CN209358905U - Radiator, cooling system and electronic equipment - Google Patents

Radiator, cooling system and electronic equipment Download PDF

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Publication number
CN209358905U
CN209358905U CN201821447411.5U CN201821447411U CN209358905U CN 209358905 U CN209358905 U CN 209358905U CN 201821447411 U CN201821447411 U CN 201821447411U CN 209358905 U CN209358905 U CN 209358905U
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CN
China
Prior art keywords
heat
radiating
pipeline section
radiator
heat sink
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201821447411.5U
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Chinese (zh)
Inventor
马计划
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhongshuo Global Electronic Technology (beijing) Co Ltd
Original Assignee
Zhongshuo Global Electronic Technology (beijing) Co Ltd
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Priority to CN201821447411.5U priority Critical patent/CN209358905U/en
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Publication of CN209358905U publication Critical patent/CN209358905U/en
Expired - Fee Related legal-status Critical Current
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Abstract

The utility model provides a kind of radiator, cooling system and electronic equipment.The radiator includes heat-conducting piece, heat conducting pipe and heat sink;First thermal conductive surface of the heat-conducting piece with the heat source of electronic equipment for connecting, to receive the heat of the heat source;The heat conducting pipe is arranged between the heat-conducting piece and the heat sink, for by the heat transfer on the heat-conducting piece to the heat sink;First radiating surface of the heat sink with the shell of the electronic equipment for connecting, to transfer heat on the shell of the electronic equipment.The utility model is conducive to improve radiating efficiency.

