CN106206493A - A kind of radiator structure encapsulating chip - Google Patents
A kind of radiator structure encapsulating chip Download PDFInfo
- Publication number
- CN106206493A CN106206493A CN201610766433.7A CN201610766433A CN106206493A CN 106206493 A CN106206493 A CN 106206493A CN 201610766433 A CN201610766433 A CN 201610766433A CN 106206493 A CN106206493 A CN 106206493A
- Authority
- CN
- China
- Prior art keywords
- chip
- radome
- radiator structure
- metal clips
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
Abstract
The application relates to chip package field, specifically, relating to a kind of radiator structure encapsulating chip, including: pcb board；Chip, is arranged on described pcb board；Radome, is encapsulated on described pcb board and is covered by described chip；Radiating piece, is arranged between the upper surface of described chip and the lower surface of described radome, and has elastic range of activity.The application uses resilient metal member as radiating piece, alignment error between chip and radome can be overcome, chip heat is made to distribute rapidly, solve that electronic product caloric value is big, heat radiation is in long-time hot operation state with chip and causes the problems such as serviceability declines, the lost of life, poor reliability slowly, while can also promote the EMC performance of chip.
Description
Technical field
The application relates to a kind of chip package field, specifically, relating to one and encapsulation chip can being overcome to install time error,
And the radiator structure that chip heat distributed rapidly.
Background technology
Chip of the prior art (Chip) generally refers to the carrier of integrated circuit, is also that integrated circuit is through design, system
Make, encapsulate, test after result, it is common that the independent entirety that can use immediately.For reliability reasons, process big
The integrated circuit of power is required for reaching heat management requirement, and the most all chips all define upper safety limit for junction temperature, generally
It is 150 DEG C (being sometimes 175 DEG C).During operation, the service life of the lowest chip of temperature is the longest.
As it is shown in figure 1, time on chip package to pcb board, its outer surface is also stamped radome, under the radome after encapsulation
Bottom surface distance chip also has a segment distance, is usually the upper surface coated with thermally conductive clay at chip in prior art, is somebody's turn to do to fill
Segment distance the heat produced by chip conduct to radome, are dispelled the heat by external cooling parts the most again.
Owing to the distance between radome and chip exists some errors, when error is bigger, heat-conducting daub usually can not
Touching radome, this allows for temperature in radome under the restriction of the non-conductor air of heat, distributes slowly so that core
Sheet is under the condition of high temperature for a long time, the very big performance and used life that have impact on chip.
Summary of the invention
Present invention purpose is that proposing one can overcome encapsulation chip to install time error, and chip heat is fast
The radiator structure that speed distributes.
In order to complete the purpose of the application, the technical scheme of employing is:
The application relates to a kind of radiator structure encapsulating chip, including:
Pcb board；
Chip, is arranged on described pcb board；
Radome, is encapsulated on described pcb board and is covered by described chip；
Radiating piece, is arranged between the upper surface of described chip and the lower surface of described radome, and has elastic activity
Scope.
Preferably, described radiating piece is metal clips, and one end is fixing end, and the other end is for tilting end.
Preferably, the end that tilts of described metal clips arranges the contact jaw of oriented horizontal direction bending.
Preferably, the fixing end of described metal clips is arranged on the upper surface of described chip, described contact jaw actively with
The lower surface contact of described radome.
Preferably, described metal clips have multiple and described chip upper surface uniform intervals be distributed.
Preferably, the operating space for machine operation is left in the center at described chip.
Preferably. described metal clips is arranged at the lower surface of described radome, and the upper table of position and described chip
Position, face is corresponding.
Preferably, the height of described metal clips is at least 0.5MM.
Preferably, described radiating piece is heat-conducting silica gel sheet.
Preferably, described heat-conducting silica gel sheet is arranged at the lower surface of described radome, and the position of position and described chip
Put correspondence.
The technical scheme of the application at least has a following beneficial effect:
The application uses resilient metal member as radiating piece, it is possible to overcomes alignment error between chip and radome, makes core
Sheet heat distributes rapidly, solves that electronic product caloric value is big, heat radiation is slow and chip is in long-time hot operation state
And cause the problems such as serviceability decline, the lost of life, poor reliability, the EMC performance of chip can also be promoted simultaneously.
