CN207398079U - Automatic circular silicon chip inserting machine - Google Patents
Automatic circular silicon chip inserting machine Download PDFInfo
- Publication number
- CN207398079U CN207398079U CN201721238235.XU CN201721238235U CN207398079U CN 207398079 U CN207398079 U CN 207398079U CN 201721238235 U CN201721238235 U CN 201721238235U CN 207398079 U CN207398079 U CN 207398079U
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- silicon chip
- inserting machine
- automatic circular
- machine according
- circular silicon
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 144
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 144
- 239000010703 silicon Substances 0.000 title claims abstract description 144
- 230000007246 mechanism Effects 0.000 claims abstract description 58
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 33
- 230000005540 biological transmission Effects 0.000 claims description 11
- 238000000926 separation method Methods 0.000 claims description 6
- 238000001179 sorption measurement Methods 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 abstract 5
- 238000004140 cleaning Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000007306 turnover Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 230000005571 horizontal transmission Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides an automatic round silicon wafer inserting machine, which comprises an inserting mechanism and a grabbing mechanism which are arranged in sequence, wherein the inserting mechanism is used for separating stacked silicon wafers and inserting and filling the separated silicon wafers into a silicon wafer loading device; and the grabbing mechanism is used for transferring the fully loaded silicon wafer loading device. The beneficial effects of the utility model are that solve among the prior art manual burst, inserted sheet and cause the problem of pollution, easy piece in the operation to the silicon chip, realize the automatic operation of circular silicon chip inserted sheet.
Description
Technical field
The utility model belongs to semi-conductor silicon chip manufacturing machine technical field, is inserted more particularly, to a kind of automatic circular silicon chip
Piece machine.
Background technology
In existing technology monocrystalline silicon cut by line, after degumming cleaning and alkali corruption process, it is necessary to which manual working is by circle
Silicon chip is inserted into silicon chip loading device, and to carry out lower road washing and cleaning operation, manual burst, inserted sheet can cause wafer contamination, and
And fragmentation easily occurs in operation.Semi-conductor silicon chip has strict requirements for the granularity on surface, what manual working generated
Secondary pollution does not adapt to the demand of production, under the rapid overall situation of industrial development, with the development of semicon industry, with
And personal expenditures is incremented by, and is badly in need of a kind of automatic circular silicon chip inserting machine and substitutes current semiconductor circle silicon chip manual inserted sheet shape
Formula, to adapt to industrial development trend.
The content of the invention
The utility model provides a kind of automatic circular silicon chip inserting machine, it is therefore an objective to solve in the prior art manual burst,
Inserted sheet pollutes silicon chip, the problem of rupture diaphragm, realizes the automated job of circular silicon chip inserted sheet in operation.
In order to solve the above technical problems, the technical solution adopted in the utility model is:A kind of automatic circular silicon chip inserting machine,
Including the insert mechanism and grasping mechanism set gradually, wherein:
The insert mechanism, for being separated the silicon chip being stacked together and filling separated silicon chip insertion silicon slice loading
It puts;
The grasping mechanism, for transferring silicon chip loading device.
Preferably, the insert mechanism includes the burst portion, transport part and the insert part that set gradually, wherein,
The silicon chip that the burst portion stacks for separation;
The transport part is used to send the silicon chip separated out through the burst part to the insert part;
The insert part is used for the silicon chip that will be transmitted insertion silicon chip loading device.
Preferably, the burst portion includes being fed groove body in water, and positioning and liter are set gradually in feeder channel body in the water
Falling unit and water outlet slicing apparatus, wherein:
The positioning and lifting gear, using cartridge clip tool locating, for the silicon chip stacked to be navigated to specific bit
It puts;
The water outlet slicing apparatus including rubbing device and sucking device, utilizes frictional force and sorptive force absorption transmission silicon
Piece, for separating circular silicon chip.
Preferably, the insert part includes lifting gear, and the lifting gear connects control system, and the lifting gear is used
Silicon chip loading device is inserted into the silicon chip for conveying the transport part.
Preferably, the burst portion further includes transmitting device, and the transmitting device includes the set gradually first transmission dress
It puts and is arranged on the second transmitting device, a part for first transmitting device inside the feeder channel body and the friction sorption
Device is connected by connector, and another part of first transmitting device is arranged on that the feeder channel is external, and described second passes
Defeated device is connected with the transport part.
Preferably, the connector is the one section of 30 ° of belt and one section of horizontal belt set gradually, the belt of the level
It is connected with first transmitting device, sensor is set on the horizontal belt.
