KR101433516B1 - Apparatus and Method for transferring substrate and tray to transfer the substrate - Google Patents
Apparatus and Method for transferring substrate and tray to transfer the substrate Download PDFInfo
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- KR101433516B1 KR101433516B1 KR1020130030914A KR20130030914A KR101433516B1 KR 101433516 B1 KR101433516 B1 KR 101433516B1 KR 1020130030914 A KR1020130030914 A KR 1020130030914A KR 20130030914 A KR20130030914 A KR 20130030914A KR 101433516 B1 KR101433516 B1 KR 101433516B1
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- South Korea
- Prior art keywords
- tray
- substrate
- unit
- loader
- unloader
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a substrate transporting apparatus and a substrate transporting method for transporting a substrate in a continuous, high-speed, high-precision, and clean manner, so that the continuous processing of the substrate can be performed quickly and accurately and stably. It has its purpose.
The present invention for realizing this is characterized in that a loader unit (200) for loading a substrate carried by the substrate loading apparatus (100) and a tray (10) for accommodating the same; And a loader lifter 330 that is lifted and lowered along a guide rail 310 provided at one side of the loader unit 200 to transport the tray 10 to the loader unit 200. [ 300); A substrate processing unit 400 on which the tray 10 containing the substrate is transferred and a substrate processing process is performed; An unloader unit 500 for separating and transporting a substrate from a tray 10 in which the substrate passed through the substrate processing unit 400 is accommodated; An unloader part lifter 630 which is moved up and down along a guide rail 610 provided at one side of the unloader part 500 and moves the tray 10 separated from the substrate to the upper part of the guide rail 610, An unloader loading / unloading portion 600 including an unloader loading portion 600; And a return conveyance unit 700 for conveying the tray 10 from the unloader portion ascending / descending portion 600 to the loader ascending / descending portion 300 side.
Description
BACKGROUND OF THE
Recently, as the demand for display devices has increased, various flat panel display devices such as LCD (Liquid Crystal Display), PDP (Plasma Display Panel), ELD (Electro Luminescent Display) and VFD (Vacuum Fluorescent Display) . 2. Description of the Related Art In recent years, research and development on a portable display device has been accelerated. Particularly, demand for a flexible substrate such as an organic light emitting diode display, which is light in weight and thin in thickness, Is increasing.
Since the flexible substrate is generally made of a plastic substrate or a thin glass substrate and has a flexible and well-bending property, in order to prevent the flexible substrate from being bent when the flexible substrate is inserted into a display device manufacturing process, A series of processes are performed.
As a prior art related to a manufacturing process of a flexible substrate in the past, a plasma cleaning apparatus and a method are disclosed as an example of a substrate manufacturing apparatus in Japanese Patent Registration No. 10-0645647 shown in Fig. The
In the
The apparatus for manufacturing a substrate of the above-mentioned Japanese Patent No. 10-0645647 has a configuration of a
On the other hand, in the prior art relating to a general substrate transport apparatus including a flexible substrate, Japanese Patent Application No. 10-0866508 shown in Fig. 2 includes an
In the substrate transport apparatus disclosed in the above-mentioned Japanese Patent No. 10866508, after a jig on which a substrate is mounted performs a treatment process, the substrate is taken out from the jig and taken out, and the
SUMMARY OF THE INVENTION The present invention has been conceived to solve the above-mentioned problems, and it is an object of the present invention to provide a substrate processing apparatus, a substrate processing method, and a substrate processing method, which can realize rapid, accurate, And a substrate transporting tray transporting device and a transporting method.
It is another object of the present invention to provide a substrate and a substrate which can improve the production yield by preventing the occurrence of trouble and reducing the takt time of the substrate processing by allowing smooth take- A tray transporting device and a transporting method.
It is still another object of the present invention to provide a tray which enables maintenance of a tray in which a problem occurs without stopping operation of the apparatus when a tray requiring maintenance is generated due to failure or deformation among a plurality of trays continuously transported And a substrate transport tray transporting device and a transporting method.
