CN113232180A - Silicon rod cutting equipment for production of ultrathin silicon wafers - Google Patents
Silicon rod cutting equipment for production of ultrathin silicon wafers Download PDFInfo
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- CN113232180A CN113232180A CN202110751980.9A CN202110751980A CN113232180A CN 113232180 A CN113232180 A CN 113232180A CN 202110751980 A CN202110751980 A CN 202110751980A CN 113232180 A CN113232180 A CN 113232180A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Abstract
The invention relates to the technical field of silicon rod processing auxiliary devices, in particular to silicon rod cutting equipment for producing ultrathin silicon wafers, which is simple in structure, wherein a diamond wire can swing in the cutting process so as to reduce the load of the diamond wire, improve the cutting efficiency of a silicon rod and facilitate taking out of the cut silicon wafers; the automatic lifting device comprises a workbench, be provided with elevating system on the workstation, the elevating system output is provided with the diaphragm, the diaphragm middle part is provided with the through-hole, through-hole department bearing rotates installs the pivot, the first gear of fixedly connected with in the pivot, the diaphragm top is provided with door type guide rail, sliding connection has the lantern ring on the door type guide rail, lantern ring bottom fixedly connected with and first gear engagement's first rack, the diaphragm top is provided with first motor, first motor output fixedly connected with driving-disc, lateral wall border region fixedly connected with drive shaft before the driving-disc, it has the actuating lever to rotate through the bearing in the drive shaft, the actuating lever left end is connected with first rack shaft.
Description
Technical Field
The invention relates to the technical field of silicon rod processing auxiliary devices, in particular to silicon rod cutting equipment for ultrathin silicon wafer production.
Background
The polycrystalline silicon is an active non-metal element, is an important component of a crystal material, is in the front of the development of new materials, is mainly used as a semiconductor rod material or solar photovoltaic power generation, heat supply and the like, is an important component of a solar cell, and has the advantages of cleanness, environmental protection, convenience and the like.
Diamond wire is short for diamond cutting wire, also called diamond cutting wire or diamond wire, and many hard materials in industry are cut by cutting steel wire or higher quality gold steel wire, such as polysilicon slice, monocrystalline silicon, crystal bar in photovoltaic field.
In the prior art, a diamond wire cutting mode which is straight up and down is mostly adopted, the diamond wire is subjected to a large load by the cutting mode, the problem of silicon rod cutting quality is easily caused, and a cut silicon wafer is not easy to take out.
Disclosure of Invention
In order to solve the technical problems, the invention provides silicon rod cutting equipment for producing ultrathin silicon wafers, which is simple in structure, and in the cutting process, a diamond wire can swing so as to reduce the load of the diamond wire, improve the cutting efficiency of a silicon rod and facilitate taking out the cut silicon wafers.
The invention relates to silicon rod cutting equipment for ultrathin silicon wafer production, which comprises a workbench, wherein a lifting mechanism is arranged on the workbench, the output end of the lifting mechanism is provided with a transverse plate, the middle part of the transverse plate is provided with a through hole, a bearing at the through hole is rotatably provided with a rotating shaft, the rotating shaft is fixedly connected with a first gear, the top part of the transverse plate is provided with a door-shaped guide rail, the door-shaped guide rail is slidably connected with a lantern ring, the bottom end of the lantern ring is fixedly connected with a first rack meshed with the first gear, the top part of the transverse plate is provided with a first motor, the output end of the first motor is fixedly connected with a driving disc, the edge area of the front side wall of the driving disc is fixedly connected with a driving shaft, the driving shaft is rotatably provided with a driving rod through the bearing, the left end of the driving rod is connected with the first rack shaft, the rotating shaft is fixedly connected with an inverted V-shaped rod, the left end of the inverted V-shaped rod is provided with a left diamond wire tractor, the right end of the inverted V-shaped rod is provided with a right diamond wire tractor, a base is arranged in the central area of the top of the workbench, an arc notch for placing a silicon rod is arranged on the base, a left support rod and a right support rod are arranged in the central area of the top of the workbench, a left connecting shaft and a right connecting shaft are respectively rotatably arranged on the left support rod and the right support rod through bearings, a swinging plate is fixedly connected with the left connecting shaft and the right connecting shaft, a left fixing shaft and a right fixing shaft are respectively fixedly connected with the top end of the left side wall and the top end of the right side wall of the swinging plate, a second gear is fixedly connected with the right connecting shaft, a first left chain wheel is rotatably arranged on the left connecting shaft through a bearing, a second left chain wheel is rotatably arranged on the left fixing shaft through a bearing, a left chain is sleeved on the first left chain wheel and the second left chain wheel, a first right chain wheel is rotatably arranged on the right connecting shaft through a bearing, a third gear is fixedly connected with the first right chain wheel through four groups of transition rods, and a second right chain wheel is rotatably arranged on the right fixing shaft through a bearing, the right chain is sleeved on the first right chain wheel and the second right chain wheel, two groups of connecting blocks are fixedly connected to the rear ends of the left chain and the right chain, the rear ends of the four groups of connecting blocks are fixedly connected with a base plate, a first air cylinder is arranged on the rear side wall of the base plate, a moving plate is arranged at the output end of the first air cylinder, a sucker is arranged on the rear side wall of the moving plate, a platform is fixedly connected to the right supporting rod, a second air cylinder is fixedly connected to the top of the platform, a driving plate is fixedly connected to the output end of the second air cylinder, a second rack and a third rack are fixedly connected to the left end of the driving plate, the second rack is meshed with the second gear, and the third rack is meshed with the third gear.
