CN113001791B - Mobile intelligent bracelet chip processing system and method suitable for tourism team management - Google Patents
Mobile intelligent bracelet chip processing system and method suitable for tourism team management Download PDFInfo
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- CN113001791B CN113001791B CN202110211342.8A CN202110211342A CN113001791B CN 113001791 B CN113001791 B CN 113001791B CN 202110211342 A CN202110211342 A CN 202110211342A CN 113001791 B CN113001791 B CN 113001791B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
- B24B3/463—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades of slicing machine disc blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a mobile intelligent bracelet chip processing system and method suitable for tourism team management, wherein the mobile intelligent bracelet chip processing system comprises an operation table, an auxiliary limiting device, a cutting device, an adjusting device and a charging box, and a silicon ingot with a certain length is fixed through the auxiliary limiting device by manpower; the stability of the silicon ingot in the slicing process is kept; the parts are tightly connected and coupled, so that the problem that the continuous progression of the silicon ingot is difficult to ensure after the silicon ingot is sliced in the existing silicon ingot cutting process, the cutting effect of the silicon ingot is influenced, and the thickness of a cut silicon wafer is uneven can be solved; and the silicon ingot cutting process is difficult to keep stable, so that the stability of the silicon ingot is influenced, the surface of a silicon wafer cut by the silicon ingot is uneven, the use effect in the later stage of the silicon wafer is seriously influenced, the surface sharpness of the cutting wheel disc is reduced after the existing silicon wafer is cut for a long time, and the service life of the cutting wheel disc is seriously influenced.
Description
Technical Field
The invention relates to the technical field of electronic engineering, in particular to a mobile intelligent bracelet chip processing system and method suitable for tourism team management.
Background
The intelligent bracelet is a wearing type intelligent device, mainly records real-time data such as exercise, sleep, diet and location in daily life, synchronizes the data with a mobile phone, a tablet computer and the like, and plays a role in guiding healthy life through the data.
The core component of the smart bracelet is a chip; the manufacturing process of the chip can be generally divided into a wafer processing procedure, a wafer probe testing procedure, a packaging procedure, a testing procedure and other steps, wherein the wafer processing procedure relates to silicon ingot slicing processing, and the following problems mainly exist in the current silicon ingot cutting process:
after the silicon ingot is sliced, the continuous progression of the silicon ingot is difficult to ensure, so that the cutting effect of the silicon ingot is influenced, and the thickness of a cut silicon wafer is uneven; and the silicon ingot cutting process is difficult to keep stable, so that the stability of the silicon ingot is influenced, the surface of a silicon wafer cut by the silicon ingot is uneven, the later-stage use effect of the silicon wafer is seriously influenced, the surface sharpness of the cutting wheel disc is reduced after the existing silicon wafer is cut for a long time, and the service life of the cutting wheel disc is seriously influenced.
Therefore, in order to prolong the service life of the cutting wheel disc; ensuring the quality effect of the cut silicon wafer; the invention provides a mobile intelligent bracelet chip processing system and method suitable for tourism team management.
