CN214336701U - Semiconductor chip packaging module structure with low thermal resistance - Google Patents
Semiconductor chip packaging module structure with low thermal resistance Download PDFInfo
- Publication number
- CN214336701U CN214336701U CN202023105861.6U CN202023105861U CN214336701U CN 214336701 U CN214336701 U CN 214336701U CN 202023105861 U CN202023105861 U CN 202023105861U CN 214336701 U CN214336701 U CN 214336701U
- Authority
- CN
- China
- Prior art keywords
- semiconductor chip
- fixedly connected
- packaging shell
- main body
- chip main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of semiconductor chip production packaging, in particular to a semiconductor chip packaging module structure with low thermal resistance, which comprises a semiconductor chip main body, a limiting frame and a heat conducting gel, wherein a lower packaging shell is arranged below the semiconductor chip main body, an upper packaging shell is arranged above the semiconductor chip main body, a rubber layer is fixedly connected with the bottom in the lower packaging shell, a semiconductor chip main body is arranged right above the rubber layer, a wire guide rod is arranged below the semiconductor chip main body, and a pin is fixedly connected with the bottom of the wire guide rod. Preventing damage during use.
Description
Technical Field
The utility model relates to a semiconductor chip production encapsulation technical field specifically is a semiconductor chip encapsulation module structure of low thermal resistance.
Background
The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a function requirement to obtain an independent chip, and the packaging process is as follows: a wafer from a wafer previous process is cut into small chips (Die) through a scribing process, then the cut chips are pasted on small islands of corresponding substrate (lead frame) frames through glue, and bonding pads (Bond pads) of the chips are connected to corresponding pins of the substrate through superfine metal (gold tin copper aluminum) wires or conductive resin to form a required circuit; and then packaging and protecting the independent wafer by using a plastic shell, carrying out a series of operations after plastic packaging, carrying out finished product testing after packaging, generally carrying out procedures such as inspection, Test, packaging and the like, and finally warehousing and shipping.
The semiconductor chip packaging module structure of transmission usually directly encapsulates the semiconductor chip main body in a proper packaging shell, and the semiconductor chip main body may cause the problem of low yield because of contact deviation at this moment, and because the packaging shell is mostly a plastic structure, may cause the damage because the packaging shell is not firm enough when using, consequently, provides a semiconductor chip packaging module structure of low thermal resistance to above-mentioned problem.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor chip encapsulation module structure of low thermal resistance to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a semiconductor chip packaging module structure with low thermal resistance comprises a semiconductor chip main body, a limiting frame and heat conducting gel, wherein a lower packaging shell is arranged below the semiconductor chip main body, an upper packaging shell is arranged above the semiconductor chip main body, a rubber layer is fixedly connected to the bottom in the lower packaging shell, the semiconductor chip main body is arranged right above the rubber layer, a wire guide rod is arranged below the semiconductor chip main body, pins are fixedly connected to the bottom of the wire guide rod, a limiting groove is formed in the lower packaging shell, the lower packaging shell is fixedly connected with the wire guide rod through the limiting groove, a limiting hole is formed in the rubber layer, the wire guide rod is arranged in the limiting hole formed in the rubber layer, the pins which are uniformly distributed are fixedly connected to two sides in the lower packaging shell, a fixing plate is fixedly connected in the lower packaging shell, and through holes are formed in the fixing plate, the fixed plate is through establishing through-hole fixedly connected with dead lever, the spacing frame of fixedly connected with in the encapsulation casing down, set up the constant head tank that is evenly distributed in the spacing frame, spacing frame is equipped with the gag lever post in the constant head tank, the fixed frame of gag lever post one side fixedly connected with, in the fixed frame with semiconductor chip main part fixed connection, on encapsulate fixedly connected with and be evenly distributed's first cooling tube in the casing, first cooling tube bottom fixedly connected with is evenly distributed's second cooling tube, second cooling tube bottom fixedly connected with heat conduction gel, heat conduction gel bottom and semiconductor chip main part zonulae occludens, on encapsulate the internal below fixedly connected with heat dissipation silica gel of casing.
Preferably, a limiting frame is arranged right above the rubber layer, U-shaped reinforcing rods are arranged on the outer sides of the pins, the pins are arranged on two sides of the fixing rod, and wire guide rods are arranged on two sides of the fixing plate.
Preferably, the upper packaging shell is arranged above the lower packaging shell, the upper packaging shell is arranged on the outer side of the upper side of the limiting frame, and a fixing frame is arranged in the limiting frame.
Preferably, a through hole is formed in the heat dissipation silica gel, a second heat dissipation pipe is fixedly connected in the through hole formed in the heat dissipation silica gel, heat conduction gel is arranged in the through hole formed in the heat dissipation silica gel, and the fixing frame is provided with heat dissipation holes which are uniformly distributed.
