CN104202944B - Single-plate cooling device and communication equipment - Google Patents
Single-plate cooling device and communication equipment Download PDFInfo
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- CN104202944B CN104202944B CN201410390727.5A CN201410390727A CN104202944B CN 104202944 B CN104202944 B CN 104202944B CN 201410390727 A CN201410390727 A CN 201410390727A CN 104202944 B CN104202944 B CN 104202944B
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- veneer
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- radiating shell
- cooling device
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a single-plate cooling device and communication equipment. The single-plate cooling device comprises a cooling shell, a cover body, a first single plate and a second single plate, the first single plate and second single plate are arranged in a hollow space formed by the cooling shell and the cover body in a buckling mode, the first single plate is located between the cooling shell and the second single plate, the first single plate is in contact with the cooling shell, and the single-plate cooling device further comprises a metal heat conducting plate and a first heat pipe; the metal heat conducting plate is clamped between the first single plate and the second single plate; the first heat pipe fits with the surface of the metal heat conducting plate, one end of the first heat pipe is in contact with an ASIC chip in the apparatus of the second single plate, the other end of the first heat pipe is in contact with the cooling shell, and the first heat pipe is used for transmitting the heat of the ASIC chip and the metal heat conducting plate to the cooling shell so as to dissipate the heat of the ASIC chip and the metal heat conducting plate through the cooling shell. The single-plate cooling device is capable of improving the cooling efficiency in a certain degree.
Description
Technical field
The present invention relates to veneer technical field of heat dissipation, more particularly to a kind of single plate cooling device and communication equipment.
Background technology
As scientific and technological progress and technology develop, each fuel plate would generally be packaged in one by existing each electronic product
In individual housing, in order to integrated, modularity, so as to be beneficial to use.This class formation would generally arrange radiator structure with its guarantee
Normal work.
Referring to accompanying drawing 1, for a kind of single plate cooling device 10 that prior art is provided, which includes mutually fastening and constituting cavity
Radiating shell 11 and lid 12, the first veneer 13 being arranged in the cavity and the second veneer 14.First veneer 13 is covered
The radiating shell 11 is simultaneously arranged between the radiating shell 11 and the second veneer 14.Due to the first veneer 13 and the second veneer
Install on 14 just like heater elements such as chips, cause the first veneer 13 and the second veneer 14 distribute heat in use.
And in the assembled state, as integrated mounting structure is limited, radiating shell 11 is only capable of and 13 directly contact of the first veneer, because
This can cause the radiating efficiency of the heater elements such as the chip on the second veneer 14 low, and then cause the radiating of single plate cooling device 10
Effect is poor.
The content of the invention
The present invention provides a kind of single plate cooling device and communication equipment, for improving radiating efficiency to a certain extent.
A kind of first aspect, there is provided single plate cooling device, including radiating shell, lid and the first veneer, the second veneer, institute
State the first veneer, the second veneer, be arranged at the radiating shell and after lid is fastened in the cavity that formed, the first veneer position
Between the radiating shell and second veneer, first veneer is contacted with the radiating shell,
The single plate cooling device also includes metal heat-conducting plate and the first heat pipe；
The metal heat-conducting plate is folded between first veneer and second veneer, and the metal heat-conducting plate is used for
Absorb the heat that the device on second veneer is produced；
First heat pipe is fitted on the surface of the metal heat-conducting plate, one end of first heat pipe and described second
Asic chip in the device of veneer contacts, the other end of first heat pipe sequentially pass through the metal heat-conducting plate and
First veneer is contacted with the radiating shell, and first heat pipe is for by the asic chip and the metal heat-conducting
The heat transfer of plate gives the radiating shell, with by the radiating shell by the asic chip and the metal heat-conducting plate
Heat is conducted.
With reference in a first aspect, in the first possible implementation, also including the second heat pipe：
Second heat pipe is fitted on the surface of the metal heat-conducting plate, one end and the radiating of second heat pipe
Housing contacts, second heat pipe for giving the radiating shell by the heat transfer of the metal heat-conducting plate, with by institute
State radiating shell to conduct the heat of the metal heat-conducting plate.