Accompanying drawing explanation
Fig. 1 is prior art chips encapsulating structure schematic diagram；
Fig. 2 is the chip-packaging structure schematic diagram of one embodiment of the application；
Fig. 3 is the metal clips structural representation of one embodiment of the application；
Fig. 4 is the chip top view of one embodiment of the application.
Detailed description of the invention
Below in conjunction with specific embodiment, the application is expanded on further.Should be understood that these embodiments are merely to illustrate the application
Rather than restriction scope of the present application.
As in figure 2 it is shown, the radiator structure 100 of the encapsulation chip of one embodiment of the application includes pcb board in general manner
10, the chip 20 being arranged on pcb board 10, the radome 30 being encapsulated on pcb board 10 and chip 20 being covered, and be arranged on
Between upper surface and the lower surface of radome 30 of chip 20 and there is the radiating piece 40 of elastic range of activity.
By possessing the radiating piece 40 of elasticity, the height error between chip 20 and radome 30 can be overcome completely, make
Heat is sent to radome 30 by radiating piece 40 as soon as possible, is then distributed by external cooling parts, thus by chip 20
It is maintained within the scope of a relatively low temperature, improves the service life of chip 20.
In present embodiment, the encapsulation process of chip 20 can use prior art completely, and radiating piece 40 can be by
Possess elasticity and the good material of thermal conduction effect is made, such as metal, heat conductive silica gel etc..Radiating piece 40 can be multiple independent dissipating
Heat is individual to be constituted, it is also possible to be the overall structure covering whole chip 20 upper surface.
As it is shown on figure 3, in an embodiment of the application, this radiating piece 40 can be metal clips 41, this metal
One end of shell fragment 41 is fixing end 411, and the other end is for tilting end 412.During installation, can be by the fixing end of metal clips 41
411, welding bonding with corresponding fixed structure or fixing point, tilt end 412 and the most freely stretch, and after radome 30 encapsulates
The contact that can be extruded.Concrete metal can be that copper, a silver-colored class are prone to conduction and possess the metal of toughness.Additionally, due to
Radome 30 is metal structure, and ground connection, chip 20 can be more fully after being contacted with radome 30 by metal clips 41
Ground connection, is greatly improved the EMC performance of chip 20
Further, for improving radiating effect, the tilting end 412 of this metal clips 41 can arrange and bend to horizontal direction
Contact jaw 413.Can be improved and radome 30 or the contact area of chip 20 by contact jaw 413, thus preferably conduct
Heat.
In an embodiment of the application, the fixing end 411 of this metal clips 41 may be mounted at the upper of chip 20
Surface, the contact jaw 413 of metal clips 41 then to radome 30 direction extend, and radome 30 encapsulate after with radome 30
Lower surface movable contact.Metal clips 41 can be directly anchored to the upper surface of chip 20 when chip 20 makes.
Further, for making heat conduction uniformly, this radiating piece 40 can be made up of, respectively multiple independent metal clips 41
Metal clips 41 is distributed at the upper surface uniform intervals of chip 20.In other embodiments, this metal clips 41 can also be adopted
With the length list structure identical with chip 20 length, and it is spaced at the upper surface of chip 20.
As shown in Figure 4, in another embodiment of the application, owing to the production process of chip 20 is all automatic metaplasia
Produce, therefore after chip 20 is mounted with heat radiation shell fragment 41, the operation for machine operation can be reserved in the center of chip 20
District 21.The size in concrete operations district 21 can according to actual production time, the area size that SMT suction nozzle district takies determines.
In another embodiment of the application, this metal clips 41 can also be arranged on the lower surface of radome 30
Place, and position is corresponding with the upper surface location of chip 20.Which can need not reserve the position of operating space 21, thus more preferably
Heat radiation.The mounting means of metal clips 41 can be identical with the mode being arranged on chip 20.
Further, in the above-described embodiments, due to the distance between radome 30 and the chip 20 after encapsulation generally
0.3MM, for ensureing that metal clips 41 can contact with radome 30 or chip 20 fully, the height of this metal clips 41 is at least
More than or equal to 0.5MM.
