CN108255274A - A kind of compound server radiating case - Google Patents
A kind of compound server radiating case Download PDFInfo
- Publication number
- CN108255274A CN108255274A CN201810239747.0A CN201810239747A CN108255274A CN 108255274 A CN108255274 A CN 108255274A CN 201810239747 A CN201810239747 A CN 201810239747A CN 108255274 A CN108255274 A CN 108255274A
- Authority
- CN
- China
- Prior art keywords
- babinet
- water
- ventilation duct
- radiating subassembly
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/202—Air convective hinge
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The problem of the invention discloses a kind of compound server radiating casees, belong to computer server technical field, are all by fan for solving most of heat dissipation of existing huge computer servers, cause heat dissipation effect single, and heat dissipation effect is undesirable.Including babinet, the first radiating subassembly, the second radiating subassembly and third radiating subassembly, the first radiating subassembly includes snorkel and the first exhaust fan, and snorkel includes the first ventilation duct and the second ventilation duct;Second radiating subassembly includes radiator and thermally conductive sheet;Third dissipates radiating subassembly and includes cooled plate, blending bin, the second exhaust fan, semiconductor chilling plate and atomizer, and cooled plate includes cooling-water duct, and one end of cooling-water duct is connected in the right wall of blending bin, and the other end is connected with water pump;It is connected in the left wall of blending bin by connecting tube with the second exhaust fan, is connected on the roof roof of blending bin by connecting tube with atomizer, the other end of atomizer is connected with water inlet pipe and semiconductor chilling plate.
Description
Technical field
The present invention relates to computer server technical fields, and in particular to a kind of compound server radiating case.
Background technology
Computer server refers to:One management resource and the computer software for providing service to the user, are generally divided into file clothes
Business device (can make user access file in other computers), database server and apps server.Operation more than software
Computer or for network host.In general, server externally provides service by network.I ntranet can be passed through
Service is provided to Intranet, can also externally provide service by I nternet.
Most of heat dissipation of existing huge computer servers be all by fan, it is single so as to cause heat dissipation effect,
And heat dissipation effect is undesirable.
Invention content
All it is by fan to solve most of heat dissipation of existing huge computer servers, is imitated so as to cause heat dissipation
The problem of fruit is single, and heat dissipation effect is undesirable, the present invention provide a kind of compound server radiating case.
In order to solve the above technical problems, the present invention provides following technical scheme:
A kind of compound server radiating case, including babinet, the top of babinet is equipped with case lid, which is characterized in that further includes
First radiating subassembly, the second radiating subassembly and third radiating subassembly, the first radiating subassembly include snorkel and the first exhaust fan, institute
It states snorkel and includes the first ventilation duct and the second ventilation duct, what first ventilation duct tilted upward is arranged on case lid, described
Second ventilation duct is arranged on the inside of babinet, first ventilation duct and the second ventilation through the roof of babinet along vertical direction
Pipe connects;The lower section of second ventilation duct is equipped with deflector, and the deflector is inclined to be arranged on the side wall of babinet, water conservancy diversion
The high-end of plate connects with the side wall of babinet, and first exhaust fan is arranged on the bottom of babinet;
Second radiating subassembly includes radiator and thermally conductive sheet, and the radiator is arranged on the roof of babinet, thermally conductive sheet
One end is set on a heat sink, and the other end of thermally conductive sheet is arranged on through case lid outside case lid;
Third dissipates radiating subassembly and includes cooled plate, blending bin, the second exhaust fan, semiconductor chilling plate and atomizer, institute
It states cooled plate and includes plate body, cooling-water duct is provided in the plate body, be equipped with and run through beside the cooling-water duct on plate body
The ventilation hole of plate body setting, the both ends of the plate body are set through the side wall of babinet, and one end of the cooling-water duct is connected to
In the right wall of blending bin, the other end of cooling-water duct is connected with water pump;It is taken out in the left wall of blending bin by connecting tube and second
Wind turbine is connected, and is connected on the roof roof of blending bin by connecting tube with atomizer, the other end of atomizer be connected with into
Water pipe, semiconductor chilling plate are arranged on the bottom of water inlet pipe.
