CN106470537A - Veneer liquid cooling heat radiation system and rack - Google Patents
Veneer liquid cooling heat radiation system and rack Download PDFInfo
- Publication number
- CN106470537A CN106470537A CN201510501994.XA CN201510501994A CN106470537A CN 106470537 A CN106470537 A CN 106470537A CN 201510501994 A CN201510501994 A CN 201510501994A CN 106470537 A CN106470537 A CN 106470537A
- Authority
- CN
- China
- Prior art keywords
- veneer
- flow
- liquid
- heat radiation
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of veneer liquid cooling heat radiation system, including primary minute-pressure liquid pump, some connecting pipes, some chip radiators, pallet radiator；First flow is provided with chip radiator；It is provided with second flow channel on pallet radiator；Primary minute-pressure liquid pump is arranged on pallet radiator, and chip radiator is arranged on veneer；Pallet radiator is located at below described veneer；Connecting pipe, first flow and second flow channel constitute a closed-loop path, and the cooling medium that liquid cooling heat radiation system transmits is under the pressure effect of primary minute-pressure liquid pump in closed-loop path internal circulation flow；Heat release cooling when cooling medium heat absorption when flowing in first flow heats up and flows in second flow channel.The invention also discloses a kind of rack.By this invention simplifies veneer liquid-cooling heat radiation structure, solving the problems, such as that the radiating effect of veneer inner heat point is not good, improving the radiating efficiency of veneer.
Description
Technical field
The present invention relates to electronic device field, more particularly, to veneer liquid cooling heat radiation system and rack.
Background technology
In the last few years, constantly developed with Internet technology, the collection to electronic equipment for the field such as communication and IT
One-tenth degree more and more higher, highly integrated big power dissipating chip is more and more applied in single board system, enters
And lead to veneer local pyrexia point problem to highlight；For solving the problems, such as the heat generating spot in veneer, general employing increases
Big veneer rack rotation speed of the fan is to increase single-board slot air quantity, and this can lead to the noise mistake of single board system
High.Veneer local pyrexia point has become as a bottleneck limiting single board service capability improving.
At present, liquid-cooling heat radiation technology has more and more been applied to the radiating solving big power consumption rack.
But the usual volume of existing liquid cooling heat radiation system is big, part is many and structure is complex, thus cannot be more
Targetedly solve the heat dissipation problem of local pyrexia point in veneer, thus have impact on single board service ability
Lifting.
Content of the invention
Present invention is primarily targeted at providing a kind of veneer liquid cooling heat radiation system and rack it is intended to solve single
The not high technical problem of the radiating efficiency of local pyrexia point in plate.
For achieving the above object, a kind of veneer liquid cooling heat radiation system that the present invention provides, including primary minute-pressure
Liquid pump, some connecting pipes, described veneer liquid cooling heat radiation system also includes：Some chip radiators, support
Disk radiator；It is provided with first flow on described chip radiator；It is provided with described pallet radiator
Two runners；Described primary minute-pressure liquid pump is arranged on described pallet radiator, described chip radiator setting
On veneer；Described pallet radiator is located at below described veneer；Described connecting pipe, described first-class
Road and described second flow channel constitute a closed-loop path, and the cooling medium of described liquid cooling heat radiation system transmission exists
In described closed-loop path internal circulation flow under the pressure effect of described primary minute-pressure liquid pump；Described cooling medium
Heat release cooling when heat absorption heats up and flows in described second flow channel when flowing in described first flow.
Preferably, described chip radiator includes substrate, Heat Conduction Material, some radiating fins and described
One runner；Described radiating fin is arranged at the upper top surface of described substrate, and the bottom surface of described substrate passes through institute
The surface stating the specified chip on Heat Conduction Material and described veneer fits tightly；Described first flow is pipeline
Formula structure and described substrate is internally provided with the groove placing described first flow.
Preferably, described pallet radiator includes the pallet for carrying described veneer and described second flow channel；
Described second flow channel is arranged at described pallet inside and adopts inflation type structure.
Preferably, described veneer liquid cooling heat radiation system also includes the liquid storage being arranged on described pallet radiator
Case, described reserving liquid tank is used for storing described cooling medium.
