CN113910109A - A Wafer Sandblasting Double Feeder - Google Patents

Abstract

The invention discloses a dual-feeder for sandblasting of wafers, which comprises a sandblaster. The sandblaster comprises a sandblaster body and a crawler conveyor. The sandblaster body is arranged at the upper end of the middle of the crawler conveyor, and the crawler conveyor The two ends of the sandblasting machine protrude from the body of the sandblasting machine; there are two sandblasting machines, and the sandblasting machines are respectively arranged on the left and right sides of the double feeder. Mechanism and unloading manipulator; the invention can supply materials to two sandblasting machines at the same time through the setting of double feeding mechanisms, which reduces the frequency of feeding, and can automatically carry out the wafer feeding through the handling mechanism, the conveying mechanism and the unloading manipulator. Handling improves the automation of the equipment, avoids manual handling, and greatly improves the efficiency of wafer sandblasting. The stability of blasting and feeding ensures the quality of blasting.

Description

A Wafer Sandblasting Double Feeder

technical field

The invention relates to the technical field of wafer sandblasting, in particular to a dual feeder for wafer sandblasting.

Background technique

During the production process of wafers, after the silicon ingot is cut into wafers, some of the wafers may need to be sandblasted to facilitate subsequent processing of the wafers. Due to the impact and cutting effect of abrasives on the surface of the workpiece, the sandblasting machine can obtain a certain degree of cleanliness and different roughness on the surface of the workpiece, so that the mechanical properties of the workpiece surface are improved, thus improving the fatigue resistance of the workpiece and increasing its The adhesion between the coating and the coating can eliminate the residual stress of the workpiece and improve the surface hardness of the substrate.

The existing sandblasting machine has the problem that the automatic feeding operation cannot be performed during operation. The wafers to be sandblasted need to be manually placed on the conveyor belt inside the sandblasting machine. Manual feeding takes a long time, resulting in sandblasting. The efficiency of the machine is low; in the process of manual feeding, the collision between the wafer and the sandblasting machine and the collision between the wafer and the wafer are prone to occur, so that the wafer has a missing angle or fragmentation, which will lead to an increase in the fragmentation rate; in addition, , the manual feeding is unstable, which will not only cause the problem of lamination, but also cause the problem of overlapping positions, resulting in insufficient sandblasting and affecting the production yield of semiconductor wafers; in response to the above problems, we propose a wafer spraying Sand dual feeder.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a dual feeder for sandblasting of wafers, so as to solve the problems raised in the above-mentioned background art.

To achieve the above object, the present invention provides the following technical solutions:

A dual-feeder for sandblasting of wafers includes a sandblaster, the sandblaster includes a sandblaster body and a crawler conveyor, the sandblaster body is arranged at the upper end of the middle of the crawler conveyor, and both ends of the crawler conveyor extend Out of the sandblasting machine body;

There are two sandblasting machines. The sandblasting machines are respectively arranged on the left and right sides of the double feeder. The double feeder includes a worktable, a double feeding mechanism, a handling mechanism, a conveying mechanism and a feeding manipulator. The double feeding mechanism Set at the front of the worktable, it includes a left feeding mechanism and a right feeding mechanism with the same structure, which are used for storing wafers. There are two conveying mechanisms and are arranged in the middle of the worktable. It is arranged on the rear side of the left feeding mechanism and the right feeding mechanism, and the transport mechanism is used to transport the wafers from the double feeding mechanism to the transport mechanism. The conveying mechanism is provided with a sensor for detecting single and double wafers. When the wafer on the conveying mechanism is a single wafer, the wafer is conveyed to the crawler conveyor by a feeding manipulator. Set on the rear side of the two conveying mechanisms.

Preferably, the left feeding mechanism includes a first mounting plate, a jacking mechanism, a jacking plate, a jacking rod, a positioning seat and a positioning rod, the jacking mechanism is fixed below the first mounting plate, and its output end is fixed with the jacking rod Connection, the upper end of the jacking rod is fixedly installed with a top plate, a positioning seat is arranged above the first installation plate, a number of positioning rods are arranged in a circular array on the positioning seat, and the center of the positioning seat is provided with an escape for passing the top plate hole, the wafer is placed in the middle of the positioning rod.

