CN210573617U

CN210573617U - Siphon radiator

Info

Publication number: CN210573617U
Application number: CN201921474912.7U
Authority: CN
Inventors: 龚振兴; 汪林; 黄明彬; 唐川
Original assignee: Kunshan Ping Tai Electronic Co ltd
Current assignee: Kunshan Ping Tai Electronic Co ltd
Priority date: 2019-09-06
Filing date: 2019-09-06
Publication date: 2020-05-19
Anticipated expiration: 2029-09-06

Abstract

The utility model discloses a siphon radiator, including condenser, evaporimeter, back flow and steam pipe, be equipped with back flow and steam pipe between evaporimeter and the condenser, the steam pipe is located the back flow top, the back flow is equipped with two at least, condenser one side is equipped with the reservoir, the back flow communicates to in the reservoir, the inside first fin group that is equipped with of condenser at least, the inside second fin group that is equipped with of evaporimeter at least. The utility model discloses can effectively reduce refrigerant backflow resistance, increase the reflux speed of refrigerant from the condenser to the evaporimeter, promote the storage capacity of refrigerant in the evaporimeter, can satisfy the cooling demand under high-power, prevent that the heat from too much leading to the defect that refrigerant is too few and can't in time cool down in the evaporimeter.

Description

Siphon radiator

Technical Field

The utility model relates to a siphon radiator belongs to the radiator field.

Background

In order to improve the heat transfer efficiency of the radiator, the thermosiphon radiator is used as another type of radiator and realizes heat transfer by means of phase change of internal refrigerant. The existing horizontal thermosiphon radiator adopts a single air pipe and a single liquid return pipe, and because the power of a server chip is larger, the evaporation capacity is more, the flow velocity of condensed liquid in the liquid return pipe is higher, and the flow resistance is larger. Because the inside of the siphon pipe is saturated steam, the steam temperature and the pressure have a one-to-one correspondence relationship, the larger the flow resistance of the system is, the higher the pressure inside the evaporator is, and the higher the evaporation temperature is, so that the temperature difference between the evaporator and the condenser is increased, and the thermal resistance of the thermosiphon radiator is increased. However, the flow resistance of the condensate in a single liquid return pipe is large, the condensate is distributed unevenly in the evaporator, and the supplement of the condensate in the evaporator is seriously influenced, so that how to improve the heat dissipation performance becomes the research direction of the technical personnel in the field.

Disclosure of Invention

The utility model aims at providing a siphon radiator, this siphon radiator can reduce refrigerant backward flow resistance, promotes heat dispersion.

In order to achieve the above purpose, the utility model adopts the technical scheme that: the siphon radiator comprises a condenser, an evaporator, a return pipe and a steam pipe, wherein the return pipe and the steam pipe are arranged between the evaporator and the condenser, the steam pipe is located above the return pipe, at least two return pipes are arranged, a liquid storage tank is arranged on one side of the condenser, and the return pipe is communicated into the liquid storage tank.

The further improved scheme in the technical scheme is as follows:

1. in the above scheme, at least one first fin group is arranged in the condenser.

2. In the above scheme, at least one second fin group is arranged in the evaporator.

3. In the above scheme, the condenser and the evaporator are filled with refrigerant.

4. In the above scheme, the liquid storage tank is a sunken groove arranged in the condenser.

5. In the above scheme, the first fin group is connected inside the condenser in a gluing or welding manner.

6. In the above scheme, the second fin group is connected inside the evaporator in a gluing or welding manner.

7. In the above scheme, the diameter of the steam pipe is larger than that of the return pipe.

Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:

1. the utility model discloses siphon radiator, it sets up two piece at least back flows between evaporimeter and condenser, can effectively reduce refrigerant backward flow resistance, increase the reflux speed of refrigerant from condenser to evaporimeter, promote the storage capacity of refrigerant in the evaporimeter, can satisfy the cooling demand under high-power, prevent that the heat too much leads to the defect that refrigerant is too few and can't in time cool down in the evaporimeter, set up the reservoir simultaneously in the condenser, can concentrate the refrigerant, increase the reflux speed, be favorable to the continuity of refrigerant to flow back.

2. The utility model discloses siphon radiator, it sets up first fin group in the condenser, and multiplicable heat radiating area increases the rate of condensation simultaneously, sets up second fin group in the evaporimeter, is favorable to the heat diffusion, avoids thermal concentrated, also can make refrigerant evenly distributed in the evaporimeter, increases heat radiating area, and first fin group and second fin group have promoted the heat dispersion of radiator jointly.

Drawings

FIG. 1 is a schematic view of the siphon radiator of the present invention;

FIG. 2 is a schematic view of a liquid storage tank structure in the siphon radiator of the present invention;

FIG. 3 is a schematic view of the internal structure of the siphon heat sink of the present invention;

fig. 4 is a side view of the internal structure of the siphon heat sink of the present invention.

In the above drawings: 1. a condenser; 2. an evaporator; 3. a return pipe; 4. a steam pipe; 5. a liquid storage tank; 6. a first fin group; 7. a second fin group.

Detailed Description

In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.

Example 1: the utility model provides a siphon radiator, includes condenser 1, evaporimeter 2, back flow 3 and steam pipe 4, be equipped with back flow 3 and steam pipe 4 between evaporimeter 2 and the condenser 1, steam pipe 4 is located back flow 3 top, back flow 3 is equipped with two at least, 1 one side of condenser is equipped with reservoir 5, back flow 3 communicates to in the reservoir 5.

Two first fin groups 6 are arranged in the condenser 1.

The evaporator 2 has three second fin groups 7 inside.

The condenser 1 and the evaporator 2 are filled with a refrigerant.

The liquid storage tank 5 is a sunken groove arranged inside the condenser 1.

The first fin group 6 is attached to the inside of the condenser 1 by gluing.

The second fin group 7 is connected to the inside of the evaporator 2 by welding.

The diameter of the steam pipe 4 is larger than that of the return pipe 3.

Example 2: the utility model provides a siphon radiator, includes condenser 1, evaporimeter 2, back flow 3 and steam pipe 4, be equipped with back flow 3 and steam pipe 4 between evaporimeter 2 and the condenser 1, steam pipe 4 is located back flow 3 top, back flow 3 is equipped with two at least, 1 one side of condenser is equipped with reservoir 5, back flow 3 communicates to in the reservoir 5.

The condenser 1 has three first fin groups 6 inside.

The evaporator 2 has three second fin groups 7 inside.

The condenser 1 and the evaporator 2 are filled with a refrigerant.

The liquid storage tank 5 is a sunken groove arranged inside the condenser 1.

The first fin group 6 is attached to the inside of the condenser 1 by gluing.

The second fin group 7 is attached to the inside of the evaporator 2 by gluing.

The diameter of the steam pipe 4 is larger than that of the return pipe 3.

When adopting above-mentioned siphon radiator, it sets up two piece at least back flows between evaporimeter and condenser, can effectively reduce refrigerant backflow resistance, increase the backward flow speed of refrigerant from condenser to evaporimeter, promote the storage capacity of refrigerant in the evaporimeter, can satisfy the cooling demand under high-power, prevent that the heat is too much to lead to in the evaporimeter refrigerant too few and the defect of unable timely cooling, set up the reservoir in the condenser simultaneously, can concentrate the refrigerant, increase the backward flow speed, be favorable to the continuity of refrigerant to flow backward.

In addition, the first fin group is arranged in the condenser, so that the heat dissipation area can be increased, the condensation speed can be increased, the second fin group is arranged in the evaporator, the heat diffusion is facilitated, the heat concentration is avoided, the refrigerant can be uniformly distributed in the evaporator, the heat dissipation area is increased, and the heat dissipation performance of the radiator is improved by the first fin group and the second fin group together.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims

1. A siphon radiator is characterized in that: including condenser (1), evaporimeter (2), back flow (3) and steam pipe (4), be equipped with back flow (3) and steam pipe (4) between evaporimeter (2) and condenser (1), steam pipe (4) are located back flow (3) top, back flow (3) are equipped with two at least, condenser (1) one side is equipped with reservoir (5), back flow (3) communicate to in reservoir (5).

2. A siphon heat sink according to claim 1, characterised in that: at least one first fin group (6) is arranged in the condenser (1).

3. A siphon heat sink according to claim 1, characterised in that: at least one second fin group (7) is arranged in the evaporator (2).

4. A siphon heat sink according to claim 1, characterised in that: the condenser (1) and the evaporator (2) are filled with a refrigerant.

5. A siphon heat sink according to claim 1, characterised in that: the liquid storage tank (5) is a sunken groove arranged in the condenser (1).

6. A siphon heat sink according to claim 2, characterised in that: the first fin group (6) is connected to the interior of the condenser (1) in a gluing or welding mode.

7. A siphon heat sink according to claim 3, characterised in that: the second fin group (7) is connected to the inside of the evaporator (2) through gluing or welding.

8. A siphon heat sink according to claim 1, characterised in that: the diameter of the steam pipe (4) is larger than that of the return pipe (3).