CN112140371B - Polycrystalline silicon wafer cutting device for producing solar cell panel - Google Patents
Polycrystalline silicon wafer cutting device for producing solar cell panel Download PDFInfo
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- CN112140371B CN112140371B CN202011051332.4A CN202011051332A CN112140371B CN 112140371 B CN112140371 B CN 112140371B CN 202011051332 A CN202011051332 A CN 202011051332A CN 112140371 B CN112140371 B CN 112140371B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
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Abstract
The invention relates to the technical field of cutting devices, in particular to a polycrystalline silicon wafer cutting device for producing a solar cell panel, which comprises: the cutting box is provided with a feeding hole and a discharging hole at opposite sides respectively, and the top end of the cutting box is also provided with a dust extraction hole communicated with the input end of the air pump; the conveying machines are respectively arranged at the discharge port and the dust extraction port in parallel; the corner clamping device is arranged on the first conveyor belt and used for fixing four corners of the bottom end of the silicon ingot; the translation duplex synchronous lifting mechanism is arranged at the bottom end of the first conveyor; the diamond wire cutter is arranged on the duplex working end of the translation duplex synchronous lifting mechanism; the working end of the water cooling mechanism is horizontally arranged on the duplex working end of the translation duplex synchronous lifting mechanism towards the cutting part of the diamond wire cutter; pick and place the absorption work frame, set up in cutting incasement portion, the device can effectively avoid cutting dust pollution operational environment and can the automatic cutout silicon bulk.
Description
Technical Field
The invention relates to the technical field of cutting devices, in particular to a polycrystalline silicon wafer cutting device for producing a solar cell panel.
Background
With the continuous development of the photovoltaic industry, the demand of solar grade silicon wafers is increasing. Solar grade silicon wafers are divided into monocrystalline and polycrystalline silicon wafers. Compared with monocrystalline silicon wafers, the polycrystalline silicon wafers outside the electroplating layer have low cost and high growth rate, and the polycrystalline silicon cells in the solar cells always occupy the main market. Because of the high hardness of the polysilicon, the diamond sand line is adopted to process the large-size polysilicon at present.
The cutting device on the market can produce some particle impurity because the polycrystalline silicon piece cutting process, and long-time use can influence human health to can cause the problem of harm to the machine.
Chinese patent CN201921576918.5 discloses a cutting device with dust fall structure for processing of polycrystalline silicon chips, including roof, second linking arm and dust absorption mouth, settle the middle-end of roof has the glass board, and the bottom of glass board installs the electronic measurement chi, the outer wall left side of electronic measurement chi is fixed with first support column, and the bottom welding of first support column has the base, the tip of first linking arm bonds and has the sliding sleeve, and links up all around the outer wall of sliding sleeve and change the rumble, the outer wall that changes the rumble is provided with diamond wire all around, the second linking arm is located the outer wall right side of sliding sleeve, and the right side welding of second linking arm has second screw thread sliding sleeve, the bottom welding of section prefabricated groove has electric hydraulic cylinder.
This cutting device goes up and down through two driving motor control screw thread sliding sleeves, and then the control sliding sleeve goes up and down, very easily makes both sides motor drive unsynchronized leading to the unable normal cutting of buddha's warrior attendant line, and the dust absorption mouth is only in one side dust absorption during the cutting, unable effectual dust removal.
Disclosure of Invention
In order to solve the technical problem, the polycrystalline silicon wafer cutting device for producing the solar cell panel is provided, and the problem of dust-free cutting of the polycrystalline silicon wafer is solved by the technical scheme.
In order to achieve the above purposes, the technical scheme adopted by the invention is as follows:
a polycrystalline silicon wafer cutting device for producing a solar cell panel comprises: the cutting box is provided with a feeding hole and a discharging hole at opposite sides respectively, the top end of the cutting box is also provided with a dust extraction hole communicated with the input end of an air pump, and the output end of the air pump is inserted into the organic solvent; the cutting box comprises a first conveyor and a second conveyor, wherein the first conveyor and the second conveyor are respectively arranged at a feed inlet and a discharge outlet in parallel, and the discharge end of the first conveyor and the feed end of the second conveyor are both positioned in the cutting box; the corner clamping device is arranged on the first conveyor belt and used for fixing four corners of the bottom end of the silicon ingot; the translation duplex synchronous lifting mechanism is arranged at the bottom end of the first conveyor, the working end of the translation duplex synchronous lifting mechanism is positioned at the top end in the cutting box, and in a working state, the duplex working end of the translation duplex synchronous lifting mechanism moves along the output direction of the first conveyor and vertically and synchronously lifts; the diamond wire cutter is arranged at the duplex working end of the translation duplex synchronous lifting mechanism, and the cutting part of the diamond wire cutter is vertical and horizontal to the output direction of the first conveyor; the working end of the water cooling mechanism is horizontally arranged on the duplex working end of the translation duplex synchronous lifting mechanism towards the cutting part of the diamond wire cutter; pick and place the absorption work frame, set up and carry out the end top at cutting incasement portion and be located first conveyer discharge end and second conveyer, under the operating condition, pick and place absorption work frame work end absorption on silicon bulk top and place silicon chip horizontal migration on second conveyer feed end after the cutting is accomplished.