In another embodiment of the application, this radiating piece 40 can also is that heat-conducting silica gel sheet (not shown).
Heat-conducting silica gel sheet is likewise supplied with certain elasticity, and heat dispersion is good.In installation, heat-conducting silica gel sheet can use whole
The mode that block directly attaches is installed, and decreases corresponding fixed structure.
Further, this heat-conducting silica gel sheet is preferably mounted at the lower surface of radome 30, and position and chip 20
Position is corresponding.
Although the application is open as above with preferred embodiment, but is not for limiting claim, any this area skill
Art personnel, on the premise of conceiving without departing from the application, can make some possible variations and amendment, therefore the application
Protection domain should be defined in the range of standard with the application claim.
Claims (10)
1. the radiator structure encapsulating chip, it is characterised in that including:
Pcb board；
Chip, is arranged on described pcb board；
Radome, is encapsulated on described pcb board and is covered by described chip；
Radiating piece, is arranged between the upper surface of described chip and the lower surface of described radome, and has elastic range of activity.
Radiator structure the most according to claim 1, it is characterised in that
Described radiating piece is metal clips, and one end is fixing end, and the other end is for tilting end.
Radiator structure the most according to claim 2, it is characterised in that
The end that tilts of described metal clips arranges the contact jaw of oriented horizontal direction bending.
Radiator structure the most according to claim 3, it is characterised in that
The fixing end of described metal clips is arranged on the upper surface of described chip, described contact jaw actively with described radome
Lower surface contacts.
Radiator structure the most according to claim 2, it is characterised in that
Described metal clips have multiple and described chip upper surface uniform intervals be distributed.
Radiator structure the most according to claim 5, it is characterised in that
The operating space for machine operation is left in the center of described chip.
Radiator structure the most according to claim 2, it is characterised in that
Described metal clips is arranged at the lower surface of described radome, and position is corresponding with the upper surface location of described chip.
8. according to the arbitrary described radiator structure of claim 2-7, it is characterised in that
The height of described metal clips is at least 0.5MM.
Radiator structure the most according to claim 1, it is characterised in that
Described radiating piece is heat-conducting silica gel sheet.
Radiator structure the most according to claim 9, it is characterised in that
Described heat-conducting silica gel sheet is arranged at the lower surface of described radome, and position is corresponding with the position of described chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610766433.7A CN106206493B (en) | 2016-08-30 | 2016-08-30 | A kind of radiator structure encapsulating chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610766433.7A CN106206493B (en) | 2016-08-30 | 2016-08-30 | A kind of radiator structure encapsulating chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106206493A true CN106206493A (en) | 2016-12-07 |
| CN106206493B CN106206493B (en) | 2019-03-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610766433.7A Active CN106206493B (en) | 2016-08-30 | 2016-08-30 | A kind of radiator structure encapsulating chip |
Country Status (1)
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| CN (1) | CN106206493B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107333448A (en) * | 2017-07-31 | 2017-11-07 | 广东欧珀移动通信有限公司 | CCD camera assembly and electronic equipment |
| CN107749408A (en) * | 2017-09-30 | 2018-03-02 | 长电科技（宿迁）有限公司 | A kind of elastic conducting warmware exposes encapsulating structure |
| CN112272496A (en) * | 2020-10-26 | 2021-01-26 | 南昌航空大学 | High-efficiency heat dissipation device for mobile communication equipment |