With reference to the first possible implementation of first aspect or first aspect, in second possible implementation,
First heat pipe is fitted in the metal heat-conducting plate towards on the surface of second veneer.
With reference to the first or second possible implementation of first aspect or first aspect, the 3rd of first aspect the
Possible implementation is planted, on the inside of the radiating shell, opens up fluted,
The other end of first heat pipe sequentially passes through the metal heat-conducting plate and first veneer and inserts described recessed
In groove, so that the other end of first heat pipe is contacted with the radiating shell.
With reference to first aspect or first aspect the first to the third any possible implementation, in first aspect
In 4th kind of possible implementation, the side of the metal heat-conducting plate is contacted with the inwall of the radiating shell.
With reference to first aspect or first aspect the first to the third any possible implementation, in first aspect
In 5th kind of possible implementation, first veneer has intercepted the contact of the metal heat-conducting plate and the radiating shell.
With reference to first aspect or first aspect the first to the 5th kind of possible implementation, the 6th of first aspect the
Plant in possible implementation, the radiating efficiency of the radiating shell is higher than the radiating efficiency of the lid.
A kind of second aspect, there is provided communication equipment, including such as first aspect or first aspect, the first is arbitrary to the 6th kind
Single plate cooling device and antenna described in, the chip on veneer in the single plate cooling device is for by the numeral for receiving
Signal is converted into analogue signal, and the analogue signal is sent to the antenna, to be believed the simulation by the antenna
Number it is transmitted to other communication equipments.
It is golden by the sandwiched between the first veneer and the second veneer according to the single plate cooling device that various implementations are provided
Category heat-conducting plate, realizes the heat transfer for producing the heater members on the second veneer in metal heat-conducting plate, further, this
The single plate cooling device of bright offer also includes the first heat pipe, and the first heat pipe is fitted in metal heat-conducting plate, and the one of the first heat pipe
End is contacted through the first veneer and radiating shell, then the heat of metal heat-conducting plate can pass to radiation shell by first heat pipe
Body, then conducted by radiating shell.So the technical scheme provided using the present invention, can improve right to a certain extent
The radiating efficiency of the second veneer, so as to improve the radiating efficiency to single plate cooling device.Further, first heat pipe is another
End is contacted with the asic chip on the second veneer, then, for the asic chip, its heat for producing can be warm by first
Pipe is directly delivered to radiating shell, so, this programme further effect can be that rapidly asic chip is radiated, drop
The surface temperature of low asic chip.
Description of the drawings
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
Accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is a kind of decomposing schematic representation of single plate cooling device of the prior art；
Fig. 2 is a kind of decomposing schematic representation of single plate cooling device that better embodiment of the present invention is provided；
Fig. 3 is the close-up schematic view in Fig. 2 shown in A；
Fig. 4 is the close-up schematic view in Fig. 2 shown in B.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than the embodiment of whole.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Firstly, it is necessary to explanation, special IC (application specific integrated
Circuit, ASIC) chip refer to answer specific user to require and particular electronic system needs and the integrated circuit that designs, manufacture
Chip.The characteristics of asic chip is the demand towards specific user, asic chip in batch production with universal integrated circuit phase
Than having the advantages that volume is less, power consumption is lower, reliability is improved, performance is improved, confidentiality strengthens, cost is reduced.But,
For other chips being arranged on same veneer, the heat that asic chip is produced will be more than other chips to asic chip
The heat of generation, so as to the surface temperature for causing asic chip is higher than the surface temperature of other chips.
Fig. 2 to Fig. 4 is referred to, better embodiment of the present invention provides a kind of single plate cooling device 20, including the first veneer
21st, the metal heat-conducting that at least one second veneers 22, radiating shell 23, lid 24, correspondence at least one second veneer 22 are arranged
Plate 25 and the first heat pipe 26.First veneer 21, the second veneer 22, metal heat-conducting plate 25 and the first heat pipe 26 are arranged at described
Between radiating shell 23 and the lid 24.In the present embodiment, the radiating shell 23 is mutually fastened simultaneously with the lid 24
Cavity is formed, first veneer 21, the second veneer 22, metal heat-conducting plate 25 and the first heat pipe 26 are arranged in the cavity,
First veneer 21 is contacted with each other with the radiating shell 23.
