CN210640204U - Silicon wafer combining and splitting device - Google Patents
Silicon wafer combining and splitting device Download PDFInfo
- Publication number
- CN210640204U CN210640204U CN201921535716.6U CN201921535716U CN210640204U CN 210640204 U CN210640204 U CN 210640204U CN 201921535716 U CN201921535716 U CN 201921535716U CN 210640204 U CN210640204 U CN 210640204U
- Authority
- CN
- China
- Prior art keywords
- subassembly
- lead screw
- silicon wafer
- skew
- sucking disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model discloses a silicon chip closes piece, piecemeal device, including installing support, removal subassembly, skew subassembly and sucking disc subassembly, remove the subassembly including setting up two parallel first lead screw slip tables in the installing support below, the skew subassembly sets up respectively on two first lead screw slip tables, and first lead screw slip table drives the major axis direction removal of skew subassembly along the installing support, and the skew subassembly includes second lead screw slip table, and the sucking disc subassembly sets up on the second lead screw slip table, second lead screw slip table drives the minor axis direction removal of sucking disc subassembly along the installing support, and the sucking disc subassembly includes a plurality of silicon chip sucking discs of hugging closely each other, and the silicon chip on the sucking disc subassembly of skew subassembly and removal subassembly drive one side earlier squints, pegs graft to the clearance of the silicon chip of opposite side sucking disc subassembly, and the skew subassembly drives sucking disc subassembly skew once more, realizes the piece that closes of silicon chip. The utility model discloses can realize the step of skew, grafting, piece that closes in the time of multi-disc silicon chip, the silicon chip of being convenient for is placed fast between different flower baskets.
Description
Technical Field
The utility model relates to a silicon chip production facility field, concretely relates to silicon chip closes piece, piecemeal device.
Background
In the process treatment of the solar cell silicon wafer, the silicon wafer needs to be stably, orderly and alternately placed by using the bearing device, so that the silicon wafer is transferred for many times in the process treatment, the bearing device is called as a silicon wafer basket, the structure and the type of the silicon wafer basket are different in different process treatment steps, two silicon wafers can be simultaneously contained in some baskets, only one silicon wafer can be contained in some baskets, and at the moment, the silicon wafers need to be combined and separated when being placed between different baskets.
In the prior art, when silicon wafers are combined, one silicon wafer is placed on one side of a flower basket firstly through a manipulator, then another silicon wafer is placed on the other side of the flower basket through the manipulator again, in the method for placing, when one silicon wafer is placed in the flower basket, the silicon wafer is likely to incline in the flower basket due to the fact that a gap in the flower basket is large, when a second silicon wafer is to be placed, the second silicon wafer may extrude the first silicon wafer to damage the first silicon wafer, and when multiple silicon wafers are placed at the same time, the placing position is likely to be inaccurate, and the silicon wafers are also likely to be damaged.
Disclosure of Invention
The to-be-solved technical problem of the utility model is to provide a silicon chip closes piece, piecing devices can realize the step of skew, grafting, piece when multi-disc silicon chip, also can realize the step of multi-disc silicon chip burst, separation simultaneously before putting into the basket of flowers with the silicon chip, the silicon chip of being convenient for is placed fast between different baskets of flowers.
In order to solve the technical problem, the utility model provides a silicon chip closes piece, piecing device which is characterized in that, including installing support, removal subassembly, skew subassembly and sucking disc subassembly, it is in including setting up to remove the subassembly two parallel first lead screw slip tables of installing support below, the skew subassembly sets up respectively on two first lead screw slip tables, first lead screw slip table drives the skew subassembly moves along the major axis direction of installing support, the skew subassembly includes the second lead screw slip table, the sucking disc subassembly sets up on the second lead screw slip table, the second lead screw slip table drives the sucking disc subassembly moves along the minor axis direction of installing support, the sucking disc subassembly includes a plurality of silicon chip sucking discs of hugging closely each other, when silicon chip sucking disc adsorbs the silicon chip, there is the clearance between two adjacent silicon chips, the silicon chip skew on the sucking disc subassembly of one side is driven earlier to skew subassembly and removal subassembly, And the silicon wafer is inserted into the gap of the silicon wafer of the sucker component at the other side in an inserting manner, and the offset component drives the sucker component to offset again, so that the silicon wafer is combined.