The novel server radiator of the present invention at work, server is placed in the cooled plate in babinet, is serviced
Three bulks of heat point that device work generates are absorbed, and the first bulk that server work generates heat is inhaled by the first radiating subassembly
It receives, opens the first exhaust fan of the bottom of box, the first exhaust fan is taken out the air in babinet by the ventilation hole set on plate body
Go out, such box house causes the air of heating in babinet to be taken out by the first exhaust fan because of the heat of server work generation
Go out, in this process, the relatively cool air outside babinet enters box house by snorkel, is formed benign air-cooled
Cycle strengthens the heat dissipation effect of server.
The second bulk that server work generates heat is absorbed by the second radiating subassembly, and the heat that server work generates passes
It is delivered on radiator, is transmitted to outside case by heat-conducting plate, reduce the heat of box house, reduce internal temperature, favorably
It works in server.Meanwhile the lower section of second ventilation duct is equipped with deflector, the deflector is inclined to be arranged on babinet
On side wall, the high-end of deflector connects with the side wall of babinet, and the setting of deflector can prevent the cold air outside babinet from coming in
The gap outflow being directly over afterwards between transverse slat, after setting deflector, the cold air come in by snorkel can be through deflector
It is adequately flowed out after server from the gap between transverse slat after water conservancy diversion so that air cooling effect reaches best.Simultaneously as
The setting of deflector can cause the wind come in outside babinet to be come into full contact with after deflector water conservancy diversion with radiator, into as early as possible
Reduction radiator temperature.
The third bulk that server work generates heat is directly passed to plate body by heat transmission, and plate body is as server
Carrier can directly absorb heat caused by server work, and water pump is opened at the water pump end of cooling-water duct, and water inlet pipe is from water
Water is drawn into blending bin at source, and pass through semiconductor chilling plate to cool down to the water in water inlet pipe, passes through atomization
Nozzle water is atomized after in blending bin, the second exhaust fan, which is kept watch, to be blown into blending bin, so as to be mixed to water and air
It closes, mixed liquid enters progress cooling cycle in cooled plate by cooling water pipeline, is mixed by water and air, can be with
Increase heat dissipation effect;The three-in-one that the present invention passes through wind-cooling heat dissipating, the heat dissipation that air-cooled and water cooling combines and radiator heat-dissipation
The heat that comprehensive radiating mode generates when working computer server radiates, and is effectively accomplished heat dissipation purpose, protects
The normal operation of computer server is protected.
Further, filter layer is equipped in first ventilation duct and the second ventilation duct, the filter layer includes strainer
Layer and active carbon layer.It prevents miscellaneous, dust from entering the inside of babinet, influences server work.
Further, point water plate is additionally provided in the plate body, the point water plate is equipped with through-hole, and the point water plate can
To play the role of a point water, through-hole makes water strengthen heat dissipation effect, and can play the work of Supporting plate full of entire cooling-water duct
With.
Further, first ventilation duct and the flexible connection of the second ventilation duct, just position repair and dismounting.
The present invention has an advantageous effect in that compared with prior art:
1st, heat point three bulks that server work generates are absorbed, and server work generates the first bulk of heat by the
One radiating subassembly absorbs, and opens the first exhaust fan of the bottom of box, the first exhaust fan is the air in babinet by being set on plate body
The ventilation hole extraction put, such box house lead to the air of heating in babinet because of heat that server work generates by the
One exhaust fan is extracted out, and in this process, the relatively cool air outside babinet enters box house by snorkel, is formed
Benign air-cooled cycle strengthens the heat dissipation effect of server.
The second bulk that server work generates heat is absorbed by the second radiating subassembly, and the heat that server work generates passes
It is delivered on radiator, is transmitted to outside case by heat-conducting plate, reduce the heat of box house, reduce internal temperature, favorably
It works in server.