Preferably, the left feeding mechanism further includes a guide seat, a first cylinder and a support, the guide seat is provided with a guide groove, the rear side of the guide groove is a straight groove, the front side is an arc groove, the left and right sides of the positioning seat are The end is arranged in the guide groove through a pin shaft, a first cylinder is arranged behind the positioning seat, the piston rod of the first cylinder is rotatably connected with the rear end of the positioning seat, and the rear end is rotatably mounted on the support.

Preferably, the jacking mechanism includes a second mounting plate, a first motor, a fixing rod, a screw rod and a threaded seat, the second mounting plate is arranged in parallel below the first mounting plate, and the fixing rod is fixed on the first mounting plate and the second mounting plate Between the plates, the lower end of the second mounting plate is fixed with the first motor, the motor shaft of the first motor extends out of the second mounting plate and is fixedly connected with the screw, the screw is installed with a threaded seat, and the lower end of the jacking rod is installed on the threaded seat superior.

Preferably, the conveying mechanism includes a third mounting plate, a second cylinder, a support block, a guide rail, a slider, a fourth mounting plate, a third cylinder and a first suction cup, the third mounting plate is fixed on the worktable, and the third mounting plate is A second cylinder and a support block are installed at the upper end of the support block, a guide rail is fixed on the upper end of the support block, the slider is slidably installed on the guide rail, the piston rod of the second cylinder is connected with the slider, and the upper end of the slider is fixedly installed with a fourth installation A third air cylinder is installed on the fourth installation plate, and a first suction cup is installed at the lower end of the third air cylinder.

Preferably, the conveying mechanism includes a conveyor, a second motor, a sensor and a receiving box, the conveyor is arranged along the Y-axis, and is drivingly connected with the second motor, and the receiving box is arranged at the tail of the end of the conveyor away from the double feeding mechanism , which is inclined downward, and there are several sensors, which are installed on the transfer path of the wafer.

Preferably, the feeding manipulator includes a first linear module set along the X-axis direction, a second linear module set along the Y-axis direction, a third linear module set along the Z-axis direction, an L-shaped block and a first linear module set along the Z-axis direction. Two suction cups, the second linear module is fixed on the moving end of the first linear module, the third linear module is fixed on the moving end of the second linear module, and the L-shaped block is fixed on the moving end of the third linear module The second suction cup is installed on the lower end.

Preferably, one side of the double feeding mechanism is provided with an air flotation separation module, and the air flotation separation module is used for blowing and separating several wafers on the top layer of the double feeding mechanism.

Compared with the prior art, the beneficial effects of the present invention are:

1. In the present invention, the non-sandblasted wafers are placed in the left feeding mechanism and the right feeding mechanism of the dual feeding mechanism, and the wafers are transported from the left feeding mechanism and the right feeding mechanism through the two transport mechanisms. On the two conveying mechanisms, when the wafer on the conveying mechanism is a single piece, the wafers on the two conveying mechanisms are respectively transported to the crawler conveyors of the sandblasting machine on the left and right sides by two unloading robots. The invention can supply materials to two sandblasting machines at the same time through the setting of the double feeding mechanism, reducing the frequency of feeding, and the wafer can be automatically transported through the handling mechanism, the conveying mechanism and the feeding manipulator, which improves the automation of the equipment. It avoids manual handling and greatly improves the efficiency of wafer sandblasting.

2. In the present invention, several wafers on the inner top layer of the double feeding mechanism are separated by air blowing through the air flotation separation module, so that the transport mechanism only transports one wafer to the transport mechanism at a time, and the transport mechanism arrives during the process of transporting the wafers. In the detection area, the sensor detects whether the wafers are overlapped, whether it is a single wafer or a double wafer, and the double wafer or multiple wafers are transported to the receiving box, and the single wafer is transported to the sandblasting machine. The setting reduces the stacking rate of the wafers, improves the stability of the wafer sandblasting and feeding, and ensures the sandblasting quality.

