CN206831862U - A kind of circular semiconductor ring-type parallel connection refrigerator - Google Patents

Abstract

The utility model discloses a kind of circular semiconductor ring-type parallel connection refrigerator, circular semiconductor ring-type parallel connection refrigerator, including water inlet pipe, radiating tube, two semiconductor chilling plates and two outlet pipes, one end of the water inlet pipe and the middle part of radiating tube connect, and the water inlet pipe communicates with radiating tube, two semiconductor chilling plates are respectively arranged in the both ends of radiating tube, and the hot junction of two semiconductor chilling plates is adjacent to the end face at the both ends of radiating tube；The cold end of the semiconductor chilling plate is connected by cool guiding block with fin, and the semiconductor chilling plate, cool guiding block and fin positioned at radiating tube both ends are wrapped up by corresponding cold scattering airduct, and one end of cold scattering airduct is provided with cold scattering fan；One end of two outlet pipes connects after passing through side wall, fin and the cool guiding block of corresponding cold scattering airduct with the cold end of corresponding semiconductor chilling plate, and two outlet pipes communicate with radiating tube.Of the present utility model simple in construction, refrigeration is high, and small volume.

Description

A circular semi-conductor annular parallel refrigerator

technical field

The utility model relates to a refrigeration technical device, in particular to a circular semiconductor annular parallel refrigerator.

Background technique

With the rapid development of the global economy, the utilization of resources is even greater, which will naturally produce irreparable consequences, and environmental issues have become the most worthy of attention. Economic development has naturally led to continuous improvement of people's living standards, and the use of air conditioners has become more and more extensive. With the extensive use of air conditioners, the energy supply and environmental issues that were already facing difficulties have been put forward more severe tests.

Semiconductor refrigeration technology is a new type of non-polluting refrigeration technology, which has been widely used in many fields. At present, semiconductor refrigeration technology has been developed to a great extent, but how to effectively improve the transfer of cold and heat at the hot and cold ends of semiconductor refrigeration chips, and thus improve the efficiency of semiconductor refrigeration, has always been one of the hotspots of research at home and abroad.

The research of many scholars at home and abroad shows that: the figure of merit of the semiconductor material, the working condition of the semiconductor, the heat dissipation method of the hot end, and the temperature difference between the hot and cold ends all have a great influence on the cooling performance of the semiconductor refrigerator. Many studies have shown that:

The figure of merit Z, as the most basic parameter of semiconductor refrigeration chips, not only limits the development of semiconductor theory, but the improvement of the figure of merit fundamentally limits the performance of semiconductor refrigeration.

There is an optimal working condition for the semiconductor refrigeration chip, and only when working under the optimal working condition can the best cooling effect and the best cooling efficiency be achieved.

In the operation of semiconductor refrigerators, if the heat generated at the hot end cannot be discharged in time, the energy accumulated at the hot end will be transferred back to the cold end through heat conduction, which will increase the temperature of the cold end, limit the cooling performance of the cold end, and fail to achieve the ideal Therefore, taking away the energy of the hot end in time can achieve better cooling, and the key factor affecting the energy removal of the hot end is the heat dissipation method.

During the operation of the whole device, the temperature difference between the hot and cold ends is also one of the important influencing factors. Only when the ideal temperature difference is obtained can the ideal cooling effect be achieved.

In short, combining the above-mentioned series of influencing factors, improving the figure of merit coefficient of semiconductor materials, strengthening the heat dissipation method of the hot end, and then increasing the temperature difference between the hot and cold ends can greatly improve the performance of semiconductor refrigeration and achieve better cooling effects. .

Utility model content

The purpose of the utility model is to overcome the shortcomings of the prior art above, and provide a circular semi-conductor annular parallel refrigerator with simple and reasonable structure, high refrigeration efficiency and small volume.

The purpose of this utility model is achieved through the following technical solutions: the circular semi-conductor annular parallel refrigerator includes a water inlet pipe, a heat dissipation pipe, two semiconductor cooling sheets and two water outlet pipes, one end of the water inlet pipe and the heat dissipation pipe The middle part is connected, and the water inlet pipe communicates with the radiating pipe, and the two semiconductor refrigerating sheets are respectively installed on the two ends of the radiating pipe, and the hot ends of the two semiconductor refrigerating sheets are attached to the end faces of the two ends of the radiating pipe; the semiconductor refrigerating sheet The cold end of the cooling tube is connected to the fins through the cooling block, and the semiconductor cooling fins, cooling blocks and fins at both ends of the cooling tube are wrapped by the corresponding cooling air tube, and one end of the cooling air tube is provided with a cooling fan; two One end of the water outlet pipe passes through the side wall of the corresponding cooling air pipe, the fins and the cooling guide block and is connected to the cold end of the corresponding semiconductor refrigeration sheet, and the two water outlet pipes communicate with the heat dissipation pipe.

