CN206831862U - A kind of circular semiconductor ring-type parallel connection refrigerator - Google Patents
A kind of circular semiconductor ring-type parallel connection refrigerator Download PDFInfo
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- CN206831862U CN206831862U CN201720417403.5U CN201720417403U CN206831862U CN 206831862 U CN206831862 U CN 206831862U CN 201720417403 U CN201720417403 U CN 201720417403U CN 206831862 U CN206831862 U CN 206831862U
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- Prior art keywords
- radiating tube
- semiconductor chilling
- cold
- semiconductor
- water inlet
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Abstract
The utility model discloses a kind of circular semiconductor ring-type parallel connection refrigerator, circular semiconductor ring-type parallel connection refrigerator, including water inlet pipe, radiating tube, two semiconductor chilling plates and two outlet pipes, one end of the water inlet pipe and the middle part of radiating tube connect, and the water inlet pipe communicates with radiating tube, two semiconductor chilling plates are respectively arranged in the both ends of radiating tube, and the hot junction of two semiconductor chilling plates is adjacent to the end face at the both ends of radiating tube；The cold end of the semiconductor chilling plate is connected by cool guiding block with fin, and the semiconductor chilling plate, cool guiding block and fin positioned at radiating tube both ends are wrapped up by corresponding cold scattering airduct, and one end of cold scattering airduct is provided with cold scattering fan；One end of two outlet pipes connects after passing through side wall, fin and the cool guiding block of corresponding cold scattering airduct with the cold end of corresponding semiconductor chilling plate, and two outlet pipes communicate with radiating tube.Of the present utility model simple in construction, refrigeration is high, and small volume.
Description
Technical field
It the utility model is related to Refrigeration Technique device, and in particular to a kind of circular semiconductor ring-type parallel connection refrigerator.
Background technology
With the rapid development of global economy, the utilization to resource more very, can produce the consequence that can not be retrieved, environment naturally
Problem, which is stood in the breach, becomes the problem of most meriting attention.Economic development causes living standards of the people to improve constantly naturally, air-conditioning
Use become more and more extensive.While air-conditioning largely uses, energy supply and ring to having faced awkward situation originally
Border problem proposes more acute test.
Semiconductor refrigerating technology is a kind of Refrigeration Technique of Novel pollution-free, is widely applied in various fields.Mesh
Preceding semiconductor refrigerating technology, which has, significantly to be developed, but how to effectively improve the cold and hot amount of semiconductor chilling plate hot and cold side
Transmit, and thus improve semiconductor refrigerating efficiency, be always one of focus studied both at home and abroad.
The research of lot of domestic and international scholar shows：The figure of merit of semi-conducting material, the working condition of semiconductor, hot junction dissipate
Hot mode, hot and cold side temperature difference etc. all have a great impact to the refrigeration performance of semiconductor cooler.Many researchs show：
Figure of merit Z not only limit the development of Semiconductive Theory as semiconductor chilling plate most underlying parameter, and the figure of merit
The raising of coefficient fundamentally limits semiconductor refrigerating performance.
There is optimum condition in semiconductor chilling plate, only work the refrigeration effect that can reach optimal under optimum condition
Fruit, best refrigerating efficiency.
In semiconductor cooler work, if heat caused by hot junction can not discharge in time, cause hot junction energy stacking then
Cold end can be passed back by heat transfer so that cold junction temperature is raised so that the refrigeration performance of cold end is limited, it is impossible to reach preferable
Refrigeration, therefore the energy in hot junction is taken away can more preferably realize refrigeration in time, and influence that hot junction energy takes away it is crucial because
It is plain then be radiating mode.
During whole device is run, the temperature difference of hot and cold side is also one of important influence factor, is only managed
The temperature difference thought, it can be only achieved preferable refrigeration.
In a word, a series of influence factor of summary, the figure of merit of semi-conducting material is improved, strengthens dissipating for hot junction
Hot mode, and then increase the hot and cold side temperature difference, the performance of semiconductor refrigerating can be largely improved, reaches preferably refrigeration effect
Fruit.
Utility model content
The purpose of this utility model is to overcome above the shortcomings of the prior art, there is provided it is a kind of it is simple in construction,
Rationally, the circular semiconductor ring-type parallel connection refrigerator of high cooling efficiency and small volume.
