CN109560004A - A kind of automatic circular silicon chip inserting machine structure - Google Patents
A kind of automatic circular silicon chip inserting machine structure Download PDFInfo
- Publication number
- CN109560004A CN109560004A CN201710879212.5A CN201710879212A CN109560004A CN 109560004 A CN109560004 A CN 109560004A CN 201710879212 A CN201710879212 A CN 201710879212A CN 109560004 A CN109560004 A CN 109560004A
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- silicon wafer
- silicon chip
- machine structure
- inserting machine
- transmitting device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a kind of automatic circular silicon chip inserting machine structure, including fragment portion, transport part and the insert part set gradually, wherein fragment portion is for separating the silicon wafer stacked；Transport part is used for transmission the silicon wafer of separation；The silicon wafer insertion silicon chip loading device that insert part is used to transmit.The beneficial effects of the invention are as follows solving the problems, such as that manual fragment, inserted sheet pollute silicon wafer in the prior art, the rupture diaphragm in operation, the automated job of round silicon wafer inserted sheet is realized.
Description
Technical field
The invention belongs to semi-conductor silicon chip manufacturing machine technical fields, more particularly, to a kind of automatic circular silicon chip inserting machine
Structure.
Background technique
Monocrystalline silicon is cut by line, after degumming cleaning and alkali corruption process in existing technology, needs manual working will be round
Silicon wafer is inserted into silicon chip loading device, and to carry out lower road washing and cleaning operation, manual fragment, inserted sheet will cause wafer contamination, and
And fragmentation easily occurs in operation.Semi-conductor silicon chip has strict requirements for the granularity on surface, what manual working generated
Secondary pollution does not adapt to the demand of production, under the rapid overall situation of industrial development, with the development of semicon industry, with
And personal expenditures is incremental, is badly in need of a kind of current manual inserted sheet shape of semiconductor circle silicon wafer of automatic circular silicon chip inserting machine structure substitution
Formula, to adapt to industrial development trend.
Summary of the invention
The present invention provides a kind of automatic circular silicon chip inserting machine structure, it is therefore an objective to solve in the prior art manual fragment, insert
Piece pollutes silicon wafer, the problem of rupture diaphragm, realizes the automated job of round silicon wafer inserted sheet in operation.
In order to solve the above technical problems, the technical solution adopted by the present invention is that: a kind of automatic circular silicon chip inserting machine structure, packet
Include fragment portion, transport part and the insert part set gradually, in which:
The fragment portion is for separating the silicon wafer stacked；
The transport part is used to send the silicon wafer separated out through the fragment part to the insert part；
The silicon wafer insertion silicon chip loading device that the insert part is used to transmit.
Preferably, the fragment portion includes that groove body is fed in water, sets gradually positioning and liter in the water in feeder channel body
Falling unit and water outlet slicing apparatus, wherein
The positioning and lifting device, for the silicon wafer stacked to be navigated to designated position；
The water outlet slicing apparatus, for separating round silicon wafer.
Preferably, the insert part includes lifting device, and the lifting device connects control system, and the lifting device is used
Silicon chip loading device is inserted into the silicon wafer for conveying transmitting device.
Preferably, the water outlet slicing apparatus includes friction sucking device, and the friction sucking device includes rubbing device
And sucking device, utilize frictional force and sorptive force absorption transmission silicon wafer.
Preferably, the fragment portion further includes transmitting device, and a part of the transmitting device is arranged in the feeder channel
Internal portion is connect with the friction sucking device by connector, and another part of the transmitting device is arranged in the feeder channel
It is connect in vitro with the transport part.
Preferably, the transmitting device include the first transmitting device and the second transmitting device, first transmitting device with
The sucking device is connected by connector.
Preferably, the connector is the one section of 30 ° of belt and one section of horizontal belt set gradually, the belt of the level
It is connect with first transmitting device, sensor is set on the horizontal belt.
Preferably, the positioning and lifting device use cartridge clip tool locating.
