TWM579757U - Three-dimensional extending cooling device for integration server - Google Patents

Three-dimensional extending cooling device for integration server Download PDF

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Publication number
TWM579757U
TWM579757U TW107217348U TW107217348U TWM579757U TW M579757 U TWM579757 U TW M579757U TW 107217348 U TW107217348 U TW 107217348U TW 107217348 U TW107217348 U TW 107217348U TW M579757 U TWM579757 U TW M579757U
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Taiwan
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air
heat
casing
heat source
flow
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TW107217348U
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Chinese (zh)
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江弦旃
王貫一
黃仁傑
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凌華科技股份有限公司
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Priority to TW107217348U priority Critical patent/TWM579757U/en
Publication of TWM579757U publication Critical patent/TWM579757U/en

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Abstract

本創作為有關一種集成服務器之三維擴展冷卻裝置,其包括有一機殼、一進風模組及至少一熱交換模組,該熱交換模組具有一熱交換器、一導風板及一底板,該導風板上方形成一第一風道,而該導風板與該底板之間形成一第二風道,該底板與該機殼底部之間形成一第三風道,該第一、二、三風道接受該進風模組所吸進空氣,各產生一冷氣流,該熱交換器接受該第一風道之該冷氣流來行使熱交換運作,該熱交換器行使熱交換所產生之熱氣流傳送至該機殼之該出風孔排出,且該第一、二、三風道經過散熱流場設計,可將較為低溫的氣流以縱向及橫向多重引向至高溫敏感的熱源元件,可同時對複數熱源元件做有效率散熱,以形成一種三維擴展冷卻裝置。 The present invention relates to a three-dimensional expansion cooling device for an integrated server, comprising a casing, an air inlet module and at least one heat exchange module, the heat exchange module having a heat exchanger, a wind deflector and a bottom plate a first air duct is formed on the air deflector, and a second air duct is formed between the air deflector and the bottom panel. A third air duct is formed between the bottom panel and the bottom of the cabinet. The second air duct receives the air sucked by the air inlet module, each generates a cold air flow, and the heat exchanger receives the cold air flow of the first air duct to perform a heat exchange operation, and the heat exchanger performs a heat exchange station. The generated hot gas flow is sent to the air outlet of the casing, and the first, second and third air passages are designed through the heat dissipation flow field, and the relatively low temperature air flow can be directed to the high temperature sensitive heat source in multiple directions in the longitudinal direction and the transverse direction. The component can efficiently dissipate heat from the plurality of heat source components to form a three-dimensional expansion cooling device.

Description

集成服務器之三維擴展冷卻裝置 3D extended cooling unit for integrated server

本創作係提供一種集成服務器之三維擴展冷卻裝置,尤指一種包括有一機殼、一進風模組及至少一熱交換模組,可同時對複數熱源元件做有效率散熱,以形成一種三維擴展冷卻裝置。 The present invention provides a three-dimensional expansion cooling device for an integrated server, and particularly includes a casing, an air inlet module and at least one heat exchange module, which can efficiently dissipate heat from a plurality of heat source components to form a three-dimensional expansion. Cooling device.

按,工業用電腦伺服器的運算速度隨著處理器、記憶體及匯流排的製程進步而快速提升,故此伺服器機箱內的溫度益發高溫,為了將機箱內的高溫有效排出於機箱之外,於機箱內設置各式散熱裝置(如:風扇、散熱片)已成為顯學,尤其工業用電腦伺服器常常需要在一個有限空間環境中密集設置,故於環境中所累積溫度不容易發散。面對惡劣散熱環境,工業電腦伺服器內的散熱裝置需要更有效率工作,在最小的空間中達到最大的散熱效果。 According to the process speed of the industrial computer server, the speed of the processor, the memory and the bus bar is rapidly improved. Therefore, the temperature inside the server chassis is high, and the high temperature in the chassis is effectively discharged outside the chassis. It is obvious to install various heat sinks (such as fans and heat sinks) in the chassis. In particular, industrial computer servers often need to be densely arranged in a limited space environment, so the accumulated temperature in the environment is not easy to diverge. In the face of the harsh heat dissipation environment, the heat sink in the industrial computer server needs to work more efficiently and achieve maximum heat dissipation in the smallest space.

再者,工業用電腦伺服器是自動化生產設備最重要一環,所有的控制流程皆掌握於該電腦伺服器,故電腦伺服器需要無時無刻開機工作,因此對於電腦伺服器的穩定性要求自然比一般家用電腦高出甚多,若發生當機停擺的情況,企業必定會產生不小的損失。關於電腦伺服器的穩定性而言,如何有效解決其內部如:中央處理器、存取設備、介面卡及電源供應器等零組件之發熱問題成為關鍵。市面上普遍大多數低階、未經 散熱流場規劃的伺服器機箱,單純用其內部風扇直接朝出風孔方向排風,機箱內部的空氣流場除了混亂無章外,渦流造成的壓力阻抗提高也使得風扇輸出風量低下,進而導致熱能持續存積,使系統內之溫度持續上升。因此,如何規劃設計出一套針對多高溫敏感熱源元件之散熱流場的冷卻裝置,即為本創作欲解決的問題。 Furthermore, the industrial computer server is the most important part of the automated production equipment. All the control processes are controlled by the computer server. Therefore, the computer server needs to be turned on all the time, so the stability requirement for the computer server is naturally higher than that of the general household. The computer is much higher. If there is a situation where the machine is shut down, the company will certainly have no small loss. Regarding the stability of the computer server, how to effectively solve the heat problem of its internal components such as the central processing unit, the access device, the interface card and the power supply is critical. Most of the low-order, uncommon in the market The server chassis of the heat dissipation flow field is simply exhausted directly toward the air outlet by the internal fan. The air flow field inside the chassis is chaotic, and the pressure resistance caused by the eddy current also causes the fan output air volume to be low, which leads to Thermal energy continues to accumulate, causing the temperature inside the system to continue to rise. Therefore, how to plan and design a cooling device for the heat dissipation flow field of the multi-temperature sensitive heat source element is the problem to be solved by the creation.

