CN108170239A - A kind of water-filled radiator for being used to dig ore deposit device - Google Patents
A kind of water-filled radiator for being used to dig ore deposit device Download PDFInfo
- Publication number
- CN108170239A CN108170239A CN201810091355.4A CN201810091355A CN108170239A CN 108170239 A CN108170239 A CN 108170239A CN 201810091355 A CN201810091355 A CN 201810091355A CN 108170239 A CN108170239 A CN 108170239A
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- chip
- plate
- heat
- power plate
- water
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a kind of water-filled radiator for being used to dig ore deposit device.The present invention includes multi-chip and calculates power plate, cooled plate, cooling fin and air cooler, and the air cooler is calculated power plate with multi-chip and connect；The chip that the multi-chip is calculated on power plate is corresponded with the cooling fin, and the multi-chip calculates power plate both sides and is connected with cooled plate, forms sandwich connection.Cooled plate and multi-chip of the present invention are calculated power plate and are assembled with sandwich, centre can connect heat conduction note or heat-conducting silicone grease, multi-chip calculates power plate both sides and is respectively connected with cooled plate, ensure that multi-chip calculates power plate front and cooled plate heat dissipation may be used in the back side, the chip that two-side radiation can calculate multi-chip power plate carries out good heat dissipation.
Description
Technical field
The invention belongs to dig mining industry business data processing field, and in particular to a kind of water-filled radiator for being used to dig ore deposit device.
Background technology
It is increasing for digging the electronic equipment demand of ore deposit with the continuous development of distributed virtual currency technology, but
It is since this equipment is integrated with a large amount of chip unit on one piece of circuit board, and these chip power-consumptions are big, and dense degree is high,
Cause temperature could to be controlled in the reasonable scope, by bringing huge noise a bit using high-revolving air cooler.
Very big due to digging ore deposit circuit power consumption, the huge noise of violence fan limits such equipment application in ordinary people,
Can not realize distributed virtual currency core concept everybody can dig the theory of ore deposit, for concentrate dig ore deposit mining site for, it is huge
Big noise is also that harm is huge for the physical and mental health of administrative staff.
At present in the digging ore deposit equipment of multi-chip circuit board all using be cooling fin cooperation fan by the way of, do not have
By the way of cooled plate heat dissipation.
Invention content
The object of the present invention is to provide a kind of for digging the water-filled radiator of ore deposit device, to overcome above-mentioned deficiency.
To achieve the above object, technical solution of the invention is：
A kind of water-filled radiator for being used to dig ore deposit device, including cooling fin；
Multi-chip calculates power plate, and the chip that the multi-chip is calculated on power plate connects one to one with the cooling fin；
Cooled plate, the multi-chip are calculated power plate both sides and are bonded with cooled plate, form sandwich connection；
Fixed clamping device, the fixed clamping device is for fixing the cooling fin, multi-chip calculates power plate and cooled plate；
Air cooler, the air cooler are calculated power plate with multi-chip and are connect, and positioned at the outside of the fixed clamping device.
The huge noise for using cooled plate generate when heat dissipation can be avoided and be radiated using common water cooling equipment, and
The temperature that multi-chip can be calculated power plate by cooled plate is preferably controlled, and improves the service life of chip；Multi-chip calculates power plate two
Side is connect with cooled plate, forms sandwich connection, it is ensured that multi-chip calculates power plate front and cooled plate may be used in the back side
Heat dissipation, two-side radiation can carry out good heat dissipation to operation chip.
Preferably, the cooling fin is connected by heat conduction patch or heat conductive silica gel with cooled plate.
Preferably, the cooled plate, heat conduction patch or heat conductive silica gel, cooling fin, multi-chip calculation power plate, cooled plate connect successively
It connects, forms a heat-sink unit.
Preferably, the fixed clamping device includes two clamping plates thirty years of age opposite and several cross bars；The two clamping plates
The upper and lower part placed vertically is equipped with mutual corresponding through-hole；The cross bar passes through mutual corresponding through-hole on clamping plate, forms
One cube shaped fixed clamping device.
Preferably, the width between the fixed clamping device middle and upper part and lower crosspiece and the heat-sink unit are put vertically
That puts is highly consistent.
Preferably, the heat-sink unit is placed in fixed clamping device vertically, will by adjusting the distance of two clamping plates
The heat-sink unit is fixed.
Preferably, the heat-sink unit is at least 2.
Preferably, the air cooler includes fan and wind scooper.
