CN213752664U - A silicon chip sorter loading attachment for screen printing - Google Patents
A silicon chip sorter loading attachment for screen printing Download PDFInfo
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- CN213752664U CN213752664U CN202120238509.5U CN202120238509U CN213752664U CN 213752664 U CN213752664 U CN 213752664U CN 202120238509 U CN202120238509 U CN 202120238509U CN 213752664 U CN213752664 U CN 213752664U
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- silicon wafer
- screen printing
- negative pressure
- silicon chip
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Abstract
The utility model discloses a silicon wafer sorting machine loading attachment for screen printing, including removal subassembly and absorption subassembly, the absorption subassembly includes the bracket that moves along the vertical direction, and the bracket is connected with elevating gear, is provided with the negative pressure mouth on the absorption subassembly, and the negative pressure mouth communicates there is air exhaust device, and air exhaust device is used for adsorbing the silicon wafer on the bracket; the moving assembly drives the suction assembly to reciprocate between two working positions; under the first working position, the bracket is positioned under the silicon wafer of the material taking platform; and under the second working position, the bracket is positioned right above the feeding end of the sorting machine. This a silicon chip sorter loading attachment for screen printing drives the bracket through elevating gear and upwards removes in order to hold up the silicon chip, prevents that the silicon chip from taking place the friction with getting the contact of material platform to utilize air exhaust device to adsorb the silicon chip on the bracket, prevent to produce relative displacement between silicon chip and the bracket and lead to the silicon chip to receive wearing and tearing, so realized the safe material loading of silicon chip.
Description
Technical Field
The utility model belongs to the technical field of solar wafer processing technique and specifically relates to a silicon chip sorter loading attachment for screen printing is related to.
Background
Automatic feeding machine is the equipment commonly used when photovoltaic silicon chip does not have net knot otter board printing, utilizes various loading attachment to pile up the silicon chip of placing in the basket of flowers in the prior art usually and transports on automatic feeding machine's conveyer belt one by one in proper order.
Chinese utility model patent that publication number is CN211563730U discloses a sorter material loading platform telescopic machanism, including base and the transmission device of setting on the base, transmission device includes the action wheel, follows the driving wheel, connects the action wheel and follows the belt of driving wheel and can dismantle the regulation strip of being connected with the base, and the one end of regulation strip is connected with following the driving wheel for adjust the action wheel and follow the distance between the driving wheel. This telescopic machanism can take up lax belt through adjusting the action wheel and from the distance between the driving wheel, makes the frictional force grow between belt and the silicon chip, makes the belt continue to use, needn't frequent change belt to improve work efficiency, avoid changing the wasting of resources that the belt brought.
However, when the telescopic device is used, friction exists between the silicon wafer and the feeding table, so that the silicon wafer is abraded when moving, and the quality of the silicon wafer is affected. Therefore, the belt can be raised by the middle part feeding device when the silicon wafers are taken out, the belt is lowered when the silicon wafers are taken out and placed at the feed end of the sorting machine, and when the silicon wafers are conveyed in the mode, friction is still inevitably generated between the belt and the silicon wafers, so that the silicon wafers are damaged, and the quality of the silicon wafers is reduced.
Therefore, there is a need for an improvement to existing sorter loading apparatus.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome the defect that exists among the prior art, provide a prevent silicon chip wearing and tearing be used for screen printing's silicon chip sorter loading attachment.
In order to realize the technical effects, the utility model adopts the technical scheme that: a feeding device of a silicon wafer sorting machine for screen printing comprises a moving assembly and a suction assembly, wherein the suction assembly comprises a bracket moving along the vertical direction, the bracket is connected with a lifting device, a negative pressure port is formed in the suction assembly, the negative pressure port is communicated with an air exhaust device, and the air exhaust device is used for adsorbing a silicon wafer on the bracket; the moving assembly drives the suction assembly to move back and forth between two working positions; under the first working position, the bracket is positioned right below the silicon wafer of the material taking table; and in the second working position, the bracket is positioned right above the feeding end of the sorting machine.
Preferably, in order to increase the adsorption area and reduce the possibility of damage to the silicon wafer, a plurality of negative pressure ports are arranged.