Preferably, the rubbing device uses idler wheel friction, and adsorption hole, the friction is arranged in the bottom of the sucking device
The side of the sucking device is arranged in device.
Preferably, first transmitting device is set as belt transport, and second transmitting device is set as scalable skin
Band transmission, first transmitting device and second transmitting device are bolted on silicon wafer carrying platform.
The advantages and positive effects of the present invention are:
1. by being fed groove body and positioning and lifting device in setting water, it is stacked together circle using high pressure water flow strikes
The radial direction of silicon wafer, high pressure water flow reduce the negative pressure between piece and piece, in uppermost round silicon wafer negative pressure between no piece
Under conditions of, achieve the purpose that separate round silicon wafer using the impact force of water flow and the buoyancy of water.
2. the round silicon wafer separated is using sorptive force and rubs by the effect of water outlet slicing apparatus and the sucking device that rubs
It wipes power and is sent to transmission belt, be finally delivered in silicon chip loading device, can be realized the automated job of round silicon wafer inserted sheet,
Solve the problems, such as that manual fragment, inserted sheet pollute silicon wafer in the prior art, the rupture diaphragm in operation, fragment and inserted sheet
In the process, stability is high, saves manpower, has very high practical value.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of automatic circular silicon chip inserting machine of the present invention；
Fig. 2 is the structural schematic diagram in fragment portion of the present invention；
Fig. 3 is automatic circular silicon chip inserting machine turnover mechanism schematic diagram of the present invention；
Fig. 4 is automatic circular silicon chip inserting machine crawl rotating mechanism schematic diagram of the present invention.
In figure:
1, it is fed groove body in water, 2, positioning and lifting device, 3, water outlet slicing apparatus,
4, rub sucking device, 5, unloaded cache mechanism, the 6, first transmitting device,
7, the second transmitting device, 8, lifting device, 9, turnover mechanism,
10, grasping mechanism, 11, crawl rotating mechanism,
41, rubbing device, 42, sucking device, 43,30 ° of belts, 44, sensor,
45, horizontal belt, 91, X to clamping device, 92, Z-direction clamping device,
93, silicon chip loading device, 94, overturning drive device, 111, grabbing device,
112, rotation drive device, 113, Z-direction mobile device,
114, Y-direction mobile device, 115, X is to mobile device.
Specific embodiment
As shown in Figure 1, a kind of automatic circular silicon chip inserting machine structure of this example, including fragment portion, the transport part set gradually
And insert part, wherein fragment portion is for separating the silicon wafer stacked；Transport part through the silicon wafer that fragment part separates out for that will pass
Give insert part；The silicon wafer insertion silicon chip loading device that insert part is used to transmit, this automatic circular silicon chip inserting machine structure
For automatic circular silicon chip inserting machine, fragment portion includes feed groove body 1 in water, is fed in groove body 1 in water and sets gradually positioning
And lifting device 2 and water outlet slicing apparatus 3, wherein positioning and lifting device 2, for the silicon wafer stacked to be navigated to finger
Positioning is set；It is discharged slicing apparatus 3, for separating round silicon wafer, insert part includes lifting device 8, the connection control of lifting device 8 system
System, the silicon wafer that lifting device 8 is used to convey transmitting device is inserted into silicon chip loading device, in the actual production process, excellent
Selection of land, silicon chip loading device fill silicon wafer.
Automatic circular silicon chip inserting machine include rack and setting gradually be fed in water on the rack groove body 1, transmitting device,
Lifting device 8 and grasping mechanism 10, setting position and lifting device 2, water outlet slicing apparatus 3 and friction are inhaled in feed groove body 1 in water
Device 4, wherein positioning and lifting device 2, for the silicon wafer stacked to be navigated to designated position；It is discharged slicing apparatus
3, for separating round silicon wafer；Rub sucking device 4, including rubbing device 41 and sucking device 42, utilizes frictional force and sorption
Power absorption transmission silicon wafer；Transmitting device is connect with friction sucking device 4 by connector；Lifting device 8 is used for transmitting device
The silicon wafer of conveying fills silicon chip loading device, and silicon chip loading device is used to hold silicon wafer, and silicon slice loading can be selected to spend
Basket or other devices with load function for conveniently holding silicon wafer；Grasping mechanism 10, for transferring the silicon wafer dress that silicon wafer is housed
It carries and sets.
