CN209880643U - Conductive silicon wafer inserting machine - Google Patents
Conductive silicon wafer inserting machine Download PDFInfo
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- CN209880643U CN209880643U CN201921072978.3U CN201921072978U CN209880643U CN 209880643 U CN209880643 U CN 209880643U CN 201921072978 U CN201921072978 U CN 201921072978U CN 209880643 U CN209880643 U CN 209880643U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model belongs to the technical field of silicon chip processing equipment and specifically relates to lead positive type silicon chip insert machine. This insert machine includes board, two-shaft manipulator, sucking disc, air blowing mechanism, conveying platform, leads positive mechanism, basket of flowers elevating system, silicon chip elevating system and burst mechanism, install two-shaft manipulator, conveying platform on the board, lead positive mechanism, burst mechanism, the lifting end of two-shaft manipulator is fixed with the sucking disc, and the horizontal migration end of two-shaft manipulator is fixed with air blowing mechanism, and the conveying platform is located leads between the positive mechanism, and the board bottom mounting has basket of flowers elevating system and silicon chip elevating system, and basket of flowers elevating system goes up to be fixed a position has the basket of flowers. The utility model discloses a two mechanical arm drive sucking discs grab the silicon chip from silicon chip elevating system and get conveying bench, and blow mechanism blows off the filth on with the silicon chip. The conveying table conveys the silicon wafer into the flower basket. The silicon wafer is prevented from deviating from the conveying direction by the guide mechanism. This application has improved the efficiency of silicon chip inserted sheet.
Description
Technical Field
The utility model belongs to the technical field of silicon chip processing equipment and specifically relates to lead positive type silicon chip insert machine.
Background
The processing of the monocrystalline silicon wafer comprises the steps of firstly squaring a monocrystalline silicon rod and then slicing, the processing of the polycrystalline silicon wafer comprises the steps of cutting a polycrystalline silicon ingot and then slicing, and the processing of the quasi-monocrystalline silicon wafer comprises the steps of cutting the quasi-monocrystalline silicon ingot and then slicing. Therefore, slicing is one of the indispensable processes in the processing technology of the crystalline silicon solar cell. And stacking the sliced silicon wafers together, and inserting the sliced silicon wafers into a flower basket for transportation after the slicing is needed. But the existing insert machine has low efficiency.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem described in the background art, the utility model provides a lead positive type silicon chip insert machine. The silicon wafer is grabbed to the conveying table from the silicon wafer lifting mechanism through the two-axis mechanical arm driving sucker, and dirt on the silicon wafer is blown off through the blowing mechanism. The conveying table conveys the silicon wafer into the flower basket. The silicon wafer is prevented from deviating from the conveying direction by the guide mechanism. This application has improved the efficiency of silicon chip inserted sheet.
The utility model provides a technical scheme that its technical problem adopted is:
the utility model provides a lead positive type silicon chip insert machine, includes board, two-axis manipulator, sucking disc, air blowing mechanism, conveying platform, leads positive mechanism, basket of flowers elevating system, silicon chip elevating system and burst mechanism, install two-axis manipulator, conveying platform on the board, lead positive mechanism, burst mechanism, the lifting end of two-axis manipulator is fixed with the sucking disc, and the horizontal migration end of two-axis manipulator is fixed with air blowing mechanism, and the conveying platform is located leads between the positive mechanism, and the board bottom mounting has basket of flowers elevating system and silicon chip elevating system, and the last location of basket of flowers elevating system has the basket of flowers, offers the mouth of wearing that is used for passing the basket of flowers and the mouth of wearing that is used for passing the silicon chip on the mesa of board.
Specifically, the two-axis manipulator comprises an X-axis linear module and a Y-axis cylinder, the cylinder body of the X-axis linear module is fixed on the machine table, a sliding seat of the X-axis linear module is fixed with the Y-axis cylinder and the air blowing mechanism through a support, and a sucker is fixed at the piston rod end of the Y-axis cylinder.
Specifically, the blowing mechanism consists of a chamber and a nozzle, the chamber and the nozzle are fixed and connected, and the chamber is communicated with an air pump.
Specifically, the conveying table is a belt conveying table.
Specifically, lead positive mechanism and constitute by the width modulation seat, rectangle frame and gyro wheel, the width modulation seat is by the cylinder body, positive and negative screw lead screw, ball nut and slide are constituteed, positive and negative screw lead screw rotates to be connected in the cylinder body, threaded connection has ball nut on positive screw thread section and the negative screw thread section respectively of positive and negative screw lead screw, all be fixed with a slide on every ball nut's the outer lane, two equal sliding fit of slide are connected on the cylinder body, the output axle head at the motor is fixed to positive and negative screw lead screw end, the cylinder body of width modulation seat is fixed on the board, all be fixed with the rectangle frame on two slides of width modulation seat, it arranges into a sharp gyro wheel to rotate on the rectangle frame to be connected with the several, the conveying platform.
