CN107995393A - A kind of heat dissipation equipment and a kind of camera module - Google Patents

A kind of heat dissipation equipment and a kind of camera module Download PDF

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Publication number
CN107995393A
CN107995393A CN201711248570.2A CN201711248570A CN107995393A CN 107995393 A CN107995393 A CN 107995393A CN 201711248570 A CN201711248570 A CN 201711248570A CN 107995393 A CN107995393 A CN 107995393A
Authority
CN
China
Prior art keywords
camera module
conducting
heat dissipation
heat
radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711248570.2A
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Chinese (zh)
Inventor
王军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Truly Opto-Electronics Ltd
Original Assignee
Truly Opto-Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Truly Opto-Electronics Ltd filed Critical Truly Opto-Electronics Ltd
Priority to CN201711248570.2A priority Critical patent/CN107995393A/en
Publication of CN107995393A publication Critical patent/CN107995393A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/222Studio circuitry; Studio devices; Studio equipment ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/225Television cameras ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/2251Constructional details
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/55Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air

Abstract

The invention discloses a kind of heat dissipation equipment, applied to camera module, including:Conducting part and the radiating part for being radiated using air for fixing camera module and conduction sensitive chip heat;Conducting part is connected with radiating part, and radiating part is provided with multiple grooves for ventilating air.As can be seen here, camera module can by conducting part by the heat that sensitive chip produces transfer out come, and dispersed by the groove structure that radiating part has using the heat that air transfers out conducting part, avoid in the prior art, the problem of can only being radiated by mainboard, silicon chip or copper sheet, improve the heat-sinking capability of camera module, the temperature of the camera module long lasting for work can be effectively reduced, so as to lift the working performance of camera module and extend the service life of camera module.In addition, the invention also discloses a kind of camera module, there is as above effect.