故,創作人有鑑於上述之問題與缺失,乃蒐集相關資料,經由多方評估及考量,並以從事於此行業累積之多年經驗,經由不斷試作及修改,始設計出此種集成服務器之三維擴展冷卻裝置之新型誕生。 Therefore, in view of the above-mentioned problems and deficiencies, the creators have collected relevant information, evaluated and considered them through multiple parties, and based on years of experience accumulated in the industry, through continuous trial and modification, designed the three-dimensional expansion of such an integrated server. A new type of cooling device was born.

本創作之主要目的在於提供一種集成服務器之三維擴展冷卻裝置,其包括有一機殼、一進風模組及至少一熱交換模組,該熱交換模組具有一熱交換器、一導風板及一底板,該導風板上方形成一第一風道,而該導風板與該底板之間形成一第二風道,該底板與該機殼底部之間形成一第三風道,該第一、二、三風道接受該進風模組所吸進空氣,產生各自獨立之冷氣流,該熱交換器接受該第一風道之該冷氣流來行使熱交換運作,該熱交換器行使熱交換所產生之熱氣流傳送至該機殼之該出風孔排出,且該第一、二、三風道經過散熱流場設計,可將較為低溫的氣流以縱向及橫向多重引向至高溫敏感的熱源元件,可同時對複數熱源元件做有效率散熱,以形成一種三維擴展冷卻裝置。 The main purpose of the present invention is to provide a three-dimensional expansion cooling device for an integrated server, comprising a casing, an air inlet module and at least one heat exchange module, the heat exchange module having a heat exchanger and a wind deflector And a bottom plate, a first air channel is formed on the air deflector, and a second air channel is formed between the air deflector and the bottom plate, and a third air channel is formed between the bottom plate and the bottom of the chassis. The first, second, and third air ducts receive air from the air intake module to generate independent cold airflow, and the heat exchanger receives the cold airflow of the first air duct to perform heat exchange operation, the heat exchanger The hot air generated by the heat exchange is transmitted to the air outlet of the casing, and the first, second and third air passages are designed through the heat dissipation flow field, and the relatively low temperature air flow can be directed to the longitudinal direction and the lateral direction. The high temperature sensitive heat source component can efficiently dissipate heat from multiple heat source components to form a three-dimensional expansion cooling device.

本創作之次要目的在於該熱交換模組更係設有一幫浦,該幫浦具有一連通管與該熱交換器連接,且該導熱元件與該幫浦做一連接,而該幫浦驅使該導熱媒介係於該幫浦、該導熱元件及該熱交換器之中做一 流動,以降低熱源元件之運作溫度。 The secondary purpose of the present invention is that the heat exchange module further has a pump, the pump has a connecting tube connected to the heat exchanger, and the heat conducting element is connected with the pump, and the pump drives The heat conducting medium is made up of the pump, the heat conducting component and the heat exchanger Flow to reduce the operating temperature of the heat source components.