The utility model discloses a preferred embodiment, further include first lead screw slip table and second lead screw slip table all include lead screw, cover and establish nut on the lead screw, fix mounting platform and drive on the nut lead screw pivoted driving source.
In a preferred embodiment of the present invention, the driving source is a servo motor, and an output end of the servo motor is connected to the lead screw through a coupling.
The utility model discloses a preferred embodiment, further include the skew subassembly still includes upper mounting panel and lower mounting panel, the upper mounting panel sets up the top of second lead screw slip table, the upper mounting panel is installed on the first lead screw slip table, the lower mounting panel sets up the below of second lead screw slip table, the sucking disc subassembly is installed on the lower mounting panel.
The utility model discloses an in the preferred embodiment, further include the silicon chip sucking disc include with the silicon chip contact the absorption portion and with absorption portion integrated into one piece's root, wherein, seted up the suction nozzle on absorption portion and the silicon chip contact surface, the inside of silicon chip sucking disc is seted up and is led to the root and is linked together external gas circuit, and the gas circuit is linked together with the suction nozzle, the thickness of root is greater than the thickness of absorption portion, thereby absorption portion sets up about root off-set and is formed with the clearance that is used for holding the silicon chip between absorption portion between them when two adjacent silicon chip sucking discs are hugged closely.
The present invention further provides a method for manufacturing a semiconductor device, which comprises forming a gap between two silicon wafers, wherein the gap is larger than the thickness of the two silicon wafers.
The utility model discloses a preferred embodiment, further include be provided with the installation riser of L type on the installing support.
The utility model discloses a preferred embodiment, further include the below of installing support is provided with the slide rail, be provided with on the skew subassembly with the slider that the slide rail matches.
The utility model has the advantages that:
the utility model discloses a long axis direction that two sets of first lead screw slip tables drive two sets of skew subassemblies and remove along the installing support, adopt the second lead screw slip table to drive the sucking disc subassembly on two sets of skew subassemblies and remove along the minor axis direction of installing support, adopt sucking disc subassembly to adsorb simultaneously has the multi-disc silicon chip, when sucking disc subassembly adsorbs the multi-disc silicon chip, there is the clearance between two adjacent silicon chips, at first, the second lead screw slip table on the skew subassembly drives sucking disc subassembly and squints to one side, make the adsorbed multi-disc silicon chip of two sets of sucking disc subassemblies distribute in a staggered way, later, the silicon chip on the sucking disc subassembly of first lead screw slip table drive one side on the removal subassembly pegs graft in the clearance of the silicon chip of opposite side sucking disc subassembly, finally, the second lead screw slip table on the skew subassembly drives sucking disc subassembly, make the laminating, Inserting and combining sheets.
And, the utility model discloses a process is reversible, also can be with a plurality of laminating silicon chips together, through sucking disc subassembly, skew subassembly and removal subassembly, divides piece, separation when realizing the silicon chip, passes through like this the utility model discloses just can realize getting fast of silicon chip between different flower baskets and put.
Drawings
FIG. 1 is a schematic structural view of a silicon wafer combining and separating device of the present invention;
fig. 2 is a schematic structural diagram of the moving assembly of the present invention;
fig. 3 is a schematic structural view of the offset assembly of the present invention;
fig. 4 is a schematic structural view of the silicon wafer chuck of the present invention.
