CN110248524A - A kind of radiator and electronic equipment - Google Patents
A kind of radiator and electronic equipment Download PDFInfo
- Publication number
- CN110248524A CN110248524A CN201910509504.9A CN201910509504A CN110248524A CN 110248524 A CN110248524 A CN 110248524A CN 201910509504 A CN201910509504 A CN 201910509504A CN 110248524 A CN110248524 A CN 110248524A
- Authority
- CN
- China
- Prior art keywords
- radiator
- channel
- passage
- power device
- storage container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims abstract description 42
- 239000002826 coolant Substances 0.000 claims abstract description 16
- 230000017525 heat dissipation Effects 0.000 abstract description 16
- 238000010586 diagram Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of radiators to pass through setting the first radiator, the second radiator, and power device, second radiator is detachably connected with the first radiator, it is connected to first passage and second channel, power device drives coolant liquid to flow between interconnected first passage, second channel, forms a kind of good radiator of heat dissipation.It is connected on the electronic equipment further through by the first radiator, and first thermally conductive section and the heat generating components thermal conductive contact, forms a kind of good electronic equipment of heat dissipation performance.
Description
Technical field
The technical program is related to technical field of heat dissipation, specially a kind of radiator and electronic equipment.
Background technique
Chip cooling with the development of chip electronic device industry, in the digital product of high integration and high power density
Problem seems especially prominent.For the chip continually and steadily to work, maximum temperature not all can exceed that 85 degrees Celsius, some researches show that
For electronic equipment within the temperature range of 70 degrees Celsius to 80 degrees Celsius, temperature often increases 1 degree Celsius, and reliability will just reduce 5%,
Nearly 33% electronic component loss is all insufficient related with heat dissipation, and electronic equipment dissipating heat design has become urgent need to resolve in industry
The problem of.
Existing electronic equipment internal is contacted by the high heat sink material of thermal conductivity with electronic equipment mainboard, and thermo-contact is passed through
Conduction spreads apart amount of localized heat.But since electronic equipment internal space is small, forced convection heat dissipation can not be generated, only by
Heat loss through conduction, heat dissipation effect are poor.In addition some digital products such as electronic equipment utilizes heat pipe heat radiation inside it, but due to heat
It can accommodate that coolant liquid is less, and when heat is larger, expection is equally not achieved in heat dissipation effect inside pipe.More electronic equipment is carried out
Charging and when playing big game or viewing HD video, the calorific value of electronic equipment reaches maximum, electronic equipment calorific value most
When big, it is easy to crash because electronic equipment calorific value is too big or burn hardware, to reduce the use longevity of electronic equipment
Life；And the calorific value of electronic equipment internal can be transmitted to the shell of electronic equipment, so that operator is when using electronic equipment,
There is hot sense of discomfort.Thereby reduce the experience sense that user uses electronic equipment.
Therefore, the problem of how preferably radiating to electronic equipment, become urgent need to resolve.
Summary of the invention
The technical problem to be solved by the present invention is a kind of radiator and electronic equipment are provided, to solve electronic equipment
Heat dissipation effect is poor, and when being charged and playing big game or viewing HD video, the calorific value of electronic equipment reaches maximum,
When electronic equipment calorific value maximum, be easy because electronic equipment calorific value is too big crash or burn hardware the problem of.
The present invention is to solve the technical solution that provides of its technical problem to be: radiator, including the first radiator, described the
One radiator includes first passage and first switch, the first passage include for it is the first of heat source thermal conductive contact thermally conductive
Section, the first switch are used to control the first passage and external on-off；Second radiator, second radiator include
Second channel；Power device；Wherein, second radiator can removably be connect with first radiator, with connection
The first passage and the second channel, the power device are used to drive coolant liquid logical in described first to be interconnected
It is flowed between road, the second channel.
As an improvement of the above scheme, described first thermally conductive section includes microchannel.
As an improvement of the above scheme, first radiator further includes the first heat-conducting piece, first heat-conducting piece and institute
State first thermally conductive section of thermal conductive contact.
It as a further improvement of the foregoing solution, further include second switch, the second switch is for controlling described second
Channel and external on-off.
