CN108646890A - A kind of radiator, computing device and dig mine machine - Google Patents
A kind of radiator, computing device and dig mine machine Download PDFInfo
- Publication number
- CN108646890A CN108646890A CN201810550736.4A CN201810550736A CN108646890A CN 108646890 A CN108646890 A CN 108646890A CN 201810550736 A CN201810550736 A CN 201810550736A CN 108646890 A CN108646890 A CN 108646890A
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- Prior art keywords
- cabinet
- chip
- radiator
- cooling fin
- fan
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention belongs to the field of radiating of mine machine, and provide a kind of radiator, computing device and dig mine machine.Wherein, radiator is installed on the computing device, the computing device includes cabinet and at least one circuit board in the cabinet, and the radiator includes the cooling fin being sticked on the chip of the circuit board and the radiator fan on the cabinet；Wherein, the radiator fan includes at least two first fans, and at least two first fan is installed in parallel at the air intake vent of the cabinet, for drying to the cabinet inside.The present invention can provide the air quantity of bigger, improve heat dissipation effect by the scheme using fan parallel connection at the air intake vent of cabinet；Also, using the scheme of the single side patch cooling fin on the chip of circuit board, bulk is saved, in the case of reaching identical heat dissipation effect, more circuit boards can be assembled.
Description
Technical field
The present invention relates to field of radiating more particularly to the field of radiating of electronic equipment, be concretely a kind of radiator,
Computing device and digging mine machine.
Background technology
In existing artificial intelligence (AI) solution, in order to meet the acceleration process demand of large-scale data operation, one
As can form cascaded structure using multiple processing chips and accelerate board to build AI operations, and accelerate board composition high using polylith
Performance computing device greatly improves the calculation processing power towards artificial intelligence.For this multi-chip cascaded structure, though
The size of right one single chip is smaller, but power consumption when chip operation is relatively high, and so more chips concentrates on difference
Circuit board top, be mounted on inside a very small cabinet, very high heat flow density can be caused.Therefore, this is to entire
The cooling requirements of computing device are very high, should ensure that the temperature of each chip cannot be exceeded, minimize each chip again
Between spacing, reduce the temperature difference between each circuit board because often limitation computing device overall performance factor
It is exactly that local chip temperature is excessively high.
In the prior art, in order to improve this multiple circuit board groups at high-capability computing device heat dissipation effect, ensure
Each chip can radiate in time, a kind of scheme be in two fans (as shown in Figure 1) of casing structure tandem, still,
In this scheme, the front and back concatenated pattern of fan increases the distance before and after cabinet, causes the temperature difference of front and back chip bigger.
It should be noted that above to the introduction of technical background be intended merely to it is convenient to technical scheme of the present invention carry out it is clear,
Complete explanation, and facilitate the understanding of those skilled in the art and illustrate.Cannot merely because these schemes the present invention
Background technology part is expounded and thinks that above-mentioned technical proposal is known to those skilled in the art.
Invention content
The embodiment of the invention discloses a kind of radiator, computing device and mine machine is dug, to solve existing computing device
In heat sink conception the problem of leading to front and back chip excessive temperature differentials.
To solve the above-mentioned problems, an embodiment of the present invention provides a kind of radiator, installation is on the computing device, described
Computing device includes cabinet and at least one circuit board in the cabinet, and the radiator includes being sticked in institute
State the cooling fin on the chip of circuit board and the radiator fan on the cabinet；Wherein, the radiator fan includes
At least two first fans, and at least two first fan is installed in parallel at the air intake vent of the cabinet, is used for institute
State cabinet inside blowing.
In one embodiment, the radiator fan further includes at least two at the air outlet of the cabinet
Second fan is connected at least two first fans being installed in parallel at the air intake vent of the cabinet to form forced convertion,
The heat that the circuit board generates is led out.
In one embodiment, first fan and the second fan are electrically connected with the circuit board, and are passed through
The mode of screw or buckle is fixedly mounted on the cabinet.
In one embodiment, each cooling fin correspondence is sticked on each chip of the circuit board, to institute
The every piece of chip stated on circuit board individually radiates；Also, each cooling fin correspondence is sticked in each chip
Single side.
In one embodiment, heat conduction glue sticking is used between the chip and cooling fin of the circuit board.