Preferably, a limiting hole is formed in the inner lower portion of the upper packaging shell, the upper packaging shell is fixedly connected with the second radiating tube through the limiting hole, a semiconductor chip main body is arranged in the upper packaging shell, and the bottom of the heat-conducting silica gel is tightly connected with the semiconductor chip main body.
Compared with the prior art, the beneficial effects of the utility model are that:
1. in the utility model, the semiconductor chip main body can be conveniently positioned during packaging through the arranged limiting frame, the limiting rod and the fixing frame, so that the semiconductor chip main body is prevented from generating deviation during packaging to cause disqualification of the semiconductor chip, and meanwhile, the lower packaging shell can be reinforced through the arranged fixing plate, the fixing rod and the U-shaped reinforcing rod to prevent damage during use;
2. the utility model discloses in, can be with the leading-in second cooling tube of heat that the semiconductor chip main part produced through the heat conduction gel that sets up, simultaneously can be when carrying out the buffering protection to the semiconductor chip main part with the leading-in second cooling tube of heat through heat dissipation silica gel, can be with heat discharge through first cooling tube, through the louvre that fixed frame was established, can upwards derive the heat that produces semiconductor chip main part below, through the leading-in second cooling tube of heat dissipation silica gel, convenient discharge.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic view of the fixing frame mounting structure of the present invention;
FIG. 3 is a schematic view of the installation structure of the heat conductive gel of the present invention;
FIG. 4 is a schematic diagram of the fixing plate structure of the present invention;
fig. 5 is the utility model discloses U type anchor strut mounting structure schematic diagram.
In the figure: 1-lower packaging shell, 2-upper packaging shell, 3-semiconductor chip main body, 4-heat dissipation silica gel, 5-rubber layer, 6-limiting frame, 7-fixing frame, 8-limiting rod, 9-fixing plate, 10-fixing rod, 11-wire rod, 12-U-shaped reinforcing rod, 13-heat conduction gel, 14-first heat dissipation pipe, 15-second heat dissipation pipe and 16-pin.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution:
a low thermal resistance semiconductor chip packaging module structure comprises a semiconductor chip main body 3, a limiting frame 6 and a heat conducting gel 13, wherein a lower packaging shell 1 is arranged below the semiconductor chip main body 3, an upper packaging shell 2 is arranged above the semiconductor chip main body 3, a rubber layer 5 is fixedly connected to the bottom in the lower packaging shell 1, the semiconductor chip main body 3 is arranged right above the rubber layer 5, a wire guide rod 11 is arranged below the semiconductor chip main body 3, pins 16 are fixedly connected to the bottom of the wire guide rod 11, a limiting groove is formed in the lower packaging shell 1, the lower packaging shell 1 is fixedly connected with the wire guide rod 11 through the limiting groove, a limiting hole is formed in the rubber layer 5, the wire guide rod 11 is arranged in the limiting hole formed in the rubber layer 5, the pins 16 which are uniformly distributed are fixedly connected to two sides in the lower packaging shell 1, a fixing plate 9 is fixedly connected to the lower packaging shell 1, and a through hole is formed in the fixing plate 9, the fixing plate 9 is fixedly connected with a fixing rod 10 through a through hole, the lower packaging shell 1 is internally and fixedly connected with a limiting frame 6, positioning grooves which are uniformly distributed are arranged in the limiting frame 6, a limiting rod 8 is arranged in the positioning groove arranged on the limiting frame 6, one side of the limiting rod 8 is fixedly connected with a fixing frame 7, the inside of the fixing frame 7 is fixedly connected with the semiconductor chip main body 3, can carry on spacingly to semiconductor chip main part 3 through this setting, it is more stable when making the installation, go up fixedly connected with and be evenly distributed's first cooling tube 14 in encapsulation casing 2, first cooling tube 14 bottom fixedly connected with is evenly distributed's second cooling tube 15, 15 bottom fixedly connected with heat conduction gel 13 of second cooling tube, heat conduction gel 13 bottom and 3 zonulae occludens of semiconductor chip main part, go up encapsulation casing 2 interior below fixedly connected with heat dissipation silica gel 4, can be convenient dispel the heat to the semiconductor chip main part through this setting.