The purpose of this utility model is realized by following technical scheme：This circular semiconductor ring-type parallel connection refrigerator, bag
Water inlet pipe, radiating tube, two semiconductor chilling plates and two outlet pipes are included, are connected in the middle part of one end of the water inlet pipe and radiating tube
Connect, and the water inlet pipe communicates with radiating tube, two semiconductor chilling plates are respectively arranged in the both ends of radiating tube, and two and half lead
The hot junction of body cooling piece is adjacent to the end face at the both ends of radiating tube；The cold end of the semiconductor chilling plate is connected by cool guiding block and fin
Connect, the semiconductor chilling plate, cool guiding block and fin positioned at radiating tube both ends are wrapped up by corresponding cold scattering airduct, and cold scattering airduct
One end be provided with cold scattering fan；One end of two outlet pipes through after the side wall of corresponding cold scattering airduct, fin and cool guiding block with
The cold end connection of corresponding semiconductor chilling plate, and two outlet pipes communicate with radiating tube.
Preferably, the first deflection plate and two the second deflection plates are provided with the radiating tube, first deflection plate is cut
Face is in arc-shaped, and this first deflection plate is installed on the upper end of the inner chamber of radiating tube, and the first deflection plate is located at the outlet of water inlet pipe
Underface；The section of second deflection plate is in " 7 ", and corresponding semiconductor chilling plate is fixed in the upper end of two the second deflection plates
Hot junction, there is spacing between the lower end of second deflection plate and the inwall of radiating tube.
Preferably, the internal diameter of the water inlet pipe is less than the internal diameter of radiating tube.
Preferably, the outer wall of two outlet pipes is wrapped up by heat insulation foam.
Preferably, the internal diameter of the outlet pipe is less than the internal diameter of radiating tube.
The utility model has the following advantages relative to prior art：
1st, this circular semiconductor ring-type parallel connection refrigerator is mainly by water inlet pipe, radiating tube, two semiconductor chilling plates and two
Bar outlet pipe is formed, and two semiconductor chilling plates are located at the both ends of radiating tube respectively, and so as to form parallel-connection structure, this is greatly improved
Refrigerating efficiency, and reduce in the case of the quantity of semiconductor chilling plate is increased as far as possible the volume of whole refrigerator.
2nd, the middle part of radiator connects water inlet pipe in this circular semiconductor ring-type parallel connection refrigerator, and the both ends of radiator connect
Pass-out water pipe, semiconductor chilling plate caused heat in process of refrigerastion is taken away by way of water cooling, this is compact-sized, rapidly
Heat caused by semiconductor chilling plate is taken away, ensures that there is the larger temperature difference between the cold end of semiconductor chilling plate and hot junction, so as to
Substantially increase the refrigeration of semiconductor chilling plate.
3rd, the hot junction of the semiconductor chilling plate in this circular semiconductor ring-type parallel connection refrigerator faces the inner chamber of radiating tube,
It can directly contact with the hot junction of semiconductor chilling plate when cooling water enters the inner chamber of radiating tube, reduced with this by other media
Heat is transmitted, so as to improve radiating efficiency.
Brief description of the drawings
Fig. 1 is the structural representation of circular semiconductor ring-type parallel connection refrigerator of the present utility model.
Fig. 2 is the structural representation of the main part of circular semiconductor ring-type parallel connection refrigerator of the present utility model.
Fig. 3 is hot channel of the present utility model and its sectional view of internal structure.
Fig. 4 is the sectional view in A-A directions in Fig. 3.
Fig. 5 is the cross-directional sectional view of the first deflection plate of the present utility model.
Embodiment
The utility model is described in further detail with reference to the accompanying drawings and examples.