The invention relates to silicon rod cutting equipment for ultrathin silicon wafer production, which comprises a lifting mechanism and a cutting device, wherein the lifting mechanism comprises two groups of door-shaped plates, mounting holes are formed in the left side and the right side of a workbench, the two groups of door-shaped plates are respectively and fixedly mounted at the two groups of mounting holes, a group of threaded rods are rotatably mounted on each group of door-shaped plates through bearings, an L-shaped plate is in threaded connection with each group of threaded rods, each group of guide rods penetrates through the L-shaped plate, two ends of each group of guide rods are respectively connected with one group of door-shaped plates, the left end and the right end of a transverse plate are respectively mounted on the two groups of L-shaped plates, a group of first bevel gears are respectively fixed at the bottom end of each group of threaded rods, a ring body is arranged at the bottom of the workbench, a support table is transversely arranged inside the ring body, a second motor is arranged on the support table, a speed reducer is arranged at the output end of the second motor, a transverse shaft is provided with two groups of second bevel gears, the two groups of second bevel gears are respectively meshed with the two groups of first bevel gears, at least three groups of stabilizer bars are arranged on the top of the supporting platform, and the cross shaft is rotatably connected with the three groups of stabilizer bars through bearings.
According to the silicon rod cutting equipment for producing the ultrathin silicon wafer, the base is fixedly provided with the two groups of sliding rails, the two groups of sliding rails are connected with the portal frame in a sliding mode, the middle of the portal frame is provided with the third air cylinder, the output end of the bottom end of the third air cylinder is provided with the pressing plate with the arc-shaped notch, the portal frame is in threaded connection with the locking bolt, and one end of the locking bolt is in contact with one group of sliding rails.
According to the silicon rod cutting equipment for producing the ultrathin silicon wafer, the four corners of the rear side wall of the base plate are fixedly connected with the telescopic rods, and the other end of each telescopic rod is fixedly connected with one corner of the front side wall of the movable plate.
According to the silicon rod cutting equipment for producing the ultrathin silicon wafer, the third gear is rotatably connected with the left connecting shaft through the bearing.
According to the silicon rod cutting equipment for producing the ultrathin silicon wafer, the first motor is a speed reducing motor, and the rotating speed of the first motor is adjustable.
According to the silicon rod cutting equipment for producing the ultrathin silicon wafer, the inner top side wall, the inner bottom side wall, the inner front side wall and the inner rear side wall of the lantern ring are respectively provided with the placing grooves, a plurality of balls are placed in each group of placing grooves, and the balls are in contact with the outer side wall of the door-shaped guide rail.
According to the silicon rod cutting equipment for producing the ultrathin silicon wafer, the workbench is hollow, the top of the workbench is communicated with the plurality of liquid inlets, the plurality of liquid inlets are positioned in the area below the front end of the silicon rod, and the left side wall of the workbench is communicated with the liquid outlet pipeline.
Compared with the prior art, the invention has the beneficial effects that: the lifting mechanism has the following principle: through the arrangement of the three groups of the stabilizer bars, the speed reducer, the cross shaft and the second bevel gear are driven to rotate after the second motor is electrified, the second bevel gear is meshed with the first bevel gear, and the threaded rod is rotatably connected with the door-shaped plate through the bearing, so that the threaded rod is driven to rotate after the second motor is electrified, the threaded rod is in threaded connection with the L-shaped plate, and the L-shaped plate cannot rotate along with the rotation of the threaded rod under the action of the threaded rod and the guide rod, so that the L-shaped plate, the cross plate and the like are driven to change the height after the second motor is electrified;
under the support of the door-shaped guide rail, the lantern ring and the first rack move left and right, and through the arrangement of the balls, when the lantern ring moves relative to the door-shaped guide rail, the balls roll to reduce the friction force between the lantern ring and the door-shaped guide rail, and because the driving shaft is fixedly connected with the edge area of the driving disc and is rotationally connected with the driving rod through the bearing, and the driving rod is connected with the first rack shaft, so that after the first motor is electrified, the driving disc is driven to rotate and further the first rack is driven to reciprocate left and right;
under the support of the workbench, the left support rod, the right support rod and the like, the swinging plate, the second gear, the left connecting shaft, the right connecting shaft and the like can rotate, as the first left chain wheel is rotatably arranged on the left connecting shaft through a bearing, the second left chain wheel is rotatably arranged on the left fixing shaft through a bearing, the first right chain wheel is rotatably arranged on the right connecting shaft through a bearing, and the second right chain wheel is rotatably arranged on the right fixing shaft through a bearing, when the length of the output end of the second cylinder is reduced, the second rack and the third rack are driven to simultaneously move backwards, as the second rack is meshed with the second gear, the swinging plate and the like rotate, as the third rack is meshed with the third gear, the first left chain wheel, the second left chain wheel, the first right chain wheel, the second right chain wheel, the left chain and the right chain rotate, and as the base plate is fixedly connected with the left chain and the rear chain through four groups of connecting blocks, when the length of the output end of the second cylinder is reduced, the swinging plate, the substrate and the like can extend forwards for a certain length while rotating forwards by taking the left connecting shaft and the right connecting shaft as axes, and the positions of the sucking disc and the moving plate can be controlled by controlling the length of the output end of the first cylinder so as to control the sucking disc to suck the front end of the silicon rod;