As an improvement of the above scheme, further include with the liquid storage container for storing coolant liquid, wherein the liquid storage container is located at
On first radiator, and it is connected to the first passage；It is told on the second radiator alternatively, the liquid storage container is located at,
And it is connected to the second channel；Alternatively, the liquid storage container is set independently of first radiator, second radiator
It sets, the liquid storage container is equipped with the interface for being respectively communicated with the first passage Yu the second channel.
As an improvement of the above scheme, the power device is located on first radiator, and with the first passage
Connection；
Alternatively, the power device is located on second radiator, and it is connected to the second channel；Or it is described dynamic
Power device is arranged independently of first radiator and second radiator, and the power device is equipped with for being respectively communicated with
The interface of the first passage and the second channel.
It as a further improvement of the foregoing solution, further include liquid storage container for storing coolant liquid, the liquid storage container
It is respectively positioned on second radiator with the power device, the liquid storage container and the power device are logical by described first
Road series connection.
As an improvement of the above scheme, second radiator further includes the second heat-conducting piece, second heat-conducting piece and institute
State liquid storage container thermal conductive contact.
As a further improvement of the foregoing solution, the second channel includes the grafting stretched out in outside second radiator
End, the second channel are inserted into the first passage by the inserted terminal to be connected to the first passage and described second
Channel.
The method have the benefit that: by the way that the first radiator, the second radiator and power device is arranged, the
Second radiator is detachably connected with the first radiator, is connected to first passage and second channel, and power device drives coolant liquid in phase
It is flowed between intercommunicated first passage, second channel, forms a kind of good radiator of heat dissipation.
The present invention also provides a kind of electronic equipment, the radiator including any one of the above, first radiator connects
It connects on the electronic equipment, and first thermally conductive section and the heat generating components thermal conductive contact, it is good to form a kind of heat dissipation performance
Electronic equipment.
Detailed description of the invention
For the clearer technical solution illustrated in the embodiment of the present invention, will make below to required in embodiment description
Attached drawing briefly describes.
Fig. 1 is a kind of schematic diagram of embodiment of radiator；
Fig. 2 is a kind of schematic diagram of embodiment of electronic equipment.
Specific embodiment
Carried out with reference to embodiments with technical effect of the attached drawing to design of the invention, specific structure and generation it is clear,
It is fully described by, to fully understand the purpose of the present invention, scheme and effect.It should be noted that in the absence of conflict originally
The feature in embodiment and embodiment in application can be combined with each other.Furthermore the upper and lower, left and right etc. used in the present invention
It describes in only opposite figure for each component part mutual alignment relation of the present invention.
Fig. 1 is a kind of schematic diagram of embodiment of radiator, includes the first radiator 100, the with reference to Fig. 1 radiator
Second radiator 200 and power device 300, the first radiator 100 are detachably connected with the second radiator 200, the first radiator 100
First passage 110 and first switch 120 are equipped with the second radiator 200, the first radiator 100；It is set on second radiator 200
There are second channel 210 and second switch 220.Power device 300 drives coolant liquid in interconnected first passage 110 and second
It is flowed between channel 210.Preferred first switch 120 and second switch 220 are pressure switch.
Preferably, first passage 110 include first thermally conductive section 111, first thermally conductive section 111 include microchannel 1111, first
Radiator 100 further includes the first heat-conducting piece 130, the first heat-conducting piece 130 and first thermally conductive section of 111 thermal conductive contact, micro- for extending
The heat dissipation area in channel 1111 enhances the heat dissipation performance of radiator.
It preferably further include second switch 220, second switch 220 is used to control second channel 210 and external on-off, make
Obtaining the second radiator 200 can work independently or cooperate with other component.
It preferably further include the liquid storage container 400 for storing coolant liquid, wherein liquid storage container 400 is located at the first heat dissipation
On device 100, and it is connected to first passage 110；Alternatively, liquid storage container 400 is located on the second radiator 200, and and second channel
210 connections, liquid storage container 400 are equipped with the interface for being respectively communicated with first passage 110 Yu second channel 210.Liquid storage container
400 setting one facilitates the flowing of coolant liquid, and two increase the heat dissipation area of radiator, increases the commutative of coolant liquid
Amount, the heat dissipation performance of heat radiation device.
Power device 300 is located on the first radiator 100, and is connected to first passage 110；Or power device is located at the
It on second radiator, and is connected to second channel 220, power device 300 is equipped with for being respectively communicated with first passage 110 and second
The interface in channel 220.Facilitate power device 300 to be connected to the first radiator 100 or the second radiator 200, promotes coolant liquid
Cycle efficieny accelerates heat dissipation.