Specifically, basket of flowers elevating system comprises cylinder and platform, is fixed with the locating pin of location basket of flowers on the platform, and the piston rod end at the cylinder is fixed to the platform.
Specifically, silicon chip elevating system comprises platform, baffle, cylinder and kicking block, and four sides of platform all are fixed with the baffle perpendicularly, and the baffle is fixed at the edge of wearing a mouthful of board, and the piston rod of cylinder passes the platform, and the piston rod end of cylinder is fixed with the kicking block.
Specifically, the slicing mechanism is composed of a horizontal cylinder and an air knife, the air knife is a rectangular piece, a cavity is arranged in the air knife, the cavity in the air knife is communicated with an air pump, an air blowing opening is formed in the side end of the air knife, the air knife is fixed on a piston rod of the horizontal cylinder, and a cylinder body of the horizontal cylinder is fixed on a machine table.
The utility model has the advantages that: the utility model provides a lead positive type silicon chip insert machine. The silicon wafer is grabbed to the conveying table from the silicon wafer lifting mechanism through the two-axis mechanical arm driving sucker, and dirt on the silicon wafer is blown off through the blowing mechanism. The conveying table conveys the silicon wafer into the flower basket. The silicon wafer is prevented from deviating from the conveying direction by the guide mechanism. This application has improved the efficiency of silicon chip inserted sheet.
Drawings
The present invention will be further explained with reference to the drawings and examples.
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a schematic structural view of the basket lifting mechanism of the present invention;
FIG. 3 is a schematic structural view of the silicon wafer lifting mechanism of the present invention;
in the figure, 1, a machine table, 2, a two-axis manipulator, 3, a sucker, 4, an air blowing mechanism, 5, a conveying table, 6, a guide mechanism, 7, a flower basket, 8, a flower basket lifting mechanism, 9, a silicon wafer lifting mechanism, 10, a slicing mechanism, 21, an X-axis linear module, 22, a Y-axis cylinder, 61, a width adjusting seat, 62, a rectangular frame, 63, a roller, 101, a horizontal cylinder and 102, an air knife are arranged.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic drawings and illustrate the basic structure of the present invention only in a schematic manner, and thus show only the components related to the present invention.
Fig. 1 is the structural schematic diagram of the present invention, fig. 2 is the structural schematic diagram of the basket of flowers elevating mechanism of the present invention, fig. 3 is the structural schematic diagram of the silicon wafer elevating mechanism of the present invention.
The utility model provides a lead positive type silicon chip insert machine, includes board 1, two-axis manipulator 2, sucking disc 3, air blowing mechanism 4, conveying platform 5, leads positive mechanism 6, basket of flowers 7, basket of flowers elevating system 8, silicon chip elevating system 9 and burst mechanism 10, install two-axis manipulator 2 on the board 1, conveying platform 5, lead positive mechanism 6, burst mechanism 10, the lift end of two-axis manipulator 2 is fixed with sucking disc 3, and the horizontal migration end of two-axis manipulator 2 is fixed with air blowing mechanism 4, and conveying platform 5 is located leads between the positive mechanism 6, and 1 bottom mounting of board has basket of flowers elevating system 8 and silicon chip elevating system 9, and the basket of flowers elevating system 8 goes up to be fixed a position has basket of flowers 7, offers the mouth of wearing that is used for passing basket of flowers 7 and the mouth of wearing that is used for passing the silicon chip on the mesa of board 1. The two-axis manipulator 2 is composed of an X-axis linear module 21 and a Y-axis cylinder 22, the cylinder body of the X-axis linear module 21 is fixed on the machine table 1, the sliding seat of the X-axis linear module 21 is fixed with the Y-axis cylinder 22 and the blowing mechanism 4 through a support, and the piston rod end of the Y-axis cylinder 22 is fixed with the sucker 3. The blowing mechanism 4 consists of a chamber and a nozzle, the chamber and the nozzle are fixed and connected together, and the chamber is communicated with an air pump. The conveying table 5 is a belt conveying table. The guide mechanism 6 is composed of a width adjusting seat 61, a rectangular frame 62 and idler wheels 63, the width adjusting seat 61 is composed of a cylinder body, a positive and negative thread screw rod, ball nuts and sliding seats, the positive and negative thread screw rod is rotatably connected in the cylinder body, the positive thread section and the negative thread section of the positive and negative thread screw rod are respectively in threaded connection with the ball nuts, a sliding seat is fixedly arranged on the outer ring of each ball nut, the two sliding seats are connected on the cylinder body in a sliding mode, the ends of the positive and negative thread screw rod are fixed at the end of an output shaft of a motor, the cylinder body of the width adjusting seat 61 is fixed on the machine table 1, the rectangular frame 62 is fixedly arranged on the two sliding seats of the width adjusting seat 61, the rectangular frame 62 is rotatably connected with the idler wheels 63 of a. The flower basket lifting mechanism 8 is composed of an air cylinder and a platform, a positioning pin for positioning the flower basket 7 is fixed on the platform, and the platform is fixed at the end of a piston rod of the air cylinder. The silicon wafer lifting mechanism 9 is composed of a platform, a baffle, a cylinder and a top block, the baffle is vertically fixed on four sides of the platform, the baffle is fixed on the edge of a penetrating opening of the machine table 1, a piston rod of the cylinder penetrates through the platform, and the top block is fixed on the piston rod end of the cylinder. The slicing mechanism 10 is composed of a horizontal cylinder 101 and an air knife 102, the air knife 102 is a rectangular piece, a cavity is arranged in the air knife 102, the cavity in the air knife 102 is communicated with an air pump, an air blowing opening is formed in the side end of the air knife 102, the air knife 102 is fixed on a piston rod of the horizontal cylinder 101, and a cylinder body of the horizontal cylinder 101 is fixed on the machine table 1.
