CN210635196U - Silicon wafer transmission mechanism - Google Patents
Silicon wafer transmission mechanism Download PDFInfo
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- CN210635196U CN210635196U CN201921217272.1U CN201921217272U CN210635196U CN 210635196 U CN210635196 U CN 210635196U CN 201921217272 U CN201921217272 U CN 201921217272U CN 210635196 U CN210635196 U CN 210635196U
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- transition
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Abstract
The utility model discloses a silicon wafer transmission mechanism, which comprises a placing arm, a transition arm, a walking mechanism and a transmission belt, wherein the placing arm and the transition arm are both used for placing a silicon wafer; the travelling mechanism comprises a travelling arm and a multi-shaft module for driving the travelling arm, the travelling arm comprises a first supporting part and a second supporting part, and the first supporting part and the second supporting part are respectively positioned at two end parts of the travelling arm; the transition arm, the placing arm and the conveying belt are sequentially arranged at equal intervals, and the distance between the transition arm, the placing arm and the conveying belt is equal to the distance between the first supporting part and the second supporting part; when the first supporting part is inserted into the placing arm, the second supporting part is inserted into the transition arm so as to sequentially transmit the silicon wafers on the placing arm and the transition arm to the transition arm and the transmission belt. The utility model discloses can improve the efficiency of silicon chip transmission.
Description
Technical Field
The utility model relates to a silicon chip automation equipment field, concretely relates to silicon chip transmission device.
Background
The silicon wafer is conveyed between different stations by means of auxiliary feeding of the conveying mechanism, and grabbing of the silicon wafer is achieved by means of a mechanical arm arranged on the stations, so that the silicon wafer on the conveying mechanism is placed on a tray of a station to be processed, and subsequent processing of the silicon wafer is facilitated.
The silicon wafer transmission mechanism mainly comprises symmetrically arranged belt pulley pairs, and the two belt pulley pairs convey silicon wafers placed on the belt pulley pairs to required stations through synchronous movement. However, in the prior art, the manipulator is usually used for taking materials, and the manipulator can only complete taking and placing of a silicon wafer in the process of one stroke movement when taking materials, so that the efficiency of silicon wafer transmission is reduced.
Disclosure of Invention
The to-be-solved technical problem of the utility model is to provide a silicon chip transmission device, its efficiency that can improve the silicon chip transmission.
In order to solve the technical problem, the utility model provides a silicon wafer transmission mechanism, which comprises a placing arm, a transition arm, a walking mechanism and a transmission belt, wherein the placing arm and the transition arm are both used for placing a silicon wafer; the travelling mechanism comprises a travelling arm and a multi-shaft module for driving the travelling arm, the travelling arm comprises a first supporting part and a second supporting part, and the first supporting part and the second supporting part are respectively positioned at two end parts of the travelling arm; the transition arm, the placing arm and the conveying belt are sequentially arranged at equal intervals, and the distance between the transition arm, the placing arm and the conveying belt is equal to the distance between the first supporting part and the second supporting part; when the first supporting part is inserted into the placing arm, the second supporting part is inserted into the transition arm so as to sequentially transmit the silicon wafers on the placing arm and the transition arm to the transition arm and the transmission belt.
Furthermore, the placing arm comprises an adsorption cavity and air holes communicated with the adsorption cavity, and the air holes are all located on the upper surface of the placing arm so as to adsorb the silicon wafer.
Furthermore, the first supporting part and the second supporting part are both connected with a plurality of air exhaust joints to adsorb the silicon wafer.
Further, sensors are arranged on the first supporting portion and the second supporting portion.
Further, the conveying belt comprises two symmetrically arranged belts, and a plurality of positioning parts are symmetrically arranged on the two belts; the positioning member includes a guide part matched with a corner of the silicon wafer to support the silicon wafer using the positioning member.
Furthermore, the positioning part is provided with a dividing rib, and the positioning part is positioned at two sides of the dividing rib to form the guide parts which are symmetrically arranged.
Furthermore, a baffle is arranged at the free end of the second supporting part, and the thickness of the baffle is smaller than or equal to the distance between two adjacent silicon wafers placed on the conveying belt.
Further, the thickness of the dividing rib is larger than or equal to that of the baffle plate.
Furthermore, the placing arm is connected with a moving module so as to be convenient for extracting the silicon wafer.
The utility model has the advantages that:
when the first supporting part is inserted into the placing arm, the second supporting part is synchronously inserted into the transition arm; when the first supporting part is used for supporting the silicon wafer placed on the placing arm, the second supporting part can synchronously support the silicon wafer placed on the transition arm; when the walking arm is driven by the multi-axis module to move away from the placing arm to a direction close to the conveying belt, and when the first supporting part places the silicon wafer supported by the first supporting part on the transition arm, the second supporting part can synchronously place the silicon wafer on the conveying belt, so that the silicon wafer is conveyed by the rotation of the conveying belt; the movement stroke of the walking arm is reduced by matching the first supporting part with the second supporting part, so that the time for transporting the silicon wafer can be shortened, and the efficiency of silicon wafer transmission is improved.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a schematic view of the placement arm of the present invention;
FIG. 3 is a schematic structural view of a traveling mechanism and a conveyor belt according to the present invention;
fig. 4 is an enlarged view of a portion a in fig. 3.
