CN110147151A - A cooling device for a computer mainframe - Google Patents

Abstract

The invention discloses a cooling device for a computer mainframe, and relates to the technical field of computer mainframes. The invention includes a main casing, a cover body, a main board cooling assembly, an air intake assembly and an air exhaust assembly. The inner wall of the main casing is fixed with a main board heat conduction shell, a cold water shell and a cold air shell. The baffles, several first baffles form a plurality of diversion cavities on the heat conduction shell of the main board, the opposite sides of the plurality of diversion cavities are fixed and communicated with water pipes, and the opposite inner walls of the cold water shell are fixed with second baffles. The present invention can carry out water-cooling treatment through the cooperative use of silica gel plate, copper plate, heat conduction plate, micro-water pump, water pipe, diversion chamber, S-shaped water guide chamber and semiconductor refrigeration sheet, through exhaust fan, air inlet pipe, air inlet assembly, The cooperating use of the semi-conductor refrigerating sheet, the air outlet pipe and the exhaust assembly can carry out air-cooling treatment, which solves the problem of poor heat dissipation effect of the existing computer mainframe.

Description

A cooling device for a computer mainframe

technical field

The invention belongs to the technical field of computer mainframes, in particular to a cooling device for computer mainframes.

Background technique

The heat dissipation inside the existing computer mainframe adopts air-cooling or water-cooling or a combination of air-cooling and water-cooling for heat dissipation treatment. The water cooling is mainly for the processor to dissipate heat, and the air cooling is mainly for the air circulation inside and outside the chassis. The heat dissipation effect is insufficient, and when using air cooling at the same time, it will bring in dust and impurities from the outside, which will affect the use of the host.

Contents of the invention

The purpose of the present invention is to provide a cooling device for a computer mainframe, which can be water-cooled through the cooperation of silica gel plate, copper plate, heat conduction plate, micro water pump, water pipe, diversion cavity, S-shaped water guide cavity and semiconductor refrigeration sheet. The combined use of the exhaust fan, the air inlet pipe, the air inlet assembly, the semiconductor cooling sheet, the air outlet pipe and the air exhaust assembly can carry out air cooling treatment, which solves the problem of poor heat dissipation effect of the existing computer mainframe.

In order to solve the problems of the technologies described above, the present invention is achieved through the following technical solutions:

The present invention is a heat dissipation device for a computer mainframe, comprising a main casing, a cover, a main board heat dissipation assembly, an air intake assembly and an air exhaust assembly;

An inner wall of the main housing is fixed with a main board heat conduction shell, a cold water shell and a cold air shell;

A plurality of first baffles are fixed side by side on the inner wall of the heat conducting shell of the main board, and the first baffles form a plurality of diversion chambers on the heat conduction shell of the main board, and the opposite sides of the plurality of diversion chambers are fixedly connected with water pipes;

The opposite inner wall of the cold water shell is fixed with a second baffle, and the two second baffles form the cold water shell into an S-shaped water guide chamber, and the water inlet of the S-shaped water guide chamber is communicated with a water pipe through a pipe, so that The water outlet of the S-shaped water guide chamber is communicated with another water pipe through a pipeline, and a micro-pump is fixedly connected between the S-shaped water guide chamber and the water pipe;

A serpentine heat dissipation pipe is fixed inside the cold air shell, and a plurality of semiconductor cooling fins are fixed on the inner bottom surface of the cold air shell and the inner bottom surface of the cold water shell. An air inlet pipe, one end of the air outlet of the serpentine heat dissipation pipe runs through the other side of the cold air shell and is fixedly connected with an air outlet pipe, and the connection between the air outlet pipe and the serpentine heat dissipation pipe is connected with an exhaust fan;

A surface of the cover body is fixedly connected with a surface of the main casing, and a plurality of first through holes are opened on the cover body;

The heat dissipation component of the main board includes a silica gel plate, one surface of the silica gel plate is fixedly connected with a surface of the cover body, a copper plate is inlaid and fixed on the bottom surface of the silica gel plate, a plurality of heat conducting plates are fixed on one surface of the copper plate, and one end of the heat conducting plate penetrates The first through hole is located inside the diversion chamber;

The air intake assembly includes a ventilation shell, one end of the ventilation shell is fixedly connected with a connecting pipe, and a side of the ventilation shell is provided with a number of ventilation holes side by side, and the structural features of the air intake assembly are the same as those of the exhaust assembly .