As shown in Fig. 2, positioning and lifting device 2 use cartridge clip tool locating, rubbing device 41 uses idler wheel friction, sorption
Adsorption hole is arranged in the bottom of device 42, and the side of sucking device 42 is arranged in rubbing device 41, wherein cartridge clip tool locating and liter
Falling unit 2 is discharged slicing apparatus 3, and silicon wafer rubs sucking device 4 by bolt linking, and total arrangement is fed groove body 1 in water
Within, meet the needs of fragment in water, working principle is, is stacked together the radial direction side of round silicon wafer using high pressure water flow strikes
To high pressure water flow reduces the negative pressure between piece and piece, under conditions of negative pressure, utilizes between no piece in uppermost round silicon wafer
The impact force of water flow and the buoyancy of water achieve the purpose that separate round silicon wafer.
It further include unloaded cache mechanism 5, unloaded cache mechanism 5 is parallel with transmitting device to be arranged on the rack, transmission dress
It sets including the first transmitting device 6 and the second transmitting device 7, is connected between the first transmitting device 6 and sucking device 4 by connector
It connects, connector is one section of 30 ° of belt and one section of horizontal belt, and the horizontal belt is connect with the first transmitting device 6, horizontal belt
Upper setting sensor.First transmitting device 6 is set as belt transport, and the second transmitting device 7 is set as retractable belt transmission, passes
Defeated device 6 is bolted on silicon wafer carrying platform with transmitting device 7, can long distance delivery circle silicon wafer, to meet
The requirement of silicon chip loading device caching number on reserved zero load cache mechanism 5.
Specifically, using negative pressure between water flow air-flow elimination disk piece, separate silicon wafer above, fragment friction roll
It takes turns mechanism 41 and sucking device 42 and round silicon wafer above is thoroughly got rid of into the negative pressure with following silicon wafer, pass through 30 degree of skins after fragment
Round silicon wafer is promoted to the height for being detached from the water surface by tape transport system 43.Using round silicon wafer, whether there is or not sensors 44 to carry out fragment inspection
Know, the fixed number of seconds that is delayed exchanges cartridge clip without silicon wafer both alarm warning operator.It is fragmented and is detached from the round silicon wafer of the water surface
Transmitting device 6 and transmitting device 7 are transmitted to by round silicon wafer horizontal transmission belt 45 until being transferred in silicon chip loading device.
As shown in figure 3, further include turnover mechanism 9, turnover mechanism 9 includes X to clamping device 91,92 and of Z-direction clamping device
Rotation drive device 94；X is to clamping device 91 and Z-direction clamping device 92, for that will be equipped with or fill the silicon slice loading of silicon wafer
Device fixes to clamp；Rotation drive device carries out 90 ° for that will be equipped with or fill silicon chip loading device.
Specifically, the silicon chip loading device of this example uses silicon slice loading piece basket, and overturning will be scalable by lifting device 8
Belt transmission device 7 is conveyed through the round silicon wafer come and fills piece basket according to setting pitch.Fill the silicon chip loading device 93 of silicon wafer
Device can be filled by being fixed on 10 silicon wafers stood up of grasping mechanism of device framework and be transferred to turnover mechanism 9, turnover mechanism
The silicon chip loading device 93 for filling round silicon wafer fixation is stepped up to clamping device 91 and Z-direction clamping device 92 using X, using turning over
Rotary driving device 94, which turn over to the full piece basket for the state that stands up, turn 90 degrees overturning, and the piece basket stood up is made to be changed to horizontal positioned piece
Basket.Finally by crawl rotating mechanism 11 by the full piece basket that horizontal direction has rotated 90 degree grab to automatic circular silicon wafer inserted sheet
On the cleaning machine buffer storage of machine linking.