During installation, cooled plate is assembled first, reassembles heat conduction patch or heat conductive silica gel, cooling fin, multi-chip calculate power plate；Again according to
Secondary assembling cooled plate, heat conduction patch or heat conductive silica gel, cooling fin, multi-chip calculate power plate, ensure between arbitrary two pieces of cooled plates
Form a heat-sink unit.Than calculating more than power plate one piece, ensureing that multi-chip calculates power plate front and the back side can be with for the quantity of cooled plate
It is radiated using cooled plate, two-side radiation can carry out good heat dissipation to operation chip.Heat-sink unit is placed on fixes to clamp vertically
In device, by adjusting the distance of two clamping plates, heat-sink unit is fixed.
The beneficial effects of the invention are as follows：
(1) cooled plate and multi-chip are calculated power plate and are assembled with sandwich, and centre can connect heat conduction note or heat-conducting silicone grease, more
Chip calculates power plate both sides and is respectively connected with cooled plate, ensures that multi-chip calculates power plate front and cooled plate heat dissipation may be used in the back side,
The chip that two-side radiation can calculate multi-chip power plate carries out good heat dissipation.
(2) individual water can be may be used for personal user to avoid huge noise is sent out using cooled plate heat dissipation
Pump and radiator radiate；Water-filled radiator by water segregator can be concentrated by the user of batch and radiated.
(3) present invention exports the heat for digging ore deposit electronic equipment by cooled plate, which can be warmed oneself with winter；It is right
In centralized mining site, circulating cooling tower may be used or ground source heat pump technology concentrates cooling, realize energy-saving and environment-friendly effect.
Description of the drawings
Fig. 1 is the structure diagram of the present invention.
In figure：1. fixed clamping device；2. cooled plate；3. multi-chip calculates power plate；4. cooling fin；5. heat conduction patch or thermal conductive silicon
Glue；6. wind scooper；7. fan；8. cross bar；9. clamping plate.
Specific embodiment
The present invention is a kind of for digging the water-filled radiator of ore deposit device by providing, and solves radiator of the prior art
The problem of heat dissipation effect is bad, and the air cooler used produces a thundering noise.
In order to solve the above-mentioned technical problem, technical solution general thought provided by the embodiments of the present application is as follows：
A kind of water-filled radiator for being used to dig ore deposit device, including
Cooling fin；
Multi-chip calculates power plate, and the chip that the multi-chip is calculated on power plate connects one to one with the cooling fin；
Cooled plate, the multi-chip are calculated power plate both sides and are bonded with cooled plate, form sandwich connection；
Fixed clamping device, the fixed clamping device is for fixing the cooling fin, multi-chip calculates power plate and cooled plate；
Air cooler, the air cooler are calculated power plate with multi-chip and are connect, and positioned at the outside of the fixed clamping device.
The huge noise for using cooled plate generate when heat dissipation can be avoided and be radiated using common water cooling equipment, and
The temperature that multi-chip can be calculated power plate by cooled plate is preferably controlled, and improves the service life of chip；Multi-chip calculates power plate two
Side is connect with cooled plate, forms sandwich connection, it is ensured that multi-chip calculates power plate front and cooled plate may be used in the back side
Heat dissipation, two-side radiation can carry out good heat dissipation to operation chip.
In order to better understand the above technical scheme, above-mentioned technical proposal is carried out below in conjunction with specific embodiment
It is described in detail, it should be understood that the specific features in the embodiment of the present invention and embodiment are to the detailed of technical scheme
Illustrate rather than the restriction to technical scheme, in the absence of conflict, in the embodiment of the present application and embodiment
Technical characteristic can be combined with each other.
The present invention and its specific embodiment are described in further detail below in conjunction with the accompanying drawings.
Embodiment 1
As shown in Figure 1, the present invention calculates power plate 3 for digging the water-filled radiator of ore deposit device, including multi-chip, cooled plate 2, dissipates
Backing 4, fixed clamping device 1, fan 7 and wind scooper 6, the fan 7 and wind scooper 6 are calculated power plate 3 with multi-chip and are connect；It is described
The chip that multi-chip is calculated on power plate 3 is corresponded with the cooling fin 4, and the multi-chip calculates 3 both sides of power plate and 2 phase of cooled plate
Even, sandwich connection is formed, the fixed clamping device 1 is for fixing the cooling fin 4, multi-chip calculates power plate 3 and cooled plate
2。
The huge noise for using cooled plate 2 generate when heat dissipation can be avoided and be radiated using common water cooling equipment is asked
Topic, and cooled plate 2 can preferably be controlled the temperature of multi-chip calculation power plate 3, improve the service life of chip；Multi-chip
It calculates 3 both sides of power plate to connect with the formation of cooled plate 2 sandwich, it is ensured that multi-chip calculates 3 front of power plate and the back side may be used
Cooled plate 2 radiates, and two-side radiation can carry out good heat dissipation to operation chip.Multi-chip calculates chip and the copper on power plate 3
Or aluminium radiator fin 4 corresponds, avoid a monoblock cooling fin be bonded with all chips cause segment chip squeeze and damage core
The problem of piece.