1‧‧‧機殼 1‧‧‧Shell

11‧‧‧入風孔 11‧‧‧Into the air hole

12‧‧‧出風孔 12‧‧‧Air outlet

13‧‧‧導風架 13‧‧‧wind guide

130‧‧‧導風口 130‧‧‧air guide

131‧‧‧導斜片 131‧‧‧Leading tablets

14‧‧‧固定架 14‧‧‧ Fixing frame

2‧‧‧進風模組 2‧‧‧Inlet air module

21‧‧‧第一風道 21‧‧‧First air duct

22‧‧‧第二風道 22‧‧‧Second air duct

23‧‧‧第三風道 23‧‧‧ Third airway

3‧‧‧熱交換模組 3‧‧‧Heat exchange module

31‧‧‧熱交換器 31‧‧‧ heat exchanger

32‧‧‧導風板 32‧‧‧Air deflector

33‧‧‧底板 33‧‧‧floor

330‧‧‧分流孔 330‧‧‧Distribution hole

331‧‧‧導風隔片 331‧‧‧ wind deflector

34‧‧‧導熱元件 34‧‧‧thermal element

341‧‧‧低溫管 341‧‧‧Cryogenic tube

342‧‧‧高溫管 342‧‧‧High temperature tube

343‧‧‧導熱蓋 343‧‧‧heat cover

35‧‧‧幫浦 35‧‧‧

351‧‧‧連通管 351‧‧‧Connected pipe

4‧‧‧第一主機板 4‧‧‧First motherboard

41‧‧‧第一熱源元件 41‧‧‧First heat source element

411‧‧‧散熱鰭片 411‧‧‧heat fins

42‧‧‧記憶模組 42‧‧‧Memory Module

5‧‧‧第二主機板 5‧‧‧Second motherboard

51‧‧‧第二熱源元件 51‧‧‧Second heat source element

6‧‧‧第三熱源元件 6‧‧‧ Third heat source element

第一圖 係為本創作集成服務器之三維擴展冷卻裝置之立體外觀結構圖。 The first figure is a three-dimensional appearance structure diagram of the three-dimensional expansion cooling device of the creative integration server.

第二圖 係為本創作集成服務器之三維擴展冷卻裝置之另一立體外觀結構圖。 The second figure is another stereoscopic structure diagram of the three-dimensional extended cooling device of the authoring integrated server.

第三圖 係為本創作集成服務器之三維擴展冷卻裝置之立體分解結構圖。 The third figure is a three-dimensional exploded structure diagram of the three-dimensional extended cooling device of the authoring integrated server.

第四圖 係為本創作集成服務器之三維擴展冷卻裝置之另一立體分解結構圖。 The fourth figure is another perspective exploded view of the three-dimensional extended cooling device of the authoring integrated server.

第五圖 係為本創作集成服務器之三維擴展冷卻裝置之側視剖面結構圖。 The fifth figure is a side cross-sectional structural view of the three-dimensional extended cooling device of the authoring integrated server.

第六圖 係為本創作集成服務器之三維擴展冷卻裝置之另一側視剖面結構圖。 The sixth figure is another side cross-sectional structural view of the three-dimensional extended cooling device of the authoring integrated server.

為達成上述目的及功效,本創作所採用之技術手段及其構造,茲繪圖就本創作之較佳實施例詳加說明其特徵與功能如下,俾利完全瞭解。 In order to achieve the above objectives and effects, the technical means and structure of the present invention are described in detail in the preferred embodiment of the present invention, and the features and functions are as follows.

請參閱第一圖至第六圖所示,係為本創作集成服務器之三維擴展冷卻裝置之立體外觀結構圖、另一立體外觀結構圖、立體分解結構圖、另一立體分解結構圖、側視剖面結構圖及另一側視剖面結構圖,由圖中可清楚看出,本創作集成服務器之三維擴展冷卻裝置主要包括有:一機殼1、一進風模組2、至少一熱交換模組3、一第一熱源元件41、一第二熱源元件51及一第三熱源元件6,各構件較詳細描述如下: Please refer to the first to sixth figures, which are the three-dimensional appearance structure diagram of the three-dimensional expansion cooling device of the creative integration server, another three-dimensional appearance structure diagram, three-dimensional decomposition structure diagram, another three-dimensional exploded structure diagram, and side view. The cross-sectional structure diagram and the other side cross-sectional structure diagram can be clearly seen from the figure. The three-dimensional expansion cooling device of the creation integrated server mainly includes: a casing 1, an air inlet module 2, at least one heat exchange module. The group 3, a first heat source element 41, a second heat source element 51 and a third heat source element 6, each of which is described in detail as follows:

該機殼1包括有一入風孔11、一出風孔12、導風架13及至少一個以上固定架14。 The casing 1 includes an air inlet hole 11, an air outlet hole 12, a wind guide frame 13, and at least one fixing frame 14.

該進風模組2固設於該機殼1之該入風孔11處,用以將外界空氣吸進該機殼1中。 The air inlet module 2 is fixed to the air inlet 11 of the casing 1 for sucking outside air into the casing 1.

該機殼1內係設有一導風架13,該導風架13上方係供該進風模組2做一固定設置,且該導風架13具有至少一個以上的導風口130,且於該導風口130處設有二導斜片131,該二導斜片131係各自呈現一導引角度,或互為平行,並各設於該導風架13之上表面及下表面處,以該二導斜片131可將該進風模組2所吸進空氣導流至該第三風道23中。 An air guiding frame 13 is disposed in the casing 1 , and the air guiding frame 13 is fixedly disposed on the air guiding frame 13 , and the air guiding frame 13 has at least one air guiding port 130 , and The air guiding port 130 is provided with two guiding slanting pieces 131, each of which presents a guiding angle or parallel to each other, and is disposed at the upper surface and the lower surface of the air guiding frame 13, respectively. The two guiding slanting piece 131 can guide the air sucked into the air inlet module 2 into the third air channel 23 .

該進風模組2係由複數風扇所構成,該複數風扇係分別固設排列於該導風架13之該導風口130之二側。 The air inlet module 2 is composed of a plurality of fans, and the plurality of fans are fixedly disposed on two sides of the air guiding port 130 of the air guiding frame 13 respectively.