Disclosure of Invention
In order to achieve the purpose, the invention adopts the following technical scheme that the mobile intelligent bracelet chip processing system suitable for the management of a tourism team comprises an operation table, an auxiliary limiting device, a cutting device, an adjusting device and a charging box; an auxiliary limiting device is arranged on the inner wall of the right side in the operating platform in a sliding fit mode, a charging box is arranged on the inner wall of the operating platform, and the charging box is located right below the auxiliary limiting device; the inner wall of the left end of the operating platform is provided with an adjusting device in a sliding fit mode, the outer wall of the left side of the operating platform is provided with a cutting device, the cutting device is positioned right above the operating platform, and the cutting device is matched with the auxiliary limiting device; wherein:
the auxiliary limiting device comprises an adjusting motor, an adjusting screw rod, an adjusting slide block, a limiting pressure plate, an electric limiting slide block, a pushing clamping rod, an auxiliary slide block, an auxiliary lapping plate and a supporting connecting rod; the adjusting motor is installed on the inner wall of the left end of the operating platform through a motor base, an output shaft of the adjusting motor is connected with a lower end shaft head of the adjusting screw rod through a coupler, an upper end shaft head of the adjusting screw rod is installed on the inner wall of the operating platform through a bearing, and an adjusting sliding block is installed on the adjusting screw rod in a threaded connection mode; the side wall of the adjusting slide block is provided with a limiting press plate, the lower end of the limiting press plate is provided with a rectangular sliding groove, and the rectangular sliding groove of the limiting press plate is internally provided with an electric limiting slide block in a sliding fit manner; the lower end of the electric limiting sliding block is provided with a pushing clamping rod which is of an L-shaped structure, and the outer wall of the upper end of the left side of the limiting pressing plate is provided with an auxiliary sliding block; the auxiliary lapping plate is arranged on the inner wall of the right side of the operating platform and is positioned below the pushing clamping rod; a U-shaped clamping groove is formed in the auxiliary lapping plate; the supporting connecting rod is arranged on the inner wall of the right side of the operating platform and is connected with the outer wall of the lower end of the auxiliary lapping plate; the auxiliary limiting device is convenient for fixing the silicon ingot on the auxiliary lapping plate and keeping the stability of the silicon ingot; the progressive effect of the silicon ingot is completed by the cooperation of the electric limiting slide block and the pushing clamping rod, so that the slicing effect of the silicon ingot is effectively guaranteed.
Preferably; the cutting device comprises a lap joint clamping frame, a supporting clamping table, an electric execution sliding block, a lifting cylinder, a fixed clamping block, a polishing unit, a cutting motor and a cutting wheel disc; the inner wall of the top end of the lap joint clamping frame is provided with a supporting clamping table with an L-shaped structure, and the outer wall of the right side of the supporting clamping table is provided with a sliding groove which is matched with the auxiliary limiting device; an electric execution sliding block is arranged on the inner wall of the top end of the supporting clamping table in a sliding fit mode; the lower end of the electric execution sliding block is provided with a lifting cylinder, the top end of the lifting cylinder is provided with a fixed fixture block, the inner wall of the top end of the fixed fixture block is provided with a polishing unit through a bolt, the cutting motor is arranged on the inner side wall of the fixed fixture block through a motor base, the output shaft of the cutting motor is provided with a cutting wheel disc through a flange, and the cutting wheel disc is matched with the polishing unit; the arranged cutting device is convenient for adjusting the thickness of the cut silicon wafer through the electric execution slide block; and the silicon ingots with different diameters are sliced under the action of the lifting cylinder.
Preferably; the adjusting device comprises an adjusting cylinder, an adjusting clamping plate, a limiting column, a limiting spring, an electric clamping sliding block, a limiting clamping ring, a jacking spring and a jacking plate; the top end of the adjusting cylinder is connected to the adjusting clamping plate; the inner wall of the left side of the adjusting clamping plate is provided with a limiting column, the outer wall of the limiting column is sleeved with a limiting spring, and the electric clamping sliding block is arranged on the inner wall of the left end of the operating platform in a sliding fit mode; the outer wall of the electric clamping sliding block is provided with a limiting snap ring, the limiting snap ring is sleeved on the outer wall of the limiting post, the lower end of the limiting snap ring is matched with the limiting spring, and balls are uniformly arranged on the outer wall of the limiting snap ring in a movable connection mode and are matched with the outer wall of the adjusting clamping plate; the outer wall of the right end of the adjusting clamping plate is provided with a jacking plate in a movable connection mode, and the inner wall of the jacking plate is connected with the inner wall of the adjusting clamping plate through evenly arranged jacking springs; the adjusting device who sets up is convenient for adjust the position of cardboard through the effect of adjusting cylinder and is realized coordinating fixedly to the silicon bulk top outer wall of different diameters to effectual the realization of the effect through the spring cooperation kicking plate of stretching on the top launches the silicon chip after the section to the magazine is inside avoids silicon chip and kicking plate contact adhesion to influence the cutting of later stage silicon bulk.