Further, cooling fin 4 is connected by heat conduction patch or heat conductive silica gel 5 with cooled plate 2, conducive to cooling fin 4 and water cooling
Plate 2 is bonded to each other.
As seen from Figure 1, cooled plate 2, heat conduction patch or heat conductive silica gel 5, cooling fin 4, multi-chip calculate power plate 3, cooled plate 2 successively
Connection, forms a heat-sink unit, several heat-sink units form a water-filled radiator.
Water-filled radiator further includes fixed clamping device 1, for fixing heat-sink unit.
Further, the heat-sink unit installed in fixed clamping device 1 is at least 2.
Fixed clamping device 1 includes two clamping plates 9 thirty years of age opposite and several cross bars 8；The two clamping plates 9 are placed vertically
Upper and lower part be equipped with mutual corresponding through-hole；The cross bar 8 passes through mutual corresponding through-hole on clamping plate 9, forms one and stands
Cube shape fixed clamping device 1.Width and heat-sink unit between 1 middle and upper part of fixed clamping device and lower crosspiece 8 are put vertically
That puts is highly consistent.
Wherein, the heat-sink unit is placed on vertically in fixed clamping device 1, will by adjusting the distance of two clamping plates 9
The heat-sink unit is fixed.
During installation, cooled plate 2 and multi-chip are calculated power plate 3 and are assembled with sandwich, centre fitting heat dissipation 4, fitting heat conduction note or
Person's heat-conducting silicone grease 5.Cooled plate 2 is assembled first, reassembles heat conduction patch or heat conductive silica gel 5, cooling fin 4, multi-chip calculate power plate 3, then
Assemble cooled plate 2 successively, heat conduction patch or heat conductive silica gel 5, cooling fin 4, multi-chip calculate power plate 3, ensure arbitrary two pieces of cooled plates 2 it
Between can form a heat-sink unit.The quantity of cooled plate 2 ensures that multi-chip calculates 3 front of power plate and the back of the body than calculating more than 3 one pieces of power plate
Face may be used cooled plate 2 and radiate, and two-side radiation can carry out good heat dissipation to operation chip.Heat-sink unit is placed on vertically
In fixed clamping device 1, by adjusting the distance of two clamping plates 9, heat-sink unit is fixed.
The beneficial effects of the invention are as follows：
(1) cooled plate and multi-chip are calculated power plate and are assembled with sandwich, and centre can connect heat conduction note or heat-conducting silicone grease, more
Chip calculates power plate both sides and is respectively connected with cooled plate, ensures that multi-chip calculates power plate front and cooled plate heat dissipation may be used in the back side,
The chip that two-side radiation can calculate multi-chip power plate carries out good heat dissipation.
(2) individual water can be may be used for personal user to avoid huge noise is sent out using cooled plate heat dissipation
Pump and radiator radiate；Water-filled radiator by water segregator can be concentrated by the user of batch and radiated.
(3) present invention exports the heat for digging ore deposit electronic equipment by cooled plate, which can be warmed oneself with winter；It is right
In centralized mining site, circulating cooling tower may be used or ground source heat pump technology concentrates cooling, realize energy-saving and environment-friendly effect.
The foregoing is merely the embodiment of the present invention, are not intended to limit the scope of the invention, every to utilize this hair
The equivalent structure or equivalent flow shift that bright specification and accompanying drawing content are made directly or indirectly is used in other relevant skills
Art field, is included within the scope of the present invention.
Claims (8)
1. a kind of water-filled radiator for being used to dig ore deposit device, it is characterised in that：Including
Cooling fin；
Multi-chip calculates power plate, and the chip that the multi-chip is calculated on power plate connects one to one with the cooling fin；
Cooled plate, the multi-chip are calculated power plate both sides and are bonded with cooled plate, form sandwich connection；
Fixed clamping device, the fixed clamping device is for fixing the cooling fin, multi-chip calculates power plate and cooled plate；
Air cooler, the air cooler are calculated power plate with multi-chip and are connect, and positioned at the outside of the fixed clamping device.
2. the water-filled radiator according to claim 1 for being used to dig ore deposit device, it is characterised in that：The cooling fin is by leading
Heat posted or heat conductive silica gel are connected with cooled plate.
3. the water-filled radiator according to claim 2 for being used to dig ore deposit device, it is characterised in that：The cooled plate, heat conduction
Patch or heat conductive silica gel, cooling fin, multi-chip calculation power plate, cooled plate are sequentially connected, and form a heat-sink unit.
4. the water-filled radiator according to claim 1 for being used to dig ore deposit device, it is characterised in that：The fixed clamping device
Including two clamping plates thirty years of age opposite and several cross bars；The upper and lower part that the two clamping plates are placed vertically is equipped with and corresponds
Through-hole；The cross bar passes through mutual corresponding through-hole on clamping plate, forms a cube shaped fixed clamping device.