The reference numbers in the figures illustrate: 1. mounting a bracket; 2. a moving assembly; 21. a first screw rod sliding table; 211. a screw rod; 212. a nut; 213. mounting a platform; 214. a drive source; 3. an offset component; 31. a second screw rod sliding table; 32. an upper mounting plate; 33. a lower mounting plate; 4. a sucker component; 41. a suction part; 42. a suction nozzle; 43. a root portion; 5. a silicon wafer; 6. installing a vertical plate; 7. a slide rail; 8. a slide block.
Detailed Description
The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.
Referring to fig. 1-3, an embodiment of the silicon wafer combining and separating device of the present invention comprises a mounting bracket 1, a moving assembly 2, a deflecting assembly 3 and a suction cup assembly 4, the moving assembly 2 comprises two parallel first screw rod sliding tables 21 arranged below the mounting bracket 1, the offset assemblies 3 are respectively arranged on two first screw rod sliding tables 21, the first screw rod sliding tables 21 drive the offset assemblies 3 to move along the long axis direction of the mounting bracket 1, the offset assembly 3 comprises a second screw rod sliding table 31, the sucker assembly 4 is arranged on the second screw rod sliding table 31, the second screw rod sliding table 31 drives the sucker assembly 4 to move along the short axis direction of the mounting bracket 1, the sucker assembly 4 comprises a plurality of silicon wafer suckers which are tightly attached to each other, and when the silicon wafer suckers adsorb the silicon wafers 5, a gap exists between every two adjacent silicon wafers 5. Firstly, the second screw rod sliding table 31 on the 3-offset component drives the sucker components 4 to offset towards one side, so that a plurality of silicon wafers 5 adsorbed by the two groups of sucker components 4 are distributed in a staggered manner, the first screw rod sliding table 21 on the moving assembly 2 drives the silicon chip 5 on the sucker assembly 4 on one side to be inserted into the gap of the silicon chip 5 on the sucker assembly 4 on the other side, and finally, the second screw rod sliding table 31 on the offset assembly 3 drives the sucker assemblies 4 to ensure that the silicon wafers 5 adsorbed on the two sucker assemblies 4 are jointed, thereby realizing the simultaneous shift, insertion and combination of a plurality of silicon wafers 5, and the process of the utility model is reversible, and a plurality of silicon wafers 5 can be adhered together, through sucking disc subassembly 4, skew subassembly 3 and removal subassembly 2, burst, separation when realizing silicon chip 5, pass through like this the utility model discloses just can realize getting fast of silicon chip 5 between different flower baskets and put.
Specifically, first lead screw slip table 21 and second lead screw slip table 31 all include lead screw 211, cover and establish nut 212 on the lead screw 211, fix mounting platform 213 and drive on the nut 212 lead screw 211 pivoted driving source 214, driving source 214 is servo motor, servo motor's output pass through the shaft coupling with lead screw 211 is connected, servo motor rotates to drive lead screw 211 and rotate, nut 212 drives mounting platform 213 is in horizontal migration is gone up to lead screw 211.
Specifically, skew subassembly 3 still includes mounting panel 32 and lower mounting panel 33, it sets up to go up mounting panel 32 the top of second lead screw slip table 31, it installs through bolt fixed mounting to go up mounting panel 32 on the mounting platform 213 of first lead screw slip table 21, lower mounting panel 33 sets up the below of second lead screw slip table 31, sucking disc subassembly 4 passes through bolt fixed mounting and is in on the lower mounting panel 33.
Referring to fig. 4, the silicon wafer chuck includes a suction portion 41 contacting with the silicon wafer and a root portion 43 integrally formed with the suction portion 41, wherein a suction nozzle 42 is formed on a contact surface of the suction portion 41 and the silicon wafer 5, an air path leading to the root portion 43 and communicating with the outside is formed inside the silicon wafer chuck, the air path is communicated with the suction nozzle 42, the thickness of the root portion 43 is greater than that of the suction portion 41, and the suction portion 41 is offset with respect to the root portion 43, so that a gap for accommodating the silicon wafer 5 is formed between the suction portions 41 of two adjacent silicon wafer chucks when the two silicon wafer chucks are tightly adhered.