Preferably, the rubbing device uses idler wheel friction, and the bottom of the sucking device sets adsorption hole, the friction
Device is arranged on the side of the sucking device.
Preferably, unloaded cache mechanism is further included, the zero load cache mechanism is arranged in parallel with the transmitting device.
Preferably, switching mechanism is further included, the switching mechanism includes X and driven to clamping device, Z-direction clamping device and rotation
Dynamic device;
The X is to clamping device and the Z-direction clamping device, for that will be equipped with the silicon chip loading device geometrical clamp of silicon chip
Tightly;
The rotating driving device carries out 90 ° of overturnings for that will be equipped with the silicon chip loading device of silicon chip.
Preferably, rack and crawl rotating mechanism are further included, the crawl rotating mechanism includes X and moved to mobile device, Y-direction
Dynamic device, Z-direction mobile device, grabbing device and driving device, the driving device are arranged on the top of the grabbing device, institute
Z-direction mobile device and the grabbing device mobile connection are stated, wherein:
The X is to mobile device in the frame top X to slip;
The Y-direction mobile device is vertically arranged with the X to mobile device, is slided in the frame top Y-direction;
The Z-direction mobile device is slidably connected with the rack vertical direction;
The utility model has the advantages and positive effects of:Due to the adoption of the above technical scheme, circular silicon can be realized
The automated job of piece inserted sheet, solve in the prior art manual burst, inserted sheet silicon chip is polluted, the rupture diaphragm in operation
Problem has the characteristics that stability is high, production capacity is big, saves personnel, has very high practical value.
Description of the drawings
Fig. 1 is the structure diagram of the utility model automatic circular silicon chip inserting machine;
Fig. 2 is the structure diagram of separating mechanism in the utility model water;
Fig. 3 is the utility model switching mechanism schematic diagram;
Fig. 4 is the utility model crawl rotating mechanism schematic diagram.
In figure:
1st, it is fed groove body in water, 2, positioning and lifting gear, 3, water outlet slicing apparatus,
4th, rub sucking device, and 5, unloaded cache mechanism, the 6, first transmitting device,
7th, the second transmitting device, 8, lifting gear, 9, switching mechanism,
10th, grasping mechanism, 11, crawl rotating mechanism,
41st, rubbing device, 42, sucking device, 43,30 ° of belts, 44, sensor,
45th, horizontal belt, 91, X to clamping device, 92, Z-direction clamping device,
93rd, silicon chip loading device, 94, overturning drive device, 111, grabbing device,
112nd, rotating driving device, 113, Z-direction mobile device,
114th, Y-direction mobile device, 115, X is to mobile device.
Specific embodiment
A kind of automatic circular silicon chip inserting machine of this example, the insert mechanism and grasping mechanism set gradually, wherein, plug-in sheet machine
Structure, it is in process of production, excellent for being separated the silicon chip being stacked together and separated silicon chip being inserted into silicon chip loading device
Selection of land, silicon chip stick with silicon chip loading device;Grasping mechanism 10, for transferring fully loaded silicon chip loading device.Insert mechanism includes
Burst portion, transport part and the insert part set gradually, wherein, burst portion is used to separate the silicon chip stacked;It uses transport part
In by separated chip transmission to designated position;Insert part is used for the silicon chip inserted sheet of transport part conveying and fills silicon chip dress
It carries and puts, burst portion includes being fed groove body in water, is fed in water in groove body 1 and sets gradually positioning and lifting gear 2 and go out moisture
Sheet devices 3, wherein, positioning and lifting gear 2 are specified for the silicon chip stacked to be navigated to using cartridge clip tool locating
Position;Water outlet slicing apparatus 3 including rubbing device and sucking device, using frictional force and sorptive force absorption transmission silicon chip, is used for
The circular silicon chip of separation.
As shown in Figure 1, automatic circular silicon chip inserting machine includes rack and is successively set in the water in rack to be fed groove body
1st, transmitting device, lifting gear 8 and grasping mechanism 10 are fed setting position and lifting gear 2, water outlet burst dress in groove body 1 in water
3 and friction sucking device 4 are put, wherein, positioning and lifting gear 2, for the silicon chip stacked to be navigated to designated position;Go out
Moisture sheet devices 3, for separating circular silicon chip;Rub sucking device 4, including rubbing device 41 and sucking device 42, using rubbing
Wipe power and sorptive force absorption transmission silicon chip;Transmitting device is connected with friction sucking device 4 by connector;Lifting gear 8, is used for
The silicon chip that transmitting device conveys is filled into silicon chip loading device, silicon chip loading device is used for holding silicon chip, can select silicon
The piece loading gaily decorated basket or other devices with load function for conveniently holding silicon chip;Grasping mechanism 10, for transferring what is completely had
Silicon chip loading device.