Preferably; the polishing unit comprises a fixed disc, a movable spring and a brushing block; the fixed disc is provided with a mounting hole; the inner wall of the mounting hole of the fixed disc is symmetrically provided with brushing blocks in a sliding fit mode, and the brushing blocks are connected with the inner wall of the mounting hole of the fixed disc through a movable spring; the polishing unit that sets up makes the cutting tooth of scrubbing piece and cutting rim plate mutually support and has guaranteed the sharpness of cutting rim plate through the effect that the scrubbing piece was stretched in the activity spring top.
Preferably; the outer wall of the left end of the propelling clamping rod is uniformly provided with balls in a movable connection mode; the outer wall of the left end of the pushing clamping rod is evenly provided with balls in a movable connection mode, so that the pushing clamping rod and the outer wall of the silicon ingot can be conveniently matched to work, and the progressive effect of the silicon ingot can be completed.
Preferably; the outer wall of the lower end of the left side of the limiting pressing plate is evenly provided with balls in a movable connection mode, the balls are evenly arranged on the outer wall of the lower end of the left side of the limiting pressing plate in a movable connection mode, so that the moving effect between the limiting pressing plate and the lower end and the silicon ingot is promoted, the limiting pressing plate is guaranteed to have a fixed limiting fixing effect, the silicon ingot is effectively prevented from shaking and deflecting, and the stability of the silicon ingot is guaranteed.
Preferably; the rollers are uniformly arranged in the U-shaped clamping grooves of the auxiliary lapping plates through bearings; the U-shaped clamping groove of the auxiliary lapping plate is internally and uniformly provided with the roller through the bearing, so that the moving effect of the silicon ingot is promoted, and the progressive effect of the sliced silicon ingot is effectively guaranteed.
Preferably; the outer wall of the brushing block is uniformly provided with steel wire brush hairs; the outer wall of the scrubbing block is uniformly provided with steel wire bristles, so that the polishing effect between the scrubbing block and the cutting wheel disc is guaranteed, and the sharpness of the cutting wheel disc is effectively guaranteed.
In addition, the invention also provides a mobile intelligent bracelet chip processing system suitable for tourism team management, and specifically, the processing method of the mobile intelligent bracelet chip processing system for tourism team management comprises the following steps:
s1: fixing a silicon ingot with a certain length through an auxiliary limiting device manually; the stability of the silicon ingot in the slicing process is kept;
s2: slicing the fixed silicon ingot through a cutting device, collecting the sliced silicon wafers through a charging box, and progressively processing the silicon ingot through an auxiliary limiting device so as to finish the slicing processing of the whole silicon ingot;
s3: after the silicon ingot is sliced, the silicon wafers in the charging box are manually collected and processed, and the quality of the sliced silicon wafers is checked.
The invention has the beneficial effects that:
1. the auxiliary limiting device is convenient for fixing the silicon ingot on the auxiliary lapping plate and keeping the stability of the silicon ingot; the progressive action of the silicon ingot is completed by the cooperation of the electric limiting slide block and the pushing clamping rod, so that the slicing effect of the silicon ingot is effectively ensured;
2. according to the invention, the thickness of the cut silicon wafer can be conveniently adjusted through the electric execution sliding block by the arranged cutting device; the silicon ingots with different diameters are sliced under the action of the lifting cylinder;
3. the adjusting device is convenient for adjusting the position of the adjusting clamping plate under the action of the adjusting cylinder to realize the matching and fixing of the top end outer walls of the silicon ingots with different diameters, and the ejection of the sliced silicon wafers into the charging box is effectively realized under the action of the ejection spring matched with the ejector plate, so that the silicon wafers are prevented from contacting and adhering with the ejector plate to influence the cutting of the silicon ingots in the later period;
4. according to the invention, the grinding unit is arranged, so that the brushing block is matched with the cutting teeth of the cutting wheel disc through the action of the movable spring pushing and extending the brushing block, and the sharpness of the cutting wheel disc is ensured.
Drawings
The invention is further illustrated by the following examples in conjunction with the drawings.
FIG. 1 is a front elevational cut-away view of the present invention;
FIG. 2 is an enlarged view of a portion of the invention at A in FIG. 1;
FIG. 3 is an enlarged view of a portion of the invention at B in FIG. 1;
FIG. 4 is an enlarged view of a portion of the invention at C in FIG. 1;
FIG. 5 is a schematic perspective view of the auxiliary strap of the present invention;
fig. 6 is a schematic perspective view of the push rod of the present invention.