Power supply 230 and switch 240 are preferably additionally provided on the second radiator 200, power supply 230 is used for driving power device
300 work, switch 240 is for being opened and closed power device 300.Power device 300 can be Micropump.
It include the liquid storage container 400 for storing coolant liquid, liquid storage container 400 and power device in another implementation column
300 are respectively positioned on the second radiator 200, and liquid storage container 400 is connected with power device 300 by second channel 210, and device is integrated
Degree is high, compact-sized, and space utilization rate is high, rationally distributed.
Fig. 2 is a kind of schematic diagram of embodiment of electronic equipment, and with reference to Fig. 2, electronic equipment includes above-mentioned any one
Radiator further includes heat generating components 500, and the first radiator 100 connects on an electronic device, and first thermally conductive section 111 and hair
500 thermal conductive contact of thermal part, compared to the electronic equipment only with single Inner heat sink, the technical program has bigger dissipate
There are more coolant liquids to be recycled, the radiating efficiency of electronic equipment can be significantly improved for heat area.
It can be seen from the above, the technical program is in electronic equipment by being arranged above-mentioned Portable scattered thermal, so that electronics
Equipment can meet cooling requirements under different working modes, and one to solve, the light and handy inner space of electronic equipment is narrow to be asked
Topic, two solve the problems, such as electronic equipment dissipating heat under high load capacity, and extend electronic equipment internal electronic component uses the longevity
Life.
Although specifically showing and describing the present invention in conjunction with preferred embodiment, those skilled in the art should be bright
It is white, it is not departing from the spirit and scope of the present invention defined by described claims, it in the form and details can be right
The present invention makes a variety of changes, and is protection scope of the present invention.
Claims (10)
1. a kind of radiator, which is characterized in that including
First radiator, first radiator include first passage and first switch, the first passage include for heat
Thermally conductive section of the first of source thermal conductive contact, the first switch is used to control the first passage and external on-off；
Second radiator, second radiator includes second channel；
Power device；
Wherein, second radiator can removably be connect with first radiator, be connected to the first passage with
The second channel, the power device are used to drive coolant liquid in the interconnected first passage, the second channel
Between flow.
2. radiator according to claim 1, which is characterized in that described first thermally conductive section includes microchannel.
3. radiator according to claim 1, which is characterized in that first radiator further includes the first heat-conducting piece,
First heat-conducting piece and first thermally conductive section of thermal conductive contact.
4. radiator according to claim 1, which is characterized in that further include second switch, the second switch is used for
Control the second channel and external on-off.
5. radiator according to claim 1, which is characterized in that it further include the liquid storage container for storing coolant liquid,
Wherein, the liquid storage container is located on first radiator, and is connected to the first passage；
Alternatively, the liquid storage container is located on second radiator, and it is connected to the second channel；
Alternatively, the liquid storage container is arranged independently of first radiator, second radiator, set on the liquid storage container
There is the interface for being respectively communicated with the first passage Yu the second channel.
6. radiator according to claim 1, which is characterized in that
The power device is located on first radiator, and is connected to the first passage；
Alternatively, the power device is located on second radiator, and it is connected to the second channel；
Alternatively, the power device is arranged independently of first radiator and second radiator, in the power device
Equipped with the interface for being respectively communicated with the first passage Yu the second channel.
7. radiator according to claim 1, which is characterized in that it further include the liquid storage container for storing coolant liquid,
The liquid storage container and the power device are respectively positioned on second radiator, and the liquid storage container and the power device are logical
Cross the first passage series connection.
8. radiator according to claim 7, which is characterized in that second radiator further includes the second heat-conducting piece,
Second heat-conducting piece and the liquid storage container thermal conductive contact.
9. radiator according to claim 1, which is characterized in that the second channel includes stretching out in described second to dissipate
Inserted terminal outside hot device, the second channel are inserted into the first passage logical to be connected to described first by the inserted terminal
Road and the second channel.