Preferably, described veneer liquid cooling heat radiation system also includes the flow being arranged on described pallet radiator
Monitor, described flow monitor is used for monitoring the flow regime of described cooling medium and being situated between in described cooling
There is output alarm signal during different shape in the flow regime of matter.
Preferably, described veneer liquid cooling heat radiation system also includes standby minute-pressure liquid pump, described primary minute-pressure liquid
Pump is connected in series with described standby minute-pressure liquid pump, and wherein, described standby minute-pressure liquid pump is used for when described primary
The work of described primary minute-pressure liquid pump taken over by minute-pressure liquid pump when breaking down.
Preferably, when described chip radiator setting quantity be no less than two when, each chip radiator it
Between using series connection and/or parallel way connect.
Preferably, the liquid outlet of described primary minute-pressure liquid pump passes through described connecting pipe and described first flow
Inlet connect；The liquid outlet of described first flow is connected with the inlet of described second flow channel；Described
The liquid outlet of second flow channel is connected with the inlet of described reserving liquid tank by described connecting pipe；Described liquid storage
The liquid outlet of case is connected with the inlet of described flow monitor by described connecting pipe；Described flow prison
The liquid outlet surveying device is connected with the inlet of described primary minute-pressure liquid pump by described connecting pipe.
Preferably, described veneer liquid cooling heat radiation system also includes some jointings, and described jointing is used
In described connecting pipe and described reserving liquid tank and/or described flow monitor and/or described primary minute-pressure liquid
Pump and/or described first flow and/or described second flow channel connect；Described jointing is additionally operable to described
First flow is connected with described second flow channel；Described jointing is entered using clip mode and/or mode of twisting soon
Row connects.
Further, for achieving the above object, the present invention also provides a kind of rack, including blower fan, described
Rack also includes the veneer liquid cooling heat radiation system described in some any of the above-described, and described blower fan is at least used for will
Described veneer liquid cooling heat radiation system and described veneer liquid cooling heat radiation system local environment carry out being dissipated during heat exchange
The heat sending discharges described rack.
The present invention passes through setting chip radiator and the lower section in veneer on the big power dissipating chip on veneer
Setting pallet radiator, and form the closed-loop path that cooling medium circulates, thus when sub-cooled is situated between
Matter is passed through to absorb, during the first flow on chip radiator, the heat that chip is given out, and by sub-cooled
Medium is changed into high temperature cooling medium；When high temperature cooling medium pass through pallet radiator on second flow channel when with
Pallet radiator surrounding air carries out heat exchange and then distributes the heat absorbing, and is situated between by high temperature cooling
Qualitative change is low-temperature cooling media.In addition, by the blower fan in rack, by veneer liquid-cooling heat radiation system in rack
The given out heat of uniting is discharged outside rack, and suck cold air outside rack in case with second flow channel in
High temperature cooling medium carries out heat exchange.By the veneer liquid cooling heat radiation system of the present invention, not only simplify list
Plate liquid-cooling heat radiation structure, and targetedly solve not good the asking of radiating effect of veneer inner heat point
Topic, improves the radiating efficiency of veneer.
Brief description
Fig. 1 is the structural representation of rack one embodiment of the present invention；
Fig. 2 is the structural representation of veneer liquid cooling heat radiation system one embodiment in Fig. 1；
Fig. 3 is that the Facad structure of veneer liquid cooling heat radiation system SMIS sheet heat radiator one embodiment in Fig. 2 is illustrated
Figure；
Fig. 4 is that the internal structure of veneer liquid cooling heat radiation system SMIS sheet heat radiator one embodiment in Fig. 2 is illustrated
Figure；
Fig. 5 is that the inverse layer structure of veneer liquid cooling heat radiation system SMIS sheet heat radiator one embodiment in Fig. 2 is illustrated
Figure；
Fig. 6 is the structural representation of pallet radiator one embodiment in veneer liquid cooling heat radiation system in Fig. 2.
The realization of the object of the invention, functional characteristics and advantage will be done further in conjunction with the embodiments referring to the drawings
Explanation.
