CN218447813U - Be applied to clamp plate of semiconductor production equipment base - Google Patents
Be applied to clamp plate of semiconductor production equipment base Download PDFInfo
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- CN218447813U CN218447813U CN202222180745.3U CN202222180745U CN218447813U CN 218447813 U CN218447813 U CN 218447813U CN 202222180745 U CN202222180745 U CN 202222180745U CN 218447813 U CN218447813 U CN 218447813U
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- pressing plate
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- base
- plate body
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Abstract
The utility model discloses a be applied to clamp plate of semiconductor production equipment base, include: the semiconductor device comprises a base body, wherein a limiting groove is formed in the upper surface of the base body and used for placing a semiconductor product; the pressing plate comprises a pressing plate body, wherein a cover plate is fixed on the pressing plate body, and the same side of the cover plate and the pressing plate body is rotatably arranged on the upper side of the base body; the heating plate is fixedly arranged in the base body and used for heating the semiconductor product; elastic pieces with gradually increased lengths are distributed on the pressing plate body, so that the frame is warped to different degrees due to heating of the semiconductor in the processing process, the pressing plate strength which can be selected adaptively is provided, the subsequent contact and collision deformation of an operation area are prevented, and the phenomena that the product is connected insecurely and the product is scrapped are avoided; the strength of the clamping object can be controlled by adjusting the position of the pressing plate body in advance according to different processing requirements, and therefore production efficiency and quality are improved.
Description
Technical Field
The utility model relates to a semiconductor production equipment technical field, concretely relates to be applied to clamp plate of semiconductor production equipment base.
Background
The semiconductor packaging process can be roughly divided into 8 main steps of back thinning, wafer cutting, wafer mounting, lead bonding, plastic packaging, laser printing, rib cutting forming, finished product testing and the like.
When the lead bonding process is used for production, the product needs to be pressed on the heating block through the pressing plate, and the heating packaging operation is completed. Severe warpage (i.e., mid-camber of the product) due to heating of the product during pre-process operations; in the operation of the wire bonding process, when a product is pressed tightly by a pressing plate and a heating block in the prior art, the surface of the product touches the bottom of the pressing plate, so that the product is collapsed and scrapped, quality accidents are caused, and the production cost is increased;
the pressing plate in the prior art can not provide packaging modes with different strengths aiming at the warping interface, so that the production efficiency is reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a be applied to the clamp plate of semiconductor production equipment base, solve problem in the above-mentioned background.
The purpose of the utility model can be realized by the following technical scheme:
a platen for use with a semiconductor manufacturing equipment base, comprising:
the semiconductor device comprises a base body, wherein a limiting groove is formed in the upper surface of the base body and used for placing a semiconductor product;
the pressing plate comprises a pressing plate body, wherein a cover plate is fixed on the pressing plate body, and the same side of the cover plate and the pressing plate body is rotatably arranged on the upper side of the base body;
and the heating plate is fixedly arranged in the base body and used for heating the semiconductor product.
As a further aspect of the present invention: the pressing plate body in install a plurality of elastic component, a plurality of the elastic component is the gradual increase and arranges.
As a further aspect of the present invention: the movable support is fixedly arranged on one side of the cover plate, moving grooves are symmetrically formed in the two sides of the base body, the movable support is movably arranged in the moving grooves, and fixing blocks in threaded connection are arranged at the two ends of the movable support.
As a further aspect of the present invention: the cover plate is provided with a groove and is connected with the base body in series through the groove.
As a further aspect of the present invention: an inner panel is fixed on the upper surface of the base body.
The utility model has the advantages that:
(1) In the utility model, the pressing plate body is convenient to move on the base body through the arranged moving groove and the moving column, and the pressing plate body is provided with the elastic pieces with gradually increased length, so that the heating of the semiconductor in the processing process causes the frame to warp in different degrees, thereby providing a pressing plate strength which can be selected adaptively, further preventing the subsequent operation area from contacting and colliding and deforming, and avoiding the insecure connection and scrapping of products; the strength of the clamping object can be controlled by adjusting the position of the pressing plate body in advance according to different processing requirements, and therefore production efficiency and quality are improved.
(2) In the utility model, the guide packaging of the semiconductor product is realized through the pressing plate body which is arranged on one side of the base body and is rotationally pressed, and the stability of the pressing plate is further improved; and the tightness of the pressing plate body can be adjusted through the fixing block which can be adjusted through threads, so that the pressing plate body can be operated conveniently.
Drawings
The present invention will be further described with reference to the accompanying drawings.
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic structural view of the pressing plate body of the present invention;
fig. 3 is a schematic structural view of the base body of the present invention;
in the figure: 1. a base body; 2. a limiting groove; 3. heating plates; 4. a pressing plate body; 5. an inner panel; 6. a moving groove; 7. a movable post; 8. a fixed block; 9. a cover plate; 10. a groove; 11. an elastic member.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a pressing plate for a semiconductor manufacturing apparatus base, comprising:
the semiconductor device comprises a base body 1, wherein a limiting groove 2 is formed in the upper surface of the base body 1, and the limiting groove 2 is used for placing a semiconductor product;
the pressing plate comprises a pressing plate body 4, wherein a cover plate 9 is fixed on the pressing plate body 4, and the same side of the cover plate 9 and the pressing plate body 4 is rotatably arranged on the upper side of the base body 1;
and a heating plate 3 fixedly installed inside the susceptor body 1 for heating the semiconductor product.