10. a kind of electronic equipment, including heat generating components, which is characterized in that further include described in any one of claims 1 to 9
Radiator, wherein first radiator is connected on the electronic equipment, and first thermally conductive section is led with the heat generating components
Thermo-contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910509504.9A CN110248524A (en) | 2019-06-13 | 2019-06-13 | A kind of radiator and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910509504.9A CN110248524A (en) | 2019-06-13 | 2019-06-13 | A kind of radiator and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110248524A true CN110248524A (en) | 2019-09-17 |
Family
ID=67886809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910509504.9A Pending CN110248524A (en) | 2019-06-13 | 2019-06-13 | A kind of radiator and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110248524A (en) |
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| CN201828336U (en) * | 2010-10-29 | 2011-05-11 | 中国工程物理研究院应用电子学研究所 | Water circulating cooling system used for laser energy meter |
| CN202799530U (en) * | 2012-08-15 | 2013-03-13 | 中国船舶重工集团公司第七一六研究所 | Water cooling and air cooling self-circulating type mixed heat radiation device |
| US20130329358A1 (en) * | 2011-12-27 | 2013-12-12 | Sandeep Ahuja | Transient thermal management systems for semiconductor devices |
| DE202015103469U1 (en) * | 2015-07-01 | 2015-10-14 | Asia Vital Components Co. Ltd. | Assemblable water cooler |
| CN205193719U (en) * | 2015-12-04 | 2016-04-27 | 赵帅 | Water cooling radiator |
| CN106470537A (en) * | 2015-08-14 | 2017-03-01 | 中兴通讯股份有限公司 | Veneer liquid cooling heat radiation system and rack |
| CN107393891A (en) * | 2017-08-17 | 2017-11-24 | 歌尔股份有限公司 | A kind of active heat removal mechanism and Intelligent worn device |
| CN207281691U (en) * | 2017-09-18 | 2018-04-27 | 深圳市高昱电子科技有限公司 | Air-cooled water cooling integrated device |
| US20190075681A1 (en) * | 2018-06-03 | 2019-03-07 | Apaltek (Dongguan) Co., Ltd | Integrated liquid-cooled heat dissipation system |
| CN210671055U (en) * | 2019-06-13 | 2020-06-02 | 南方科技大学 | Heat dissipation device and electronic equipment |
-
2019
- 2019-06-13 CN CN201910509504.9A patent/CN110248524A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050141196A1 (en) * | 2003-12-17 | 2005-06-30 | Takaaki Yamatani | Liquid cooling system and electronic equipment using the same |
| CN201828336U (en) * | 2010-10-29 | 2011-05-11 | 中国工程物理研究院应用电子学研究所 | Water circulating cooling system used for laser energy meter |
| US20130329358A1 (en) * | 2011-12-27 | 2013-12-12 | Sandeep Ahuja | Transient thermal management systems for semiconductor devices |
| CN202799530U (en) * | 2012-08-15 | 2013-03-13 | 中国船舶重工集团公司第七一六研究所 | Water cooling and air cooling self-circulating type mixed heat radiation device |
| DE202015103469U1 (en) * | 2015-07-01 | 2015-10-14 | Asia Vital Components Co. Ltd. | Assemblable water cooler |
| CN106470537A (en) * | 2015-08-14 | 2017-03-01 | 中兴通讯股份有限公司 | Veneer liquid cooling heat radiation system and rack |
| CN205193719U (en) * | 2015-12-04 | 2016-04-27 | 赵帅 | Water cooling radiator |
| CN107393891A (en) * | 2017-08-17 | 2017-11-24 | 歌尔股份有限公司 | A kind of active heat removal mechanism and Intelligent worn device |
| CN207281691U (en) * | 2017-09-18 | 2018-04-27 | 深圳市高昱电子科技有限公司 | Air-cooled water cooling integrated device |
| US20190075681A1 (en) * | 2018-06-03 | 2019-03-07 | Apaltek (Dongguan) Co., Ltd | Integrated liquid-cooled heat dissipation system |
| CN210671055U (en) * | 2019-06-13 | 2020-06-02 | 南方科技大学 | Heat dissipation device and electronic equipment |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20230109 Address after: 518104 Building 12, 13, 16 and 17, Zone A, Gonghe No.1 Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province Applicant after: Jieyao Precision Hardware (Shenzhen) Co.,Ltd. Address before: No. 1088, Xili Xueyuan Avenue, Nanshan District, Shenzhen, Guangdong Province Applicant before: SOUTH University OF SCIENCE AND TECHNOLOGY OF CHINA |
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| TA01 | Transfer of patent application right |