Preferably, a first baffle and two second baffles are arranged inside the heat dissipation pipe, the cross section of the first baffle is arc-shaped, and the first baffle is installed in the inner cavity of the heat dissipation pipe The upper end of the first baffle is located directly below the outlet of the water inlet pipe; the cross-section of the second baffle is "7", and the upper ends of the two second baffles are fixed to the hot ends of the corresponding semiconductor cooling fins , there is a distance between the lower end of the second baffle and the inner wall of the heat pipe.

Preferably, the inner diameter of the water inlet pipe is smaller than the inner diameter of the heat dissipation pipe.

Preferably, the outer walls of the two water outlet pipes are wrapped with thermal insulation cotton.

Preferably, the inner diameter of the water outlet pipe is smaller than the inner diameter of the heat dissipation pipe.

The utility model has the following advantages relative to the prior art:

1. The circular semi-conductor annular parallel cooler is mainly composed of a water inlet pipe, a heat dissipation pipe, two semiconductor refrigeration sheets and two water outlet pipes. The two semiconductor refrigeration sheets are respectively located at both ends of the heat dissipation pipe, thereby forming a parallel structure. The refrigeration efficiency is greatly improved, and the volume of the entire refrigerator is reduced while increasing the number of semiconductor refrigeration sheets as much as possible.

2. The middle part of the radiator in the circular semi-conductor annular parallel cooler is connected to the water inlet pipe, and the two ends of the radiator are connected to the water outlet pipe, and the heat generated by the semiconductor refrigeration sheet in the cooling process is taken away by water cooling, and the structure is compact. , quickly take away the heat generated by the semiconductor refrigerating sheet, and ensure a large temperature difference between the cold end and the hot end of the semiconductor refrigerating sheet, thereby greatly improving the cooling effect of the semiconductor refrigerating sheet.

3. The hot end of the semiconductor refrigerating sheet in the circular semiconductor annular parallel refrigerator is facing the inner cavity of the heat dissipation pipe. When the cooling water enters the inner cavity of the radiating pipe, it can directly contact the hot end of the semiconductor refrigerating sheet. Reduce heat transfer through other media, thereby improving heat dissipation efficiency.

Description of drawings

Fig. 1 is a structural schematic diagram of a circular semi-conductor annular parallel refrigerator of the present invention.

Fig. 2 is a schematic structural view of the main part of the circular semi-conductor annular parallel refrigerator of the present invention.

Fig. 3 is a cross-sectional view of the heat dissipation pipe of the present invention and its internal structure.

Fig. 4 is a sectional view along A-A direction in Fig. 3 .

Fig. 5 is a cross-sectional view of the first baffle of the present invention.

detailed description

Below in conjunction with accompanying drawing and embodiment the utility model is further described.

Circular semi-conductor annular parallel cooler as shown in Fig. 1 to Fig. 3, comprises water inlet pipe 1, heat dissipation pipe 2, two semiconductive cooling sheets 3 and two water outlet pipes 4, and one end of described water inlet pipe 1 is connected with heat dissipation pipe The middle part of 2 is connected, and the water inlet pipe 1 communicates with the heat dissipation pipe 2, and the two semiconductor cooling fins 3 are respectively installed on the two ends of the heat dissipation pipe 2, and the hot ends of the two semiconductor cooling fins 3 are close to the two ends of the heat dissipation pipe 2. The end face of the end; the cold end of the semiconductor cooling plate 3 is connected to the fin 6 through the cooling block 5, and the semiconductor cooling plate 3, the cooling block 5 and the fins 6 located at the two ends of the heat dissipation pipe 2 are all cooled by the corresponding cooling air pipe 7 Wrapped, and one end of the cooling air duct 7 is provided with a cooling fan 8; one end of the two outlet pipes 4 passes through the side wall of the corresponding cooling air duct 7, the fins 6 and the cooling block 5, and then connects with the corresponding semiconductor cooling sheet The cold end of 3 is connected, and the two outlet pipes 4 communicate with the heat pipe 2.

In actual use, tap water is used as the coolant at the hot end of the semiconductor refrigeration chip. If the first container 9 with tap water is connected to the water inlet of the water inlet pipe 1, the tap water at normal temperature will flow into the cooling pipe 2 through the water inlet pipe 1. Inner cavity, the tap water at this moment absorbs the heat that the hot end of semiconductor cooling chip 3 produces, and the tap water that has absorbed heat flows out through water outlet pipe 4 again. For reducing the waste of running water, the other ends of the two outlet pipes 4 are all connected with the second container 10, and this second container 10 is used for collecting the running water that has absorbed heat. The tap water that has absorbed the heat is drawn back to the first container 9 by the water pump after cooling naturally, so as to allow the tap water used for cooling to be reused. Simultaneously, the cold produced by the cold end of the semiconducting refrigerating sheet 3 is guided to the place where it is needed through the joint action of the cooling fan 8 and the cooling air duct 7, such as a certain box in which food or other materials exist. The two semiconductor cooling fins 3 are installed at both ends of the heat dissipation pipe 2 in parallel, which has a compact structure and does not take up much space, and is applicable to the needs of various environments.