5. it is used to dig the water-filled radiator of ore deposit device according to 3 or 4 any one of them of claim, it is characterised in that：It is described solid
Determine the width between clamping device middle and upper part and lower crosspiece and the heat-sink unit place vertically it is highly consistent.
6. the water-filled radiator according to claim 5 for being used to dig ore deposit device, it is characterised in that：The heat-sink unit is vertical
It is placed in fixed clamping device, by adjusting the distance of two clamping plates, the heat-sink unit is fixed.
7. the water-filled radiator according to claim 6 for being used to dig ore deposit device, it is characterised in that：The heat-sink unit is at least
It is 2.
8. the water-filled radiator according to claim 1 for being used to dig ore deposit device, it is characterised in that：The air cooler includes
Fan and wind scooper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810091355.4A CN108170239A (en) | 2018-01-30 | 2018-01-30 | A kind of water-filled radiator for being used to dig ore deposit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810091355.4A CN108170239A (en) | 2018-01-30 | 2018-01-30 | A kind of water-filled radiator for being used to dig ore deposit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108170239A true CN108170239A (en) | 2018-06-15 |
Family
ID=62512801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810091355.4A Pending CN108170239A (en) | 2018-01-30 | 2018-01-30 | A kind of water-filled radiator for being used to dig ore deposit device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108170239A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108762452A (en) * | 2018-07-13 | 2018-11-06 | 华南理工大学 | A kind of container-type digs mine machine radiator and its heat dissipating method |
| CN110069115A (en) * | 2019-04-11 | 2019-07-30 | 杭州微兔科技有限公司 | A kind of digging mine formula heating system and preparation method |
| CN110671737A (en) * | 2019-10-17 | 2020-01-10 | 邬晨燚 | Block chain digging heater |
| WO2021258837A1 (en) * | 2020-06-22 | 2021-12-30 | 深圳比特微电子科技有限公司 | Liquid-cooling heat dissipation apparatus, liquid-cooling data processing device, and temperature equalization method |
| CN114564094A (en) * | 2022-02-28 | 2022-05-31 | 上海顺诠科技有限公司 | Server, water cooling assembly and water cooling plate assembly |
| US20230086448A1 (en) * | 2020-05-12 | 2023-03-23 | Shenzhen Microbt Electronics Technology Co., Ltd. | Liquid cooling plate suitable for liquid cooling heat dissipation of electronic device, and heat dissipation unit |
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| CN1485906A (en) * | 2002-09-24 | 2004-03-31 | ������������ʽ���� | Electronic equipment |
| US20120224328A1 (en) * | 2011-03-02 | 2012-09-06 | Siliconware Precision Industries Co., Ltd. | Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereof |
| CN106470537A (en) * | 2015-08-14 | 2017-03-01 | 中兴通讯股份有限公司 | Veneer liquid cooling heat radiation system and rack |
| CN106486433A (en) * | 2016-12-30 | 2017-03-08 | 株洲时代金属制造有限公司 | Igbt radiator |
| CN207731226U (en) * | 2018-01-30 | 2018-08-14 | 石家庄东远散热技术有限公司 | A kind of water-filled radiator for digging mine device |
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| CN1485906A (en) * | 2002-09-24 | 2004-03-31 | ������������ʽ���� | Electronic equipment |
| US20120224328A1 (en) * | 2011-03-02 | 2012-09-06 | Siliconware Precision Industries Co., Ltd. | Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108762452A (en) * | 2018-07-13 | 2018-11-06 | 华南理工大学 | A kind of container-type digs mine machine radiator and its heat dissipating method |
| CN108762452B (en) * | 2018-07-13 | 2024-06-07 | 华南理工大学 | Container type computer heat dissipation device and heat dissipation method thereof |
| CN110069115A (en) * | 2019-04-11 | 2019-07-30 | 杭州微兔科技有限公司 | A kind of digging mine formula heating system and preparation method |
| CN110671737A (en) * | 2019-10-17 | 2020-01-10 | 邬晨燚 | Block chain digging heater |
| US20230086448A1 (en) * | 2020-05-12 | 2023-03-23 | Shenzhen Microbt Electronics Technology Co., Ltd. | Liquid cooling plate suitable for liquid cooling heat dissipation of electronic device, and heat dissipation unit |
| WO2021258837A1 (en) * | 2020-06-22 | 2021-12-30 | 深圳比特微电子科技有限公司 | Liquid-cooling heat dissipation apparatus, liquid-cooling data processing device, and temperature equalization method |
| CN114564094A (en) * | 2022-02-28 | 2022-05-31 | 上海顺诠科技有限公司 | Server, water cooling assembly and water cooling plate assembly |
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