CN217802839U

CN217802839U - Connecting rod lifting device for semiconductor plastic packaging press

Info

Publication number: CN217802839U
Application number: CN202221151102.XU
Authority: CN
Inventors: 彭卢; 孙贤业
Original assignee: Tongling Quanjuhe Semiconductor Co ltd
Current assignee: Tongling Quanjuhe Semiconductor Co ltd
Priority date: 2022-05-13
Filing date: 2022-05-13
Publication date: 2022-11-15
Anticipated expiration: 2032-05-13

Abstract

The utility model discloses a connecting rod elevating gear for semiconductor plastic envelope press relates to semiconductor plastic envelope technical field. Including installation machine case and the clamp plate of setting in installation machine case upper end, the both sides of clamp plate are provided with the lift unit respectively, the lift unit includes connecting rod A and connecting rod B, connecting rod A and connecting rod B swing joint, and connecting rod A of upper end is connected with moving member A, and connecting rod B of lower extreme is connected with moving member B, the utility model provides a when the plastic envelope press uses, it is not firm enough to drive actuating cylinder promotion clamp plate decline, and the technical problem of inconvenient adjusting the height of clamp plate, rotates through connecting rod A and connecting rod B, drives the clamp plate and pushes down, makes it and mould chamber block installation, and the connecting rod A and the connecting rod B of the lift unit of both sides support and the transmission to the clamp plate, and the installation is comparatively firm, and can adjusting the ascending height of clamp plate.

Description

Connecting rod lifting device for semiconductor plastic packaging press

Technical Field

The utility model belongs to semiconductor plastic envelope production field, more specifically say, relate to a connecting rod elevating gear for semiconductor plastic envelope press.

Background

The plastic packaging press is used for thermosetting plastic packaging of semiconductor components and integrated circuits. The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The packaging process comprises the following steps: the wafer from the previous process of the wafer is cut into small chips after scribing process, then the cut chips are pasted on the corresponding island of the substrate (lead frame) frame by glue, and then the bonding pads of the chips are connected to the corresponding pins of the substrate by utilizing superfine metal (gold tin copper aluminum) wires or conductive resin to form the required circuit; and then packaging and protecting the independent wafer by using a plastic shell, carrying out a series of operations after plastic packaging, and carrying out finished product testing after packaging is finished.

However, when the plastic envelope press used, it was usually the cylinder to drive the clamp plate, and the clamp plate descends and is not firm enough, overhauls the mould chamber or when clearing up, also is inconvenient to rise higher height with the clamp plate, when clamp plate and mould chamber block were stereotyped, and is inconvenient to fix the clamp plate, leaves the gap easily, leads to the defective products to appear.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome among the prior art when plastic envelope press uses, it is not firm enough to drive actuating cylinder promotion clamp plate decline, and the height of inconvenient regulation clamp plate, and inconvenient condition of overhauing the plastic envelope press provides a connecting rod elevating gear for semiconductor plastic envelope press to it is not enough more than solving, facilitates the use.

In order to achieve the above purpose, the utility model provides a technical scheme does:

the utility model discloses a connecting rod elevating gear for semiconductor plastic envelope press, including installation machine case and the clamp plate of setting in installation machine case upper end, the both sides of clamp plate are provided with the lift unit respectively, and the lift unit includes connecting rod A and connecting rod B, connecting rod A and connecting rod B swing joint, and connecting rod A of upper end is connected with moving member A, and connecting rod B of lower extreme is connected with moving member B.

Preferably, the middle parts of the connecting rods A and B are connected through a movable shaft, and the connecting rods A and B are connected end to end.

Preferably, the two sides of the lower end of the pressing plate are provided with fixing frames, the inner sides of the fixing frames are provided with limiting rods, and the moving piece A is sleeved at the upper ends of the limiting rods.

Preferably, mounting grooves are formed in two sides of the upper end of the mounting case, a transmission screw is arranged inside each mounting groove, and the moving member B is in threaded connection with the transmission screw.