As shown in Fig. 2, positioning and lifting gear 2 use cartridge clip tool locating, rubbing device 41 uses idler wheel friction, sorption
The bottom of device 42 sets adsorption hole, and rubbing device 41 is arranged on the side of sucking device 42, wherein, cartridge clip tool locating and liter
Falling unit 2, water outlet slicing apparatus 3, silicon chip friction sucking device 4 is connected by bolt, and total arrangement is fed groove body 1 in water
Within, meet the needs of burst in water, operation principle is the radial direction side of circular silicon chip of being stacked together using high pressure water flow strikes
To high pressure water flow reduces the negative pressure between piece and piece, under conditions of negative pressure, is utilized between no piece in uppermost circular silicon chip
The impact force of current and the buoyancy of water achieve the purpose that the circular silicon chip of separation.
Unloaded cache mechanism 5 is further included, unloaded cache mechanism 5 is parallel with transmitting device to be arranged in rack, transmission dress
It puts including the first transmitting device 6 and the second transmitting device 7, is connected between the first transmitting device 6 and sucking device 4 by connector
It connects, connector is one section of 30 ° of belt and one section of horizontal belt, and the horizontal belt is connected with the first transmitting device 6, horizontal belt
Upper setting sensor.First transmitting device 6 is arranged to belt transport, and the second transmitting device 7 is arranged to retractable belt transmission, passes
Defeated device 6 and transmitting device 7 are bolted in the rack, can long distance delivery circle silicon chip, it is reserved to meet
The requirement of silicon chip loading device caching number on unloaded cache mechanism 5.
Specifically, using negative pressure between current air-flow elimination disk piece, separate silicon chip above, burst friction roll
Circular silicon chip above is thoroughly broken away from the negative pressure with following silicon chip by wheel mechanism 41 and sucking device 42, passes through 30 degree of skins after burst
Circular silicon chip is promoted to the height for departing from the water surface by tape transport system 43.Burst inspection is carried out using circular silicon chip whether there is sensor 44
Know, the fixed number of seconds that is delayed both had been alarmed without silicon chip warns operator to exchange cartridge clip.It is fragmented and departs from the circular silicon chip of the water surface
Transmitting device 6 and transmitting device 7 are transmitted to by circular silicon wafer horizontal transmission belt 45 until being transferred in silicon chip loading device.
As shown in figure 3, further including switching mechanism 9, switching mechanism 9 includes X to clamping device 91,92 and of Z-direction clamping device
Rotating driving device 94;X is to clamping device 91 and Z-direction clamping device 92, for the silicon chip loading device for filling silicon chip to be fixed
It clamps;Rotating driving device carries out 90 ° for that will expire silicon chip loading device.
Specifically, the silicon chip loading device of this example uses silicon slice loading piece basket, and overturning will be scalable by lifting gear 8
Belt transmission device 7 is conveyed through the circular silicon chip come and fills piece basket according to setting pitch.Fill the silicon chip loading device 93 of silicon chip
Can the full piece basket that be stood up by being fixed on the grasping mechanism 10 of device framework be transferred to switching mechanism 9, switching mechanism using X to
Clamping device 91 and Z-direction clamping device 92 step up the silicon chip loading device 93 for filling circular silicon chip fixation, are driven using overturning
Device 94, which to the full piece basket for standing up state turn over, turn 90 degrees overturning, and the piece stood up basket is made to be changed to horizontal positioned piece basket.Most
It is held in the mouth afterwards by capturing rotating mechanism 11 and horizontal direction being had rotated 90 degree of full piece basket and captured to automatic circular silicon chip inserting machine
On the cleaning machine buffer storage connect.
As shown in figure 4, further including crawl rotating mechanism 11, the top of crawl rotating mechanism 11 is connected with frame top, is grabbed
Rotating mechanism 11 is taken to include grabbing device 111 and driving device 112, driving device 112 is arranged on 111 top of grabbing device, grabs
Device is taken to be used for capturing the silicon chip loading device for filling silicon chip, crawl rotating mechanism 11 further includes X and moved to mobile device 115, Y-direction
Dynamic device 114 and Z-direction mobile device 113, Z-direction mobile device 113 and 111 mobile connection of grabbing device, X is to mobile device 115
In frame top X to slip, Y-direction mobile device 114 is slided in frame top Y-direction, and Z-direction mobile device 113 is square vertically with rack
To being slidably connected.