First veneer 21 is arranged near the radiating shell 23, and second veneer 22 is arranged at first veneer
Between 21 and the lid 24.The metal heat-conducting plate 25 is arranged near second veneer 22 and is folded in first veneer
21 and second heat produced with the device absorbed on second veneer 22 between veneer 22, described first heat pipe, 26 one end with
Asic chip on second veneer 22 contacts, and the other end of first heat pipe 26 is connected to the radiating shell 23.
In the present embodiment, the single plate cooling device 20 is provided with first veneer 21 and second veneer 22.Institute
The setting quantity for stating the second veneer 22 of single plate cooling device 20 can be one, alternatively multiple.The single plate cooling device 20
When multiple second veneers 22 are set, multiple second veneers 22 can be arranged at being generally parallel to each other the first veneer 21 and lid 24 it
Between.The function of first veneer 21 and second veneer 22, structure, size, it is arranged at first veneer 21 and second
The device component of veneer 22 can be identical, also dependent on needing with difference.
In the present embodiment, first veneer 21 and the second veneer 22 are packaged in the cavity.First veneer
21 and second veneer 22 can be all kinds of printed circuit board (PCB)s for being provided with electronic devices and components, or for carrying the base of other components and parts
Plate, first veneer 21, the second veneer 22 can also be any type of with heat source region and the fuel plate that need to radiate.
First heat pipe 26 is fitted on the side of the metal heat-conducting plate 25, one end of first heat pipe 26 and institute
The asic chip stated in the device of the second veneer 22 contacts, and the other end of first heat pipe 26 sequentially passes through the gold
Category heat-conducting plate 25 and first veneer 21 are contacted with the radiating shell 23, and first heat pipe 21 is for by the ASIC
The heat transfer of chip and the metal heat-conducting plate 25 gives the radiating shell 23, with will be described by the radiating shell 23
The heat of asic chip and the metal heat-conducting plate 25 is conducted.
It should be noted that the first heat pipe 26 can be fitted in the metal heat-conducting plate 25 towards second veneer 22
On side, it is appreciated that, the first heat pipe 26 can also be fitted in the metal heat-conducting plate 25 through after metal heat-conducting plate 25
Towards on the side of the first veneer 21.
In use, the first veneer 21, the second veneer 22 and first veneer 21 and the second veneer 22 are arranged at
Components and parts produce heat, and pass through metal heat-conducting plate 25 and the first heat pipe 26 and conduct heat to radiating shell 23, go forward side by side one
Walk to the outside of the single plate cooling device 20 and distribute, so as to reduce by 20 bulk temperature of single plate cooling device, it is ensured that veneer radiating dress
Put 20 normal works.
Further, the size of first veneer 21 is basically identical with the size of the cavity of the radiating shell 23, institute
The edge for stating the first veneer 21 is arranged near the cavity of the radiating shell 23, so that single plate cooling device 20 is with more tight
The layout gathered and less volume.Further, first substrate through hole 211 is offered on first veneer 21, so as to
One heat pipe 26 passes through first veneer 21 and is connected to radiating shell 23.
It is understood that when the first veneer 21 is positioned in the radiating shell 23, such as the first veneer 21 does not cover
Lid radiating shell 23, then the end of the first heat pipe 26 radiating shell 23 can be connected between uncovered area, so as to
Carry out heat conduction, radiating.
In the present embodiment, the radiating shell 23 includes diapire 231 and is approximately perpendicular to the inwall of the diapire 231
233, the lid 24 is fastened on the radiating shell 23 and accommodates first veneer 21 and the second veneer 22 to be formed
Cavity.
Further, the single plate cooling device 20 also includes the second heat pipe 28.Second heat pipe 28 fits in described
Metal heat-conducting plate 25, one end of second heat pipe 28 are contacted with the radiating shell 23, and second heat pipe 28 is used for will
The heat transfer of the metal heat-conducting plate 25 gives the radiating shell 23, to pass through the radiating shell 23 by the metal heat-conducting
The heat of plate 25 is conducted.
