CN202414765U - Silicon wafer transportation mechanism of automatic loading and unloading system of plate type PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment - Google Patents
Silicon wafer transportation mechanism of automatic loading and unloading system of plate type PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment Download PDFInfo
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- CN202414765U CN202414765U CN2011205725911U CN201120572591U CN202414765U CN 202414765 U CN202414765 U CN 202414765U CN 2011205725911 U CN2011205725911 U CN 2011205725911U CN 201120572591 U CN201120572591 U CN 201120572591U CN 202414765 U CN202414765 U CN 202414765U
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Abstract
The utility model provides a silicon wafer transportation mechanism of an automatic loading and unloading system of plate type PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment. The silicon wafer transportation mechanism can transport silicon wafers from a rack to a wafer-discharge carbon plate and can also transport the treated silicon wafer on the wafer-discharge carbon plate to an unloading device. The silicon wafer transportation mechanism has the advantages of high working efficiency, reliable silicon wafer transportation and low fragment rate. The silicon wafer transportation mechanism is characterized by comprising a linear guide rail, a loading transportation mechanism and an unloading transportation mechanism, wherein both the loading transportation mechanism and the unloading transportation mechanism comprise linear modules and transportation cross beams, couplings of the linear modules are provided with servo motors, and the linear modules are installed on a linear module support; and the linear guide rail is fixed on the linear module support and is parallel to the linear modules, one end of each transportation cross beam is installed on the linear module via a linear module connecting plate, the other end of the transportation cross beam is installed on the linear guide rail via a sliding block, and the outer side wall of the transportation cross beam is provided with a silicon wafer pick-up device.
Description
Technical field
The utility model relates to the automation loading and unloading equipment technology field of board-like PECVD equipment, is specially a kind of silicon wafer carrying structure of board-like PECVD equipment automatic loading and unloading system.
Background technology
Mostly the silicon chip material loading of board-like in the past PECVD equipment is silicon chip is directly taken out in manual work from silicon box after orderly arrangement of silicon chip to be placed the slice carbon plate; By the slice carbon plate silicon chip being sent into PECVD equipment from inlet point again handles; And the blanking of silicon chip also is will put into silicon box from the silicon chip of processing on the slice carbon plate that PECVD equipment discharging opening transports out by manual work; Not only inefficiency, the labor strength of silicon chip loading and unloading is big for it; And the fragment rate of silicon chip is high in the loading and unloading process; Productive costs is high, therefore progressively adopts full automatic slice mechanism that silicon chip is taken out and arranges from silicon box now and is positioned on the silicon chip bin, and this is carried to the silicon chip on the silicon chip bin on the slice carbon plate with regard to needing further Handling device; By the slice carbon plate silicon chip is sent into PECVD equipment from inlet point and handle, the silicon chip of having handled on the slice carbon plate that also needs simultaneously to see off from PECVD equipment discharging opening is carried to the blanking platform of silicon chip.
Summary of the invention
To the problems referred to above; The utility model provides a kind of silicon wafer carrying structure of board-like PECVD equipment automatic loading and unloading system; It can be carried to the slice carbon plate from bin with silicon chip; Simultaneously can the silicon chip of having handled on the slice carbon plate be carried to blanking device, its high efficiency, the silicon chip carrying is reliable, fragment rate is low.
Its technical scheme is such; It is characterized in that: it comprises line slideway, material loading carrying mechanism and blanking carrying mechanism; Said material loading carrying mechanism and blanking carrying mechanism include straight line module and carrying crossbeam; Said straight line module is coupling servomotor is installed, and said straight line module is installed on straight line module support, and said line slideway is fixed in line slideway support and parallel with said straight line module; Said carrying crossbeam one end through straight line module connecting panel be installed on said straight line module, the other end is installed on said line slideway through slide block, the lateral wall of said carrying crossbeam is equipped with the silicon chip pickup device.
It is further characterized in that: the straight line module of said material loading carrying mechanism and the staggered parallel said straight line module support that is installed on of the straight line module of blanking carrying mechanism; The carrying crossbeam of said material loading carrying mechanism and the parallel dorsad installation of the carrying crossbeam of said blanking carrying mechanism; Said silicon chip pickup device comprises the gentle sucker that revolves of pneumatic slide unit; Said cyclone sucker is fixed in sucker through the sucker adapter plate installs crossbeam; Said sucker is installed crossbeam and is installed on said pneumatic slide unit through pneumatic slide unit connecting panel, and said pneumatic slide unit is fixed in the lateral wall of said carrying crossbeam; Said sucker is installed on the crossbeam six cyclone suckers is installed, and said six cyclone suckers are uniformly distributed in said sucker crossbeam is installed.
