CN218394801U - Semiconductor chip packaging waste removing device in frame - Google Patents
Semiconductor chip packaging waste removing device in frame Download PDFInfo
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- CN218394801U CN218394801U CN202222735847.7U CN202222735847U CN218394801U CN 218394801 U CN218394801 U CN 218394801U CN 202222735847 U CN202222735847 U CN 202222735847U CN 218394801 U CN218394801 U CN 218394801U
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- frame
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- installation shell
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Abstract
The utility model relates to a device for removing waste packaging products of semiconductor chips in a frame, which comprises a fixing mechanism and a vertical moving mechanism; the fixing mechanism comprises a base and a fixing table; the fixed table is fixed on the base; a support column is vertically arranged at one end of the base, an installation shell is arranged on the support column and positioned right above the fixed table, a rotating shaft is horizontally and rotatably arranged on one side of the installation shell, the rotating shaft penetrates through one side of the installation shell and enters the installation shell, and a gear is fixed at one end of the rotating shaft, which is positioned in the installation shell; the vertical moving mechanism comprises a supporting bar and a supporting plate; the supporting bars are vertically and slidably arranged on the mounting shell, and two ends of each supporting bar respectively extend out of the top and the bottom of the mounting shell; a rack is vertically arranged on one surface of the support bar, which faces the gear; the supporting plate is fixed at the bottom of the supporting bar; the lower surface of the supporting plate is provided with a cutter group. The utility model provides a pair of semiconductor chip encapsulation waste product remove device in frame can amputate the waste product chip in the frame fast.
Description
Technical Field
The utility model relates to a semiconductor chip encapsulates technical field, concretely relates to semiconductor chip encapsulates waste product remove device in frame.
Background
In the chip processing process, plastic packaging treatment needs to be carried out on the chip through a plastic packaging machine, and resin injection packaging of the chip is a process in chip packaging and is used for wrapping a layer of resin shell with an isolation protection effect on the surface of the chip.
After the plastic package treatment is carried out on the chip on the frame, the chip needs to be detected, and when the detection result shows that the resin shell on the individual chip does not completely cover the chip in the frame, at present, the chip in the whole frame is scrapped, so that the great waste is caused, and the production cost of an enterprise is improved.
In order to solve the above problems, the present applicant proposed a semiconductor chip package waste removing apparatus in a frame.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor chip encapsulation waste product remove device in frame can amputate the waste product chip in the frame fast.
In order to achieve the purpose of the utility model, the device for removing the semiconductor chip packaging waste in the frame comprises a fixing mechanism and a vertical moving mechanism;
the fixing mechanism comprises a base and a fixing table; the fixed table is fixed on the base, and the upper surface of the fixed table is in a horizontal position; a supporting column is vertically arranged at one end of the base, an installation shell is arranged on the supporting column and positioned right above the fixed station, a rotating shaft is horizontally and rotatably arranged on one side of the installation shell, the rotating shaft penetrates through one side of the installation shell and enters the installation shell, and a gear is fixed at one end of the rotating shaft, which is positioned in the installation shell;
the vertical moving mechanism comprises a supporting bar and a supporting plate; the supporting bar is vertically and slidably arranged on the mounting shell, and two ends of the supporting bar respectively extend out of the top and the bottom of the mounting shell; a rack is vertically arranged on one surface, facing the gear, of the supporting bar, and the rack is meshed with the gear; the supporting plate is fixed at the bottom of the supporting bar, and the lower surface of the supporting plate is kept horizontal; and the lower surface of the supporting plate is provided with a cutter set, and the cutter set is matched with the semiconductor chip to be cut.
Preferably, a handle is arranged on the rotating shaft.
Preferably, all be vertically fixed with first guide post on the corner of fixed station, the backup pad cup joints a plurality of on the first guide post, just the top of first guide post is fixed with first dog.
Preferably, a first spring is sleeved between the fixed platform and the support plate in the first guide column.
Preferably, the top of installation casing is fixed with the support frame, the second spring is installed at the top of support frame, the top of support bar is equipped with the roof, the one end of second spring with the top of support frame is connected, the other end of second spring with the roof is connected.