A limiting frame 6 is arranged right above the rubber layer 5, U-shaped reinforcing rods 12 are arranged on the outer sides of the pins 16, the pins 16 are arranged on the two sides of the fixing rod 10, lead rods 11 are arranged on the two sides of the fixing plate 9, the packaging module can be reinforced through the arrangement, the packaging module is prevented from being damaged, an upper packaging shell 2 is arranged above the lower packaging shell 1, an upper packaging shell 2 is arranged on the outer side above the limiting frame 6, a fixing frame 7 is arranged in the limiting frame 6, the semiconductor chip main body 3 can be conveniently packaged through the arrangement, the packaging effect is better, through holes are formed in the heat dissipation silica gel 4, second heat dissipation tubes 15 are fixedly connected in the through holes arranged in the heat dissipation silica gel 4, heat conduction gel 13 is arranged in the through holes arranged in the heat dissipation silica gel 4, heat dissipation holes which are uniformly distributed are formed in the fixing frame 7, the heat dissipation of the semiconductor chip main body 3 can be conveniently performed through the arrangement, and limiting holes are arranged below the upper packaging shell 2, go up encapsulation casing 2 through establishing spacing hole and second cooling tube 15 fixed connection, be equipped with semiconductor chip main part 3 in going up encapsulation casing 2, heat conduction silica gel 4 bottom and semiconductor chip main part 3 zonulae occludens, cushions semiconductor chip main part 3 when dispelling the heat to semiconductor chip main part 3 through this setting, prevents that semiconductor chip main part 3 from damaging.
The working process is as follows: when the semiconductor chip packaging module structure is used, the lower packaging shell 1 is firstly placed at a proper position, the semiconductor chip main body 3 is moved to the top of the lower packaging shell 1 by a machine, the limiting rod 8 is aligned to a limiting groove arranged on the limiting frame 6, the semiconductor chip main body 3 is controlled to move downwards by the machine, the limiting rod 8 enters the limiting groove arranged on the limiting frame 6, the semiconductor chip main body 3 is fixed by the limiting rod 8 and the fixing frame 7, the lead rod 11 is contacted with the semiconductor chip main body 3, the bottom of the semiconductor chip main body 3 is tightly contacted with the rubber layer 5, the upper packaging shell 2 is moved to the position right above the lower packaging shell 1 by the machine, the upper packaging shell 1 is moved downwards by the machine and is placed to the outer side of the limiting frame 6, and the upper packaging shell 2 is fixedly connected with the lower packaging shell 1, this moment heat dissipation silica gel 4 and heat conduction gel all with semiconductor chip main part 3 zonulae occludens, accomplish the encapsulation this moment, when this semiconductor chip is using, directly be connected pin 16 with the mainboard, can fix and support lower encapsulation casing 1 through U type anchor strut 12, fixed plate 9 and dead lever 10 this moment, after this mainboard circular telegram, insert the electric current in semiconductor chip main part 3 through pin 16, semiconductor chip main part 3 begins to operate this moment, the inevitable heat that can produce when operating, introduce into first cooling tube 14 through second cooling tube 15 with the heat through heat dissipation silica gel 4 and heat conduction gel 13 this moment, the air in first cooling tube 14 is taken away with the heat together through the flow of air this moment, realize the heat dissipation to semiconductor chip main part 3.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a semiconductor chip encapsulation modular structure of low thermal resistance, includes semiconductor chip main part (3), spacing frame (6) and heat conduction gel (13), its characterized in that: a lower packaging shell (1) is arranged below the semiconductor chip main body (3), an upper packaging shell (2) is arranged above the semiconductor chip main body (3), a rubber layer (5) is fixedly connected to the bottom of the lower packaging shell (1), the semiconductor chip main body (3) is arranged right above the rubber layer (5), a wire guide rod (11) is arranged below the semiconductor chip main body (3), a pin (16) is fixedly connected to the bottom of the wire guide rod (11), a limiting groove is formed in the lower packaging shell (1), the lower packaging shell (1) is fixedly connected with the wire guide rod (11) through the limiting groove, a limiting hole is formed in the rubber layer (5), the wire guide rod (11) is arranged in the limiting hole formed in the rubber layer (5), and the pin (16) which are uniformly distributed are fixedly connected to two sides in the lower packaging shell (1), the packaging structure is characterized in that a fixing plate (9) is fixedly connected in the lower packaging shell (1), a through hole is formed in the fixing plate (9), a fixing rod (10) is fixedly connected with the fixing plate through the arranged through hole of the fixing plate (9), a limiting frame (6) is fixedly connected in the lower packaging shell (1), positioning grooves which are uniformly distributed are formed in the limiting frame (6), a limiting rod (8) is arranged in the positioning groove formed in the limiting frame (6), a fixing frame (7) is fixedly connected to one side of the limiting rod (8), the fixing frame (7) is fixedly connected with a semiconductor chip main body (3), first radiating pipes (14) which are uniformly distributed are fixedly connected in the upper packaging shell (2), second radiating pipes (15) which are uniformly distributed are fixedly connected to the bottom of the first radiating pipes (14), and heat-conducting gel (13) is fixedly connected to the bottom of the second radiating pipes (15), the bottom of the heat conducting gel (13) is tightly connected with the semiconductor chip main body (3), and the lower part of the upper packaging shell (2) is fixedly connected with heat-radiating silica gel (4).