Adopt the silicon chip carrying of a kind of board-like PECVD equipment automatic loading and unloading system of the utility model mechanism; Its beneficial effect is: it comprises material loading carrying mechanism and blanking carrying mechanism; The silicon chip that the blanking carrying mechanism has been handled on can be with the slice carbon plate when the material loading carrying mechanism is carried to untreated silicon chip on the slice carbon plate is carried to the blanking platform, thereby can improve the loading and unloading efficient of silicon chip greatly; Simultaneously, the silicon chip pickup device that is installed on the carrying crossbeam adopts the cyclone Acetabula device, and it can draw and place silicon chip reliably, reduces silicon chip and in handling process, damages, and reduces fragment rate, reduces production costs.
Description of drawings
Fig. 1 is the silicon wafer carrying structure structural representation of a kind of board-like PECVD equipment automatic loading and unloading system of the utility model.
The specific embodiment
See Fig. 1; It comprises line slideway 11, material loading carrying mechanism and blanking carrying mechanism the utility model; The material loading carrying mechanism comprises straight line module 1 and carrying crossbeam 2; The blanking carrying mechanism comprises straight line module 15 and carrying crossbeam 14; Straight line module 1,15 all is coupling servomotor 4 is installed, and straight line module 1,15 is installed on straight line module support 13, and line slideway 11 is fixed in line slideway support 12 and parallel with straight line module 1,15; One end of carrying crossbeam 2,14 is installed on straight line module 1 and 15, the other end through straight line module connecting panel 3 correspondences respectively and all is installed on line slideway 11 through slide block 10, and the lateral wall of carrying crossbeam 2,14 is equipped with the silicon chip pickup device.The straight line module 1 of material loading carrying mechanism and the straight line module of the blanking carrying mechanism 15 staggered parallel straight line module supports 13 that are installed on; The carrying crossbeam 2 of material loading carrying mechanism and the parallel dorsad installation of the carrying crossbeam 14 of blanking carrying mechanism; The silicon chip pickup device comprises pneumatic slide unit 9 and cyclone sucker 6; Cyclone sucker 6 is fixed in sucker through sucker adapter plate 5 installs crossbeam 7; Sucker is installed crossbeam 7 and is installed on pneumatic slide unit 9 through pneumatic slide unit connecting panel 8, and pneumatic slide unit 9 is fixed in the lateral wall of carrying crossbeam 2; 6, six cyclone suckers 6 of six cyclone suckers are installed on the sucker installation crossbeam 7 are uniformly distributed in sucker installation crossbeam 7.In the utility model in the silicon chip pickup device quantity of cyclone sucker can require to adjust according to actual production.When the utility model device is installed and used; It laterally is across silicon chip material loading platform, slice carbon plate mechanism, the silicon chip blanking flat-bed top of board-like PECVD equipment automatic loading/unloading machine, and wherein silicon chip material loading platform and silicon chip blanking platform are positioned at the transverse ends subordinate side of the utility model device, the lateral center below that slice carbon plate mechanism is positioned at the utility model device.
Specifically describe the working process of the utility model below: the carrying crossbeam 2 of material loading carrying mechanism the effect lower edge of servomotor 4, straight line module 1 line slideway 11 be moved horizontally to line slideway 11 the end, wait to carry above the silicon chip; The cyclone sucker 6 of pneumatic slide unit 9 actions, driving and its connection moves downward and makes cyclone sucker 6 and silicon chip approaching; 6 ventilations of cyclone sucker, absorption silicon chip; Servomotor 4, straight line module 1 drive carrying crossbeam 2 and move directly over the slice carbon plate to the by-level of line slideway 11 then; Pneumatic slide unit 9 drives cyclone suckers 6 makes silicon chip and slice carbon plate approaching downwards; Cyclone sucker 6 is died, and silicon chip promptly is placed on the slice carbon plate; When carrying out silicon chip blanking carrying; The carrying crossbeam 14 in the middle of the effect lower edge of servomotor 4, straight line module 15 line slideway 11 is moved horizontally to line slideway, the slice carbon plate above; The cyclone sucker 6 of pneumatic slide unit 9 actions, driving and its connection moves downward and makes cyclone sucker 6 and silicon chip approaching on the carrying crossbeam 14; Cyclone sucker 6 is ventilated and is drawn silicon chip then; Then servomotor 4, straight line module 15 drive carrying crossbeams 14 directly over the end of line slideway 11, silicon chip blanking platform, and pneumatic slide unit 9 moves, makes silicon chip and silicon chip blanking platform approaching downwards, and cyclone sucker 6 is died, silicon chip promptly is placed on the silicon chip blanking platform.