Description

A kind of heat dissipation equipment and a kind of camera module
Technical field
The present invention relates to field of photography, more particularly to a kind of heat dissipation equipment and a kind of camera module.
Background technology
At present, in order to meet use demand, many camera modules need (tens thousand of hours) continuous firing, such as security protection for a long time Camera group, vehicle-mounted camera combination industrial equipment camera group etc..
In the prior art, the camera module in work is radiated by mainboard, silicon chip or copper sheet, heat radiation energy Power is limited.For the camera module long lasting for work, heat caused by camera module is far more than passing through The heat that mainboard, silicon chip or copper sheet dissipate, i.e., existing technological means can not effectively reduce the shooting long lasting for work The temperature of head mould group, so as to influence the working performance and service life of camera module.
Therefore, how effectively to lift the radiating efficiency of camera module, with ensure the working performance of camera module and The service life for increasing camera module is the current technical issues that need to address of those skilled in the art.
The content of the invention
The object of the present invention is to provide a kind of heat dissipation equipment and a kind of camera module, can effectively lift shooting head mould The radiating efficiency of group, with the service life for ensureing the working performance of camera module and increasing camera module.
In order to solve the above technical problem, the present invention provides a kind of heat dissipation equipment, applied to camera module, including: Conducting part and the radiating part for being radiated using air for fixing camera module and conduction sensitive chip heat;
The conducting part is connected with the radiating part, and the radiating part is provided with multiple grooves for ventilating air;
Wherein, the sensitive chip is arranged on the circuit board in the camera module.
Preferably, the heat dissipation equipment further includes the steel plate for strengthening the conducting part capacity of heat transmission, and the steel plate is just To the sensitive chip, and the one side of the steel plate is bonded with the circuit board, the another side of the steel plate and the conducting part Fitting.
Preferably, the heat dissipation equipment further includes heat conduction silicone, the steel plate by the heat conduction silicone with it is described Conducting part is bonded.
Preferably, the heat dissipation equipment further includes conductive fabric, and the steel plate is pasted by the conductive fabric and the conducting part Close.
Preferably, the thickness of the steel plate is 0.3 millimeter.
Preferably, the heat dissipation equipment further includes the fan for accelerating the air flow rate in the groove, described Fan is arranged on the cell wall of the groove.
Preferably, the conducting part and the radiating part are magnesium alloy part.
In order to solve the above-mentioned technical problem, the present invention also provides a kind of camera module, including camera module body, Any heat dissipation equipment as described above is further included, the heat dissipation equipment is fixed on the camera module body.
In terms of existing technologies, heat dissipation equipment provided by the invention, applied to camera module, including:For solid Determine camera module and conduct the conducting part of sensitive chip heat and the radiating part for radiating using air;Conducting part and heat dissipation Portion connects, and radiating part is provided with multiple grooves for ventilating air, wherein, sensitive chip is arranged on the electricity in camera module On the plate of road.It can be seen from the above that camera module can by conducting part by the heat that sensitive chip produces transfer out come, and by dissipate The groove structure that hot portion has is dispersed using the heat that air transfers out conducting part, is avoided in the prior art, can only be passed through The problem of mainboard, silicon chip or copper sheet are radiated, improves the heat-sinking capability of camera module, can effectively reduce and hold for a long time The temperature of the camera module of continuous work, so as to lift the working performance of camera module and extend the use longevity of camera module Life.In addition, present invention also offers a kind of camera module, there is as above effect.
Brief description of the drawings
In order to illustrate the embodiments of the present invention more clearly, attached drawing needed in the embodiment will be done simply below Introduce, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for ordinary skill people For member, without creative efforts, other accompanying drawings can also be obtained according to these attached drawings.
Fig. 1 is a kind of structure diagram of heat dissipation equipment provided in an embodiment of the present invention;
Fig. 2 is a kind of structure diagram of camera module provided in an embodiment of the present invention;
Fig. 3 (a) is the front elevation in a kind of structural design drawing of camera module provided in an embodiment of the present invention;
Fig. 3 (b) is the reverse side figure in a kind of structural design drawing of camera module provided in an embodiment of the present invention;
Fig. 3 (c) is the side view in a kind of structural design drawing of camera module provided in an embodiment of the present invention.
Embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment only part of the embodiment of the present invention, rather than whole embodiments.Based on this Embodiment in invention, those of ordinary skill in the art on the premise of not making the creative labor, obtained it is all its His embodiment, belongs to the scope of the present invention.
The object of the present invention is to provide a kind of heat dissipation equipment and a kind of camera module, can effectively lift shooting head mould The radiating efficiency of group, with the service life for ensureing the working performance of camera module and increasing camera module.
In order to make those skilled in the art be better understood from technical solution of the present invention, below in conjunction with the accompanying drawings and it is embodied The present invention is described in further detail for mode.
Fig. 1 is a kind of structure diagram of heat dissipation equipment provided in an embodiment of the present invention.As shown in Figure 1, the present invention first The heat dissipation equipment that a embodiment provides, applied to camera module, including:For fixing camera module and conduction sensitive chip The conducting part 10 of heat and the radiating part 11 for being radiated using air;