when the silicon rod cutting machine is normally used, a silicon rod is placed at the arc-shaped notch of the base, the position of the silicon rod is adjusted according to the thickness of a required silicon wafer, after the position of the silicon rod is adjusted, the third air cylinder is operated to enable the pressing plate to tightly press the silicon rod, the position of the silicon rod is fixed, the second air cylinder is operated to enable the sucker to be in a vertical state, the first air cylinder is operated to enable the sucker to suck the front end face of the silicon rod, when the first air cylinder acts, the telescopic rod simultaneously extends and retracts, the stability of the moving plate during extension and retraction is improved, then the left diamond wire tractor and the right diamond wire tractor are started to enable the diamond wires to move, the first motor is started to enable the diamond wires and the like to rotate by taking the first gear central shaft as an axis, the lifting mechanism is operated to control the height of the diamond wires, when the silicon rod is cut, the diamond wires can slowly rotate by taking the first gear central shaft as an axis simultaneously during descending process, and compared with a cutting mode that the diamond wires are straight up and straight down in the prior art, load of buddha's warrior attendant line is littleer, the silicon chip quality after the cutting is more excellent, and improved cutting efficiency, the cutting finishes the back, operation elevating system makes buddha's warrior attendant line rise and breaks away from the silicon rod, then the first cylinder output of operation shortens the silicon chip that makes after the cutting antedisplacement, then operation second cylinder output shortens and makes the silicon chip remove forward when rotatory forward, then take off the silicon chip, the coolant liquid that uses during the cutting enters into the workstation inside along a plurality of inlets, then flow along liquid outlet pipe, be convenient for collect the coolant liquid.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a perspective view of a right support rod, a right connecting shaft, a swing plate, a right fixed shaft, a first right chain wheel, a second right chain wheel, a right chain, a connecting block, a base plate, a first cylinder, a moving plate, a sucker, a platform and a telescopic rod;
FIG. 3 is a schematic top view of the connection of the right support rod, the swing plate, the right fixed shaft, the right chain, the connecting block, the base plate, the first cylinder, the moving plate, the suction cup, the platform and the telescopic rod;
FIG. 4 is a perspective view of a right support bar, a second gear, a transition bar, a third gear, a right connecting shaft, a swing plate, a right fixed shaft, a first right sprocket, a second right sprocket, a right chain, a base plate, a moving plate, a suction cup, a platform and a telescoping bar; (ii) a
FIG. 5 is a schematic top view of the connection of the second cylinder, drive plate, second rack, third rack, second gear and third gear;
FIG. 6 is an enlarged view of a portion A of FIG. 1;
FIG. 7 is a partial enlarged view of portion B of FIG. 1;
FIG. 8 is a right side cross-sectional view of the gate track, ball and collar;
in the drawings, the reference numbers: 1. a work table; 2. a transverse plate; 3. a rotating shaft; 4. a first gear; 5. a gate-type guide rail; 6. a collar; 7. a first rack; 8. a first motor; 9. a drive disc; 10. a drive shaft; 11. a drive rod; 12. an inverted V-shaped rod; 13. a left diamond wire tractor; 14. a base; 15. a silicon rod; 16. a right support bar; 17. a right connecting shaft; 18. a swing plate; 19. a right fixed shaft; 20. a second gear; 21. a first right sprocket; 22. a second right sprocket; 23. a right chain; 24. a transition rod; 25. a third gear; 26. connecting blocks; 27. a substrate; 28. a first cylinder; 29. moving the plate; 30. a suction cup; 31. a platform; 32. a second cylinder; 33. a drive plate; 34. a second rack; 35. a third rack; 36. a door profile; 37. a guide bar; 38. a threaded rod; 39. an L-shaped plate; 40. a first bevel gear; 41. a ring body; 42. a support table; 43. a second motor; 44. a speed reducer; 45. a horizontal axis; 46. a second bevel gear; 47. a stabilizer bar; 48. a slide rail; 49. a gantry; 50. a third cylinder; 51. pressing a plate; 52. locking the bolt; 53. a telescopic rod; 54. a ball bearing; 55. and (7) a liquid outlet pipeline.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
As shown in fig. 1 to 8, the silicon rod cutting equipment for producing ultrathin silicon wafers comprises a workbench 1, wherein a lifting mechanism is arranged on the workbench 1, the output end of the lifting mechanism is provided with a transverse plate 2, the middle part of the transverse plate 2 is provided with a through hole, a rotating shaft 3 is rotatably arranged on a bearing at the through hole, a first gear 4 is fixedly connected onto the rotating shaft 3, a door-shaped guide rail 5 is arranged at the top of the transverse plate 2, a lantern ring 6 is slidably connected onto the door-shaped guide rail 5, a first rack 7 meshed with the first gear 4 is fixedly connected to the bottom end of the lantern ring 6, a first motor 8 is arranged at the top of the transverse plate 2, a driving disc 9 is fixedly connected to the output end of the first motor 8, a driving shaft 10 is fixedly connected to the edge area of the front side wall of the driving disc 9, a driving rod 11 is rotatably connected onto the driving shaft 10 through a bearing, the left end of the driving rod 11 is connected with the first rack 7 shaft, an inverted V-shaped rod 12 is fixedly connected onto the rotating shaft 3, a left diamond wire tractor 13 is arranged at the left end of an inverted V-shaped rod 12, a right diamond wire tractor is arranged at the right end of the inverted V-shaped rod 12, a base 14 is arranged in the