In one embodiment, it is fixed by way of screw or buckle between the chip and cooling fin of the circuit board
Connection.
In one embodiment, it includes thermally conductive gel, heat-conducting silicone grease, thermal conductive silicon to be used between the cooling fin and chip
The structure interval of boundary material filling between the two including rubber cushion, phase-change material.
To solve the above-mentioned problems, the embodiment of the present invention additionally provides a kind of computing device, including radiates as described above
Device.
To solve the above-mentioned problems, the embodiment of the present invention additionally provides a kind of digging mine machine, including cabinet, is located at cabinet inside
Control panel, the expansion board being connect with control panel, the operation board that is connect with expansion board and radiator as described above；Its
In, the cooling fin in the radiator is sticked on the chip of the operation board.
The revealed radiator of the embodiment of the present invention, computing device and digging mine machine, by being adopted at the air intake vent of cabinet
With the scheme of fan parallel connection, the air quantity of bigger can be provided, heat dissipation effect is improved；Also, using on the chip of circuit board
Single side pastes the scheme of cooling fin, saves bulk, in the case of reaching identical heat dissipation effect, can assemble more circuits
Plate.Meanwhile it can install at the air outlet of cabinet and be installed in parallel at least at least radiator fan, with the air intake vent of cabinet
The heat that the circuit board generates faster is blown out by Cascaded radiator fan with forming forced convertion, improves heat dissipation effect
Fruit.
With reference to following description and accompanying drawings, only certain exemplary embodiments of this invention is disclosed in detail, specifies the original of the present invention
Reason can be in a manner of adopted.It should be understood that embodiments of the present invention are not so limited in range.In appended power
In the range of the spirit and terms that profit requires, embodiments of the present invention include many changes, modifications and are equal.
The feature for describing and/or showing for a kind of embodiment can be in a manner of same or similar one or more
It is used in a other embodiment, it is combined with the feature in other embodiment, or substitute the feature in other embodiment.
It should be emphasized that term "comprises/comprising" refers to the presence of feature, one integral piece, step or component when being used herein, but simultaneously
It is not excluded for the presence or additional of one or more other features, one integral piece, step or component.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those skilled in the art without having to pay creative labor, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is a kind of structural schematic diagram of the heat dissipation equipment of computing device of the prior art；
Fig. 2 is the structural schematic diagram of the radiator of one embodiment of the invention；
Fig. 3 is the structural schematic diagram of the radiator of another embodiment of the present invention；
Fig. 4 is the structural schematic diagram that the single side of the embodiment of the present invention pastes the heat sink conception of cooling fin；
Fig. 5 is the structural schematic diagram of the radiator of further embodiment of this invention；
Fig. 6 is that the radiator of the present invention applies the structural schematic diagram in mine machine.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Below with reference to several representative embodiments of the present invention, the principle and spirit of the invention are illustrated in detail.
The embodiment of the present invention discloses a kind of radiator, using the parallel connection of at least two fans at the air intake vent of cabinet
Mode is dried toward cabinet inside, is taken away heat by way of forced convertion.The mode of this fan parallel connection can improve logical
The air quantity of cabinet is crossed, and makes the air volume adjustment for passing through circuit board also average, to improve heat dissipation effect.In addition,
Since the heat dissipation effect of fan enhances, therefore can cooling fin be set in the single side of chip, save bulk, reach identical and dissipate
In the case of thermal effect, more circuit boards can be assembled.
Fig. 2 is the structural schematic diagram of the radiator of an embodiment of the present invention.In the present embodiment, as shown in Fig. 2, institute
It includes the cooling fin being sticked on the chip of the circuit board and dissipating on the cabinet of computing device to state radiator
Hot-air fan；Wherein, the radiator fan includes at least two first fans, and at least two first fan is installed in parallel
At the air intake vent of the cabinet, for drying to the cabinet inside.
In the present embodiment, at least two first fans being installed in parallel can be that specifications parameter and power parameter are identical scattered
Hot-air fan is mounted on the cabinet of computing device, and is connected electrically to the control panel of electronic equipment.Wherein, electronic equipment
Control panel can realize the control to the rotating speed of at least two first fans according to signals such as temperature in chassis and/or chip temperatures
System.In a kind of more excellent embodiment, it can be provided with and multiple to be intervally arranged along its short transverse on the front side board of cabinet
Installation through-hole, i.e., multiple installation through-holes are intervally arranged along the short transverse of cabinet, and the first fan is provided on each installation through-hole.
