CN106206493B - A kind of radiator structure encapsulating chip - Google Patents
A kind of radiator structure encapsulating chip Download PDFInfo
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- CN106206493B CN106206493B CN201610766433.7A CN201610766433A CN106206493B CN 106206493 B CN106206493 B CN 106206493B CN 201610766433 A CN201610766433 A CN 201610766433A CN 106206493 B CN106206493 B CN 106206493B
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- chip
- shielding case
- radiator structure
- metal clips
- pcb board
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Abstract
This application involves chip package fields, specifically, are related to a kind of radiator structure for encapsulating chip, comprising: pcb board；Chip is mounted on the pcb board；Shielding case is encapsulated on the pcb board and covers the chip；Radiating piece is arranged between the upper surface of the chip and the lower surface of the shielding case, and has elastic scope of activities.The application is using resilient metal member as radiating piece, installation error between chip and shielding case can be overcome, distribute chip heat rapidly, it solves that electronic product calorific value is big, heat dissipation is slow is in long-time hot operation state and leads to service performance decline, the lost of life, poor reliability with chip, while the EMC performance of chip can also be promoted.
Description
Technical field
This application involves a kind of chip package fields, and specifically, error when encapsulating chip installation can be overcome by being related to one kind,
And the radiator structure for distributing chip heat rapidly.
Background technique
The carrier and integrated circuit that chip (Chip) in the prior art generally refers to integrated circuit are by design, system
It is after making, encapsulate, testing as a result, the usually one independent entirety that can be used immediately.For reliability reasons, processing is big
The integrated circuit of power requires to reach heat management requirement, therefore all chips are all directed to junction temperature and define upper safety limit, usually
For 150 DEG C (being sometimes 175 DEG C).The service life of the lower chip of temperature is longer when operation.
As shown in Figure 1, shielding case is also stamped in outer surface when on chip package to pcb board, under the shielding case after encapsulation
Apart from chip, there are also a distances for bottom surface, are in the prior art usually the upper surface coated with thermally conductive clay in chip, should with filling
Section distance simultaneously conducts the heat that chip generates to shielding case, is then radiated again by external cooling component.
Since there are some errors for the distance between shielding case and chip, when error is larger, heat-conducting daub usually cannot
Shielding case is touched, this allows for the temperature in shielding case under the limitation of the non-conductor air of heat, distributes slowly, so that core
Piece is under the condition of high temperature for a long time, the very big performance and used life for affecting chip.
Summary of the invention
Present invention purpose is that proposing that one kind can overcome encapsulates error when chip is installed, and chip heat is fast
The radiator structure that speed distributes.
In order to complete the purpose of the application, the technical solution of use are as follows:
This application involves a kind of radiator structures for encapsulating chip, comprising:
Pcb board；
Chip is mounted on the pcb board；
Shielding case is encapsulated on the pcb board and covers the chip；
Radiating piece is arranged between the upper surface of the chip and the lower surface of the shielding case, and has elasticity activity
Range.
Preferably, the radiating piece is metal clips, and one end is fixing end, and the other end is to tilt end.
Preferably, the tilting end of the metal clips is provided with the contact jaw bent to horizontal direction.
Preferably, the fixing end of the metal clips is mounted on the upper surface of the chip, the contact jaw actively with
The following table face contact of the shielding case.
Preferably, the metal clips has multiple and is evenly spaced in the upper surface of the chip.
Preferably, in the center of the chip, there are the operating spaces operated for machine.
Preferably, metal clips described in is mounted at the lower surface of the shielding case, and the upper table of position and the chip
Face position is corresponding.
Preferably, the height of the metal clips is at least 0.5MM.
Preferably, the radiating piece is heat-conducting silica gel sheet.
Preferably, the heat-conducting silica gel sheet is mounted at the lower surface of the shielding case, and the position of position and the chip
Set correspondence.
The technical solution of the application at least has following beneficial effect:
The application, as radiating piece, can be overcome installation error between chip and shielding case, make core using resilient metal member
Piece heat distributes rapidly, solves that electronic product calorific value is big, heat dissipation is slow and chip is in long-time hot operation state
And lead to service performance decline, the lost of life, poor reliability, while the EMC performance of chip can also be promoted.
Detailed description of the invention
Fig. 1 is chip-packaging structure schematic diagram in the prior art；
Fig. 2 is the chip-packaging structure schematic diagram of one embodiment of the application；
Fig. 3 is the metal clips structural schematic diagram of one embodiment of the application；
Fig. 4 is the chip top view of one embodiment of the application.
Specific embodiment
Combined with specific embodiments below, the application is further described.It should be understood that these embodiments are merely to illustrate the application
Rather than limitation scope of the present application.
As shown in Fig. 2, the radiator structure 100 of the encapsulation chip of one embodiment of the application generally includes pcb board
10, the chip 20 being mounted on pcb board 10, the shielding case 30 for being encapsulated on pcb board 10 and covering chip 20, and be arranged and exist
Between the upper surface of chip 20 and the lower surface of shielding case 30 and there is the radiating piece 40 of elastic scope of activities.