至少一熱交換模組3固設於該機殼1中,該熱交換模組3具有一熱交換器31、一導風板32及一底板33,該導風板32上方形成一第一風道21,而該導風板32與該底板33之間形成一第二風道22,該底板33與該機殼1底部之間形成一第三風道23,該第一、二、三風道(21、22、23)接受該進風模組2所吸進空氣,產生各自獨立之冷氣流,該熱交換器31接受該第一風道21之該冷氣流來行使熱交換運作,該熱交換器31行使熱交換所產生之熱氣流傳送至該機殼1之該出風孔12排出。 At least one heat exchange module 3 is fixed in the casing 1. The heat exchange module 3 has a heat exchanger 31, a wind deflector 32 and a bottom plate 33. A first wind is formed above the wind deflector 32. a second air passage 22 is formed between the air deflector 32 and the bottom plate 33. A third air passage 23 is formed between the bottom plate 33 and the bottom of the casing 1. The first, second, and third winds are formed. The passage (21, 22, 23) receives the air sucked by the air inlet module 2 to generate independent cold airflow, and the heat exchanger 31 receives the cold airflow of the first air passage 21 to perform a heat exchange operation. The heat exchanger 31 performs heat flow generated by heat exchange and is sent to the outlet hole 12 of the casing 1 for discharge.

該熱交換模組3之該底板33更係設有至少一個以上的分流孔330,該分流孔330係將該第二風道22之部分冷氣流導引至該 第三風道23。 The bottom plate 33 of the heat exchange module 3 is further provided with at least one or more diverting holes 330, and the diverting holes 330 guide a part of the cold airflow of the second air duct 22 to the Third air passage 23.

該熱交換模組3之該導風板32及該底板33更係設置有複數導風隔片331,該些導風隔片331係將該第二風道22之該冷氣流進行橫向切割,並導引各橫向冷氣流集中導向該第二熱源元件51進行散熱。舉例而言,若該第二熱源元件51設置數量為三個,該些導風隔片331針對該將該第二熱源元件51之位置,將第二風道22橫向切割並分隔成三個集中風道以使散熱效果更佳,而該些導風隔片331係可因應第二熱源元件51的設置數量及位置進行不同的配置,以使散熱效率達到最佳化。 The air deflector 32 and the bottom plate 33 of the heat exchange module 3 are further provided with a plurality of air guiding partitions 331, and the air guiding partitions 331 are transversely cut by the cold airflow of the second air duct 22, And guiding each of the lateral cold airflows to the second heat source element 51 for heat dissipation. For example, if the number of the second heat source elements 51 is three, the air guiding partitions 331 laterally cut and divide the second air duct 22 into three concentrated positions for the position of the second heat source element 51. The air ducts are better for the heat dissipation effect, and the air guiding partitions 331 can be configured differently according to the number and position of the second heat source elements 51 to optimize the heat dissipation efficiency.

該熱交換器31係為一鰭片式熱交換器所構成,該鰭片式熱交換器中設有複數流道(圖中未示),以供該導熱媒介(圖中未示)流入進行熱交換。該導熱媒介係由純水或複合成分之水冷液所構成。但此僅為本創作所列舉出之一實施構件,而熟習本項技藝人仕亦可利用一熱導管(Heat Pipe)做為熱交換器31之實施構件,而導熱媒介為一般的空氣或特定成分氣體,亦能達到熱交換之功能,利用熱導管做為熱交換器31的實施構件,仍在本創作之保護範圍內。 The heat exchanger 31 is formed by a fin heat exchanger, and the fin heat exchanger is provided with a plurality of flow passages (not shown) for allowing the heat transfer medium (not shown) to flow in. Heat exchange. The heat transfer medium is composed of pure water or a water-cooling liquid of a composite component. However, this is only one of the implementation components listed in the present application, and those skilled in the art may also use a heat pipe as a component of the heat exchanger 31, and the heat transfer medium is general air or specific. The component gas can also achieve the function of heat exchange, and the use of the heat pipe as the implementing member of the heat exchanger 31 is still within the protection scope of the present invention.

該機殼1內更係設有至少一個以上固定架14,該固定架14係供該熱交換模組3做一吊置固定,本創作雖以二個固定架14做為固定該熱交換模組3之實施結構,但固定架14設置數量非為重點,而不以此自限。 The housing 1 is further provided with at least one fixing frame 14 for fixing the heat exchange module 3, and the present invention uses the two fixing frames 14 as a fixing heat exchange module. The implementation structure of group 3, but the number of fixtures 14 is not important, and is not self-limiting.

該熱交換模組3於該導風板32上設有一幫浦35,該幫浦35係為一液體幫浦,該幫浦35具有一連通管351與該熱交換器3 1連接,且導熱元件34與該幫浦35做一連接,而該幫浦35驅使該導熱媒介係於該幫浦35、該導熱元件34及該熱交換器31之中做一流動,以降低第一熱源元件41之運作溫度。 The heat exchange module 3 is provided with a pump 35 on the air deflector 32. The pump 35 is a liquid pump, and the pump 35 has a communication tube 351 and the heat exchanger 3. 1 is connected, and the heat conducting element 34 is connected to the pump 35, and the pump 35 drives the heat conducting medium to flow in the pump 35, the heat conducting element 34 and the heat exchanger 31 to reduce The operating temperature of the first heat source element 41.