Preferably, the corner clamping device comprises: the fixing plate is arranged on the output belt of the first conveyor; the working ends of the sliding table cylinders are uniformly distributed at the top end of the fixed plate towards the center of the fixed plate; the opening side of the right-angle frame is horizontally arranged on the working end of the sliding table cylinder towards the center of the fixed plate, and the opening side of the right-angle frame is abutted against the four corners of the bottom end of the silicon ingot in a working state; and the rubber pads are arranged on two sides of the opening of the right-angle frame and used for preventing the silicon ingot from being damaged by butt joint.
Preferably, the translation duplex synchronous lifting mechanism comprises: the ball screw sliding table and the first conveyor are arranged at the bottom of the second conveyor in the same direction; the fixed base is arranged on the movable working end of the ball screw sliding table; the upright columns are vertically arranged on two sides of the top end of the fixed base, are positioned on two sides of the first conveyor, and are vertically provided with dovetail grooves towards the conveying direction of the first conveyor; the connecting plate is horizontally arranged, and two ends of the connecting plate are fixedly connected with the top ends of the stand columns; a dovetail wedge in sliding fit with the dovetail groove is vertically arranged on one side of the sliding right-angle plate, and diamond wire cutters are arranged on the sliding right-angle plates on the two sides; the screw rod is vertically and rotatably arranged in the dovetail groove, vertically penetrates through the dovetail wedge and is in screwed fit with the thread of the dovetail wedge; the axis of an output shaft of the double-shaft servo motor is perpendicular to the axis of a screw rod and is arranged at the top end of the fixed base; the first bevel gear and the second bevel gear are respectively and coaxially arranged at the bottom end of the screw rod and on an output shaft of the double-shaft servo motor, and the axes of the first bevel gear and the second bevel gear are vertical and meshed.
Preferably, the diamond wire cutter comprises: the output shaft of the servo motor is vertically upwards arranged on the sliding right-angle plates at the two sides; the concave wheel is coaxially and fixedly arranged on the output shaft of the servo motor; and two ends of the diamond wire are respectively wound in the concave wheel grooves on the two sides.
Preferably, the water cooling mechanism includes; the outlet of the flushing nozzle is horizontally arranged on the duplex working end of the translation duplex synchronous lifting mechanism towards the coaxial mounting seats at the two ends of the diamond wire; the semicircular sheet and the notch are horizontally arranged on a duplex working end of the translation duplex synchronous lifting mechanism through a mounting seat, and the thickness of the semicircular sheet is smaller than the height of the notch; in the working state, the semicircular slice is horizontally inserted into the notch; the flushing nozzle and the semicircular sheet are communicated with the output end of the water pump through hoses.
Preferably, the pick-and-place suction work frame includes: the magnetic coupling rodless cylinder is arranged at the top of the discharge end of the first conveyor and the top of the feeding end of the second conveyor through an I-shaped support, and the working end of the magnetic coupling rodless cylinder horizontally moves along the conveying direction of the second conveyor in a working state; the output end of the long-axis cylinder is vertically arranged at the bottom end of the working part of the magnetic coupling rodless cylinder downwards, and the long-axis cylinder is communicated with the negative pressure port through a hose; the sucker is arranged at the bottom of the output end of the long shaft cylinder through the sucker frame, and in a working state, the output end of the long shaft cylinder extends out to drive the long shaft cylinder to abut against and be adsorbed at the top end of the silicon ingot.
Preferably, the silicon ingot casting machine further comprises a correlation type sensor, the working end of the correlation type sensor is horizontally arranged at the top of the discharge end of the first conveyor and electrically connected with the controller, and in a working state, the silicon ingot is moved on the first conveyor until the working end of the first conveyor is blocked, so that the controller controls the first conveyor to stop working.
Preferably, the feeding hole is also provided with a rubber curtain strip for blocking flushing liquid and dust from being discharged out of the cutting box.
Preferably, the cutting box is further provided with a lifting cover convenient to lift and overhaul, and the lifting cover is further provided with a handle convenient to hold and lift.