Preferably, a pressing plate is further arranged below the supporting plate, second guide posts are vertically arranged at the edge positions of the upper surface of the pressing plate, the supporting plate is sleeved on the second guide posts, and second stop blocks are arranged at the tops of the second guide posts; and a channel hole is formed in the position, opposite to the cutter group, of the pressing plate and used for the cutter group to pass through.
Preferably, a third spring is sleeved on the second guide column between the pressure plate and the support plate.
The utility model relates to a semiconductor chip encapsulation waste product remove device in frame compares with prior art, still has following advantage:
(1) The frame can be effectively fixed, waste chips in the frame are cut off, and the waste chips and qualified chips are effectively separated;
(2) Simple structure, convenient operation is swift.
Drawings
Fig. 1 is a schematic structural diagram 1 of a device for removing package waste of semiconductor chips in a frame according to the present embodiment;
FIG. 2 is an enlarged view of a portion A of FIG. 1;
FIG. 3 is a schematic structural diagram of a device for removing package rejects of semiconductor chips in a frame according to the present embodiment;
fig. 4 is a partially enlarged view of fig. 3 at B.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, a semiconductor chip package waste removing apparatus in a frame includes a fixing mechanism and a vertical moving mechanism;
the fixing mechanism comprises a base 1 and a fixing table 2; the fixed table 2 is fixed on the base 1, and the upper surface of the fixed table 2 is in a horizontal position; the vertical support column 3 that is equipped with of one end of base 1, it is equipped with installation casing 4 to lie in fixed station 2 directly over on the support column 3, one side of installation casing 4 is gone up the level and is rotated and be equipped with pivot 13, pivot 13 passes one side of installation casing 4 enters into in the installation casing 4, lie in pivot 13 one of installation casing 4 is served and is fixed with the gear, (because the gear is located the installation casing, so can not see in the picture). In this embodiment, in order to rotate the rotating shaft 13, a handle 15 is provided on the rotating shaft 13.
The vertical moving mechanism comprises a supporting bar 5 and a supporting plate 21; the supporting bar 5 is vertically arranged on the mounting shell 4 in a sliding manner, and two ends of the supporting bar 5 respectively extend out of the top and the bottom of the mounting shell 4; as shown in fig. 2, a rack 14 is vertically installed on one surface of the supporting bar 5 facing the gear, and the rack 14 is meshed with the gear; the supporting plate 21 is fixed at the bottom of the supporting bar 5, and the lower surface of the supporting plate 21 is kept horizontal; and a cutter group 6 is arranged on the lower surface of the supporting plate 21, and the cutter group 6 is matched with the semiconductor chip to be cut.
In this embodiment, as shown in fig. 1, first guide posts 7 are vertically fixed on the corners of the fixed platform 2, the support plate 21 is sleeved on the first guide posts 7, and a first stop block 9 is fixed on the top of the first guide post 7; therefore, the straightness of the movement direction of the support plate 21 can be effectively guaranteed, and the accuracy of subsequent cutting of waste chips in the frame is guaranteed.
Further, a first spring 8 is sleeved between the fixed platform 2 and the support plate 21 in the first guide column 7; in this way, after the cutting of the defective chips is completed, the support plate 21 can be lifted up by the elasticity of the first spring 8.
Furthermore, a supporting frame 10 is fixed at the top of the mounting housing 4, a second spring 11 is mounted at the top of the supporting frame 10, a top plate 12 is arranged at the top of the supporting bar 5, one end of the second spring 11 is connected with the top of the supporting frame 10, and the other end of the second spring 11 is connected with the top plate 12; in this way, the first spring 8 is further assisted by the elastic force of the second spring 11 to lift and restore the support plate 21.
In this embodiment, as shown in fig. 3 and 4, a pressing plate 20 is further disposed below the supporting plate 21, second guiding columns 18 are vertically disposed at edge positions of an upper surface of the pressing plate 20, the supporting plate 21 is sleeved on the second guiding columns 18, and second stoppers 17 are disposed at tops of the second guiding columns 18; a passage hole 22 is formed in the position, opposite to the cutter set 6, of the pressing plate 20, and the cutter set 6 passes through the passage hole. Thus, when the cutter group 6 cuts the waste chip on the frame, the pressing plate 20 can press the frame to prevent the movement of the frame and influence the cutting. Furthermore, a third spring 19 is sleeved between the pressing plate 20 and the supporting plate 21 on the second guiding column 18, and after the cutting is completed, the pressing plate 20 can be lifted by using the elastic force of the third spring 19.