Circular semiconductor ring-type parallel connection refrigerator as shown in Figure 1 to Figure 3, including water inlet pipe 1, radiating tube 2, two and half are led
Body cooling piece 3 and two outlet pipes 4, one end of the water inlet pipe 1 are connected with the middle part of radiating tube 2, and the water inlet pipe 1 is with dissipating
Heat pipe 2 communicates, and two semiconductor chilling plates 3 are respectively arranged in the both ends of radiating tube 2, and the hot junction of two semiconductor chilling plates 3
It is adjacent to the end face at the both ends of radiating tube 2；The cold end of the semiconductor chilling plate 3 is connected by cool guiding block 5 with fin 6, positioned at scattered
Semiconductor chilling plate 3, cool guiding block 5 and the fin 6 at the both ends of heat pipe 2 are wrapped up by corresponding cold scattering airduct 7, and cold scattering airduct 7
One end is provided with cold scattering fan 8；After one end of two outlet pipes 4 passes through side wall, fin 6 and the cool guiding block 5 of corresponding cold scattering airduct 7
Connected with the cold end of corresponding semiconductor chilling plate 3, and two outlet pipes 4 communicate with radiating tube 2.
In actual use, using coolant of the running water as the hot junction of semiconductor chilling plate, as that will have originally
First container 9 of water is connected with the water inlet of water inlet pipe 1, then the running water of these normal temperature flows into radiating tube 2 by water inlet pipe 1
Inner chamber, running water now absorbs heat caused by the hot junction of semiconductor chilling plate 3, and the running water for absorbing heat passes through again
Outlet pipe 4 flows out.To reduce the waste of running water, the other end of two outlet pipes 4 is all connected with second container 10, this second appearance
Device 10 absorbs the running water of heat for collecting.After these absorb the running water of heat by Temperature fall, then pass through
Water pump extracts and returns to the first container 9, the running water recycling to allow as cooling.At the same time, semiconductor chilling plate 3
Cold caused by cold end, to be directed to the place of needs, is deposited by the collective effect of cold scattering fan 8 and cold scattering airduct 7 Ru a certain
In the casing of food or unclassified stores.Two modes in parallel of semiconductor chilling plate 3 are installed on the both ends of radiating tube 2, knot
Structure is compact, will not take more space, the demand of a variety of environment when applicable.
As shown in Fig. 3, Fig. 4 and Fig. 5, the first deflection plate 11 and two the second deflection plates 12, institute are provided with the radiating tube 2
The section for stating the first deflection plate 11 is in arc-shaped, and this first deflection plate 12 is installed on the upper end of the inner chamber of radiating tube 2, and the first folding
Flowing plate 11 is located at immediately below the outlet of water inlet pipe 1；The section of second deflection plate 12 is in " 7 ", two the second deflection plates 12
The hot junction of corresponding semiconductor chilling plate 3 is fixed in upper end, between the lower end of second deflection plate 12 and the inwall of radiating tube 2
With spacing 13.Specifically, the first deflection plate 11 convex surface facing water inlet pipe 4, then the first deflection plate 11 flows out to water inlet pipe 4
Running water has guiding function, slows down the impact of current, and flexure plane of the running water along the first deflection plate is flowed into radiating tube 2
The lower end of inner chamber；And the upper end of semiconductor chilling plate 3 is fixed in the upper end of the second deflection plate 12, and the second deflection plate 12 is with partly leading
Tie point between body cooling piece 3 is higher than outlet pipe 4, and running water falls on radiating after flowing successively through water inlet pipe 1, the first deflection plate 11
The inner chamber lower end of pipe 2, then the spacing 13 again between the lower end of the second deflection plate 12 and the inwall of radiating tube 2 flow through and enter
Outlet pipe 4, this setting can allow running water to absorb more heat as far as possible, improve the radiating efficiency in the hot junction of semiconductor chilling plate 3；
Meanwhile first deflection plate 11 and the second deflection plate 12 can also prevent from producing dead band when running water from flowing, can be good at heat
The energy at end is taken away, so as to more preferably play refrigeration.
The internal diameter of the water inlet pipe 1 is less than the internal diameter of radiating tube 2.The internal diameter of the outlet pipe 4 is less than the interior of radiating tube 2
Footpath.The internal diameter of water inlet pipe 1 and outlet pipe 4 is respectively less than the internal diameter of radiating tube 2, it ensure that the running water tool in radiating tube 2
Heat caused by having time enough absorption semiconductor chilling plate, further ensures radiating effect.
The outer wall of two outlet pipes 4 is wrapped up by heat insulation foam.This is avoided cold caused by semiconductor chilling plate in radiation air
Energy exchange is carried out with being located at the interior of outlet pipe 4 and having absorbed the running water of heat during pipe 7, so as to improve refrigeration.
Above-mentioned embodiment is preferred embodiment of the present utility model, and the utility model can not be defined,
Other any changes made without departing from the technical solution of the utility model or other equivalent substitute modes, are included in
Within the scope of protection of the utility model.
Claims (5)
- A kind of 1. circular semiconductor ring-type parallel connection refrigerator, it is characterised in that：Including water inlet pipe, radiating tube, two semiconductor systems Cold and two outlet pipes, one end of the water inlet pipe and the middle part of radiating tube connect, and the water inlet pipe communicates with radiating tube, Two semiconductor chilling plates are respectively arranged in the both ends of radiating tube, and the hot junction of two semiconductor chilling plates is adjacent to the two of radiating tube The end face at end；The cold end of the semiconductor chilling plate is connected by cool guiding block with fin, the semiconductor system positioned at radiating tube both ends Cold, cool guiding block and fin are wrapped up by corresponding cold scattering airduct, and one end of cold scattering airduct is provided with cold scattering fan；Two water outlets One end of pipe connects after passing through side wall, fin and the cool guiding block of corresponding cold scattering airduct with the cold end of corresponding semiconductor chilling plate Connect, and two outlet pipes communicate with radiating tube.
- 2. circular semiconductor ring-type parallel connection refrigerator according to claim 1, it is characterised in that：It is provided with the radiating tube First deflection plate and two the second deflection plates, the section of first deflection plate is in arc-shaped, and this first deflection plate is installed on scattered The upper end of the inner chamber of heat pipe, and the first deflection plate is located at immediately below the outlet of water inlet pipe；The section of second deflection plate is in The hot junction of corresponding semiconductor chilling plate is fixed in " 7 ", the upper end of two the second deflection plates, the lower end of second deflection plate with There is spacing between the inwall of radiating tube.
- 3. circular semiconductor ring-type parallel connection refrigerator according to claim 1, it is characterised in that：The internal diameter of the water inlet pipe Less than the internal diameter of radiating tube.
- 4. circular semiconductor ring-type parallel connection refrigerator according to claim 1, it is characterised in that：The outer wall of two outlet pipes Wrapped up by heat insulation foam.
- 5. circular semiconductor ring-type parallel connection refrigerator according to claim 1, it is characterised in that：The internal diameter of the outlet pipe Less than the internal diameter of radiating tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720417403.5U CN206831862U (en) | 2017-04-20 | 2017-04-20 | A kind of circular semiconductor ring-type parallel connection refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720417403.5U CN206831862U (en) | 2017-04-20 | 2017-04-20 | A kind of circular semiconductor ring-type parallel connection refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206831862U true CN206831862U (en) | 2018-01-02 |
Family
ID=60768778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720417403.5U Expired - Fee Related CN206831862U (en) | 2017-04-20 | 2017-04-20 | A kind of circular semiconductor ring-type parallel connection refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206831862U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106979633A (en) * | 2017-04-20 | 2017-07-25 | 华南理工大学 | A kind of circular semiconductor ring-type refrigerator in parallel |
| CN114212334A (en) * | 2022-02-21 | 2022-03-22 | 江苏良友正大股份有限公司 | Subsidiary forced air cooling prevents transportation equipment for bio-organic fertilizer manufacturing of caking function |
-
2017
- 2017-04-20 CN CN201720417403.5U patent/CN206831862U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106979633A (en) * | 2017-04-20 | 2017-07-25 | 华南理工大学 | A kind of circular semiconductor ring-type refrigerator in parallel |
| CN114212334A (en) * | 2022-02-21 | 2022-03-22 | 江苏良友正大股份有限公司 | Subsidiary forced air cooling prevents transportation equipment for bio-organic fertilizer manufacturing of caking function |
| CN114212334B (en) * | 2022-02-21 | 2022-05-31 | 江苏良友正大股份有限公司 | Subsidiary forced air cooling prevents transportation equipment for bio-organic fertilizer manufacturing of caking function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180102 Termination date: 20210420 |