Preferably, the flip cover is further provided with an observation window for directly observing the cutting condition in the cutting box.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the silicon ingot cutting device, a relatively sealed environment is provided through the cutting box, the pollution to the working environment caused by direct cutting is avoided, the silicon ingot and the silicon wafer are automatically conveyed through the first conveyor and the second conveyor, specifically, during working, the first conveyor is started to enable the fixing plate to move to the outside of the cutting box, so that feeding and discharging are facilitated, the silicon ingot is placed on the fixing plate, the sliding table air cylinder is started, the output shaft of the sliding table air cylinder drives the right-angle frame to move towards the center of the silicon ingot, the right-angle frame is enabled to abut against the four corners and the adjacent side faces of the silicon ingot, and the silicon ingot is fixed on the corner clamping device, so that cutting is facilitated;
2. according to the silicon ingot cutting machine, a silicon ingot is fixed through the corner clamping device, the silicon wafer is automatically cut in the cutting box through the translation duplex synchronous lifting mechanism, the diamond wire cutter, the water cooling mechanism and the pick-and-place adsorption working frame, the precision is high, specifically, the first conveyor is started to enable the silicon ingot to move to the inside of the cutting box, the long shaft air cylinder is started, the working end of the long shaft air cylinder is lowered, and the sucking disc frame is adsorbed and abutted to the top end of the silicon ingot; starting a double-shaft servo motor, driving first bevel gears on two sides to synchronously rotate by an output shaft of the double-shaft servo motor through a second bevel gear, screwing a lead screw and dovetail wedge threads, and thus synchronously lifting sliding right-angle plates on two sides, enabling diamond wires to be parallel to the top ends of silicon ingots, and enabling the horizontal height of the top ends of the silicon ingots from a cutting part of a diamond wire cutter to be the required slicing thickness; starting a water pump communicated with the flushing nozzle and a water pump, synchronously starting a ball screw sliding table and a servo motor, enabling the diamond wires to slowly and horizontally move towards the direction of the silicon ingot, driving two ends of the diamond wires to perform reciprocating cutting by a concave wheel, so that the diamond wires horizontally cut the top end of the silicon ingot, and enabling the semicircular sheets to be inserted into the cut to spray cooling liquid, so that the flushing nozzle and the semicircular sheets spray the cooling liquid to cool the cutting part of the diamond wire cutter and absorb part of dust; the sucker frame is adsorbed at the top end of the silicon ingot, so that after the silicon ingot is sliced, the magnetic coupling rodless cylinder is started to enable the working end of the magnetic coupling rodless cylinder to directly and horizontally move the silicon wafer to the feeding end of the second conveyor, and the silicon wafer is moved to the outside of the cutting box by the second conveyor; the remained dust is communicated with the input end of the air pump through the dust extraction port and is discharged into the organic solvent, so that the working environment is prevented from being polluted.
Drawings
FIGS. 1 and 2 are perspective views of the present invention from two different perspectives, respectively;
FIG. 3 is a perspective view showing the internal structure of the cutting box of the present invention;
FIG. 4 is an enlarged view of a portion of FIG. 3 in accordance with the present invention;
FIG. 5 is a top view of the internal structure of the cutting box of the present invention;
FIG. 6 is a front view showing the inner structure of the cutting box of the present invention;
FIG. 7 is a perspective view of the corner clamping arrangement of the present invention;
FIG. 8 is a perspective view of the translational duplex synchronous lift mechanism of the present invention;
FIG. 9 is an enlarged view of a portion of FIG. 8 at B;
fig. 10 is a side view of the translational duplex synchronous lift mechanism of the present invention.
The reference numbers in the figures are:
1-cutting a box; 1 a-a feed inlet; 1 b-a discharge hole; 1 c-a dust extraction port; 1 d-rubber curtain strips; 1 e-lifting the cover; 1e 1-handle; 1e 2-observation window;
2-a first conveyor;
3-a second conveyor;
4-corner clamping device; 4 a-a fixed plate; 4 b-a slipway cylinder; 4 c-right angle frame; 4 d-rubber pad;
5-translation duplex synchronous lifting mechanism; 5 a-a ball screw sliding table; 5 b-a stationary base; 5 c-a column; 5c 1-dovetail groove; 5 d-connecting plate; 5 e-a sliding L-square; 5e 1-dovetail wedge; 5 f-a screw rod; 5 g-a dual-axis servo motor; 5 h-first bevel gear; 5 i-second bevel gear;
6-diamond wire cutter; 6 a-a servo motor; 6 b-a concave wheel; 6 c-diamond wire;
7-a water cooling mechanism; 7 a-rinsing nozzle; 7 b-semicircular sheet;
8, picking and placing an adsorption working frame; 8 a-a magnetically coupled rodless cylinder; 8 b-i-scaffold; 8 c-long axis cylinder; 8 d-sucker; 8 e-a suction cup rack;
9-correlation type sensor.
Detailed Description
The following description is provided to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art.