Conducting part 10 is connected with radiating part 11, and radiating part 11 is provided with multiple grooves 110 for ventilating air.
Wherein, sensitive chip is arranged on the circuit board in camera module, and conducting part 10 is used to consolidate camera module Be scheduled on heat dissipation equipment, and at the same time be used for by sensitive chip produce heat conduct to away from sensitive chip heat dissipation equipment its Its position, and when heat is conducted to radiating part 11, conducting part 10 can be transmitted to by being arranged at the groove 110 of radiating part 11 Heat in groove walls is dispersed by the cold air to circulate in groove 110, is reached for the purpose of camera module heat dissipation, so that It can ensure that camera module is operated in a lower environment of temperature, the working performance and increase that lift camera module are taken the photograph As the service life of head mould group.Moreover, it is noted that in order to make heat dissipation equipment reach more preferable heat dissipation effect, radiating Portion 11 sets the concrete mode of groove 110 to be easy to air circulation, i.e., should be blocked in the direction of air circulation without cell wall.
Consider the heat dissipation effect and cost problem of heat dissipation equipment, on the basis of first embodiment of the invention, make Mode is preferably carried out for one kind, four grooves 110 can be set on radiating part 11.It is, of course, understood that in order into The heat dissipation effect of one step heat radiation equipment, in the case of allowing in 11 space of radiating part, can be set more on radiating part 11 Multiple grooves 110, still, due to groove 110 set it is more, technique is more complicated, and cost is higher, so, specifically exist Several grooves 110 are set on radiating part 11, should also be according to actual use situation depending on, the present invention do not limit.
In the concrete application of heat dissipation equipment, the fixed form of camera module and heat dissipation equipment can be it is dismountable, Camera module is fixed on such as by screw it is on conducting part 10 or non-removable, such as by glue by camera Module is pasted on conducting part 10, and the present invention does not limit.Also, it is to be understood that in order to reach more preferable heat dissipation effect, When camera module is fixed on heat dissipation equipment, the sensitive chip of camera module should be made close proximity to conducting part 10.Pass It can be integrally formed to lead portion 10 and radiating part 11, i.e., conducting part 10 and radiating part 11 are specially one completely without splicing Workpiece, the part for being mainly used for conducting heat on workpiece are known as conducting part 10, and the part for being mainly used for heat dissipation is known as radiating part 11; It is of course also possible to be split, i.e., conducting part 10 and radiating part 11 are specially two independent workpiece, it is necessary to by 10 He of conducting part Radiating part 11, which splice, could form heat dissipation equipment, and the connection mode of conducting part 10 and radiating part 11 should be beneficial to heat transfer, Heat conductive silica gel or conductive fabric can be such as set between conducting part 10 and radiating part 11, and the present invention does not limit.
It can be seen from the above that camera module can be transferred out the heat that sensitive chip produces and to pass through by conducting part The groove structure that radiating part has is dispersed using the heat that air transfers out conducting part, is avoided in the prior art, Zhi Nengtong The problem of mainboard, silicon chip or copper sheet are radiated is crossed, improves the heat-sinking capability of camera module, can effectively be reduced for a long time The temperature of the camera module of continuous firing, so as to lift the working performance of camera module and extend the use of camera module Service life.
In order to make the heat-sinking capability of further heat radiation equipment, in the heat dissipation equipment that first embodiment of the invention provides On the basis of, mode is preferably carried out as one kind, the heat dissipation equipment that second embodiment of the invention provides is further included for adding The steel plate of strong 10 capacity of heat transmission of conducting part, steel plate face sensitive chip, and the one side of steel plate is bonded with circuit board, steel plate it is another Face is bonded with conducting part 10.That is, conducting part 10 is connected by steel plate and the sensitive chip of camera module, will be photosensitive The heat-sinking capability for being transferred to conducting part 10, strengthening heat dissipation equipment of the heat that chip produces faster and more, so as to accelerate to take the photograph As the radiating efficiency of head mould group so that the operating temperature of camera module is as far as possible low, and then can lift the work of camera module Make performance and increase the service life of camera module.Can profit it is, of course, understood that steel plate face sensitive chip is set The heat for being produced sensitive chip with steel plate is taken away as soon as possible, is only that one kind is preferably carried out mode, and is not unique reality Mode is applied, therefore, in other embodiments, steel plate not face sensitive chip setting, the present invention can not also be limited.
In order to strengthen the heat transfer capability between steel plate and conducting part 10, on the basis of second embodiment of the invention On, mode is preferably carried out as one kind, heat dissipation equipment further includes heat conduction silicone, and steel plate passes through heat conduction silicone and conducting part 10 fittings.Since metal covering is not definitely smooth, and deformation is not easy again, if two metal coverings simply are directly born against one Rise, its contact surface is in fact and little, and centre can seriously affect heat and be delivered to another from a metal covering there are many gaps The efficiency of metal covering, and the thermal conductivity of heat conductive silica gel preferably and soft texture, easy deformation, so, in steel plate and conducting part 10 Between increase heat conduction silicone can increase contact area between steel plate and conducting part 10, so as to strengthen steel plate and conducting part 10 Between heat transfer capability.