The substrate transport apparatus for transporting a substrate includes a substrate transported by the
The method for transporting a substrate and a tray for transporting a substrate according to the present invention includes the steps of feeding a tray (10) to be loaded with a substrate into a loader section (200); Loading the substrate into the tray (10) loaded in the loader unit (200); Transporting the
According to the substrate transporting apparatus and the transporting method of the present invention, the substrate accommodated in the tray is continuously transported while passing through the substrate processing section, and the tray on which the processed substrate is transported and unloaded is loaded A series of processes of re-loading the wafer into the loader section through the steel section, the return conveyance section, and the load-section ascending / descending section can be performed smoothly without interruption, so that the continuous processing of the substrate can be performed quickly and accurately and stably.
Further, the tray placed in the first buffer section of the return conveyance section is conveyed to the second buffer section by using a transfer unit which moves along the conveyance rail, thereby speeding up the conveyance speed of the tray, and at the same time, It is possible to increase the yield of the substrate accommodated in the tray and to process the product and to improve the reliability of the product.
Further, a plurality of buffer units are additionally provided between the first buffer unit and the second buffer unit provided in the return conveyance unit, and when a tray requiring maintenance is generated due to failure or deformation of a plurality of trays continuously conveyed The tray in which a problem has occurred is placed in the plurality of buffer units, maintenance is performed, and at the same time, a normal tray is continuously transported to perform a substrate processing process, thereby preventing the apparatus from being shut down and efficiently operating the apparatus.
BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a diagram of a substrate manufacturing apparatus disclosed in Japanese Patent No. 10-0645647,
Figure 2 shows a substrate transfer apparatus as disclosed in Japanese Patent No. 10-0866508,
3 is a perspective view of a substrate and a tray transport apparatus for transporting a substrate according to the present invention,
Fig. 4 is a front view of Fig. 3,
5 is a perspective view of the
Fig. 6 is a plan view of Fig. 5,
Fig. 7 is a side view of Fig. 5,
8 is a perspective view of the
9 is a left side view of the
10 is a perspective view showing a state in which the
11 is a plan view showing the operation in which the substrate S is coupled to the
Fig. 12 is a perspective view, (c) a right side view, and (d) a front view of the
13 is a perspective view of the
14 is a plan view showing the operation of separating the substrate S from the
15 is a perspective view of the
16 is a front view of the
17 is a front view of the
18 is a perspective view (a), a right side view (b), and a front view (c) of the
19 is a front view showing a state (a), a front view (c), and a left side view (d) of the
20 is a flowchart of a substrate transport method for transporting a substrate and a substrate according to the present invention,
21 is a view showing a step of loading the
22 is a view showing a step in which the substrate S is coupled to the
23 is a view showing a step in which the
24 is a view showing a step in which the
25 shows a step in which the substrate S is separated and taken out from the
26 is a view showing a step in which the
27 shows a step in which the
28 shows a step of transferring the
29 shows a step in which the
30 shows a step in which the
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 3 is a perspective view of a substrate and a tray transport apparatus for transporting a substrate according to the present invention, and FIG. 4 is a front view of FIG.
A substrate transport apparatus for transporting a substrate according to the present invention includes a
The
A
The substrate S carried into the
Hereinafter, the structure and operation of individual components constituting the substrate and the substrate transport tray of the present invention will be described in the order of the transport process, and then the substrate and the substrate transport tray transportation method will be described.
As an embodiment of the substrate S applied to the present invention, a flexible substrate of a predetermined width, length and thinness can be applied, and in this case, it is possible to prevent sagging or deformation of the substrate during the processing process In order to maintain a flat state, the processing process is performed while the substrate S is mounted on the
Fig. 5 is a perspective view of the
The
The
Each of the
The moving
The
The tension generated by the
The
In this embodiment, the tension of the substrate S is controlled by moving the
Hereinafter, the structure of the
9 is a left side view of the
The
The lifting and lowering table 220 is vertically moved by driving the table lifting and lowering
On the other side of the
A
Hereinafter, a process of storing and mounting the substrate S on the
The
The
An inner side of the
The inner surface of the
A plurality of tapered tapered portions (not shown) are protruded from the pushing
10, the
The moving table 223 includes a moving
Meanwhile, a pair of
When the substrate S is seated on the lifting table 220 by the
Thereafter, after the substrate S is placed on the lifting table 220, the driving force of the
After the substrate S is fixed to the
When the
Hereinafter, the structure of the
Each of the first and
The
Each of the first and
The first aligning
The
The
The
Fig. 13 is a perspective view of the
The
14A, when the
The
The
A plurality of
The plurality of
Hereinafter, the configurations of the
17 is a perspective view showing (a) a perspective view of the
18 shows (a) a perspective view of the
18, the
Each of the
Each of the
The process of gripping the
19 is a front view showing (a) a perspective view of the loader
Hereinafter, a method of conveying the substrate and the tray in the substrate and the tray transporting apparatus for carrying the substrate constructed as described above will be described.