The reference numbers in the figures illustrate: 1. placing an arm; 11. an adsorption chamber; 12. air holes; 13. a moving module; 2. a transition arm; 3. a traveling arm; 31. a multi-axis module; 32. a first support section; 33. a second support portion; 331. a baffle plate; 34. a sensor; 35. an air extraction joint; 4. a belt; 41. a positioning member; 411. a guide portion; 412. cutting ribs; 5. and (3) a silicon wafer.
Detailed Description
The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.
Referring to fig. 1-3, an embodiment of a silicon wafer transmission mechanism of the present invention includes a placing arm 1, a transition arm 2, a traveling mechanism and a transmission belt, wherein the placing arm 1 is connected to a moving module 13, so as to take out a silicon wafer 5 from a flower basket. The traveling mechanism comprises a traveling arm 3 and a multi-axis module 31 for driving the traveling arm 3 to move, and the traveling arm 3 can realize the movement in the vertical direction and the horizontal direction under the driving of the multi-axis module 31. The transition arm 2 is supported by a support frame, which is not shown in this embodiment. The traveling arm 3 includes a first support portion 32 and a second support portion 33, and the first support portion 32 and the second support portion 33 are respectively located at both sides of the traveling arm 3. The first support part 32 and the second support part 33 are respectively provided with a plurality of air suction joints 35, so that the silicon wafer 5 can be adsorbed and transported by utilizing the first support part 32 and the second support part 33.
Referring to fig. 1-3, the placing arm 1, the transition arm 2 and the conveyor belt are all arranged in a horizontal direction in sequence, and the minimum distance between the placing arm 1 and the transition arm 2 is equal to the minimum distance between the transition arm 2 and the conveyor belt. Meanwhile, the distances are equal to the minimum distance between the first support part 32 and the second support part 33, so that the silicon wafer 5 can be efficiently transferred by using the first support part 32 and the second support part 33. In an initial state, the walking arm 3 is driven by the multi-axis module 31 to move along the vertical direction, so that the upper surface of the walking arm 3 is lower than the silicon wafer 5; then, the multi-axis module 31 is used for driving the walking arm 3 to move along the horizontal direction until the first supporting part 32 is inserted into the placing arm 1, and at the moment, the first supporting part 32 is positioned below the silicon wafer 5; then, the walking arm 3 is driven by the multi-axis module 31 to move upwards along the vertical direction, so that the first supporting part 32 can lift the silicon wafer 5 placed on the placing arm 1; then the multi-axis module 31 drives the traveling arm 3 to move back and forth in the horizontal direction, so that the first support part 32 moves to the transition arm 2. At this time, the multi-axis module 31 drives the first support part 32 to move downward to transfer the silicon wafer 5 on the first support part 32 to the transition arm 2, which is the initial movement of the silicon wafer 5 during transfer. When the above steps are repeated, when the first support part 32 is inserted into the placing arm 1, the second support part 33 is synchronously inserted into the transition arm 2; when the silicon wafer 5 placed on the placing arm 1 is lifted by the first supporting part 32, the second supporting part 33 can synchronously lift the silicon wafer 5 placed on the transition arm 2. When the walking arm 3 is driven by the multi-axis module 31 to move away from the placing arm 1 to a direction close to the conveying belt, and when the first supporting portion 32 places the silicon wafer 5 lifted by the first supporting portion on the transition arm 2, the second supporting portion 33 can place the silicon wafer 5 on the conveying belt synchronously, so that the silicon wafer 5 can be conveyed by the rotation of the conveying belt. The movement stroke of the traveling arm 3 is reduced by the cooperation of the first support part 32 and the second support part 33, so that the time for transporting the silicon wafer 5 can be reduced to improve the efficiency of transporting the silicon wafer 5.
Referring to fig. 3, the first supporting portion 32 and the second supporting portion 33 are both provided with a sensor 34, and the sensor 34 in this embodiment may be a photoelectric sensor 34, so as to detect whether the silicon wafer 5 is placed on the first supporting portion 32 and the second supporting portion 33.
Referring to fig. 1 and 2, the placing arm 1 includes an adsorption cavity 11 and a plurality of air holes 12 communicated with the adsorption cavity 11, the adsorption cavity 11 is opened inside the placing arm 1, and all the air holes 12 are opened on the upper surface of the placing arm 1. The adsorption cavity 11 is communicated with an air exhaust assembly, so that the silicon wafer 5 can be adsorbed on the placing arm 1 by utilizing the air pressure difference, and the stability of the silicon wafer 5 during placing is ensured.