該第一熱源元件41設置於該機殼1底部之第一主機板4上,且第一主機板4上另設有複數記憶模組42,接受該第三風道之該冷氣流降溫,該第一熱源元件41與該熱交換器31之間設有一導熱元件34,該導熱元件34係由一低溫管341、一高溫管342及貼覆於該第一熱源元件41表面之一導熱蓋343所構成,而使該第一熱源元件41所產生熱能透過該導熱元件34之高溫管342之一導熱媒介輸入至該熱交換器31中進行熱交換,該熱交換器31所輸出低溫之該導熱媒介透過該導熱元件34之低溫管341及該導熱蓋343回傳至該第一熱源元件41,以降低該第一熱源元件41之運作溫度,該第一熱源元件41係指至少一個以上的中央處理器(CPU),且該中央處理器上設置有一散熱鰭片411,該散熱鰭片411頂部與該導熱蓋343接觸以形成該中央處理器將熱量傳導至該導熱蓋343,再藉由該導熱元件34進行熱交換。 The first heat source component 41 is disposed on the first motherboard 4 at the bottom of the casing 1 , and the first motherboard 4 is further provided with a plurality of memory modules 42 for receiving the cooling airflow of the third air channel. A heat conducting component 34 is disposed between the first heat source component 41 and the heat exchanger 31. The heat conducting component 34 is a low temperature pipe 341, a high temperature pipe 342, and a heat conducting cover 343 attached to the surface of the first heat source component 41. The heat energy generated by the first heat source element 41 is transmitted to the heat exchanger 31 through a heat transfer medium of the high temperature tube 342 of the heat conduction element 34 for heat exchange, and the heat conduction of the heat exchanger 31 is low temperature. The medium is passed back to the first heat source element 41 through the cryogenic tube 341 of the heat conducting element 34 and the heat conducting cover 343 to reduce the operating temperature of the first heat source element 41. The first heat source element 41 refers to at least one central portion. a processor (CPU), and the central processor is provided with a heat dissipation fin 411, the top of the heat dissipation fin 411 is in contact with the heat conduction cover 343 to form the central processor to conduct heat to the heat conduction cover 343, and The heat conducting element 34 performs heat exchange.

該第二熱源元件51插接於該機殼1之第二主機板5之插槽(Slot)上,接受該第二風道22之該冷氣流降溫,流過該第二熱源元件51之熱氣流送至該機殼1之該出風孔12排出,該第二熱源元件51係指至少一個以上的介面卡,而該介面卡例如為容易發熱之圖形處理介面卡(GPU Card),當然本創作不以此自限,舉凡其他易於發熱之介面卡,亦可做為第二熱源元件51之實施構件。 The second heat source element 51 is inserted into a slot of the second motherboard 5 of the casing 1. The cold airflow that receives the second air duct 22 is cooled, and the hot air flowing through the second heat source element 51 flows. The air outlet hole 12 that is sent to the casing 1 is discharged. The second heat source element 51 refers to at least one interface card, and the interface card is, for example, a GPU card that is easy to generate heat. The creation is not limited by this, and other interface cards that are prone to heat can also be used as the implementation components of the second heat source element 51.

該第三熱源元件6設置於該機殼1底部上,接受該第三風道23流過該第一熱源元件41之氣流進行降溫,而流過該第三熱源元件6之熱氣流傳送至該機殼1之該出風孔12排出,該第三熱源元件6係指至少一個以上的電源供應器(Power Supply)。 The third heat source element 6 is disposed on the bottom of the casing 1 and receives the airflow flowing through the first heat source element 41 to cool the third air passage 23, and the hot airflow flowing through the third heat source element 6 is transmitted to the The air outlet 12 of the casing 1 is discharged, and the third heat source element 6 refers to at least one power supply.

欲將本創作集成服務器之三維擴展冷卻裝置做一組裝,先將第一主機板4設置於機殼1底部之上,且第一主機板4上包括至少一個以上之第一熱源元件41(中央處理器)及複數記憶模組42,續將該第三熱源元件6(電源供應器)設置於該機殼1底部上,而該第二主機板5設置於該第三熱源元件6上方,該第二主機板5上具有複數插槽,該些插槽係供至少一個以上之第二熱源元件51(介面卡)做一插置。而於機殼1中固設導風架13,該導風架13上係供進風模組2(複數風扇)做一固定設置。將至少一個以上的熱交換模組3、導熱元件34與固定於第一主機板4上之第一熱源元件41做一連接,再將熱交換模組3本體上方固定於至少一個以上固定架14後,再將至少一個以上固定架14固定於機殼1中,以完成本創作之組裝。 To assemble the three-dimensional expansion cooling device of the authoring integrated server, the first motherboard 4 is first disposed on the bottom of the casing 1, and the first motherboard 4 includes at least one or more first heat source components 41 (the center) The processor and the plurality of memory modules 42 are configured to be disposed on the bottom of the casing 1 and the second motherboard 5 is disposed above the third heat source component 6 . The second motherboard 5 has a plurality of slots for interposing at least one of the second heat source elements 51 (interface cards). The air guiding frame 13 is fixed in the casing 1, and the air guiding frame 13 is provided with a cooling module 2 (plural fan) for a fixed setting. The at least one heat exchange module 3 and the heat conduction component 34 are connected to the first heat source component 41 fixed on the first motherboard 4, and the upper body of the heat exchange module 3 is fixed to the at least one fixture 14 above. Thereafter, at least one or more fixing brackets 14 are fixed in the casing 1 to complete the assembly of the present invention.