Further, one end of the upper connecting pipe of the air inlet assembly is fixedly communicated with one end of the air inlet pipe through a quick-connect joint, and one end of the upper connecting pipe of the air exhaust assembly is fixedly communicated with one end of the air outlet pipe through a quick-connect joint.

Further, a set of second through holes is opened on a surface of the cover body, and one end of the air inlet pipe and the air outlet pipe respectively pass through the cover body through the two second through holes.

Further, several annular holes are opened on the silica gel plate, and several threaded sleeves are fixed on one surface of the cover body, and the annular holes and the threaded sleeves are in clearance fit, and the length of the threaded sleeves is the same as the thickness of the silica gel plate, several The first through hole is located in the middle of several threaded sleeves.

Further, a rubber plate is fixed on the inner side of the cover, and the heat conduction shell of the main board, the cold water shell and the cold air shell are sealed with the cover through the rubber plate.

Further, several heat conduction plates are arranged in several rows, and the several rows of heat conduction plates are arranged at intervals by the first heat conduction plate and the second heat conduction plate, and the first heat conduction plate and the second heat conduction plate are distributed in a figure-eight shape.

Further, the inner diameters of the several ventilation holes increase sequentially from the end of the ventilation shell with the connecting pipe to the other end of the ventilation shell, and the increasing range is in the range of 0.2-0.4 cm.

Further, several thread lugs are fixed on opposite sides of the ventilation shell.

Further, the side surfaces of the heat conduction shell of the main board, the cold water shell and the cold air shell are all covered with a heat insulation layer, and the serpentine heat dissipation pipe is a copper pipe structure.

The present invention has the following beneficial effects:

1. The present invention can discharge heat to the water in the diversion cavity through the silica gel plate, copper plate and heat conduction plate, and can form the water circulation between the diversion cavity and the S-shaped water diversion cavity through the micro water pump and the water pipe, and pass through the cold water shell The advanced semiconductor cooling chip can refrigerate the water in the S-shaped water guide chamber, and can perform water cooling treatment. The heat on the motherboard can be efficiently guided to the inside of the guide chamber through the silica gel plate and copper plate, improving the water cooling effect on the host.

2. The present invention discharges the hot gas in the chassis into the serpentine heat dissipation pipe through the exhaust fan, the air inlet pipe and the air inlet assembly, and the gas in the serpentine heat dissipation pipe can be cooled by the semiconductor refrigeration sheet in the cold air shell and the water in the cold air shell. For refrigeration treatment, the cold air can be discharged through the air outlet pipe and exhaust components to form air circulation, and air cooling treatment can be carried out. The combination of water cooling and air cooling greatly improves the heat dissipation effect of the main unit and improves the use effect of the main unit , while using this device for air cooling, there is no need to use hollow holes to communicate with the outside world, so as to avoid the situation that external dust and impurities enter the chassis.

Of course, any product implementing the present invention does not necessarily need to achieve all the above-mentioned advantages at the same time.

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the accompanying drawings that are required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. Those of ordinary skill in the art can also obtain other drawings based on these drawings without any creative effort.