20 is a flowchart of a substrate transport method for transporting a substrate and a substrate according to the present invention.
The method of transporting a substrate and a tray for transporting a substrate according to the present invention includes the steps of loading a tray 10 to be loaded with a substrate into a loader unit 200, loading the substrate into a tray 10 loaded in the loader unit 200 The substrate transported by the unloader unit 500 is transported through the substrate processing unit 400 to the substrate processing unit 400, Separating and removing the substrate from the tray 10 and raising and lowering the tray 10 separated from the substrate to the upper portion of the unloader portion ascending / descending portion 600 using the unloader portion lifter 630, The tray 10 moved to the upper portion of the loader lifting and lowering portion 600 is returned and transported using the unloader robot arm 800 moving along the liner 810 provided on the bottom surface of the return conveying portion 700 To a first buffer unit (711) provided on one side of the first unit (700) The tray 10 positioned in the buffer unit 711 is transferred to the other side of the return conveyance unit 700 by using the transfer unit 730 which moves along the conveyance rail 720 provided on the ceiling of the return conveyance unit 700 The tray 10 positioned in the second buffer unit 712 is moved along the liner 910 provided on the bottom surface of the return conveyance unit 700 To the loader part lifter 330 waiting on the upper part of the loader lifting part 300 by using the loader part robot arm 900 and lowering the loader part lifter 330 to load the loader part 200 (10) to prepare for loading the substrate to be loaded.
Figs. 21 to 30 show the substrate and the tray transport method of the present invention according to the transport order. Fig. Here, the substrate loading
21 shows a stage in which the
22 shows a stage in which the substrate S is coupled to the
23 shows a stage in which the
FIG. 24 is a diagram illustrating a step in which the
26 shows a stage in which the
27 shows a step in which the
28 shows a step of transferring the
29 shows a step in which the
30 shows a stage in which the
Here, the process of conveying one
S: Substrate 1: First frame
2: second frame 3: third frame
10: Tray 11: Presser plate
12: ring 13: push rod
100: substrate loading apparatus 100 ': substrate unloading apparatus
110: first grip part 120: second grip part
130: tension adjusting part 140: pressure sensing part
150: Position adjusting section 200:
210: Base frame 220: Up / down table
221: table lifting cylinder 222: guide member
223: moving pin 224: connecting member
225: cylinder 226: link
227: step motor 230: motor
240: conveying roller 250: side guide roller
260: inclination adjusting cylinder 300:
310: guide rail 320: lifter grip arm
330: Lifter 340: Housing
350: first grip portion 360: second grip portion
370: first aligning portion 380: second aligning portion
400: substrate processing part 500: unloader part
510: Base frame 520: Up / down table
530: conveying roller 540: side guide roller
550: side guide roller 600: unloader part ascending / descending portion
610: Guide rail 620: Lifter grip arm
630: Lifter 700: Return carriage
710, 711, 712, 713, 714, 715: buffer unit 720:
730: transfer unit 740: housing
750: cylinder 760: first grip part
770: second grip portion 780: first alignment portion
790: 2nd alignment part 800: Unloader part robot arm
810: liner 820: sliding member
830: Moving block 840: Cylinder
850: Support plate 860:
900: Loader robot arm 910: Liner
920: Sliding member 930: Moving block
940: cylinder 950: support plate
960:
Claims (20)
And a loader lifter 330 that is lifted and lowered along a guide rail 310 provided at one side of the loader unit 200 to transport the tray 10 to the loader unit 200. [ 300);
A substrate processing unit 400 on which the tray 10 containing the substrate is transferred and a substrate processing process is performed;
An unloader unit 500 for separating and transporting a substrate from a tray 10 in which the substrate passed through the substrate processing unit 400 is accommodated;