The third bulk that server work generates heat is directly passed to plate body by heat transmission, and plate body is as server
Carrier can directly absorb heat caused by server work, and water pump is opened at the water pump end of cooling-water duct, and water inlet pipe is from water
Water is drawn into blending bin at source, and pass through semiconductor chilling plate to cool down to the water in water inlet pipe, passes through atomization
Nozzle water is atomized after in blending bin, the second exhaust fan, which is kept watch, to be blown into blending bin, so as to be mixed to water and air
It closes, mixed liquid enters progress cooling cycle in cooled plate by cooling water pipeline, is mixed by water and air, can be with
Increase heat dissipation effect;The three-in-one that the present invention passes through wind-cooling heat dissipating, the heat dissipation that air-cooled and water cooling combines and radiator heat-dissipation
The heat that comprehensive radiating mode generates when working computer server radiates, and is effectively accomplished heat dissipation purpose, protects
The normal operation of computer server is protected.Meanwhile mainly wind energy and tap water is utilized in the present invention so that of the invention
It is at low cost, but the effect reached is highly practical, is suitble to promote.
2nd, the lower section of second ventilation duct is equipped with deflector, and the deflector is inclined to be arranged on the side wall of babinet,
The high-end of deflector connects with the side wall of babinet, and the setting of deflector can prevent the cold air outside babinet from directly being passed through after coming in
The outflow of the gap between transverse slat is crossed, after setting deflector, the cold air come in by snorkel can fill after deflector water conservancy diversion
That divides flows out after server from the gap between transverse slat so that air cooling effect reaches best.Simultaneously as deflector
Setting, can cause the wind come in outside babinet to be come into full contact with after deflector water conservancy diversion with radiator, be dissipated into reducing as soon as possible
The temperature of hot device.
3rd, point water plate is additionally provided in the plate body, the point water plate is equipped with through-hole, and the point water plate can play
Divide the effect of water, through-hole makes water strengthen heat dissipation effect, and can play the role of Supporting plate full of entire cooling-water duct.
Description of the drawings
Fig. 1 is the structural diagram of the present invention.
Fig. 2 is the structure diagram of the cooled plate of the present invention.
It is marked in figure:1- babinets, 2- filter mesh layers, 3- active carbon layers, the first ventilation ducts of 4-, the second ventilation ducts of 5-, 6- ventilations
Pipe, 7- thermally conductive sheets, 8- case lids, 9- radiators, 10- deflectors, 11- water pumps, the first exhaust fans of 12-, 15- blending bins, 16- second
Exhaust fan, 17- connecting tubes, 18- atomizers, 19- semiconductor chilling plates, 20- water inlet pipes, 21- cooled plates, 22- plate bodys, 23-
Cooling-water duct, 24- point water plates, 25- through-holes, 26- ventilation holes.
Specific embodiment
With reference to embodiment, the invention will be further described, and described embodiment is only a present invention part
Embodiment is not whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making
Other embodiments used obtained under the premise of creative work, belong to protection scope of the present invention.
Embodiment:
As shown in Figs. 1-2, a kind of compound server radiating case, including babinet 1, the top of babinet 1 is equipped with case lid 8,
It is characterized in that, further include the first radiating subassembly, the second radiating subassembly and third radiating subassembly, the first radiating subassembly includes snorkel
6 and first exhaust fan 12, the snorkel 6 include the first ventilation duct 4 and the second ventilation duct 5, first ventilation duct 4 is tilted towards
On be arranged on case lid 8, second ventilation duct 5 is arranged on the interior of babinet 1 through the roof of babinet 1 along vertical direction
Portion, first ventilation duct 4 are connected with the second ventilation duct 5;First ventilation duct 4 of the present embodiment and 5 activity of the second ventilation duct are even
It connects, just position repair and dismounting.Filter layer is equipped in first ventilation duct, 4 and second ventilation duct 5, the filter layer includes filter
Stratum reticulare 2 and active carbon layer 3.It prevents miscellaneous, dust from entering the inside of babinet 1, influences server work.Second ventilation duct 5
Lower section be equipped with deflector 10, the deflector 10 is inclined to be arranged on the side wall of babinet 1, the high-end and babinet of deflector 10
1 side wall connects, and first exhaust fan 12 is arranged on the bottom of babinet 1;
