CN215731590U

CN215731590U - Chip packaging equipment

Info

Publication number: CN215731590U
Application number: CN202121884988.4U
Authority: CN
Inventors: 时岱; 吴楠; 杨军; 包斌
Original assignee: Shenzhen Lixiang Technology Co ltd
Current assignee: Shenzhen Lixiang Technology Co ltd
Priority date: 2021-08-12
Filing date: 2021-08-12
Publication date: 2022-02-01
Anticipated expiration: 2031-08-12

Abstract

The utility model relates to the technical field of chip packaging, and discloses chip packaging equipment which comprises a packaging frame, wherein the top of the inner wall of the packaging frame is fixedly connected with an electric telescopic rod, the bottom of the electric telescopic rod is fixedly connected with a connecting transverse plate, the bottom of the connecting transverse plate is fixedly connected with a connecting column, the bottom of the connecting column is movably connected with an outer rotating disc, the outer surface of the connecting column is fixedly connected with a fixed block, and one side, away from the connecting column, of the fixed block is fixedly connected with a torsion spring. In the utility model, the positions of all the packaging machines are adjusted through the rotation between the connecting column and the outer rotary disc, so that the proper packaging machines are aligned with the chips on the packaging table for packaging, namely, the outer rotary disc is rotated to ensure that the limiting clamping block clamped with the limiting concave plate is not clamped with the outer rotary disc any more, and the limiting concave plate is clamped with the next limiting clamping block, thereby fixing the outer rotary disc and changing the steering direction of the outer rotary disc at the same time, thereby achieving the effect of packaging the chips with different specifications.

Description

Chip packaging equipment

Technical Field

The utility model relates to the technical field of chip packaging, in particular to chip packaging equipment.

Background

The packaging can be regarded as the last process of the integrated circuit production process, and refers to a process of arranging, bonding, fixing and connecting chips on different types of frames or substrates, leading out a connecting terminal, and fixing the chips through a plastic packaging material to form packaging bodies with different shapes.

The utility model discloses a chip packaging device which comprises a bottom box, wherein supporting legs are arranged at the bottom of the bottom box, a side plate is arranged on the upper surface of the bottom box, mutually matched bulges are arranged at the bottom of the side plate and the top of the bottom box, threaded openings are formed in the bottom of the side plate and the top of the bottom box, a lifting plate is arranged on the inner side of the side plate above the bottom box, a screw rod is arranged on the side surface of the side plate, the top of the screw rod is fixedly connected with a first bearing at the top of the side plate, the bottom of the screw rod is fixedly connected with a second bearing at the top of the bottom box, the top of the screw rod is movably connected with the first bearing, and the bottom of the screw rod is movably connected with the second bearing. According to the chip packaging device, the dust collector on the side face of the box body is matched with the air blower on the top of the lifting plate to work and is connected with the air inlet pipe, so that in the chip packaging process, the head of the dust collector is aligned to the chip position to suck out dust, and the dust is discharged through the air blower, so that the dust-free effect of the chip packaging environment is achieved, and the chip yield is improved. The device is difficult to encapsulate the chip of different specifications in the use to can't fix corresponding chip according to the difference of chip specification, make the chip spend a large amount of time when the encapsulation and remove adjustment fixed position, the chip packaging equipment of present design can encapsulate the chip of different specifications, can stabilize in order to improve the chip yields to different chips at the packaging process simultaneously.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Aiming at the defects of the prior art, the utility model provides chip packaging equipment which has the advantages of packaging chips with different specifications and stabilizing different chips so as to improve the yield of the chips, and solves the problem that the chips with different specifications are difficult to package.

(II) technical scheme

In order to achieve the purpose, the utility model provides the following technical scheme:

chip encapsulation equipment, including the encapsulation frame, the inner wall top fixedly connected with electric telescopic handle of encapsulation frame, electric telescopic handle's bottom fixedly connected with connects the diaphragm, the bottom fixedly connected with spliced pole of connecting the diaphragm, the bottom swing joint of spliced pole has outer capstan, the outer fixed surface of spliced pole is connected with the fixed block, one side fixedly connected with torsional spring from the spliced pole is kept away from to the fixed block, the spacing fixture block of one end fixedly connected with of fixed block is kept away from to the torsional spring, the spacing concave plate of interior fixed surface of outer capstan is connected with, the internal surface of spacing concave plate and the surface activity joint of spacing fixture block.