Fig. 1 is the structural representation of a kind of computer host cooling device of the present invention;

Figure 2 is an exploded view of the structure of Figure 1;

Fig. 3 is a structural schematic diagram of the main housing;

Fig. 4 is the structural representation of cover body;

FIG. 5 is a schematic structural diagram of a mainboard cooling assembly;

Figure 6 is a schematic structural view of the air inlet assembly;

In the accompanying drawings, the list of parts represented by each label is as follows:

1-Main shell, 2-Cover body, 3-Main board heat dissipation component, 4-Inlet component, 5-Exhaust component, 101-Main board heat conduction shell, 102-Cold water shell, 103-Cool air shell, 104-First gear Plate, 105-flow guide chamber, 106-water pipe, 107-second baffle, 108-S-shaped water guide chamber, 109-miniature water pump, 110-snake heat pipe, 111-semiconductor cooling plate, 112-air intake Pipe, 113-air outlet pipe, 114-exhauster fan, 201-first through hole, 202-second through hole, 203-thread sleeve, 301-silica gel plate, 302-copper plate, 303-heat conduction plate, 304-ring hole , 401-ventilation shell, 402-connecting pipe, 403-ventilation hole, 404-thread lug.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

Please refer to Figs. 1-6, the present invention is a cooling device for a computer mainframe, including a main casing 1, a cover 2, a motherboard cooling assembly 3, an air inlet assembly 4 and an exhaust assembly 5;

The inner wall of the main shell 1 is fixed with a main board heat conduction shell 101, a cold water shell 102 and a cold air shell 103. The main shell 1 is fitted with the case in a gap, and the main shell 1 is fixedly connected with the inner wall of the case by bolts. The installation position is the original main board of the existing case the installation location;

A plurality of first baffles 104 are fixed side by side on the inner wall of the heat conduction shell 101 of the main board. The first baffles 104 form a plurality of diversion cavities 105 on the heat conduction shell 101 of the main board.

The opposite inner wall of the cold water shell 102 is fixed with a second baffle 107, and the two second baffles 107 form the cold water shell 102 into an S-shaped water guide chamber 108, and the water inlet of the S-shaped water guide chamber 108 is communicated with a water pipe 106 through a pipeline. The water outlet of the S-shaped water guide chamber 108 communicates with another water pipe 106 through a pipeline, and a micro-water pump 109 is fixedly connected between the S-shaped water guide chamber 108 and the water pipe 106;

A serpentine heat dissipation pipe 110 is fixed inside the cold air casing 103, and a plurality of semiconductor cooling fins 111 are fixed on the inner bottom surface of the cold air casing 103 and the inner bottom surface of the cold water casing 102. There is an air inlet pipe 112, one end of the air outlet of the serpentine heat dissipation pipe 110 runs through the other side of the cold air shell 103 and is fixedly connected with an air outlet pipe 113, and the connection between the air outlet pipe 113 and the serpentine heat dissipation pipe 110 is connected with an exhaust fan 114;

A surface of the cover body 2 is fixedly connected with a surface of the main casing 1, and a plurality of first through holes 201 are opened on the cover body 2;

The motherboard cooling assembly 3 includes a silica gel plate 301, one surface of the silica gel plate 301 is fixedly connected with the other surface of the cover body 2, a copper plate 302 is embedded and fixed on the bottom surface of the silica gel plate 301, and a plurality of heat conduction plates 303 are fixed on the surface of the copper plate 302, and one end of the heat conduction plate 303 runs through the first A through hole 201 is located inside the diversion chamber 105;

The air intake assembly 4 includes a ventilation shell 401, one end of the ventilation shell 401 is fixedly connected with a connecting pipe 402, and one side of the ventilation shell 401 is provided with a number of ventilation holes 403 side by side. The structural features of the air intake assembly 4 are the same as those of the exhaust assembly 5 , the ventilation shell 401 on the air inlet assembly 4 and the air exhaust assembly 5 is fixedly connected to an opposite inner wall of the chassis through threaded lugs 404 and bolts.

Wherein as shown in Figure 1, one end of the connecting pipe 402 on the air inlet assembly 4 is fixedly communicated with one end of the air inlet pipe 112 through a quick-connect joint, and one end of the connecting pipe 402 on the exhaust assembly 5 is fixedly communicated with one end of the air outlet pipe 113 through a quick-connect joint .