An unloader part lifter 630 which is moved up and down along a guide rail 610 provided at one side of the unloader part 500 and moves the tray 10 separated from the substrate to the upper part of the guide rail 610, An unloader loading / unloading portion 600 including an unloader loading portion 600;
And a return conveying unit 700 for conveying the tray 10 from the unloader portion ascending / descending portion 600 to the loader descending / descending portion 300 side,
The return transfer part 700 includes a first buffer part 711, a second buffer part 712 and a first buffer part 711 which are disposed at positions spaced apart from each other and on which the tray 10 is mounted, A transfer unit 730 for holding the tray 10 on which the tray 10 is located and transferring the tray 10 to the second buffer unit 712, a transfer unit 730 for transferring the tray 10 from the unloader unit lifter 630 to the first buffer unit 711 And a loader robot arm 900 which takes over the tray 10 from the second buffer unit 712 and transfers the tray 10 to the loader unit lifter 330 And a substrate transport tray for transporting the substrate.
The loader portion 200 and the loader portion ascending / descending portion 300 are provided at the inlet side of the substrate processing portion 400,
The unloader portion 500 and the unloader portion ascending / descending portion 600 are provided at an outlet side of the substrate processing portion 400,
Wherein the return transfer part 700 is provided between the loader ascending and descending part 300 and the unloader part ascending and descending part 600 on the upper side of the substrate processing part 400. [ .
Wherein the substrate is made of a flexible material having a predetermined width, length and thin shape,
The substrate loading apparatus 100 may include a first grip portion 110 and a second grip portion 120, respectively, which grip opposite opposite edges of the substrate, respectively.
A tension drive unit for moving the first grip part 110 and the second grip part 120 or both to apply a predetermined tension to the gripped parts of the first grip part 110 and the second grip part 120 130) for transporting a substrate.
A first flange portion 10a and a second flange portion 10b protruding inwardly and upwardly from the rim of four sides are formed on the tray 10 so that the substrate is seated and accommodated,
A presser plate 11 horizontally moved from the upper surface of the first flange portion 10a to press the outer surface of the substrate inward to fix the inner surface of the second flange portion 10b of the tray 10, And a push rod (13) inserted into the ring (12) formed at regular intervals along the longitudinal direction on the upper side of the press plate (11) to press and fix the upper surface of the press plate (11) Tray transfer device.
The loading unit 200 is provided with a moving pin 223 for pressing the outer surface of the pressing plate 11 inward to fix the substrate on the tray 10 and an outer end of the moving pin 223 And a cylinder (225) for driving the horizontal movement of the connecting member (224).
The loader unit 200 and the unloader unit 500 are provided with elevating tables 220 and 520 that support the tray 10 and are driven to move up and down.
A link 226 for pressing the push rod 13 to move the push rod 13 horizontally and a step motor 227 for driving rotation and horizontal movement of the link 226, ) For transporting the substrate (1).
The loader unit 200 and the unloader unit 500 are provided with elevating tables 220 and 520 that support the tray 10 and are driven to move up and down.
A pair of guide members 222 are formed on both sides of the ascending / descending tables 220 and 520 and the upper surface of the tray 10 is inclined downward from the outer side to the inner side so that the tray 10 is seated at a predetermined position on the ascending / And a conveying device for conveying the substrate.
The loader unit 200 and the unloader unit 500 are provided with a tilt adjusting cylinder 260 coupled to a bottom surface of the base frame 210 and driven in the vertical direction,
And a hinge portion 211 which is a turning center of the base frame 210 when the inclination adjusting cylinder 260 is driven is formed on the other bottom surface of the base frame 210. [ .
