TWI815096B - Liquid cooling loop heat sink and cooling system having the same - Google Patents

Abstract

A liquid cooling loop heat sink and cooling system having the same are provided. The heat sink has a power-allocate assembly and two gather-transport members. The power-allocate assembly has a first water reservoir for heat dissipation, a second water reservoir for heat dissipation, a plurality of heat dissipation pumps arranged on the first water reservoir for heat dissipation, and a plurality of tandem pipes and cooling heads corresponding to each heat dissipation pump. The two gather-transport members respectively connect to the first water reservoir for heat dissipation and the second water reservoir for heat dissipation, and are respectively arranged on two sides of the power- allocate assembly. Wherein, the tandem pipes tandem connect to the cooling heads to connect between the first water reservoir for heat dissipation and the second water reservoir for heat dissipation.

Description

Liquid cooling circuit cooling device and its cooling system

The present invention relates to a heat dissipation device, in particular to a liquid cooling circuit heat dissipation device and its heat dissipation system.

Press, in the past, water-cooled heat dissipation devices or systems used in electronic heating applications such as servers mainly distributed coolant through a water tank to the water-cooled heads in each server case, and each water-cooled head was connected to the water tank through a water tank. After the circulation loop is connected, the coolant can be transported to the water block of the corresponding heat source, so that the water block absorbs the high temperature generated by the heat source and then sends the coolant back to the water tank for cooling.

In the traditional design of the circulation loop in each server casing, the coolant is usually transported in a certain flow direction through a single pump. However, as the number of operating components required inside today's server boards increases, it has become normal to connect multiple water-cooling heads in series, and a single pump connected in series will have insufficient power to affect the flow of coolant; By simply adding additional pumps, it is difficult to effectively utilize the power of each pump, resulting in an uneven coolant flow rate.

In view of this, in order to improve and solve the above-mentioned deficiencies, the inventor of the present invention devoted himself to research and combined with the application of academic theory, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned deficiencies.

The main purpose of the present invention is to provide a liquid cooling circuit heat dissipation device and its heat dissipation system, which is designed through the arrangement of multiple water pumps to facilitate installation in a limited space, and at the same time, it can effectively provide cooling liquid transportation power and is easy to control. flow.

In order to achieve the above object, the present invention provides a liquid cooling circuit heat dissipation device including a power distribution assembly and two collection and transmission parts. The power distribution assembly includes a first water reservoir for heat dissipation, a second water reservoir for heat dissipation, and a plurality of water storage units for heat dissipation. A heat dissipation water pump is provided on the first water reservoir for heat dissipation, as well as series pipelines and cooling heads respectively corresponding to each heat dissipation water pump, and the two collection and delivery assemblies are respectively connected to the first water reservoir for heat dissipation and the second heat dissipation water reservoir. The water reservoirs are respectively arranged on two sides of the power distribution assembly; wherein, the series pipeline is connected in series with the cooling head and is connected between the first water reservoir for heat dissipation and the second water reservoir for heat dissipation.

In order to achieve the above object, the present invention provides a liquid cooling circuit heat dissipation system, a main control box, a plurality of casings, and two shunt components; each casing is stacked on top and bottom of each other and is stacked on the main control box. above, and each casing is equipped with a liquid-cooling circuit heat dissipation device, and two branching components are located outside the stacked side of each casing and are connected to the liquid-cooling circuit radiator in each casing; wherein, each The liquid cooling circuit heat dissipation device includes a power distribution component and two collection and transmission components. The power distribution component includes a first water reservoir for heat dissipation, a second water reservoir for heat dissipation, and a plurality of plurality of first water reservoirs for heat dissipation. A heat dissipation water pump, and a series pipeline and a cooling head respectively corresponding to each heat dissipation water pump. The series pipeline is connected in series with the cooling head and is connected between the first water reservoir for heat dissipation and the second water reservoir for heat dissipation, and The two collecting and conveying assemblies are respectively connected to the first water reservoir for heat dissipation and the second water reservoir for heat dissipation, and are respectively arranged on two sides of the power distribution component.