Description

Radiator, cooling system and electronic equipment
Technical field
The utility model relates to Heat sink technology more particularly to a kind of radiators, cooling system and electronic equipment.
Background technique
Electronic equipment can generate heat in the process of running, therefore radiator is usually provided in electronic equipment, to mention The radiating efficiency of high electronic equipment.
Existing radiator includes heat-conducting piece and radiating fin, and heat-conducting piece is connected directly with radiating fin, and heat is by leading Warmware is transferred to radiating fin, then is diffused in air and radiated by radiating fin.
However, existing radiator is due to heat lower, the heat dissipation effect that by radiating fin diffuses to the speed in air Rate is lower.
Utility model content
The utility model provides a kind of radiator, cooling system and electronic equipment, to improve radiating efficiency.
The utility model first aspect provides a kind of radiator, including heat-conducting piece, heat conducting pipe and heat sink;The heat-conducting piece The first thermal conductive surface for being connect with the heat source of electronic equipment, to receive the heat of the heat source;The heat conducting pipe is arranged in institute It states between heat-conducting piece and the heat sink, for by the heat transfer on the heat-conducting piece to the heat sink;The heat dissipation First radiating surface of plate with the shell of the electronic equipment for connecting, to transfer heat to the shell of the electronic equipment On.
The radiator, it is preferred that it further include radiating fin, the first edge of the radiating fin and the heat-conducting piece The connection of the second thermal conductive surface, the second edge of the radiating fin connect with the second radiating surface of the heat sink.
The radiator, it is preferred that the heat conducting pipe includes the first pipeline section and the second pipeline section, the first pipeline section sandwiched Between the first edge of the radiating fin and the second thermal conductive surface of the heat-conducting piece, second pipeline section is folded in described dissipate Between the second edge of hot fin and the second radiating surface of the heat sink, first pipeline section and the second pipeline section are dissipated along described The thickness direction of hot fin extends.
Affiliated radiator, it is preferred that the heat conducting pipe further includes third pipeline section, and third pipeline section setting is described the Extend on two radiating surfaces and at least along the length direction of second radiating surface.
The radiator, it is preferred that the radiating fin is located at the middle part of second radiating surface, and the heat conducting pipe is Multiple, the third pipeline section of multiple heat conducting pipes is radiated along multiple directions towards described second by the middle part of second radiating surface The edge in face extends.
The radiator, it is preferred that the first link slot is provided on second thermal conductive surface, on second radiating surface It is provided with the second link slot, first pipeline section is arranged in first link slot, and second pipeline section and third pipeline section are set It sets in second link slot.
The radiator, it is preferred that the mounting groove of at least one is additionally provided on the heat sink, the mounting groove is used In at least one heater element of installation.
The utility model second aspect provides a kind of cooling system, including fan and radiator provided by the utility model, The fan is arranged towards the radiating fin.
The utility model third aspect provide a kind of electronic equipment, including heat source, shell and it is provided by the utility model dissipate First thermal conductive surface of hot device, the heat-conducting piece is connect with the heat source, and the first radiating surface and the shell of the heat sink connect It connects.
The utility model fourth aspect provide a kind of electronic equipment, including heat source, shell and it is provided by the utility model dissipate First thermal conductive surface of hot systems, the heat-conducting piece is connect with the heat source, and first radiating surface is connect with the shell.
Based on above-mentioned, radiator provided by the utility model, when in use, the heat source of heat-conducting piece and electronic equipment can be connected It connects and connects the shell of the first radiating surface of heat sink and electronic equipment, heat-conducting piece receives to carry out the heat of self-heat power, leads later Heat pipe transfers heat on heat sink, and the heat of heat source can diffuse on the shell of electronic equipment after reaching heat sink.Due to Heat can be transferred directly on the shell directly contacted with outside air, to accelerate radiating rate, improve heat dissipation effect Rate.
Detailed description of the invention
Fig. 1 is a kind of perspective view of radiator provided by the embodiment of the utility model;
Fig. 2 is a kind of structural exploded view of radiator provided by the embodiment of the utility model;
Fig. 3 is a kind of bottom view of the heat sink of radiator provided by the embodiment of the utility model;
Fig. 4 is a kind of top view of the heat sink of radiator provided by the embodiment of the utility model;
Fig. 5 is a kind of structural schematic diagram of the heat-conducting plate of radiator provided by the embodiment of the utility model.
Appended drawing reference:
10: heat-conducting piece;11: the first thermal conductive surfaces;12: the second thermal conductive surfaces;
13: the first link slots;20: heat conducting pipe;21: the first pipeline sections;
22: the second pipeline sections;23: third pipeline section;30: heat sink;
31: the first radiating surfaces;32: the second radiating surfaces;33: the second link slots;
34: mounting groove;40: radiating fin.
Specific embodiment