central area of the top of a workbench 1, an arc notch for placing a silicon rod 15 is arranged on the base 14, a left support rod and a right support rod 16 are arranged in the central area of the top of the workbench 1, a left connecting shaft and a right connecting shaft 17 are respectively rotatably arranged on the left support rod and the right support rod 16 through bearings, a swinging plate 18 is fixedly connected with the left connecting shaft and the right connecting shaft 17, a left fixed shaft and a right fixed shaft 19 are respectively fixedly connected with the top end of the left side wall and the top end of the right side wall of the swinging plate 18, a second gear 20 is fixedly connected with the right connecting shaft 17, a first left chain wheel is rotatably arranged on the left connecting shaft through a bearing, a second left chain, a first right chain wheel 21 is rotatably arranged on the right connecting shaft 17 through a bearing, a third gear 25 is fixedly connected on the first right chain wheel 21 through four groups of transition rods 24, a second right chain wheel 22 is rotatably arranged on the right fixing shaft 19 through a bearing, a right chain 23 is sleeved on the first right chain wheel 21 and the second right chain wheel 22, two groups of connecting blocks 26 are fixedly connected at the rear ends of the left chain and the right chain 23, a base plate 27 is fixedly connected at the rear end of each group of connecting blocks 26, a first air cylinder 28 is arranged on the rear side wall of the base plate 27, a moving plate 29 is arranged at the output end of the first air cylinder 28, a sucking disc 30 is arranged on the rear side wall of the moving plate 29, a platform 31 is fixedly connected on the right supporting rod 16, a second air cylinder 32 is fixedly connected at the top of the platform 31, a driving plate 33 is fixedly connected at the output end of the second air cylinder 32, a second rack 34 and a third rack 35 are fixedly connected at the left end of the driving plate 33, the second rack 34 is meshed with the second gear 20, the third rack 35 is engaged with the third gear 25;
under the support of the door-shaped guide rail 5, the lantern ring 6 and the first rack 7 move left and right, the driving shaft 10 is fixedly connected with the edge area of the driving disc 9, the driving shaft 10 is rotatably connected with the driving rod 11 through a bearing, and the driving rod 11 is connected with the first rack 7 through a shaft, so that after the first motor 8 is electrified, the driving disc 9 is driven to rotate, and the first rack 7 is driven to reciprocate left and right, and as the first gear 4 is rotatably connected with the transverse plate 2 through a bearing and the first gear 4 is meshed with the first rack 7, the first gear 4 and the inverted V-shaped rod 12 reciprocate to swing after the first motor 8 is electrified, and further the left diamond wire tractor 13, the right diamond wire tractor and the like reciprocate;
under the support of the workbench 1, the left support rod, the right support rod 16 and the like, the swinging plate 18, the second gear 20, the left connecting shaft, the right connecting shaft 17 and the like can rotate, as a first left chain wheel is rotatably arranged on the left connecting shaft through a bearing, a second left chain wheel is rotatably arranged on the left fixing shaft through a bearing, a first right chain wheel 21 is rotatably arranged on the right connecting shaft 17 through a bearing, and a second right chain wheel 22 is rotatably arranged on the right fixing shaft 19 through a bearing, when the length of the output end of the second cylinder 32 is reduced, the second rack 34 and the third rack 35 are driven to simultaneously move backwards, as the second rack 34 is meshed with the second gear 20, the swinging plate 18 and the like can rotate, as the third rack 35 is meshed with the third gear 25, the first left chain wheel, the second left chain wheel, the first right chain wheel 21, the second right chain wheel 22, the left chain and the right chain 23 can rotate, because the base plate 27 is fixedly connected with the left chain and the rear chain through the four groups of connecting blocks 26, relative displacement is generated between the base plate 27 and the swinging plate 18, when the length of the output end of the second air cylinder 32 is reduced, the swinging plate 18, the base plate 27 and the like can forwardly extend for a certain length while the swinging plate 18, the base plate 27 and the like rotate forwards by taking the left connecting shaft and the right connecting shaft 17 as axes, and the positions of the suction cup 30 and the moving plate 29 can be controlled by controlling the length of the output end of the first air cylinder 28, so that the suction cup 30 can be controlled to suck the front end of the silicon rod 15;
during normal use, the silicon rod 15 is placed at the arc-shaped notch of the base 14, the position of the silicon rod 15 is adjusted according to the thickness of a required silicon wafer, the second air cylinder 32 is operated to enable the sucker 30 to be in a vertical state, the first air cylinder 28 is operated to enable the sucker 30 to suck the front end face of the silicon rod 15, the left diamond wire tractor 13 and the right diamond wire tractor are started to enable the diamond wires to move, the first motor 8 is started to enable the diamond wires and the like to rotate by taking the central shaft of the first gear 4 as an axis, the lifting mechanism is operated to control the height of the diamond wires, during the cutting process of the silicon rod 15, the diamond wires can slowly rotate by taking the central shaft of the first gear 4 as an axis during the descending process, compared with the cutting mode that the diamond wires are vertically arranged in the prior art, the load of the diamond wires is smaller, the quality of the cut silicon wafer is better, the cutting efficiency is improved, after the cutting is finished, the lifting mechanism is operated to lift the diamond wire off the silicon rod 15, then the output end of the first air cylinder 28 is operated to shorten to advance the cut silicon wafer, then the output end of the second air cylinder 32 is operated to shorten to advance the silicon wafer while rotating forward, and then the silicon wafer is taken down.
