CN101950778A - Solar silicon water wet-process automatic separating method - Google Patents
Solar silicon water wet-process automatic separating method Download PDFInfo
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- CN101950778A CN101950778A CN2010102706961A CN201010270696A CN101950778A CN 101950778 A CN101950778 A CN 101950778A CN 2010102706961 A CN2010102706961 A CN 2010102706961A CN 201010270696 A CN201010270696 A CN 201010270696A CN 101950778 A CN101950778 A CN 101950778A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a solar silicon water wet-process automatic separating method, which comprises the following steps: striking the side face of multiple silicon chips stacked together by using a high-pressure air-liquid mixed jet flow in a water tank to inject the air and water mixed flow into the spaces between the multiple silicon chips to destroy the inter-layer vacuum which leads to the adhesion of the silicon chips stacked together; and when the silicon waster on a top layer floats up under the action of the buoyancy force of air bubbles after the inter-layer vacuum is destroyed, absorbing the floating cells by using an absorbing and conveying device and carrying the cells away from the water tank, and thus, separating the silicon chips gradually. The solar silicon water wet-process automatic separating method has the advantages of placing the silicon chips to be separated in water to prevent the silicon chips from pollution and oxidization in the air, adopting vacuum absorption, realizing the flexible contact of a conveying belt in a whole process, reducing chip breakage rate and reducing silicon chip pollution caused by human factors.
Description
Technical field
The present invention relates to a kind of solar silicon wafers (hereinafter to be referred as silicon chip) sharding method, particularly relate to a kind of silicon chip wet method auto plate separation method.
Background technology
Along with the develop rapidly of solar energy industry, make the demand of silicon chip increase day by day, silicon chip after finishing cutting, coming unstuck need be packed monolithic in the anchor clamps so that subsequent handling is handled, traditional method is the manual burst anchor clamps of packing into, yet manual burst pollutes silicon chip and fragmentation rate height easily.And in the current era of industrialization high speed development, manual operations can not have been satisfied the demand of industry, and this just needs a kind of auto plate separation method, does not still have this class methods at present and occurs.
Summary of the invention
The objective of the invention is to overcome the shortcoming of prior art, a kind of auto plate separation method that the silicon chip that stacks can be separated and carries out piecewise is provided.
Solar silicon wafers wet method auto plate separation method of the present invention, it may further comprise the steps: the side of the multi-disc silicon chip that in tank, utilizes the high-pressure gas-liquid mixing jet to impact to be stacked together, cause the interlayer negative pressure of adhesion between the silicon chip that is stacked together with destruction at the fluid-mixing that injects empty G﹠W between the multi-disc silicon chip; Be positioned at the silicon chip on upper strata after the interlayer negative pressure is destroyed because the battery sheet that utilizes this moment the absorption conveyer to draw piecewise to float and with its carrying effluent trough, so that the multi-disc silicon chip separates is piecewise upwards floated in the bubble buoyancy effect.
Beneficial effect of the present invention and advantage are: will treat that the branch silicon chip is placed in the water, avoided silicon chip to be exposed to and polluted in the air and oxidation and absorption of employing negative pressure and omnidistance flexible contact of conveyer belt realization, further reduce fragment rate, reduced the wafer contamination that human factor is introduced simultaneously.
Description of drawings
Fig. 1 is the general structure schematic diagram of the device of solar silicon wafers wet method auto plate separation method employing of the present invention;
Fig. 2 is the supply assembly structural representation in the device shown in Figure 1;
Fig. 2-the 1st, the structural representation of translation driving device in the device shown in Figure 2;
Fig. 3 is the gas-liquid mixed ejection assemblies structural representation in the device shown in Figure 1;
Fig. 3-the 1st, the gas-liquid mixed jeting effect schematic diagram in the device shown in Figure 3;
Fig. 4 is the absorption transfer assembly structural representation in the device shown in Figure 1;
Fig. 4-the 1st, the absorption transfer assembly upward view in the device shown in Figure 4.
Embodiment
Describe the present invention below in conjunction with the drawings and specific embodiments.