Description of drawings

Fig. 1 is the overall structure schematic diagram of the present invention;

2 is a schematic structural diagram of the overall structure of the present invention omitting a protective cover;

Fig. 3 is the double feeder structure schematic diagram of the present invention;

Fig. 4 is the sandblasting machine structure schematic diagram of the present invention;

Fig. 5 is the structure schematic diagram of the double feeding mechanism of the present invention;

6 is a schematic structural diagram of a dual feeding mechanism from another angle of the present invention;

Fig. 7 is the structural representation of the transport mechanism of the present invention;

8 is a schematic structural diagram of the conveying mechanism of the present invention;

Fig. 9 is the structural schematic diagram of the unwinding manipulator of the present invention;

FIG. 10 is a schematic diagram of the enlarged structure of the area A in FIG. 3 of the present invention.

In the picture: 1 double feeder, 2 sand blasting machine, 21 sand blasting machine body, 22 crawler conveyor, 3 worktable, 4 double feeding mechanism, 41 first installation plate, 42 jacking mechanism, 421 second installation Plate, 422 First Motor, 423 Fixed Rod, 424 Screw, 425 Threaded Seat, 43 Top Plate, 44 Lifting Rod, 45 Positioning Seat, 46 Positioning Rod, 47 Guide Seat, 471 Guide Groove, 48 First Air Cylinder, 49 Supports Seat, 5 conveying mechanism, 51 third mounting plate, 52 second cylinder, 53 supporting block, 54 guide rail, 55 sliding block, 56 fourth mounting plate, 57 third cylinder, 58 first suction cup, 6 conveying mechanism, 61 transmission machine, 62 second motor, 63 sensor, 64 receiving box, 7 feeding manipulator, 71 first linear module, 72 second linear module, 73 third linear module, 74L block, 75 second suction cup , 8 wafers, 9 air flotation separation modules.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Please refer to Fig. 1-10, the present invention provides a kind of technical scheme:

A dual-feeder for sandblasting of wafers includes a sandblaster 2, the sandblaster 2 includes a sandblaster body 21 and a crawler conveyor 22, the sandblaster body 21 is arranged at the upper end of the middle of the crawler conveyor 22, and the crawler belt Both ends of the conveyor 22 protrude from the sandblasting machine body 21 .

There are two sandblasting machines 2, and the sandblasting machines 2 are respectively arranged on the left and right sides of the double feeder 1. The double feeder 1 includes a workbench 3, a double feeding mechanism 4, a conveying mechanism 5, a conveying mechanism 6 and The feeding manipulator 7 and the double feeding mechanism 4 are arranged at the front of the worktable 3, which include a left feeding mechanism and a right feeding mechanism with the same structure, which are used for storing the wafers 8, and the conveying mechanism 6 is provided with two And it is arranged in the middle of the table 3, two conveying mechanisms 6 are respectively arranged on the rear side of the left feeding mechanism and the right feeding mechanism, and the conveying mechanism 5 is used for conveying the wafers 8 from the double feeding mechanism 4 to the conveying mechanism. 6, which are provided with two and are respectively arranged on the outside of the two conveying mechanisms 6. The conveying mechanism 6 is provided with a sensor 63 for detecting single and double wafers. When the wafer 8 on the conveying mechanism 6 is a single wafer, it passes through The unloading robot 7 transports the wafers 8 to the crawler conveyor 22 , and two unloading robots 7 are symmetrically arranged on the left and right, and they are respectively arranged on the rear sides of the two conveying mechanisms 6 .

The left feeding mechanism includes a first mounting plate 41, a jacking mechanism 42, a jacking plate 43, a jacking rod 44, a positioning seat 45 and a positioning rod 46. The jacking mechanism 42 is fixed below the first mounting plate 41, and its output end It is fixedly connected with the jacking rod 44, the upper end of the jacking rod 44 is fixedly installed with a top plate 43, a positioning seat 45 is arranged above the first mounting plate 41, and a plurality of positioning rods 46 are arranged in a circular array on the positioning seat 45 to locate The center of the seat 45 is provided with an escape hole for passing through the top plate 43, the wafer 8 is placed in the middle of the positioning rod 46, and the wafer 8 is pushed up by the lifting mechanism 42, the top plate 43 and the lifting rod 44, so that the uppermost The wafers 8 are always kept at the same height, which is convenient for the transport mechanism 5 to transport.