When the waste chips on the frame are cut, the frame is firstly placed on the fixing table 2, the waste chips on the frame are located under the cutter set 6, the handle 15 is pulled, the rotating shaft 13 rotates, the gear is meshed with the rack 14, the supporting bar 5 is driven to descend, the cutter set 6 on the supporting plate 21 descends, the pressing plate 20 firstly presses the frame, the supporting plate 21 further slides downwards under the guiding effect of the second guiding column 18, the cutter set 6 penetrates through the channel hole 22 to cut the waste chips, finally, the cutter set is lifted up by the aid of elasticity of the first spring 8 and the second spring 11, and cutting is completed.
While embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art without departing from the scope of the present invention.
Claims (7)
1. The device for removing the packaging waste of the semiconductor chip in the frame is characterized by comprising a fixing mechanism and a vertical moving mechanism;
the fixing mechanism comprises a base and a fixing table; the fixed table is fixed on the base, and the upper surface of the fixed table is in a horizontal position; a supporting column is vertically arranged at one end of the base, an installation shell is arranged on the supporting column and positioned right above the fixed station, a rotating shaft is horizontally and rotatably arranged on one side of the installation shell, the rotating shaft penetrates through one side of the installation shell and enters the installation shell, and a gear is fixed at one end of the rotating shaft, which is positioned in the installation shell;
the vertical moving mechanism comprises a supporting bar and a supporting plate; the supporting bar is vertically and slidably arranged on the mounting shell, and two ends of the supporting bar respectively extend out of the top and the bottom of the mounting shell; one surface of the support bar, which faces the gear, is vertically provided with a rack, and the rack is meshed with the gear; the supporting plate is fixed at the bottom of the supporting bar, and the lower surface of the supporting plate is kept horizontal; and a cutter group is arranged on the lower surface of the supporting plate and is matched with the semiconductor chip to be cut.
2. The apparatus for removing package waste of semiconductor chips in frame as claimed in claim 1, wherein the shaft is provided with a handle.
3. The device for removing the package waste of the semiconductor chips in the frame as claimed in claim 1 or 2, wherein the corners of the fixing table are vertically fixed with first guide posts, the supporting plate is sleeved on the first guide posts, and the top of the first guide posts is fixed with first stoppers.
4. The apparatus as claimed in claim 3, wherein a first spring is sleeved between the fixing stage and the supporting plate in the first guiding column.
5. The device for removing the packaging waste of the semiconductor chips in the frame as claimed in claim 4, wherein a supporting frame is fixed on the top of the mounting housing, a second spring is mounted on the top of the supporting frame, a top plate is arranged on the top of the supporting bar, one end of the second spring is connected with the top of the supporting frame, and the other end of the second spring is connected with the top plate.
6. The device for removing the packaging waste of the semiconductor chips in the frame as claimed in claim 1 or 2, wherein a pressing plate is further arranged below the supporting plate, second guide posts are vertically arranged at the edge positions of the upper surface of the pressing plate, the supporting plate is sleeved on the second guide posts, and second stop blocks are arranged at the tops of the second guide posts; and a channel hole is formed in the position, opposite to the cutter group, of the pressing plate and used for the cutter group to pass through.
7. The apparatus for removing package waste of semiconductor chips in frame as claimed in claim 6, wherein a third spring is sleeved on the second guiding column between the pressing plate and the supporting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222735847.7U CN218394801U (en) | 2022-10-17 | 2022-10-17 | Semiconductor chip packaging waste removing device in frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222735847.7U CN218394801U (en) | 2022-10-17 | 2022-10-17 | Semiconductor chip packaging waste removing device in frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218394801U true CN218394801U (en) | 2023-01-31 |
Family
ID=85002765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222735847.7U Active CN218394801U (en) | 2022-10-17 | 2022-10-17 | Semiconductor chip packaging waste removing device in frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218394801U (en) |
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2022
- 2022-10-17 CN CN202222735847.7U patent/CN218394801U/en active Active
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