請特別參閱第五、六圖所示,本創作集成服務器之三維擴展冷卻裝置之運作流程為:該進風模組2將外界空氣吸進該機殼1中以形成冷氣流,大部分的冷氣流直接進入了第一風道21及第二風道22中,而分設導風架13二側之進風模組2之間的小部分冷氣流經由導風架13之導斜片131之導引向下流入第三風道23中,且第二風道22流經熱交換模組3之底板33之部分冷氣流經由分流孔330向下流入第三風道23,以形成第一、二、三風道(21、22、23)皆有冷氣流流動之 散熱流場。其中第二風道22主要針對第二熱源元件51做一氣冷散熱;第三風道23主要針對第一熱源元件41、記憶模組42及第三熱源元件6做一氣冷散熱,但由於第一熱源元件41(中央處理器)所產生的熱量不易藉由單一風道做完全降溫冷卻,特將第一熱源元件41連接一導熱元件34、熱交換器31及幫浦35,即可將第一熱源元件41所產生高溫熱能由導熱元件34中之導熱媒介(可為純水或複合成分之水冷液)傳導至熱交換器31中進行熱交換,熱交換器31經由第一風道21之冷氣流進行氣冷散熱,熱交換器31所輸出低溫之導熱媒介再透過導熱元件34回傳至第一熱源元件41,以降低第一熱源元件41之運作溫度,以形成具有縱向擴展之第一、二、三風道(21、22、23)及第二風道22之該冷氣流橫向切割,並導引各橫向冷氣流集中導向該第二熱源元件51進行散熱之三維擴展冷卻裝置。 Please refer to the fifth and sixth figures in particular, the operation flow of the three-dimensional expansion cooling device of the creation integrated server is: the air inlet module 2 sucks outside air into the casing 1 to form a cold air flow, and most of the air-conditioning The flow directly enters the first air passage 21 and the second air passage 22, and a small portion of the cold airflow between the air intake modules 2 on the two sides of the air guide frame 13 is separated by the guide slanting piece 131 of the air guide frame 13. Directly flowing downward into the third air passage 23, and a portion of the cold airflow of the second air passage 22 flowing through the bottom plate 33 of the heat exchange module 3 flows downward through the diverting hole 330 into the third air passage 23 to form a first Second and third air ducts (21, 22, 23) have cold airflow Cooling flow field. The second air channel 22 is mainly used for air cooling and cooling of the second heat source element 51. The third air channel 23 is mainly used for air cooling and cooling of the first heat source element 41, the memory module 42 and the third heat source element 6, but The heat generated by the heat source element 41 (central processing unit) is not easily cooled by a single air passage, and the first heat source element 41 is connected to a heat conducting element 34, a heat exchanger 31, and a pump 35. The high-temperature heat energy generated by the heat source element 41 is conducted to the heat exchanger 31 for heat exchange by the heat-conducting medium (which may be pure water or a composite water-cooled liquid) in the heat-conducting element 34, and the heat exchanger 31 passes through the first air passage 21 The cold air flow is cooled by air cooling, and the heat-conducting medium outputted by the heat exchanger 31 is transmitted back to the first heat source element 41 through the heat-conducting element 34 to lower the operating temperature of the first heat source element 41 to form a longitudinal expansion. The cold airflow of the first, second, and third air passages (21, 22, 23) and the second air passage 22 is transversely cut, and the three-dimensional expansion cooling device that directs the horizontal cold airflow to the second heat source element 51 for heat dissipation is guided.

藉由上述第一圖至第六圖之揭露,即可瞭解本創作為一種集成服務器之三維擴展冷卻裝置,其主要提供一種集成服務器之三維擴展冷卻裝置,其包括有一機殼、一進風模組及至少一熱交換模組,該熱交換模組具有一熱交換器、一導風板及一底板,該導風板上方形成一第一風道,而該導風板與該底板之間形成一第二風道,該底板與該機殼底部之間形成一第三風道,該第一、二、三風道接受該進風模組所吸進空氣,各產生一冷氣流,該熱交換器接受該第一風道之該冷氣流來行使熱交換運作,該熱交換器行使熱交換所產生之熱氣流傳送至該機殼之該出風孔排出,且該第一、二、三風道經過散熱流場設計,可將較為低溫的氣流以縱向及橫向多重引向至高溫敏感的熱源元件,可同時對複數熱源元件做有效率散熱, 以形成一種三維擴展冷卻裝置,本創作可應用於各種有冷卻散熱需求的電子或機械裝置中,具有良好的散熱效率,故提出專利申請以尋求專利權之保護。 With the disclosure of the first to sixth figures above, it can be understood that the present invention is a three-dimensional expansion cooling device of an integrated server, which mainly provides a three-dimensional expansion cooling device of an integrated server, which comprises a casing and an air inlet module. And a heat exchange module having a heat exchanger, a wind deflector and a bottom plate, wherein a first air passage is formed above the air deflector, and the air deflector is between the air deflector and the bottom plate Forming a second air passage, a third air passage is formed between the bottom plate and the bottom of the casing, and the first, second, and third air passages receive air from the air intake module, and each generates a cold air flow. The heat exchanger receives the cold air flow of the first air passage to perform a heat exchange operation, and the heat exchanger transmits the hot air flow generated by the heat exchange to the air outlet hole of the casing, and the first, second, Through the design of the heat dissipation flow field, the three air ducts can direct the relatively low temperature airflow to the high temperature sensitive heat source components in the longitudinal direction and the lateral direction, and can efficiently dissipate heat to the plurality of heat source components at the same time. In order to form a three-dimensional expansion cooling device, the present invention can be applied to various electronic or mechanical devices having cooling and heat dissipation requirements, and has good heat dissipation efficiency, so a patent application is filed to seek patent protection.