The invention relates to silicon rod cutting equipment for ultrathin silicon wafer production, which comprises a lifting mechanism, a worktable 1, two groups of door-shaped plates 36 and two groups of guide rods 37, wherein the left side and the right side of the worktable 1 are respectively provided with a mounting hole, the two groups of door-shaped plates 36 are respectively and fixedly mounted at the two groups of mounting holes, each group of door-shaped plates 36 is respectively and rotatably mounted with a group of threaded rods 38 through bearings, each group of threaded rods 38 is in threaded connection with an L-shaped plate 39, each group of guide rods 37 passes through the L-shaped plate 39, the two ends of each group of guide rods 37 are respectively connected with one group of door-shaped plates 36, the left end and the right end of a transverse plate 2 are respectively mounted on the two groups of L-shaped plates 39, the bottom end of each group of threaded rods 38 is respectively and fixedly provided with a group of first bevel gears 40, the bottom of the worktable 1 is provided with a ring body 41, a supporting table 42 is transversely arranged in the ring body 41, the supporting table 42 is provided with a second motor 43, the output end of the second motor 43 is provided with a speed reducer 44, the output end of the speed reducer 44 is provided with a transverse shaft 45, two groups of second bevel gears 46 are arranged on the cross shaft 45, the two groups of second bevel gears 46 are respectively meshed with the two groups of first bevel gears 40, at least three groups of stabilizing bars 47 are arranged on the top of the supporting platform 42, and the cross shaft 45 is rotatably connected with the three groups of stabilizing bars 47 through bearings; the lifting mechanism has the following principle: through setting up three sets of stabilizer bars 47, second motor 43 drives speed reducer 44 after the circular telegram, cross axle 45 and second bevel gear 46 rotate, because second bevel gear 46 meshes with first bevel gear 40, and threaded rod 38 passes through the bearing and door template 36 rotation connection, thereby second motor 43 drives threaded rod 38 after the circular telegram and rotates, because threaded rod 38 and L template 39 threaded connection, and L template 39 can not rotate and take place to rotate along with threaded rod 38 under the effect of threaded rod 38 and guide bar 37, thereby second motor 43 drives L template 39 and diaphragm 2 etc. after the circular telegram and carries out height variation.
According to the silicon rod cutting equipment for ultrathin silicon wafer production, two groups of sliding rails 48 are fixedly mounted on a base 14, a portal frame 49 is connected onto the two groups of sliding rails 48 in a sliding manner, a third air cylinder 50 is arranged in the middle of the portal frame 49, a pressing plate 51 with an arc-shaped notch is arranged at the output end of the bottom end of the third air cylinder 50, a locking bolt 52 is connected onto the portal frame 49 in a threaded manner, and one end of the locking bolt 52 is in contact with one group of sliding rails 48; the portal frame 49 can slide on the two sets of slide rails 48, the position of the portal frame 49 is fixed by screwing the locking bolts 52, and after the position of the silicon rod 15 is adjusted, the third air cylinder 50 is operated to enable the pressing plate 51 to press the silicon rod 15 tightly, so that the position of the silicon rod 15 is fixed.
According to the silicon rod cutting equipment for ultrathin silicon wafer production, the four corners of the rear side wall of the base plate 27 are fixedly connected with the telescopic rods 53, and the other end of each group of telescopic rods 53 is fixedly connected with one corner of the front side wall of the movable plate 29; when the first cylinder 28 is operated, the telescopic rod 53 is simultaneously extended and retracted, and the stability of the movable plate 29 when extended and retracted is improved.
According to the silicon rod cutting equipment for producing the ultrathin silicon wafers, the third gear 25 is rotatably connected with the left connecting shaft through the bearing; the third gear 25 is rotatably connected with the left connecting shaft through a bearing, so that the stability of the third gear 25 during rotation is improved.
According to the silicon rod cutting equipment for ultrathin silicon wafer production, the first motor 8 is a speed reducing motor, and the rotating speed of the first motor 8 is adjustable; first motor 8 is gear motor to first motor 8 rotational speed is adjustable, and speed when adjustable buddha's warrior attendant line is rotatory further improves the practicality.
According to the silicon rod cutting equipment for producing the ultrathin silicon wafers, the inner top side wall, the inner bottom side wall, the inner front side wall and the inner rear side wall of the lantern ring 6 are respectively provided with the placing grooves, a plurality of balls 54 are placed in each group of placing grooves, and the balls 54 are contacted with the outer side wall of the door-shaped guide rail 5; by providing the balls 54, when the collar 6 moves relative to the gate rail 5, the balls 54 roll, reducing the frictional force between the collar 6 and the gate rail 5, and improving the stability in use.
According to the silicon rod cutting equipment for producing the ultrathin silicon wafers, the workbench 1 is hollow, the top of the workbench 1 is communicated with a plurality of liquid inlets, the plurality of liquid inlets are positioned in the area below the front end of the silicon rod 15, and the left side wall of the workbench 1 is communicated with a liquid outlet pipeline 55; inside coolant liquid that uses during the cutting entered into workstation 1 along a plurality of inlets, then flowed out along liquid outlet pipe 55, was convenient for collect the coolant liquid.