Detailed Description
Embodiments of the present invention will be described below with reference to the drawings. In this process, the width of the lines or the size of the components in the drawings may be exaggerated for clarity and convenience of description.
In addition, the following terms are defined based on functions in the present invention, and may be different according to intentions or conventions of a user or an operator; therefore, these terms are defined based on the entire contents of the present specification.
As shown in fig. 1 to 6, a mobile intelligent bracelet chip processing system suitable for management of a tourism team comprises an operation table 1, an auxiliary limiting device 2, a cutting device 3, an adjusting device 4 and a cartridge 5; an auxiliary limiting device 2 is installed on the inner wall of the right side in the operating platform 1 in a sliding fit mode, a charging box 5 is arranged on the inner wall of the operating platform 1, and the charging box 5 is located right below the auxiliary limiting device 2; an adjusting device 4 is arranged on the inner wall of the left end of the operating platform 1 in a sliding fit mode, a cutting device 3 is arranged on the outer wall of the left side of the operating platform 1, the cutting device 3 is located right above the operating platform 1, and the cutting device 3 is matched with the auxiliary limiting device 2; wherein:
the auxiliary limiting device 2 comprises an adjusting motor 21, an adjusting screw 22, an adjusting slide block 23, a limiting pressure plate 24, an electric limiting slide block 25, a pushing clamping rod 26, an auxiliary slide block 27, an auxiliary lapping plate 28 and a supporting connecting rod 29; the adjusting motor 21 is installed on the inner wall of the left end of the operating platform 1 through a motor base, an output shaft of the adjusting motor 21 is connected with a lower end shaft head of an adjusting screw rod 22 through a coupler, an upper end shaft head of the adjusting screw rod 22 is installed on the inner wall of the operating platform 1 through a bearing, and an adjusting slide block 23 is installed on the adjusting screw rod 22 in a threaded connection mode; a limiting pressure plate 24 is arranged on the side wall of the adjusting slide block 23, a rectangular sliding groove is arranged at the lower end of the limiting pressure plate 24, and an electric limiting slide block 25 is arranged in the rectangular sliding groove of the limiting pressure plate 24 in a sliding fit manner; the lower end of the electric limiting slide block 25 is provided with a propelling clamping rod 26, the propelling clamping rod 26 is of an L-shaped structure, and the outer wall of the upper end of the left side of the limiting press plate 24 is provided with an auxiliary slide block 27; the outer wall of the left end of the propelling clamping rod 26 is uniformly provided with balls in a movable connection mode; the outer wall of the left end of the pushing clamping rod 26 is uniformly provided with balls in a movable connection mode, so that the pushing clamping rod 26 is matched with the outer wall of a silicon ingot to complete the progressive action of the silicon ingot; the outer wall of the lower end of the left side of the limiting pressing plate 24 is uniformly provided with balls in a movable connection mode, the balls are uniformly arranged on the outer wall of the lower end of the left side of the limiting pressing plate 24 in a movable connection mode, so that the moving effect between the limiting pressing plate 24 and the lower end and the silicon ingot is promoted, the limiting and fixing effect of the limiting pressing plate 24 on fixation is ensured, the silicon ingot is effectively prevented from shaking and deflecting, and the stability of the silicon ingot is ensured; the auxiliary lapping plate 28 is arranged on the inner wall of the right side of the operating platform 1 and is positioned below the pushing clamping rod 26; a U-shaped clamping groove is formed in the auxiliary lapping plate 28; rollers are uniformly arranged in the U-shaped clamping groove of the auxiliary lapping plate 28 through a bearing; the rollers are uniformly arranged in the U-shaped clamping groove of the auxiliary lapping plate 28 through the bearing, so that the moving effect of the silicon ingot is promoted, and the progressive action of the sliced silicon ingot is effectively ensured; the supporting connecting rod 29 is arranged on the inner wall of the right side of the operating platform 1 and is connected with the outer wall of the lower end of the auxiliary lapping plate 28; the auxiliary limiting device 2 is arranged to facilitate the silicon ingot to be fixed on the auxiliary lapping plate 28 and keep the stability of the silicon ingot; the progressive effect of the silicon ingot is completed by the cooperation of the electric limiting slide block 25 and the pushing clamping rod 26, so that the slicing effect of the silicon ingot is effectively guaranteed.
