CN216015303U - Separation mould convenient to location for semiconductor device production - Google Patents
Separation mould convenient to location for semiconductor device production Download PDFInfo
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- CN216015303U CN216015303U CN202121861720.9U CN202121861720U CN216015303U CN 216015303 U CN216015303 U CN 216015303U CN 202121861720 U CN202121861720 U CN 202121861720U CN 216015303 U CN216015303 U CN 216015303U
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Abstract
The utility model discloses a separation die convenient for positioning and used for producing a semiconductor device, which comprises a machine table, wherein a lower die is arranged on the upper surface of the machine table, a station groove is formed in the upper surface of the lower die, a guide block is arranged on the outer side of the station groove, a plurality of first positioning holes and second positioning holes are symmetrically formed in the upper surface of the lower die, a plurality of positioning grooves are formed in the left side and the right side of the upper surface of the lower die, an upper die is arranged above the lower die, the left end and the right end of the upper die are movably arranged on the upper surface of the machine table through a mounting frame, an auxiliary positioning needle and an accurate positioning needle are symmetrically arranged on the bottom surface of the upper die, a plurality of positioning blocks are arranged on the left side and the right side of the bottom surface of the upper die, the outer walls of the positioning blocks are inserted into the positioning grooves, a processing die head is arranged on the bottom surface of the upper die, and a guide groove is arranged on the outer side of the processing die head. The utility model enables the upper die and the lower die to carry out multi-stage positioning, ensures the appearance and the performance of a produced product, improves the production qualification rate and reduces the production cost.
Description
Technical Field
The utility model relates to the field of semiconductor packaging, in particular to a separation die convenient for positioning and used for producing a semiconductor device.
Background
The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The packaging process comprises the following steps: a wafer from a wafer previous process is cut into small chips after a scribing process, then the cut chips are pasted on small islands of corresponding substrate (lead frame) frames by glue, and bonding pads of the chips are connected to corresponding pins of the substrate by utilizing superfine metal (gold, tin, copper, aluminum or the like) wires or conductive resin to form a required circuit; and then packaging and protecting the independent wafer by using a plastic shell, carrying out a series of operations after plastic packaging, carrying out finished product testing after packaging, generally carrying out the processes of inspection, testing, packaging and the like, and finally warehousing and shipping.
After the semiconductor device is subjected to plastic packaging, the product needs to be processed through a separation die to form independent devices, but the size of an auxiliary positioning needle of the conventional separation die is basically consistent with that of an accurate positioning needle, the auxiliary positioning needle cannot achieve the auxiliary positioning effect, the positioning means of the separation die is single, the upper die and the lower die are prone to deviation, the appearance of the product is damaged, the performance and the qualification rate of the product are affected, the production cost is improved, and certain defects exist.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a separating die for producing a semiconductor device, which is convenient to position, and can effectively and quickly position an upper die and a lower die, ensure the appearance and the performance of a produced product, improve the production qualification rate and reduce the production cost.
In order to solve the technical problems, the utility model provides a separation die convenient for positioning and used for producing a semiconductor device, which comprises a machine table, wherein a lower die is fixedly arranged on the upper surface of the machine table, a station groove is arranged on the upper surface of the lower die, a guide block is arranged outside the station groove, a plurality of first positioning holes and second positioning holes are symmetrically arranged on the upper surface of the lower die, a plurality of positioning grooves are respectively arranged on the left side and the right side of the upper surface of the lower die, an upper die is arranged above the lower die, the left end and the right end of the upper die are movably arranged on the upper surface of the machine table through a mounting frame, auxiliary positioning pins and accurate positioning pins matched with the first positioning holes and the second positioning holes are symmetrically arranged on the bottom surface of the upper die, a plurality of positioning blocks are respectively arranged on the left side and the right side of the bottom surface of the upper die, the outer walls of the positioning blocks are inserted in the positioning grooves, the bottom surface of the upper die is provided with a processing die head, and the outer side of the processing die head is provided with a guide groove matched with the guide block.