By having the radiating piece 40 of elasticity, the height error between chip 20 and shielding case 30 can be overcome completely, is made
Heat passes through radiating piece 40 as soon as possible and is sent to shielding case 30, is then distributed by external cooling component, thus by chip 20
It is maintained within the scope of a lower temperature, improves the service life of chip 20.
In present embodiment, the encapsulation process of chip 20 can use the prior art completely, and radiating piece 40 can be by
Have elastic and good thermal conduction effect material to be made, such as metal, heat conductive silica gel.Radiating piece 40 can be multiple independent scattered
Hot individual is constituted, and is also possible to cover the overall structure of entire 20 upper surface of chip.
As shown in figure 3, the radiating piece 40 can be metal clips 41, the metal in the embodiment of the application
One end of elastic slice 41 is fixing end 411, and the other end is to tilt end 412.When installation, the fixing end of metal clips 41 can be passed through
411 with corresponding fixed structure or fixed spot gluing, welding, and tilt the then free extension of end 412, and after the encapsulation of shielding case 30
The contact that can be extruded.Specific metal can be copper, silver-colored one kind is easy to conduct and have the metal of toughness.Further, since
Shielding case 30 is metal structure, and is grounded, and chip 20 can be more fully after being contacted by metal clips 41 with shielding case 30
Ground connection, greatly improves the EMC performance of chip 20
Further, to improve heat dissipation effect, the tilting end 412 of the metal clips 41 can be set to be bent to horizontal direction
Contact jaw 413.The contact area with shielding case 30 or chip 20 can be improved by contact jaw 413, to preferably conduct
Heat.
In the embodiment of the application, the fixing end 411 of the metal clips 41 may be mounted at the upper of chip 20
Surface, and the contact jaw 413 of metal clips 41 then to 30 direction of shielding case extend, and shielding case 30 encapsulation after with shielding case 30
Lower surface movable contact.Metal clips 41 can be directly anchored to the upper surface of chip 20 when chip 20 makes.
Further, to make heat conduction uniformly, which can be made of multiple independent metal clips 41, respectively
Metal clips 41 is evenly spaced in the upper surface of chip 20.In other embodiments, which can also adopt
With length strip structure identical with 20 length of chip, and it is alternatively arranged in the upper surface of chip 20.
As shown in figure 4, in the another embodiment of the application, since the production process of chip 20 is automated life
It produces, therefore after chip 20 is mounted with heat dissipation elastic slice 41, the operation for machine operation can be reserved in the center of chip 20
Area 21.When the size in concrete operations area 21 can be according to actual production, the area size that SMT suction nozzle area occupies is determined.
In the another embodiment of the application, which can also be mounted on the lower surface of shielding case 30
Place, and position is corresponding with the upper surface location of chip 20.Which can not need to reserve the position of operating space 21, thus more preferably
Heat dissipation.The mounting means of metal clips 41 can be identical as the mode being mounted on chip 20.
Further, in the above-described embodiments, due to after encapsulation shielding case 30 and the distance between chip 20 be generally
0.3MM, to guarantee that metal clips 41 can be contacted fully with shielding case 30 or chip 20, the height of the metal clips 41 is at least
More than or equal to 0.5MM.
In the another embodiment of the application, which can also be heat-conducting silica gel sheet (not shown).
Heat-conducting silica gel sheet is likewise supplied with certain elasticity, and heat dissipation performance is good.In installation, heat-conducting silica gel sheet can use whole
The mode that block directly attaches is installed, and corresponding fixed structure is reduced.
Further, which is preferably mounted at the lower surface of shielding case 30, and position and chip 20
Position is corresponding.
It is not for limiting claim, any this field skill although the application is disclosed as above with preferred embodiment
Art personnel without departing from the concept of this application, can make several possible variations and modification, therefore the application
Protection scope should be subject to the range that the claim of this application is defined.
Claims (7)
1. a kind of radiator structure for encapsulating chip characterized by comprising
Pcb board；
Chip is mounted on the pcb board；
Shielding case is encapsulated on the pcb board and covers the chip；
Radiating piece is arranged between the upper surface of the chip and the lower surface of the shielding case, and has elastic scope of activities；
The radiating piece is metal clips, and one end is fixing end, and the other end is to tilt end；
Tilting end free extension, and the contact being extruded after shielding case encapsulation.
2. radiator structure according to claim 1, which is characterized in that
The tilting end of the metal clips is provided with the contact jaw bent to horizontal direction.
3. radiator structure according to claim 2, which is characterized in that
The fixing end of the metal clips is mounted on the upper surface of the chip, the contact jaw actively with the shielding case
Following table face contact.
4. radiator structure according to claim 1, which is characterized in that
The metal clips has multiple and is evenly spaced in the upper surface of the chip.