Specifically, by Z-direction mobile device 113, Y-direction mobile device 114, X is to mobile device 115 by grabbing device 111
It is moved at silicon wafer turnover device, horizontal positioned silicon chip loading device is held into fixation, the driving of rotating driving device 112 is firmly grasped
Horizontal direction be rotated by 90 °, and again by Z-direction mobile device 113, Y-direction mobile device 114, X will turn to mobile device 115
The silicon chip loading device become better is placed on the cleaning machine buffer storage being connected with automatic circular silicon chip inserting machine.
The course of work of this example:First, the cartridge clip supplied materials for filling circular silicon chip is placed on cartridge clip frock and determined by operating personnel
On position and lifting gear 2, silicon chip can be separated the circular silicon chip being stacked together by water outlet slicing apparatus 3, be recycled
Silicon chip is delivered on belt transmission device 6 by silicon chip friction sucking device 4, is justified monolithic by retractable belt transmitting device 7
Shape silicon chip fills piece basket according to setting pitch.What the piece basket filled can be stood up by being fixed on the grasping mechanism 10 of device framework
Full piece basket is transferred to switching mechanism 9, and passes through switching mechanism 9 and 90 degree of overturnings are carried out to full piece basket, fills the silicon slice loading stood up
It puts and is changed to horizontal positioned silicon chip loading device.Horizontal direction is had rotated 90 degree finally by full basket crawl rotating mechanism 11
Full basket capture to the cleaning machine buffer storage being connected with automatic circular silicon chip inserting machine.
The beneficial effects of the utility model are:
1. be fed groove body and positioning and lifting gear in water by setting, it is stacked together circle using high pressure water flow strikes
The radial direction of silicon chip, high pressure water flow reduce the negative pressure between piece and piece, in uppermost circular silicon chip negative pressure between no piece
Under conditions of, achieve the purpose that the circular silicon chip of separation using the impact force of current and the buoyancy of water.
2. by the effect of water outlet slicing apparatus and friction sucking device, using sorptive force and rubbed by separated circular silicon chip
It wipes power and is sent to transmission belt, be finally delivered in silicon chip loading device, during burst, caused by slipping up except manual work
The high loss of fragment rate, stability is high, saves manpower, and wafer contamination caused by also can avoiding manual working has very high reality
With value.
3. the silicon chip loading device of circular silicon chip will be filled by electric turnover mechanism, by cube silicon chip loading device turn over
Go to horizontal direction.The silicon chip loading device of horizontal direction is rotated by 90 ° direction in the same plane by rotating device, and by
The silicon chip loading device rotated is placed on the cleaning machine caching being connected with automatic circular silicon chip inserting machine by end grabbing device
On device, other equipment can be taken into account simultaneously and be made by reducing manual operation amount and operation intensity, operator using equipment automatization
Industry reduces personnel amount and personnel cost.
4. by being fed groove body, positioning and lifting gear, water outlet slicing apparatus, friction sucking device, transmitting device in water
And the cooperation of lifting gear, turnover device and full blue crawl rotating mechanism, reduce manual operation amount and work using equipment automatization
Industry intensity, operator can take into account other equipment and carry out operation simultaneously, reduce personnel amount and personnel cost.Eliminate manual work
The high loss of fragment rate caused by error, wafer contamination caused by also can avoiding manual working have production capacity high, and production cost is low
The advantages of.
One embodiment of the utility model is described in detail above, but the content is only the utility model
Preferred embodiment, it is impossible to be construed as limiting the scope of the utility model.It is all to be made according to application scope of the utility model
All the changes and improvements etc., should all still belong within the patent covering scope of the utility model.
Claims (10)
1. a kind of automatic circular silicon chip inserting machine, which is characterized in that including the insert mechanism and grasping mechanism set gradually,
In:
The insert mechanism, for being separated the silicon chip being stacked together and separated silicon chip being inserted into silicon chip loading device;
The grasping mechanism, for transferring silicon chip loading device.