As shown in figure 4, further including crawl rotating mechanism 11, the top of crawl rotating mechanism 11 connect with frame top, grabs
Taking rotating mechanism 11 includes grabbing device 111 and driving device 112, and the setting of driving device 112 is grabbed at 111 top of grabbing device
Device is taken to be used to grab the silicon chip loading device for filling silicon wafer, crawl rotating mechanism 11 further includes that X is moved to mobile device 115, Y-direction
Dynamic device 114 and Z-direction mobile device 113, Z-direction mobile device 113 and 111 mobile connection of grabbing device, X is to mobile device 115
In frame top X to sliding, Y-direction mobile device 114 is slided in frame top Y-direction, and Z-direction mobile device 113 and rack are square vertically
To being slidably connected.
Specifically, by Z-direction mobile device 113, Y-direction mobile device 114, X is to mobile device 115 by grabbing device 111
It is moved at silicon wafer turnover device, horizontal positioned silicon chip loading device is held into fixation, the driving of rotation drive device 112 is firmly grasped
Horizontal direction be rotated by 90 °, and again by Z-direction mobile device 113, Y-direction mobile device 114, X will turn to mobile device 115
The silicon chip loading device become better is placed on the cleaning machine buffer storage being connected with automatic circular silicon chip inserting machine.
The course of work of this example: determine firstly, the cartridge clip supplied materials equipped with round silicon wafer is placed on cartridge clip tooling by operator
On position and lifting device 2, silicon wafer can be separated the round silicon wafer being stacked together by water outlet slicing apparatus 3, be recycled
Silicon wafer is delivered on belt transmission device 6 by silicon wafer friction sucking device 4, by retractable belt transmitting device 7 that monolithic is round
Shape silicon wafer fills piece basket according to setting pitch.The piece basket filled can be stood up by being fixed on grasping mechanism 10 of device framework
Full piece basket is transferred to turnover mechanism 9, and carries out 90 degree of overturnings to full piece basket by turnover mechanism 9, fills the silicon slice loading stood up
It sets and is changed to horizontal positioned silicon chip loading device.Horizontal direction is had rotated 90 degree finally by full basket crawl rotating mechanism 11
Full basket grab to the cleaning machine buffer storage being connected with automatic circular silicon chip inserting machine.
The beneficial effects of the present invention are:
1. by being fed groove body and positioning and lifting device in setting water, it is stacked together circle using high pressure water flow strikes
The radial direction of silicon wafer, high pressure water flow reduce the negative pressure between piece and piece, in uppermost round silicon wafer negative pressure between no piece
Under conditions of, achieve the purpose that separate round silicon wafer using the impact force of water flow and the buoyancy of water.
2. the round silicon wafer separated is using sorptive force and rubs by the effect of water outlet slicing apparatus and the sucking device that rubs
It wipes power and is sent to transmission belt, be finally delivered in silicon chip loading device, during fragment, except caused by manual work fault
The high loss of fragment rate, stability is high, saves manpower, also can avoid wafer contamination caused by manual working, has very high reality
With value.
3. by the silicon chip loading device equipped with round silicon wafer by electric turnover mechanism, by cube silicon chip loading device turn over
Go to horizontal direction.The silicon chip loading device of horizontal direction is rotated by 90 ° direction in the same plane by rotating device, and by
The silicon chip loading device rotated is placed on the cleaning machine caching being connected with automatic circular silicon chip inserting machine by end grabbing device
On device, other equipment can be combined and be made by reducing manual operation amount and operation intensity, operator using equipment automatization
Industry reduces personnel amount and personnel cost.
