forth in claim 2, wherein: a housing for accommodating a lifting rotary power device is fixed at the bottom of the workbench, a lifting seat is arranged in the housing in a lifting sliding manner, the lower section of the transmission rod is rotatably arranged on the lifting seat, the lifting rotary power device comprises a rotary power device for controlling the transmission rod to rotate and a lifting power device for driving the transmission rod to lift, the rotary power device is fixed on the lifting seat, the rotary power device and the transmission rod are driven by a synchronous belt, the lifting power device is fixed in the housing, and the power end of the lifting power device is connected with the lifting seat to control the lifting of the lifting seat.
4. A cooling index apparatus for silicon wafers as claimed in claim 3, wherein: the rotary power device comprises a servo motor, a driving wheel is fixed on an output shaft of the servo motor, a driven wheel is connected to the transmission rod, the driving wheel and the driven wheel are in meshing transmission through a synchronous belt, and the servo motor is fixedly installed on the lifting seat.
5. The cooling and transposing apparatus for silicon wafers as claimed in claim 4, wherein: the lifting power device comprises a linear cylinder, the linear cylinder is fixedly arranged at the bottom of the housing, the lifting seat comprises an upper plate, a middle plate and a lower plate, the upper plate, the middle plate and the lower plate form a rectangular frame structure, a guide rod of the linear cylinder is connected with the lower plate, a servo motor is fixedly arranged on the middle plate, a bearing is fixed on the upper plate, and the transmission rod is rotatably arranged on the upper plate through the bearing.
6. The cooling and transposing apparatus for silicon wafers as claimed in claim 5, wherein: the adsorption device comprises a wafer support for supporting the silicon wafer and fixed at the execution end of the manipulator, a plurality of adsorption holes are formed in the wafer support, and the adsorption holes are communicated with the vacuum power device to adsorb the silicon wafer.
7. The cooling and transposing apparatus for silicon wafers as claimed in claim 6, wherein: the cooling seat comprises a seat body, a cooling platform used for placing the silicon wafer is arranged on the seat body, a cooling coil used for circulating cooling media is arranged in the seat body, and the cooling coil is communicated with a cooling medium circulating pipeline system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221865395.8U CN218039109U (en) | 2022-07-19 | 2022-07-19 | Cooling transposition device for silicon wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221865395.8U CN218039109U (en) | 2022-07-19 | 2022-07-19 | Cooling transposition device for silicon wafers |
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| Publication Number | Publication Date |
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| CN218039109U true CN218039109U (en) | 2022-12-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202221865395.8U Active CN218039109U (en) | 2022-07-19 | 2022-07-19 | Cooling transposition device for silicon wafers |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116153845A (en) * | 2023-02-27 | 2023-05-23 | 东莞市智赢智能装备有限公司 | Wafer robot |
-
2022
- 2022-07-19 CN CN202221865395.8U patent/CN218039109U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116153845A (en) * | 2023-02-27 | 2023-05-23 | 东莞市智赢智能装备有限公司 | Wafer robot |
| CN116153845B (en) * | 2023-02-27 | 2023-10-31 | 东莞市智赢智能装备有限公司 | Wafer robot |
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