上所述僅為本創作之較佳實施例而已,非因此即侷限本創作之專利範圍,故舉凡運用本創作說明書及圖式內容所為之簡易修飾及等效結構變化,均應同理包含於本創作之專利範圍內,合予陳明。 The above description is only for the preferred embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Therefore, all the simple modifications and equivalent structural changes that are made by using the present specification and the schema contents should be included in the same reason. Within the scope of the patent of this creation, it is given to Chen Ming.

綜上所述,本創作上述集成服務器之三維擴展冷卻裝置於使用時,為確實能達到其功效及目的,故本創作誠為一實用性優異之創作,為符合新型專利之申請要件,爰依法提出申請,盼 審委早日賜准本案,以保障創作人之辛苦創作,倘若 鈞局審委有任何稽疑,請不吝來函指示,創作人定當竭力配合,實感德便。 In summary, the three-dimensional expansion cooling device of the above integrated server is used to achieve its efficacy and purpose. Therefore, the creation is a practical and excellent creation, in order to meet the requirements of the new patent application, To apply, I hope that the trial committee will grant this case as soon as possible to protect the creators' hard work. If there is any doubt in the ruling committee, please do not hesitate to give instructions, the creators will try their best to cooperate, and feel really good.

Claims (10)

一種集成服務器之三維擴展冷卻裝置,包括:一機殼,包括有一入風孔及一出風孔;一進風模組,固設於該機殼之該入風孔處,用以將外界空氣吸進該機殼中;該進風模組鄰接至少一熱交換模組,其固設於該機殼中,該熱交換模組具有一熱交換器、一導風板及一底板,該導風板上方形成一第一風道,而該導風板與該底板之間形成一第二風道,該底板與該機殼底部之間形成一第三風道,該第一、二、三風道接受該進風模組所吸進空氣,各產生一冷氣流,該熱交換器接受該第一風道之該冷氣流來行使熱交換運作,該熱交換器行使熱交換所產生之熱氣流傳送至該機殼之該出風孔排出;一第一熱源元件,設置於該機殼底部上,接受該第三風道之該冷氣流降溫,該第一熱源元件與該熱交換器之間設有一導熱元件,而使該第一熱源元件所產生熱能透過該導熱元件中之一導熱媒介輸入至該熱交換器中進行熱交換,該熱交換器所輸出低溫之該導熱媒介透過該導熱元件回傳至該第一熱源元件,以降低該第一熱源元件之運作溫度;一第二熱源元件,設置於該機殼中,接受該第二風道之該冷氣流降溫,流過該第二熱源元件之熱氣流送至該機殼之該出風孔排出;以及一第三熱源元件,設置於該機殼底部上,接受該第三風道流過該第一熱源元件之氣流進行降溫,而流過該第三熱源元件之熱氣流傳送至該機殼之該出風孔排出。 A three-dimensional expansion cooling device for an integrated server includes: a casing including an air inlet hole and an air outlet hole; and an air inlet module fixed to the air inlet hole of the casing for external air The air intake module is adjacent to the at least one heat exchange module, and is fixed in the casing. The heat exchange module has a heat exchanger, an air deflector and a bottom plate. A first air duct is formed above the wind deflecting plate, and a second air duct is formed between the air deflecting plate and the bottom plate, and a third air duct is formed between the bottom plate and the bottom of the casing, the first, second, third The air duct receives the air sucked by the air inlet module, each generates a cold air flow, and the heat exchanger receives the cold air flow of the first air passage to perform a heat exchange operation, and the heat exchanger performs the heat generated by the heat exchange. The flow is sent to the air outlet of the casing; a first heat source element is disposed on the bottom of the casing, and the cold airflow receiving the third air passage is cooled, and the first heat source element and the heat exchanger a heat conducting component is disposed between the heat source generated by the first heat source component One of the heat transfer medium is input to the heat exchanger for heat exchange, and the heat transfer medium outputted by the heat exchanger is transmitted back to the first heat source element through the heat transfer element to reduce the operating temperature of the first heat source element. a second heat source element disposed in the casing, the cold airflow receiving the second air passage is cooled, and the hot air flowing through the second heat source element is sent to the air outlet of the casing for discharging; and a third heat source element is disposed on the bottom of the casing, receives a flow of the third air passage through the first heat source element for cooling, and the hot air flow flowing through the third heat source element is transmitted to the casing. The air holes are discharged. 如申請專利範圍第1項所述之集成服務器之三維擴展冷卻裝置,其中該熱交換模組更係設有一幫浦,該幫浦具有一連通管與該熱交換器連接,且該導熱元件與該幫浦做一連接,而該幫浦驅使該導熱媒介係於該幫浦、該導熱元件及該熱交換器之中做一流動,以降低該第一熱源元件之運作溫度。 