The loader part lifter 330 and the unloader part lifter 630,
A first grip portion 350 and a second grip portion 360 for respectively gripping front and rear edge portions of the tray 10;
And a second aligning part (380) for aligning the right and left direction positions of the tray (10) while supporting opposite left and right side edges of the tray (10) A substrate transfer tray transfer device.
The first grip portion 350 and the second grip portion 360, respectively,
Cylinders (351, 361) fixed to the bottom surface of the housing (340) and driven forward and backward;
Plates (352,362) coupled to the top of the cylinders (351,361);
Cylinders (353, 363) spaced on both sides of the bottom surface of the plates (352, 362) and positioned above the bottom surface of the housing (340) and driven up and down;
Movement grippers 354 and 364 which are driven up and down by the cylinders 353 and 363;
The upper portion of the plate 352 is fixed to the bottom surface of the plate 352 and the lower portion of the plate 352 is paired with the moving grippers 354 and 364 through the bottom surface of the housing 340 to fix the tray 10 to the fixing grippers 355 and 365 And a substrate transport tray for transporting the substrate.
The transfer unit 730,
And is reciprocated between the first buffer unit 711 and the second buffer unit 712 along the transporting rail 720 disposed horizontally on the ceiling of the return transport unit 700, 750);
A first grip portion 760 and a second grip portion 770 for gripping front and rear edge portions facing the tray 10, respectively;
A first aligning portion 780 and a second aligning portion 790 for supporting the opposite left and right side edges of the tray 10 and aligning the left and right positions of the tray 10; Conveying device.
The first grip portion 760 and the second grip portion 770, respectively,
Cylinders (761, 771) fixed to the bottom surface of the housing (740) and driven forward and backward;
Plates (762,772) coupled to the top of the cylinders (761,771);
Cylinders (763, 733) spaced from both sides of the bottom of the plates (762, 772) and positioned above the bottom surface of the housing (740) and driven up and down;
Movement grippers 764 and 774 driven up and down by the cylinders 763 and 773;
The upper portion of the plate 762 is fixed to the bottom of the plate 762 and the lower portion of the plate 762 is paired with the moving grippers 764 and 774 through the bottom surface of the housing 740 to fix the tray 10 to the fixing grippers 765 and 775 And a substrate transport tray for transporting the substrate.
The first and second alignment portions 370, 780 and the second alignment portions 380,
Cylinders (371, 381, 718, and 791) fixed to the bottom surfaces of the housings (340, 740) and driven to the left and right;
Plates (372, 382, 782, 792) coupled to the upper portions of the cylinders (371, 381, 781, 791);
Cylinders (373, 383, 783, and 793) spaced on both sides of the bottom surfaces of the plates (372, 382, 782, and 792) and positioned vertically through the bottom surface of the housings (340, 740)
And rollers (374, 384, 784, and 794) driven up and down by the cylinders (373, 383, 783, and 793) to support the side surfaces of the tray (10).
The unloader unit robot arm 800 and the loader unit robot arm 900,
Sliding members (820, 920) reciprocating along liner (810, 910) arranged horizontally on the bottom surface of the return conveyor (700);
Moving blocks (830, 930) coupled to the top of the sliding members (820, 920);
Cylinders (840, 940) coupled to the moving blocks (830, 930) and driven up and down;
Support plates 850 and 950 which are moved up and down by driving the cylinders 840 and 940; And
And a seating part (860, 960) coupled to the support plate (850, 950) to seat the tray (10).
A plurality of buffer units 713, 714 and 715 are installed between the first buffer unit 711 and the second buffer unit 712 to receive the tray 10 carried by the transfer unit 730, Respectively,
Wherein the first buffer unit 711, the second buffer unit 712 and the plurality of buffer units 713, 714 and 715 are provided with sensing means for sensing the position of the tray 10. [ Device.