Through the technical scheme, the positions of the packaging machines can be adjusted through rotation between the connecting column and the outer rotating disc in the packaging equipment, so that the proper packaging machines are aligned with the chip on the packaging table for packaging, namely the outer rotating disc is rotated to ensure that the limiting clamping block clamped with the limiting concave plate is not clamped with the limiting concave plate, the limiting concave plate is clamped with the next limiting clamping block, the outer rotating disc is fixed, the steering of the outer rotating disc is changed at the same time, and the positions of the packaging machines are changed.

Preferably, the bottom of the packaging frame is fixedly connected with a driving wheel, and the bottom of the inner wall of the packaging frame is welded with a packaging table.

Through the technical scheme, the whole device moves through the driving wheels, and the chip is packaged on the packaging table.

Preferably, the bottom of the outer rotating disc is fixedly connected with a packaging machine, and the bottom of the connecting transverse plate is fixedly connected with an upper pressing plate.

Through the technical scheme, the upper pressing plate is matched with the lower pressing plate and the inner pressure spring in the process of packaging the chip by the packaging machine, so that the packaging process is kept stable, and the yield of the chip is improved.

Preferably, the bottom of the upper pressure plate is fixedly connected with an inner pressure spring, and the bottom of the inner pressure spring is fixedly connected with a lower pressure plate.

Through the technical scheme, the upper pressing plate and the inner pressure spring can be driven to move downwards in the downward moving process of the upper pressing plate, and the packaging machine starts to be stabilized after the lower pressing plate is contacted with the packaging table.

Preferably, the top of the packaging table is fixedly connected with a right nail plate, the bottom of the inner wall of the packaging frame is fixedly connected with a left vertical plate, and the right side of the left vertical plate is fixedly connected with a limiting sleeve.

Through above-mentioned technical scheme, the left side of right nail board contacts with the right side of chip, cooperates left spacing to support the board, all fixes the left and right sides of chip.

Preferably, the inner wall of the limiting sleeve is fixedly connected with a limiting spring, the right side of the limiting spring is fixedly connected with a limiting abutting plate, and the bottom of the limiting abutting plate is in sliding connection with the top of the packaging table.

Through the technical scheme, in the process that the limiting support plate supports the chip, the distance between the limiting sleeve and the limiting support plate can be adjusted according to the limiting spring, so that the chips of different specifications are fixed.

Compared with the prior art, the utility model provides chip packaging equipment, which has the following beneficial effects:

1. according to the chip packaging equipment, the positions of the packaging machines are adjusted through rotation between the connecting column and the outer rotary disc, so that the proper packaging machines are aligned with the chips on the packaging table for packaging, namely, the outer rotary disc is rotated to ensure that the limiting clamping block clamped with the limiting concave plate is not clamped with the limiting concave plate, the limiting concave plate is clamped with the next limiting clamping block, the outer rotary disc is fixed, and the steering of the outer rotary disc is changed, so that the effect of packaging the chips with different specifications is achieved.

2. This chip package equipment through placing the chip at the encapsulation bench, makes the right side of chip support right nail board, later according to the length adjustment of chip spacing the position of supporting the board, through the flexible of spacing spring in spacing cover for the right side of spacing supporting the board supports the chip, thereby has reached and has stabilized the effect in order to improve the chip yields to different chips.

Drawings

FIG. 1 is a schematic view of the main structure of the present invention;

FIG. 2 is a schematic view of the internal structure of the outer turntable according to the present invention;

fig. 3 is a schematic structural view of the limiting spring of the present invention.

Wherein: 1. a packaging frame; 2. an electric telescopic rod; 3. connecting the transverse plates; 4. connecting columns; 5. an outer turntable; 6. a fixed block; 7. a torsion spring; 8. a limiting clamping block; 9. a limit concave plate; 10. a packaging machine; 11. an upper pressure plate; 12. an inner pressure spring; 13. a lower pressing plate; 14. a drive wheel; 15. a packaging stage; 16. a right nail plate; 17. a left vertical plate; 18. a limiting sleeve; 19. a limiting spring; 20. and a limiting abutting plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Embodiment 1, as shown in fig. 1 to 3, the present invention provides a chip packaging apparatus, when packaging chips of different specifications, a corresponding packaging machine 10 may be selected, that is, an outer turntable 5 is rotated, and the outer turntable 5 is fixed while the direction of rotation is changed by parts at the connection position of the outer turntable 5 and a connection column 4, so that the corresponding packaging machine 10 is aligned with the chip, and the packaging machine 10 is in a stable state during the process of packaging chips of different specifications by matching the stable effect of two pressing plates and an inner pressure spring 12 and the chip on a packaging table 15 in a fixed state, thereby improving the yield of the chip.