Preferably, the negative pressure port is disposed on the bracket in order to facilitate the silicon wafer to be firmly attached to the bracket.
Preferably, the top surface of the carrier is roughened to increase the roughness of the surface of the carrier and to prevent the silicon wafer from sliding relative to the carrier.
Preferably, in order to ensure that a gap exists between the silicon wafer and the negative pressure port when the silicon wafer is adsorbed and prevent the silicon wafer from being damaged, the top surface of the bracket comprises a silicon wafer bearing part, and the negative pressure port is arranged close to the plane where the silicon wafer bearing part is located.
Preferably, in order to further ensure that a gap exists between the silicon wafer and the negative pressure port when the silicon wafer is adsorbed, the top surface of the bracket further comprises a recessed portion, and the negative pressure port is arranged on the recessed portion.
Preferably, the depressions are densely arranged on the top surface of the holder in order to uniformly apply force to the silicon wafer at various locations and improve the adsorption effect.
Preferably, in order to avoid damage to the silicon wafer, the silicon wafer bearing part is in smooth transition connection with the concave part.
Preferably, in order to realize buffering and prevent the silicon wafer from being damaged through flexible contact, the bracket is made of rubber or silica gel.
To sum up, the utility model is used for screen printing's silicon chip sorter loading attachment is when getting the piece, drives the bracket through elevating gear and upwards removes in order to hold up the silicon chip, prevents that the silicon chip from removing the in-process and getting the contact of material platform and taking place the friction to utilize air exhaust device to produce the air current, adsorb the silicon chip on the bracket, increase the static friction power between silicon chip and the bracket, prevent to produce relative displacement between silicon chip and the bracket and lead to the silicon chip to receive wearing and tearing, so realized the safe material loading of silicon chip.
Drawings
Fig. 1 is a schematic structural diagram of embodiment 1 of the present invention;
FIG. 2 is a schematic structural view of an absorption assembly in embodiment 1 of the present invention;
fig. 3 is a schematic structural view of the suction assembly in embodiment 2 of the present invention;
fig. 4 is a schematic structural diagram of the suction assembly in embodiment 3 of the present invention;
fig. 5 is a top view of the suction module according to embodiment 3 of the present invention;
fig. 6 is a schematic structural diagram of the suction assembly in embodiment 4 of the present invention;
in the figure: 1. the device comprises a moving assembly, 2 parts of a suction assembly, 2 parts to 1 parts of a negative pressure port, 3 parts to a bracket, 3 parts to 1 parts of a silicon wafer bearing part, 3 parts to 2 parts of a concave part, 3 parts to 3 parts of a cavity, 4 parts of a lifting device, 5 parts of an air extractor, 6 parts of a silicon wafer, 7 parts of a corrugated pipe, 8 parts of a sorting machine conveying belt, 9 parts of a material taking table and 10 parts of a bottom plate.
Detailed Description
The following description will further describe embodiments of the present invention with reference to the accompanying drawings and examples. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
Example 1
As shown in fig. 1 and 2, the silicon wafer sorter feeding device for screen printing of embodiment 1 comprises a moving assembly 1 and a sucking assembly 2; the suction assembly 2 comprises a horizontally arranged bottom plate 10, an air extracting device 5 is fixed on the upper surface of the bottom plate 10, lifting devices 4 are fixed at two ends of the air extracting device 5, each lifting device 4 is an air cylinder, a horizontal bracket 3 is fixed at the top end of a piston rod of the air cylinder, each bracket 3 is flat, a negative pressure port 2-1 is formed in the center of each bracket, the air extracting device 5 is an air extracting pump, and a corrugated pipe 7 is connected between each negative pressure port 2-1 and an air inlet of the air extracting pump; the moving assembly 1 is a belt conveyor and is arranged below the bottom plate 10, and the moving assembly 1 drives the suction assembly 2 to reciprocate between two working positions; under the first working position, the bracket 3 and the negative pressure port 2-1 are both positioned under the silicon wafer 6 in the material taking platform 9, and the air exhaust device 5 absorbs the silicon wafer 6 on the bracket 3; in the second operating position, the carrier 3 is located directly above the feed end of the sorter (i.e. the sorter conveyor 8).