Referring to fig. 1, 2 and 3, the X-axis linear module 21 of the two-axis robot 2 can drive the suction cup 3 and the blowing mechanism 4 to perform horizontal linear movement. The Y-axis cylinder 22 can drive the suction cup 3 to move up and down linearly.
The sucking disc 3 is internally provided with a cavity, the bottom surface of the sucking disc 3 is provided with a sucking hole, the sucking hole is communicated with the cavity, and the cavity of the sucking disc 3 is communicated with an air inlet of the air pump. The suction pump makes the suction holes on the bottom surface of the suction cup 3 generate negative pressure to suck the silicon wafer.
The conveying table 5 is composed of two parallel belts, a motor, a driving wheel and a table body, the driving wheels are respectively rotated at two ends of the table body, the driving wheels are all tensioned at inner rings of the belts, and a shaft of the driving wheel at one end is fixed on an output shaft of the motor. The motor drives the transmission wheel to rotate, and the rotating transmission wheel drives the belt to transmit through friction. The belt drives the silicon wafer to transmit through friction force.
The linear module is characterized in that a motor drives a ball screw to rotate, the rotating ball screw drives a ball nut in threaded connection with the rotating ball screw to linearly move, and a sliding seat fixed with the outer ring of the ball nut synchronously moves with the ball nut.
The working mode of the width adjusting seat 61 is that the motor drives the positive and negative thread screw to rotate, and the rotating positive and negative thread screw can drive the ball nuts on the positive thread section and the ball nuts on the negative thread section to respectively move linearly in opposite or opposite directions. And the two rectangular frames 62 fixed to the two nuts, respectively, are also linearly moved in opposite or opposite directions in synchronization with the ball nuts.
On silicon chip elevating system 9's platform was placed to a pile of silicon chip of at first piling up, the cylinder ordered about the kicking block and up moved, and the kicking block is with a pile of silicon chips toward rising, and the silicon chip of up most advanced passes the mouth of wearing of board 1. Then the horizontal cylinder 101 drives the air knife 102 to move towards the silicon wafer, and the air knife 102 blows air towards the silicon wafer, so that the silicon wafer on the uppermost layer is separated from the silicon wafer on the lower layer, and adhesion is prevented. And then the two-axis manipulator 2 drives the nozzle of the blowing mechanism 4 to move right above the silicon wafer, and the nozzle blows air towards the silicon wafer, so that dirt on the silicon wafer is blown off. Then the two-axis robot 2 sucks and places the silicon wafer on the transfer table 5 for transfer. When the sucker 3 is positioned right above the conveying table 5 for placing the silicon wafer, the air blowing mechanism 4 is just right above the silicon wafer lifting mechanism 9, and dirt on the silicon wafer lifting mechanism 9 can be blown off at the same time.
After the silicon wafer is placed on the conveying table 5, the width adjusting base 61 drives the rectangular frames 62 positioned on the left side and the right side of the silicon wafer to move towards the direction of the silicon wafer respectively, so that the silicon wafer is limited to move forwards within a certain width range, and the silicon wafer is prevented from deviating. When the roller contacts the silicon chip, the friction between the roller and the silicon chip can be greatly reduced by utilizing the rotation.
The transfer stage 5 transfers the silicon wafer into the basket 7. A plurality of slots are sequentially arranged in the flower basket 7 from top to bottom, after silicon wafers are inserted into the current slots, a piston rod of the flower basket lifting mechanism 8 drives the flower basket 7 to move up and down, so that the empty slots are moved to the position right in front of a discharge port of the conveying table 5, then the next silicon wafer is conveyed into the slots, and the method is sequentially carried out until the flower basket 7 is fully inserted. And finally, taking the flower basket 7 away from the platform of the flower basket lifting mechanism 8.