In the embodiment depicted in figure 2, two the first fans of air intake vent parallel connection are single fan, in another embodiment
In, the fan in embodiment illustrated in fig. 3 can also be used, by multiple radiator fan arranged superposeds.By in each installation through-hole
The radiator fan of upper multiple (the being, for example, two) arranged superposeds of installation, can increase the air quantity in cabinet, to further increase
Wind pressure in cabinet, has further speeded up flowing velocity distinguished and admirable in cabinet, so that fan can area much sooner
The heat in cabinet is walked, and then further improves heat dissipation performance.
Radiator disclosed in the embodiment of the present invention, which is mainly realized, carries out the chip on the circuit board in computing device
Heat dissipation.Computing device can be server, dig mine machine or other realize computing functions and the larger machine of heating power, calculate
Equipment includes cabinet and at least one circuit board in the cabinet, and circuit board can be dug in mine machine
Power plate is calculated, when realizing high-power calculating, each chip on operation board will produce amount of heat.
In one embodiment, in order to promote operational capability, computing device may include the polylith circuit of laid out in parallel
Plate includes the polylith chip in the array arrangement of rule on every piece of circuit board.Also, in Fig. 4 illustrated embodiments, Mei Yixin
It is bonded with cooling fin above piece, can individually radiate to every piece of chip on circuit board, be used between chip and cooling fin
Heat conduction glue sticking makes every piece of chip can be fully bonded with cooling fin, improves heat dissipation effect.The heat that chip operation generates
Above conduction to cooling fin, then two radiator fans of air intake vent parallel connection blow away heat.In embodiment illustrated in fig. 4, only exist
The single side of chip pastes cooling fin, and the mode of this single side bonding cooling fin effectively saves space, in addition simultaneously by two fans
It is arranged by the way of in parallel, the Distance Shortened of such air intake vent and air outlet, the front and back chip temperature difference reduces, simultaneously as being wind
Mode in parallel is fanned, is greatly improved by the air quantity of cabinet, further improves the heat dissipation effect of chip and circuit board.
In another embodiment, the mode in the Double-face adhesive cooling fin of chip can also be used, while by two wind
Fan is arranged by the way of in parallel.Due to the Double-face adhesive cooling fin in chip so that radiating efficiency is more preferable, this to be adapted to single
The higher situation of piece power dissipation ratio, it is necessary first to, then again will be in cabinet by two fans in parallel quickly to chip cooling
Heat take away.
That is, corresponding to the heat sink conception of the embodiment of the present invention, the scheme of the single side patch cooling fin of chip corresponds to section
Save space, single-chip situation low in energy consumption can promote calculated performance by promoting the quantity of circuit board；Double-face adhesive cooling fin
Scheme correspond to the high situation of single-chip power consumption, need higher radiating efficiency.
Certainly, if single-chip power consumption is relatively low, can also several chips share a cooling fin, to reduce cooling fin cost
And technology difficulty.For example, for the chip array of the 6*14 on computing board as shown in Figure 2,4 be evenly distributed can be set
Cooling fin, each cooling fin cover 3*7 chip.
In the embodiment of the present invention, heat conduction glue sticking can be used between the chip and cooling fin of circuit board, can also pass through spiral shell
The mode of silk or buckle is fixedly connected.When being connected by the way of screw or buckle, using including thermally conductive gel, thermal conductive silicon
The structure interval of thermal interfacial material filling between the two including fat, thermal conductive silicon rubber cushion, phase-change material.When the fixation side of radiator
When formula is using screw or buckle fixed form, by can mechanically or manually complete to install and dismantle, without high temperature furnace and
Stand-by period saves dismounting working hour and reduces disassemblerassembler demand.Thermal interfacial material range of choice is wide, thermally conductive gel, thermal conductive silicon
The boundary materials such as fat, thermal conductive silicon rubber cushion, phase-change material can be used in this radiator fixed form.And select these hot boundaries
The advantages of plane materiel material, has thermal coefficient high (can reach 60W/M*K), and thickness can control space big, easy to operate, without height
Warm stove solidification and time wait for, and substantially reduce the thermal contact resistance between chip and radiator, the thermal conductivity of heat radiation structural member
While energy, operational sequence is in turn simplified, a large amount of human cost has been saved.