As shown in FIG. 1 and FIG. 4 , a set of second through holes 202 is opened on one surface of the cover body 2 , and one end of the air inlet pipe 112 and the air outlet pipe 113 respectively pass through the cover body 2 through the two second through holes 202 .

Wherein as shown in Figure 1 and Figure 5, offer some annular holes 304 on the silica gel plate 301, cover body 2 one surface is fixed with some threaded sleeves 203, annular hole 304 and threaded sleeves 203 clearance fits, the length of threaded sleeves 203 and silica gel The boards 301 have the same thickness, and the several first through holes 201 are located in the middle of the several threaded sleeves 203 .

Wherein, a rubber plate is fixed on the inner surface of the cover body 2 , and the heat conduction shell 101 of the main board, the cold water shell 102 and the cold air shell 103 are sealed with the cover body 2 through the rubber plate.

As shown in FIG. 5 , several heat conducting plates 303 are arranged in several rows, and several rows of heat conducting plates 303 are arranged at intervals by first heat conducting plates and second heat conducting plates, and the first heat conducting plates and the second heat conducting plates are arranged in a figure-eight shape.

As shown in FIG. 6 , the inner diameters of the ventilation holes 403 increase sequentially from the end of the ventilation shell 401 with the connecting pipe 402 to the other end of the ventilation shell 401, and the increasing range is in the range of 0.2-0.4 cm.

Wherein, as shown in FIG. 6 , a plurality of threaded lugs 404 are fixed on opposite sides of the ventilation shell 401 .

Wherein, the sides of the main board heat conduction shell 101 , the cold water shell 102 and the cold air shell 103 are covered with a heat insulating layer, and the serpentine heat dissipation pipe 110 is a copper pipe structure.

A specific application of this embodiment is: the heat dissipation method of the chassis is a combination of water cooling and air cooling. In the water, the micro-water pump 109 pumps out the water in the guide chamber 105 through the water pipe 106 and discharges it into the S-shaped water guide chamber 108 in the cold water shell 102. The water is refrigerated, and the refrigerated water flows back into the diversion cavity 105 through the water pipe 106 to form a water cycle, which can be used for water cooling.

During air-cooling and heat dissipation, the exhaust fan 114 extracts the hot gas in the chassis through the air inlet pipe 112 and the air inlet assembly 4, and discharges it into the serpentine heat dissipation pipe 110. The water is refrigerated, and the cold water in the cold air shell 103 refrigerates the gas in the serpentine heat dissipation pipe 110, and the cold air flows back into the chassis through the air outlet pipe 113 and the exhaust assembly 5, so that air cooling can be performed.

In the description of this specification, descriptions with reference to the terms "one embodiment", "example", "specific example" and the like mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment of the present invention. In an embodiment or example. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the invention disclosed above are only to help illustrate the invention. The preferred embodiments are not exhaustive in all detail, nor are the inventions limited to specific embodiments described. Obviously, many modifications and variations can be made based on the contents of this specification. This description selects and specifically describes these embodiments in order to better explain the principle and practical application of the present invention, so that those skilled in the art can well understand and utilize the present invention. The invention is to be limited only by the claims, along with their full scope and equivalents.

Claims (9)

1. a kind of computer host radiator, it is characterised in that: including main casing (1), lid (2), mainboard radiating subassembly (3), air intake assembly (4) and air draft component (5)；

(1) one inner wall of main casing is fixed with the thermally conductive shell of a mainboard (101), cold water shell (102) and cold wind shell (103)；

Thermally conductive (101) one inner wall of shell of mainboard is fixed with several first baffles (104) side by side, several first baffles (104) the thermally conductive shell of mainboard (101) is formed into several diversion cavities (105), several (105) one opposite sides of diversion cavity are fixed to be connected It is connected with water service pipe (106)；