Solar silicon wafers wet method auto plate separation method of the present invention, it may further comprise the steps: the side of the multi-disc silicon chip that in tank, utilizes the high-pressure gas-liquid mixing jet to impact to be stacked together, cause the interlayer negative pressure of adhesion between the silicon chip that is stacked together with destruction at the fluid-mixing that injects empty G﹠W between the multi-disc silicon chip; The silicon chip that is positioned at the upper strata after the interlayer negative pressure is destroyed is because the battery sheet that utilizes this moment the absorption conveyer to draw piecewise to float and with its carrying effluent trough, so that the multi-disc silicon chip separates is piecewise upwards floated in the bubble buoyancy effect.
Described high-pressure gas-liquid mixing jet utilizes preferably that the mode of bubbling forms below hydraulic spray; The absorption transport process of described absorption conveyer is preferably taken the water between conveyer belt mounting panel and the superiors' silicon chip that floated away by drawing water, ambient water has little time to replenish, between conveyer belt mounting panel and the superiors' silicon chip of having floated, form local decompression, silicon chip is attached on the proal conveyer belt under local decompression's effect, thereby the battery sheet is carried away.
As shown in Figure 1, the solar silicon wafers wet method auto plate separation device of realizing the inventive method comprises the supply assembly 1 that is used to place silicon chip, the absorption transfer assembly 2 that is used to separate the gas-liquid mixed ejection assemblies 3 of silicon chip and is used to carry silicon chip, and preferred three part assembly central axes are provided with.Gas-liquid mixed ejection assemblies 3 is installed on supply assembly 1 dead ahead of silicon chip.Absorption transfer assembly 2 is installed on directly over the supply assembly 1, becomes the rear end of 20 ° of-30 ° of angles and absorption transfer assembly to flush with supply assembly 1 rear end with horizontal plane.
As shown in Figure 2, supply assembly 1 comprises places the silicon chip loading fixture 1-2 that silicon chip is used, and silicon chip 1-1 to be separated is stacked to be positioned on the silicon chip loading fixture 1-2, and silicon chip loading fixture 1-2 is fixed on the translation plates 1-5, and translation plates 1-5 is arranged on main mounting panel 1-3 top.Translation plates 1-5 is driven and can vertically be moved by translation driving device 1-4.Translation driving device 1-4 can be shown in Fig. 2-1, and figure cathetus motor 1-6 drives the push rod 1-8 motion that links to each other with translation plates, and to realize that translation plates moves up and down, main mounting panel 1-3 bottom is provided with black box 1-7 to prevent that liquid spills in the groove.In the course of work, the removed back of upper strata silicon chip translation driving device drives translation plates and moves up, thereby compensates the height space that removed silicon chip stays, and prepares for drawing follow-up silicon chip.
As shown in Figure 3, described gas-liquid mixed ejection assemblies 3 comprises first and second two hydraulic spray 3-1,3-2 and two groups of pressure-air bubbling device 3-3,3-4.The first pressure-air bubbling device is arranged on the front lower place of described first hydraulic spray, and the second pressure-air bubbling device is arranged on the front lower place of described second hydraulic spray.
Water after the first hydraulic spray 3-1 will pressurize when working shown in Fig. 3-1 vertically is the covering of the fan ejection, current mix with the bubble that the first pressure-air bubbling device 3-3 of the first hydraulic spray 3-1 front lower place is produced, form the first gas-liquid mixed jet 3-6, in like manner: the second hydraulic spray 3-2 cooperates the formation second gas-liquid mixed jet 3-5 with the second pressure-air bubbling device 3-4.The first and second gas-liquid mixed jet 3-6,3-5 impacts the silicon chip 1-1 to be separated in its place ahead jointly, the gas-liquid mixed jet enters the slit between silicon chip 1-1 to be separated, under the buoyancy of the air that is launched into shown in the floating one-tenth Fig. 3-1 of the silicon chip on upper strata shown in state, silicon chip is successfully separated.