In the embodiment of the present invention, the cooling fin can be designed as pectinate texture, and include egative film and multiple fins, described
Multiple fins connect the top surface of the egative film, and the fin includes a fin with handgrip.In some embodiments
In, multiple fins can be arranged in parallel, can also spaced set.For the ease of machine or manually to the lifting of cooling fin, also
Can handgrip be set with the top of a riser wherein.Handgrip can be connected to sheet or the ring bodies on riser top etc..
Fig. 5 is the structural schematic diagram of the radiator of another embodiment of the present invention.As shown in figure 5, the radiator fan is also
Include at least two second fans at the air outlet of the circuit board, it is in parallel at the air intake vent of the circuit board
At least two first fans of installation are connected to form forced convertion, and the heat that the circuit board generates faster is blown out
It goes.Although this scheme increases the distance before and after cabinet, but the forced convertion that is formed of former and later two fans can more rapidly and
Efficiently the heat in cabinet is blown out.It should be noted that corresponding to the quantity for the first fan being arranged at air intake vent,
It is correspondingly arranged the second fan of identical quantity at air outlet, multiple symmetrical air ducts can be correspondingly formed in this way, to improve heat dissipation
Efficiency.
In one embodiment, be arranged the second fan at air outlet can have be arranged at air intake vent the
The identical specifications parameter of one fan and power parameter.Wherein, the second fan is also electrically connected the control panel into computing device, and
Control panel can realize the control to the rotating speed of at least one second fan according to signals such as temperature in chassis and/or chip temperatures
System.In a kind of more excellent embodiment, can cabinet back side panel (it is related with the installation site of the first fan, if first
Fan is mounted on front side board, then the second fan is mounted on corresponding back side panel, if the first fan is mounted on back side panel,
Second fan be mounted on corresponding front side board) on be provided with multiple installation through-holes being intervally arranged along its short transverse, i.e.,
Multiple installation through-holes are intervally arranged along the short transverse of cabinet, and the second fan is provided on each installation through-hole.
In embodiments of the present invention, first fan and the second fan electrically connect with the circuit board in the cabinet
It connects, and is fixedly mounted on the cabinet by way of screw or buckle.For example, can be arranged in the periphery of each fan more
A first screw hole is arranged multiple second screw holes in the corresponding position of cabinet, then passes through more longer screws of root long degree
It is connect again with the second screw hole across the first screw hole, you can the installation for realizing all fans has the advantages of simple structure and easy realization.
Radiator disclosed in the embodiment of the present invention, due at cabinet air intake vent at least two radiator fans in parallel to
Blowing in cabinet, therefore the air quantity by cabinet can be improved, to improve heat dissipation effect；Also, it is low in energy consumption for single-chip
The case where, cooling fin can be pasted in the single side of chip, therefore space can be saved, and promote meter by promoting the quantity of circuit board
Performance is calculated, and in the case of single-chip power consumption is high, it can be in the Double-face adhesive cooling fin of chip so that radiating efficiency is more preferable.Together
When, it can install at the air outlet of cabinet and be installed in parallel at least at least one radiator fan, with the air intake vent of cabinet
The heat that the circuit board generates faster is blown out, improves scattered to form forced convertion by two Cascaded radiator fans
Thermal effect.
Invention additionally discloses a kind of computing devices, including the heat dissipation dress recorded in one or more the above embodiment of the present invention
It sets.In a specific embodiment, computing device can be dig mine machine comprising cabinet, positioned at cabinet inside control panel, with
Radiator recorded in the expansion board of control panel connection, the operation board being connect with expansion board and embodiment as above.Such as Fig. 6 institutes
Show, is the structural schematic diagram that the virtual digit coin of the embodiment of the present invention digs one embodiment of mine machine.