5. radiator structure according to claim 4, which is characterized in that
In the center of the chip, there are the operating spaces operated for machine.
6. radiator structure according to claim 1, which is characterized in that
The metal clips is mounted at the lower surface of the shielding case, and position is corresponding with the upper surface location of the chip.
7. according to any radiator structure of claim 2-6, which is characterized in that
The height of the metal clips is at least 0.5MM.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610766433.7A CN106206493B (en) | 2016-08-30 | 2016-08-30 | A kind of radiator structure encapsulating chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610766433.7A CN106206493B (en) | 2016-08-30 | 2016-08-30 | A kind of radiator structure encapsulating chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106206493A CN106206493A (en) | 2016-12-07 |
| CN106206493B true CN106206493B (en) | 2019-03-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610766433.7A Active CN106206493B (en) | 2016-08-30 | 2016-08-30 | A kind of radiator structure encapsulating chip |
Country Status (1)
| Country | Link |
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| CN (1) | CN106206493B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107333448A (en) * | 2017-07-31 | 2017-11-07 | 广东欧珀移动通信有限公司 | CCD camera assembly and electronic equipment |
| CN107749408B (en) * | 2017-09-30 | 2020-04-21 | 长电科技（宿迁）有限公司 | Elastic heat conducting piece exposed packaging structure |
| CN112272496A (en) * | 2020-10-26 | 2021-01-26 | 南昌航空大学 | High-efficiency heat dissipation device for mobile communication equipment |
| CN112420634A (en) * | 2020-10-26 | 2021-02-26 | 南昌航空大学 | High-efficiency chip heat dissipation structure |
| CN112447630A (en) * | 2020-11-09 | 2021-03-05 | 南昌航空大学 | Heat dissipation body and chip package having the same |
| CN112447631A (en) * | 2020-11-09 | 2021-03-05 | 南昌航空大学 | Heat radiation structure of packaged chip |
| CN112533362A (en) * | 2020-12-29 | 2021-03-19 | 苏州元格利科技有限公司 | Chip based on RFID authentication technology |
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|---|---|---|---|---|
| US6064573A (en) * | 1998-07-31 | 2000-05-16 | Litton Systems, Inc. | Method and apparatus for efficient conduction cooling of surface-mounted integrated circuits |
| DE19925983A1 (en) * | 1999-06-08 | 2000-12-14 | Bosch Gmbh Robert | Heat sink for dissipating heat losses from electronic component has contact surface with component equal in area to that of component surface |
| US6260611B1 (en) * | 1999-12-13 | 2001-07-17 | Orient Semiconductor Electronics Ltd. | Heat dissipation module |
| US6462952B1 (en) * | 2000-06-02 | 2002-10-08 | Kabushiki Kaisha Toshiba | Structure and method for constructing circuit module suitable for hand-held electronic equipment |
| CN101848622A (en) * | 2009-03-24 | 2010-09-29 | 富准精密工业(深圳)有限公司 | Radiator and electronic device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63226952A (en) * | 1987-03-16 | 1988-09-21 | Hitachi Ltd | Semiconductor device |
| JPS63287038A (en) * | 1987-05-20 | 1988-11-24 | Hitachi Ltd | Package structure |
| CN202026562U (en) * | 2011-03-11 | 2011-11-02 | 深圳瑞谷电子有限公司 | Shielding hood with radiation function |
-
2016
- 2016-08-30 CN CN201610766433.7A patent/CN106206493B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6064573A (en) * | 1998-07-31 | 2000-05-16 | Litton Systems, Inc. | Method and apparatus for efficient conduction cooling of surface-mounted integrated circuits |
| DE19925983A1 (en) * | 1999-06-08 | 2000-12-14 | Bosch Gmbh Robert | Heat sink for dissipating heat losses from electronic component has contact surface with component equal in area to that of component surface |
| US6260611B1 (en) * | 1999-12-13 | 2001-07-17 | Orient Semiconductor Electronics Ltd. | Heat dissipation module |
| US6462952B1 (en) * | 2000-06-02 | 2002-10-08 | Kabushiki Kaisha Toshiba | Structure and method for constructing circuit module suitable for hand-held electronic equipment |
| CN101848622A (en) * | 2009-03-24 | 2010-09-29 | 富准精密工业(深圳)有限公司 | Radiator and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106206493A (en) | 2016-12-07 |
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Effective date of registration: 20190510 Address after: 644005 Suger Intelligent Industrial Base, 31 Gangyuan Road, Lingang District, Yibin City, Sichuan Province Co-patentee after: Yibin Chen'an Intelligent Manufacturing Co., Ltd. Patentee after: Sichuan sac Communication Technology Co., Ltd. Address before: 518053 H3 501B, east industrial area of overseas Chinese town, Nanshan District, Shenzhen, Guangdong Patentee before: Shenzhen Tinno Wireless Technology Co., Ltd. |
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