Similarly, on the basis of second embodiment of the invention, mode is preferably carried out as another kind, heat dissipation equipment is also Including conductive fabric, steel plate is bonded by conductive fabric with conducting part 10.Since the quality of conductive fabric is also more soft, easy deformation and With certain capacity of heat transmission, so can equally increase the contact area between steel plate and conducting part 10, so as to strengthen steel plate With the heat transfer capability between conducting part 10.
The present invention considers the heat-sinking capability and cost problem of heat dissipation equipment, and mode, steel are preferably carried out as one kind The thickness of plate is 0.3 millimeter.
In order to further enhance the heat-sinking capability of heat dissipation equipment, on the basis of any of the above-described embodiment, as a kind of excellent Selection of land embodiment, the heat dissipation equipment that third embodiment of the invention provides are further included for accelerating the air stream in groove 110 The fan of logical speed, fan are arranged on the cell wall of groove 110.It is understood that the speed of air circulation in groove 110 Faster, the heat that it is taken away is also more, and therefore, the setting of fan can effectively increase the heat-sinking capability of radiating part 11, from And the heat-sinking capability of heat dissipation equipment can be further enhanced.
For the performance of further heat radiation equipment, on the basis of any of the above-described embodiment, as it is a kind of preferably Embodiment, four embodiment of the invention provide heat dissipation equipment in conducting part 10 and radiating part 11 be magnesium alloy Part.Since almag part has the advantages that the hard amount of matter is light, density is low, thermal diffusivity is preferable and crushing resistance is stronger, so when heat dissipation When the conducting part 10 and radiating part 11 of equipment are almag part, heat dissipation equipment also has that the hard amount of matter is light, density is low, scattered at the same time It is hot preferably and crushing resistance it is stronger the advantages that.
Present invention also offers a kind of camera module for including any of the above-described kind of heat dissipation equipment, due to camera module portion The embodiment and the embodiment of heat dissipation equipment part divided mutually correlate, therefore the embodiment of camera module part may refer to dissipate The description of the embodiment of hot environment division, for identical part, the present invention repeats no more.
Fig. 2 is a kind of structure diagram of camera module provided in an embodiment of the present invention.As shown in Fig. 2, the present invention is real Applying the camera module of example offer includes camera module body 20 and such as described heat dissipation equipment 21 of above-mentioned any embodiment, Heat dissipation equipment 21 is fixed on camera module body 20.
As it can be seen that since camera module provided in this embodiment has the heat dissipation equipment that is provided of any of the above-described embodiment, So camera module provided in this embodiment can be transferred out the heat that sensitive chip produces and to pass through by conducting part The groove structure that radiating part has is dispersed using the heat that air transfers out conducting part, is avoided in the prior art, Zhi Nengtong The problem of mainboard, silicon chip or copper sheet are radiated is crossed, improves the heat-sinking capability of camera module, can effectively be reduced for a long time The temperature of the camera module of continuous firing, so as to lift the working performance of camera module and extend the use of camera module Service life.
In order to enable those skilled in the art to be better understood from camera module provided in an embodiment of the present invention, below It is described in detail with reference to the structural design drawing of camera module.
Fig. 3 (a) be a kind of structural design drawing of camera module provided in an embodiment of the present invention in front elevation, Fig. 3 (b) For the reverse side figure in a kind of structural design drawing of camera module provided in an embodiment of the present invention, Fig. 3 (c) is the embodiment of the present invention Side view in a kind of structural design drawing of the camera module provided.
As shown in Fig. 3 (a), Fig. 3 (b) and Fig. 3 (c), the camera module shown in Fig. 3 (a), Fig. 3 (b) and Fig. 3 (c) In, including two camera module bodies 20, and two camera modules 20 are fixed on same dissipate by conducting part 10 respectively Hot equipment 21, is provided with four grooves 110 on the radiating part 11 of hot jet device 21, wherein, two grooves 110 are located at heat dissipation equipment 21 front, two grooves 110 are located at the reverse side of heat dissipation equipment 21.As it can be seen that in this example, two camera module bodies 20 work The heat of generation can be conducted to radiating part 11 by conducting part 10, and utilizes stream in four grooves 11 set on radiating part 11 Logical air takes away heat, so as to effectively reduce the temperature of camera module, avoids imaging even module because of long-time work Work is damaged in hot environment.
A kind of heat dissipation equipment provided by the present invention and a kind of camera module are described in detail above.Specification In each embodiment described by the way of progressive, it is difference with other embodiments that each embodiment, which stresses, Between each embodiment identical similar portion mutually referring to.
It should be pointed out that for those skilled in the art, without departing from the principle of the present invention, Some improvement and modification can also be carried out to the present invention, these are improved and modification also falls into the protection domain of the claims in the present invention It is interior.
It should also be noted that, in the present specification, such as first and second etc relational terms are used merely to one A entity is either operated either to operate with another entity and distinguished without necessarily requiring or implying these entities or behaviour There are any actual relationship or order between work.Moreover, term " comprising ", "comprising" or its any variation are intended to Cover non-exclusive inclusion, so that process, method, article or equipment including a series of key element not only include that A little key elements, but also other key elements including being not explicitly listed, either further include as this process, method, article or set Standby intrinsic key element.In the absence of more restrictions, the key element limited by sentence "including a ...", it is not excluded that Also there are other identical element in the process, method, article or apparatus that includes the element.