Referring to fig. 1, a cutting apparatus for a polycrystalline silicon wafer used for producing a solar cell panel includes:
the cutting device comprises a cutting box 1, wherein a feeding hole 1a and a discharging hole 1b are respectively arranged on the opposite sides of the cutting box 1, a dust extraction hole 1c communicated with an input end of an air pump is also formed in the top end of the cutting box 1, and an output end of the air pump is inserted into an organic solvent;
the cutting machine comprises a first conveyor 2 and a second conveyor 3, wherein the first conveyor 2 and the second conveyor 3 are respectively arranged at a feed port 1a and a discharge port 1b in parallel, and the discharge end of the first conveyor 2 and the feed end of the second conveyor 3 are both positioned in a cutting box 1;
the corner clamping device 4 is arranged on the conveying belt of the first conveyor 2 and used for fixing four corners of the bottom end of the silicon ingot;
the translational duplex synchronous lifting mechanism 5 is arranged at the bottom end of the first conveyor 2, the working end of the translational duplex synchronous lifting mechanism 5 is positioned at the top end in the cutting box 1, and in a working state, the duplex working end of the translational duplex synchronous lifting mechanism 5 moves along the output direction of the first conveyor 2 and vertically and synchronously lifts;
the diamond wire cutter 6 is arranged at the duplex working end of the translation duplex synchronous lifting mechanism 5, and the cutting part of the diamond wire cutter 6 is vertical and horizontal to the output direction of the first conveyor 2;
the water cooling mechanism 7 is arranged on the duplex working end of the translation duplex synchronous lifting mechanism 5, and the working end of the water cooling mechanism horizontally faces the cutting part of the diamond wire cutter 6;
pick-and-place adsorption work frame 8 is arranged inside the cutting box 1 and positioned at the discharge end of the first conveyor 2 and the top of the feeding end of the second conveyor 3, and under the working state, the work end of the pick-and-place adsorption work frame 8 is adsorbed on the top end of a silicon ingot and horizontally moves and places the silicon wafer on the feeding end of the second conveyor 3 after the cutting is completed.
The feeding hole 1a and the discharging hole 1b are respectively used for feeding a silicon ingot and discharging a silicon wafer; during operation, the first conveyor 2 is started to enable the corner clamping device 4 to move to the outside of the cutting box 1, so that feeding and discharging are facilitated, a silicon ingot is placed on the corner clamping device 4, the working parts of the corner clamping device 4 are abutted to four corners and adjacent side faces of the silicon ingot, and the silicon ingot is fixed on the corner clamping device 4, so that cutting is facilitated;
starting the first conveyor 2 to move the silicon ingot into the cutting box 1, starting the pick-and-place adsorption working frame 8 to enable the working end of the pick-and-place adsorption working frame to be adsorbed and abutted to the top end of the silicon ingot, starting the lifting part of the translation duplex synchronous lifting mechanism 5 to enable the duplex lifting working end of the pick-and-place adsorption working frame to be synchronously lifted, enabling the cutting part of the diamond wire cutter 6 to be parallel to the top end of the silicon ingot, and enabling the horizontal height between the top of the silicon ingot and the cutting part of the diamond wire cutter 6 to be the required slicing thickness; synchronously starting the diamond wire cutter 6 and the translation part of the translation duplex synchronous lifting mechanism 5, so that the cutting part of the diamond wire cutter 6 slowly and horizontally moves towards the direction of the silicon ingot, the cutting part of the diamond wire cutter 6 horizontally cuts the top end of the silicon ingot, and the working end of the pick-and-place adsorption working frame 8 is adsorbed at the top end of the silicon ingot, so that after the silicon ingot is sliced, the working end of the pick-and-place adsorption working frame 8 directly and horizontally moves the silicon wafer to the feeding end of the second conveyor 3, and the silicon wafer is moved to the outside of the cutting box 1 by the second conveyor 3;
in the cutting process, the cutting part of the diamond wire cutter 6 generates high temperature and simultaneously generates dust, and the working end of the water cooling mechanism 7 faces the cutting part of the diamond wire cutter 6 and is arranged on the duplex working end of the translation duplex synchronous lifting mechanism 5, so that the working end of the water cooling mechanism 7 sprays cooling liquid to cool the cutting part of the diamond wire cutter 6 and absorb part of the dust; and the residual dust is communicated with the input end of the air pump through the dust extraction port 1c and is discharged into the organic solvent, so that the working environment is prevented from being polluted.
As shown in fig. 7, the corner clip 4 includes:
a fixed plate 4a, the fixed plate 4a is arranged on the output belt of the first conveyor 2;
the working ends of the sliding table cylinders 4b face the center of the fixed plate 4a and are uniformly distributed at the top end of the fixed plate 4 a;
the opening side of the right-angle frame 4c is horizontally arranged at the working end of the sliding table cylinder 4b towards the center of the fixing plate 4a, and the opening side of the right-angle frame 4c is abutted against four corners of the bottom end of the silicon ingot in a working state;
and the rubber pads 4d are arranged on two sides of the opening of the right-angle frame 4c and used for preventing the silicon ingot from being damaged by butt joint.