The cutting device 3 comprises an overlapping clamp frame 31, a supporting clamp table 32, an electric execution slide block 33, a lifting cylinder 34, a fixed clamp block 35, a grinding unit 36, a cutting motor 37 and a cutting wheel disc 38; the inner wall of the top end of the lap joint clamping frame 31 is provided with a supporting clamping table 32 with an L-shaped structure, and the outer wall of the right side of the supporting clamping table 32 is provided with a sliding groove which is matched with the auxiliary limiting device 2; an electric execution sliding block 33 is arranged on the inner wall of the top end of the supporting clamping table 32 in a sliding fit mode; the lower end of the electric execution sliding block 33 is provided with a lifting cylinder 34, the top end of the lifting cylinder 34 is provided with a fixed clamping block 35, the inner wall of the top end of the fixed clamping block 35 is provided with a polishing unit 36 through a bolt, the cutting motor 37 is arranged on the inner side wall of the fixed clamping block 35 through a motor base, the output shaft of the cutting motor 37 is provided with a cutting wheel disc 38 through a flange, and the cutting wheel disc 38 is matched with the polishing unit 36; the cutting device 3 is arranged to conveniently adjust the thickness of the cut silicon wafer through the electric execution sliding block 33; and the silicon ingots with different diameters are sliced through the action of the lifting cylinder 34.
The adjusting device 4 comprises an adjusting cylinder 41, an adjusting clamping plate 42, a limiting column 43, a limiting spring 44, an electric clamping sliding block 45, a limiting clamping ring 46, a jacking spring 47 and a jacking plate 48; the top end of the adjusting cylinder 41 is connected to the adjusting clamping plate 42; a limiting column 43 is arranged on the inner wall of the left side of the adjusting clamping plate 42, a limiting spring 44 is sleeved on the outer wall of the limiting column 43, and the electric clamping sliding block 45 is installed on the inner wall of the left end of the operating platform 1 in a sliding fit mode; the outer wall of the electric clamping sliding block 45 is provided with a limiting snap ring 46, the limiting snap ring 46 is sleeved on the outer wall of the limiting column 43, the lower end of the limiting snap ring 46 is matched with the limiting spring 44, and balls are uniformly arranged on the outer wall of the limiting snap ring 46 in a movable connection mode to be matched with the outer wall of the adjusting clamping plate 42; the outer wall of the right end of the adjusting clamping plate 42 is provided with a material ejecting plate 48 in a movable connection mode, and the inner wall of the material ejecting plate 48 is connected with the inner wall of the adjusting clamping plate 42 through evenly arranged jacking springs 47; adjusting device 4 that sets up is convenient for adjust the position of cardboard 42 through the effect of adjusting cylinder 41 and is realized coordinating fixedly to the silicon bulk top outer wall of different diameters to the effectual realization of effect through the cooperation of jacking spring 47 ejector plate 48 launches the silicon chip after the section to the charging box 5 is inside to avoid silicon chip and ejector plate 48 to contact the cutting of adhesion influence later stage silicon bulk.
The grinding unit 36 comprises a fixed disc 361, a movable spring 362 and a brushing block 363; the fixed disc 361 is provided with a mounting hole; the inner wall of the mounting hole of the fixed disk 361 is symmetrically provided with brushing blocks 363 in a sliding fit manner, and the brushing blocks 363 are connected with the inner wall of the mounting hole of the fixed disk 361 through a movable spring 362; the outer wall of the brushing block 363 is uniformly provided with steel wire brush hairs; the steel wire bristles are uniformly arranged on the outer wall of the brushing block 363, so that the polishing effect between the brushing block 363 and the cutting wheel disc 38 is guaranteed, and the sharpness of the cutting wheel disc 38 is effectively guaranteed; the sharpening unit 36 is arranged such that the cutting teeth of the cutting wheel 38 are mutually engaged with the brush block 363 by the action of the movable spring 362 pushing against the brush block 363 to ensure the sharpness of the cutting wheel 38.