Preferably, one end of the transmission screw is provided with a conical gear A, one side of the conical gear A is engaged with a conical gear B, the conical gears B on two sides are connected through a fixed rod, and the middle of the fixed rod is provided with a driving assembly A.

Preferably, the lower end of the pressure plate is also provided with a guide rod, the guide rod is matched with a guide hole formed in the upper surface of the mounting case in size, and the upper end of the guide rod is provided with a through groove.

Preferably, the upper end of the installation case is provided with a mold cavity, and a positioning assembly is arranged inside the guide hole.

Preferably, the positioning assembly comprises a driving assembly B and a rotary screw rod arranged on one side of the driving assembly B, a supporting piece is arranged in the middle of the rotary screw rod, and positioning blocks are sleeved on two sides of the rotary screw rod.

Preferably, the rotary screw rods on the two sides of the support piece are respectively two groups of parts with opposite thread directions and are matched with the thread cavity formed on the inner side of the positioning block.

Preferably, the upper side and the lower side of the positioning block are inclined and matched with the size of the through groove.

Adopt the technical scheme provided by the utility model, compare with prior art, have following beneficial effect:

compared with the prior art, the beneficial effects of the utility model are as follows:

(1) The utility model discloses a connecting rod elevating gear for semiconductor plastic envelope press, when using the plastic envelope press, after putting into the mould chamber with the raw materials, drive assembly A drives bevel gear B through the dead lever and rotates, it is rotatory to drive screw through bevel gear A, and then drive moving member B and remove, and then connecting rod A and connecting rod B rotate, it pushes down to drive the clamp plate, make its and mould chamber block installation, connecting rod A and the connecting rod B of the lift unit of both sides support and the transmission to the clamp plate, the installation is comparatively firm, and can the height that adjusting plate rose, use comparatively in a flexible way.

(2) The utility model discloses a connecting rod elevating gear for semiconductor plastic envelope press, when the clamp plate goes up and down, the guide bar is in the inside activity of guiding hole, and then plays certain guide effect to the clamp plate, avoids when the clamp plate pushes down, and the phenomenon of dislocation appears in clamp plate and mould chamber, and then leads to the production of defective products.

(3) The utility model discloses a connecting rod elevating gear for semiconductor plastic envelope press when the clamp plate descends and carry out the plastic envelope shaping to the semiconductor, drive assembly B drives rotatory screw rod and rotates, and then the locating piece of both sides stretches out simultaneously, and the card is inside running through the inslot, and the convenience is fixed the guide bar, avoids the guide bar to rock and influences the semiconductor plastic envelope precision, makes the device wholly more firm.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic view of the structure of the lifting unit of the present invention;

FIG. 3 is a schematic view of the transmission structure of the transmission screw of the present invention;

FIG. 4 is a schematic view of the guide bar mounting structure of the present invention;

fig. 5 is a schematic view of the structure of the installation case of the present invention;

fig. 6 is a schematic structural diagram of the positioning assembly of the present invention.

In the figure: 1. installing a case; 11. mounting grooves; 12. a drive screw; 13. a bevel gear A; 14. a bevel gear B; 15. fixing the rod; 16. a driving assembly A; 17. a mold cavity; 18. a guide hole; 19. a positioning assembly; 191. a drive assembly B; 192. rotating the screw; 193. a support member; 194. positioning a block; 2. pressing a plate; 21. a fixed mount; 22. a limiting rod; 23. a guide rod; 24. a through groove; 3. a lifting unit; 31. a connecting rod A; 32. a connecting rod B; 33. a moving member A; 34. and a moving part B.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

For a further understanding of the present invention, reference is made to the following detailed description taken in conjunction with the accompanying drawings.

Combine fig. 1, the utility model discloses a connecting rod elevating gear for semiconductor plastic envelope press, including installation machine case 1 and the clamp plate 2 of setting in installation machine case 1 upper end, the both sides of clamp plate 2 are provided with elevating unit 3 respectively.