It is practical new below in conjunction with this to keep the purpose of this utility model, feature, advantage more obvious and understandable Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched The embodiment stated is only the utility model a part of the embodiment, and not all embodiments.Based on the implementation in the utility model Example, those skilled in the art's every other embodiment obtained without making creative work, belongs to this reality With novel protected range.
Fig. 1 is a kind of perspective view of radiator provided by the embodiment of the utility model;Fig. 2 mentions for the utility model embodiment A kind of structural exploded view of the radiator supplied;Fig. 3 is a kind of bowing for heat sink of radiator provided by the embodiment of the utility model View;Fig. 4 is a kind of bottom view of the heat sink of radiator provided by the embodiment of the utility model;Fig. 5 is that the utility model is real A kind of structural schematic diagram of the heat-conducting plate of radiator of example offer is provided.
Embodiment one
As shown in Figure 1-3, the utility model embodiment provides a kind of radiator, comprising: heat-conducting piece 10,20 and of heat conducting pipe Heat sink 30;First thermal conductive surface 11 of heat-conducting piece 10 with the heat source of electronic equipment for connecting, to receive the heat of heat source;It is thermally conductive Pipe 20 is arranged between heat-conducting piece 10 and heat sink 30, for by the heat transfer on heat-conducting piece 10 to heat sink 30;Heat dissipation First radiating surface 31 of plate 30 with the shell of electronic equipment for connecting, to transfer heat on the shell of electronic equipment.
Heat-conducting piece 10 can connect with the heat source of electronic equipment and will radiate when in use by the radiator in the present embodiment First radiating surface 31 of plate 30 is connect with the shell of electronic equipment, and heat-conducting piece 10 receives the heat for carrying out self-heat power, later by thermally conductive Pipe 20 will be in the heat transfer on heat-conducting piece 10 to heat sink 30;Heat can be by direct with heat sink 30 after reaching heat sink 30 The casting of electronic device of connection, directly diffuses in air and radiates.Due to heat-conducting plate and the shell for directly contacting outside air Body is connected, so comparing traditional heat sinks, the heat on radiator in the present embodiment can be diffused to directly in outside air, Therefore, the radiating efficiency of radiator has been can be improved.
Embodiment two
As shown in Figs. 1-5, on the basis of example 1, radiator further includes radiating fin 40, and the of radiating fin 40 One edge is connect with the second thermal conductive surface 12 of heat-conducting piece 10, the second edge of radiating fin 40 and the second radiating surface of heat sink 30 32 connections.When in use, it is connected due to heat-conducting piece 10 with radiating fin 40, heat-conducting piece 10 can pass the heat of heat source It is handed on radiating fin 40 and is diffused, while radiating fin is connected with heat sink 30, therefore the heat on radiating fin 40 can It is transferred in outside air with being transferred on the shell of electronic equipment by heat sink 30.To further improve The radiating efficiency of radiator.
In the present embodiment, heat conducting pipe 20 includes the first pipeline section 21 and the second pipeline section 22, and the first pipeline section 21 is folded in heat radiating fin Between the first edge of piece 40 and the second thermal conductive surface 12 of heat-conducting piece 10, the second pipeline section 22 is folded in the second side of radiating fin 40 Between edge and the second radiating surface 32 of heat sink 30, the first pipeline section 21 and the second pipeline section 22 are along the thickness direction of radiating fin 40 Extend.It is folded in due to the first pipeline section 21 between the first edge of radiating fin 40 and the second thermal conductive surface 12 of heat-conducting piece 10, the Two pipeline sections 22 are folded between the second edge of radiating fin 40 and the second radiating surface 32 of heat sink 30, therefore, heat-conducting piece 10 A part of heat on heat-conducting piece 10 can be transferred directly on heat sink 30 by heat conducting pipe 20, and another on heat-conducting piece 10 Partial heat can be transferred to the first edge and second edge of radiating fin 40 by heat conducting pipe 20, and then enable heat edge Both direction is spread on radiating fin 40, to accelerate the diffusion velocity of heat.Wherein, radiating fin 40 can be more A, multiple 40 through-thickness of radiating fin are uniformly arranged, and the first pipeline section 21 and the second pipeline section 22 are along multiple radiating fins 40 Thickness direction extends, to guarantee that the first pipeline section 21 and the second pipeline section 22 can be connect with every a piece of radiating fin 40.
In the present embodiment, heat conducting pipe 20 further includes third pipeline section 23, and third pipeline section 23 is arranged on the second radiating surface 32 simultaneously At least extend along the length direction of the second radiating surface 32.Length direction due to three pipeline sections along the second radiating surface 32 extends, So that the heat on heat conducting pipe 20 is sufficiently transmitted in 30 length direction of heat sink, the space on heat sink 30 is made full use of to carry out Heat dissipation, further increases the radiating efficiency of radiator.
In the present embodiment, radiating fin 40 is located at the middle part of the second radiating surface 32, and heat conducting pipe 20 is multiple, multiple heat conducting pipes 20 third pipeline section 23 is extended by the middle part of the second radiating surface 32 along the edge of multiple directions towards the second radiating surface 32.Due to Radiating fin 40 is arranged in the middle part of the second radiating surface 32, while heat conducting pipe 20 also can be from the middle part of the second radiating surface 32 to second The edge of radiating surface 32 extends, therefore the heat on the heat and heat conducting pipe 20 on radiating fin 40 can be by the second heat dissipation The middle part in face 32 is spread to the edge of the second radiating surface 32, to be conducive to shorten the transmitting distance of heat, improves radiating efficiency. In addition, multiple heat conducting pipes 20 extend along multiple directions, the diffusion that heat can be made more uniform on heat sink 30, thus favorably In making full use of space on heat sink 30, radiating efficiency is further increased.