Specifically, because the two silicon wafers 5 are to be spliced, the two silicon wafers should be accommodated in the gap, and the distance of the gap is set to be greater than the thickness of the stacked two silicon wafers 5, so that the two silicon wafers 5 can be accommodated in the gap.
In order to facilitate the fixing of the silicon wafer combining and splitting device on the side wall or the portal frame in this embodiment, an L-shaped mounting vertical plate 6 is arranged on the mounting bracket 1, and the L-shaped mounting vertical plate 6 can fix the whole device on the side wall of a carrying machine, and can also be fixed on the portal frame capable of moving up and down according to the use requirement.
Specifically, in order to facilitate the sliding of the offset assembly 3 on the moving assembly 2 and ensure that the sliding process does not shake, a slide rail 7 is arranged below the mounting bracket 1, a slide block 8 matched with the slide rail 7 is arranged on the offset assembly 3, and the slide block 8 moves along the slide rail 7, so that the offset assembly 3 is indirectly fixed in position, and the collision between the silicon wafers 5 due to the shaking of the offset assembly 3 in the process of inserting the silicon wafers 5 is prevented.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.
Claims (8)
1. The utility model provides a silicon chip closes piece, piecing devices, a serial communication port, including installing support, removal subassembly, skew subassembly and sucking disc subassembly, it is in including setting up to remove the subassembly two parallel first lead screw slip tables of installing support below, the skew subassembly sets up respectively on two first lead screw slip tables, first lead screw slip table drives the major axis direction of skew subassembly along the installing support removes, the skew subassembly includes second lead screw slip table, the sucking disc subassembly sets up on the second lead screw slip table, second lead screw slip table drives the sucking disc subassembly removes along the minor axis direction of installing support, the sucking disc subassembly includes a plurality of silicon chip sucking discs of hugging closely each other, and when silicon chip sucking disc adsorbs the silicon chip, there is the clearance between two adjacent silicon chips, silicon chip skew on the sucking disc subassembly of skew subassembly and removal subassembly drive one side earlier, the silicon chip skew, And the silicon wafer is inserted into the gap of the silicon wafer of the sucker component at the other side in an inserting manner, and the offset component drives the sucker component to offset again, so that the silicon wafer is combined.
2. The silicon wafer combining and separating device of claim 1, wherein the first lead screw sliding table and the second lead screw sliding table each comprise a lead screw, a nut sleeved on the lead screw, a mounting platform fixed on the nut, and a driving source for driving the lead screw to rotate.
3. The silicon wafer combining and splitting device according to claim 2, wherein the driving source is a servo motor, and an output end of the servo motor is connected with the screw rod through a coupler.
4. The silicon wafer combining and separating device of claim 1, wherein the offset assembly further comprises an upper mounting plate and a lower mounting plate, the upper mounting plate is disposed above the second screw rod sliding table, the upper mounting plate is mounted on the first screw rod sliding table, the lower mounting plate is disposed below the second screw rod sliding table, and the suction cup assembly is mounted on the lower mounting plate.
5. The silicon wafer combining and separating device according to claim 1, wherein the silicon wafer chuck comprises a suction portion contacting with the silicon wafer and a root portion integrally formed with the suction portion, wherein a suction nozzle is formed on a contact surface of the suction portion and the silicon wafer, an air passage leading to the root portion and communicating with the outside is formed inside the silicon wafer chuck, the air passage is communicated with the suction nozzle, the thickness of the root portion is greater than that of the suction portion, and the suction portions are arranged in an offset manner with respect to the root portion so that a gap for accommodating the silicon wafer is formed between the suction portions of the two adjacent silicon wafer chucks when the two adjacent silicon wafer chucks are attached to each other.
6. The silicon wafer combining and separating device according to claim 5, wherein the distance between the gaps is larger than the thickness of the two stacked silicon wafers, so that the two silicon wafers can be accommodated in the gaps.