(102) one opposed inner walls of cold water shell are respectively and fixedly provided with second baffle (107), and two second baffles (107) are by cold water Shell (102) forms S-shaped water-guiding cavity (108), and the water inlet of the S-shaped water-guiding cavity (108) is connected by pipeline and a water service pipe (106) Logical, the water outlet of the S-shaped water-guiding cavity (108) is connected to by pipeline with another water service pipe (106), the S-shaped water-guiding cavity (108) Fixation is communicated with micro pump (109) between water service pipe (106)；

It is fixed with serpentine fin pipe (110) in the cold wind shell (103), cold wind shell (103) inner bottom surface and cold water shell (102) Inner bottom surface is fixed with several semiconductor chilling plates (111), and cold wind shell is run through in air inlet one end of the serpentine fin pipe (110) (103) side and fixation is communicated with a blast pipe (112), cold wind shell is run through in gas outlet one end of the serpentine fin pipe (110) (103) other side and fixation be communicated with a discharge pipe (113), the junction of the discharge pipe (113) and serpentine fin pipe (110) It is communicated with exhaust fan (114)；

(2) one surface of lid is fixedly connected with (1) one surface of main casing, and it is logical that several first are offered on the lid (2) Hole (201)；

The mainboard radiating subassembly (3) includes silica gel plate (301), and (301) one surface of silica gel plate and (2) one surface of lid are solid Fixed connection, silica gel plate (301) bottom surface, which is inlayed, to be fixed with a copper sheet (302), and (302) one surface of copper sheet is fixed with several Heat-conducting plate (303), described heat-conducting plate (303) one end is through first through hole (201) and is located at diversion cavity (105) inside；

The air intake assembly (4) includes ventilation shell (401), and (401) one end face of the ventilation shell fixation is communicated with a connecting tube (402), ventilation shell (401) one side offers several ventilation holes (403) side by side, and the structure of the air intake assembly (4) is special It levies identical as the structure feature of air draft component (5).

2. a kind of computer host radiator according to claim 1, which is characterized in that on the air intake assembly (4) Connecting tube (402) one end is connected to by quick union with the fixation of blast pipe (112) one end, air draft component (5) upper connector (402) one end is connected to by quick union with the fixation of discharge pipe (113) one end.

3. a kind of computer host radiator according to claim 1, which is characterized in that (2) one surface of lid One group of second through-hole (202) is offered, the blast pipe (112) and discharge pipe (113) one end pass through two second through-holes respectively (202) run through lid (2).

4. a kind of computer host radiator according to claim 1, which is characterized in that on the silica gel plate (301) It offers several looping pits (304), (2) one surface of lid is fixed with several thread bush (203), the looping pit (304) It is identical as the thickness of silica gel plate (301) as the length of thread bush (203) clearance fit, the thread bush (203), several described One through-hole (201) is located at the position in the middle part of several thread bush (203).

5. a kind of computer host radiator according to claim 1, which is characterized in that lid (2) medial surface It is fixed with a rubber slab, the thermally conductive shell of mainboard (101), cold water shell (102) and cold wind shell (103) pass through rubber slab and lid (2) it seals.

6. a kind of computer host radiator according to claim 1, which is characterized in that several heat-conducting plates (303) it being arranged in several rows, heat-conducting plate (303) described in several rows is spaced apart arrangement by the first heat-conducting plate and the second heat-conducting plate, First heat-conducting plate and the second heat-conducting plate are distributed in splayed.

7. a kind of computer host radiator according to claim 1, which is characterized in that several ventilation holes (403) inner diameter size is sequentially increased from ventilation shell (401) with connecting tube (402) one end to shell of divulging information (401) other end, is increased Range of the big range in 0.2-0.4cm.

8. a kind of computer host radiator according to claim 1, which is characterized in that the ventilation shell (401) one Opposite side is respectively and fixedly provided with several screw thread trunnions (404).

9. a kind of computer host radiator according to claim 1, which is characterized in that the thermally conductive shell of mainboard (101), cold water shell (102) and all sides of cold wind shell (103) are coated with thermal insulation layer, and the serpentine fin pipe (110) is copper pipe Structure.