Specific embodiment
It should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not used to limit
The present invention.
With reference to Fig. 1, Fig. 1 is the structural representation of rack one embodiment of the present invention.In the present embodiment, rack
10 include：Blower fan 11, some veneers 12 and be arranged on the veneer liquid cooling heat radiation system 20 on veneer 12.
Veneer liquid cooling heat radiation system 20 is used for and veneer 12 (the big power dissipating chip mainly on monolithic 12)
Carry out heat exchange, with produced heat when absorbing veneer 12 work, simultaneously with veneer 12 local environment
Carry out heat exchange to be dispersed into the heat absorbing in local environment；Blower fan 11 is at least used for veneer liquid
The heat that cold cooling system 20 and local environment (such as air) carry out being given out during heat exchange discharges machine
Cabinet 10.
Further alternative, multiple air vents can be increased on rack 10, when blower fan 11 is by rack 10
Interior when carrying out the hot-air that heat exchange formed and extracting out, meanwhile, by the cold air outside rack 10 (relatively
For the hot-air in rack 10, the air outside rack 10 can regard cold air as) by ventilation
Hole sucks in rack 10, and carries out heat exchange with veneer liquid cooling heat radiation system 20, thus realizing to veneer
12 radiating treatment.
Existing rack 10 typically adopts blower fan 11 and air vent, and the veneer 12 in rack 10 is dissipated
Heat treatment, but not high for the radiating efficiency of local pyrexia point produced by big power dissipating chip on veneer 12.
In the present embodiment, it is specific to the big power consumption core on single veneer 12 by veneer liquid cooling heat radiation system 20
Produced by piece, local pyrexia point carries out radiating treatment, and heat produced on monolithic 12 is dispersed into list
Discharge outside rack 10 in the surrounding of piece 12 and by blower fan 11, and then improve on veneer 12
The radiating treatment efficiency of local pyrexia point produced by big power dissipating chip.
With reference to Fig. 2, Fig. 2 is the structural representation of veneer liquid cooling heat radiation system one embodiment in Fig. 1.
In the present embodiment, veneer liquid cooling heat radiation system 20 includes：Minute-pressure liquid pump 21, some chip radiators
22nd, pallet radiator 23 and be used for connecting minute-pressure liquid pump 21, chip radiator 22, pallet radiator
Some connecting pipes 24 of 23 grade parts.Chip radiator 22 is arranged at the big power consumption specified on veneer 12
The top of chip (not shown), veneer 12 can be arranged on pallet by securing member (such as screw) and dissipate
On hot device 23, namely pallet radiator 23 is located at the lower section of veneer 12.Minute-pressure liquid pump 21 preferably passes through
On veneer 12, reserved installation position to be to be fixed on pallet radiator 23, additionally, minute-pressure liquid pump 21 also may be used
To be set directly on veneer 12.
In addition, it is necessary to explanation, the quantity of chip radiator 22 and connecting pipe 24 is with specific reference to product
Product design is configured.When chip radiator 22 exist multiple be, can between multiple chip radiators 22
With using in parallel, or series connection, or the connected mode of parallel connection and serial connection mixing and pass through connecting pipe 24
It is directly connected to.Additionally, each chip radiator 22 can also be used alone, namely each chip radiator 22
Between can also connecting single board liquid cooling heat radiation system 20 miscellaneous part, such as minute-pressure liquid pump 21 etc., tool
Body is configured according to actual needs.The material of connecting pipe 24 can be the flexible duct such as rubber, PVC,
It can also be the rigid conduit such as plastics, metal.
The cooling medium being transmitted in veneer liquid cooling heat radiation system 20 is liquid, and can be in minute-pressure liquid pump 21
Pressure effect under chip radiator 22 and pallet radiator 23 in flowing.Work as low-temperature cooling media
When flowing in chip radiator 22, carry out heat friendship with the big power dissipating chip (not shown) on veneer 12
Change to absorb heat produced by big power dissipating chip, now, low-temperature cooling media heat absorption intensification is changed into high temperature
Cooling medium；And when high temperature cooling medium flows in pallet radiator 23, with pallet radiator 23
Residing external environment (such as air) carries out heat exchange to discharge entrained heat, and now, high temperature is cold
But medium heat release cooling is changed into low-temperature cooling media.In addition, the flow direction of cooling medium does not limit, specifically
Related to the pressure action direction of minute-pressure liquid pump 21.
