CN220934052U - Semiconductor packaging substrate - Google Patents
Semiconductor packaging substrate Download PDFInfo
- Publication number
- CN220934052U CN220934052U CN202322112009.9U CN202322112009U CN220934052U CN 220934052 U CN220934052 U CN 220934052U CN 202322112009 U CN202322112009 U CN 202322112009U CN 220934052 U CN220934052 U CN 220934052U
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- plate
- heat
- substrate
- base plate
- sleeve
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- 239000000758 substrate Substances 0.000 title claims abstract description 64
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 238000001816 cooling Methods 0.000 claims abstract description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 7
- 230000001070 adhesive effect Effects 0.000 claims abstract description 7
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 238000009413 insulation Methods 0.000 claims description 5
- 229920000297 Rayon Polymers 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 3
- 229910001000 nickel titanium Inorganic materials 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 7
- 230000006870 function Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a semiconductor packaging substrate, which belongs to the technical field of semiconductor packaging substrates and comprises a substrate, wherein a packaging body is welded in an inner cavity of the substrate, a supporting seat is fixedly arranged on the periphery of the side wall of the substrate, an insulating plate is adhered to the lower end face of the substrate through adhesive, a heat conducting plate is fixedly arranged on the lower end face of the insulating plate, a sleeve is fixedly arranged on the periphery of the lower end face of the substrate, a sliding rod is slidably arranged in the inner cavity of the sleeve, a heat conducting clamping plate is fixedly arranged on the lower end face of the sliding rod, and an air cooling mechanism is arranged on the front side of the lower end face of the substrate. According to the utility model, through the cooperation of the sleeve, the heat conducting clamping plate and the like, the connectivity among the heat conducting plate, the insulating plate and the base plate is further improved, the heat conducting plate is ensured to radiate the base plate for a long time, and the heat radiating effect of the package body on the base plate during working is further improved through the cooperation of the air cooling mechanism.
Description
Technical Field
The utility model relates to the field of semiconductor packaging substrates, in particular to a semiconductor packaging substrate.
Background
Semiconductor packaging refers to the process of processing a wafer that passes testing to obtain individual chips according to product model and functional requirements. The packaging process is as follows: the wafer from the wafer front process is cut into small chips through the dicing process, the cut chips are then attached to the islands of the corresponding substrate (lead frame) frame with glue, the bonding pads of the chips are connected to the corresponding pins of the substrate by using ultrafine metal wires or conductive resin, and the required circuits are formed, then the individual chips are packaged and protected by a plastic housing, and a series of operations are performed after the plastic packaging.
The patent of publication No. CN211182189U, which comprises a substrate, the lower terminal surface of base plate is last to be adhered with the insulating layer, the lower terminal surface on insulating layer is last to be adhered with the heat conduction board, is provided with a plurality of evenly arranged's fin on the lower terminal surface of heat conduction board, and a pair of spliced pole is installed to the both ends each setting about the base plate, a pair of splint is installed to the upper end setting of spliced pole.
In the above application, mainly through installing the heating panel of smearing viscose connection in the lower part of base plate, and the encapsulation body on the base plate is in actual operation, and the high temperature that produces extremely easily leads to melting of viscose and then leads to the fact the drop of heating panel, leads to subsequent radiating effect variation, has certain drawback. Therefore, how to develop a semiconductor package substrate to improve these problems is a urgent problem for those skilled in the art.
Disclosure of utility model
In order to overcome the above disadvantages, the present utility model provides a semiconductor package substrate, which aims to improve the problems set forth in the above background art.
The utility model is realized in the following way:
The utility model provides a semiconductor packaging substrate, which comprises a substrate, wherein a packaging body is welded in an inner cavity of the substrate, a supporting seat is fixedly arranged on the periphery of the side wall of the substrate, an insulating plate is adhered to the lower end face of the substrate through adhesive, a heat conducting plate is fixedly arranged on the lower end face of the insulating plate, a sleeve is fixedly arranged on the periphery of the lower end face of the substrate, a sliding rod is slidably arranged in the inner cavity of the sleeve, a heat conducting clamping plate is fixedly arranged on the lower end face of the sliding rod, and an air cooling mechanism is arranged on the front side of the lower end face of the substrate.
Preferably, the adhesive is polyimide adhesive, and the area of the insulating plate is larger than that of the heat conducting plate.
By adopting the technical scheme, the insulating plate can be adhered to the lower part of the substrate for a long time.
Preferably, the lower end face of the heat conducting plate is fixedly provided with radiating fins, and the radiating fins are provided with a plurality of radiating fins.
Through adopting above-mentioned technical scheme, the heat conduction board that makes can be quick with its heat dissipation in the air.
Preferably, a memory spring is fixedly arranged on the bottom surface of the inner cavity of the sleeve, the other end of the memory spring is fixedly connected with the sliding rod, the memory spring is made of nickel-titanium alloy, and the heat conducting clamping plate is attached to the surface wall of the heat conducting plate.