Claims (5)
1. the silicon wafer carrying structure of a board-like PECVD equipment automatic loading and unloading system; It is characterized in that: it comprises line slideway, material loading carrying mechanism and blanking carrying mechanism; Said material loading carrying mechanism and blanking carrying mechanism include straight line module and carrying crossbeam; Said straight line module is coupling servomotor is installed; Said straight line module is installed on straight line module support; Said line slideway is fixed in line slideway support and parallel with said straight line module, said carrying crossbeam one end through straight line module connecting panel be installed on said straight line module, the other end is installed on said line slideway through slide block, the lateral wall of said carrying crossbeam is equipped with the silicon chip pickup device.
2. the silicon wafer carrying structure of a kind of board-like PECVD equipment automatic loading and unloading system according to claim 1 is characterized in that: the straight line module of said material loading carrying mechanism and the staggered parallel said straight line module support that is installed on of the straight line module of blanking carrying mechanism.
3. the silicon wafer carrying structure of a kind of board-like PECVD equipment automatic loading and unloading system according to claim 2 is characterized in that: the carrying crossbeam of said material loading carrying mechanism and the parallel dorsad installation of the carrying crossbeam of said blanking carrying mechanism.
4. the silicon wafer carrying structure of a kind of board-like PECVD equipment automatic loading and unloading system according to claim 3; It is characterized in that: said silicon chip pickup device comprises the gentle sucker that revolves of pneumatic slide unit; Said cyclone sucker is fixed in sucker through the sucker adapter plate installs crossbeam; Said sucker is installed crossbeam and is installed on said pneumatic slide unit through pneumatic slide unit connecting panel, and said pneumatic slide unit is fixed in the lateral wall of said carrying crossbeam.
5. the silicon wafer carrying structure of a kind of board-like PECVD equipment automatic loading and unloading system according to claim 4; It is characterized in that: said sucker is installed on the crossbeam six cyclone suckers is installed, and said six cyclone suckers are uniformly distributed in said sucker crossbeam is installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205725911U CN202414765U (en) | 2011-12-31 | 2011-12-31 | Silicon wafer transportation mechanism of automatic loading and unloading system of plate type PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205725911U CN202414765U (en) | 2011-12-31 | 2011-12-31 | Silicon wafer transportation mechanism of automatic loading and unloading system of plate type PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202414765U true CN202414765U (en) | 2012-09-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205725911U Expired - Fee Related CN202414765U (en) | 2011-12-31 | 2011-12-31 | Silicon wafer transportation mechanism of automatic loading and unloading system of plate type PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment |
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| CN (1) | CN202414765U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102530546A (en) * | 2011-12-31 | 2012-07-04 | 无锡市奥曼特科技有限公司 | Silicon chip carrying mechanism of automatic loading and unloading system of plate type PECVD (plasma-enhanced chemical vapor deposition) device |
| CN104708303A (en) * | 2015-02-17 | 2015-06-17 | 苏州博众精工科技有限公司 | High-speed transferring method of high-speed transferring module |
| CN105035761A (en) * | 2014-04-28 | 2015-11-11 | 三星钻石工业股份有限公司 | Carrying method and carrying device of fragile material substrates |
| CN107720242A (en) * | 2017-10-23 | 2018-02-23 | 惠州市齐力建筑工程有限公司 | A kind of fixed hub feeding device for building |
-
2011
- 2011-12-31 CN CN2011205725911U patent/CN202414765U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102530546A (en) * | 2011-12-31 | 2012-07-04 | 无锡市奥曼特科技有限公司 | Silicon chip carrying mechanism of automatic loading and unloading system of plate type PECVD (plasma-enhanced chemical vapor deposition) device |
| CN105035761A (en) * | 2014-04-28 | 2015-11-11 | 三星钻石工业股份有限公司 | Carrying method and carrying device of fragile material substrates |
| CN105035761B (en) * | 2014-04-28 | 2019-01-04 | 三星钻石工业股份有限公司 | The transport method and carrying device of brittle material substrate |
| CN104708303A (en) * | 2015-02-17 | 2015-06-17 | 苏州博众精工科技有限公司 | High-speed transferring method of high-speed transferring module |
| CN104708303B (en) * | 2015-02-17 | 2017-03-01 | 苏州博众精工科技有限公司 | Carry at a high speed the high speed method for carrying of module |
| CN107720242A (en) * | 2017-10-23 | 2018-02-23 | 惠州市齐力建筑工程有限公司 | A kind of fixed hub feeding device for building |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120905 Termination date: 20141231 |
|
| EXPY | Termination of patent right or utility model |