Further alternative, veneer liquid cooling heat radiation system 20 can also include a standby minute-pressure liquid pump and (not show
Go out), this standby minute-pressure liquid pump is used for taking over when minute-pressure liquid pump 21 breaks down (such as quitting work)
The work of minute-pressure liquid pump 21.Preferably standby minute-pressure liquid pump and minute-pressure liquid pump 21 are using being connected in series and standby
It is arranged at the liquid outlet of minute-pressure liquid pump 21 with minute-pressure liquid pump.Additionally, in view of each veneer 12 in rack 10
Mounting means (stacking), it is therefore preferable that standby minute-pressure liquid pump is not surpassed with the height of minute-pressure liquid pump 21
Cross the height of veneer 12.
Further alternative, veneer liquid cooling heat radiation system 20 can also include a flow monitor 25, this stream
Amount monitor 25 is used for monitoring the flow regime of cooling medium and the flow regime in cooling medium occurs different shape
When output alarm signal.Such as, when cooling medium stops flowing or flowing slowly and is less than default monitoring
During value, then output alarm signal.Flow monitor 25 both can be arranged on pallet radiator 23,
Can be arranged on veneer 12, be preferably disposed in the present embodiment on pallet radiator 23.
Further alternative, veneer liquid cooling heat radiation system 20 can also include a reserving liquid tank 26, this reserving liquid tank
26 are used for storing cooling medium.Reserving liquid tank 26 both can be arranged on pallet radiator 23 it is also possible to set
It is placed on veneer 12, be preferably disposed in the present embodiment on pallet radiator 23.Furthermore it is preferred that liquid storage
The height of case 26 is no more than the height of veneer 12.When veneer 12 adopts enclosed construction, for saving
Space is it is also possible to select to be not provided with reserving liquid tank 26, now cooling medium is stored in flow channel.
Reference picture 3-5, Fig. 3 is for veneer liquid cooling heat radiation system SMIS sheet heat radiator one embodiment in Fig. 2 just
Face structural representation；Fig. 4 is the interior of veneer liquid cooling heat radiation system SMIS sheet heat radiator one embodiment in Fig. 2
Portion's structural representation；Fig. 5 is the anti-of veneer liquid cooling heat radiation system SMIS sheet heat radiator one embodiment in Fig. 2
Face structural representation.
As shown in figure 3, the big power dissipating chip that chip radiator 22 includes being arranged on veneer 12 (does not show
Go out) substrate 221 on top and some radiating fins 222 being arranged on top surface on substrate 221, substrate
The surface that 221 bottom surface passes through the big power dissipating chip (not shown) on Heat Conduction Material and veneer 12 is tight
Laminating.Wherein, substrate 221 is installed on the top of big power dissipating chip by securing member (such as screw),
Thus heat produced by big power dissipating chip can be delivered to the radiating fin on substrate 221 by Heat Conduction Material
Piece 222, and then by some radiating fins 222 and chip radiator 22 local environment (such as air)
Carry out heat exchange, thus realizing the radiating treatment to big power dissipating chip.
As shown in figure 4, chip radiator 22 also includes being arranged on the first flow 223 within substrate 221,
First flow 223 is directly fitted tightly with big power dissipating chip 121, and cooling medium is in first flow 223
Carry out heat exchange to absorb heat produced by big power dissipating chip 121 with big power dissipating chip 121 during flowing.
Each first flow 223 when there are multiple chip radiator 22, corresponding to each chip radiator 22
Between be preferably attached by connecting pipe 24.Additionally, realizing and big power dissipating chip 121 for maximizing
Heat exchange (radiating fin radiating with cooling medium radiating), namely ensure substrate 221 and big power dissipating chip
121 have while certain contact area it is ensured that cooling medium can absorb more heats, and therefore first
The setting of runner 223 is preferably shaped to " U " type side by side, namely ensures first flow 223 and big power consumption core
Piece 121 has the contact area of maximum.Additionally, being the effect ensureing heat exchange, therefore first flow 223
Material be preferably import property preferable metal material.In addition, first flow 223 preferably employs duct type
Structure, namely laying pipeline material.