The silicon rod cutting equipment for producing the ultrathin silicon wafer disclosed by the invention has the following lifting mechanism principle in work: by arranging the three groups of stabilizer bars 47, the second motor 43 drives the speed reducer 44, the transverse shaft 45 and the second bevel gear 46 to rotate after being electrified, the second bevel gear 46 is meshed with the first bevel gear 40, and the threaded rod 38 is rotatably connected with the door-shaped plate 36 through a bearing, so that the threaded rod 38 is driven to rotate after the second motor 43 is electrified, the threaded rod 38 is in threaded connection with the L-shaped plate 39, the L-shaped plate 39 cannot rotate along with the threaded rod 38 under the action of the threaded rod 38 and the guide rod 37, and the L-shaped plate 39 and the transverse plate 2 and the like are driven to change the height after the second motor 43 is electrified;
the lantern ring 6 and the first rack 7 move left and right under the support of the door-shaped guide rail 5, and through the arrangement of the ball 54, when the collar 6 moves relative to the portal guide 5, the balls 54 roll, reducing the friction between the collar 6 and the portal guide 5, and since the drive shaft 10 is fixedly connected to the edge region of the drive disk 9, and the driving shaft 10 is rotatably connected with the driving rod 11 through a bearing, and the driving rod 11 is connected with the first rack 7 through a shaft, thereby driving the driving disk 9 to rotate and further driving the first rack 7 to reciprocate left and right after the first motor 8 is electrified, because the first gear 4 is rotationally connected with the transverse plate 2 through the bearing, and the first gear 4 is meshed with the first rack 7, after the first motor 8 is electrified, the first gear 4 and the inverted V-shaped rod 12 are reciprocated, and further the left diamond wire tractor 13, the right diamond wire tractor and the like are reciprocated;
under the support of the workbench 1, the left support rod, the right support rod 16 and the like, the swinging plate 18, the second gear 20, the left connecting shaft, the right connecting shaft 17 and the like can rotate, as a first left chain wheel is rotatably arranged on the left connecting shaft through a bearing, a second left chain wheel is rotatably arranged on the left fixing shaft through a bearing, a first right chain wheel 21 is rotatably arranged on the right connecting shaft 17 through a bearing, and a second right chain wheel 22 is rotatably arranged on the right fixing shaft 19 through a bearing, when the length of the output end of the second cylinder 32 is reduced, the second rack 34 and the third rack 35 are driven to simultaneously move backwards, as the second rack 34 is meshed with the second gear 20, the swinging plate 18 and the like can rotate, as the third rack 35 is meshed with the third gear 25, the first left chain wheel, the second left chain wheel, the first right chain wheel 21, the second right chain wheel 22, the left chain and the right chain 23 can rotate, because the base plate 27 is fixedly connected with the left chain and the rear chain through the four groups of connecting blocks 26, relative displacement is generated between the base plate 27 and the swinging plate 18, when the length of the output end of the second air cylinder 32 is reduced, the swinging plate 18, the base plate 27 and the like can forwardly extend for a certain length while the swinging plate 18, the base plate 27 and the like rotate forwards by taking the left connecting shaft and the right connecting shaft 17 as axes, and the positions of the suction cup 30 and the moving plate 29 can be controlled by controlling the length of the output end of the first air cylinder 28, so that the suction cup 30 can be controlled to suck the front end of the silicon rod 15;
when the silicon rod cutting machine is normally used, the silicon rod 15 is placed at the arc-shaped notch of the base 14, the position of the silicon rod 15 is adjusted according to the thickness of a required silicon wafer, after the position of the silicon rod 15 is adjusted, the third air cylinder 50 is operated to enable the pressing plate 51 to tightly press the silicon rod 15, the position of the silicon rod 15 is fixed, the second air cylinder 32 is operated to enable the sucker 30 to be in a vertical state, the first air cylinder 28 is operated to enable the sucker 30 to suck the front end face of the silicon rod 15, when the first air cylinder 28 acts, the telescopic rod 53 simultaneously extends and retracts to improve the stability when the moving plate 29 extends and retracts, then the left diamond wire tractor 13 and the right diamond wire tractor are started to enable the diamond wires to move, the first motor 8 is started to enable the diamond wires and the like to rotate by taking the central shaft of the first gear 4 as an axis, the lifting mechanism is operated to control the height of the diamond wires, when the silicon rod 15 is cut, the diamond wires slowly rotate by taking the central shaft of the first gear 4 as an axis simultaneously in the descending process, for the cutting mode of diamond wire straight-up among the prior art, the load of diamond wire is littleer, the silicon chip quality after the cutting is more excellent, and cutting efficiency has been improved, after the cutting finishes, operation elevating system makes the diamond wire rise and break away from silicon rod 15, then operation first cylinder 28 output shortens to make the silicon chip after the cutting move forward, then operation second cylinder 32 output shortens to make the silicon chip move forward when rotatory forward, then take off the silicon chip, the coolant liquid that uses during the cutting enters into workstation 1 inside along a plurality of inlets, then flow out along liquid outlet pipe 55, be convenient for collect the coolant liquid.