Further, a plurality of movable rods of processing die head upper end fixedly connected with, the outer wall of movable rod bottom all overlaps and is equipped with compression spring, the outer wall of movable rod upper portion all runs through sliding connection and has the mounting panel, mounting panel outer wall movable mounting be in go up inside the mould, the mounting panel left end runs through sliding connection and has a plurality of spacing guide arms, just the equal vertical fixed mounting of spacing guide arm is in go up inside the mould, the mounting panel right-hand member runs through threaded connection and has accommodate the lead screw, accommodate the lead screw vertical rotation install go up inside the mould, the accommodate the lead screw upper end runs through and extends to go up the mould top, the fixed turning block that is equipped with in accommodate the lead screw upper end, run through on the turning block and be equipped with construction bolt, the construction bolt lower extreme with go up mould upper surface threaded connection.
Further, the outer wall of the bottom of the mounting frame is sleeved with a return spring.
Furthermore, the lower ends of the auxiliary positioning needle and the accurate positioning needle are both subjected to rounding treatment.
Furthermore, one side of the guide block, which is close to the station slot, is provided with a slope.
Compared with the prior art, the utility model has the following beneficial effects:
according to the utility model, the auxiliary positioning needle is matched with the first positioning hole to realize the primary positioning of the upper die and the lower die, the precise positioning needle is matched with the second positioning hole to perform precise positioning, and finally the positioning block is matched with the positioning groove, the guide block and the guide groove to realize multi-stage positioning, so that the positioning effect is good, and the processing die head is arranged to have a buffering protection function, so that the die head is prevented from crushing a product, the production quality of the product is ensured, and the production cost is reduced.
Drawings
FIG. 1 is a schematic view of the overall structure of a separating mold for manufacturing a semiconductor device, which is convenient to position according to the present invention;
FIG. 2 is a left side view of the external structure of the split mold for semiconductor device fabrication of the present invention, which is convenient for positioning;
FIG. 3 is a schematic cross-sectional view of an upper mold of the separation mold for manufacturing a semiconductor device, which is convenient for positioning according to the present invention;
fig. 4 is a schematic view of an external structure of an auxiliary positioning pin of the separation mold for semiconductor device production, which facilitates positioning according to the present invention.
Detailed Description
The utility model will be described in more detail hereinafter with reference to the accompanying schematic drawings, in which preferred embodiments of the utility model are shown, and it is to be understood that those skilled in the art may modify the utility model herein described while still achieving the advantageous effects of the utility model. Accordingly, the following description should be construed as broadly as possible to those skilled in the art and not as limiting the utility model.
The utility model is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
As shown in fig. 1, an embodiment of the present invention provides a separation mold for semiconductor device production, which is convenient for positioning, and includes a machine table 1, a lower mold 2 is fixedly installed on an upper surface of the machine table 1, a station groove 3 is installed on an upper surface of the lower mold 2, a guide block 4 is installed outside the station groove 3, a plurality of first positioning holes 5 and second positioning holes 6 are symmetrically installed on an upper surface of the lower mold 2, a plurality of positioning grooves 7 are respectively installed on both left and right sides of an upper surface of the lower mold 2, an upper mold 8 is installed above the lower mold 2, both left and right ends of the upper mold 8 are movably installed on the upper surface of the machine table 1 through an installation frame 9, an auxiliary positioning pin 10 and a precise positioning pin 11 which are matched with the first positioning hole 5 and the second positioning hole 6 are symmetrically installed on a bottom surface of the upper mold 8, both left and right sides of a bottom surface of the upper mold 8 are provided with a plurality of positioning blocks 12, and the outer walls of the positioning blocks 12 are all inserted into the positioning grooves 7, the bottom surface of the upper die 8 is provided with a processing die head 13, and the outer side of the processing die head 13 is provided with a guide groove matched with the guide block 4.
The upper end of the mounting frame 9 is provided with a pressure cylinder, a plunger of the pressure cylinder is in transmission connection with the top surface of the upper die 8, the plunger of the pressure cylinder is stretched to realize the pressing and resetting of the upper die 8, the auxiliary positioning needle 10 arranged on the upper die 8 is matched with the first positioning hole 5 to realize the primary positioning of the upper die and the lower die, the precise positioning is carried out through the matching of the precise positioning needle 11 and the second positioning hole 6, then the secondary positioning is carried out through the positioning block 12 arranged on the upper die 8 and the positioning groove 7 arranged on the lower die 2, wherein the length of the auxiliary positioning needle 10 is larger than the length of the precise positioning needle 11, the diameter of the auxiliary positioning needle 10 is smaller than the diameter of the precise positioning needle 11, finally, the tertiary positioning is realized through the guide block 4 arranged on the lower die 2 and the guide groove arranged on the bottom surface of the upper die 8, the positioning effect is good, and when the guide block 4 is deviated from the processing die head 13, the position of the guide block is guided and corrected, the processing effect is ensured.