Referring to fig. 1-4, the conveyor belt comprises two symmetrically arranged belt 4 drive pairs, said belt 4 drive pairs comprising belts 4. A plurality of positioning parts 41 are fixedly arranged on the belt 4, the positioning parts 41 on the same belt 4 are arranged at intervals according to the same distance, and the positioning parts 41 on the two belts 4 are symmetrically arranged; thereby achieving a synchronized movement of the positioning member 41 when the two belts 4 are moved in synchronization. The positioning member 41 includes a guide portion 411 and a dividing rib 412, and the guide portion 411 can be fitted to a corner of the silicon wafer 5 to support the corner of the silicon wafer 5. Since the guide portions 411 are symmetrically formed on both sides of the dividing rib 412 of the positioning member 41, the distance between two adjacent silicon wafers 5 can be reduced, and the silicon wafers 5 can be efficiently transported. The silicon wafers 5 are supported at 4 corners by the adjacent positioning members 41 respectively provided on the two belts 4, thereby facilitating the transfer of the silicon wafers 5.
Referring to fig. 3 and 4, when the silicon wafers 5 are transported on the transport belt, the distance between two adjacent silicon wafers 5 is equal to the thickness of the dividing ribs 412, so that the distance between the silicon wafers 5 during transport can be reduced, and the silicon wafers 5 can be prevented from being overlapped. The baffle 331 is integrally formed at the free end of the second support portion 33, and the thickness of the baffle 331 is slightly less than or equal to the thickness of the dividing rib 412. When the second support part 33 places the silicon wafer 5 on the conveyor belt, the baffle 331 can come into contact with the side edge of the adjacent silicon wafer 5, so that the accuracy of the position when the silicon wafer 5 is placed can be increased.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.
Claims (9)
1. The silicon wafer conveying mechanism is characterized by comprising a placing arm, a transition arm, a travelling mechanism and a conveying belt, wherein the placing arm and the transition arm are used for placing a silicon wafer; the travelling mechanism comprises a travelling arm and a multi-shaft module for driving the travelling arm, the travelling arm comprises a first supporting part and a second supporting part, and the first supporting part and the second supporting part are respectively positioned at two end parts of the travelling arm; the transition arm, the placing arm and the conveying belt are sequentially arranged at equal intervals, and the distance between the transition arm, the placing arm and the conveying belt is equal to the distance between the first supporting part and the second supporting part; when the first supporting part is inserted into the placing arm, the second supporting part is inserted into the transition arm so as to sequentially transmit the silicon wafers on the placing arm and the transition arm to the transition arm and the transmission belt.
2. The wafer conveying mechanism according to claim 1, wherein the placing arm comprises an adsorption cavity and air holes communicated with the adsorption cavity, and the air holes are all positioned on the upper surface of the placing arm so as to adsorb the wafer.
3. The wafer transfer mechanism of claim 1, wherein a plurality of suction connections are connected to each of the first support and the second support to suck the wafer.
4. The silicon wafer transfer mechanism of claim 1 wherein a sensor is disposed on each of the first support and the second support.
5. The silicon wafer conveying mechanism according to claim 1, wherein the conveying belt comprises two symmetrically arranged belts, and a plurality of positioning components are symmetrically arranged on the two belts; the positioning member includes a guide part matched with a corner of the silicon wafer to support the silicon wafer using the positioning member.
6. The silicon wafer conveying mechanism according to claim 5, wherein the positioning member is provided with a dividing rib, and the positioning member is positioned on both sides of the dividing rib to form the guide portions symmetrically arranged.
7. The silicon wafer conveying mechanism according to claim 6, wherein a baffle is arranged at the free end of the second supporting part, and the thickness of the baffle is smaller than or equal to the distance between two adjacent silicon wafers placed on the conveying belt.
8. The silicon wafer conveying mechanism according to claim 7, wherein the thickness of the dividing rib is greater than or equal to the thickness of the stopper.
9. The wafer transfer mechanism of claim 1, wherein a movement module is coupled to the placement arm to facilitate extraction of the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921217272.1U CN210635196U (en) | 2019-07-30 | 2019-07-30 | Silicon wafer transmission mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921217272.1U CN210635196U (en) | 2019-07-30 | 2019-07-30 | Silicon wafer transmission mechanism |
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| Publication Number | Publication Date |
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| CN210635196U true CN210635196U (en) | 2020-05-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921217272.1U Active CN210635196U (en) | 2019-07-30 | 2019-07-30 | Silicon wafer transmission mechanism |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112299013A (en) * | 2020-11-20 | 2021-02-02 | 枣庄睿诺电子科技有限公司 | Glass substrate conveying device and glass substrate cleaning device |
-
2019
- 2019-07-30 CN CN201921217272.1U patent/CN210635196U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112299013A (en) * | 2020-11-20 | 2021-02-02 | 枣庄睿诺电子科技有限公司 | Glass substrate conveying device and glass substrate cleaning device |
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