The left feeding mechanism also includes a guide seat 47, a first cylinder 48 and a support 49. The guide seat 47 is provided with a guide groove 471. The rear side of the guide groove 471 is a straight groove, and the front side is an arc groove. The left and right ends of the 45 are arranged in the guide groove 471 through the pin shaft. The rear of the positioning seat 45 is provided with a first cylinder 48. on the support 49. When there is no wafer 8 in the dual feeding mechanism 4, the first air cylinder 48 is activated to push the positioning seat 45 to move along the guide groove 471. Since the front side of the guide groove 471 is an arc groove, the positioning rod 46 changes from vertical upward to inclined. , which is convenient for the wafer 8 to be loaded. After the loading is completed, the first air cylinder 48 resets and pulls the positioning rod 46 back to the vertical upward position.

The jacking mechanism 42 includes a second mounting plate 421, a first motor 422, a fixing rod 423, a screw 424 and a threaded seat 425. The second mounting plate 421 is arranged in parallel below the first mounting plate 41, and the fixing rod 423 is fixed on the first Between the mounting plate 41 and the second mounting plate 421, the lower end of the second mounting plate 421 is fixed with the first motor 422, and the motor shaft of the first motor 422 extends out of the second mounting plate 421 and is fixedly connected with the screw 424, on the screw 424 A threaded seat 425 is installed, and the lower end of the jacking rod 44 is installed on the threaded seat 425 . The rotation of the first motor 422 and the screw 424 drives the threaded seat 425 to ascend or descend, thereby driving the jacking rod 44 and the top plate 43 to ascend or descend.

The conveying mechanism 5 includes a third mounting plate 51, a second cylinder 52, a support block 53, a guide rail 54, a slider 55, a fourth mounting plate 56, a third cylinder 57 and a first suction cup 58. The third mounting plate 51 is fixed on the working On the table 3, a second cylinder 52 and a support block 53 are installed on the upper end of the third mounting plate 51, a guide rail 54 is fixed on the upper end of the support block 53, and the slider 55 is slidably installed on the guide rail 54 forward and backward. The piston rod of the second cylinder 52 Connected to the slider 55 , the upper end of the slider 55 is fixedly mounted with a fourth mounting plate 56 , the fourth mounting plate 56 is mounted with a third cylinder 57 , and the lower end of the third cylinder 57 is mounted with a first suction cup 58 . The slider 55 is driven to slide back and forth along the guide rail 54 by the second air cylinder 52 , while the first suction cup 58 is driven to move back and forth by the fourth mounting plate 56 and the third air cylinder 57 .

The second cylinder 52 is extended, the first suction cup 58 reaches the top of the double feeding mechanism 4, and after sucking the wafer 8 from the double feeding mechanism 4, the second cylinder 52 retracts, and the first suction cup 58 reaches the top of the conveying mechanism 6, Then, the piston rod of the third air cylinder 57 is extended downward, and the wafer 8 is placed on the conveyor 61 by the first suction cup 58 . After the placement, the third air cylinder is reset and the above-mentioned actions are repeated.

The conveying mechanism 6 includes a conveyor 61, a second motor 62, a sensor 63 and a receiving box 64. The conveyor 61 is arranged along the Y-axis and is connected with the second motor 62 in a driving manner. The receiving box 64 is arranged on the conveyor 61 away from the dual supply The tail of one end of the feeding mechanism 4, which is inclined downward, is provided with three sensors 63, which are installed on the transfer path of the wafer 8, one sensor 63 is provided in the middle of the conveyor 61, and two sensors 63 are provided in the conveyor. The rear of the 61.