<Invention>

1: Main control box

2: Receiver

20:Server board

3: Diversion component

30: Water reservoir for diversion

31:Connecting pipe

32: Diversion water pump

320:Curved pipe

4: Liquid cooling circuit cooling device

40: Power distribution components

400: The first water reservoir for heat dissipation

401: Second water reservoir for heat dissipation

402:Heating water pump

403:Series pipeline

403a: First pipeline

403b: Second pipeline

403c: Third pipeline

404:Cooling head

404a: First cooling head

404b: Second cooling head

41:Collect conveyor components

Figure 1 is a schematic three-dimensional appearance diagram of the liquid cooling circuit heat dissipation system of the present invention.

Figure 2 is a partially enlarged schematic diagram of the liquid cooling circuit heat dissipation system of the present invention from another perspective.

Figure 3 is a schematic plan view of the liquid cooling circuit heat dissipation device of the present invention installed in the casing.

Figure 4 is a schematic three-dimensional view of the liquid cooling circuit heat dissipation device of the present invention.

Figure 5 is a partial cross-sectional schematic diagram of the liquid cooling circuit heat dissipation device of the present invention.

Figure 6 is a schematic diagram of the flow diverting component of the present invention.

In order to enable the examining committee to further understand the characteristics and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the attached drawings are only for reference and illustration and are not intended to limit the present invention. .

Please refer to FIGS. 1 and 2 , which are respectively a three-dimensional schematic view of the liquid cooling circuit heat dissipation system of the present invention and a partially enlarged schematic view from another perspective. The invention provides a liquid cooling circuit heat dissipation device and its heat dissipation system. The liquid cooling circuit heat dissipation system includes a main control box 1, a plurality of casings 2 stacked on the main control box, and at least two casings 2 respectively connected to the main control box. There is a branching component 3 between the box 1 and each casing 2, and the liquid cooling circuit heat dissipation device 4 is located inside each casing 2 and communicates with the two shunting components 3; wherein: the main control box 1 can be a The water tank can also be a chassis with components such as a main pump, a water tank, and a heat exchanger. Furthermore, it can also be equipped with a control system (CDU, cooling distribution unit) to control the operation of the pump and the heat exchanger. Perform detection and other tasks efficiently.

Please refer to Figure 3 as well. The casings 2 can be equipped with an electronic operation unit, such as a server board 20, and are stacked on top and bottom of each other and are stacked on the above-mentioned main control box 1. superior. Each casing 2 is equipped with the above-mentioned liquid cooling circuit heat dissipation device 4, and the liquid cooling circuit heat dissipation device 4 and the above-mentioned two branching structures are After the components 3 are connected, the coolant in the main control box 1 can be transported to the liquid cooling circuit heat dissipation device 4 through the distribution component 3, thereby providing heat dissipation for electronic operating units such as server boards.

Please refer to Figures 1 and 2 again. The two diverting members 3 are arranged outside one side of the stacked casings 2, and the two diverting members 3 can be on the same side or on different sides. Each diverting component 3 has a diverting water reservoir 30 , a connecting pipe 31 connected from the main control box 1 to the diverting water reservoir 30 , and a plurality of diverting water pumps provided on the diverting water reservoir 30 32, and the diversion water reservoir 30 is in the shape of a long strip along the direction in which each casing 2 is stacked up and down, so that each diversion water pump 32 can be used along the long strip of water for diversion. The water reservoirs 30 are arranged in sequence and are in power communication. Each diversion water pump 32 has a curved pipe 320 connected to the interior of the corresponding casing 2 and connected to the above-mentioned liquid cooling circuit heat dissipation device 4, as shown in Figure 3 shown.

Please refer to Figures 3, 4 and 5 again. The liquid cooling circuit heat dissipation device 4 includes a power distribution assembly 40 and two collection and transmission assemblies 41. The power distribution assembly 40 includes a first water reservoir for heat dissipation. 400. A second water reservoir 401 for heat dissipation, a plurality of heat dissipation water pumps 402 provided on the first heat dissipation water reservoir 400, and series pipes 403 and cooling heads 404 corresponding to each heat dissipation water pump 402, and The two collecting and conveying assemblies 41 are respectively connected to the first water reservoir 400 for heat dissipation and the second water reservoir 401 for heat dissipation, and are respectively arranged on two sides of the power distribution assembly 40, thereby extending to the two branching members 3 mentioned above. It is connected with the curved pipes 320 of each branch water pump 32 to provide cooling liquid for circulation and heat dissipation. In more detail, the above-mentioned series pipeline 403 can be segmented into a first pipeline 403a, a second pipeline 403b and a third pipeline 403c, and the cooling heads 404 can be added to multiple numbers according to the required heat sources, for example The first cooling head 404a and the second cooling head 404b are connected in series between the first water reservoir 400 for heat dissipation and the second water reservoir 401 for heat dissipation through the first, second and third pipelines 403a, 403b and 403c. , so that each cooling water pump 402 can provide the cooling liquid driving power required in each series pipeline 403, and at the same time have the cooling function The effect of dispersing and concentrating the coolant is achieved by using the first water reservoir 400 for heat dissipation and the second water reservoir 401 for heat dissipation arranged on both sides of the power distribution assembly 40 to meet the needs of cooling liquid inlet and outlet. Under the influence or avoidance of the configuration and arrangement of the series pipeline 403 and the cooling head 404 corresponding to each heat source, they are connected with the two branching components 3 to form a circulation loop, and each heat dissipation water pump 402 on the circulation loop can control each The driving force of the coolant in the series pipeline 403 is consistent to achieve uniform cooling and heat dissipation.

Following the above, as shown in Figure 5, the second water reservoir 401 for heat dissipation can be horizontally parallel to the first water reservoir 400 for heat dissipation and located at a lower position inside the first water reservoir 400 for heat dissipation. The water pump 402 is disposed above the first water reservoir 400 for heat dissipation, and the first pipeline 403a can be higher than the second and third pipelines 403b, 403c and each cooling head 404 to facilitate return flow. The three pipes 403b and 403c may also have curved sections and be connected to the lower second water reservoir 401 for heat dissipation.

In addition, as shown in FIG. 6 , the diverting water pump 32 of each diverting member 3 is arranged on one side of the diverting water reservoir 30 , and the side refers to the side of the diverting water reservoir 30 facing each casing 2 For example, the side where the diverting water reservoirs 30 of the two diverting members 3 face each other is the side; of course, it can also be the side facing away from each other, or the aforementioned facing and facing away sides. Arrange in a staggered manner on both sides. In this way, a wider distance D can be provided between the diverting water reservoir 30 of each diverting component 3 and the casing 2 to configure the curved pipe 320, so that the curved pipe 320 can have a sufficient extension length for separation. The flowing water pump 32 drives the coolant into the liquid cooling circuit radiator 4, or the liquid cooling circuit radiator 4 is pumped out by the diverted water pump 32 into the diverting water reservoir 30.

Therefore, through the above-mentioned structural composition, the liquid cooling circuit heat dissipation device and its heat dissipation system of the present invention can be obtained.

To sum up, it is clear that the present invention can achieve the expected purpose of use and solve the deficiencies of conventional knowledge, and because it is extremely novel and progressive, it fully meets the requirements for application for an invention patent. Please file an application in accordance with the patent law. Please check carefully and The patent in this case is granted to protect the rights of the inventor.

However, the above descriptions are only the best possible embodiments of the present invention, and they do not limit the patent scope of the present invention. Therefore, all changes in equivalent technologies, means, etc. that are made by using the contents of the description and drawings of the present invention are equally applicable. Included within the scope of the present invention, it is stated here.

320:Curved pipe

4: Liquid cooling circuit cooling device

40: Power distribution components

400: The first water reservoir for heat dissipation

401: Second water reservoir for heat dissipation

402:Heating water pump

403:Series pipeline

403a: First pipeline

403b: Second pipeline

403c: Third pipeline

404:Cooling head

404a: First cooling head

404b: Second cooling head

41:Collect conveyor components

Claims (10)

A liquid cooling circuit heat dissipation device, including: a power distribution component, including a first water reservoir for heat dissipation, a second water reservoir for heat dissipation, and a plurality of heat dissipation water pumps provided on the first water reservoir for heat dissipation, And the series pipelines and cooling heads respectively corresponding to the heat dissipation water pumps; and two collection and transmission assemblies respectively connected to the first water reservoir for heat dissipation and the second water reservoir for heat dissipation, and respectively configured in the power distribution assembly on both sides; wherein, the series pipeline is connected in series with the cooling head and is connected between the first water reservoir for heat dissipation and the second water reservoir for heat dissipation. The liquid cooling circuit heat dissipation device according to claim 1, wherein the series pipeline is segmented into a first pipeline, a second pipeline and a third pipeline, and the cooling heads are added to plural numbers, And connect the cooling heads in series through the first, second and third pipelines. The liquid cooling circuit heat dissipation device according to claim 1, wherein the second water reservoir for heat dissipation is horizontally parallel to the first water reservoir for heat dissipation and is located inside the first water reservoir for heat dissipation. The liquid cooling circuit heat dissipation device of claim 3, wherein the second water reservoir for heat dissipation is lower than the first water reservoir for heat dissipation. The liquid cooling circuit heat dissipation device according to claim 3, wherein the heat dissipation water pumps are arranged above the first water reservoir for heat dissipation. A liquid cooling circuit heat dissipation system, including: a main control box; a plurality of casings, which are stacked on top and bottom of each other and are stacked on the main control box, and each of the casings is equipped with a liquid cooling circuit for heat dissipation device; and Two branching components are located outside one side of the stacked casings and are connected to the liquid cooling circuit heat dissipation device in each of the casings; wherein each of the liquid cooling circuit heat dissipation devices includes: a power distribution component, It includes a first water reservoir for heat dissipation, a second water reservoir for heat dissipation, a plurality of heat dissipation water pumps provided on the first heat dissipation water reservoir, and series pipes and cooling pipes respectively corresponding to the heat dissipation water pumps. head, the series pipeline is connected in series with the cooling head and is connected between the first water reservoir for heat dissipation and the second water reservoir for heat dissipation; and two collection and delivery assemblies are respectively connected to the first water reservoir for heat dissipation. and the second water reservoir for heat dissipation, and are respectively arranged on two sides of the power distribution assembly. The liquid cooling circuit heat dissipation system as described in claim 6, wherein the two branching components each have a water distribution reservoir, a connecting pipe connected from the main control box to the water distribution reservoir, and a plurality of connecting pipes connected to the water distribution reservoir. The diversion water pump is provided on the water reservoir for diversion, and each of the diversion water pumps has a curved pipe connected to the corresponding liquid cooling circuit heat dissipation device inside the casing. The liquid cooling circuit heat dissipation system of claim 7, wherein the diversion water reservoir is in a strip shape along the direction in which the upper and lower parts of the casings are stacked. The liquid cooling circuit heat dissipation system according to any one of claims 6 to 8, wherein the series pipelines of each liquid cooling circuit heat dissipation device are segmented into a first pipeline, a second pipeline and a first pipeline. There are three pipelines, and the cooling heads are added to plural numbers, and the cooling heads are connected in series through the first, second and third pipelines. The liquid cooling circuit heat dissipation system according to any one of claims 6 to 8, wherein the second water reservoir for heat dissipation of each liquid cooling circuit heat dissipation device is horizontally parallel to the first water reservoir for heat dissipation and located in the heat dissipation device. Inside the first water reservoir.

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