Virtual digit coin is dug in mine machine, and control panel is the entire control centre for digging mine machine, and control panel passes through input/output
(IO) expansion board sends instruction and business datum, and operation board is powered using power supply, is the entire arithmetic center for digging mine machine.Control
Instruction and data is issued to I/O expansion plate by making sheet, and instruction and data is forwarded to operation board by I/O expansion plate, after operation board operation
Result is returned into control panel by I/O expansion plate, control panel can be uploaded to by communications network interface in internet.In addition,
Operation board can also include other units, such as power supply protection circuit, the power supply protection circuit can be in the entirety of circuit device
The power supply of power supply is cut off when temperature anomaly.Wherein, the calculation power for digging the operation board of mine machine is very strong, and power consumption is very big, therefore desirability
Radiator that can be very high cools down to it, therefore the cooling fin in the radiator disclosed in the embodiment of the present invention is sticked described
On the chip of operation board, effectively radiated to it.
Radiator, computing device disclosed in the embodiment of the present invention and digging mine machine, due in parallel at cabinet air intake vent
At least two fans are dried to cabinet, therefore can improve the air quantity by cabinet, to improve heat dissipation effect；Also, for
Single-chip situation low in energy consumption can paste cooling fin in the single side of chip, therefore can save space, and by promoting circuit board
Quantity promotes calculated performance, and in the case of single-chip power consumption is high, can be in the Double-face adhesive cooling fin of chip, and in cabinet
At least two radiator fans in parallel are set at air intake vent so that radiating efficiency is more preferable.Meanwhile it can be at the air outlet of cabinet
At least one radiator fan is installed, it is strong to be formed at least two Cascaded radiator fans that are installed in parallel at the air intake vent of cabinet
The heat that the circuit board generates faster is blown out, improves heat dissipation effect by convection current processed.
Specific embodiment is applied in the present invention, and principle and implementation of the present invention are described, above example
Explanation be merely used to help understand the present invention method and its core concept；Meanwhile for those of ordinary skill in the art,
According to the thought of the present invention, there will be changes in the specific implementation manner and application range, in conclusion in this specification
Appearance should not be construed as limiting the invention.
Claims (10)
1. a kind of radiator, on the computing device, the computing device includes cabinet and is mounted in the cabinet for installation
At least one circuit board, which is characterized in that the radiator includes the cooling fin being sticked on the chip of the circuit board
And the radiator fan on the cabinet；
Wherein, the radiator fan includes at least two first fans, and at least two first fan is installed in parallel in institute
It states at the air intake vent of cabinet, for drying to the cabinet inside.
2. radiator according to claim 1, which is characterized in that the radiator fan further includes being mounted on the cabinet
Air outlet at least two second fans, at least two first fans being installed in parallel at the air intake vent of the cabinet
Series connection is led out the heat that the circuit board generates with forming forced convertion.
3. radiator according to claim 2, which is characterized in that first fan and the second fan with the electricity
Road plate electrical connection, and be fixedly mounted on the cabinet by way of screw or buckle.
4. radiator according to claim 1, which is characterized in that each cooling fin correspondence is sticked in the circuit
On each chip of plate, individually radiate to every piece of chip on the circuit board；
Also, each cooling fin corresponds to the single side being sticked in each chip.
5. radiator according to claim 1, which is characterized in that each cooling fin correspondence is sticked in the circuit
On each chip of plate, individually radiate to every piece of chip on the circuit board；
Also, two-sided be sticked of each chip has the cooling fin.
6. according to claim 1-5 any one of them radiators, which is characterized in that the chip and cooling fin of the circuit board
Between use heat conduction glue sticking.
7. according to claim 1-5 any one of them radiators, which is characterized in that the chip and cooling fin of the circuit board
Between be fixedly connected by way of screw or buckle.
8. radiator according to claim 7, which is characterized in that it includes heat conduction to be used between the cooling fin and chip
The structure interval of thermal interfacial material filling between the two including gel, heat-conducting silicone grease, thermal conductive silicon rubber cushion, phase-change material.
9. a kind of computing device, which is characterized in that including such as claim 1-9 any one of them radiator.