The invention will be further described with reference to the following examples

Example 1

Referring to fig. 1 to 3, the lifting unit 3 includes a connecting rod a31 and a connecting rod B32, the connecting rod a31 is movably connected with the connecting rod B32, the middle parts of the connecting rod a31 and the connecting rod B32 are connected through a movable shaft, and each of the connecting rod a31 and the connecting rod B32 is connected end to end, the connecting rod a31 at the upper end is connected with a moving member a33, and the connecting rod B32 at the lower end is connected with a moving member B34.

The lower extreme both sides of clamp plate 2 are provided with mount 21, and the inboard of mount 21 is provided with gag lever post 22, and moving member A33 suit is in the upper end of gag lever post 22.

The mounting structure comprises a mounting case 1, wherein mounting grooves 11 are formed in two sides of the upper end of the mounting case 1, a transmission screw 12 is arranged in each mounting groove 11, a moving member B34 is in threaded connection with the transmission screw 12, a bevel gear A13 is arranged at one end of the transmission screw 12, a bevel gear B14 is mounted on one side of the bevel gear A13 in a meshed mode, the bevel gears B14 on two sides are connected through a fixing rod 15, and a driving assembly A16 is arranged in the middle of the fixing rod 15.

When using the plastic envelope press, after putting into mould cavity 17 with the raw materials, drive assembly A16 drives conical gear B14 through dead lever 15 and rotates, it rotates to drive screw 12 through conical gear A13, and then drive moving member B34 and remove, and then connecting rod A31 and connecting rod B32 rotate, it pushes down to drive clamp plate 2, make its and the installation of mould cavity 17 block, connecting rod A31 and connecting rod B32 of the lift unit 3 of both sides support and the transmission to clamp plate 2, the installation is comparatively firm, and can adjust the height that clamp plate 2 rose, it is comparatively nimble to use.

Example 2

With reference to fig. 4-5, the lower end of the pressing plate 2 is further provided with a guide rod 23, the guide rod 23 is matched with the guide hole 18 formed on the upper surface of the installation case 1 in size, and the upper end of the guide rod 23 is provided with a through groove 24.

When the pressing plate 2 goes up and down, the guide rod 23 moves in the guide hole 18, so that the pressing plate 2 is guided to a certain extent, and the phenomenon that the pressing plate 2 and the die cavity 17 are staggered when the pressing plate 2 is pressed down is avoided, so that defective products are generated.

Example 3

With reference to fig. 4-6, a mold cavity 17 is disposed at the upper end of the installation case 1, a positioning component 19 is disposed inside the guide hole 18, the positioning component 19 includes a driving component B191 and a rotating screw 192 disposed on one side of the driving component B191, a supporting component 193 is disposed in the middle of the rotating screw 192, positioning blocks 194 are sleeved on two sides of the rotating screw 192, the rotating screws 192 on two sides of the supporting component 193 are two sets of components with opposite thread directions and are matched with the thread cavities formed in the inner sides of the positioning blocks 194, and the upper and lower sides of the positioning blocks 194 are inclined and are matched with the through grooves 24 in size.

When clamp plate 2 drops and carries out plastic envelope shaping to the semiconductor, drive assembly B191 drives rotatory screw 192 and rotates, and then the locating piece 194 of both sides stretches out simultaneously, and the card is inside running through groove 24, conveniently fixes guide bar 23, avoids guide bar 23 to rock the influence semiconductor plastic envelope precision, makes the whole more firm of device.