Fixed plate 4a is used for fixed mounting slip table cylinder 4b and is used for accepting the silicon bulk, with the vertical place of silicon bulk on fixed plate 4a, start slip table cylinder 4b, make its output promote right angle frame 4c and remove towards silicon bulk center direction to make right angle frame 4c butt in silicon bulk bottom four corners, and can prevent effectively that the silicon bulk from sliding and preventing to scrape colored silicon bulk on fixed plate 4a top through rubber pad 4d, thereby be convenient for cut.
As shown in fig. 8 and 10, the translational duplex synchronous lifting mechanism 5 includes:
the ball screw sliding table 5a and the first conveyor 2 are arranged at the bottom of the second conveyor 3 in the same direction;
the fixed base 5b is arranged on the movable working end of the ball screw sliding table 5 a;
the upright columns 5c are vertically arranged on two sides of the top end of the fixed base 5b, the upright columns 5c are located on two sides of the first conveyor 2, and dovetail grooves 5c1 are vertically formed in the upright columns 5c in the conveying direction of the first conveyor 2;
the connecting plate 5d is horizontally arranged, and two ends of the connecting plate 5d are fixedly connected with the top end of the upright post 5 c;
a dovetail wedge 5e1 in sliding fit with the dovetail groove 5c1 is vertically arranged on one side of the sliding right-angle plate 5e, and a diamond wire cutter 6 is arranged on the sliding right-angle plates 5e on the two sides;
the screw rod 5f is vertically and rotatably arranged in the dovetail groove 5c1, and the screw rod 5f vertically penetrates through the dovetail wedge 5e1 and is screwed and matched with the thread of the dovetail wedge;
the axis of an output shaft of the double-shaft servo motor 5g is perpendicular to the axis of the screw rod 5f and is arranged at the top end of the fixed base 5 b;
the first bevel gear 5h and the second bevel gear 5i are coaxially arranged at the bottom end of the screw rod 5f and on an output shaft of the double-shaft servo motor 5g respectively, and the axes of the first bevel gear 5h and the second bevel gear 5i are vertical and meshed.
After the silicon ingot moves to a designated place, starting a double-shaft servo motor 5g, enabling an output shaft of the double-shaft servo motor to drive a first bevel gear 5h to synchronously rotate through a second bevel gear 5i, enabling the first bevel gear 5h to be fixedly connected with the bottom end of a screw rod 5f, enabling the screw rod 5f to rotatably arranged in a dovetail groove 5c1, enabling a dovetail wedge 5e1 to be in threaded connection with the screw rod 5f, enabling a sliding right-angle plate 5e to drive a diamond wire cutter 6 to synchronously lift, enabling a cutting part of the diamond wire cutter 6 to be horizontal to the top end of the silicon ingot, and enabling the horizontal height of the cutting part of the diamond wire cutter 6 from the top end of a track to be the thickness of a silicon wafer to be cut; therefore, the working end of the ball screw sliding table 5a drives the fixed base 5b to move towards the direction of the silicon ingot by starting the ball screw sliding table 5a, and the silicon ingot is horizontally cut by the diamond wire cutter 6; the connecting plate 5d is used for fixedly connecting the top ends of the upright columns 5c at two sides, so that the structure is more stable, and the cutting is facilitated.
As shown in fig. 4, the diamond wire cutter 6 includes:
the output shaft of the servo motor 6a is vertically upwards arranged on the sliding right-angle plates 5e at the two sides;
the concave wheel 6b is coaxially and fixedly arranged on an output shaft of the servo motor 6 a;
and two ends of the diamond wire 6c are respectively wound in the grooves of the concave wheels 6b on the two sides.
When the sliding right-angle plate 5e drives the servo motor 6a to move synchronously, the servo motor 6a is started, and the output shaft of the servo motor drives the concave wheels 6b to rotate coaxially, so that silicon ingots are cut around diamond wires 6c arranged on the concave wheels 6b on the two sides, and the slicing operation is completed.
As shown in fig. 9, the water cooling mechanism 7 includes;
the flushing nozzle 7a is provided with a coaxial mounting seat at the outlet of the flushing nozzle 7a, which is horizontally arranged towards the two ends of the diamond wire 6c and is arranged at the duplex working end of the translation duplex synchronous lifting mechanism 5;
the semicircular sheet 7b and the notch are horizontally arranged on the duplex working end of the translation duplex synchronous lifting mechanism 5 through a mounting seat, and the thickness of the semicircular sheet 7b is smaller than the height of the notch; in the working state, the semicircular sheet 7b is horizontally inserted into the notch;
the flushing nozzle 7a and the semicircular sheet 7b are both communicated with the output end of the water pump through hoses.