It should be noted that the semiconductor product packaged in this application is a lead frame, which is a chip carrier of an integrated circuit; when the pressing plate body 1 is pressed with the lead frame, the side frame of the pressing plate body 1 is tightly attached to the corresponding frame plate, and a gap is reserved between the cover plate 9 and the lead frame. The void height is greater than the height of the warp domed area.
In practical application and initial regulation, the pressing plate body 4 is rotated to guide and package the semiconductor product; an inner panel 5 is fixed on the upper surface of the base body 1 and used for placing a semiconductor product; the front end of the pressing plate body 4 is held by hand to press, and after the pressing is ensured to be well matched, the heating plate 3 is started to heat the semiconductor, so that the pressing plate strength which can be selected adaptively is provided, and further, the deformation of a subsequent operation area is prevented; the strength of the clamping object can be controlled by adjusting the position of the pressing plate body 4 in advance according to different processing requirements, and further the production efficiency and the quality are improved.
As shown in fig. 1-3, as a preferred embodiment of the present invention, a plurality of elastic members 11 are installed in the pressing plate body 4, and the plurality of elastic members 11 are arranged in a gradually increasing manner;
the movable column 7 is fixedly arranged on one side of the cover plate 9, the moving grooves 6 are symmetrically formed in two sides of the base body 1, the movable column 7 is movably arranged in the moving grooves 6, and fixing blocks 8 in threaded connection are arranged at two ends of the movable column 7.
In one aspect of the present embodiment, by adjusting the position of the movable column 7 in the movable slot 6 and further adjusting the position of the pressure plate body 4 on the base body 1, the pressure plate body 4 is arranged with an elastic element 11 with gradually increasing length, the elastic element 11 is disposed inside the pressure plate body 4, and a spring or an equivalent structure can be selected.
As shown in fig. 1-3, as a preferred embodiment of the present invention, a groove 10 is disposed on the cover plate 9, and the cover plate 9 is connected in series with the base body 1 through the groove 10.
In a case of this embodiment, when the rotating pressing plate body 4 moves back and forth in the moving groove 6, it is not obstructed by the base body 1, and the convenience degree of the moving adjustment of the pressing plate body 4 is ensured.
The utility model discloses a theory of operation: the embodiment of the utility model provides a clamp plate applied to semiconductor production equipment base, the clamp plate body 4 has been convenient to move on base body 1 through moving groove 6 and movable post 7 that set up, and the elastic component 11 of gradual increase length is arranged to clamp plate body 4, and then for the heating causes the frame to warp to different degrees in the course of working of semiconductor, provide a clamp plate intensity that can adapt to the selection, and then prevent subsequent processing procedure from leading to contact and collision, avoid the product connection insecure, product is scrapped; the strength of the clamping object can be controlled by adjusting the position of the pressing plate body 4 in advance according to different processing requirements, and therefore the production efficiency and the quality are improved.
Although an embodiment of the present invention has been described in detail, the description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.
Claims (5)
1. Be applied to clamp plate of semiconductor production equipment base, its characterized in that includes:
the semiconductor device comprises a base body (1), wherein a limiting groove (2) is formed in the upper surface of the base body (1), and the limiting groove (2) is used for placing a semiconductor product;
the pressing plate comprises a pressing plate body (4), wherein a cover plate (9) is fixed on the pressing plate body (4), and the same side of the cover plate (9) and the pressing plate body (4) is rotatably arranged on the upper side of the base body (1);
and the heating plate (3) is fixedly arranged in the base body (1) and is used for heating the semiconductor product.
2. The pressing plate applied to the base of the semiconductor production equipment as claimed in claim 1, wherein a plurality of elastic members (11) are installed in the pressing plate body (4), and the plurality of elastic members (11) are arranged in a gradually increasing manner.
3. The pressing plate applied to the base of the semiconductor production equipment as claimed in claim 1, wherein a movable column (7) is fixedly arranged on one side of the cover plate (9), moving grooves (6) are symmetrically formed in two sides of the base body (1), the movable column (7) is movably arranged in the moving grooves (6), and fixing blocks (8) in threaded connection are arranged at two ends of the movable column (7).
4. The pressing plate applied to the base of the semiconductor production equipment as claimed in claim 1, wherein the cover plate (9) is provided with a groove (10), and the cover plate (9) is connected with the base body (1) in series through the groove (10).
5. The pressing plate applied to the pedestal of the semiconductor production equipment as claimed in claim 1, wherein an inner panel (5) is fixed on the upper surface of the pedestal body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222180745.3U CN218447813U (en) | 2022-08-18 | 2022-08-18 | Be applied to clamp plate of semiconductor production equipment base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222180745.3U CN218447813U (en) | 2022-08-18 | 2022-08-18 | Be applied to clamp plate of semiconductor production equipment base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218447813U true CN218447813U (en) | 2023-02-03 |
Family
ID=85095553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222180745.3U Active CN218447813U (en) | 2022-08-18 | 2022-08-18 | Be applied to clamp plate of semiconductor production equipment base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218447813U (en) |
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2022
- 2022-08-18 CN CN202222180745.3U patent/CN218447813U/en active Active
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