In addition, the invention also provides a mobile intelligent bracelet chip processing system suitable for tourism team management, and specifically the processing method of the mobile intelligent bracelet chip processing system suitable for tourism team management comprises the following steps:
s1: fixing a silicon ingot with a certain length through the auxiliary limiting device 2 manually; the stability of the silicon ingot in the slicing process is kept;
s2: slicing the fixed silicon ingot through a cutting device 3, collecting the sliced silicon wafers through a charging box 5, and progressively processing the silicon ingot through an auxiliary limiting device 2 so as to finish the slicing processing of the whole silicon ingot;
s3: after the silicon ingot is sliced, the silicon wafers inside the charging box 5 are manually collected and the quality of the sliced silicon wafers is checked.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A mobile intelligent bracelet chip processing system suitable for tour group management comprises an operation table (1), an auxiliary limiting device (2), a cutting device (3), an adjusting device (4) and a charging box (5); the method is characterized in that: an auxiliary limiting device (2) is installed on the inner wall of the right side in the operating platform (1) in a sliding fit mode, a charging box (5) is arranged on the inner wall of the operating platform (1), and the charging box (5) is located right below the auxiliary limiting device (2); an adjusting device (4) is arranged on the inner wall of the left end of the operating platform (1) in a sliding fit mode, a cutting device (3) is arranged on the outer wall of the left side of the operating platform (1), the cutting device (3) is positioned right above the operating platform (1), and the cutting device (3) is matched with the auxiliary limiting device (2); wherein:
the auxiliary limiting device (2) comprises an adjusting motor (21), an adjusting screw rod (22), an adjusting slide block (23), a limiting pressure plate (24), an electric limiting slide block (25), a pushing clamping rod (26), an auxiliary slide block (27), an auxiliary lapping plate (28) and a supporting connecting rod (29); the adjusting motor (21) is installed on the inner wall of the left end of the operating platform (1) through a motor base, an output shaft of the adjusting motor (21) is connected with a lower end shaft head of an adjusting lead screw (22) through a coupler, an upper end shaft head of the adjusting lead screw (22) is installed on the inner wall of the operating platform (1) through a bearing, and an adjusting slide block (23) is installed on the adjusting lead screw (22) in a threaded connection mode; a limiting pressure plate (24) is arranged on the side wall of the adjusting slide block (23), a rectangular sliding groove is formed in the lower end of the limiting pressure plate (24), and an electric limiting slide block (25) is arranged in the rectangular sliding groove of the limiting pressure plate (24) in a sliding fit mode; a pushing clamping rod (26) is arranged at the lower end of the electric limiting sliding block (25), the pushing clamping rod (26) is of an L-shaped structure, and an auxiliary sliding block (27) is arranged on the outer wall of the upper end of the left side of the limiting pressing plate (24); the auxiliary lapping plate (28) is arranged on the inner wall of the right side of the operating platform (1) and is positioned below the pushing clamping rod (26); a U-shaped clamping groove is formed in the auxiliary lapping plate (28); the supporting connecting rod (29) is arranged on the inner wall of the right side of the operating platform (1) and is connected with the outer wall of the lower end of the auxiliary lapping plate (28);
the cutting device (3) comprises an overlapping clamp frame (31), a supporting clamp table (32), an electric execution sliding block (33), a lifting cylinder (34), a fixed clamping block (35), a grinding unit (36), a cutting motor (37) and a cutting wheel disc (38); a supporting clamping table (32) with an L-shaped structure is mounted on the inner wall of the top end of the lapping clamping frame (31), and a sliding groove is formed in the outer wall of the right side of the supporting clamping table (32) and is matched with the auxiliary limiting device (2); an electric execution sliding block (33) is arranged on the inner wall of the top end of the supporting clamping table (32) in a sliding fit mode; the lower end of the electric execution sliding block (33) is provided with a lifting cylinder (34), the top end of the lifting cylinder (34) is provided with a fixed clamping block (35), the inner wall of the top end of the fixed clamping block (35) is provided with a polishing unit (36) through a bolt, the cutting motor (37) is arranged on the inner side wall of the fixed clamping block (35) through a motor base, the output shaft of the cutting motor (37) is provided with a cutting wheel disc (38) through a flange, and the cutting wheel disc (38) is matched with the polishing unit (36);