The flushing nozzle 7a and the semicircular sheet 7b are both communicated with the output end of the water pump through a hose, and the thickness of the semicircular sheet 7b is smaller than the height of the notch, so that the semicircular sheet can be inserted into the notch to cool the diamond wire 6c, and can absorb part of dust; by being able to support the slices, they are less prone to breakage.
As shown in fig. 4, the pick-and-place suction frame 8 includes:
the magnetic coupling rodless cylinder 8a is arranged at the top of the discharging end of the first conveyor 2 and the feeding end of the second conveyor 3 through an I-shaped support 8b, and the working end of the magnetic coupling rodless cylinder 8a horizontally moves along the conveying direction of the second conveyor 3 in a working state;
the output end of the long-shaft cylinder 8c is vertically arranged at the bottom end of the working part of the magnetic coupling rodless cylinder 8a downwards, and the long-shaft cylinder 8c is communicated with the negative pressure port through a hose;
sucking disc 8d, sucking disc 8d sets up in major axis cylinder 8c output bottom through sucking disc frame 8e, under the operating condition, major axis cylinder 8c output stretches out to drive major axis cylinder 8c butt and adsorbs on the silicon bulk top.
The I-shaped support 8b is used for fixedly arranging a magnetic coupling rodless cylinder 8a, when slicing is carried out, the long shaft cylinder 8c is started, an output shaft of the long shaft cylinder drives the sucker 8d to abut against the top end of the silicon ingot through the sucker frame 8e, the sucker 8d is connected with the negative pressure port through the hose, and therefore the sucker 8d is adsorbed to the top end of the silicon ingot, and the sucker 8d can be adsorbed to the top end of the silicon wafer to enable the silicon ingot to be not prone to fracture when cutting is carried out; after the silicon wafers are cut, the silicon wafers cut from the silicon ingots can be placed on the feeding end of the second conveyor 3 through the magnetic coupling rodless cylinder 8a and are conveyed outwards through the feeding end.
As shown in fig. 5, the silicon ingot casting machine further comprises a correlation type sensor 9, wherein a working end of the correlation type sensor 9 is horizontally arranged at the top of a discharging end of the first conveyor 2 and is electrically connected with the controller, and in a working state, the silicon ingot moves on the first conveyor 2 until the working end of the first conveyor 2 is blocked, so that the controller controls the first conveyor 2 to stop working.
The correlation type sensor 9 can control the first conveyor 2 to stop working when the silicon ingot moves to a designated place on the first conveyor 2, thereby facilitating cutting at the designated place.
As shown in fig. 2, a rubber curtain strip 1d for blocking the discharge of the washing liquid and the dust to the outside of the cutting box 1 is further provided on the feed port 1 a.
As shown in fig. 2, the cutting box 1 is further provided with a lifting cover 1e for facilitating lifting and maintenance, and the lifting cover 1e is further provided with a handle 1e1 for facilitating holding and lifting.
The inner structure of the cutting box 1 can be directly overhauled by lifting the lifting cover 1e through holding the handle 1e1 by hand, thereby improving the working efficiency.
As shown in fig. 2, the lift cover 1e is further provided with an observation window 1e2 for directly observing the cutting condition inside the cutting box 1.
The observation window 1e2 enables a worker to directly observe the cutting condition inside the cutting box 1 without opening the flip cover 1e, so that the cutting operation can be adjusted in time.
The working principle of the invention is as follows:
the device realizes the functions of the invention through the following steps, thereby solving the technical problems provided by the invention:
the method comprises the following steps: during operation, the first conveyor 2 is started to enable the fixing plate 4a to move to the outside of the cutting box 1, so that feeding and discharging are facilitated, a silicon ingot is placed on the fixing plate 4a, the sliding table air cylinder 4b is started, the output shaft of the sliding table air cylinder drives the right-angle frame 4c to move towards the center of the silicon ingot, the right-angle frame 4c is abutted to the four corners and the adjacent side faces of the silicon ingot, and the silicon ingot is fixed on the corner clamping device 4, so that cutting is facilitated;
step two: then, the first conveyor 2 is started to move the silicon ingot into the cutting box 1, and the long-shaft air cylinder 8c is started to descend the working end of the long-shaft air cylinder so as to enable the sucker frame 8e to be sucked and abutted to the top end of the silicon ingot;
step three: starting a double-shaft servo motor 5g, driving first bevel gears 5h on two sides to synchronously rotate by an output shaft of the double-shaft servo motor through a second bevel gear 5i, screwing a screw rod 5f and a dovetail wedge 5e1 in a threaded manner, so that sliding right-angle plates 5e on two sides synchronously lift, a diamond wire 6c is parallel to the top end of a silicon ingot, and the horizontal height of the top end of the silicon ingot from a cutting part of a diamond wire cutter 6 is the required slice thickness;