Claims (8)

  1. A kind of 1. heat dissipation equipment, applied to camera module, it is characterised in that including:For fixing camera module and conduction The conducting part of sensitive chip heat and the radiating part for being radiated using air;
    The conducting part is connected with the radiating part, and the radiating part is provided with multiple grooves for ventilating air;
    Wherein, the sensitive chip is arranged on the circuit board in the camera module.
  2. 2. heat dissipation equipment according to claim 1, it is characterised in that further include for strengthening the conducting part capacity of heat transmission Steel plate, sensitive chip described in the steel plate face, and the one side of the steel plate is bonded with the circuit board, the steel plate it is another Simultaneously it is bonded with the conducting part.
  3. 3. heat dissipation equipment according to claim 2, it is characterised in that further include heat conduction silicone, the steel plate passes through institute Heat conduction silicone is stated to be bonded with the conducting part.
  4. 4. heat dissipation equipment according to claim 2, it is characterised in that further include conductive fabric, the steel plate is led by described Electric cloth is bonded with the conducting part.
  5. 5. according to claim 2-4 any one of them heat dissipation equipments, it is characterised in that the thickness of the steel plate is 0.3 millimeter.
  6. 6. according to claim 1-4 any one of them heat dissipation equipments, it is characterised in that further include for accelerating in the groove Air flow rate fan, the fan is arranged on the cell wall of the groove.
  7. 7. according to claim 1-4 any one of them heat dissipation equipments, it is characterised in that the conducting part and the radiating part are equal For magnesium alloy part.
  8. 8. a kind of camera module, including camera module body, it is characterised in that further include such as any one of claim 1-7 The heat dissipation equipment, the heat dissipation equipment are fixed on the camera module body.
CN201711248570.2A 2017-12-01 2017-12-01 A kind of heat dissipation equipment and a kind of camera module Pending CN107995393A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711248570.2A CN107995393A (en) 2017-12-01 2017-12-01 A kind of heat dissipation equipment and a kind of camera module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711248570.2A CN107995393A (en) 2017-12-01 2017-12-01 A kind of heat dissipation equipment and a kind of camera module

Publications (1)

Publication Number Publication Date
CN107995393A true CN107995393A (en) 2018-05-04

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CN201711248570.2A Pending CN107995393A (en) 2017-12-01 2017-12-01 A kind of heat dissipation equipment and a kind of camera module

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109089026A (en) * 2018-08-28 2018-12-25 信利光电股份有限公司 A kind of full-view camera mould group

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009100374A (en) * 2007-10-18 2009-05-07 Olympus Imaging Corp Image sensor cooling unit, photographing lens unit, and electronic apparatus
CN203387593U (en) * 2013-08-08 2014-01-08 南昌欧菲光电技术有限公司 Shooting module and mobile device including the shooting module
CN206302491U (en) * 2016-12-23 2017-07-04 深圳市豪恩汽车电子装备有限公司 Camera heat abstractor
CN206332907U (en) * 2016-12-05 2017-07-14 昆山雷克斯电子科技有限公司 The circuit board of high efficiency and heat radiation

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009100374A (en) * 2007-10-18 2009-05-07 Olympus Imaging Corp Image sensor cooling unit, photographing lens unit, and electronic apparatus
CN203387593U (en) * 2013-08-08 2014-01-08 南昌欧菲光电技术有限公司 Shooting module and mobile device including the shooting module
CN206332907U (en) * 2016-12-05 2017-07-14 昆山雷克斯电子科技有限公司 The circuit board of high efficiency and heat radiation
CN206302491U (en) * 2016-12-23 2017-07-04 深圳市豪恩汽车电子装备有限公司 Camera heat abstractor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109089026A (en) * 2018-08-28 2018-12-25 信利光电股份有限公司 A kind of full-view camera mould group

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Application publication date: 20180504