As shown in Fig. 3, Fig. 4 and Fig. 5, a first baffle plate 11 and two second baffle plates 12 are arranged inside the heat pipe 2, and the cross section of the first baffle plate 11 is arc-shaped. , the first baffle 12 is mounted on the upper end of the inner cavity of the heat dissipation pipe 2, and the first baffle 11 is located directly below the outlet of the water inlet pipe 1; the cross section of the second baffle 12 is "7", The upper ends of the two second baffles 12 are fixed to the hot ends of the corresponding semiconductor cooling fins 3 , and there is a distance 13 between the lower ends of the second baffles 12 and the inner wall of the heat pipe 2 . Specifically, the convex surface of the first baffle 11 faces the water inlet pipe 4, and the first baffle 11 guides the tap water flowing out of the water inlet pipe 4, slowing down the impact of the water flow, and the tap water follows the curved surface of the first baffle. Flow into the lower end of the inner cavity of the heat dissipation pipe 2; and the upper end of the second baffle 12 is fixed on the upper end of the semiconductive cooling sheet 3, and the connection point between the second baffle 12 and the semiconducting cooling sheet 3 is higher than the water outlet pipe 4. The tap water flows through the water inlet pipe 1 and the first baffle 11 in turn, and then falls to the lower end of the inner cavity of the heat dissipation pipe 2, and then flows from the distance 13 between the lower end of the second baffle 12 and the inner wall of the heat dissipation pipe 2. Pass and enter water outlet pipe 4, this setting can allow tap water to absorb more heat as far as possible, improves the heat dissipation efficiency of the hot end of semiconductor cooling chip 3; Simultaneously, first baffle plate 11 and second baffle plate 12 can also prevent tap water from flowing When the dead zone is generated, the energy of the hot end can be well taken away, so as to achieve a better cooling effect.

The inner diameter of the water inlet pipe 1 is smaller than the inner diameter of the heat dissipation pipe 2 . The inner diameter of the water outlet pipe 4 is smaller than the inner diameter of the heat dissipation pipe 2 . The inner diameters of the water inlet pipe 1 and the water outlet pipe 4 are all smaller than the inner diameter of the heat dissipation pipe 2, which ensures that the tap water located in the heat dissipation pipe 2 has enough time to absorb the heat generated by the semiconductor cooling chip, and further ensures the heat dissipation effect.

The outer walls of the two water outlet pipes 4 are all wrapped by heat-insulating cotton. This avoids that the cold energy produced by the semiconductor refrigeration sheet performs energy exchange with the tap water that is located in the water outlet pipe 4 and has absorbed heat when the heat dissipation air pipe 7 is used, thereby improving the cooling effect.

The specific implementation described above is a preferred embodiment of the utility model, and does not limit the utility model. Any other changes or other equivalent replacement methods that do not deviate from the technical solution of the utility model are included in the utility model. within the scope of the new protection.

Claims (5)

1. a circular semi-conductor annular parallel cooler is characterized in that: comprise water inlet pipe, radiating pipe, two semi-conductor refrigerating plates and two water outlet pipes, one end of described water inlet pipe is connected with the middle part of radiating pipe, and the The water inlet pipe communicates with the radiating pipe, and the two semiconductor refrigerating sheets are respectively installed at both ends of the radiating pipe, and the hot ends of the two semiconductor refrigerating sheets are attached to the end faces of the two ends of the radiating pipe; the cold ends of the semiconductor refrigerating sheet pass through the conductive The cold block is connected to the fins, and the semiconductor cooling fins, cooling blocks and fins located at both ends of the heat pipe are wrapped by the corresponding cooling air pipe, and one end of the cooling air pipe is provided with a cooling fan; one end of the two outlet pipes passes through After passing through the side wall of the corresponding cooling air pipe, the fins and the cooling block, it is connected with the cold end of the corresponding semiconductor refrigeration sheet, and the two outlet pipes communicate with the heat dissipation pipe. 2. The circular semi-conductor annular parallel refrigerator according to claim 1, characterized in that: a first baffle and two second baffles are arranged in the heat dissipation pipe, and the first baffle The section is arc-shaped, the first baffle is installed on the upper end of the inner cavity of the heat dissipation pipe, and the first baffle is located directly below the outlet of the water inlet pipe; the section of the second baffle is "7", The upper ends of the two second baffles are fixed to the hot ends of the corresponding semiconductor cooling fins, and there is a distance between the lower ends of the second baffles and the inner wall of the radiating pipe. 3. The circular semiconductor annular parallel refrigerator according to claim 1, characterized in that: the inner diameter of the water inlet pipe is smaller than the inner diameter of the heat dissipation pipe. 4. The circular semi-conductor annular parallel refrigerator according to claim 1, characterized in that: the outer walls of the two outlet pipes are both wrapped with heat-insulating cotton. 5. The circular semi-conductor annular parallel refrigerator according to claim 1, characterized in that: the inner diameter of the water outlet pipe is smaller than the inner diameter of the heat dissipation pipe.