As Fig. 4, shown in Fig. 4-1, described absorption transfer assembly 2 comprises the conveyer belt 2-4 that links to each other with conveyor drive arrangement, described conveyer belt is installed in the both sides of conveyer belt mounting panel 2-1, described conveyer belt mounting panel flushes setting from the horizontal by 20 ° of-30 ° of angle settings and its rear end with silicon chip loading fixture rear end, the drinking-water pipe joint is housed on the conveyer belt mounting panel, the conveyer belt mounting panel is equipped with the adsorption plate 2-6 that has a plurality of holes towards battery sheet side, hole on the adsorption plate communicates with the drinking-water pipe joint, and described conveyer belt mounting panel is installed on the main mounting panel by jockey.Conveyer belt 2-4 is furnished with conveyer belt tensioning apparatus 2-3, and conveyor drive arrangement is connected to drive conveyer belt by being with synchronously with synchronous pulley 2-2.In the course of work, water pump draws water by the adsorption plate hole, adsorption plate and the water that swims between the uppermost silicon chip (as Fig. 3-1) are taken away, thereby between adsorption plate and silicon chip, form local decompression, silicon chip is because local decompression's effect is attached to the conveyer belt surface, conveyer belt drives silicon chip and travels forward, and silicon chip is removed.
This device working method as follows:
Whole device is arranged in the tank, silicon slice placed is placed on the supply assembly 1, utilize the high-pressure gas-liquid mixing jet to impact the silicon chip side that is sticked together owing to the interlayer negative pressure in tank, the fluid-mixing that injects empty G﹠W between silicon chip causes the interlayer negative pressure of silicon chip adhesion with destruction; The destroyed back of interlayer negative pressure silicon chip upwards floats owing to the bubble buoyancy effect, and utilization absorption this moment transfer assembly is drawn the battery sheet and it is carried effluent trough, to reach the purpose of separating silicon chip piecewise.The principle of absorption transfer assembly is by drawing water the water between conveyer belt mounting panel and the superiors' silicon chip that floated to be taken away, ambient water has little time to replenish, between conveyer belt mounting panel and the superiors' silicon chip of having floated, form local decompression, silicon chip is attached on the proal conveyer belt under local decompression's effect, thereby the battery sheet is carried away.
Embodiment 1
The interlayer negative pressure of adhesion between the silicon chip that is stacked together is caused in the side of the multi-disc silicon chip that utilizes the high-pressure gas-liquid mixing jet to impact in tank to be stacked together with destruction at the fluid-mixing that injects empty G﹠W between the multi-disc silicon chip; The silicon chip that is positioned at the upper strata after the interlayer negative pressure is destroyed is because the bubble buoyancy effect is upwards floated, and the battery sheet that utilizes this moment the absorption conveyer to draw piecewise to float and with its carrying effluent trough separates the multi-disc silicon chip piecewise.
To treat that the branch silicon chip is placed in the water, avoided silicon chip to be exposed to and polluted in the air and oxidation and absorption of employing negative pressure and omnidistance flexible contact of conveyer belt realization, compare battery sheet wet separation technology with the traditional-handwork burst and greatly reduce dress basket fragment rate, burst fragmentation rate is lower than 0.1%, reduces by 0.5% silicon chip loss late than traditional-handwork burst.
Claims (2)
1. solar silicon wafers wet method auto plate separation method, it is characterized in that it may further comprise the steps: the side of the multi-disc silicon chip that in tank, utilizes the high-pressure gas-liquid mixing jet to impact to be stacked together, cause the interlayer negative pressure of adhesion between the silicon chip that is stacked together with destruction at the fluid-mixing that injects empty G﹠W between the multi-disc silicon chip; The silicon chip that is positioned at the upper strata after the interlayer negative pressure is destroyed is because the battery sheet that utilizes this moment the absorption conveyer to draw piecewise to float and with its carrying effluent trough, so that the multi-disc silicon chip separates is piecewise upwards floated in the bubble buoyancy effect.
