CN218826986U

CN218826986U - Packaging machine for semiconductor production line

Info

Publication number: CN218826986U
Application number: CN202222738448.6U
Authority: CN
Inventors: 郭保磊
Original assignee: Yaoxin Semiconductor Huzhou Co ltd
Current assignee: Kuanshan Chaopeng Mechanical And Electrical Technology Co ltd
Priority date: 2022-10-18
Filing date: 2022-10-18
Publication date: 2023-04-07
Anticipated expiration: 2032-10-18

Abstract

The utility model discloses a semiconductor is packaging machine for production line, including the supporting mechanism, the supporting mechanism includes the support column, the top fixedly connected with backup pad of support column, the top sliding connection of backup pad has the supporting shoe, the both sides of supporting shoe are provided with clamping mechanism, the mount has been placed at the top of supporting shoe, the top rear side of backup pad is provided with guiding mechanism. The beneficial effects are that: the adjusting mechanism is arranged, and the position of the packaging cover is adjusted through the adjusting mechanism, so that the clamping strip at the bottom of the packaging cover can be smoothly inserted into the clamping groove formed in the top of the fixing frame; the adjusting mechanism comprises a first motor, and the whole mechanism is rotated through the first motor, so that the clamping assembly can clamp a new packaging cover to carry out packaging continuously; the baffle is arranged, and the baffle is initially positioned in the grooves formed in the two sides of the fixing frame, so that the semiconductor chip is conveniently fixed.

Description

Packaging machine for semiconductor production line

Technical Field

The utility model relates to a semiconductor production field especially relates to a packaging machine for semiconductor production line.

Background

The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The packaging process comprises the following steps: the wafer from the previous process of the wafer is cut into small chips through a scribing process, then the cut chips are pasted on the corresponding small islands of the substrate frame through glue, and then the bonding pads of the chips are connected to the corresponding pins of the substrate through superfine metal wires or conductive resin to form a required circuit; then packaging and protecting the independent wafer by using a plastic shell, carrying out a series of operations after plastic packaging, carrying out finished product testing after packaging, generally carrying out the processes of inspection, testing, packaging and the like, and finally warehousing and shipping.

Chinese patent publication No. CN210325744U discloses a packaging mechanism for semiconductor manufacture through retrieval, including the mount, the mounting groove has been seted up at the top of mount, mounting groove internally mounted has the base plate, all through locking bolted connection between base plate and the mount four corners, the top horizontally connect of base plate has semiconductor chip, semiconductor chip's both sides all are equipped with installation mechanism.

The patent effectively improves the stability of the installation of the semiconductor chip, but because of the existence of errors, the probability of one-time success is smaller when the fixture block on the packaging cover is matched with the installation groove on the fixing frame, and therefore continuous adjustment is needed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a packaging machine for semiconductor manufacturing line just in order to solve above-mentioned problem.

The utility model discloses a following technical scheme realizes above-mentioned purpose:

the utility model provides a semiconductor is packaging machine for production line, includes supporting mechanism, supporting mechanism includes the support column, the top fixedly connected with backup pad of support column, the top sliding connection of backup pad has the supporting shoe, the both sides of supporting shoe are provided with clamping mechanism, the mount has been placed at the top of supporting shoe, the top rear side of backup pad is provided with guiding mechanism.

Preferably, guiding mechanism includes first motor, first motor fixed connection be in the top rear side of backup pad, there is the pole setting output of first motor through the coupling joint, the top fixedly connected with installation piece of pole setting, the front side fixedly connected with support frame of installation piece, the mounting groove has been seted up at the top of support frame, the front side fixedly connected with second motor of installation piece, there is the lead screw output of second motor through the coupling joint, threaded connection has the slider on the lead screw, slider sliding connection be in the mounting groove that the support frame top was seted up, the bottom fixedly connected with pneumatic cylinder of slider, the bottom fixedly connected with centre gripping subassembly of pneumatic cylinder.

Preferably, the clamping mechanism comprises two L-shaped support plates which are symmetrically arranged, the L-shaped support plates are fixedly connected to two sides of the support block, one side of each L-shaped support plate, which is close to the support block, is fixedly connected with a first electric push rod, and the other end of each first electric push rod is fixedly connected with a clamping plate.

Preferably, the top of mount is seted up slottedly, inslot fixedly connected with semiconductor chip, both sides are seted up slottedly around the mount, and inslot sliding connection has hugs closely the baffle of semiconductor chip upper surface, one side fixedly connected with second electric putter of baffle, second electric putter other end fixed connection be in the inner wall of mount, the bottom both sides fixedly connected with of mount a plurality of evenly set up pins.

Preferably, the clamping assembly clamps the packaging cover in the middle.