Loading the substrate into the tray (10) loaded in the loader unit (200);
Transporting the tray 10 to which the substrate is coupled through the substrate processing unit 400 and performing a substrate processing process;
Separating and transporting the substrate from the tray 10 coupled with the substrate conveyed to the unloader unit 500 through the processing step;
Elevating the tray (10) separated from the substrate to the upper portion of the unloader portion ascending / descending portion (600) by using the unloader portion lifter (630);
The tray 10 moved to the upper portion of the unloader portion ascending / descending portion 600 is moved by the unloader portion robot arm 800 moving along the liner 810 provided on the bottom surface of the return conveying portion 700 To a first buffer unit (711) provided at one side of the return conveyance unit (700);
The transfer unit 700 is moved to the first buffer unit 711 by using the transfer unit 730 which moves the tray 10 along the conveyance rail 720 provided on the ceiling of the return conveyance unit 700, To a second buffer unit (712) provided on the other side of the first buffer unit (712);
The tray 10 located in the second buffer unit 712 is moved by the loader robot arm 900 moving along the liner 910 provided on the bottom surface of the return conveyor unit 700, To a loader lifter (330) waiting at the top of the loader lifter (300);
And lowering the loader part lifter (330) so as to insert the tray (10) into the loader part (200) to prepare for loading of the loaded substrate.
When the tray 10 is moved by the loader part lifter 330, the unloader part lifter 630 and the transfer unit 730, both right and left side surfaces of the tray 10 are supported by the first and second aligning parts And the front and rear side surfaces of the tray (10) are moved in a state gripped by the first grip portion and the second grip portion.
The unloader robot arm 10 transfers the tray 10 from the lower side of the unloader section lifter 630 to the tray 10 via the unloader section lifter 630, And transferring the tray (10) onto the first buffer unit (711) while descending after being horizontally moved to the upper side of the first buffer unit (711)
The transfer of the tray 10 by the loader section robot arm 900 is carried out by moving the loader robot arm 900 waiting on the lower side of the second buffer section 712 up and down on the second buffer section 712 The tray 10 is moved horizontally to the lower side of the loader lifter 330 and transferred to the loader part lifter 330 and then lowered to be lowered to the lower side of the second buffer part 712 So as to wait for the substrate to be transported.
A plurality of buffer units 713, 714 and 715 are provided at predetermined intervals between the first buffer unit 711 and the second buffer unit 712 and the transfer unit 730 is connected to the unloader unit robot arm 800 The tray 10 positioned in the first buffer unit 711 in the previous stage before the tray 10 transported to the first buffer unit 711 is transported to the second buffer unit 712, (713, 714, 715) to transport the tray (10).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130030914A KR101433516B1 (en) | 2013-03-22 | 2013-03-22 | Apparatus and Method for transferring substrate and tray to transfer the substrate |
| PCT/KR2014/002390 WO2014148857A1 (en) | 2013-03-22 | 2014-03-21 | Device and method for transferring substrate and substrate-transferring tray |
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| KR1020130030914A KR101433516B1 (en) | 2013-03-22 | 2013-03-22 | Apparatus and Method for transferring substrate and tray to transfer the substrate |
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| KR101433516B1 true KR101433516B1 (en) | 2014-08-27 |
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| KR1020130030914A KR101433516B1 (en) | 2013-03-22 | 2013-03-22 | Apparatus and Method for transferring substrate and tray to transfer the substrate |
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| WO (1) | WO2014148857A1 (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160081008A (en) * | 2014-12-30 | 2016-07-08 | 세메스 주식회사 | Buffer unit, Apparatus for treating a substrate including the unit |