Second heat pipe 28 can fit in metal heat-conducting plate 25 towards 21 side of the first veneer, can also fit in metal
Heat-conducting plate 25 is towards 22 side of the second veneer.One end of second heat pipe 28 can extend to radiating shell 23 using free routing,
And contacted with the optional position of the radiating shell 23.Such as, second heat pipe 28 may extend to the bottom of radiating shell 23
Wall 231 or inwall 233, and second heat pipe 28 may pass through the first veneer 21 to contact with radiating shell 23, or from described
One veneer, 21 edge extends to radiating shell 23 to contact with radiating shell 23.
Further, the outside of the diapire 231 of the radiating shell 23 is provided with radiating part 235, for veneer radiating is filled
The heat put in 20 is distributed to outside.The radiating mode and structure of the radiating part 235 voluntarily can be arranged as needed, can such as be set
The radiating elements such as fin are put as radiating part 235, only need to ensure which can play thermolysis；And the radiating part 235 in
Set location on the radiating shell 23 is such as only arranged at the diapire 231 of radiating shell 23 also dependent on needing to be adjusted
Subregion, or arrange radiating shell 23 inwall 233 on.Likewise, the radiating shell 23 can adopt any form
Or structure, its concrete shape can be voluntarily adjusted according to the actually used demand of single plate cooling device 20.
Fig. 3 is referred to, further, the inner side of the diapire 231 of the radiating shell 23 is provided with groove 237, the groove
237 are made in order to heat spreader using metal material.In the present embodiment, the groove is inserted in the end of the first heat pipe 26
In 237, so as to increase the contact area between the first heat pipe 26 and groove 237, improving radiating effect.It is understood that institute
State groove 237 and can be formed at the radiating shell 23, can also be formed at each class formation being arranged on radiating shell 23.
Further, heat-conducting medium is filled with the groove 237 of the radiating shell 23.The heat-conducting medium can be adopted and be led
Thermal gels or heat conductive silica gel, consequently facilitating when the first heat pipe 26 is inserted in the connecting hole 2371, fully can pass heat
It is directed at radiating shell 23.
Further, the side of the metal heat-conducting plate 25 can be contacted with the inwall 233 of the radiating shell 23.So as to
It is easy to metal heat-conducting plate 25 be directed into radiating shell 23 by heat thereon, lifts the radiating efficiency of metal heat-conducting plate 25.
Further, in another embodiment of the invention, first veneer 21 can also intercept the metal heat-conducting plate
Contact between 25 and the diapire 231/ or inwall 233 of the radiating shell 23.Specifically, the setting feelings according to the first veneer 21
Condition, the first veneer 21 not only can cover the diapire 231 of the radiating shell 23 relative to the metal heat-conducting plate 25, also can be by
Localised spacer is between the inwall 233 of the metal heat-conducting plate 25 and radiating shell 23.
Further, the radiating efficiency of the radiating shell 23 is higher than the radiating efficiency of the lid 24, so as to ensure list
The one side radiating efficiency of plate heat dissipating device 20.
Fig. 4 is referred to, further, the single plate cooling device 20 is additionally provided with fixture 27, and fixture 27 is arranged at institute
State metal heat-conducting plate 25.The fixture 27 is bar shaped, offers fixing groove 270 thereon.The end connection of the fixture 27
In the side of the metal heat-conducting plate 25, and extend to the outside of the metal heat-conducting plate 25.The fixing groove of the fixture 27
270 are used to fixedly mount the first heat pipe 26, and first heat pipe 26 is welded in the fixing groove 270 of the fixture 27.
Specifically, the fixture 27 connects or is shaped in the metal heat-conducting plate 25.The fixture 27 can be
All kinds of suitable shapes such as tubulose, lamellar, bar shaped, its length, structure, bearing of trend are voluntarily set also dependent on concrete installation situation
Put.In the present embodiment, the fixture 27 is provided with the first fixed part 271 and connection for being roughly parallel to second veneer 22
In the second fixed part 273 of first fixed part 271.Second fixed part 273 is approximately perpendicular to first fixed part
271 and extend towards the radiating shell 23.The shape of the fixture 27 is consistent with first heat pipe 26, consequently facilitating solid
Dingan County fills the first heat pipe 26.