Preferably, the heat dissipation holes are formed in the front side and the rear side of the packaging cover, the clamping strips are fixedly connected to the bottom of the packaging cover, and clamping grooves corresponding to the clamping strips are formed in the top of the fixing frame.

Has the advantages that: the adjusting mechanism is arranged, and the position of the packaging cover is adjusted through the adjusting mechanism, so that the clamping strip at the bottom of the packaging cover can be smoothly inserted into the clamping groove formed in the top of the fixing frame; the adjusting mechanism comprises a first motor, and the whole mechanism is rotated through the first motor, so that the clamping assembly can clamp a new packaging cover to carry out packaging continuously; the baffle is arranged, and the baffle is initially positioned in the grooves formed in the two sides of the fixing frame, so that the semiconductor chip is conveniently fixed.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic view of a packaging machine for a semiconductor production line according to the present invention;

fig. 2 is a top view of the packaging machine for semiconductor production line according to the present invention;

FIG. 3 is a front view of the packaging machine for semiconductor manufacturing line according to the present invention;

FIG. 4 is a right side view of the packaging machine for semiconductor manufacturing line according to the present invention;

fig. 5 is a schematic view of the internal structure of the fixing frame of the packaging machine for the semiconductor production line.

The reference numerals are explained below: 1. a support mechanism; 101. a support pillar; 102. a support plate; 2. a support block; 3. a clamping mechanism; 301. an L-shaped support plate; 302. a first electric push rod; 303. a clamping plate; 4. a fixed mount; 401. a baffle plate; 402. a second electric push rod; 403. a semiconductor chip; 404. a pin; 5. an adjustment mechanism; 501. a first motor; 502. erecting a rod; 503. mounting blocks; 504. a support frame; 505. a second motor; 506. a screw rod; 507. a slider; 508. a hydraulic cylinder; 509. a clamping assembly; 6. a package cover; 601. heat dissipation holes; 602. and (6) clamping the strip.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

The present invention will be further explained with reference to the accompanying drawings:

examples

As shown in fig. 1-5, a packaging machine for a semiconductor production line comprises a supporting mechanism 1, wherein the supporting mechanism 1 comprises a supporting column 101, a supporting plate 102 is welded on the top of the supporting column 101, a supporting block 2 is slidably connected to the top of the supporting plate 102, clamping mechanisms 3 are arranged on two sides of the supporting block 2, a fixing frame 4 is placed on the top of the supporting block 2, and an adjusting mechanism 5 is arranged on the rear side of the top of the supporting plate 102.

In this embodiment, the adjusting mechanism 5 includes a first motor 501, the first motor 501 is bolted on the rear side of the top of the supporting plate 102, the output end of the first motor 501 is connected with a vertical rod 502 through a coupler, the top of the vertical rod 502 is fixedly connected with an installation block 503, the front side of the installation block 503 is fixedly connected with a support frame 504, the top of the support frame 504 is provided with an installation groove, the front side of the installation block 503 is bolted with a second motor 505, the output end of the second motor 505 is connected with a lead screw 506 through a coupler, a sliding block 507 is in threaded connection with the lead screw 506, the sliding block 507 is slidably connected in the installation groove formed in the top of the support frame 504, the bottom of the sliding block 507 is fixedly connected with a hydraulic cylinder 508, the bottom of the hydraulic cylinder 508 is fixedly connected with a clamping component 509, the second motor 505 is started, the second motor 505 drives the lead screw 507 to rotate, the lead screw 506 drives the sliding block 506 to move, the sliding block 507 drives the hydraulic cylinder 508 to move, and the hydraulic cylinder 508 drives the clamping component 509 to drive the packaging cover 6 to move.

In this embodiment, the clamping mechanism 3 includes two symmetrically disposed L-shaped support plates 301, the L-shaped support plates 301 are fixedly connected to two sides of the supporting block 2, one side of the L-shaped support plate 301 close to the supporting block 2 is fixedly connected with a first electric push rod 302, the other end of the first electric push rod 302 is fixedly connected with a clamping plate 303, and the clamping plate 303 clamps the fixing frame 4 by controlling the first electric push rod 302.

In this embodiment, the top of mount 4 is seted up slottedly, the inslot is through glue fixedly connected with semiconductor chip 403, both sides are seted up slottedly around mount 4, sliding connection has baffle 401 of hugging closely semiconductor chip 403 upper surface in the inslot, one side fixedly connected with second electric putter 402 of baffle 401, the inner wall at mount 4 is connected to the second electric putter 402 other end fixed connection, the pin 404 of a plurality of even settings of bottom both sides fixedly connected with of mount 4, through electric connection between pin 404 and the semiconductor chip 403, the installation of mount 4 is convenient for through pin 404, second electric putter 402 makes baffle 401 slide to the top of semiconductor chip 403 from the inslot of both sides, set up the inslot semiconductor chip 403 at mount 4 top to gluing and carry out further fixing.