In the present embodiment, it is provided with the first link slot 13 on the second thermal conductive surface 12, is provided with second on the second radiating surface 32 Link slot 33, the first pipeline section 21 are arranged in the first link slot 13, and the second pipeline section 22 and the setting of third pipeline section 23 are in the second connection In slot 33.Link slot is set in the second thermal conductive surface 12, the second radiating surface 32, make heat conducting pipe 20 and heat-conducting plate, heat conducting pipe 20 and is dissipated The connection of hot plate 30 is more stable.To, it effectively prevent heat conducting pipe 20 caused by vibration or movement because of electronic equipment to shift, into And it ensure that heat dissipation effect.
In the present embodiment, the mounting groove 34 of at least one is additionally provided on heat sink 30, mounting groove 34 is for installing at least One heater element.Mounting groove 34 on heat sink 30 can be used to fix multiple heater elements, and multiple heater elements are connected to In mounting groove 34 on heat sink 30, each element is enable directly to radiate using heat sink 30.To improve radiating efficiency, at This control is more reasonable.
The embodiments of the present invention additionally provide in a kind of cooling system, including fan and the utility model embodiment two The radiator, fan are arranged towards radiating fin 40.Since fan is arranged towards radiating fin 40, fan is being opened The speed air flow that can accelerate around radiating fin 40 under state is opened, to be conducive to accelerate the heat dissipation speed of radiating fin 40 Degree.When radiating fin 40 is multiple, multiple 40 through-thickness of radiating fin are uniformly arranged, between multiple radiating fins 40 There are gap, fan is arranged towards the gap between multiple radiating fins 40.The heat dissipation effect of radiator is further increased as a result, Rate.
The embodiments of the present invention additionally provide a kind of electronic equipment, including heat source, shell and the utility model are any First thermal conductive surface 11 of radiator described in embodiment, heat-conducting piece 10 is connect with heat source, the first radiating surface 31 of heat sink 30 with Shell connection.
Electronic equipment in the present embodiment, when in use, heat-conducting piece 10 receive the heat of the heat source from electronic equipment, it It afterwards will be in the heat transfer on heat-conducting piece 10 to heat sink 30 by heat conducting pipe 20;Heat reach heat sink 30 after can by with heat dissipation The casting of electronic device that plate 30 is directly connected to, directly diffuses in air and radiates.Due to, heat-conducting plate with directly contact it is external The shell of air is connected, so comparing traditional heat sinks, the heat on radiator in the present embodiment can directly diffuse to outer In portion's air, therefore, the radiating efficiency of radiator can be improved.
In the present embodiment, it is preferred that the connection between heat sink 30 and shell is to be bolted, and thus facilitates heat sink 30 Connection between shell.
The embodiments of the present invention additionally provide a kind of electronic equipment, including heat source, shell and the utility model are any First thermal conductive surface 11 of cooling system described in embodiment, heat-conducting piece 10 is connect with heat source, and the first radiating surface 31 is connect with shell.
Electronic equipment in the present embodiment, when in use, heat-conducting piece 10 receive the heat for carrying out self-heat power, later by heat conducting pipe 20 will be in the heat transfer on heat-conducting piece 10 to heat sink 30;Heat can be by directly connecting after reaching heat sink 30 with heat sink 30 The casting of electronic device connect, directly diffuses in air and radiates.Due to heat-conducting plate and the shell for directly contacting outside air It is connected, so comparing traditional heat sinks, the heat on radiator in the present embodiment can be diffused to directly in outside air, because This, can be improved the radiating efficiency of radiator.Simultaneously because fan is arranged towards radiating fin 40, therefore, fan is being opened It can accelerate the speed air flow around radiating fin 40 under state, to be conducive to accelerate the radiating rate of radiating fin 40.
In the present embodiment, it is preferred that the connection between heat sink 30 and shell is to be bolted, and thus facilitates heat sink 30 Connection between shell.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example Point is contained at least one embodiment or example of the utility model.Moreover, description specific features, structure, material or Feature may be combined in any suitable manner in any one or more of the embodiments or examples.In addition, in not conflicting situation Under, those skilled in the art can be by different embodiments or examples described in this specification and different embodiments or examples Feature be combined.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance Or implicitly indicate the quantity of indicated technical characteristic." first " is defined as a result, the feature of " second " can be expressed or hidden It include at least one this feature containing ground.The meaning of " plurality " is two or more in the description of the present invention, unless Separately there is clearly specific restriction.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to In this, anyone skilled in the art within the technical scope disclosed by the utility model, can readily occur in variation Or replacement, it should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should be with the power Subject to the protection scope that benefit requires.