step four: starting a water pump communicated with the flushing nozzles 7a and 7c0, and then synchronously starting the ball screw sliding table 5a and the servo motor 6a to enable the diamond wire 6c to slowly and horizontally move towards the direction of the silicon ingot, and the concave wheel 6b drives the two ends of the diamond wire 6c to perform reciprocating cutting, so that the diamond wire 6c horizontally cuts the top end of the silicon ingot, and the semicircular sheet 7b is inserted in the notch to spray cooling liquid, so that the flushing nozzles 7a and the semicircular sheet 7b spray the cooling liquid to cool the cutting part of the diamond wire cutter 6 and absorb part of dust; the sucking disc frame 8e is adsorbed at the top end of the silicon ingot, so that after the silicon ingot is sliced, the magnetic coupling rodless cylinder 8a is started to enable the working end of the magnetic coupling rodless cylinder to directly and horizontally move the silicon wafer to the feeding end of the second conveyor 3, and the silicon wafer is moved to the outside of the cutting box 1 by the second conveyor 3;
step five: the remained dust is communicated with the input end of the air pump through the dust extraction port 1c and is discharged into the organic solvent, thereby preventing the pollution to the working environment.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. A polycrystalline silicon wafer cutting device for producing solar panels is characterized by comprising:
the device comprises a cutting box (1), wherein the opposite sides of the cutting box are respectively provided with a feeding hole (1 a) and a discharging hole (1 b), the top end of the cutting box (1) is also provided with a dust pumping hole (1 c) communicated with the input end of an air pump, and the output end of the air pump is inserted into an organic solvent;
the cutting machine comprises a first conveyor (2) and a second conveyor (3), wherein the first conveyor (2) and the second conveyor (3) are respectively arranged at a feeding hole (1 a) and a discharging hole (1 b) in parallel, and the discharging end of the first conveyor (2) and the feeding end of the second conveyor (3) are both positioned in a cutting box (1);
the corner clamping device (4) is arranged on the conveying belt of the first conveyor (2) and used for fixing four corners of the bottom end of the silicon ingot;
the translational duplex synchronous lifting mechanism (5) is arranged at the bottom end of the first conveyor (2), the working end of the translational duplex synchronous lifting mechanism (5) is positioned at the top end in the cutting box (1), and in a working state, the duplex working end of the translational duplex synchronous lifting mechanism (5) moves along the output direction of the first conveyor (2) and is lifted vertically and synchronously;
the diamond wire cutter (6) is arranged at the duplex working end of the translation duplex synchronous lifting mechanism (5), and the cutting part of the diamond wire cutter (6) is vertical and horizontal to the output direction of the first conveyor (2);
the water cooling mechanism (7) is arranged on the duplex working end of the translation duplex synchronous lifting mechanism (5) with the working end horizontally facing the cutting part of the diamond wire cutter (6);
the picking and placing adsorption working frame (8) is arranged in the cutting box (1) and is positioned at the discharge end of the first conveyor (2) and the top of the advancing end of the second conveyor (3), and in a working state, the working end of the picking and placing adsorption working frame (8) is adsorbed at the top end of the silicon ingot and horizontally moves and places the silicon wafer on the feeding end of the second conveyor (3) after cutting is completed;
the translation duplex synchronous lifting mechanism (5) comprises:
the ball screw sliding table (5 a) and the first conveyor (2) are arranged at the bottom of the second conveyor (3) in the same direction;
the fixed base (5 b) is arranged on the movable working end of the ball screw sliding table (5 a);
the vertical columns (5 c) are vertically arranged on two sides of the top end of the fixed base (5 b), the vertical columns (5 c) are located on two sides of the first conveyor (2), and dovetail grooves (5 c 1) are vertically formed in the direction, facing the conveying direction of the first conveyor (2), of the vertical columns (5 c);
the connecting plate (5 d) is horizontally arranged, and two ends of the connecting plate (5 d) are fixedly connected with the top end of the upright post (5 c);
a dovetail wedge (5 e 1) in sliding fit with the dovetail groove (5 c 1) is vertically arranged on one side of the sliding right-angle plate (5 e), and diamond wire cutters (6) are arranged on the sliding right-angle plates (5 e) on the two sides;
the screw rod (5 f) is vertically and rotatably arranged in the dovetail groove (5 c 1), and the screw rod (5 f) vertically penetrates through the dovetail wedge (5 e 1) and is screwed and matched with the thread of the dovetail wedge;
the axis of an output shaft of the double-shaft servo motor (5 g) is perpendicular to the axis of the screw rod (5 f) and is arranged at the top end of the fixed base (5 b);
the first bevel gear (5 h) and the second bevel gear (5 i) are respectively and coaxially arranged at the bottom end of the screw rod (5 f) and on an output shaft of the double-shaft servo motor (5 g), and the axes of the first bevel gear (5 h) and the second bevel gear (5 i) are vertical and meshed;
the water cooling mechanism (7) comprises:
the outlet of the washing nozzle (7 a) is horizontally arranged on the duplex working end of the translation duplex synchronous lifting mechanism (5) towards the coaxial mounting seats at the two ends of the diamond wire (6 c);
the semicircular sheet (7 b) and the notch are horizontally arranged on a duplex working end of the translation duplex synchronous lifting mechanism (5) through a mounting seat, and the thickness of the semicircular sheet (7 b) is smaller than the height of the notch; in the working state, the semicircular sheet (7 b) is horizontally inserted into the notch;
the flushing nozzle (7 a) and the semicircular sheet (7 b) are communicated with the output end of the water pump through hoses.