By adopting the technical scheme, the connectivity between the insulating plate and the substrate is improved.
Preferably, the air cooling mechanism comprises a mounting frame fixedly mounted on the front part of the lower end face of the base plate and a mounting plate fixedly mounted in the inner cavity of the mounting frame, and a heat radiation fan is fixedly mounted on the mounting plate.
By adopting the technical scheme, the heat dissipation effect of the package body on the substrate during working is improved.
Preferably, the cooling fan is provided with three groups altogether, fixed mounting has the filter screen on the lateral wall of mounting bracket.
By adopting the technical scheme, dust is prevented from blowing and adhering to the radiating fins, and the radiating effect is ensured.
The beneficial effects of the utility model are as follows:
When the packaging body on the substrate works, the substrate is continuously heated, heat is transferred to the heat conducting plate through the insulating plate, and a plurality of radiating fins are arranged below the heat conducting plate, so that the radiating fins can realize the function of radiating the heat of the heat conducting plate to a certain extent; simultaneously, the heat conduction plate can also give the heat conduction splint with heat transfer, the telescopic inner chamber of heat transfer splint with heat transfer, the memory spring will heat up shrink fast this moment, make the slide bar drive the heat conduction splint and further press from both sides tightly the insulation board, effectively promoted the connectivity between insulation board, heat conduction plate and the base plate, guaranteed that whole base plate can have good radiating effect for a long time, the encapsulation body during operation on the base plate, radiator fan will obtain rotating in step, so that the blowing to the inner chamber air of base plate below, the velocity of flow of air has been accelerated, in order to realize further promoting the heat dispersion of whole base plate when using.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a front view overall structure of a semiconductor package substrate according to an embodiment of the present utility model;
fig. 2 is a schematic bottom view of a semiconductor package substrate according to an embodiment of the present utility model;
Fig. 3 is a schematic view illustrating an internal structure of a sleeve of a semiconductor package substrate according to an embodiment of the present utility model;
Fig. 4 is a schematic diagram showing a structure of an air cooling mechanism of a semiconductor package substrate according to an embodiment of the present utility model.
In the figure: 1. a substrate; 2. a package; 3. a support base; 4. an insulating plate; 5. a heat conductive plate; 51. a heat radiation fin; 6. a sleeve; 61. a memory spring; 7. a slide bar; 8. a heat conductive clamping plate; 9. an air cooling mechanism; 91. a mounting frame; 92. a mounting plate; 93. a heat radiation fan; 94. and (5) a filter screen.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, based on the embodiments of the utility model, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the utility model.
Examples
Referring to fig. 1-4, a semiconductor package substrate comprises a substrate 1, a package body 2 is welded in an inner cavity of the substrate 1, a supporting seat 3 is fixedly installed around the side wall of the substrate 1, an insulating plate 4 is adhered to the lower end face of the substrate 1 through adhesive, a heat conducting plate 5 is fixedly installed on the lower end face of the insulating plate 4, a sleeve 6 is fixedly installed around the lower end face of the substrate 1, a sliding rod 7 is slidably installed in the inner cavity of the sleeve 6, a heat conducting clamping plate 8 is fixedly installed on the lower end face of the sliding rod 7, and an air cooling mechanism 9 is arranged on the front side of the lower end face of the substrate 1.
Further; the viscose adopts polyimide glue, and the area of insulation board 4 is greater than the area of heat conduction board 5, and heat dissipation fin 51 is fixed mounting to the lower terminal surface of heat conduction board 5, and heat dissipation fin 51 is provided with a plurality of.
It should be noted that: when the package body 2 on the substrate 1 works, the substrate 1 is heated continuously, heat is transferred to the heat conducting plate 5 through the insulating plate 4, and short circuit caused by direct contact between the heat conducting plate 5 and the welding point on the substrate 1 can be avoided through the arrangement of the insulating plate 4.
Referring to fig. 3-4, further; the inner chamber bottom surface fixed mounting of sleeve 6 has memory spring 61, memory spring 61's the other end and slide bar 7 fixed connection, memory spring 61's material is nickel titanium alloy, heat conduction splint 8 laminating is on the surface wall of heat conduction board 5, air cooling mechanism 9 includes mounting bracket 91 of fixed mounting in the terminal surface front portion under base plate 1, and fixed mounting is at the mounting panel 92 of mounting bracket 91 inner chamber, fixed mounting has cooling fan 93 on the mounting panel 92, cooling fan 93 is provided with three altogether, fixed mounting has filter screen 94 on the lateral wall of mounting bracket 91.