In this embodiment, the clamping assembly 509 clamps the package lid 6 therebetween.

In this embodiment, heat dissipation holes 601 are formed in the front and rear sides of the encapsulation cover 6, a clamping strip 602 is welded to the bottom of the encapsulation cover 6, a clamping groove corresponding to the clamping strip 602 is formed in the top of the fixing frame 4, and the clamping strip 602 at the bottom of the encapsulation cover 6 is smoothly inserted into the clamping groove formed in the top of the fixing frame 4 through the adjusting mechanism 5.

The working principle is as follows: the utility model discloses in, at first put mount 4 at the top of supporting shoe 2, it presss from both sides the mount 4 tightly to make the clamp plate 303 press from both sides through controlling first electric putter 302, make baffle 401 slide to the top of semiconductor chip 403 from the inslot of both sides through controlling second electric putter 402, set up the inslot at mount 4 top to glue and carry out further fixed, then utilize clamping component 509 to hold encapsulation lid 6, make clamping component 509 press from both sides encapsulation lid 6 downstream through control pneumatic cylinder 508, start second motor 505, second motor 505 drive lead screw 506 rotates, lead screw 506 drive slider 507 removes, slider 507 drive pneumatic cylinder 508 removes, pneumatic cylinder 508 drive clamping component 509 drives encapsulation lid 6 and removes, thereby through the smooth grafting of card strip 602 of adjustment bottom encapsulation lid 6 to the draw-in groove of seting up at mount 4 top, after the encapsulation, make pole setting 502 rotate through driving first motor 501, thereby make the new encapsulation lid 6 of clamping component 509 centre gripping continue to encapsulate.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a semiconductor is packaging machine for production line, includes supporting mechanism (1), supporting mechanism (1) includes support column (101), the top fixedly connected with backup pad (102) of support column (101), its characterized in that: the top of the supporting plate (102) is connected with a supporting block (2) in a sliding mode, clamping mechanisms (3) are arranged on two sides of the supporting block (2), a fixing frame (4) is placed at the top of the supporting block (2), and an adjusting mechanism (5) is arranged on the rear side of the top of the supporting plate (102).

2. A packaging machine for a semiconductor production line as claimed in claim 1, wherein: adjustment mechanism (5) include first motor (501), first motor (501) fixed connection be in the top rear side of backup pad (102), the output of first motor (501) has pole setting (502) through the coupling joint, the top fixedly connected with installation piece (503) of pole setting (502), front side fixedly connected with support frame (504) of installation piece (503), the mounting groove has been seted up at the top of support frame (504), the front side fixedly connected with second motor (505) of installation piece (503), the output of second motor (505) has lead screw (506) through the coupling joint, threaded connection has slider (507) on lead screw (506), slider (507) sliding connection be in the mounting groove that support frame (504) top was seted up, the bottom fixedly connected with pneumatic cylinder (508) of slider (507), the bottom fixedly connected with centre gripping subassembly (509) of pneumatic cylinder (508).

3. A packaging machine for a semiconductor production line as claimed in claim 1, wherein: the clamping mechanism (3) comprises two L-shaped support plates (301) which are symmetrically arranged, the L-shaped support plates (301) are fixedly connected to two sides of the supporting block (2), one side, close to the supporting block (2), of each L-shaped support plate (301) is fixedly connected with a first electric push rod (302), and the other end of each first electric push rod (302) is fixedly connected with a clamping plate (303).

4. A packaging machine for a semiconductor production line according to claim 1, characterized in that: the top of mount (4) is seted up slottedly, and inslot fixedly connected with semiconductor chip (403), both sides are seted up slottedly around mount (4), and inslot sliding connection has hugs closely baffle (401) of semiconductor chip (403) upper surface, one side fixedly connected with second electric putter (402) of baffle (401), second electric putter (402) other end fixed connection be in the inner wall of mount (4), a plurality of evenly set up pins (404) of bottom both sides fixedly connected with of mount (4).

5. A packaging machine for a semiconductor production line as claimed in claim 2, wherein: the clamping component (509) clamps the packaging cover (6) in the middle.

6. A packaging machine for a semiconductor production line according to claim 5, characterized in that: the heat dissipation holes (601) are formed in the front side and the rear side of the packaging cover (6), the bottom of the packaging cover (6) is fixedly connected with a clamping strip (602), and the top of the fixing frame (4) is provided with a clamping groove corresponding to the clamping strip (602).