As shown in figure 5, arranging fluted 224 on the bottom surface of substrate 221, adopt for placement and fixation
With the first flow 223 of duct type structure, thus realize substrate 221 and first flow 223 all with big power consumption
Chip 121 keeps optimum directly contact, thus be greatly improved dissipating to big power dissipating chip (not shown)
Heat treatment efficiency.In addition, first flow 223 can also adopt inflation type structure, namely directly in substrate
221 be internally formed hollow space using by this hollow space as cooling medium runner.
With reference to Fig. 6, Fig. 6 is the structure of pallet radiator one embodiment in veneer liquid cooling heat radiation system in Fig. 2
Schematic diagram.
In the present embodiment, pallet radiator 23 includes pallet 231 and setting for carrying veneer 12
Second flow channel 232 within pallet 231.Second flow channel 232 both can adopt duct type structure, also may be used
Using inflation type structure, to be configured with specific reference to being actually needed, in the present embodiment, preferably employ inflation
Formula structure.The setting of second flow channel 232 is preferably shaped to " U " type side by side, namely ensures second flow channel
232 have maximum contact area with local environment (such as air).In addition, when second flow channel 232 adopts
During inflation type structure, the material of second flow channel 232 is identical with pallet 231, it is preferred to use metal material.
Further alternative, pallet radiator 23 can also arrange multiple louvres to improve veneer 12
Radiating efficiency.
Based on the various embodiments described above, in a preferred embodiment of veneer liquid cooling heat radiation system of the present invention, single
The annexation of each part of plate liquid cooling heat radiation system 20 includes：The liquid outlet of minute-pressure liquid pump 21 passes through to connect
Pipeline 24 is connected with the inlet of first flow 223；The liquid outlet of first flow 223 and second flow channel 232
Inlet connect；The liquid outlet of second flow channel 232 passes through the feed liquor of connecting pipe 24 and reserving liquid tank 26
Mouth connects；The liquid outlet of reserving liquid tank 26 is connected with the inlet of flow monitor 25 by connecting pipe 24；
The liquid outlet of flow monitor 25 is connected with the inlet of minute-pressure liquid pump 21 by connecting pipe 24.
It should be noted that when multiple chip radiators 22 are using in parallel, or series connection, or in parallel with
When series hybrid connects, (going out) the liquid mouth that enters corresponding to first flow 223 in the present embodiment is that cooling is situated between
Matter is (last) first to flow into corresponding first (last) during (going out) multiple first flow 223
First flow 223 enter (going out) liquid mouth.
Further alternative, veneer liquid cooling heat radiation system 20 also includes some jointing (not shown),
This jointing is used for connecting pipe 24 and reserving liquid tank 26 and/or flow monitor 25 and/or minute-pressure liquid
Pump 21 and/or first flow 223 and/or second flow channel connect 232；Additionally, jointing is additionally operable to
First flow 223 is connected 232 with second flow channel；Jointing preferably employs clip mode and/or twists side soon
Formula is attached.
These are only the preferred embodiments of the present invention, not thereby limit the scope of the claims of the present invention, every
The equivalent structure made using description of the invention and accompanying drawing content or equivalent flow conversion, or directly or
Connect and be used in other related technical fields, be included within the scope of the present invention.
Claims (10)
1. a kind of veneer liquid cooling heat radiation system, including primary minute-pressure liquid pump, some connecting pipes, its feature
It is, described veneer liquid cooling heat radiation system also includes：Some chip radiators, pallet radiator；Described
First flow is provided with chip radiator；It is provided with second flow channel on described pallet radiator；Described master
It is arranged on described pallet radiator with minute-pressure liquid pump, described chip radiator is arranged on veneer；Described
Pallet radiator is located at below described veneer；Described connecting pipe, described first flow and described second
Runner constitutes a closed-loop path, and the cooling medium of described liquid cooling heat radiation system transmission is in described primary minute-pressure liquid
In described closed-loop path internal circulation flow under the pressure effect of pump；Described cooling medium is in described first flow
Heat release cooling when heat absorption heats up and flows in described second flow channel during interior flowing.