the adjusting device (4) comprises an adjusting cylinder (41), an adjusting clamping plate (42), a limiting column (43), a limiting spring (44), an electric clamping sliding block (45), a limiting clamping ring (46), a jacking spring (47) and a jacking plate (48); the top end of the adjusting cylinder (41) is connected to the adjusting clamping plate (42); a limiting column (43) is arranged on the inner wall of the left side of the adjusting clamping plate (42), a limiting spring (44) is sleeved on the outer wall of the limiting column (43), and the electric clamping sliding block (45) is installed on the inner wall of the left end of the operating platform (1) in a sliding fit mode; the outer wall of the electric clamping sliding block (45) is provided with a limiting clamp ring (46), the limiting clamp ring (46) is sleeved on the outer wall of the limiting column (43), the lower end of the limiting clamp ring (46) is matched with a limiting spring (44), and balls are uniformly arranged on the outer wall of the limiting clamp ring (46) in a movable connection mode to be matched with the outer wall of the adjusting clamp plate (42); the outer wall of the right end of the adjusting clamping plate (42) is provided with a material ejecting plate (48) in a movable connection mode, and the inner wall of the material ejecting plate (48) is connected with the inner wall of the adjusting clamping plate (42) through evenly arranged ejection springs (47).
2. The mobile smart bracelet chip processing system suitable for travel team management according to claim 1; the method is characterized in that: the grinding unit (36) comprises a fixed disc (361), a movable spring (362) and a brushing block (363); the fixed disc (361) is provided with a mounting hole; the inner wall of the mounting hole of the fixed disc (361) is symmetrically provided with brushing blocks (363) in a sliding fit mode, and the brushing blocks (363) are connected with the inner wall of the mounting hole of the fixed disc (361) through a movable spring (362).
3. The mobile smart bracelet chip processing system suitable for travel team management according to claim 1; the method is characterized in that: the outer wall of the left end of the propelling clamping rod (26) is uniformly provided with balls in a movable connection mode.
4. The mobile smart bracelet chip processing system adapted for travel team management according to claim 1; the method is characterized in that: the outer wall of the lower end of the left side of the limiting pressing plate (24) is evenly provided with balls in a movable connection mode.
5. The mobile smart bracelet chip processing system suitable for travel team management according to claim 1; the method is characterized in that: and rollers are uniformly arranged in the U-shaped clamping grooves of the auxiliary lapping plates (28) through bearings.
6. A mobile smart bracelet chip processing system adapted for use in travel team management according to claim 2; the method is characterized in that: the outer wall of the brushing block (363) is uniformly provided with steel wire brush hairs.
7. A mobile intelligent bracelet chip processing system suitable for management of a travel team according to any one of claims 1 to 6, wherein: specifically, the processing method of the mobile intelligent bracelet chip processing system managed by the tourism team comprises the following steps:
s1: fixing a silicon ingot with a certain length through an auxiliary limiting device (2) manually; the stability of the silicon ingot in the slicing process is kept;
s2: slicing the fixed silicon ingot through a cutting device (3), collecting the sliced silicon wafers through a charging box (5), and carrying out progressive processing on the silicon ingot through an auxiliary limiting device (2), so that the slicing processing of the whole silicon ingot is completed;
s3: after the silicon ingot is sliced, the silicon wafers in the charging box (5) are manually collected and processed, and the quality of the sliced silicon wafers is checked.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110211342.8A CN113001791B (en) | 2021-02-25 | 2021-02-25 | Mobile intelligent bracelet chip processing system and method suitable for tourism team management |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110211342.8A CN113001791B (en) | 2021-02-25 | 2021-02-25 | Mobile intelligent bracelet chip processing system and method suitable for tourism team management |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113001791A CN113001791A (en) | 2021-06-22 |
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