The feeding manipulator 7 includes a first linear module 71 arranged along the X-axis direction, a second linear module 72 arranged along the Y-axis direction, a third linear module 73 arranged along the Z-axis direction, and an L-shaped block 74 and the second suction cup 75, the second linear module 72 is fixed on the moving end of the first linear module 71, the third linear module 73 is fixed on the moving end of the second linear module 72, and the L-shaped block 74 is fixed A second suction cup 75 is installed on the lower end of the moving end of the third linear module 73 .

The second suction cup 75 is moved downward by the third linear module 73 to suck the wafer 8 on the conveyor 61, and the second suction cup 75 rises after sucking the wafer 8; then the first linear module 71 moves left or right The second suction cup 75 is moved to transfer the wafer 8 on the conveyor 61 to the top of the crawler conveyor 22, and the third linear module 73 drives the second suction cup 75 to move downward to place the wafer 8 on the crawler conveyor 22. Afterwards, the third linear module 73 and the first linear module 71 are reset, and the above-mentioned actions are repeated. In addition, the placement position of the wafers 8 can be adjusted by the forward and backward movement of the second linear module 72 , for example, two rows of wafers 8 are placed forward and backward on the conveyor 61 , and are staggered to avoid overlapping of the two wafers 8 .

One side of the double feeding mechanism 4 is provided with an air flotation separation module 9 , and the air flotation separation module 9 is used for blowing and separating several wafers 8 on the inner top layer of the double feeding mechanism 4 so as to facilitate the suction by the first suction cup 58 .

The working principle of the present invention is:

Place the unsand-blasted wafers 8 in the left feeding mechanism and the right feeding mechanism of the dual feeding mechanism 4, and the air flotation separation module 9 blows air to separate the five to six wafers on the top layer of the dual feeding mechanism 4. 8. The transport mechanism 5 only transports one wafer 8 to the transport mechanism 6 at a time, and the wafers 8 are transported from the left feeding mechanism and the right feeding mechanism to the two transport mechanisms 6 through the two transport mechanisms 5, The conveying mechanism 6 reaches the detection area in the process of conveying the wafers 8, and the sensor 63 detects whether the wafers 8 overlap, whether it is a single wafer or a double wafer. The two unwinding robots 7 transport the wafers 8 on the two conveying mechanisms 6 to the crawler conveyors 22 of the sandblasting machine 2 on the left and right sides respectively, and then blast the wafers through the sandblasting machine body 21 .

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, and substitutions can be made in these embodiments without departing from the principle and spirit of the invention and modifications, the scope of the present invention is defined by the appended claims and their equivalents.

Claims (8)

1. The utility model provides a wafer sandblast dual feed machine, its includes sand blasting machine (2), and sand blasting machine (2) are including sand blasting machine body (21) and caterpillar conveyor (22), sand blasting machine body (21) set up the upper end at caterpillar conveyor (22) middle part, sand blasting machine body (21), its characterized in that are stretched out at the both ends of caterpillar conveyor (22):

the double-feeding mechanism comprises a workbench (3), double-feeding mechanisms (4), a carrying mechanism (5), conveying mechanisms (6) and a discharging manipulator (7), wherein the double-feeding mechanisms (4) are arranged at the front part of the workbench (3), the double-feeding mechanisms (1) comprise a left feeding mechanism and a right feeding mechanism which are identical in structure and are used for storing wafers (8), the conveying mechanisms (6) are provided with two conveying mechanisms (6) which are arranged in the middle of the workbench (3), the two conveying mechanisms (6) are respectively arranged at the rear sides of the left feeding mechanism and the right feeding mechanism, the carrying mechanism (5) is used for carrying the wafers (8) to the conveying mechanisms (6) from the double-feeding mechanism (4), the two conveying mechanisms (6) are respectively arranged at the outer sides of the two conveying mechanisms (6), the automatic wafer feeding device is characterized in that a sensor (63) for detecting single and double wafers is arranged on the conveying mechanism (6), when the wafer (8) on the conveying mechanism (6) is single wafer, the wafer (8) is carried to the crawler conveyor (22) through the discharging manipulator (7), the discharging manipulator (7) is bilaterally symmetrical, and the two discharging manipulators are respectively arranged at the rear sides of the two conveying mechanisms (6).