As shown in fig. 3, the upper end of the processing die head 13 is fixedly connected with a plurality of movable rods 14, the outer walls of the bottoms of the movable rods 14 are all sleeved with compression springs 16, the outer wall of the upper part of the movable rod 14 is connected with a mounting plate 15 in a penetrating and sliding way, the outer wall of the mounting plate 15 is movably mounted inside the upper die 8, the left end of the mounting plate 15 is connected with a plurality of limiting guide rods 17 in a penetrating and sliding way, the limiting guide rods 17 are vertically and fixedly arranged inside the upper die 8, the right end of the mounting plate 15 is connected with an adjusting screw rod 18 through threads, the adjusting screw rod 18 is vertically and rotatably arranged inside the upper die 8, the upper end of the adjusting screw rod 18 penetrates through and extends to the upper part of the upper die 8, a rotating block is fixedly arranged at the upper end of the adjusting screw rod 18, a mounting bolt penetrates through the rotating block, and the lower end of the mounting bolt is in threaded connection with the upper surface of the upper die 8. In this embodiment, when the upper die 8 drives the processing die head 13 to press down, under the buffering effect of the compression spring 16, the protection function of the product is realized, the adjusting screw rod 18 can be rotated by the passing, the relative position of the mounting plate 15 is adjusted by utilizing the screw rod principle, the pressure adjustment of the processing die head 13 is realized, and the damage of the device caused by overlarge pressure is avoided under the condition that the separation of the device is ensured.
The outer wall of the bottom of the mounting rack 9 is sleeved with a return spring 19. In the present embodiment, a return spring 19 is provided to facilitate the return of the upper mold 8 when the plunger of the cylinder is retracted.
As shown in fig. 4, the lower ends of the auxiliary positioning pin 10 and the precise positioning pin 11 are rounded. In this embodiment, the lower ends of the auxiliary positioning pin 10 and the accurate positioning pin 11 are both rounded, so that the auxiliary positioning pin 10 and the accurate positioning pin 11 can be conveniently inserted into the first positioning hole 5 and the second positioning hole 6, and the positioning and correcting effects are improved.
As shown in fig. 2, the guide blocks 4 are all provided with a slope on the side close to the station slot 3. In the present embodiment, the side of the guiding block 4 close to the station slot 3 is provided with a slope, so that the guiding block and the guiding slot cooperate to have a guiding function, thereby ensuring the processing position of the processing die head 13 and avoiding the deviation of the processing die head 13.
The following is a list of preferred embodiments of the separation mold for semiconductor device production for facilitating positioning to clearly illustrate the contents of the present invention, and it should be understood that the contents of the present invention are not limited to the following embodiments, and other modifications by conventional technical means of those skilled in the art are also within the scope of the idea of the present invention.