Second radiating subassembly includes radiator 9 and thermally conductive sheet 7, and the radiator 9 is arranged on the roof of babinet 1, heat conduction
One end of piece 7 is arranged on radiator 9, and the other end of thermally conductive sheet 7 is arranged on through case lid 8 outside case lid 8;
Third dissipates radiating subassembly and includes cooled plate 21, blending bin 15, the second exhaust fan 16, semiconductor chilling plate 19 and mist
Change nozzle 18, the cooled plate 21 includes plate body 22, cooling-water duct 23, the plate body 22 are provided in the plate body 22
Point water plate 24 is inside additionally provided with, the point water plate 24 is equipped with through-hole 25, and the point water plate 24 can play the role of a point water, leads to
Hole 25 makes water strengthen heat dissipation effect, and can play the role of Supporting plate 22 full of entire cooling-water duct 23.On plate body 22
The side of cooling-water duct 23 be equipped with the ventilation hole 26 set through plate body 22, the side of babinet 1 is run through at the both ends of the plate body 22
Wall is set, and one end of the cooling-water duct 23 is connected in the right wall of blending bin 15, the other end connection of cooling-water duct 23
There is water pump 11;It is connected in the left wall of blending bin 15 by connecting tube 17 with the second exhaust fan 16, on the roof roof of blending bin 15
It is connected by connecting tube 17 with atomizer 18, the other end of atomizer 18 is connected with water inlet pipe 20, semiconductor chilling plate 19
It is arranged on the bottom of water inlet pipe 20.
The operation principle of the present invention:The novel server radiator of invention is placed on babinet 1 at work, server
In interior cooled plate 21, three bulks of heat point that server work generates are absorbed, and the first of server work generation heat is big
Block is absorbed by the first radiating subassembly, opens the first exhaust fan 12 of 1 bottom of babinet, the first exhaust fan 12 is the air in babinet 1
It is extracted out by the ventilation hole 26 set on plate body 22, such 1 inside of babinet leads to case because of the heat of server work generation
The air of heating is extracted out by the first exhaust fan 12 in body 1, and in this process, the relatively cool air outside babinet 1 is by logical
Tracheae 6 is entered inside babinet 1, forms benign air-cooled cycle, strengthens the heat dissipation effect of server.
The second bulk that server work generates heat is absorbed by the second radiating subassembly, and the heat that server work generates passes
It is delivered on radiator 9, is transmitted to outside case by heat-conducting plate, reduce the heat inside babinet 1, reduce internal temperature, have
It works conducive to server.Meanwhile the lower section of second ventilation duct 5 is equipped with deflector 10, the 10 inclined setting of deflector
On the side wall of babinet 1, the side wall of the high-end and babinet 1 of deflector 10 connects, and the setting of deflector 10 can be prevented outside babinet 1
The cold air in portion is directly over the gap outflow between transverse slat after coming in, after setting deflector 10, come in by snorkel 6 cold
Air can adequately flow out after 10 water conservancy diversion of deflector after server from the gap between transverse slat so that air cooling effect
Reach best.Simultaneously as the setting of deflector 10, can cause the wind come in outside babinet 1 after 10 water conservancy diversion of deflector
It is come into full contact with radiator 9, into the temperature for reducing radiator 9 as soon as possible.
The third bulk that server work generates heat is directly passed to plate body 22 by heat transmission, and plate body 22 is as service
The carrier of device can directly absorb heat caused by server work, and water pump 11 is opened at 11 end of water pump of cooling-water duct 23,
Water inlet pipe 20 is drawn into water in blending bin 15 at water source, and pass through semiconductor chilling plate 19 can be in water inlet pipe 20
Water cools down, and is arrived in blending bin 15 after being atomized by atomizer 18 to water, the second exhaust fan 16, which is kept watch, is blown into mixing
In case 15, so as to be mixed to water and air, mixed liquid is entered in cooled plate 21 by cooling water pipeline and is carried out
Cooling cycle is mixed by water and air, can increase heat dissipation effect;The present invention is combined by wind-cooling heat dissipating, air-cooled and water cooling
Heat dissipation and the heat that generates when working computer server of the three-in-one comprehensive radiating mode that radiates of radiator 9
It radiates, is effectively accomplished heat dissipation purpose, protect the normal operation of computer server.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should all be included in the protection scope of the present invention.