7. The silicon wafer combining and splitting device according to claim 1, wherein an L-shaped mounting vertical plate is arranged on the mounting bracket.
8. The silicon wafer combining and splitting device according to claim 1, wherein a slide rail is arranged below the mounting bracket, and a slide block matched with the slide rail is arranged on the offset assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921535716.6U CN210640204U (en) | 2019-09-16 | 2019-09-16 | Silicon wafer combining and splitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921535716.6U CN210640204U (en) | 2019-09-16 | 2019-09-16 | Silicon wafer combining and splitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210640204U true CN210640204U (en) | 2020-05-29 |
Family
ID=70795190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921535716.6U Active CN210640204U (en) | 2019-09-16 | 2019-09-16 | Silicon wafer combining and splitting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210640204U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114180339A (en) * | 2021-03-31 | 2022-03-15 | 无锡市江松科技有限公司 | Silicon wafer clamping device |
| CN115008376A (en) * | 2022-07-11 | 2022-09-06 | 罗博特科智能科技股份有限公司 | Universal electric positioning platform for precisely positioning square products |
| CN117672948A (en) * | 2024-01-30 | 2024-03-08 | 无锡松煜科技有限公司 | Silicon wafer separating and combining device and silicon wafer diffusion inserting and taking method |
-
2019
- 2019-09-16 CN CN201921535716.6U patent/CN210640204U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114180339A (en) * | 2021-03-31 | 2022-03-15 | 无锡市江松科技有限公司 | Silicon wafer clamping device |
| CN114180339B (en) * | 2021-03-31 | 2024-01-19 | 无锡江松科技股份有限公司 | Silicon wafer clamping device |
| CN115008376A (en) * | 2022-07-11 | 2022-09-06 | 罗博特科智能科技股份有限公司 | Universal electric positioning platform for precisely positioning square products |
| CN117672948A (en) * | 2024-01-30 | 2024-03-08 | 无锡松煜科技有限公司 | Silicon wafer separating and combining device and silicon wafer diffusion inserting and taking method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210640204U (en) | Silicon wafer combining and splitting device | |
| KR101258860B1 (en) | The wafer picker device for using solar cell wafer transfer system | |
| CN108346585B (en) | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device | |
| CN212967642U (en) | High-efficient device of getting of silicon chip | |
| KR102365660B1 (en) | Die pickup module and die bonding apparatus including the same | |
| CN1716528A (en) | Processing device | |
| CN104838481B (en) | House before substrate conveying | |
| KR101281495B1 (en) | Sorting table and singulation apparatus using the sorting table | |
| KR100639553B1 (en) | Die pickup device | |
| CN109979870B (en) | Automatic burst feed mechanism of silicon wafer | |
| CN209080382U (en) | A kind of camera module stripping single device | |
| CN111439418A (en) | Wafer separation boxing machine and method with wafer lifting device | |
| CN107068606A (en) | Processing unit (plant) | |
| KR20080089795A (en) | Vacuum adsorption picker apparatus of handler | |
| CN212220673U (en) | Wafer lifting device and wafer separating and boxing machine comprising same | |
| CN213261150U (en) | Multi-specification nut assembling all-in-one machine | |
| CN114335253A (en) | Silicon wafer taking and placing device and method | |
| CN113257731A (en) | Solar cell silicon wafer conveying device and using method thereof | |
| CN211350604U (en) | Automatic wafer loading and unloading device | |
| CN110707032A (en) | Inserting device and inserting method for large-size silicon wafer | |
| CN106743392B (en) | Automatic transposition mechanism on earphone magnetizing device | |
| CN108389935B (en) | A kind of whole line of monocrystalline making herbs into wool is slotting to divide biplate to automate charging & discharging machine | |
| KR20130009100A (en) | Apparatus and method of transferring semiconductor packages in a sawing and sorter system | |
| KR102330661B1 (en) | Die pickup module and die bonding apparatus including the same | |
| CN220604621U (en) | Chip sorting machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |