CN210718198U - Liquid cooling integrated semiconductor refrigerating system - Google Patents
Liquid cooling integrated semiconductor refrigerating system Download PDFInfo
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- CN210718198U CN210718198U CN201921412168.8U CN201921412168U CN210718198U CN 210718198 U CN210718198 U CN 210718198U CN 201921412168 U CN201921412168 U CN 201921412168U CN 210718198 U CN210718198 U CN 210718198U
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Abstract
The utility model provides a liquid cooling integral type semiconductor refrigerating system, including semiconductor refrigeration module and the water-cooling module who is connected with semiconductor refrigeration mould, semiconductor refrigeration mould includes semiconductor refrigeration chip and the cold junction keysets that is connected with semiconductor refrigeration chip, semiconductor refrigeration chip includes cold junction and hot junction; the water-cooling module comprises a water pump and a heat absorption bottom plate arranged at the bottom of the water pump, the cold end is connected with the cold end adapter plate, the hot end is connected with the heat absorption bottom plate, and the cold end adapter plate is fixedly connected with the water pump to form a whole. The embodiment of the utility model provides an integration sets up, can effectively avoid the weeping phenomenon to effectively improve semiconductor refrigeration chip's effect and security performance, it is simple convenient.
Description
Technical Field
The utility model relates to a heat dissipation refrigeration technology field especially relates to a liquid cooling integral type semiconductor refrigerating system.
Background
The existing biochemical reagent pot or cold storage box adopts the traditional absorption refrigeration, vapor compression refrigeration and/or the semiconductor adopts an air cooling radiator. The absorption refrigerating device consists of a generator, a condenser, an evaporator, an absorber, a circulating pump, a throttle valve and other parts, and the working medium comprises a refrigerant which is used for preparing cold energy by taking water or ammonia and the like which naturally exist as the refrigerant and an absorbent which absorbs and desorbs the refrigerant, and the working medium and the refrigerant form a working medium pair. Heating the diluted mixed solution in a generator, separating refrigerant steam with a certain flow rate, feeding the separated refrigerant steam into a condenser, cooling the steam in the condenser, and condensing the steam into liquid; the liquid cryogen is throttled and depressurized, enters the evaporator, is absorbed and evaporated in the evaporator to generate a cold effect, and the cryogen is changed into a gas state from a liquid state and then enters the absorber; in addition, the concentrated solution flowing out of the generator enters the absorber after being subjected to throttling and pressure reduction through the heat exchanger to absorb the refrigerant vapor from the evaporator, the dilute solution generated in the absorption process is pressurized by the circulating pump, enters the generator again after being subjected to heat absorption and temperature rise through the heat exchanger, and the circulation refrigeration is carried out in the way.
The vapor compression type refrigeration is composed of refrigerant and four parts, namely a compressor, a condenser, an expansion valve and an evaporator. The refrigerant continuously circulates in the system, changes state and exchanges heat with the outside. After absorbing the heat of the cooled object in the evaporator, the liquid refrigerant is vaporized into low-temperature low-pressure steam, the steam is sucked by the compressor, the steam is compressed into high-pressure high-temperature steam and then is discharged into the condenser, the steam releases heat to a cooling medium (water or air) in the condenser, the steam is condensed into high-pressure liquid, the high-pressure liquid is throttled into the low-pressure low-temperature refrigerant by the throttle valve, and the low-pressure low-temperature refrigerant enters the evaporator again to absorb heat and vaporize. Thus, the refrigerant is subjected to four basic processes of compression, condensation, throttling and evaporation in the system to complete a refrigeration cycle.
And it is common in the market that semiconductor refrigeration module and water pump are separately, cause the pipeline to increase, and the coupling increases, and the weeping risk is big for the result of use is not good and there is the potential safety hazard.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a solve current semiconductor refrigeration module and water pump and separately set up, cause the technical problem of weeping easily, provide a liquid cooling integral type semiconductor refrigerating system.
The utility model provides a liquid cooling integral type semiconductor refrigerating system, including semiconductor refrigeration module and the water-cooling module who is connected with semiconductor refrigeration mould, semiconductor refrigeration mould includes semiconductor refrigeration chip and the cold junction keysets that is connected with semiconductor refrigeration chip, semiconductor refrigeration chip includes cold junction and hot junction; the water-cooling module comprises a water pump and a heat absorption bottom plate arranged at the bottom of the water pump, the cold end is connected with the cold end adapter plate, the hot end is connected with the heat absorption bottom plate, and the cold end adapter plate is fixedly connected with the water pump to form a whole.
Further, the cold-end adapter plate is connected with the water pump through a first screw; and a heat insulation pad is arranged between the first screw and the cold end adapter plate.
Furthermore, the heat absorption bottom plate is fixedly arranged at the bottom of the water pump through a second screw.
Furthermore, heat-conducting silica gel is respectively arranged between the semiconductor refrigeration chip and the cold end adapter plate and between the semiconductor refrigeration chip and the heat absorption bottom plate.
Furthermore, the water cooling module is also provided with a connecting pipe connected with the water pump, a heat dissipation bar connected with the connecting pipe and a heat dissipation fan connected with the heat dissipation bar.
Furthermore, the heat dissipation row is provided with a first water inlet and a first water outlet which are communicated, and the water pump is provided with a second water inlet and a second water outlet which are communicated; the first water inlet is connected with the second water outlet, and the first water outlet is connected with the second water inlet.
Furthermore, a heat insulation layer is arranged around the semiconductor refrigeration chip.
Furthermore, the heat-insulating layer is filled with polyurethane foaming or epoxy resin pouring sealant.
Furthermore, one end of the heat absorption bottom plate, which is connected with the water pump, is provided with a columnar heat dissipation fin block or a relieved tooth heat dissipation fin.
Furthermore, the heat absorption bottom plate and the cold end adapter plate are made of red copper.
The utility model has the advantages that: the embodiment of the utility model arranges the heat absorption bottom plate below the water pump, installs the semiconductor refrigeration chip between the heat absorption bottom plate and the cold junction adapter plate, and fixedly connects the cold junction adapter plate with the bottom of the water pump, so that the semiconductor refrigeration chip and the water pump are arranged integrally; when the semiconductor refrigeration chip is used, the cold end of the semiconductor refrigeration chip is connected with the cold end adapter plate and is connected with the biochemical reagent pot or the refrigerating box through the cold end adapter plate to provide refrigeration energy for the biochemical reagent pot or the refrigerating box; simultaneously, the hot junction is connected with the heat absorption bottom plate, with heat transfer to the water pump in, through the hydrologic cycle in the water pump, gives off the heat, can effectively ensure semiconductor refrigeration chip's working property, the integration sets up, also can effectively avoid the weeping phenomenon to effectively improve semiconductor refrigeration chip's effect and security performance, it is simple convenient.
Drawings
Fig. 1 is a perspective view of an embodiment of the liquid cooling integrated semiconductor refrigeration system of the present invention.
Fig. 2 is an exploded view of an embodiment of the liquid cooling integrated semiconductor refrigeration system of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1-2, the utility model provides a liquid cooling integrated semiconductor refrigeration system, including semiconductor refrigeration module and the water-cooling module of being connected with semiconductor refrigeration mould, semiconductor refrigeration mould includes semiconductor refrigeration chip 21 and the cold junction keysets 22 of being connected with semiconductor refrigeration chip 21, semiconductor refrigeration chip 21 includes cold junction and hot junction; the water-cooling module comprises a water pump 11 and a heat absorption bottom plate 12 arranged at the bottom of the water pump 11, the cold end is connected with a cold end adapter plate 22, the hot end is connected with the heat absorption bottom plate 12, and the cold end adapter plate 22 is fixedly connected with the water pump 11 into a whole.
In the embodiment of the utility model, the heat absorption bottom plate 12 is arranged below the water pump 11, the semiconductor refrigeration chip 21 is arranged between the heat absorption bottom plate 12 and the cold end adapter plate 22, and the cold end adapter plate 22 is fixedly connected with the bottom of the water pump 11, so that the semiconductor refrigeration chip 21 and the water pump 11 are integrally arranged; when the semiconductor refrigeration device is used, the cold end of the semiconductor refrigeration chip 21 is connected with the cold end adapter plate 22 and is connected with the biochemical reagent pot or the refrigerating box through the cold end adapter plate 22 to provide refrigeration energy for the biochemical reagent pot or the refrigerating box; simultaneously, the hot junction is connected with heat absorption bottom plate 12, in transferring heat to water pump 11, through the hydrologic cycle in the water pump 11, gives off the heat, can effectively ensure semiconductor refrigeration chip 21's working property, and the integration sets up, also can effectively avoid the weeping phenomenon to effectively improve semiconductor refrigeration chip 21's effect and security performance, it is simple convenient.
In an alternative embodiment, the cold end adapter plate 22 is connected with the water pump 11 through a first screw 31; and a heat insulation pad 33 is arranged between the first screw 31 and the cold end adapter plate 22.
In this embodiment, the cold-end adapter plate 22 can be effectively and fixedly connected to the bottom of the water pump 11 through the first screw 31, so as to be integrally arranged; and set up heat insulating mattress 33, can effectively reduce cold energy and lose along the screw.
In an alternative embodiment, the heat absorbing base plate 12 is fixedly mounted to the bottom of the water pump 11 by second screws 32. The heat absorption bottom plate 12 can be effectively fixed and installed at the bottom of the water pump 11 through the second screws 32, and specifically, the second screws 32 are countersunk screws.
In an alternative embodiment, a heat conductive silicone is disposed between the semiconductor refrigeration chip 21 and the cold-end adapter plate 22 and the heat absorption bottom plate 12. The heat-conducting silica gel is arranged, so that the heat end and the cold end of the semiconductor refrigeration chip 21 can conveniently transmit energy to the heat absorption bottom plate 12 and the cold end adapter plate 22 respectively, and the energy transmission efficiency is effectively improved.
In an alternative embodiment, the water cooling module is further provided with a connecting pipe 13 connected with the water pump 11, a heat dissipation row 14 connected with the connecting pipe 13, and a heat dissipation fan 15 connected with the heat dissipation row 14. Specifically, the heat dissipation bank 14 is provided with a first water inlet and a first water outlet which are communicated, and the water pump 11 is provided with a second water inlet and a second water outlet which are communicated; the first water inlet is connected with the second water outlet, and the first water outlet is connected with the second water inlet.
In this embodiment, when semiconductor refrigeration chip 21 during operation, the heat that the hot junction produced transmits to heat absorption bottom plate 12, heat absorption bottom plate 12 is through the liquid cooling with in the water pump 11 contact, take away the heat through the liquid cooling, and the liquid cooling passes through the effect of water pump 11, go out from the second delivery port and arrange 14 in the first water inlet entering heat dissipation row 14 from the heat dissipation through connecting pipe 13, arrange 14 and radiator fan 15 through the heat dissipation and cool down the back to the liquid cooling, go out from first delivery port and reach second water inlet entering water pump 11 through another connecting pipe 13, be connected with heat absorption bottom plate 12, so circulate, can effectively take away the heat on the heat absorption bottom plate 12, improve semiconductor refrigeration chip 21's effect.
In an optional embodiment, an insulating layer is further arranged around the semiconductor refrigeration chip 21; specifically, the heat-insulating layer is filled with polyurethane foaming or epoxy resin pouring sealant. The heat preservation layer is arranged, so that heat preservation and heat insulation can be performed on the semiconductor refrigeration chip 21, the semiconductor refrigeration chip 21 can be wrapped and sealed, the semiconductor refrigeration chip is protected from being corroded by condensed water, short circuit and burning of devices are prevented, and the safety performance and the service life of the semiconductor refrigeration chip 21 are effectively improved.
In an alternative embodiment, the heat absorbing bottom plate 12 is connected to the water pump 11 by a cylindrical heat dissipating fin block or a relieved heat dissipating fin. Through the columnar heat dissipation fin block or the relieved tooth heat dissipation fin, the contact area of the heat absorption bottom plate 12 and water cooling liquid can be effectively increased, and therefore heat dissipation of the heat absorption bottom plate 12 is effectively accelerated.
In an optional embodiment, the heat absorption bottom plate 12 and the cold-end adapter plate 22 are made of red copper, so that the energy conductivity of the heat absorption bottom plate 12 and the cold-end adapter plate 22 is effectively ensured, and energy waste is avoided.
In the description herein, references to the description of the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is a more detailed description of the present invention that is presented in conjunction with specific embodiments, and it is not to be understood that the specific embodiments of the present invention are limited to these descriptions. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement.
Claims (10)
1. A liquid cooling integrated semiconductor refrigeration system is characterized by comprising a semiconductor refrigeration module and a water cooling module connected with the semiconductor refrigeration module, wherein the semiconductor refrigeration module comprises a semiconductor refrigeration chip and a cold end adapter plate connected with the semiconductor refrigeration chip, and the semiconductor refrigeration chip comprises a cold end and a hot end; the water-cooling module comprises a water pump and a heat absorption bottom plate arranged at the bottom of the water pump, the cold end is connected with the cold end adapter plate, the hot end is connected with the heat absorption bottom plate, and the cold end adapter plate is fixedly connected with the water pump to form a whole.
2. The liquid-cooled integrated semiconductor refrigeration system of claim 1 wherein said cold end adapter plate is connected to a water pump by first screws; and a heat insulation pad is arranged between the first screw and the cold end adapter plate.
3. The liquid-cooled integrated semiconductor refrigeration system according to claim 1, wherein the heat absorption base plate is fixedly mounted to a bottom of the water pump by second screws.
4. The liquid-cooled integrated semiconductor refrigeration system of claim 1 wherein thermally conductive silicone is disposed between said semiconductor refrigeration chip and each of said cold side adapter plate and said heat sink base plate.
5. The liquid-cooled integrated semiconductor refrigeration system of claim 1 wherein the water-cooled module further comprises a connection tube connected to the water pump, a heat sink connected to the connection tube, and a heat sink fan connected to the heat sink.
6. The liquid-cooled integrated semiconductor refrigeration system of claim 5 wherein said heat sink bank has a first inlet and a first outlet in communication, and said water pump has a second inlet and a second outlet in communication; the first water inlet is connected with the second water outlet, and the first water outlet is connected with the second water inlet.
7. The liquid-cooled integrated semiconductor refrigeration system of claim 1 wherein an insulating layer is further disposed around said semiconductor refrigeration chip.
8. The liquid-cooled integrated semiconductor refrigeration system of claim 7, wherein the thermal insulation layer is filled with polyurethane foam or epoxy potting adhesive.
9. The liquid-cooled integrated semiconductor refrigeration system of claim 1 wherein the end of the heat absorption base plate connected to the water pump is provided with a cylindrical heat sink fin block or a relieved fin.
10. The liquid-cooled integrated semiconductor refrigeration system of claim 1 wherein said heat absorption base plate and cold end adapter plate are both made of red copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921412168.8U CN210718198U (en) | 2019-08-28 | 2019-08-28 | Liquid cooling integrated semiconductor refrigerating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921412168.8U CN210718198U (en) | 2019-08-28 | 2019-08-28 | Liquid cooling integrated semiconductor refrigerating system |
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| Publication Number | Publication Date |
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| CN210718198U true CN210718198U (en) | 2020-06-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921412168.8U Active CN210718198U (en) | 2019-08-28 | 2019-08-28 | Liquid cooling integrated semiconductor refrigerating system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114893925A (en) * | 2021-12-11 | 2022-08-12 | 上海精密计量测试研究所 | Integrated circuit refrigerating system based on semiconductor refrigerating sheet |
-
2019
- 2019-08-28 CN CN201921412168.8U patent/CN210718198U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114893925A (en) * | 2021-12-11 | 2022-08-12 | 上海精密计量测试研究所 | Integrated circuit refrigerating system based on semiconductor refrigerating sheet |
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