In conclusion: when the plastic package press is used, after raw materials are placed into the die cavity 17, the driving assembly A16 drives the bevel gear B14 to rotate through the fixing rod 15, the driving screw 12 is driven to rotate through the bevel gear A13, the moving member B34 is driven to move, the connecting rod A31 and the connecting rod B32 are further driven to rotate, the pressing plate 2 is driven to press downwards, the pressing plate is clamped and installed with the die cavity 17, the pressing plate 2 is supported and driven by the connecting rod A31 and the connecting rod B32 of the lifting units 3 on the two sides, the installation is stable, the lifting height of the pressing plate 2 can be adjusted, the use is flexible, when the pressing plate 2 is lifted, the guide rod 23 moves inside the guide hole 18, a certain guiding effect is achieved on the pressing plate 2, the phenomenon that the pressing plate 2 and the die cavity 17 are staggered is avoided when the pressing plate 2 is pressed downwards, the defective products are further generated, when the pressing plate 2 is lowered to carry out plastic package forming on the semiconductor, the driving assembly B191 drives the rotating screw 192 to rotate, the positioning blocks 194 on the two sides extend out simultaneously, the clamping is clamped inside the through groove 24, the guide rod 23 is convenient to fix, and the influence on the plastic package forming precision of the semiconductor device is avoided, and the whole plastic package device is further.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a connecting rod elevating gear for semiconductor plastic envelope press, includes installation machine case (1) and clamp plate (2) of setting in installation machine case (1) upper end, its characterized in that: the two sides of the pressing plate (2) are respectively provided with a lifting unit (3), each lifting unit (3) comprises a connecting rod A (31) and a connecting rod B (32), the connecting rods A (31) and B (32) are movably connected, the connecting rod A (31) at the upper end is connected with a moving part A (33), and the connecting rod B (32) at the lower end is connected with a moving part B (34).

2. The connecting rod lifting device for the semiconductor plastic package press as claimed in claim 1, wherein: the middle parts of the connecting rods A (31) and B (32) are connected through movable shafts, and the connecting rods A (31) and B (32) are connected end to end.

3. The connecting rod lifting device for the semiconductor plastic package press as claimed in claim 2, wherein: the pressing plate is characterized in that fixing frames (21) are arranged on two sides of the lower end of the pressing plate (2), limiting rods (22) are arranged on the inner sides of the fixing frames (21), and moving pieces A (33) are sleeved at the upper ends of the limiting rods (22).

4. The connecting rod lifting device for the semiconductor plastic package press as claimed in claim 3, wherein: the mounting structure is characterized in that mounting grooves (11) are formed in two sides of the upper end of the mounting case (1), a transmission screw (12) is arranged inside each mounting groove (11), and a moving piece B (34) is in threaded connection with the transmission screw (12).

5. The connecting rod lifting device for the semiconductor plastic package press as claimed in claim 4, wherein: one end of the transmission screw rod (12) is provided with a conical gear A (13), one side of the conical gear A (13) is meshed with a conical gear B (14), the conical gears B (14) on two sides are connected through a fixing rod (15), and the middle of the fixing rod (15) is provided with a driving assembly A (16).

6. The connecting rod lifting device for the semiconductor plastic package press as claimed in claim 5, wherein: the lower end of the pressing plate (2) is also provided with a guide rod (23), the guide rod (23) is matched with a guide hole (18) formed in the upper surface of the mounting case (1) in size, and the upper end of the guide rod (23) is provided with a through groove (24).

7. The connecting rod lifting device for the semiconductor plastic package press as claimed in claim 6, wherein: the upper end of the installation case (1) is provided with a mold cavity (17), and a positioning component (19) is arranged in the guide hole (18).

8. The connecting rod lifting device for the semiconductor plastic package press as claimed in claim 7, wherein: the positioning assembly (19) comprises a driving assembly B (191) and a rotating screw (192) arranged on one side of the driving assembly B (191), a support piece (193) is arranged in the middle of the rotating screw (192), and positioning blocks (194) are sleeved on two sides of the rotating screw (192).

9. The connecting rod lifting device for the semiconductor plastic package press as recited in claim 8, wherein: the rotary screw rods (192) on the two sides of the support (193) are two groups of parts with opposite thread directions respectively and are matched with thread cavities formed in the inner side of the positioning block (194).

10. The connecting rod lifting device for the semiconductor plastic package press as recited in claim 9, wherein: the upper side and the lower side of the positioning block (194) are inclined and matched with the size of the through groove (24).