2. The wafer blasting double feeder according to claim 1, characterized in that: left side feed mechanism includes first mounting panel (41), climbing mechanism (42), top dish (43), jacking rod (44), positioning seat (45) and locating lever (46), and climbing mechanism (42) are fixed in the below of first mounting panel (41), its output and jacking rod (44) fixed connection, the upper end fixed mounting of jacking rod (44) has top dish (43), the top of first mounting panel (41) is provided with positioning seat (45), it is provided with a plurality of locating lever (46) to form annular array on positioning seat (45), the center department of positioning seat (45) is offered and is used for dodging the hole through top dish (43), and wafer (8) are placed in the centre of locating lever (46).

3. The wafer blasting double feeder according to claim 2, characterized in that: the left feeding mechanism further comprises a guide seat (47), a first air cylinder (48) and a support (49), wherein a guide groove (471) is formed in the guide seat (47), the rear side of the guide groove (471) is a straight groove, the front side of the guide groove is an arc-shaped groove, the left end and the right end of the positioning seat (45) are arranged in the guide groove (471) through a hinge pin, the first air cylinder (48) is arranged behind the positioning seat (45), a piston rod of the first air cylinder (48) is rotatably connected with the rear end of the positioning seat (45), and the rear end of the first air cylinder is rotatably installed on the support (49).

4. The wafer blasting double feeder according to claim 2 or 3, characterized in that: climbing mechanism (42) include second mounting panel (421), first motor (422), dead lever (423), screw rod (424) and screw base (425), second mounting panel (421) parallel arrangement is in the below of first mounting panel (41), dead lever (423) are fixed between first mounting panel (41) and second mounting panel (421), the lower extreme of second mounting panel (421) is fixed with first motor (422), the motor shaft of first motor (422) stretch out second mounting panel (421) and with screw rod (424) fixed connection, install screw base (425) on screw rod (424), the lower extreme of jacking pole (44) is installed on screw base (425).

5. The wafer blasting double feeder according to claim 1, characterized in that: the carrying mechanism (5) comprises a third mounting plate (51), a second air cylinder (52), a supporting block (53), a guide rail (54), a sliding block (55), a fourth mounting plate (56), a third air cylinder (57) and a first sucking disc (58), wherein the third mounting plate (51) is fixed on the workbench (3), the second air cylinder (52) and the supporting block (53) are installed at the upper end of the third mounting plate (51), the guide rail (54) is fixed at the upper end of the supporting block (53), the sliding block (55) is slidably mounted on the guide rail (54) in a front-back mode, a piston rod of the second air cylinder (52) is connected with the sliding block (55), the fourth mounting plate (56) is fixedly installed at the upper end of the sliding block (55), the third air cylinder (57) is installed on the fourth mounting plate (56), and the first sucking disc (58) is installed at the lower end of the third air cylinder (57).

6. The wafer blasting double feeder according to claim 1, characterized in that: conveying mechanism (6) include conveyer (61), second motor (62), sensor (63) and material collecting box (64), Y axle setting is followed in conveyer (61), and it is connected with second motor (62) transmission, material collecting box (64) set up the afterbody of keeping away from the one end of two feeding mechanism (4) in conveyer (61), and its downward sloping sets up, sensor (63) are provided with a plurality of, and it installs on the transmission path of wafer (8).

7. The wafer blasting double feeder according to claim 1, characterized in that: blowing manipulator (7) are including first sharp module (71) that the motion set up along the X axle direction, second sharp module (72) that set up along the Y axle direction, third sharp module (73), L type piece (74) and second sucking disc (75) that set up along the Z axle direction, second sharp module (72) are fixed and are served in the removal of first sharp module (71), third sharp module (73) are fixed and are served in the removal of second sharp module (72), L type piece (74) are fixed and are served in the removal of third sharp module (73), and second sucking disc (75) are installed to its lower extreme.

8. The wafer blasting double feeder according to claim 4, wherein: and an air floatation separation module (9) is arranged on one side of the double-feeding mechanism (4), and the air floatation separation module (9) is used for air blowing and separating a plurality of wafers (8) on the top layer in the double-feeding mechanism (4).

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