The invention relates to silicon rod cutting equipment for ultrathin silicon wafer production, wherein a left diamond wire tractor 13 and a right diamond wire tractor are purchased by a user, and the using method is detailed in the self-contained application instruction.
According to the silicon rod cutting equipment for producing the ultrathin silicon wafers, the installation modes, the connection modes or the arrangement modes of all the components are welding, riveting or other common mechanical modes, wherein the sliding/rotating fixation is that the components do not fall off in the sliding/rotating state, the sealing communication is that the two connecting pieces are communicated and simultaneously sealed, the specific structures, the models and the coefficient indexes of all the components are self-contained technologies, the beneficial effects can be achieved, all the electric modules and the electric appliances are common electric appliances in the market, the electric modules and the electric appliances can be used only by being electrically connected with each other according to the purchased instructions when bought back for use, and the control modules are common self-contained modules, so that the detailed description is omitted.
In the silicon rod cutting equipment for producing ultrathin silicon wafers, in the case of not being described to the contrary, the directional words included in the terms of "up, down, left, right, front, back, inside and outside, vertical and horizontal" and the like only represent the direction of the term in the conventional use state, or be a trivial term understood by those skilled in the art, and should not be considered as limiting the term, at the same time, the numerical terms "first," "second," and "third," etc. do not denote any particular quantity or order, but rather are used to distinguish one from another, furthermore, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements, but also includes other elements not expressly listed or inherent to such process, method, article, or apparatus.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (8)
1. A silicon rod cutting device for ultrathin silicon wafer production is characterized by comprising a workbench (1), wherein a lifting mechanism is arranged on the workbench (1), a transverse plate (2) is arranged at the output end of the lifting mechanism, a through hole is formed in the middle of the transverse plate (2), a rotating shaft (3) is rotatably installed at the position of the through hole through a bearing, a first gear (4) is fixedly connected onto the rotating shaft (3), a door-shaped guide rail (5) is arranged at the top of the transverse plate (2), a lantern ring (6) is slidably connected onto the door-shaped guide rail (5), a first rack (7) meshed with the first gear (4) is fixedly connected to the bottom end of the lantern ring (6), a first motor (8) is arranged at the top of the transverse plate (2), a driving disc (9) is fixedly connected to the output end of the first motor (8), a driving shaft (10) is fixedly connected to the edge area of the front side wall of the driving disc (9), and a driving rod (11) is rotatably arranged on the driving shaft (10) through a bearing, the left end of a driving rod (11) is connected with a first rack (7) in a shaft mode, an inverted V-shaped rod (12) is fixedly connected onto a rotating shaft (3), a left diamond wire tractor (13) is arranged at the left end of the inverted V-shaped rod (12), a right diamond wire tractor is arranged at the right end of the inverted V-shaped rod (12), a base (14) is arranged in the central area of the top of a workbench (1), an arc notch for placing a silicon rod (15) is formed in the base (14), a left supporting rod and a right supporting rod (16) are arranged in the central area of the top of the workbench (1), a left connecting shaft and a right connecting shaft (17) are respectively rotatably installed on the left supporting rod and the right supporting rod (16) through bearings, a swinging plate (18) is fixedly connected onto the left connecting shaft and the right connecting shaft (17), a left fixing shaft and a right fixing shaft (19) are respectively fixedly connected onto the top end of the left side wall and the top end of the right side wall of the swinging plate (18), and a second gear (20) is fixedly connected onto the right connecting shaft (17), a first left chain wheel is rotatably arranged on the left connecting shaft through a bearing, a second left chain wheel is rotatably arranged on the left fixing shaft through a bearing, a left chain is sleeved on the first left chain wheel and the second left chain wheel, a first right chain wheel (21) is rotatably arranged on the right connecting shaft (17) through a bearing, a third gear (25) is fixedly connected onto the first right chain wheel (21) through four groups of transition rods (24), a second right chain wheel (22) is rotatably arranged on the right fixing shaft (19) through a bearing, a right chain (23) is sleeved on the first right chain wheel (21) and the second right chain wheel (22), the rear ends of the left chain and the right chain (23) are fixedly connected with two groups of connecting blocks (26), the rear ends of the four groups of connecting blocks (26) are fixedly connected with a base plate (27), a first air cylinder (28) is arranged on the rear side wall of the base plate (27), and a moving plate (29) is arranged at the output end of the first air cylinder (28), the sucking disc (30) is arranged on the rear side wall of the moving plate (29), the platform (31) is fixedly connected onto the right supporting rod (16), the second air cylinder (32) is fixedly connected onto the top of the platform (31), the driving plate (33) is fixedly connected onto the output end of the second air cylinder (32), the second rack (34) and the third rack (35) are fixedly connected onto the left end of the driving plate (33), the second rack (34) is meshed with the second gear (20), and the third rack (35) is meshed with the third gear (25).