2. a kind of automatic circular silicon chip inserting machine according to claim 1, it is characterised in that:The insert mechanism include according to
Burst portion, transport part and the insert part of secondary setting, wherein,
The silicon chip that the burst portion stacks for separation;
The transport part is used to send the silicon chip separated out through the burst part to the insert part;
The insert part is used for the silicon chip that will be transmitted insertion silicon chip loading device.
3. a kind of automatic circular silicon chip inserting machine according to claim 2, which is characterized in that the burst portion is included in water
Groove body is fed, sets gradually positioning and lifting gear and water outlet slicing apparatus in feeder channel body in the water, wherein:
The positioning and lifting gear, using cartridge clip tool locating, for the silicon chip stacked to be navigated to designated position;
The water outlet slicing apparatus including rubbing device and sucking device, using frictional force and sorptive force absorption transmission silicon chip, is used
In the circular silicon chip of separation.
4. a kind of automatic circular silicon chip inserting machine according to claim 2, it is characterised in that:The insert part includes lifting
Device, the lifting gear connect control system, and the lifting gear is used for the silicon chip for conveying the transport part and is inserted into
Silicon chip loading device.
5. a kind of automatic circular silicon chip inserting machine according to claim 3, it is characterised in that:The burst portion further includes biography
Defeated device, the transmitting device include the first transmitting device and the second transmitting device that set gradually, first transmitting device
A part be arranged on inside the feeder channel body and be connected with the sucking device by connector, first transmitting device
Another part is arranged on that the feeder channel is external, and second transmitting device is connected with the transport part.
6. a kind of automatic circular silicon chip inserting machine according to claim 5, it is characterised in that:The connector is to set successively
The one section of 30 ° of belt put and one section of horizontal belt, the belt of the level are connected with first transmitting device, the horizontal skin
Take setting sensor.
7. a kind of automatic circular silicon chip inserting machine according to claim 3, it is characterised in that:The rubbing device is using rolling
Wheel friction, the bottom of the sucking device set adsorption hole, and the rubbing device is arranged on the side of the sucking device.
8. a kind of automatic circular silicon chip inserting machine according to claim 5, it is characterised in that:Further include unloaded caching machine
Structure, the zero load cache mechanism are arranged in parallel with the transmitting device.
9. a kind of automatic circular silicon chip inserting machine according to claim 1, it is characterised in that:Switching mechanism is further included, institute
Stating switching mechanism includes X to clamping device, Z-direction clamping device and rotating driving device;
The X is to clamping device and the Z-direction clamping device, for the silicon chip loading device that silicon chip is housed to be fixed to clamp;
The rotating driving device carries out 90 ° of overturnings for that will be equipped with the silicon chip loading device of silicon chip.
10. a kind of automatic circular silicon chip inserting machine according to claim 9, which is characterized in that further include rack and crawl
Rotating mechanism, the crawl rotating mechanism include X to mobile device, Y-direction mobile device, Z-direction mobile device, grabbing device and drive
Dynamic device, the driving device are arranged on the top of the grabbing device, and the Z-direction mobile device is moved with the grabbing device
Connection, wherein:
The X is to mobile device in the frame top X to slip;
The Y-direction mobile device is vertically arranged with the X to mobile device, is slided in the frame top Y-direction;
The Z-direction mobile device is slidably connected with the rack vertical direction.
Priority Applications (1)
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CN201721238235.XU CN207398079U (en) | 2017-09-26 | 2017-09-26 | Automatic circular silicon chip inserting machine |
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CN201721238235.XU CN207398079U (en) | 2017-09-26 | 2017-09-26 | Automatic circular silicon chip inserting machine |
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CN207398079U true CN207398079U (en) | 2018-05-22 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109560005A (en) * | 2017-09-26 | 2019-04-02 | 天津环鑫科技发展有限公司 | Automatic circular silicon chip inserting machine |
CN113745143A (en) * | 2021-11-04 | 2021-12-03 | 天津环博科技有限责任公司 | Automatic inserting mechanism for arranging silicon wafers |
-
2017
- 2017-09-26 CN CN201721238235.XU patent/CN207398079U/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109560005A (en) * | 2017-09-26 | 2019-04-02 | 天津环鑫科技发展有限公司 | Automatic circular silicon chip inserting machine |
CN113745143A (en) * | 2021-11-04 | 2021-12-03 | 天津环博科技有限责任公司 | Automatic inserting mechanism for arranging silicon wafers |
CN113745143B (en) * | 2021-11-04 | 2022-01-28 | 天津环博科技有限责任公司 | Automatic inserting mechanism for arranging silicon wafers |
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