In embodiment 2, as shown in fig. 2 and 3, a chip is placed on the packaging table 15, the right side of the chip abuts against the right nail plate 16, then the position of the limiting abutting plate 20 is adjusted according to the specification of the chip, so that the limiting spring 19 extends and retracts in the limiting sleeve 18, and finally the right side of the limiting abutting plate 20 abuts against the chip, and both sides of the chip are stabilized.

The wiring diagram of the electric telescopic rod 2 belongs to the common knowledge in the field, the working principle of the wiring diagram is the known technology, the model is selected according to the actual use, and therefore, the control mode and the wiring arrangement are not explained in detail for the electric telescopic rod 2.

The working principle is as follows: the chip packaging equipment comprises a packaging table 15, a right nail plate 16 is supported by the right side of a chip, the position of a limiting support plate 20 is adjusted according to the length of the chip, the right side of the limiting support plate 20 supports the chip through the expansion of a limiting spring 19 in a limiting sleeve 18, the force applied on the limiting support plate 20 is further transmitted to a left vertical plate 17, the purpose of stabilizing different chips to improve the yield of the chips is achieved, a connecting transverse plate 3 moves downwards through the up-and-down expansion of an electric telescopic rod 2, a connecting column 4 and an outer rotary disc 5 move downwards, finally a packaging machine 10 packages the chips, when the chips with different specifications are packaged, the corresponding packaging machine 10 can be selected, namely, the outer rotating disc 5 is rotated to ensure that the limiting clamping block 8 and the limiting concave plate 9 which are originally in a clamping state are not clamped any more, the limiting clamping block 8 is pulled by the torsion spring 7 to realize the purpose, the steering of the outer rotating disc 5 is changed immediately, then the limiting clamping block 8 and the next limiting concave plate 9 are clamped under the action of the torsion spring 7 connected with the fixing block 6 until the limiting clamping block 8 and the next limiting concave plate 9 are adjusted to a proper position to ensure that the corresponding packaging machine 10 is aligned with the chip, and finally, the outer rotating disc 5 is fixed to achieve the purpose of packaging chips of different specifications, and in the process of moving down the connecting transverse plate 3, after the lower pressing plate 13 is contacted with the packaging table 15, the lower pressing plate 13 and the upper pressing plate 11 are continuously pressed to extrude the inner pressing spring 12, and the packaging machine 10 is kept stable in the packaging process through the lower pressing plate 13.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Chip package equipment, including encapsulation frame (1), its characterized in that: the inner wall top fixedly connected with electric telescopic handle (2) of encapsulation frame (1), the bottom fixedly connected with of electric telescopic handle (2) connects diaphragm (3), the bottom fixedly connected with spliced pole (4) of connecting diaphragm (3), the bottom swing joint of spliced pole (4) has outer carousel (5), the outer fixed surface of spliced pole (4) is connected with fixed block (6), one side fixedly connected with torsional spring (7) of spliced pole (4) are kept away from fixed block (6), the spacing fixture block of one end fixedly connected with (8) of fixed block (6) are kept away from torsional spring (7), the spacing concave plate of interior fixed surface fixedly connected with (9) of outer carousel (5), the internal surface of spacing concave plate (9) and the outer movable joint of surface of spacing fixture block (8).

2. The chip packaging apparatus according to claim 1, wherein: the bottom of the packaging frame (1) is fixedly connected with a driving wheel (14), and the bottom of the inner wall of the packaging frame (1) is welded with a packaging table (15).

3. The chip packaging apparatus according to claim 1, wherein: the bottom of the outer turntable (5) is fixedly connected with a packaging machine (10), and the bottom of the connecting transverse plate (3) is fixedly connected with an upper pressure plate (11).

4. The chip packaging apparatus according to claim 3, wherein: the bottom of the upper pressure plate (11) is fixedly connected with an inner pressure spring (12), and the bottom of the inner pressure spring (12) is fixedly connected with a lower pressure plate (13).

5. The chip packaging apparatus according to claim 2, wherein: the top of the packaging table (15) is fixedly connected with a right nail plate (16), the bottom of the inner wall of the packaging frame (1) is fixedly connected with a left vertical plate (17), and the right side of the left vertical plate (17) is fixedly connected with a limiting sleeve (18).

6. The chip packaging apparatus according to claim 5, wherein: the inner wall of the limiting sleeve (18) is fixedly connected with a limiting spring (19), the right side of the limiting spring (19) is fixedly connected with a limiting abutting plate (20), and the bottom of the limiting abutting plate (20) is in sliding connection with the top of the packaging table (15).