When the feeding device operates, the moving assembly 1 drives the bottom plate 3 to move to a first working position for taking a wafer, the lifting device 4 moves the bracket 3 upwards to lift the silicon wafer 6 to separate the silicon wafer from the latch on the taking table 9, and the silicon wafer 6 is prevented from being abraded due to relative friction with the latch on the taking table 9 in the moving process; then, the air extracting device 5 is started, air is sucked from the negative pressure port 2-1 through the telescopic corrugated pipe 7, negative pressure is generated at the negative pressure port 2-1, so that the silicon wafer 6 is adsorbed on the bracket 3, the pressure between the silicon wafer and the bracket is increased, and the silicon wafer 6 is prevented from being abraded due to relative sliding between the silicon wafer and the bracket; and then, the moving assembly 1 drives the suction assembly 2 to move to a second working position, at the moment, the air exhaust device 5 stops running, and the lifting device 4 moves the bracket 3 downwards to the position below the sorting machine conveyer belt 8, so that the silicon wafer 6 is supposed to be on the sorting machine conveyer belt 8, and the conveying work of the single silicon wafer 6 is finished.
When the silicon wafer is taken, the silicon wafer 6 is lifted through the lifting device 4, negative pressure is generated at the negative pressure port 2-1 by the air exhaust device 5, the silicon wafer 6 is adsorbed on the bracket 3, the bracket 3 and the silicon wafer 6 are prevented from sliding relatively, synchronous movement of the bracket 3 and the silicon wafer 6 is guaranteed, the silicon wafer 6 is prevented from being abraded, and safe feeding of the silicon wafer 6 is realized.
It should be noted that, other driving mechanisms may be selected for the moving assembly 1 in the feeding device, such as a hydraulic cylinder or a motor screw structure, and the moving assembly can also realize the movement of the bottom plate 10 between the two working positions; in addition, the structures of the base plate 10 and the bracket 3 are not limited to the above-described embodiment; the lifting device 6 can be equivalently replaced by other driving mechanisms such as an oil cylinder and the like.
Example 2
As shown in fig. 3, the feeding device of the screen-printing silicon wafer sorting machine of embodiment 2 is based on embodiment 1, and is different in that a bracket 3 is of a hollow structure, a plurality of negative pressure ports 2-1 are formed in the top surface of the bracket 3, the negative pressure ports 2-1 are uniform, the negative pressure ports 2-1 are communicated with a cavity 3-3 of the bracket 3, an air exhaust device 5 is fixed on the lower surface of the bracket 3, and an air inlet of the air exhaust device 5 is communicated with the cavity 3-3.
In this embodiment, since the negative pressure ports 2-1 are provided in plural numbers, when the air extracting device 5 operates, the silicon wafer 6 is acted on the bracket 3 from plural positions, so that the stress on the silicon wafer 6 is more uniform and consistent, and the possibility that the silicon wafer 6 is damaged due to the excessively strong suction force when the silicon wafer is adsorbed at a single position is reduced.
Example 3
As shown in fig. 4 and 5, the silicon wafer sorter feeding apparatus for screen printing of example 3 is based on example 1 except that the top center of the carrier 3 protrudes from the periphery thereof so that a depression 3-2 is formed at the periphery, and a negative pressure port 2-1 is provided on the depression 3-2; the part protruding from the center of the top of the bracket 3 is a silicon wafer bearing part 3-1 for bearing a silicon wafer; the negative pressure port 2-1 is arranged close to the plane where the silicon wafer bearing part 3-1 is located.
In the embodiment, when the silicon wafer 6 is loaded, the negative pressure port 2-1 and the plane where the silicon wafer loading part 3-1 is located are arranged in close proximity, so that a certain gap exists between the negative pressure port 2-1 and the lower surface of the silicon wafer 6, air flow is facilitated, and the possibility of damage to the silicon wafer 6 caused by overlarge suction force in the adsorption process is reduced.