2. The silicon bar cutting equipment for ultrathin silicon wafer production as claimed in claim 1, wherein the lifting mechanism comprises two groups of door-shaped plates (36) and two groups of guide rods (37), the left and right sides of the worktable (1) are respectively provided with mounting holes, the two groups of door-shaped plates (36) are respectively and fixedly mounted at the two groups of mounting holes, each group of door-shaped plates (36) is rotatably mounted with a group of threaded rods (38) through bearings, each group of threaded rods (38) is in threaded connection with an L-shaped plate (39), each group of guide rods (37) passes through the L-shaped plate (39), both ends of each group of guide rods (37) are respectively connected with one group of door-shaped plates (36), the left and right ends of the transverse plate (2) are respectively mounted on the two groups of L-shaped plates (39), the bottom end of each group of threaded rods (38) is respectively fixed with a group of first bevel gears (40), the bottom of the worktable (1) is provided with a group of ring bodies (41), a supporting platform (42) is transversely arranged in the ring body (41), a second motor (43) is arranged on the supporting platform (42), a speed reducer (44) is arranged at the output end of the second motor (43), a transverse shaft (45) is arranged at the output end of the speed reducer (44), two groups of second bevel gears (46) are arranged on the transverse shaft (45), the two groups of second bevel gears (46) are respectively meshed with the two groups of first bevel gears (40), at least three groups of stabilizer bars (47) are arranged at the top of the supporting platform (42), and the transverse shaft (45) and the three groups of stabilizer bars (47) are rotatably connected through bearings.
3. The silicon rod cutting device for ultrathin silicon wafer production as claimed in claim 2, wherein two sets of slide rails (48) are fixedly mounted on the base (14), a portal frame (49) is slidably connected to the two sets of slide rails (48), a third cylinder (50) is arranged in the middle of the portal frame (49), a pressing plate (51) with an arc-shaped notch is arranged at the output end of the bottom end of the third cylinder (50), a locking bolt (52) is threadedly connected to the portal frame (49), and one end of the locking bolt (52) is in contact with one set of slide rails (48).
4. The silicon rod cutting device for ultra-thin silicon wafer production according to claim 3, wherein the telescopic rods (53) are fixedly connected to four corners of the rear side wall of the base plate (27), and the other end of each group of telescopic rods (53) is fixedly connected to one corner of the front side wall of the movable plate (29).
5. The silicon rod cutting device for ultra-thin silicon wafer production as claimed in claim 4, wherein the third gear (25) is rotatably connected with the left connecting shaft through a bearing.
6. The silicon rod cutting apparatus for ultra-thin silicon wafer production as set forth in claim 5, wherein the first motor (8) is a reduction motor, and the rotation speed of the first motor (8) is adjustable.
7. The silicon rod cutting device for ultra-thin silicon wafer production according to claim 6, wherein the inner top side wall, the inner bottom side wall, the inner front side wall and the inner rear side wall of the collar (6) are provided with placing grooves, a plurality of balls (54) are placed in each group of placing grooves, and the balls (54) are in contact with the outer side wall of the door type guide rail (5).
8. The silicon rod cutting equipment for ultrathin silicon wafer production as claimed in claim 7, wherein the workbench (1) is hollow and the top of the workbench (1) is communicated with a plurality of liquid inlets, the plurality of liquid inlets are positioned in the area below the front end of the silicon rod (15), and the left side wall of the workbench (1) is communicated with a liquid outlet pipeline (55).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110751980.9A CN113232180A (en) | 2021-07-03 | 2021-07-03 | Silicon rod cutting equipment for production of ultrathin silicon wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110751980.9A CN113232180A (en) | 2021-07-03 | 2021-07-03 | Silicon rod cutting equipment for production of ultrathin silicon wafers |
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| Publication Number | Publication Date |
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| CN113232180A true CN113232180A (en) | 2021-08-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110751980.9A Withdrawn CN113232180A (en) | 2021-07-03 | 2021-07-03 | Silicon rod cutting equipment for production of ultrathin silicon wafers |
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| CN (1) | CN113232180A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115890938A (en) * | 2022-11-02 | 2023-04-04 | 无锡展照精密机械科技有限公司 | Diamond wire slicing equipment with cooling liquid recycling function |
| CN115972418A (en) * | 2023-03-20 | 2023-04-18 | 西安中威新材料有限公司 | Silicon carbide ceramic wafer boat tooth punching equipment for wafer diffusion |
| CN116337750A (en) * | 2023-05-22 | 2023-06-27 | 张家口原轼新型材料股份有限公司 | Device and method for testing holding force of diamond wire |
| CN116653135A (en) * | 2023-06-07 | 2023-08-29 | 西南石油大学 | Slicing device for carbonate rock analysis |
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2021
- 2021-07-03 CN CN202110751980.9A patent/CN113232180A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115890938A (en) * | 2022-11-02 | 2023-04-04 | 无锡展照精密机械科技有限公司 | Diamond wire slicing equipment with cooling liquid recycling function |
| CN115890938B (en) * | 2022-11-02 | 2023-10-31 | 无锡展照精密机械科技有限公司 | Diamond wire slicing equipment capable of recycling cooling liquid |
| CN115972418A (en) * | 2023-03-20 | 2023-04-18 | 西安中威新材料有限公司 | Silicon carbide ceramic wafer boat tooth punching equipment for wafer diffusion |
| CN116337750A (en) * | 2023-05-22 | 2023-06-27 | 张家口原轼新型材料股份有限公司 | Device and method for testing holding force of diamond wire |
| CN116337750B (en) * | 2023-05-22 | 2023-08-22 | 张家口原轼新型材料股份有限公司 | Device and method for testing holding force of diamond wire |
| CN116653135A (en) * | 2023-06-07 | 2023-08-29 | 西南石油大学 | Slicing device for carbonate rock analysis |
| CN116653135B (en) * | 2023-06-07 | 2024-02-20 | 西南石油大学 | Slicing device for carbonate rock analysis |
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