| CN112420634A (en) * | 2020-10-26 | 2021-02-26 | 南昌航空大学 | High-efficiency chip heat dissipation structure |
| CN112447631A (en) * | 2020-11-09 | 2021-03-05 | 南昌航空大学 | Heat radiation structure of packaged chip |
| CN112447630A (en) * | 2020-11-09 | 2021-03-05 | 南昌航空大学 | Heat dissipation body and chip package having the same |
| WO2022141905A1 (en) * | 2020-12-29 | 2022-07-07 | 苏州元格利科技有限公司 | Chip based on rfid authentication technology |
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| JPS63226952A (en) * | 1987-03-16 | 1988-09-21 | Hitachi Ltd | Semiconductor device |
| JPS63287038A (en) * | 1987-05-20 | 1988-11-24 | Hitachi Ltd | Package structure |
| US6064573A (en) * | 1998-07-31 | 2000-05-16 | Litton Systems, Inc. | Method and apparatus for efficient conduction cooling of surface-mounted integrated circuits |
| DE19925983A1 (en) * | 1999-06-08 | 2000-12-14 | Bosch Gmbh Robert | Heat sink for dissipating heat losses from electronic component has contact surface with component equal in area to that of component surface |
| US6260611B1 (en) * | 1999-12-13 | 2001-07-17 | Orient Semiconductor Electronics Ltd. | Heat dissipation module |
| US6462952B1 (en) * | 2000-06-02 | 2002-10-08 | Kabushiki Kaisha Toshiba | Structure and method for constructing circuit module suitable for hand-held electronic equipment |
| CN101848622A (en) * | 2009-03-24 | 2010-09-29 | 富准精密工业(深圳)有限公司 | Radiator and electronic device |
| CN202026562U (en) * | 2011-03-11 | 2011-11-02 | 深圳瑞谷电子有限公司 | Shielding hood with radiation function |
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2016
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|---|---|---|---|---|
| JPS63226952A (en) * | 1987-03-16 | 1988-09-21 | Hitachi Ltd | Semiconductor device |
| JPS63287038A (en) * | 1987-05-20 | 1988-11-24 | Hitachi Ltd | Package structure |
| US6064573A (en) * | 1998-07-31 | 2000-05-16 | Litton Systems, Inc. | Method and apparatus for efficient conduction cooling of surface-mounted integrated circuits |
| DE19925983A1 (en) * | 1999-06-08 | 2000-12-14 | Bosch Gmbh Robert | Heat sink for dissipating heat losses from electronic component has contact surface with component equal in area to that of component surface |
| US6260611B1 (en) * | 1999-12-13 | 2001-07-17 | Orient Semiconductor Electronics Ltd. | Heat dissipation module |
| US6462952B1 (en) * | 2000-06-02 | 2002-10-08 | Kabushiki Kaisha Toshiba | Structure and method for constructing circuit module suitable for hand-held electronic equipment |
| CN101848622A (en) * | 2009-03-24 | 2010-09-29 | 富准精密工业(深圳)有限公司 | Radiator and electronic device |
| CN202026562U (en) * | 2011-03-11 | 2011-11-02 | 深圳瑞谷电子有限公司 | Shielding hood with radiation function |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107333448A (en) * | 2017-07-31 | 2017-11-07 | 广东欧珀移动通信有限公司 | CCD camera assembly and electronic equipment |
| CN107749408A (en) * | 2017-09-30 | 2018-03-02 | 长电科技（宿迁）有限公司 | A kind of elastic conducting warmware exposes encapsulating structure |
| CN112272496A (en) * | 2020-10-26 | 2021-01-26 | 南昌航空大学 | High-efficiency heat dissipation device for mobile communication equipment |
| CN112420634A (en) * | 2020-10-26 | 2021-02-26 | 南昌航空大学 | High-efficiency chip heat dissipation structure |
| CN112447631A (en) * | 2020-11-09 | 2021-03-05 | 南昌航空大学 | Heat radiation structure of packaged chip |
| CN112447630A (en) * | 2020-11-09 | 2021-03-05 | 南昌航空大学 | Heat dissipation body and chip package having the same |
| WO2022141905A1 (en) * | 2020-12-29 | 2022-07-07 | 苏州元格利科技有限公司 | Chip based on rfid authentication technology |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106206493B (en) | 2019-03-22 |
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Effective date of registration: 20190510 Address after: 644005 Suger Intelligent Industrial Base, 31 Gangyuan Road, Lingang District, Yibin City, Sichuan Province Co-patentee after: Yibin Chen'an Intelligent Manufacturing Co., Ltd. Patentee after: Sichuan sac Communication Technology Co., Ltd. Address before: 518053 H3 501B, east industrial area of overseas Chinese town, Nanshan District, Shenzhen, Guangdong Patentee before: Shenzhen Tinno Wireless Technology Co., Ltd. |