| KR102014116B1 (en) * | 2018-03-15 | 2019-08-26 | 주식회사 신성에프에이 | Tray transfer apparatus |
| KR102027116B1 (en) * | 2018-04-04 | 2019-10-01 | 주식회사 필옵틱스 | Non―contact adsorption device of flexible material |
| CN110324777A (en) * | 2019-07-11 | 2019-10-11 | 南京万孚电声有限公司 | A kind of loudspeaker lifting drying tunnel machine |
| KR20190119846A (en) * | 2018-04-13 | 2019-10-23 | 세메스 주식회사 | Vehicle set up device and method of setting up vehicle using the same |
| KR20190128878A (en) * | 2018-05-09 | 2019-11-19 | 주식회사 글로벌시스템즈 | A system for processing exact treatment |
| US20200176295A1 (en) * | 2018-11-29 | 2020-06-04 | Samsung Display Co., Ltd. | System for transferring substrate and method for transferring substrate using the same |
| KR20200122833A (en) * | 2019-04-19 | 2020-10-28 | 한국알박(주) | Tray conveying apparatus and vacuum deposition device comprising the same |
| CN115108244A (en) * | 2022-06-22 | 2022-09-27 | 四川金域医学检验中心有限公司 | Equipment suitable for pathological slide dries in air piece and preserves |
| KR102488021B1 (en) * | 2022-06-07 | 2023-01-13 | 주식회사 에이투비 | Transport system of waste using bucket |
| KR200496677Y1 (en) * | 2018-06-19 | 2023-04-05 | 주식회사 디엠에스 | Pallet for transfer substrate and substrate processing apparatus using the same |
| KR20240024659A (en) * | 2022-08-17 | 2024-02-26 | 주식회사 넥사 | Equipment front end module |
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| CN216749844U (en) * | 2022-02-21 | 2022-06-14 | 上海世禹精密机械有限公司 | Semiconductor element transfer apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160081008A (en) * | 2014-12-30 | 2016-07-08 | 세메스 주식회사 | Buffer unit, Apparatus for treating a substrate including the unit |
| KR102316618B1 (en) * | 2014-12-30 | 2021-10-22 | 세메스 주식회사 | Buffer unit, Apparatus for treating a substrate including the unit |
| KR102014116B1 (en) * | 2018-03-15 | 2019-08-26 | 주식회사 신성에프에이 | Tray transfer apparatus |
| KR102027116B1 (en) * | 2018-04-04 | 2019-10-01 | 주식회사 필옵틱스 | Non―contact adsorption device of flexible material |
| KR102469667B1 (en) | 2018-04-13 | 2022-11-22 | 세메스 주식회사 | Vehicle set up device and method of setting up vehicle using the same |
| KR20190119846A (en) * | 2018-04-13 | 2019-10-23 | 세메스 주식회사 | Vehicle set up device and method of setting up vehicle using the same |
| KR20190128878A (en) * | 2018-05-09 | 2019-11-19 | 주식회사 글로벌시스템즈 | A system for processing exact treatment |
| KR102054714B1 (en) * | 2018-05-09 | 2019-12-12 | 주식회사 글로벌시스템즈 | A system for processing exact treatment |
| KR200496677Y1 (en) * | 2018-06-19 | 2023-04-05 | 주식회사 디엠에스 | Pallet for transfer substrate and substrate processing apparatus using the same |
| US11735453B2 (en) * | 2018-11-29 | 2023-08-22 | Samsung Display Co., Ltd. | System for transferring substrate |
| US20200176295A1 (en) * | 2018-11-29 | 2020-06-04 | Samsung Display Co., Ltd. | System for transferring substrate and method for transferring substrate using the same |
| KR20200122833A (en) * | 2019-04-19 | 2020-10-28 | 한국알박(주) | Tray conveying apparatus and vacuum deposition device comprising the same |
| KR102638343B1 (en) | 2019-04-19 | 2024-02-21 | 한국알박(주) | Tray conveying apparatus and vacuum deposition device comprising the same |
| CN110324777A (en) * | 2019-07-11 | 2019-10-11 | 南京万孚电声有限公司 | A kind of loudspeaker lifting drying tunnel machine |
| KR102488021B1 (en) * | 2022-06-07 | 2023-01-13 | 주식회사 에이투비 | Transport system of waste using bucket |
| CN115108244A (en) * | 2022-06-22 | 2022-09-27 | 四川金域医学检验中心有限公司 | Equipment suitable for pathological slide dries in air piece and preserves |
| CN115108244B (en) * | 2022-06-22 | 2024-01-26 | 四川金域医学检验中心有限公司 | Equipment suitable for pathological slide dries in air piece and preserves |
| KR20240024659A (en) * | 2022-08-17 | 2024-02-26 | 주식회사 넥사 | Equipment front end module |
| KR102655081B1 (en) * | 2022-08-17 | 2024-04-05 | 주식회사 넥사 | Equipment front end module |
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| WO2014148857A1 (en) | 2014-09-25 |
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