2. The semiconductor chip packaging module structure of claim 1, wherein: be equipped with limit frame (6) directly over rubber layer (5), pin (16) outside all is equipped with U type anchor strut (12), dead lever (10) both sides all are equipped with pin (16), fixed plate (9) both sides all are equipped with wire guide (11).
3. The semiconductor chip packaging module structure of claim 1, wherein: encapsulation casing (2) are equipped with to encapsulation casing (1) top down, spacing frame (6) top outside is equipped with encapsulation casing (2), be equipped with fixed frame (7) in spacing frame (6).
4. The semiconductor chip packaging module structure of claim 1, wherein: the heat dissipation structure is characterized in that a through hole is formed in the heat dissipation silica gel (4), a second heat dissipation pipe (15) is fixedly connected in the through hole formed in the heat dissipation silica gel (4), heat conduction gel (13) is arranged in the through hole formed in the heat dissipation silica gel (4), and heat dissipation holes which are uniformly distributed are formed in the fixing frame (7).
5. The semiconductor chip packaging module structure of claim 1, wherein: the improved radiating structure is characterized in that a limiting hole is formed in the lower portion of the upper packaging shell (2), the upper packaging shell (2) is fixedly connected with the second radiating pipe (15) through the limiting hole, a semiconductor chip main body (3) is arranged in the upper packaging shell (2), and the bottom of the radiating silica gel (4) is tightly connected with the semiconductor chip main body (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023105861.6U CN214336701U (en) | 2020-12-21 | 2020-12-21 | Semiconductor chip packaging module structure with low thermal resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023105861.6U CN214336701U (en) | 2020-12-21 | 2020-12-21 | Semiconductor chip packaging module structure with low thermal resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214336701U true CN214336701U (en) | 2021-10-01 |
Family
ID=77900784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023105861.6U Active CN214336701U (en) | 2020-12-21 | 2020-12-21 | Semiconductor chip packaging module structure with low thermal resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214336701U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117199016A (en) * | 2023-11-06 | 2023-12-08 | 上海威固信息技术股份有限公司 | Optoelectronic semiconductor chip structure and method for producing the same |
-
2020
- 2020-12-21 CN CN202023105861.6U patent/CN214336701U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117199016A (en) * | 2023-11-06 | 2023-12-08 | 上海威固信息技术股份有限公司 | Optoelectronic semiconductor chip structure and method for producing the same |
| CN117199016B (en) * | 2023-11-06 | 2024-01-23 | 上海威固信息技术股份有限公司 | Optoelectronic semiconductor chip structure and method for producing the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109727943A (en) | A kind of package structure of semiconductor device and its manufacturing method with low thermal resistance | |
| CN214336701U (en) | Semiconductor chip packaging module structure with low thermal resistance | |
| CN218730911U (en) | Double-sided heat dissipation packaging structure with internal insulation | |
| JP2017139290A (en) | Resin-sealed semiconductor device | |
| CN209357719U (en) | A kind of package structure of semiconductor device with low thermal resistance | |
| CN215377395U (en) | Packaging structure for semiconductor chip | |
| CN208077964U (en) | The encapsulating structure of the plastic sealed IPM modules of high power density | |
| JP2004311748A (en) | Resin sealed semiconductor device and its manufacturing device, and forming die | |
| CN216054669U (en) | Gallium nitride power device convenient to heat dissipation | |
| CN212848373U (en) | Wafer packaging heat dissipation mechanism | |
| JPH01270336A (en) | Manufacture of semicondcutor device | |
| CN209000902U (en) | A kind of encapsulating structure of frame clsss product enhancing heat dissipation | |
| CN208835051U (en) | A kind of low stress semiconductor core piece fixed structure, semiconductor devices | |
| CN106935520A (en) | A kind of interior insulation encapsulating structure and its manufacturing process | |
| CN220934052U (en) | Semiconductor packaging substrate | |
| CN214588813U (en) | Packaging structure of reverse-bending internal insulation product | |
| CN216288408U (en) | Novel packaging structure of high-voltage power semiconductor chip | |
| CN219778881U (en) | Substrate for high-power semiconductor packaging | |
| JP3528711B2 (en) | Lead frame, resin-sealed semiconductor device using the same, and method of manufacturing the same | |
| CN218827099U (en) | Lead frame structure and packaging structure | |
| CN221057401U (en) | Small-sized metal ceramic surface-mounted SOP (silicon on insulator) packaging four-transistor array | |
| CN212991089U (en) | T0-263 frame | |
| CN218039189U (en) | Lead frame structure for semiconductor packaging | |
| CN220895502U (en) | Package structure for fixing chip on lead | |
| JP2000049272A (en) | Lead frame, manufacture of semiconductor device employing it and semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |