TWI815096B - Liquid cooling loop heat sink and cooling system having the same - Google Patents
Liquid cooling loop heat sink and cooling system having the same Download PDFInfo
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- TWI815096B TWI815096B TW110109539A TW110109539A TWI815096B TW I815096 B TWI815096 B TW I815096B TW 110109539 A TW110109539 A TW 110109539A TW 110109539 A TW110109539 A TW 110109539A TW I815096 B TWI815096 B TW I815096B
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- heat dissipation
- water reservoir
- water
- liquid cooling
- cooling circuit
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- 238000001816 cooling Methods 0.000 title claims abstract description 79
- 239000007788 liquid Substances 0.000 title claims abstract description 42
- 230000017525 heat dissipation Effects 0.000 claims abstract description 123
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 113
- 230000000712 assembly Effects 0.000 claims description 6
- 238000000429 assembly Methods 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000002826 coolant Substances 0.000 description 10
- 239000000110 cooling liquid Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000007812 deficiency Effects 0.000 description 3
- 239000008236 heating water Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Sampling And Sample Adjustment (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本發明係與一種散熱裝置有關,尤指一種液冷迴路散熱裝置及其散熱系統。 The present invention relates to a heat dissipation device, in particular to a liquid cooling circuit heat dissipation device and its heat dissipation system.
按,以往用於如伺服器等電子發熱場合的水冷式散熱裝置或系統,主要係透過一水箱將冷卻液分送至各伺服器機匣內的水冷頭上,且各水冷頭透過一與水箱連通的循環迴路作連接後,使冷卻液可被輸送至所對應熱源的水冷頭上,以藉由水冷頭吸收熱源產生的高溫後,再將冷卻液輸送回水箱作冷卻。 Press, in the past, water-cooled heat dissipation devices or systems used in electronic heating applications such as servers mainly distributed coolant through a water tank to the water-cooled heads in each server case, and each water-cooled head was connected to the water tank through a water tank. After the circulation loop is connected, the coolant can be transported to the water block of the corresponding heat source, so that the water block absorbs the high temperature generated by the heat source and then sends the coolant back to the water tank for cooling.
而傳統在各伺服器機匣內的循環迴路之設計上,通常是透過單一泵浦將冷卻液以一定的流向作輸送。但在對應現今伺服器機板內部的所需的運作元件增加的情況下,其串聯複數水冷頭已為常態,而單一泵浦通過串聯的方式將影響冷卻液在流動上的動力較為不足;而透過單純增設泵浦的設計下,也難以有效發揮每一泵浦的動力,使得冷卻液的流量也不夠平均。 In the traditional design of the circulation loop in each server casing, the coolant is usually transported in a certain flow direction through a single pump. However, as the number of operating components required inside today's server boards increases, it has become normal to connect multiple water-cooling heads in series, and a single pump connected in series will have insufficient power to affect the flow of coolant; By simply adding additional pumps, it is difficult to effectively utilize the power of each pump, resulting in an uneven coolant flow rate.
有鑑於此,本發明人係為改善並解決上述之缺失,乃特潛心研究並配合學理之運用,終於提出一種設計合理且有效改善上述缺失之本發明。 In view of this, in order to improve and solve the above-mentioned deficiencies, the inventor of the present invention devoted himself to research and combined with the application of academic theory, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned deficiencies.
本發明之主要目的,在於可提供一種液冷迴路散熱裝置及其散熱系統,其係透過複數水泵的排列設計,以在有限的空間下便於安裝,同時能有效提供冷卻液輸送動力,且便於控制流量。 The main purpose of the present invention is to provide a liquid cooling circuit heat dissipation device and its heat dissipation system, which is designed through the arrangement of multiple water pumps to facilitate installation in a limited space, and at the same time, it can effectively provide cooling liquid transportation power and is easy to control. flow.
為了達成上述之目的,本發明係提供一種液冷迴路散熱裝置包括一動力分配組件與二匯集輸送件,動力分配組件包含一散熱用第一蓄水器、一散熱用第二蓄水器、複數設於散熱用第一蓄水器上的散熱用水泵、以及分別對應各散熱用水泵的串聯管路與冷卻頭,而二匯集輸送組件分別連通散熱用第一蓄水器與散熱用第二蓄水器,並分別配置於動力分配組件的二側處;其中,所述串聯管路串聯冷卻頭而連通於散熱用第一蓄水器與散熱用第二蓄水器之間。 In order to achieve the above object, the present invention provides a liquid cooling circuit heat dissipation device including a power distribution assembly and two collection and transmission parts. The power distribution assembly includes a first water reservoir for heat dissipation, a second water reservoir for heat dissipation, and a plurality of water storage units for heat dissipation. A heat dissipation water pump is provided on the first water reservoir for heat dissipation, as well as series pipelines and cooling heads respectively corresponding to each heat dissipation water pump, and the two collection and delivery assemblies are respectively connected to the first water reservoir for heat dissipation and the second heat dissipation water reservoir. The water reservoirs are respectively arranged on two sides of the power distribution assembly; wherein, the series pipeline is connected in series with the cooling head and is connected between the first water reservoir for heat dissipation and the second water reservoir for heat dissipation.
為了達成上述之目的,本發明係提供一種液冷迴路散熱系統,一主控箱、複數機匣、以及二分流構件;各機匣彼此上、下相疊置而一併疊設於主控箱上,且各機匣內皆設有一液冷迴路散熱裝置,而二分流構件設於各機匣疊置後的一側外,並與各機匣內的液冷迴路散熱裝置連通;其中,各該液冷迴路散熱裝置包括一動力分配組件與二匯集輸送件,動力分配組件包含一散熱用第一蓄水器、一散熱用第二蓄水器、複數設於散熱用第一蓄水器上的散熱用水泵、以及分別對應各散熱用水泵的串聯管路與冷卻頭,所述串聯管路串聯冷卻頭而連通於散熱用第一蓄水器與散熱用第二蓄水器之間,而二匯集輸送組件分別連通散熱用第一蓄水器與散熱用第二蓄水器,並分別配置於動力分配組件的二側處。 In order to achieve the above object, the present invention provides a liquid cooling circuit heat dissipation system, a main control box, a plurality of casings, and two shunt components; each casing is stacked on top and bottom of each other and is stacked on the main control box. above, and each casing is equipped with a liquid-cooling circuit heat dissipation device, and two branching components are located outside the stacked side of each casing and are connected to the liquid-cooling circuit radiator in each casing; wherein, each The liquid cooling circuit heat dissipation device includes a power distribution component and two collection and transmission components. The power distribution component includes a first water reservoir for heat dissipation, a second water reservoir for heat dissipation, and a plurality of plurality of first water reservoirs for heat dissipation. A heat dissipation water pump, and a series pipeline and a cooling head respectively corresponding to each heat dissipation water pump. The series pipeline is connected in series with the cooling head and is connected between the first water reservoir for heat dissipation and the second water reservoir for heat dissipation, and The two collecting and conveying assemblies are respectively connected to the first water reservoir for heat dissipation and the second water reservoir for heat dissipation, and are respectively arranged on two sides of the power distribution component.
<本發明> <Invention>
1:主控箱 1: Main control box
2:機匣 2: Receiver
20:伺服器機板 20:Server board
3:分流構件 3: Diversion component
30:分流用蓄水器 30: Water reservoir for diversion
31:連接管 31:Connecting pipe
32:分流用水泵 32: Diversion water pump
320:曲管 320:Curved pipe
4:液冷迴路散熱裝置 4: Liquid cooling circuit cooling device
40:動力分配組件 40: Power distribution components
400:散熱用第一蓄水器 400: The first water reservoir for heat dissipation
401:散熱用第二蓄水器 401: Second water reservoir for heat dissipation
402:散熱用水泵 402:Heating water pump
403:串聯管路 403:Series pipeline
403a:第一管路 403a: First pipeline
403b:第二管路 403b: Second pipeline
403c:第三管路 403c: Third pipeline
404:冷卻頭 404:Cooling head
404a:第一冷卻頭 404a: First cooling head
404b:第二冷卻頭 404b: Second cooling head
41:匯集輸送組件 41:Collect conveyor components
圖1係本發明液冷迴路散熱系統之立體外觀示意圖。 Figure 1 is a schematic three-dimensional appearance diagram of the liquid cooling circuit heat dissipation system of the present invention.
圖2係本發明液冷迴路散熱系統另一視角之局部放大示意圖。 Figure 2 is a partially enlarged schematic diagram of the liquid cooling circuit heat dissipation system of the present invention from another perspective.
圖3係本發明液冷迴路散熱裝置設於機匣內之平面示意圖。 Figure 3 is a schematic plan view of the liquid cooling circuit heat dissipation device of the present invention installed in the casing.
圖4係本發明液冷迴路散熱裝置之立體外觀示意圖。 Figure 4 is a schematic three-dimensional view of the liquid cooling circuit heat dissipation device of the present invention.
圖5係本發明液冷迴路散熱裝置之局部剖面示意圖。 Figure 5 is a partial cross-sectional schematic diagram of the liquid cooling circuit heat dissipation device of the present invention.
圖6係本發明分流構件之示意圖。 Figure 6 is a schematic diagram of the flow diverting component of the present invention.
為了使 貴審查委員能更進一步瞭解本發明之特徵及技術內容,請參閱以下有關本發明之詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。 In order to enable the examining committee to further understand the characteristics and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the attached drawings are only for reference and illustration and are not intended to limit the present invention. .
請參閱圖1及圖2,係分別為本發明液冷迴路散熱系統之立體外觀示意圖及另一視角之局部放大示意圖。本發明係提供一種液冷迴路散熱裝置及其散熱系統,該液冷迴路散熱系統包括一主控箱1、複數疊置於該主控箱上的機匣2、以及至少二分別連通於主控箱1與各機匣2間的分流構件3,而所述液冷迴路散熱裝置4即設於各該機匣2內部,並與二分流構件3連通;其中:該主控箱1可以是一水箱、也可以是一機箱內設有主泵浦、水箱及熱交換器等組件;更進一步地,還可以具備一控制系統(CDU,cooling distribution unit),用以控制泵浦運轉及對於熱交換效率進行偵測等工作。
Please refer to FIGS. 1 and 2 , which are respectively a three-dimensional schematic view of the liquid cooling circuit heat dissipation system of the present invention and a partially enlarged schematic view from another perspective. The invention provides a liquid cooling circuit heat dissipation device and its heat dissipation system. The liquid cooling circuit heat dissipation system includes a
請一併參閱圖3所示,該等機匣2內係可供一電子運作單元設置,如伺服器機板20,並彼此上、下相疊置而一併疊設於上述主控箱1上。而各機匣2內即係設有上述液冷迴路散熱裝置4,液冷迴路散熱裝置4與上述二分流構
件3連通後,即可由主控箱1內的冷卻液透過分流構件3而輸送至液冷迴路散熱裝置4,藉以提供如伺服器機板等電子運作單元進行散熱。
Please refer to Figure 3 as well. The
再請參閱圖1及圖2所示,該二分流構件3係設於上述各機匣2疊置後的一側外,且該二分流構件3可為同一側或不同側。各分流構件3皆具有一分流用蓄水器30、一由主控箱1連通至該分流用蓄水器30的連接管31、以及複數設於該分流用蓄水器30上的分流用水泵32,且該分流用蓄水器30係沿著各機匣2上、下疊置的方向而呈長條狀者,以供各分流用水泵32沿著所述呈長條狀的該分流用蓄水器30而依序配置且作動力連通,各分流用水泵32皆具有一曲管320連通至所對應的機匣2內部,並與上述液冷迴路散熱裝置4相連接,即如圖3所示。
Please refer to Figures 1 and 2 again. The two
再請參閱圖3、圖4及圖5所示,該液冷迴路散熱裝置4係包括一動力分配組件40、以及二匯集輸送組件41,該動力分配組件40包含一散熱用第一蓄水器400、一散熱用第二蓄水器401、複數設於該散熱用第一蓄水器400上的散熱用水泵402、以及分別對應各散熱用水泵402的串聯管路403與冷卻頭404,而二匯集輸送組件41則分別連通散熱用第一蓄水器400與散熱用第二蓄水器401,並分別配置於該動力分配組件40的二側處,從而延伸至與上述二分流構件3處而與各分流用水泵32的曲管320相連通,進而提供冷卻液進行循環散熱。更詳細地,上述串聯管路403可分段為一第一管路403a、一第二管路403b與一第三管路403c,而冷卻頭404可根據所需的熱源而增設為複數,例如第一冷卻頭404a與第二冷卻頭404b,並透過第一、二及三管路403a、403b及403c串聯而連通於散熱用第一蓄水器400與散熱用第二蓄水器401之間,以供各該散熱用水泵402皆可提供每一串聯管路403內所需要的冷卻液推動動力,同時兼具冷
卻液分散與集中之效,再藉由配置於動力分配組件40二側的散熱用第一蓄水器400與散熱用第二蓄水器401作為冷卻液進、出之所需,可在不影響或避開串聯管路403與冷卻頭404為對應各熱源所作的配置與排列下,與二分流構件3連通而構成循環迴路,並維持循環迴路上各該散熱用水泵402都能控制每一串聯管路403內對冷卻液的推動動力一致,以達均勻冷卻進行散熱之目的。
Please refer to Figures 3, 4 and 5 again. The liquid cooling circuit
承上,如圖5所示,上述散熱用第二蓄水器401可與散熱用第一蓄水器400橫向並列且位於該散熱用第一蓄水器400內側較低處,以供各散熱用水泵402配置於該散熱用第一蓄水器400的上方位置處,而第一管路403a可高於第二、三管路403b、403c與各冷卻頭404而便於迴流,同時第二、三管路403b、403c也可具有彎曲段而連接至位於較低的散熱用第二蓄水器401。
Following the above, as shown in Figure 5, the
此外,如圖6所示上述各分流構件3的分流用水泵32配置於分流用蓄水器30的一側處,所述一側係指該分流用蓄水器30面向各機匣2的側向位置,例如二分流構件3之分流用蓄水器30彼此相面對的一側即是;當然,亦可為彼此相背對的一側、或是為前述相面對與相背對的二側作交錯排列。如此,各分流構件3之分流用蓄水器30與機匣2之間可提供較寬的距離D而配置所述曲管320,使所述曲管320能有足夠的延伸長度而能供分流用水泵32將冷卻液打入液冷迴路散熱裝置4、或由液冷迴路散熱裝置4被分流用水泵32打出至分流用蓄水器30內。
In addition, as shown in FIG. 6 , the diverting
是以,藉由上述之構造組成,即可得到本發明液冷迴路散熱裝置及其散熱系統。 Therefore, through the above-mentioned structural composition, the liquid cooling circuit heat dissipation device and its heat dissipation system of the present invention can be obtained.
綜上所述,本發明確可達到預期之使用目的,而解決習知之缺失,又因極具新穎性及進步性,完全符合發明專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障發明人之權利。 To sum up, it is clear that the present invention can achieve the expected purpose of use and solve the deficiencies of conventional knowledge, and because it is extremely novel and progressive, it fully meets the requirements for application for an invention patent. Please file an application in accordance with the patent law. Please check carefully and The patent in this case is granted to protect the rights of the inventor.
惟以上所述僅為本發明之較佳可行實施例,非因此即拘限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之等效技術、手段等變化,均同理皆包含於本發明之範圍內,合予陳明。 However, the above descriptions are only the best possible embodiments of the present invention, and they do not limit the patent scope of the present invention. Therefore, all changes in equivalent technologies, means, etc. that are made by using the contents of the description and drawings of the present invention are equally applicable. Included within the scope of the present invention, it is stated here.
320:曲管 320:Curved pipe
4:液冷迴路散熱裝置 4: Liquid cooling circuit cooling device
40:動力分配組件 40: Power distribution components
400:散熱用第一蓄水器 400: The first water reservoir for heat dissipation
401:散熱用第二蓄水器 401: Second water reservoir for heat dissipation
402:散熱用水泵 402:Heating water pump
403:串聯管路 403:Series pipeline
403a:第一管路 403a: First pipeline
403b:第二管路 403b: Second pipeline
403c:第三管路 403c: Third pipeline
404:冷卻頭 404:Cooling head
404a:第一冷卻頭 404a: First cooling head
404b:第二冷卻頭 404b: Second cooling head
41:匯集輸送組件 41:Collect conveyor components
Claims (10)
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201039649Y (en) * | 2007-04-03 | 2008-03-19 | 万在工业股份有限公司 | Liquid-cooling heat radiator |
US20110026225A1 (en) * | 2009-07-31 | 2011-02-03 | Sun Microsystems, Inc. | Method and Apparatus for Liquid Cooling Computer Equipment |
CN106470537A (en) * | 2015-08-14 | 2017-03-01 | 中兴通讯股份有限公司 | Veneer liquid cooling heat radiation system and rack |
CN110062560A (en) * | 2019-03-14 | 2019-07-26 | 华为技术有限公司 | Heat dissipating method, radiator and cabinet |
TWI688331B (en) * | 2019-02-01 | 2020-03-11 | 邁萪科技股份有限公司 | Flow uniformized pressured liquid heat dissipation system |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201039649Y (en) * | 2007-04-03 | 2008-03-19 | 万在工业股份有限公司 | Liquid-cooling heat radiator |
US20110026225A1 (en) * | 2009-07-31 | 2011-02-03 | Sun Microsystems, Inc. | Method and Apparatus for Liquid Cooling Computer Equipment |
CN106470537A (en) * | 2015-08-14 | 2017-03-01 | 中兴通讯股份有限公司 | Veneer liquid cooling heat radiation system and rack |
TWI688331B (en) * | 2019-02-01 | 2020-03-11 | 邁萪科技股份有限公司 | Flow uniformized pressured liquid heat dissipation system |
CN110062560A (en) * | 2019-03-14 | 2019-07-26 | 华为技术有限公司 | Heat dissipating method, radiator and cabinet |
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