In another embodiment of the invention, groove 237 may also set up the inwall 233 in the radiating shell 23, and first
Heat pipe 26 can be arranged in first veneer 21 and be directly connected in the inwall 233 of radiating shell 23.
Understand, using single plate cooling device provided in an embodiment of the present invention, by between the first veneer and the second veneer
Sandwiched metal heat-conducting plate, realizes the heat transfer for producing the heater members on the second veneer in metal heat-conducting plate, further
, the single plate cooling device that the present invention is provided also includes the first heat pipe, and the first heat pipe is fitted in metal heat-conducting plate, and first hot
One end of pipe sequentially passes through the contact of metal heat-conducting plate, the first veneer and radiating shell, then the heat of metal heat-conducting plate can be by this
First heat pipe passes to radiating shell, then is conducted by radiating shell.So the technical scheme provided using the present invention, can
To improve the radiating efficiency to the second veneer to a certain extent, so as to improve the radiating efficiency to single plate cooling device.Enter one
Step, the other end of first heat pipe is contacted with the asic chip on the second veneer, then for the asic chip, its product
Raw heat can be directly delivered to radiating shell by the first heat pipe, so, this programme further effect can be rapidly
Asic chip is radiated, the surface temperature of asic chip is reduced.
The present invention also provides a kind of communication equipment, including single plate cooling device as above 20 and antenna (not shown),
The chip on veneer in the single plate cooling device 20 for the digital signal for receiving is converted into analogue signal, and by institute
State analogue signal and be sent to the antenna, so that the analogue signal is transmitted to other communication equipments by the antenna.
Due to single plate cooling device provided in an embodiment of the present invention, by the sandwiched gold between the first veneer and the second veneer
Category heat-conducting plate, realizes the heat transfer for producing the heater members on the second veneer in metal heat-conducting plate, further, this
The single plate cooling device of bright offer also includes the first heat pipe, and the first heat pipe is fitted in metal heat-conducting plate, and the one of the first heat pipe
End sequentially passes through the contact of metal heat-conducting plate, the first veneer and radiating shell, then the heat of metal heat-conducting plate can be first warm by this
Pipe passes to radiating shell, then is conducted by radiating shell.So the technical scheme provided using the present invention, can be one
Determine in degree, to improve the radiating efficiency to the second veneer, so as to improve the radiating efficiency to single plate cooling device.Further, should
The other end of the first heat pipe is contacted with the asic chip on the second veneer, then for the asic chip, its heat for producing
Amount can be directly delivered to radiating shell by the first heat pipe, so, this programme further effect can be rapidly to ASIC
Chip is radiated, and reduces the surface temperature of asic chip.So, comprising single plate cooling device provided in an embodiment of the present invention
The radiating efficiency of communication equipment does not include the communication equipment of single plate cooling device provided in an embodiment of the present invention also above other.
Above disclosed is only a kind of preferred embodiment of the invention, and the power of the present invention can not be limited certainly with this
Sharp scope, one of ordinary skill in the art will appreciate that all or part of flow process of above-described embodiment is realized, and according to present invention power
Profit requires made equivalent variations, still falls within the covered scope of invention.
Claims (10)
1. a kind of single plate cooling device, including radiating shell, lid and the first veneer, the second veneer, first veneer, second
Veneer, it is arranged in the cavity formed after the radiating shell and lid are fastened, first veneer is located at the radiating shell
And second veneer between, first veneer is contacted with the radiating shell, it is characterised in that：
The single plate cooling device also includes metal heat-conducting plate and the first heat pipe；
The metal heat-conducting plate is folded between first veneer and second veneer, and the metal heat-conducting plate is used to absorb
The heat that device on second veneer is produced；
First heat pipe is fitted on the surface of the metal heat-conducting plate, one end of first heat pipe and second veneer
The device in application-specific integrated circuit ASIC chip contact, the other end of first heat pipe sequentially passes through the metal
Heat-conducting plate and first veneer are contacted with the radiating shell, and first heat pipe is for by the asic chip and described
The heat transfer of metal heat-conducting plate gives the radiating shell, to pass through the radiating shell by the asic chip and the metal
The heat of heat-conducting plate is conducted；
The single plate cooling device also includes the second heat pipe：
Second heat pipe is fitted on the surface of the metal heat-conducting plate, one end and the radiating shell of second heat pipe
Contact, second heat pipe is for giving the radiating shell by the heat transfer of the metal heat-conducting plate, described scattered to pass through
The heat of the metal heat-conducting plate is conducted by hot housing.