4. by being fed groove body, positioning and lifting device, water outlet slicing apparatus, friction sucking device, transmitting device in water
And lifting device, turnover device and the cooperation for grabbing rotating mechanism, manual operation amount is reduced using equipment automatization and operation is strong
Degree, operator can combine other equipment and carry out operation, reduce personnel amount and personnel cost.Eliminate manual work fault
Caused by the high loss of fragment rate, also can avoid wafer contamination caused by manual working, have that production capacity is high, low excellent of production cost
Point.
One embodiment of the present invention has been described in detail above, but the content is only preferable implementation of the invention
Example, should not be considered as limiting the scope of the invention.It is all according to all the changes and improvements made by the present patent application range
Deng should still be within the scope of the patent of the present invention.
Claims (10)
1. a kind of automatic circular silicon chip inserting machine structure, which is characterized in that including fragment portion, transport part and the inserted sheet set gradually
Portion, in which:
The fragment portion is for separating the silicon wafer stacked；
The transport part is used to send the silicon wafer separated out through the fragment part to the insert part；
The silicon wafer insertion silicon chip loading device that the insert part is used to transmit.
2. a kind of automatic circular silicon chip inserting machine structure according to claim 1, it is characterised in that: the fragment portion includes water
Middle feed groove body sets gradually positioning and lifting device and water outlet slicing apparatus in the water in feeder channel body, wherein
The positioning and lifting device, for the silicon wafer stacked to be navigated to designated position；
The water outlet slicing apparatus, for separating round silicon wafer.
3. a kind of automatic circular silicon chip inserting machine structure according to claim 1, it is characterised in that: the insert part includes rising
Falling unit, the lifting device connect control system, and the silicon wafer that the lifting device is used to convey transmitting device is inserted into
Silicon chip loading device.
4. a kind of automatic circular silicon chip inserting machine structure according to claim 2, it is characterised in that: the water outlet slicing apparatus
Including the sucking device that rubs, the friction sucking device includes rubbing device and sucking device, is inhaled using frictional force and sorptive force
Attached transmission silicon wafer.
5. a kind of automatic circular silicon chip inserting machine structure according to claim 4, it is characterised in that: the fragment portion further includes
Transmitting device, a part setting of the transmitting device, which passes through inside the feeder channel body with the friction sucking device, to be connect
Another part setting of part connection, the transmitting device is connect with the transport part in vitro in the feeder channel.
6. a kind of automatic circular silicon chip inserting machine structure according to claim 5, it is characterised in that: the transmitting device includes
The first transmitting device and the second transmitting device set gradually, first transmitting device and the sucking device pass through connector
Connection.
7. a kind of automatic circular silicon chip inserting machine structure according to claim 6, it is characterised in that: the connector is successively
One section of 30 ° of belt being arranged and one section of horizontal belt, the belt of the level are connect with first transmitting device, the level
Sensor is set on belt.
8. -7 any a kind of automatic circular silicon chip inserting machine structure according to claim 1, it is characterised in that: the positioning and
Lifting device uses cartridge clip tool locating.
9. a kind of automatic circular silicon chip inserting machine structure according to claim 4, it is characterised in that: the rubbing device uses
Adsorption hole is arranged in the bottom of idler wheel friction, the sucking device, and the side of the sucking device is arranged in the rubbing device.
10. a kind of automatic circular silicon chip inserting machine structure according to claim 6 or 7, it is characterised in that: first transmission
Device is set as belt transport, and second transmitting device is set as retractable belt transmission, first transmitting device and institute
The second transmitting device is stated to be bolted on silicon wafer carrying platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710879212.5A CN109560004A (en) | 2017-09-26 | 2017-09-26 | A kind of automatic circular silicon chip inserting machine structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710879212.5A CN109560004A (en) | 2017-09-26 | 2017-09-26 | A kind of automatic circular silicon chip inserting machine structure |
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| Publication Number | Publication Date |
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| CN109560004A true CN109560004A (en) | 2019-04-02 |
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| CN201710879212.5A Pending CN109560004A (en) | 2017-09-26 | 2017-09-26 | A kind of automatic circular silicon chip inserting machine structure |
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