2. veneer liquid cooling heat radiation system as claimed in claim 1 is it is characterised in that described chip cooling
Device includes substrate, Heat Conduction Material, some radiating fins and described first flow；Described radiating fin setting
In the upper top surface of described substrate, the bottom surface of described substrate passes through on described Heat Conduction Material and described veneer
The surface of specified chip fits tightly；Described first flow is setting inside duct type structure and described substrate
There is the groove placing described first flow.
3. veneer liquid cooling heat radiation system as claimed in claim 2 is it is characterised in that described pallet radiates
Device includes pallet and described second flow channel for carrying described veneer；Described second flow channel is arranged at described
Pallet is internal and adopts inflation type structure.
4. veneer liquid cooling heat radiation system as claimed in claim 3 is it is characterised in that described veneer liquid is cold
Cooling system also includes the reserving liquid tank being arranged on described pallet radiator, and described reserving liquid tank is used for storing institute
State cooling medium.
5. the veneer liquid cooling heat radiation system as any one of claim 1-4 is it is characterised in that institute
State the flow monitor that veneer liquid cooling heat radiation system also includes being arranged on described pallet radiator, described stream
Amount monitor is used for monitoring the flow regime of described cooling medium and the flow regime in described cooling medium is sent out
Output alarm signal during raw different shape.
6. veneer liquid cooling heat radiation system as claimed in claim 5 is it is characterised in that described veneer liquid is cold
Cooling system also includes standby minute-pressure liquid pump, and described primary minute-pressure liquid pump is connected with described standby minute-pressure liquid pump
Connect, wherein, described standby minute-pressure liquid pump is used for taking over institute when described primary minute-pressure liquid pump breaks down
State the work of primary minute-pressure liquid pump.
7. veneer liquid cooling heat radiation system as claimed in claim 5 dissipates it is characterised in that working as described chip
When the setting quantity of hot device is no less than two, connected using series connection and/or parallel way between each chip radiator
Connect.
8. veneer liquid cooling heat radiation system as claimed in claim 7 is it is characterised in that described primary minute-pressure
The liquid outlet of liquid pump is connected with the inlet of described first flow by described connecting pipe；Described first-class
The liquid outlet in road is connected with the inlet of described second flow channel；The liquid outlet of described second flow channel passes through described
Connecting pipe is connected with the inlet of described reserving liquid tank；The liquid outlet of described reserving liquid tank is by described connecting tube
Road is connected with the inlet of described flow monitor；The liquid outlet of described flow monitor is by described connection
Pipeline is connected with the inlet of described primary minute-pressure liquid pump.
9. veneer liquid cooling heat radiation system as claimed in claim 8 is it is characterised in that described veneer liquid is cold
Cooling system also includes some jointings, and described jointing is used for described connecting pipe and described liquid storage
Case and/or described flow monitor and/or described primary minute-pressure liquid pump and/or described first flow and
/ or the connection of described second flow channel；Described jointing is additionally operable to described first flow with described second flow channel even
Connect；Described jointing is attached using clip mode and/or mode of twisting soon.