10. a kind of digging mine machine, which is characterized in that control panel, the extension that is connect with control panel including cabinet, positioned at cabinet inside
Plate, the operation board being connect with expansion board and such as claim 1-9 any one of them radiators；
Wherein, the cooling fin in the radiator is sticked on the chip of the operation board.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810550736.4A CN108646890A (en) | 2018-05-31 | 2018-05-31 | A kind of radiator, computing device and dig mine machine |
| PCT/CN2019/075041 WO2019179259A1 (en) | 2018-03-21 | 2019-02-14 | Chip heat dissipating structure, chip structure, circuit board, and computing device |
| PCT/CN2019/089095 WO2019228420A1 (en) | 2018-05-31 | 2019-05-29 | Data processing device |
| CN201980003912.5A CN111133401B (en) | 2018-05-31 | 2019-05-29 | Data processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810550736.4A CN108646890A (en) | 2018-05-31 | 2018-05-31 | A kind of radiator, computing device and dig mine machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108646890A true CN108646890A (en) | 2018-10-12 |
Family
ID=63759050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810550736.4A Pending CN108646890A (en) | 2018-03-21 | 2018-05-31 | A kind of radiator, computing device and dig mine machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108646890A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110069111A (en) * | 2019-06-06 | 2019-07-30 | 深圳云朵数据科技有限公司 | A kind of AI calculation server |
| CN110134205A (en) * | 2019-06-06 | 2019-08-16 | 深圳云朵数据科技有限公司 | A kind of AI calculation server |
| CN110198593A (en) * | 2019-06-06 | 2019-09-03 | 北京灵汐科技有限公司 | A kind of multi-chip board, multiple chips board and calculate equipment |
| WO2019179259A1 (en) * | 2018-03-21 | 2019-09-26 | Bitmain Technologies Inc. | Chip heat dissipating structure, chip structure, circuit board, and computing device |
| WO2019228420A1 (en) * | 2018-05-31 | 2019-12-05 | 北京比特大陆科技有限公司 | Data processing device |
| USD973654S1 (en) * | 2018-10-30 | 2022-12-27 | Bitmain Technologies Inc. | Supercomputing device |
| USD979561S1 (en) * | 2018-10-30 | 2023-02-28 | Bitmain Technologies Inc. | Supercomputing device |
| WO2023186147A1 (en) * | 2022-04-02 | 2023-10-05 | 北京嘉楠捷思信息技术有限公司 | Heat dissipation apparatus and computing device |
| WO2024040932A1 (en) * | 2022-08-25 | 2024-02-29 | 中兴通讯股份有限公司 | Fan plug-in box, fan frame, and plug-in box system |
| WO2024083228A1 (en) * | 2022-10-20 | 2024-04-25 | 北京嘉楠捷思信息技术有限公司 | Circuit board and working assembly |
-
2018
- 2018-05-31 CN CN201810550736.4A patent/CN108646890A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019179259A1 (en) * | 2018-03-21 | 2019-09-26 | Bitmain Technologies Inc. | Chip heat dissipating structure, chip structure, circuit board, and computing device |
| WO2019228420A1 (en) * | 2018-05-31 | 2019-12-05 | 北京比特大陆科技有限公司 | Data processing device |
| USD973654S1 (en) * | 2018-10-30 | 2022-12-27 | Bitmain Technologies Inc. | Supercomputing device |
| USD979561S1 (en) * | 2018-10-30 | 2023-02-28 | Bitmain Technologies Inc. | Supercomputing device |
| CN110069111A (en) * | 2019-06-06 | 2019-07-30 | 深圳云朵数据科技有限公司 | A kind of AI calculation server |
| CN110134205A (en) * | 2019-06-06 | 2019-08-16 | 深圳云朵数据科技有限公司 | A kind of AI calculation server |
| CN110198593A (en) * | 2019-06-06 | 2019-09-03 | 北京灵汐科技有限公司 | A kind of multi-chip board, multiple chips board and calculate equipment |
| CN110134205B (en) * | 2019-06-06 | 2024-03-29 | 深圳云朵数据科技有限公司 | AI calculates server |
| WO2023186147A1 (en) * | 2022-04-02 | 2023-10-05 | 北京嘉楠捷思信息技术有限公司 | Heat dissipation apparatus and computing device |
| WO2024040932A1 (en) * | 2022-08-25 | 2024-02-29 | 中兴通讯股份有限公司 | Fan plug-in box, fan frame, and plug-in box system |
| WO2024083228A1 (en) * | 2022-10-20 | 2024-04-25 | 北京嘉楠捷思信息技术有限公司 | Circuit board and working assembly |
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