2. The device for cutting polycrystalline silicon wafers for producing solar panels as claimed in claim 1, characterized in that the corner holding device (4) comprises:
a fixed plate (4 a), the fixed plate (4 a) being arranged on an output belt of the first conveyor (2);
the working ends of the sliding table cylinders (4 b) face the center of the fixed plate (4 a) and are uniformly distributed at the top end of the fixed plate (4 a);
the opening side of the right-angle frame (4 c) is horizontally arranged on the working end of the sliding table cylinder (4 b) towards the center of the fixing plate (4 a), and the opening side of the right-angle frame (4 c) is abutted to the four corners of the bottom end of the silicon ingot in a working state;
and the rubber pads (4 d) are arranged on two sides of the opening of the right-angle frame (4 c) and used for preventing the silicon ingot from being damaged by butt joint.
3. A device for cutting polycrystalline silicon wafers for the production of solar panels according to claim 1, characterized in that the diamond wire cutter (6) comprises:
the output shaft of the servo motor (6 a) is vertically upwards arranged on the sliding right-angle plates (5 e) at the two sides;
the concave wheel (6 b), the said concave wheel (6 b) is fixed and set up on the output shaft of the servomotor (6 a) coaxially;
and two ends of the diamond wire (6 c) are wound in the grooves of the concave wheels (6 b) on the two sides respectively.
4. The device for cutting polycrystalline silicon wafers for producing solar panels according to claim 1, characterized in that the pick-and-place suction work frame (8) comprises:
the magnetic coupling rodless cylinder (8 a) is arranged at the top of the discharging end of the first conveyor (2) and the feeding end of the second conveyor (3) through an I-shaped support (8 b), and in a working state, the working end of the magnetic coupling rodless cylinder (8 a) horizontally moves along the conveying direction of the second conveyor (3);
the output end of the long-axis cylinder (8 c) is vertically arranged at the bottom end of the working part of the magnetic coupling rodless cylinder (8 a) downwards, and the long-axis cylinder (8 c) is communicated with the negative pressure port through a hose;
sucking disc (8 d), sucking disc (8 d) set up in major axis cylinder (8 c) output bottom through sucking disc frame (8 e), under the operating condition, major axis cylinder (8 c) output stretches out and drives major axis cylinder (8 c) butt and adsorb on the silicon bulk top.
5. The cutting device for the polycrystalline silicon wafers for producing the solar cell panels is characterized by further comprising a correlation type sensor (9), wherein the working end of the correlation type sensor (9) is horizontally arranged at the top of the discharging end of the first conveyor (2) and is electrically connected with the controller, and in the working state, the silicon ingot moves on the first conveyor (2) until the working end of the first conveyor (2) is blocked, so that the controller controls the first conveyor (2) to stop working.
6. The cutting device for the polycrystalline silicon wafers used for producing the solar panels is characterized in that a rubber curtain strip (1 d) used for blocking flushing liquid and dust from discharging to the outside of the cutting box (1) is further arranged on the feeding port (1 a).
7. The cutting device for the polycrystalline silicon wafer used for producing the solar cell panel is characterized in that a lifting cover (1 e) which is convenient to lift and overhaul is further arranged on the cutting box (1), and a handle (1 e 1) which is convenient to hold and lift is further arranged on the lifting cover (1 e).
8. The cutting device for the polycrystalline silicon wafers used for producing the solar panels according to claim 7 is characterized in that the lifting cover (1 e) is also provided with an observation window (1 e 2) which is convenient for directly observing the cutting condition inside the cutting box (1).
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| CN113001791B (en) * | 2021-02-25 | 2022-11-22 | 江苏唱游数据技术有限公司 | Mobile intelligent bracelet chip processing system and method suitable for tourism team management |
| CN114833388B (en) * | 2022-06-14 | 2023-09-01 | 郴州市三益机械制造有限公司 | Cutting cooling device for industrial steel machining |
| CN116766419B (en) * | 2023-06-07 | 2024-04-19 | 徐州顺泰新能源发电有限公司 | Automatic cutting device for solar cell |
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