10. a kind of rack, including blower fan it is characterised in that described rack also include some as rights will
Seek the veneer liquid cooling heat radiation system any one of 1-9, described blower fan is at least used for will be cold for described veneer liquid
Cooling system and described veneer liquid cooling heat radiation system local environment carry out the heat row being given out during heat exchange
Go out described rack.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510501994.XA CN106470537A (en) | 2015-08-14 | 2015-08-14 | Veneer liquid cooling heat radiation system and rack |
| PCT/CN2016/073803 WO2017028512A1 (en) | 2015-08-14 | 2016-02-15 | Single-board liquid-cooled heatsink system and cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510501994.XA CN106470537A (en) | 2015-08-14 | 2015-08-14 | Veneer liquid cooling heat radiation system and rack |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106470537A true CN106470537A (en) | 2017-03-01 |
Family
ID=58051802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510501994.XA Pending CN106470537A (en) | 2015-08-14 | 2015-08-14 | Veneer liquid cooling heat radiation system and rack |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106470537A (en) |
| WO (1) | WO2017028512A1 (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107124853A (en) * | 2017-05-17 | 2017-09-01 | 加弘科技咨询(上海)有限公司 | Liquid cooling apparatus and its electronic equipment of application |
| CN107592773A (en) * | 2017-09-06 | 2018-01-16 | 珠海格力电器股份有限公司 | Heat generating member radiator and the air conditioner for including it |
| CN108170239A (en) * | 2018-01-30 | 2018-06-15 | 石家庄东远散热技术有限公司 | A kind of water-filled radiator for being used to dig ore deposit device |
| CN108196655A (en) * | 2018-02-28 | 2018-06-22 | 爱美达（上海）热能系统有限公司 | A kind of novel board cooling assembling device and its assembly method |
| CN110248524A (en) * | 2019-06-13 | 2019-09-17 | 南方科技大学 | A kind of radiator and electronic equipment |
| CN111384006A (en) * | 2018-12-29 | 2020-07-07 | 中兴通讯股份有限公司 | Heat radiation structure |
| WO2021035760A1 (en) * | 2019-08-31 | 2021-03-04 | 华为技术有限公司 | Heat dissipation apparatus, device, equipment rack, and system |
| CN115867006A (en) * | 2023-02-28 | 2023-03-28 | 绵阳高新区恒奥电子科技有限公司 | Distributed liquid cooling cabinet |
| TWI815096B (en) * | 2021-03-17 | 2023-09-11 | 尼得科超眾科技股份有限公司 | Liquid cooling loop heat sink and cooling system having the same |
| WO2023221638A1 (en) * | 2022-05-20 | 2023-11-23 | 华为技术有限公司 | Heat dissipation apparatus, connecting structure, and electronic device |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107328807B (en) * | 2017-05-08 | 2023-04-11 | 广东工业大学 | Cabinet heat dissipation testing arrangement |
| CN108680785A (en) * | 2018-06-21 | 2018-10-19 | 深圳绿色云图科技有限公司 | A kind of fictitious load test device |
| CN110062297A (en) * | 2019-04-09 | 2019-07-26 | 广东合一新材料研究院有限公司 | A kind of base station 5G cooling system |
| CN113043877A (en) * | 2019-12-26 | 2021-06-29 | 奥动新能源汽车科技有限公司 | Charging cooling system and power exchanging station and energy storage station comprising same |
| CN112002355B (en) * | 2020-07-27 | 2022-02-18 | 北京浪潮数据技术有限公司 | Hard disk liquid cooling heat dissipation system and server |
| CN113371234A (en) * | 2021-05-18 | 2021-09-10 | 北京国科环宇科技股份有限公司 | Liquid cooling structure and case shell |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8081463B2 (en) * | 2009-06-16 | 2011-12-20 | Asia Vital Components Co., Ltd. | Water-cooled communication chassis |
| US20140251583A1 (en) * | 2013-03-07 | 2014-09-11 | Asetek A/S | Leak detection system for a liquid cooling system |
| GB2512874A (en) * | 2013-04-09 | 2014-10-15 | Richard Weatherley | Cooling system |
| CN203632535U (en) * | 2013-12-13 | 2014-06-04 | 常州联力自动化科技有限公司 | Mining frequency converter water cooling heat dissipation system |
| CN203788629U (en) * | 2014-03-28 | 2014-08-20 | 中兴通讯股份有限公司 | Liquid cooling radiating cabinet system |