The three-dimensional expansion cooling device of the integrated server of claim 1, wherein the heat exchange module further comprises a pump, the pump has a connecting tube connected to the heat exchanger, and the heat conducting component is The pump makes a connection, and the pump drives the heat transfer medium to flow in the pump, the heat conducting element and the heat exchanger to reduce the operating temperature of the first heat source element. 如申請專利範圍第1項所述之集成服務器之三維擴展冷卻裝置,其中該熱交換模組之該導風板及該底板更係設置有複數導風隔片,該些導風隔片係將該第二風道之該冷氣流進行橫向切割,並導引各橫向冷氣流集中導向該第二熱源元件進行散熱。 The three-dimensional expansion cooling device of the integrated server of claim 1, wherein the air deflector and the bottom plate of the heat exchange module are further provided with a plurality of air guiding spacers, and the air guiding spacers are The cold airflow of the second air duct is transversely cut, and guides each of the lateral cold airflows to be directed to the second heat source component for heat dissipation. 如申請專利範圍第1項所述之集成服務器之三維擴展冷卻裝置,其中該熱交換模組之該底板更係設有至少一個以上的分流孔,該分流孔係將該第二風道之部分冷氣流導引至該第三風道。 The three-dimensional expansion cooling device of the integrated server of claim 1, wherein the bottom plate of the heat exchange module is further provided with at least one or more diversion holes, the diversion holes being part of the second air passage. The cold air flow is directed to the third air duct. 如申請專利範圍第1項所述之集成服務器之三維擴展冷卻裝置,其中該導熱元件係為中空狀之二導熱管及貼覆於該第一熱源元件表面之一導熱蓋所構成,該二導熱管包括一低溫管及一高溫管,且該二導熱管中可供液體狀態之該導熱媒介做一流動。 The three-dimensional expansion cooling device of the integrated server of claim 1, wherein the heat conducting component is a hollow heat pipe and a heat conducting cover attached to a surface of the first heat source component, the heat conducting The tube comprises a cryogenic tube and a high temperature tube, and the heat conducting medium in a liquid state is made to flow in the two heat conducting tubes. 如申請專利範圍第1項所述之集成服務器之三維擴展冷卻裝置,其中該熱交換器係為一鰭片式熱交換器所構成,該鰭片式熱交換器中設有複數流道,以供該導熱媒介流入進行熱交換。 The three-dimensional expansion cooling device of the integrated server according to claim 1, wherein the heat exchanger is constituted by a fin heat exchanger, and the fin heat exchanger is provided with a plurality of flow passages, The heat transfer medium flows in for heat exchange. 如申請專利範圍第1項所述之集成服務器之三維擴展冷卻裝置,其中該導熱媒介係由純水或複合成分之水冷液所構成。 The three-dimensional expansion cooling device of the integrated server according to claim 1, wherein the heat transfer medium is composed of pure water or a composite component water-cooled liquid. 如申請專利範圍第1項所述之集成服務器之三維擴展冷卻裝置,其中 該機殼內更係設有一導風架,該導風架上方係供該進風模組做一固定設置,且該導風架具有至少一個以上導風口,且於該導風口處設有二導斜片,該二導斜片係各自呈現一導引角度,或互為平行,並且各設於該導風架之上表面及下表面處,以該二導斜片可將該進風模組所吸進空氣導流至該第三風道中。 The three-dimensional expansion cooling device of the integrated server according to claim 1, wherein The air guide frame is further provided with a wind guide frame, wherein the air guide frame is provided with a fixed arrangement for the air inlet module, and the air guide frame has at least one air guiding port, and two air guiding ports are provided at the air guiding port. a guiding slanting piece, each of which presents a guiding angle or parallel to each other, and is disposed at each of the upper surface and the lower surface of the air guiding frame, and the two guiding slanting piece can be used for the air guiding mode The intake air from the group is diverted into the third air passage. 如申請專利範圍第8項所述之集成服務器之三維擴展冷卻裝置,其中該進風模組係由複數風扇所構成,該複數風扇係分別固設排列於該導風架之該導風口之二側。 The three-dimensional expansion cooling device of the integrated server of claim 8, wherein the air inlet module is composed of a plurality of fans, and the plurality of fans are respectively fixed to the air guiding port of the air guiding frame. side. 如申請專利範圍第1項所述之集成服務器之三維擴展冷卻裝置,其中該機殼內更係設有至少一個以上固定架,該固定架係供該熱交換模組做一吊置固定。 The three-dimensional expansion cooling device of the integrated server of claim 1, wherein the casing is further provided with at least one fixing frame, and the fixing frame is configured to be fixed by the heat exchange module.
TW107217348U 2018-12-20 2018-12-20 Three-dimensional extending cooling device for integration server TWM579757U (en)

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