Claims (10)

1. a kind of radiator, which is characterized in that including heat-conducting piece, heat conducting pipe and heat sink;
First thermal conductive surface of the heat-conducting piece with the heat source of electronic equipment for connecting, to receive the heat of the heat source;
The heat conducting pipe is arranged between the heat-conducting piece and the heat sink, for by the heat transfer on the heat-conducting piece extremely On the heat sink;
First radiating surface of the heat sink with the shell of the electronic equipment for connecting, to transfer heat to the electronics On the shell of equipment.
2. radiator according to claim 1, which is characterized in that it further include radiating fin, the first of the radiating fin Edge is connect with the second thermal conductive surface of the heat-conducting piece, the second heat dissipation of the second edge of the radiating fin and the heat sink Face connection.
3. radiator according to claim 2, which is characterized in that the heat conducting pipe includes the first pipeline section and the second pipeline section, First pipeline section is folded between the first edge of the radiating fin and the second thermal conductive surface of the heat-conducting piece, and described second Pipeline section is folded between the second edge of the radiating fin and the second radiating surface of the heat sink, first pipeline section and Two pipeline sections extend along the thickness direction of the radiating fin.
4. radiator according to claim 3, which is characterized in that the heat conducting pipe further includes third pipeline section, the third Pipeline section is arranged on second radiating surface and at least along the length direction of second radiating surface and extends.
5. radiator according to claim 4, which is characterized in that the radiating fin is located in second radiating surface Portion, the heat conducting pipe be it is multiple, the third pipeline section of multiple heat conducting pipes is by the middle part of second radiating surface along multiple directions Extend towards the edge of second radiating surface.
6. radiator according to claim 4, which is characterized in that it is provided with the first link slot on second thermal conductive surface, The second link slot is provided on second radiating surface, first pipeline section is arranged in first link slot, and described second Pipeline section and third pipeline section are arranged in second link slot.
7. any radiator in -6 according to claim 1, which is characterized in that be additionally provided at least one on the heat sink A mounting groove, the mounting groove is for installing at least one heater element.
8. a kind of cooling system, which is characterized in that including the radiator any in fan and claim 2-6, the wind Fan is arranged towards the radiating fin.
9. a kind of electronic equipment, which is characterized in that including the radiator any in heat source, shell and claim 1-7, institute The first thermal conductive surface for stating heat-conducting piece is connect with the heat source, and the first radiating surface of the heat sink is connect with the shell.
10. a kind of electronic equipment, which is characterized in that described to lead including heat source, shell and cooling system according to any one of claims 8 First thermal conductive surface of warmware is connect with the heat source, and first radiating surface is connect with the shell.
CN201821447411.5U 2018-09-04 2018-09-04 Radiator, cooling system and electronic equipment Expired - Fee Related CN209358905U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821447411.5U CN209358905U (en) 2018-09-04 2018-09-04 Radiator, cooling system and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821447411.5U CN209358905U (en) 2018-09-04 2018-09-04 Radiator, cooling system and electronic equipment

Publications (1)

Publication Number Publication Date
CN209358905U true CN209358905U (en) 2019-09-06

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821447411.5U Expired - Fee Related CN209358905U (en) 2018-09-04 2018-09-04 Radiator, cooling system and electronic equipment

Country Status (1)

Country Link
CN (1) CN209358905U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024027303A1 (en) * 2022-07-30 2024-02-08 超聚变数字技术有限公司 Heat dissipation device and electronic apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024027303A1 (en) * 2022-07-30 2024-02-08 超聚变数字技术有限公司 Heat dissipation device and electronic apparatus

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190906

Termination date: 20210904

CF01 Termination of patent right due to non-payment of annual fee