| CN104202944B (en) * | 2014-08-08 | 2017-04-12 | 华为技术有限公司 | Single-plate cooling device and communication equipment |
-
2015
- 2015-08-14 CN CN201510501994.XA patent/CN106470537A/en active Pending
-
2016
- 2016-02-15 WO PCT/CN2016/073803 patent/WO2017028512A1/en active Application Filing
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107124853A (en) * | 2017-05-17 | 2017-09-01 | 加弘科技咨询(上海)有限公司 | Liquid cooling apparatus and its electronic equipment of application |
| CN107592773A (en) * | 2017-09-06 | 2018-01-16 | 珠海格力电器股份有限公司 | Heat generating member radiator and the air conditioner for including it |
| CN108170239A (en) * | 2018-01-30 | 2018-06-15 | 石家庄东远散热技术有限公司 | A kind of water-filled radiator for being used to dig ore deposit device |
| CN108196655A (en) * | 2018-02-28 | 2018-06-22 | 爱美达（上海）热能系统有限公司 | A kind of novel board cooling assembling device and its assembly method |
| CN111384006A (en) * | 2018-12-29 | 2020-07-07 | 中兴通讯股份有限公司 | Heat radiation structure |
| CN110248524A (en) * | 2019-06-13 | 2019-09-17 | 南方科技大学 | A kind of radiator and electronic equipment |
| WO2021035760A1 (en) * | 2019-08-31 | 2021-03-04 | 华为技术有限公司 | Heat dissipation apparatus, device, equipment rack, and system |
| CN113508647A (en) * | 2019-08-31 | 2021-10-15 | 华为技术有限公司 | Heat dissipation device, equipment, rack and system |
| US11903164B2 (en) | 2019-08-31 | 2024-02-13 | Huawei Technologies Co., Ltd. | Heat dissipation apparatus, device, rack, and system |
| TWI815096B (en) * | 2021-03-17 | 2023-09-11 | 尼得科超眾科技股份有限公司 | Liquid cooling loop heat sink and cooling system having the same |
| WO2023221638A1 (en) * | 2022-05-20 | 2023-11-23 | 华为技术有限公司 | Heat dissipation apparatus, connecting structure, and electronic device |
| CN115867006A (en) * | 2023-02-28 | 2023-03-28 | 绵阳高新区恒奥电子科技有限公司 | Distributed liquid cooling cabinet |
| CN115867006B (en) * | 2023-02-28 | 2023-04-25 | 绵阳高新区恒奥电子科技有限公司 | Distributed liquid cooling cabinet |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017028512A1 (en) | 2017-02-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106470537A (en) | Veneer liquid cooling heat radiation system and rack | |
| CN105682423B (en) | Heat dissipation equipment | |
| CN203120357U (en) | Liquid cooling heat dissipation cabinet | |
| KR100605422B1 (en) | Liquid circulation type cooling system | |
| CN203276154U (en) | Efficient heat dissipation device of computer CPU | |
| CN104159437B (en) | Composite heat dissipation device | |
| US9310113B2 (en) | Thermoelectric heat pump apparatus | |
| CN206023565U (en) | A kind of current transformer cooling system | |
| CN109974136A (en) | A kind of radiator, air-conditioner outdoor unit and air conditioner | |
| CN206713229U (en) | A kind of radiator and the electric vehicle controller with the radiator | |
| CN105792603B (en) | Cooling device | |
| CN104703448B (en) | The server cabinet cooling system that gate-type cold water heat-exchanger rig and liquid cooling apparatus combine | |
| CN207969285U (en) | A kind of efficient circulation radiator of information system control babinet | |
| CN106500202A (en) | A kind of heat abstractor of off-premises station | |
| CN204102056U (en) | A kind of VPX heat-sinking structure of chassis | |
| CN206831862U (en) | A kind of circular semiconductor ring-type parallel connection refrigerator | |
| CN108255274A (en) | A kind of compound server radiating case | |
| CN211526871U (en) | Condenser applied to rapidly cooling beverage | |
| CN107072118A (en) | A kind of rack dust panel formula heat-pipe radiating apparatus | |
| CN210573617U (en) | Siphon radiator | |
| CN206977885U (en) | A kind of rack dust panel formula heat-pipe radiating apparatus | |
| CN109671690B (en) | Multi-head spiral flow channel liquid cooler for heat dissipation of electronic component | |
| CN205726814U (en) | Cooling device | |
| CN216308710U (en) | Gravity heat pipe radiator system | |
| CN220031191U (en) | Auxiliary device for 3D printer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170301 |