2. single plate cooling device as claimed in claim 1, it is characterised in that：
First heat pipe is fitted in the metal heat-conducting plate towards on the surface of second veneer.
3. single plate cooling device as claimed in claim 1, it is characterised in that：
Open up fluted on the inside of the radiating shell,
The other end of first heat pipe sequentially passes through the metal heat-conducting plate and first veneer and inserts in the groove,
So that the other end of first heat pipe is contacted with the radiating shell.
4. single plate cooling device as claimed in claim 2, it is characterised in that：
Open up fluted on the inside of the radiating shell,
The other end of first heat pipe sequentially passes through the metal heat-conducting plate and first veneer and inserts in the groove,
So that the other end of first heat pipe is contacted with the radiating shell.
5. the single plate cooling device as described in any one of Claims 1-4, it is characterised in that：
The side of the metal heat-conducting plate is contacted with the inwall of the radiating shell.
6. the single plate cooling device according to any one of Claims 1-4, it is characterised in that：
First veneer has intercepted the contact of the metal heat-conducting plate and the radiating shell.
7. the single plate cooling device according to any one of Claims 1-4, it is characterised in that：
The radiating efficiency of the radiating shell is higher than the radiating efficiency of the lid.
8. single plate cooling device according to claim 5, it is characterised in that：The radiating efficiency of the radiating shell is than described
The radiating efficiency of lid is high.
9. single plate cooling device according to claim 6, it is characterised in that：The radiating efficiency of the radiating shell is than described
The radiating efficiency of lid is high.
10. a kind of communication equipment, it is characterised in that：Including single plate cooling device and day as described in any one of claim 1 to 9
Line, the chip on veneer in the single plate cooling device is for being converted into analogue signal by the digital signal for receiving, and incites somebody to action
The analogue signal is sent to the antenna, so that the analogue signal is transmitted to other communication equipments by the antenna.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410390727.5A CN104202944B (en) | 2014-08-08 | 2014-08-08 | Single-plate cooling device and communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410390727.5A CN104202944B (en) | 2014-08-08 | 2014-08-08 | Single-plate cooling device and communication equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104202944A CN104202944A (en) | 2014-12-10 |
| CN104202944B true CN104202944B (en) | 2017-04-12 |
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ID=52088145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410390727.5A Active CN104202944B (en) | 2014-08-08 | 2014-08-08 | Single-plate cooling device and communication equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN104202944B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106470537A (en) * | 2015-08-14 | 2017-03-01 | 中兴通讯股份有限公司 | Veneer liquid cooling heat radiation system and rack |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101193534A (en) * | 2006-11-29 | 2008-06-04 | 富准精密工业(深圳)有限公司 | Heat radiator |
| CN201418227Y (en) * | 2009-06-05 | 2010-03-03 | 深圳市宾利达智能科技有限公司 | Novel radiator |
| CN103139925A (en) * | 2013-01-31 | 2013-06-05 | 武汉邮电科学研究院 | Upstream data dispatch method used for local thermodynamic equilibrium (LTE) system and device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005229047A (en) * | 2004-02-16 | 2005-08-25 | Hitachi Ltd | Cooling system for electronic equipment, and the electronic equipment using same |
| JP5091291B2 (en) * | 2010-09-03 | 2012-12-05 | 東芝テック株式会社 | Electronics |
-
2014
- 2014-08-08 CN CN201410390727.5A patent/CN104202944B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101193534A (en) * | 2006-11-29 | 2008-06-04 | 富准精密工业(深圳)有限公司 | Heat radiator |
| CN201418227Y (en) * | 2009-06-05 | 2010-03-03 | 深圳市宾利达智能科技有限公司 | Novel radiator |
| CN103139925A (en) * | 2013-01-31 | 2013-06-05 | 武汉邮电科学研究院 | Upstream data dispatch method used for local thermodynamic equilibrium (LTE) system and device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104202944A (en) | 2014-12-10 |
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