It should be noted that: after the heat conducting plate 5 is heated and warmed, a plurality of radiating fins 51 are arranged below the heat conducting plate 5, and at the moment, the radiating fins 51 can realize the function of radiating the heat conducting plate 5 to a certain extent; meanwhile, the heat-conducting plate 5 can also transmit heat to the heat-conducting clamping plate 8, at the moment, the heat of the heat-conducting clamping plate 8 enters the inner cavity of the sleeve 6 through the sliding rod 7, so that the memory spring 61 in the sleeve 6 is rapidly heated and contracted, the sliding rod 7 moves towards the sleeve 6, namely, at the moment, the heat-conducting clamping plate 8 can better clamp the insulating plate 4 and the heat-conducting plate 5, the connectivity among the insulating plate 4, the heat-conducting plate 5 and the substrate 1 is effectively improved, and the long-term good heat dissipation effect of the whole substrate 1 is ensured; when the package body 2 on the substrate 1 works, the heat dissipation fan 93 will synchronously rotate, so that air in the inner cavity below the substrate 1 is blown, the flow speed of the air is accelerated, and the heat dissipation performance of the whole substrate 1 in use is further improved.
The working principle of the semiconductor packaging substrate is as follows:
When the package body 2 on the substrate 1 works, the substrate 1 is heated continuously, heat is transferred to the heat conducting plate 5 through the insulating plate 4, and short circuit caused by direct contact between the heat conducting plate 5 and the welding point on the substrate 1 can be avoided through the arrangement of the insulating plate 4;
after the heat conducting plate 5 is heated and warmed, a plurality of radiating fins 51 are arranged below the heat conducting plate 5, and at the moment, the radiating fins 51 can realize the function of radiating the heat conducting plate 5 to a certain extent;
Meanwhile, the heat-conducting plate 5 can also transmit heat to the heat-conducting clamping plate 8, at the moment, the heat of the heat-conducting clamping plate 8 enters the inner cavity of the sleeve 6 through the sliding rod 7, so that the memory spring 61 in the sleeve 6 is rapidly heated and contracted, the sliding rod 7 moves towards the sleeve 6, namely, at the moment, the heat-conducting clamping plate 8 can better clamp the insulating plate 4 and the heat-conducting plate 5, the connectivity among the insulating plate 4, the heat-conducting plate 5 and the substrate 1 is effectively improved, and the long-term good heat dissipation effect of the whole substrate 1 is ensured;
when the package body 2 on the substrate 1 works, the heat dissipation fan 93 will synchronously rotate, so that air in the inner cavity below the substrate 1 is blown, the flow speed of the air is accelerated, and the heat dissipation performance of the whole substrate 1 in use is further improved.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
It should be noted that, specific model specifications of the motor need to be determined by selecting a model according to actual specifications of the device, and a specific model selection calculation method adopts the prior art in the field, so detailed description is omitted.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, and various modifications and variations may be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (6)
1. The utility model provides a semiconductor package base plate, includes base plate (1), the inner chamber welding of base plate (1) has encapsulation body (2), fixed mounting has supporting seat (3) all around the lateral wall of base plate (1), a serial communication port, the lower terminal surface of base plate (1) has insulation board (4) through viscose bonding, the lower terminal surface fixed mounting of insulation board (4) has heat-conducting plate (5), the lower terminal surface of base plate (1) has sleeve (6) all around, the inner chamber slidable mounting of sleeve (6) has slide bar (7), the lower terminal surface fixed mounting of slide bar (7) has heat-conducting splint (8), the lower terminal surface front side of base plate (1) is provided with forced air cooling mechanism (9).
2. A semiconductor package substrate according to claim 1, wherein the adhesive is polyimide adhesive, and the insulating plate (4) has an area larger than that of the heat conductive plate (5).
3. A semiconductor package substrate according to claim 1, wherein the lower end surface of the heat conductive plate (5) is fixedly provided with heat radiating fins (51), and the heat radiating fins (51) are provided in plural.
4. The semiconductor packaging substrate according to claim 1, wherein a memory spring (61) is fixedly installed on the bottom surface of the inner cavity of the sleeve (6), the other end of the memory spring (61) is fixedly connected with the sliding rod (7), the memory spring (61) is made of nickel-titanium alloy, and the heat conducting clamping plate (8) is attached to the surface wall of the heat conducting plate (5).
5. A semiconductor package substrate according to claim 1, wherein the air cooling mechanism (9) comprises a mounting frame (91) fixedly mounted at the front part of the lower end surface of the substrate (1), and a mounting plate (92) fixedly mounted in the inner cavity of the mounting frame (91), and a heat dissipation fan (93) is fixedly mounted on the mounting plate (92).
6. The semiconductor package substrate according to claim 5, wherein three groups of heat dissipation fans (93) are provided, and a filter screen (94) is fixedly installed on a side wall of the mounting frame (91).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322112009.9U CN220934052U (en) | 2023-08-08 | 2023-08-08 | Semiconductor packaging substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322112009.9U CN220934052U (en) | 2023-08-08 | 2023-08-08 | Semiconductor packaging substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220934052U true CN220934052U (en) | 2024-05-10 |
Family
ID=90962682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322112009.9U Active CN220934052U (en) | 2023-08-08 | 2023-08-08 | Semiconductor packaging substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220934052U (en) |
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2023
- 2023-08-08 CN CN202322112009.9U patent/CN220934052U/en active Active
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