The embodiment of the utility model provides a use method of a separation die for producing a semiconductor device, which is convenient to position and comprises the following steps: placing a component frame to be separated into a station groove 3, positioning the component frame through a positioning pin, opening a pressure cylinder switch, extending a plunger of the pressure cylinder to drive an upper die 8 and a processing die head 13 to press downwards, realizing primary positioning of the upper die and the lower die through the matching of an auxiliary positioning pin 10 arranged on the upper die 8 and a first positioning hole 5 arranged on the lower die 2, then carrying out precise positioning through the matching of a precise positioning pin 11 and a second positioning hole 6, and then carrying out secondary positioning through a positioning block 12 arranged on the upper die 8 and a positioning groove 7 arranged on the lower die 2, wherein the length of the auxiliary positioning pin 10 is larger than the length of the precise positioning pin 11, the diameter of the auxiliary positioning pin 10 is smaller than the diameter of the precise positioning pin 11, finally realizing positioning through a tertiary guide block 4 arranged on the lower die 2 and a guide groove arranged on the bottom surface of the upper die 8, and having good positioning effect, and when the guide block 4 deviates from the machining die head 13, the guide block guides and corrects the position of the machining die head, so that the machining effect is ensured.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the utility model. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (5)
1. A separation die convenient for positioning and used for producing a semiconductor device is characterized by comprising a machine table, wherein a lower die is fixedly arranged on the upper surface of the machine table, a station groove is arranged on the upper surface of the lower die, a guide block is arranged on the outer side of the station groove, a plurality of first positioning holes and second positioning holes are symmetrically arranged on the upper surface of the lower die, a plurality of positioning grooves are respectively arranged on the left side and the right side of the upper surface of the lower die, an upper die is arranged above the lower die, the left end and the right end of the upper die are movably arranged on the upper surface of the machine table through a mounting frame, auxiliary positioning pins and accurate positioning pins matched with the first positioning holes and the second positioning holes are symmetrically arranged on the bottom surface of the upper die, a plurality of positioning blocks are respectively arranged on the left side and the right side of the bottom surface of the upper die, the outer walls of the positioning blocks are inserted into the positioning grooves, and a processing die head is arranged on the bottom surface of the upper die, and the outer sides of the processing die heads are provided with guide grooves matched with the guide blocks.
2. The separation mold for semiconductor device production facilitating positioning as set forth in claim 1, the upper end of the processing die head is fixedly connected with a plurality of movable rods, the outer walls of the bottoms of the movable rods are all sleeved with compression springs, the outer wall of the upper part of the movable rod is connected with a mounting plate in a penetrating and sliding way, the outer wall of the mounting plate is movably mounted in the upper die, the left end of the mounting plate is connected with a plurality of limiting guide rods in a penetrating and sliding way, the limiting guide rods are vertically and fixedly arranged inside the upper die, the right end of the mounting plate is connected with an adjusting screw rod through threads, the adjusting screw rod is vertically and rotatably arranged in the upper die, the upper end of the adjusting screw rod penetrates through and extends to the upper part of the upper die, the adjusting screw rod is characterized in that a rotating block is fixedly arranged at the upper end of the adjusting screw rod, a mounting bolt penetrates through the rotating block, and the lower end of the mounting bolt is in threaded connection with the upper surface of the upper die.
3. The separation die convenient to position for semiconductor device production as recited in claim 1, wherein the outer wall of the bottom of the mounting frame is sleeved with a return spring.
4. The separation die for semiconductor device production convenient to position as claimed in claim 1, wherein the lower ends of the auxiliary positioning pin and the accurate positioning pin are rounded.
5. The separation die for manufacturing semiconductor devices, which is convenient to position as recited in claim 1, wherein the sides of the guide blocks adjacent to the station slot are each provided with a slope.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121861720.9U CN216015303U (en) | 2021-08-10 | 2021-08-10 | Separation mould convenient to location for semiconductor device production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121861720.9U CN216015303U (en) | 2021-08-10 | 2021-08-10 | Separation mould convenient to location for semiconductor device production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216015303U true CN216015303U (en) | 2022-03-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121861720.9U Active CN216015303U (en) | 2021-08-10 | 2021-08-10 | Separation mould convenient to location for semiconductor device production |
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| Country | Link |
|---|---|
| CN (1) | CN216015303U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114769414A (en) * | 2022-06-21 | 2022-07-22 | 四川旭茂微科技有限公司 | Semiconductor forming and separating die |
| CN117637536A (en) * | 2023-11-09 | 2024-03-01 | 扬州奕丞科技有限公司 | Processing device based on semiconductor device |
-
2021
- 2021-08-10 CN CN202121861720.9U patent/CN216015303U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114769414A (en) * | 2022-06-21 | 2022-07-22 | 四川旭茂微科技有限公司 | Semiconductor forming and separating die |
| CN114769414B (en) * | 2022-06-21 | 2022-09-20 | 四川旭茂微科技有限公司 | Semiconductor forming and separating die |
| CN117637536A (en) * | 2023-11-09 | 2024-03-01 | 扬州奕丞科技有限公司 | Processing device based on semiconductor device |
| CN117637536B (en) * | 2023-11-09 | 2024-06-11 | 扬州奕丞科技有限公司 | Processing device based on semiconductor device |
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