In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (8)
1. The utility model provides a lead positive type silicon chip insert machine, characterized by, includes board (1), two-axis manipulator (2), sucking disc (3), mechanism of blowing (4), conveying platform (5), leads positive mechanism (6), basket of flowers (7), basket of flowers elevating system (8), silicon chip elevating system (9) and burst mechanism (10), install two-axis manipulator (2), conveying platform (5), lead positive mechanism (6), burst mechanism (10) on board (1), the lift end of two-axis manipulator (2) is fixed with sucking disc (3), the horizontal migration end of two-axis manipulator (2) is fixed with mechanism of blowing (4), conveying platform (5) are located and lead between positive mechanism (6), board (1) bottom mounting has basket of flowers elevating system (8) and silicon chip elevating system (9), be located basket of flowers elevating system (8) basket of flowers (7), set up on the mesa of board (1) and be used for passing the basket of flowers (7) and be used for passing the mouth of wearing of silicon chip.
2. The machine of claim 1, wherein: the two-axis manipulator (2) is composed of an X-axis linear module (21) and a Y-axis cylinder (22), a cylinder body of the X-axis linear module (21) is fixed on the machine table (1), a sliding seat of the X-axis linear module (21) is fixed with the Y-axis cylinder (22) and the air blowing mechanism (4) through a support, and a sucker (3) is fixed at a piston rod end of the Y-axis cylinder (22).
3. The machine of claim 1, wherein: the blowing mechanism (4) consists of a chamber and a nozzle, the chamber and the nozzle are fixed and connected together, and the chamber is communicated with an air pump.
4. The machine of claim 1, wherein: the conveying table (5) is a belt conveying table.
5. The machine of claim 1, wherein: lead positive mechanism (6) by width modulation seat (61), rectangle frame (62) and gyro wheel (63) are constituteed, width modulation seat (61) is by the cylinder body, positive and negative screw lead screw, ball nut and slide are constituteed, positive and negative screw lead screw rotates to be connected in the cylinder body, threaded connection has ball nut on positive screw thread section and the negative screw thread section respectively of positive and negative screw lead screw, all be fixed with a slide on every ball nut's the outer lane, two equal sliding fit of slide are connected on the cylinder body, the output axle head at the motor is fixed to positive and negative screw lead screw end, the cylinder body of width modulation seat (61) is fixed on board (1), all be fixed with rectangle frame (62) on two slides of width modulation seat (61), it arranges into a sharp gyro wheel (63) to rotate on rectangle frame (62) to be connected with the several, conveying platform (5) are located between two rectangle frames (.
6. The machine of claim 1, wherein: the flower basket lifting mechanism (8) is composed of an air cylinder and a platform, a positioning pin for positioning the flower basket (7) is fixed on the platform, and the platform is fixed at the end of a piston rod of the air cylinder.
7. The machine of claim 1, wherein: silicon chip elevating system (9) comprises platform, baffle, cylinder and kicking block, and four sides of platform all are fixed with the baffle perpendicularly, and the baffle is fixed at the edge of wearing a mouthful of board (1), and the piston rod of cylinder passes the platform, and the piston rod end of cylinder is fixed with the kicking block.
8. The machine of claim 1, wherein: the slicing mechanism (10) is composed of a horizontal cylinder (101) and an air knife (102), the air knife (102) is a rectangular piece, a cavity is arranged in the air knife (102), the cavity in the air knife (102) is communicated with an air pump, an air blowing opening is formed in the side end of the air knife (102), the air knife (102) is fixed on a piston rod of the horizontal cylinder (101), and a cylinder body of the horizontal cylinder (101) is fixed on the machine table (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921072978.3U CN209880643U (en) | 2019-07-10 | 2019-07-10 | Conductive silicon wafer inserting machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921072978.3U CN209880643U (en) | 2019-07-10 | 2019-07-10 | Conductive silicon wafer inserting machine |
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| Publication Number | Publication Date |
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| CN209880643U true CN209880643U (en) | 2019-12-31 |
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| CN201921072978.3U Active CN209880643U (en) | 2019-07-10 | 2019-07-10 | Conductive silicon wafer inserting machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116423071A (en) * | 2023-06-13 | 2023-07-14 | 深圳光远智能装备股份有限公司 | Ultrathin silicon wafer cutting device with automatic alignment compensation function |
-
2019
- 2019-07-10 CN CN201921072978.3U patent/CN209880643U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116423071A (en) * | 2023-06-13 | 2023-07-14 | 深圳光远智能装备股份有限公司 | Ultrathin silicon wafer cutting device with automatic alignment compensation function |
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