Claims (4)
1. a kind of compound server radiating case, including babinet (1), the top of babinet (1) is equipped with case lid (8), which is characterized in that
The first radiating subassembly, the second radiating subassembly and third radiating subassembly are further included, the first radiating subassembly includes snorkel (6) and first
Exhaust fan (12), the snorkel (6) include the first ventilation duct (4) and the second ventilation duct (5), and first ventilation duct (4) is inclined
Being arranged on case lid (8) obliquely, second ventilation duct (5) are arranged on along vertical direction through the roof of babinet (1)
The inside of babinet (1), first ventilation duct (4) connect with the second ventilation duct (5);It is set below second ventilation duct (5)
There is deflector (10), the deflector (10) is inclined to be arranged on the side wall of babinet (1), the high-end and babinet of deflector (10)
(1) side wall connects, and first exhaust fan (12) is arranged on the bottom of babinet (1);
Second radiating subassembly includes radiator (9) and thermally conductive sheet (7), and the radiator (9) is arranged on the roof of babinet (1),
One end of thermally conductive sheet (7) is arranged on radiator (9), and the other end of thermally conductive sheet (7) is arranged on case lid (8) outside through case lid (8);
Third dissipate radiating subassembly include cooled plate (21), blending bin (15), the second exhaust fan (16), semiconductor chilling plate (19) and
Atomizer (18), the cooled plate (21) include plate body (22), and cooling-water duct (23) is provided in the plate body (22),
The ventilation hole (26) through plate body (22) setting is equipped with beside cooling-water duct (23) on plate body (22), the plate body (22)
Both ends are set through the side wall of babinet (1), and one end of the cooling-water duct (23) is connected in the right wall of blending bin (15), cold
But the other end of aquaporin (23) is connected with water pump (11);Pass through connecting tube (17) and the second exhausting in the left wall of blending bin (15)
Machine (16) is connected, and is connected on the roof roof of blending bin (15) by connecting tube (17) with atomizer (18), atomizer
(18) the other end is connected with water inlet pipe (20), and semiconductor chilling plate (19) is arranged on the bottom of water inlet pipe (20).
A kind of 2. compound server radiating case according to claim 1, which is characterized in that first ventilation duct (4)
Be equipped with filter layer in the second ventilation duct (5), the filter layer includes filter mesh layer (2) and active carbon layer (3).
3. a kind of compound server radiating case according to claim 1, which is characterized in that in the plate body (22)
Point water plate (24) is additionally provided with, the point water plate (24) is equipped with through-hole (25).
A kind of 4. compound server radiating case according to claim 1, which is characterized in that first ventilation duct (4)
It is flexibly connected with the second ventilation duct (5).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810239747.0A CN108255274A (en) | 2018-03-22 | 2018-03-22 | A kind of compound server radiating case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810239747.0A CN108255274A (en) | 2018-03-22 | 2018-03-22 | A kind of compound server radiating case |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108255274A true CN108255274A (en) | 2018-07-06 |
Family
ID=62746095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201810239747.0A Withdrawn CN108255274A (en) | 2018-03-22 | 2018-03-22 | A kind of compound server radiating case |
Country Status (1)
Country | Link |
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CN (1) | CN108255274A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109062375A (en) * | 2018-08-21 | 2018-12-21 | 河南省云乐科技有限公司 | A kind of novel computer server radiating case |
CN110147151A (en) * | 2019-05-27 | 2019-08-20 | 运城学院 | A kind of computer host radiator |
-
2018
- 2018-03-22 CN CN201810239747.0A patent/CN108255274A/en not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109062375A (en) * | 2018-08-21 | 2018-12-21 | 河南省云乐科技有限公司 | A kind of novel computer server radiating case |
CN110147151A (en) * | 2019-05-27 | 2019-08-20 | 运城学院 | A kind of computer host radiator |
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Application publication date: 20180706 |