Example 4
As shown in fig. 6, the feeding device of the silicon wafer sorter for screen printing of the embodiment 4 is based on the embodiment 3, and is different from the embodiment in that the silicon wafer bearing part 3-1 is smoothly transitionally connected with the recess part 3-2, and the bracket 3 is made of rubber.
In the embodiment, the top surface of the bracket 3 is provided with the dense and uniformly distributed concave parts 3-2, so that the silicon wafers 6 are uniformly stressed in the feeding process, and after the concave parts 3-2 are smoothly and transitionally connected with the silicon wafer bearing parts 3-1, the bracket 3 is prevented from having sharp parts, and the possibility of damaging the silicon wafers 6 is reduced; moreover, the corrugated design increases the roughness of the bearing surface of the bracket 3, and further prevents the silicon wafer 6 and the bracket 3 from sliding relatively; the bracket 3 is made of flexible rubber, so that the bracket 3 has a certain buffering function, the bracket 3 is in flexible contact with the silicon wafer 6, the possibility of damage of the silicon wafer 6 is further reduced, and the quality of the silicon wafer 6 is ensured; as an alternative to a similar effect, the carrier 3 may also be made of silicone.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the technical principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.
Claims (9)
1. The utility model provides a silicon chip sorter loading attachment for screen printing, is including removing subassembly (1) and absorbing subassembly (2), absorb subassembly (2) including following bracket (3) that vertical direction removed, bracket (3) are connected with elevating gear (4), its characterized in that:
the suction assembly (2) is provided with a negative pressure port (2-1), the negative pressure port (2-1) is communicated with an air extraction device (5), and the air extraction device (5) is used for adsorbing the silicon wafer on the bracket (3);
the moving assembly (1) drives the suction assembly (2) to move back and forth between two working positions;
under the first working position, the bracket (3) is positioned under the silicon wafer of the material taking table;
and in the second working position, the bracket (3) is positioned right above the feeding end of the separator.
2. The silicon wafer sorter feeding device for screen printing as claimed in claim 1, wherein: the negative pressure port (2-1) is provided with a plurality of ports.
3. The silicon wafer sorter feeding device for screen printing as claimed in claim 1, wherein: the negative pressure port (2-1) is arranged on the bracket (3).
4. The silicon wafer sorter feeding device for screen printing as claimed in claim 1, wherein: the top surface of the bracket (3) is a rough surface.
5. The silicon wafer sorter feeding device for screen printing as claimed in claim 1, wherein: the top surface of the bracket (3) comprises a silicon wafer bearing part (3-1), and the negative pressure port (2-1) is closely adjacent to the plane where the silicon wafer bearing part (3-1) is located.
6. The silicon wafer sorter feeding device for screen printing as claimed in claim 5, wherein: the top surface of the bracket (3) further comprises a concave part (3-2), and the negative pressure port (2-1) is arranged on the concave part (3-2).
7. The silicon wafer sorter feeding device for screen printing as claimed in claim 6, wherein: the concave parts (3-2) are densely arranged on the top surface of the bracket (3).
8. The silicon wafer sorter feeding device for screen printing as claimed in claim 7, wherein: the silicon chip bearing part (3-1) is in smooth transition connection with the concave part (3-2).
9. The silicon wafer sorter feeding device for screen printing as claimed in claim 7, wherein: the bracket (3) is made of rubber or silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120238509.5U CN213752664U (en) | 2021-01-28 | 2021-01-28 | A silicon chip sorter loading attachment for screen printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120238509.5U CN213752664U (en) | 2021-01-28 | 2021-01-28 | A silicon chip sorter loading attachment for screen printing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213752664U true CN213752664U (en) | 2021-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120238509.5U Active CN213752664U (en) | 2021-01-28 | 2021-01-28 | A silicon chip sorter loading attachment for screen printing |
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| CN (1) | CN213752664U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115320226A (en) * | 2022-07-29 | 2022-11-11 | 苏州诺亚智造科技有限公司 | Liquid crystal screen laminating machine |
-
2021
- 2021-01-28 CN CN202120238509.5U patent/CN213752664U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115320226A (en) * | 2022-07-29 | 2022-11-11 | 苏州诺亚智造科技有限公司 | Liquid crystal screen laminating machine |
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