2. according to the described solar silicon wafers wet method of claim 1 auto plate separation method, it is characterized in that: described high-pressure gas-liquid mixing jet is that utilization mode of bubbling below hydraulic spray forms; The absorption transport process of described absorption conveyer is for taking the water between conveyer belt mounting panel and the superiors' silicon chip that floated away by drawing water, ambient water has little time to replenish, between conveyer belt mounting panel and the superiors' silicon chip of having floated, form local decompression, silicon chip is attached on the proal conveyer belt under local decompression's effect, thereby the battery sheet is carried away.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102706961A CN101950778A (en) | 2010-09-02 | 2010-09-02 | Solar silicon water wet-process automatic separating method |
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| CN2010102706961A CN101950778A (en) | 2010-09-02 | 2010-09-02 | Solar silicon water wet-process automatic separating method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102299049A (en) * | 2011-07-30 | 2011-12-28 | 太原风华信息装备股份有限公司 | Petal-basket floating silicon chip automation separation mechanism |
| CN102294332A (en) * | 2011-08-08 | 2011-12-28 | 江西金葵能源科技有限公司 | Method for cleaning silicon wafer linearly cut by diamond |
| CN102427095A (en) * | 2011-08-11 | 2012-04-25 | 浙江大学台州研究院 | Solar silicon wafer automatic wafer separator based on cyclic distribution device and wafer separation method thereof |
| CN102614977A (en) * | 2012-03-06 | 2012-08-01 | 董维来 | Automatic separation method for solar silicon wafers or other flaky objects in water |
| CN102623372A (en) * | 2012-03-27 | 2012-08-01 | 江西赛维Ldk太阳能高科技有限公司 | Automatic wafer-separating device for wet silicon wafers |
| CN105428465A (en) * | 2015-12-31 | 2016-03-23 | 苏州博阳能源设备有限公司 | Silicon chip separating device |
| CN109560004A (en) * | 2017-09-26 | 2019-04-02 | 天津环鑫科技发展有限公司 | A kind of automatic circular silicon chip inserting machine structure |
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| CN1379708A (en) * | 1999-10-16 | 2002-11-13 | Acr洁净室自动控制技术有限公司 | Method and device for isolating plate-like substrates |
| CN1853265A (en) * | 2003-08-04 | 2006-10-25 | S.O.I.Tec绝缘体上硅技术公司 | Method of detaching a semiconductor layer |
| CN101405832A (en) * | 2006-03-13 | 2009-04-08 | Rec斯坎沃佛股份有限公司 | Method for separating wafers from a stack of wafers |
| WO2009074317A1 (en) * | 2007-12-11 | 2009-06-18 | Gebr. Schmid Gmbh & Co. | Method of, and apparatus for, separating wafers from a wafer stack |
| CN101652849A (en) * | 2006-12-19 | 2010-02-17 | Rec斯坎沃佛股份有限公司 | The method and apparatus that is used for se aration of silicon wafers |
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2010
- 2010-09-02 CN CN2010102706961A patent/CN101950778A/en active Pending
Patent Citations (5)
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| CN1379708A (en) * | 1999-10-16 | 2002-11-13 | Acr洁净室自动控制技术有限公司 | Method and device for isolating plate-like substrates |
| CN1853265A (en) * | 2003-08-04 | 2006-10-25 | S.O.I.Tec绝缘体上硅技术公司 | Method of detaching a semiconductor layer |
| CN101405832A (en) * | 2006-03-13 | 2009-04-08 | Rec斯坎沃佛股份有限公司 | Method for separating wafers from a stack of wafers |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102299049A (en) * | 2011-07-30 | 2011-12-28 | 太原风华信息装备股份有限公司 | Petal-basket floating silicon chip automation separation mechanism |
| CN102299049B (en) * | 2011-07-30 | 2013-06-12 | 太原风华信息装备股份有限公司 | Petal-basket floating silicon chip automation separation mechanism |
| CN102294332A (en) * | 2011-08-08 | 2011-12-28 | 江西金葵能源科技有限公司 | Method for cleaning silicon wafer linearly cut by diamond |
| CN102427095A (en) * | 2011-08-11 | 2012-04-25 | 浙江大学台州研究院 | Solar silicon wafer automatic wafer separator based on cyclic distribution device and wafer separation method thereof |
| CN102614977A (en) * | 2012-03-06 | 2012-08-01 | 董维来 | Automatic separation method for solar silicon wafers or other flaky objects in water |
| CN102623372A (en) * | 2012-03-27 | 2012-08-01 | 江西赛维Ldk太阳能高科技有限公司 | Automatic wafer-separating device for wet silicon wafers |
| CN102623372B (en) * | 2012-03-27 | 2014-07-02 | 江西赛维Ldk太阳能高科技有限公司 | Automatic wafer-separating device for wet silicon wafers |
| CN105428465A (en) * | 2015-12-31 | 2016-03-23 | 苏州博阳能源设备有限公司 | Silicon chip separating device |
| CN109560004A (en) * | 2017-09-26 | 2019-04-02 | 天津环鑫科技发展有限公司 | A kind of automatic circular silicon chip inserting machine structure |
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Open date: 20110119 |